Jet spray cooling heat dissipation device

Abstract

The invention discloses a jet flow spray cooling heat dissipation device, and relates to the technical field of spray cooling, the jet flow spray cooling heat dissipation device comprises a liquid inlet part and a heat dissipation part used for being attached to an electronic device for cooling, a closed atomization cavity is formed between the liquid inlet part and the heat dissipation part, and a spraying part facing the atomization cavity is detachably installed on the liquid inlet part; a first rotating part is rotatably mounted in the atomization cavity, a second rotating part is slidably mounted on the first rotating part, and cleaning parts used for cleaning water drops are arranged on the sides, facing the liquid inlet part and the heat dissipation part, of the first rotating part and the second rotating part correspondingly; limiting parts for limiting stable rotation of the first rotating part and the second rotating part are arranged in the atomization cavity, when spraying is stopped every time, liquid drops at the heat dissipation part and the spraying part can be collected and discharged synchronously through cooperation of the limiting parts and the rotating parts and through the first guide plate and the second guide plate, and it is avoided that after chip heat is transmitted to the surface of the heat dissipation part, the heat dissipation part is not damaged. And the temperature distribution of the liquid and the heat dissipation part is not uniform.

Description

Technical Field

[0001] The invention relates to the technical field of spray cooling, in particular to a jet spray cooling and heat dissipation device. Background Art

[0002] With the rapid development of electronic equipment integration technology, the power density of electronic components is increasing, and the heat dissipation requirements are becoming increasingly stringent. Therefore, the heat dissipation of high power consumption and high heat flux density bodies has been achieved by using jet spray cooling. The liquid working fluid is pressurized to form a high-pressure liquid that is ejected from the atomizing nozzle, atomized into uniform fine droplets in a low-pressure environment, and impacts the heating surface at a high speed to form a liquid film on the heating surface. The heating surface is cooled by the impact of droplets, scouring of the liquid film, evaporation, boiling, etc. The Chinese invention patent (CN106288501A) discloses "a high-load CPU spray phase change refrigeration device coolant circulation system and its control method", which specifically discloses: the coolant accumulation in the spray chamber is extracted through the negative pressure formed in the jet chamber to realize the circulation of the coolant; by adopting a closed spray chamber design and a closed-circuit circulation system, the coolant is completely isolated from the outside world to ensure the safety of the equipment; it has a complete self-circulation function, and has the advantages of high heat dissipation efficiency, low energy consumption, and low noise, and is suitable for high-load chip heat dissipation such as single-body desktops and high-performance workstations.

[0003] In fact, after each spray is sprayed, the spray tends to adhere to the surface of the heat sink to form water droplets. Due to the different media of the heat sink and the liquid, the temperature distribution of the liquid and the heat sink itself will be uneven after the heat of the chip is transferred to the surface of the heat sink when it is used next time. This will affect the heat dissipation uniformity of the chip of the high heat flux density electronic device and reduce the heat dissipation efficiency. In addition, long-term uneven heat dissipation will also affect the service life of the chip. In view of this, the present invention proposes a jet spray cooling and heat dissipation device to make up for and improve the deficiencies of the prior art. Summary of the invention

[0004] The object of the present invention is to provide a jet spray cooling and heat dissipation device to solve the problems raised in the prior art.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a jet spray cooling and heat dissipation device, comprising a liquid inlet part and a heat dissipation part for cooling down an electronic device, a closed atomization chamber is formed between the liquid inlet part and the heat dissipation part, a spray part facing the atomization chamber is detachably mounted on the liquid inlet part, a first rotating part is rotatably mounted inside the atomization chamber, a second rotating part is slidably mounted on the first rotating part, a cleaning part for cleaning water droplets is provided on the first rotating part and the second rotating part facing the liquid inlet part and the heat dissipation part, a limiting part for limiting the stable rotation of the first rotating part and the second rotating part is provided inside the atomization chamber, one end of the second rotating part is slidably connected to the limiting part, and the first rotating part is driven to rotate by a power source.

[0006] Through the first rotating member and the second rotating member, in conjunction with the design of the cleaning part, the water droplets gathered inside the atomizing chamber can be cleaned after the electronic device is cooled, so as to avoid uneven heat dissipation of the electronic device when it is used again later due to the accumulation of water droplets, thereby reducing the service life of the electronic device; A second rotating member is provided in a sliding sleeve inside the first rotating member, a sliding wheel is provided at one end of the second rotating member, and the limiting portion is an arc-shaped sliding groove. When the first rotating member is driven to rotate by a power source, the sliding wheel slides back and forth inside the arc-shaped sliding groove.

[0007] Through the above technical solution, it can be ensured that the first rotating member and the second rotating member can operate stably and for a long time when cleaning the inside of the atomization chamber.

[0008] The cleaning part includes a first guide plate and a second guide plate, the first guide plate is installed on one side of the first rotating member and the second rotating member, and the second guide plate is installed on the other side of the first rotating member and the second rotating member. The first rotating member is provided with an open groove for the first guide plate and the second guide plate on the second rotating member to slide inside the groove, a scraper or a brush is installed on the first guide plate and the second guide plate on the side away from the first rotating member and the second rotating member, and a guide chute is provided at the connection between the first guide plate and the second guide plate and the scraper or the brush.

[0009] A plurality of through holes are provided at the connection between the first guide plate and the second guide plate and the first rotating member and the second rotating member, and a drainage groove is provided at the bottom of the first rotating member and the second rotating member.

[0010] The first guide plate and the second guide plate are both arranged to be inclined relative to the first rotating member and the second rotating member.

[0011] The injection part includes a detachable fixed plate and a nozzle, the fixed plate is connected to the liquid inlet part, the nozzle is installed on the fixed plate, a first annular groove is provided at the connection between the nozzle and the fixed plate, a second annular groove is provided at one end of the nozzle away from the fixed plate, sliding columns are slidably arranged inside the first annular groove and the second annular groove, and one end of the sliding column is connected to the arc plate.

[0012] A liquid outlet hole is provided at the bottom of the arc-shaped plate, and a tongue plate is provided below the liquid outlet hole.

[0013] The arc-shaped plate is arranged to be wider at the top and narrower at the bottom.

[0014] A liquid inlet cavity is provided in the middle of the liquid inlet portion, a liquid inlet port is provided at one side of the liquid inlet cavity, and a liquid discharge port is provided at the bottom of the atomizing cavity.

[0015] The power source is a servo motor, and the servo motor drives one end of the first rotating member to reciprocate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. Compared with the prior art where the spray gathers into water droplets and adheres to the heat sink or accumulates and remains on the nozzle, and the long-term uneven heat dissipation affects the service life of the chip, each time the spraying is stopped, the limit part and the rotating part are matched, and the first guide plate and the second guide plate are used to synchronously collect and discharge the droplets at the heat sink and the spraying part, so as to avoid the phenomenon that the temperature distribution of the liquid and the heat sink itself is uneven after the heat of the chip is transferred to the surface of the heat sink; In addition, the first guide plate and the second guide plate are both inclined to improve the liquid discharge efficiency. Ultimately, each time the chip is turned on, each nozzle initially sprays water mist directly toward the heat dissipation part, and will not be affected by the residual accumulated water droplets from the last time, thereby ensuring the initial uniformity of the spray. In short, by accelerating the discharge of droplets from the heat dissipation part and the nozzle surface of the jet spray cooling device, the heat dissipation uniformity of the heat dissipation part is ensured, and at the same time, the uniform distribution of the spray is not affected, thereby improving the cooling uniformity and increasing the service life of the chip.

[0017] 2. During the spraying process of the nozzle, an arc plate with a width at the top and a narrowness at the bottom is used, so that the droplets continuously generated during operation are guided downward along the arc plate, and flow out along the tongue plate after reaching the liquid outlet. Since the tongue plate is in an arc shape and the concave and convex positions of the arc surface are opposite to the arc plate, the liquid can be delayed from falling from the liquid outlet to avoid splashing of droplets, and part of the sprayed mist is driven and absorbed into the droplets, thereby affecting the spray concentration. In addition, under the action of the annular groove, no matter how much the nozzle is rotated during installation, the arc plate is always facing downward, without the need for secondary adjustment, which is convenient for receiving droplets and preventing the droplets above from falling directly into the nozzle below, thereby ensuring that the spray always maintains the initial uniformity and is not affected by the droplets generated during the spraying process.

[0018] 3. Considering the integration and compactness of the design application in electronic equipment, the size of the cavity is set to be suitable for electronic chips with high heat flux density, which can not only avoid the excessive volume of the traditional spray cavity, but also facilitate the distribution and discharge of the liquid. The liquid inlet cavity and the atomization cavity are separated by a multi-nozzle array. In order to make the liquid distribution of the plate nozzle uniform, reduce the blind area of ​​the spray distribution, and increase the dense distribution between the droplets, thereby improving the heat exchange performance, the liquid enters the liquid inlet part from the liquid inlet, is atomized by the plate nozzle, and is evenly sprayed on the surface of the heating object. In addition, since the plate nozzle adopts a design that separates the panel and the nozzle, the nozzle part can be easily replaced, which reduces the serious wear of the nozzle during long-term use and the weakening of the atomization performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of a jet spray cooling and heat dissipation device of the present invention; Figure 2 It is a schematic diagram of the structure inside the atomizing chamber in a jet spray cooling and heat dissipation device of the present invention; Figure 3 It is a schematic diagram of the installation positions of the first rotating member and the second rotating member in a jet spray cooling and heat dissipation device of the present invention; Figure 4 It is a schematic structural diagram of a first rotating member and a second rotating member in a jet spray cooling and heat dissipation device of the present invention; Figure 5 It is a schematic diagram of the disassembled structure of a first rotating member and a second rotating member in a jet spray cooling and heat dissipation device of the present invention; Figure 6 The present invention is a schematic diagram of the installation structure of the arc plate in a jet spray cooling and heat dissipation device.

[0020] 1. heat dissipation part; 2. plate nozzle; 21. fixing plate; 22. nozzle; 3. liquid inlet plate; 4. liquid inlet cavity; 5. atomization cavity; 6. liquid inlet; 71. first rotating member; 72. second rotating member; 73. first guide plate; 74. second guide plate; 75. arc-shaped slideway; 76. servo motor; 77. sliding wheel; 78. brush; 79. scraper; 710. through hole; 711. diversion chute; 81, first annular groove; 82, second annular groove; 83, sliding column; 84, arc plate; 85, liquid outlet hole; 86, tongue plate; DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Example: Figure 1 As shown, the present invention provides a jet spray cooling and heat dissipation device, comprising a liquid inlet portion and a heat dissipation portion 1 for attaching to an electronic device to cool down; Furthermore, the liquid inlet portion includes a liquid inlet plate 3, a liquid inlet cavity 4 is opened in the middle of the liquid inlet plate 3, and the coolant enters the liquid inlet cavity 4 through the liquid inlet port; A closed atomizing chamber 5 is formed between the liquid inlet plate 3 and the heat dissipation plate 1, and a spraying portion facing the atomizing chamber 5 is detachably mounted on the liquid inlet plate 3; Furthermore, the spraying part is a plate-type nozzle 2, comprising a detachable fixed plate 21 and a spray head 22, the fixed plate 21 is connected to the liquid inlet plate 3, and the spray head 22 is mounted on the fixed plate 21; The coolant enters the liquid inlet cavity 4 through the liquid inlet port 6. As the pressure inside the liquid inlet cavity 4 increases, the coolant is sprayed out through the nozzle 22 in atomized form. The atomized coolant enters the atomizing cavity 5 and is adsorbed on the surface of the heat dissipation part 1, thereby cooling and dissipating the electronic components attached to the heat dissipation part 1. like Figure 2-Figure 5 As shown, a first rotating member 71 is rotatably installed inside the atomizing chamber 5, a second rotating member 72 is slidably installed on the first rotating member 71, and a cleaning part for cleaning water droplets is provided on the first rotating member 71 and the second rotating member 72 facing the liquid inlet plate 3 and the heat dissipation part 1; Furthermore, the cleaning portion includes a first guide plate 73 and a second guide plate 74, the first guide plate 73 being mounted on one side of the first rotating member 71 and the second rotating member 72, the second guide plate 74 being mounted on the other side of the first rotating member 71 and the second rotating member 72, an open groove 711 being provided on the first rotating member for the first guide plate 73 and the second guide plate 74 on the second rotating member 72 to slide inside the groove, a scraper 79 or a brush 78 being mounted on the first guide plate 73 and the second guide plate 74 on the side away from the first rotating member 71 and the second rotating member 72, and a guide chute 711 being provided at the connection between the first guide plate 73 and the second guide plate 74 and the scraper 79 or the brush 78.

[0023] A limiting portion for limiting the stable rotation of the first rotating member 71 and the second rotating member 72 is arranged inside the atomizing chamber 5. The limiting portion is an arc-shaped slide groove 75. One end of the second rotating member 74 is slidably connected to the limiting arc-shaped slide groove 75. The first rotating member 71 is driven to rotate by a servo motor 76.

[0024] In one embodiment, a second rotating member 72 is slidably sleeved inside the first rotating member 71 , a sliding wheel 77 is provided at one end of the second rotating member 74 , and when the first rotating member 71 is driven to rotate by a servo motor 76 , the sliding wheel 77 slides back and forth inside the arc-shaped sliding groove 75 .

[0025] During operation, the spray will continuously gather into water droplets and remain at the nozzle 22, and will drip when it gathers to a certain extent, so that the vertically arranged nozzles 22 will accumulate liquid and then intermittently drip downward, which may block the lower nozzle 22 many times, affecting the overall uniformity of the spray. Secondly, after each spray is sprayed, the spray is easy to adhere to the surface of the heat sink 1 to form water droplets, which will cause the temperature distribution of the coolant and the heat sink 1 itself to be uneven when used next time. Compared with the prior art, through the implementation of this embodiment, the first rotating member 71 and the second rotating member 72, in conjunction with the first guide plate 73 and the second guide plate 74 and the brush 78 and the scraper 79, can synchronously collect and discharge the droplets at the heat sink 1 and the nozzle 22, thereby improving the comprehensiveness of the droplet collection, and ultimately, each time the chip is turned on, each nozzle 22 starts to spray water mist in a direction directly toward the heat sink 1, thereby ensuring the initial uniformity of the spray.

[0026] A plurality of through holes 710 are disposed at the connection between the first guide plate 73 and the second guide plate 74 and the first rotating member 71 and the second rotating member 72 . A drainage groove 713 is disposed at the bottom of each of the first rotating member 71 and the second rotating member 72 .

[0027] The first guide plate 73 and the second guide plate 74 are both arranged to be inclined relative to the first rotating member 71 and the second rotating member 72 .

[0028] In one embodiment, when the atomization cooling treatment of the electronic device is stopped, the servo motor 76 is started, and the servo motor 76 drives the first rotating member 71 and the second rotating member 72 to rotate. During the rotation, the first guide plate 73 and the second guide plate 74 drive the brush 78 and the scraper 79 to clean the water droplets adhered to the surface of the heat sink 1 and the nozzle 22. During the cleaning process, the water droplets will flow along the guide chute 711 to the first guide plate 73 and the second guide plate 74, and then flow into the first rotating member 71 and the second rotating member 72 through the through hole 710, and then be discharged through the drainage groove 713. A drainage port is provided at the bottom of the atomization chamber, and finally the coolant is discharged through the drainage port, so as to achieve the effect of cleaning the atomization chamber 5 after use, thereby ensuring the next cooling and heat dissipation needs of the electronic device.

[0029] like Figure 6As shown, a first annular groove 81 is provided at the connection between the nozzle 22 and the fixed plate 21, and a second annular groove 82 is provided at the end of the nozzle 22 away from the fixed plate 21. Sliding columns 83 are slidably arranged inside the first annular groove 81 and the second annular groove 82, and one end of the sliding column 83 is connected to an arc plate 84.

[0030] A liquid outlet hole 85 is formed at the bottom of the arc plate 84 , and a tongue plate 86 is disposed below the liquid outlet hole 85 . The arc plate 85 is wide at the top and narrow at the bottom.

[0031] Furthermore, when the nozzle 22 is installed, no matter the nozzle 22 is rotated at any angle due to the installation, under the action of the first annular groove 81 and the second annular groove 82, the arc plate 84 is always located below the nozzle 22 under the cooperation of the slide column 83 and its own gravity, so as to receive the droplets dripping from the spray port of the nozzle 22 during operation, and there is no need to adjust the position of the arc plate 84. During operation, the continuously generated droplets can flow along the arc plate 84 to the liquid outlet 85 and then flow out along the tongue plate 86, and the liquid outlet 85 is close to the nozzle 22. The plate-type nozzle 22 is set to prevent the droplets above from falling directly into the spray outlet of the nozzle 22 below. When the droplets gather at the lower position of the nozzle 22 and continue to drip, the arc plate 84 is set to be wide at the top and narrow at the bottom. The wider upper part can collect most of the droplets generated by the spray outlet, and then discharge them in a concentrated manner along the narrower part below the arc plate 84, so that the droplets all flow to the surface of the nozzle 22, thereby ensuring that the initial uniformity is always maintained during the spraying process of the nozzle 22, thereby increasing the continuous uniformity of the spray.

[0032] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0033] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A jet spray cooling and heat dissipation device, comprising a liquid inlet and a heat dissipation part for cooling down an electronic device, a closed atomization chamber is formed between the liquid inlet and the heat dissipation part, and a spray part facing the atomization chamber is detachably mounted on the liquid inlet, characterized in that: A first rotating member is rotatably installed inside the atomizing chamber, a second rotating member is slidably installed on the first rotating member, and cleaning parts for cleaning water droplets are arranged on the sides of the first rotating member and the second rotating member facing the liquid inlet part and the heat dissipation part. A limiting part for limiting the stable rotation of the first rotating member and the second rotating member is arranged inside the atomizing chamber, one end of the second rotating member is slidably connected to the limiting part, and the first rotating member is driven to rotate by a power source.

2. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: A second rotating member is provided in a sliding sleeve inside the first rotating member, a sliding wheel is provided at one end of the second rotating member, and the limiting portion is an arc-shaped sliding groove. When the first rotating member is driven to rotate by a power source, the sliding wheel slides back and forth inside the arc-shaped sliding groove.

3. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: The cleaning part includes a first guide plate and a second guide plate, the first guide plate is installed on one side of the first rotating member and the second rotating member, and the second guide plate is installed on the other side of the first rotating member and the second rotating member. An open groove is provided on the first rotating member for the first guide plate and the second guide plate to slide inside the groove, a scraper or a brush is installed on the first guide plate and the second guide plate on the side away from the first rotating member and the second rotating member, and a guide chute is provided at the connection between the first guide plate and the second guide plate and the scraper or the brush.

4. The jet spray cooling and heat dissipation device according to claim 3, characterized in that: A plurality of through holes are provided at the connection between the first guide plate and the second guide plate and the first rotating member and the second rotating member, and a drainage groove is provided at the bottom of the first rotating member and the second rotating member.

5. The jet spray cooling and heat dissipation device according to claim 3, characterized in that: The first guide plate and the second guide plate are both arranged to be inclined relative to the first rotating member and the second rotating member.

6. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: The injection part includes a detachable fixed plate and a nozzle, the fixed plate is connected to the liquid inlet part, the nozzle is installed on the fixed plate, a first annular groove is provided at the connection between the nozzle and the fixed plate, a second annular groove is provided at one end of the nozzle away from the fixed plate, sliding columns are slidably arranged inside the first annular groove and the second annular groove, and one end of the sliding column is connected to the arc plate.

7. The jet spray cooling and heat dissipation device according to claim 6, characterized in that: A liquid outlet hole is provided at the bottom of the arc-shaped plate, and a tongue plate is provided below the liquid outlet hole.

8. The jet spray cooling and heat dissipation device according to claim 6, characterized in that: The arc-shaped plate is arranged to be wider at the top and narrower at the bottom.

9. A jet spray cooling and heat dissipation device according to claims 1-8, characterized in that: A liquid inlet cavity is provided in the middle of the liquid inlet portion, a liquid inlet port is provided at one side of the liquid inlet cavity, and a liquid discharge port is provided at the bottom of the atomizing cavity.

10. A jet spray cooling and heat dissipation device according to claims 1-8, characterized in that: The power source is a servo motor, and the servo motor drives one end of the first rotating member to reciprocate.

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