A jet spray cooling and heat dissipation device

Abstract

The present invention discloses a jet spray cooling heat dissipation device, which relates to the technical field of spray cooling, comprises a liquid inlet part and a heat dissipation part for cooling electronic devices, a closed atomizing chamber is formed between the liquid inlet part and the heat dissipation part, a spray part facing the atomizing chamber is detachably mounted on the liquid inlet part, a first rotating part is rotatably mounted inside the atomizing chamber, a second rotating part is slidably mounted on the first rotating part, a cleaning part for cleaning water droplets is provided on the first rotating part and the second rotating part facing the liquid inlet part and the heat dissipation part, a limiting part is provided inside the atomizing chamber for limiting the stable rotation of the first rotating part and the second rotating part, each time the spraying is stopped, the limiting part and the rotating part are cooperated, and the first guide plate and the second guide plate can be used to synchronously collect and discharge the liquid droplets at the heat dissipation part and the spray part, so as to avoid the phenomenon that the temperature of the liquid and the heat dissipation part itself is unevenly distributed after the heat of the chip is transferred to the surface of the heat dissipation part.

Description

Technical Field

[0001] The invention relates to the technical field of spray cooling, in particular to a jet spray cooling and heat dissipation device. Background Art

[0002] With the rapid development of electronic equipment integration technology, the power density of electronic components is increasing, and their heat dissipation requirements are becoming increasingly stringent. Therefore, for the heat dissipation of high power consumption and high heat flux density bodies, a heat dissipation method using jet spray cooling has been adopted. The liquid working medium is pressurized to form a high-pressure liquid and is sprayed from the atomizing nozzle. In a low-pressure environment, the liquid is atomized into uniform fine droplets, which impact the heating surface at a high speed to form a liquid film on the heating surface. The heating surface is cooled by the impact of the droplets, the scouring of the liquid film, evaporation, boiling, etc.

[0003] A Chinese invention patent (CN106288501A) discloses "a high-load CPU spray phase change refrigeration device coolant circulation system and control method thereof." It specifically discloses: the coolant accumulated in the spray chamber is extracted through the negative pressure formed in the jet chamber to achieve coolant circulation; by adopting a closed spray chamber design and a closed-circuit circulation system, the coolant is completely isolated from the outside world to ensure the safety of the equipment; it has a fully self-circulating function, and has the advantages of high heat dissipation efficiency, low energy consumption, and low noise. It is suitable for high-load chip heat dissipation in single-unit desktop computers, high-performance workstations, etc.

[0004] In fact, after each spray is completed, the spray tends to adhere to the surface of the heat sink to form water droplets. Due to the different media between the heat sink and the liquid, when the heat of the chip is transferred to the surface of the heat sink next time, the temperature distribution of the liquid and the heat sink itself is uneven, which will affect the heat dissipation uniformity of the chip of the high heat flux density electronic device and reduce the heat dissipation efficiency. In addition, long-term uneven heat dissipation will also shorten the service life of the chip.

[0005] In view of this, the present invention proposes a jet spray cooling and heat dissipation device to compensate for and improve the shortcomings of the prior art. Summary of the Invention

[0006] The object of the present invention is to provide a jet spray cooling and heat dissipation device to solve the problems raised in the prior art.

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a jet spray cooling and heat dissipation device, comprising a liquid inlet part and a heat dissipation part for cooling electronic devices, a closed atomization chamber is formed between the liquid inlet part and the heat dissipation part, a spray part facing the atomization chamber is detachably mounted on the liquid inlet part, a first rotating part is rotatably mounted inside the atomization chamber, a second rotating part is slidably mounted on the first rotating part, a cleaning part for cleaning water droplets is provided on the first rotating part and the second rotating part facing the liquid inlet part and the heat dissipation part, a limiting part is provided inside the atomization chamber for limiting the stable rotation of the first rotating part and the second rotating part, one end of the second rotating part is slidably connected to the limiting part, and the first rotating part is driven to rotate by a power source.

[0008] The first rotating member and the second rotating member, in conjunction with the design of the cleaning portion, can clean the water droplets accumulated inside the atomization chamber after the electronic device has been cooled, thereby preventing the accumulation of water droplets from causing uneven heat dissipation of the electronic device when it is subsequently used, thereby reducing the service life of the electronic device.

[0009] A second rotating member is provided in a sliding sleeve inside the first rotating member, a sliding wheel is provided at one end of the second rotating member, and the limiting portion is an arc-shaped sliding groove. When the first rotating member is driven to rotate by a power source, the sliding wheel slides back and forth inside the arc-shaped sliding groove.

[0010] The above technical solution can ensure that the first rotating member and the second rotating member can operate stably and for a long time when cleaning the inside of the atomization chamber.

[0011] The cleaning part includes a first guide plate and a second guide plate, the first guide plate is installed on one side of the first rotating member and the second rotating member, and the second guide plate is installed on the other side of the first rotating member and the second rotating member. An open groove is provided on the first rotating member for the first guide plate and the second guide plate on the second rotating member to slide inside the groove, a scraper or a brush is installed on the first guide plate and the second guide plate away from the first rotating member and the second rotating member, and a diversion chute is provided at the connection between the first guide plate and the second guide plate and the scraper or the brush.

[0012] A plurality of through holes are provided at the connection between the first guide plate and the second guide plate and the first rotating member and the second rotating member, and a drainage groove is provided at the bottom of the first rotating member and the second rotating member.

[0013] The first guide plate and the second guide plate are both arranged to be inclined relative to the first rotating member and the second rotating member.

[0014] The injection part includes a detachable fixed plate and a nozzle, the fixed plate is connected to the liquid inlet part, the nozzle is installed on the fixed plate, a first annular groove is provided at the connection between the nozzle and the fixed plate, and a second annular groove is provided at one end of the nozzle away from the fixed plate. Slide columns are slidably arranged inside the first and second annular grooves, and one end of the slide column is connected to the arc plate.

[0015] A liquid outlet hole is provided at the bottom of the arc-shaped plate, and a tongue plate is provided below the liquid outlet hole.

[0016] The arc-shaped plate is arranged to be wider at the top and narrower at the bottom.

[0017] A liquid inlet cavity is provided in the middle of the liquid inlet portion, a liquid inlet port is provided on one side of the liquid inlet cavity, and a liquid discharge port is provided at the bottom of the atomizing cavity.

[0018] The power source is a servo motor, and the servo motor drives one end of the first rotating member to reciprocate.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. Compared with the existing technology where the spray gathers into droplets and adheres to the heat sink or accumulates and remains on the nozzle, resulting in long-term uneven heat dissipation that affects the service life of the chip, each time the spraying stops, the limit part and the rotating part cooperate to use the first guide plate and the second guide plate to synchronously collect and discharge the droplets at the heat sink and the spray part, thereby avoiding the phenomenon of uneven temperature distribution between the liquid and the heat sink itself after the heat of the chip is transferred to the surface of the heat sink;

[0021] In addition, the first guide plate and the second guide plate are both inclined, which improves the drainage efficiency. Ultimately, each time the chip is turned on, the water mist sprayed by each nozzle is directly directed toward the heat dissipation part, and will not be affected by the residual accumulated water droplets from the last time, thereby ensuring the initial uniformity of the spray. In short, by accelerating the discharge of droplets from the heat dissipation part and the nozzle surface of the jet spray cooling device, the heat dissipation uniformity of the heat dissipation part is ensured, and at the same time, the uniform distribution of the spray is not affected, thereby improving the cooling uniformity and increasing the service life of the chip.

[0022] 2. During the process of spraying water mist from the nozzle, an arc-shaped plate with a width at the top and a narrowness at the bottom is used, so that the droplets continuously generated during operation are guided downward along the arc-shaped plate, and flow out along the tongue plate after reaching the liquid outlet. Since the tongue plate is in an arc shape and the concave and convex positions of the arc surface are opposite to the arc-shaped plate, the liquid can be delayed from falling from the liquid outlet to avoid splashing of droplets, and part of the sprayed mist is driven and absorbed into the droplets, thereby affecting the spray concentration. Moreover, under the action of the annular groove, no matter how much the nozzle is rotated during installation, the arc-shaped plate is always facing downward, without the need for secondary adjustment, which is convenient for catching droplets and preventing droplets from falling directly into the nozzle below, thereby ensuring that the spray always maintains the initial uniformity and is not affected by the water droplets generated during the spraying process.

[0023] 3. Considering the integration and compactness of the design application in electronic equipment, the size of the cavity is set to be suitable for electronic chips with high heat flux density, which can not only avoid the excessive volume of the traditional spray cavity, but also facilitate the distribution and discharge of the liquid. The liquid inlet cavity and the atomization cavity are separated by a multi-nozzle array. In order to make the liquid distribution of the plate nozzle uniform, reduce the blind area of ​​the spray distribution, increase the dense distribution between the droplets, and thus improve the heat exchange performance, the liquid enters the liquid inlet from the liquid inlet, is atomized through the plate nozzle, and is evenly sprayed on the surface of the heating object. In addition, since the plate nozzle adopts a design that separates the panel and the nozzle, the nozzle part can be easily replaced, reducing the serious wear of the nozzle during long-term use and the weakening of the atomization performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a jet spray cooling and heat dissipation device of the present invention;

[0025] Figure 2 This is a schematic diagram of the structure inside the atomizing chamber of a jet spray cooling and heat dissipation device of the present invention;

[0026] Figure 3 Schematic diagram of the installation positions of the first rotating member and the second rotating member in a jet spray cooling and heat dissipation device of the present invention;

[0027] Figure 4 This is a schematic structural diagram of a first rotating member and a second rotating member in a jet spray cooling and heat dissipation device of the present invention;

[0028] Figure 5 This is a schematic diagram of the disassembled structure of a first rotating member and a second rotating member in a jet spray cooling and heat dissipation device of the present invention;

[0029] Figure 6 The figure is a schematic diagram of the installation structure of the arc plate in a jet spray cooling and heat dissipation device of the present invention.

[0030] 1. Heat dissipation unit; 2. Plate nozzle; 21. Fixing plate; 22. Nozzle; 3. Liquid inlet plate; 4. Liquid inlet cavity; 5. Atomizing cavity; 6. Liquid inlet;

[0031] 71. First rotating member; 72. Second rotating member; 73. First guide plate; 74. Second guide plate; 75. Arc-shaped chute; 76. Servo motor; 77. Sliding wheel; 78. Brush; 79. Scraper; 710. Through hole; 711. Diversion chute;

[0032] 81. First annular groove; 82. Second annular groove; 83. Sliding column; 84. Arc plate; 85. Liquid outlet; 86. Tongue plate; DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] Example: Figure 1 As shown, the present invention provides a jet spray cooling and heat dissipation device, comprising a liquid inlet portion and a heat dissipation portion 1 for attaching to electronic devices to cool down;

[0035] Furthermore, the liquid inlet portion includes a liquid inlet plate 3, a liquid inlet cavity 4 is opened in the middle of the liquid inlet plate 3, and the coolant enters the liquid inlet cavity 4 through the liquid inlet port;

[0036] A sealed atomizing chamber 5 is formed between the liquid inlet plate 3 and the heat dissipation plate 1, and a spray portion facing the atomizing chamber 5 is detachably mounted on the liquid inlet plate 3;

[0037] Furthermore, the spraying part is a plate-type nozzle 2, comprising a detachable fixed plate 21 and a spray head 22, the fixed plate 21 being connected to the liquid inlet plate 3, and the spray head 22 being mounted on the fixed plate 21;

[0038] The coolant enters the liquid inlet chamber 4 through the liquid inlet 6. As the pressure inside the liquid inlet chamber 4 continues to increase, the coolant is atomized and sprayed out through the nozzle 22. The atomized coolant enters the atomization chamber 5 and is adsorbed on the surface of the heat dissipation part 1, thereby cooling and dissipating the electronic components attached to the heat dissipation part 1.

[0039] like Figure 2-Figure 5 As shown, a first rotating member 71 is rotatably installed inside the atomizing chamber 5, and a second rotating member 72 is slidably installed on the first rotating member 71. The first rotating member 71 and the second rotating member 72 are both provided with cleaning parts for cleaning water droplets on the side facing the liquid inlet plate 3 and the heat dissipation part 1;

[0040] Furthermore, the cleaning portion includes a first guide plate 73 and a second guide plate 74, the first guide plate 73 being mounted on one side of the first rotating member 71 and the second rotating member 72, and the second guide plate 74 being mounted on the other side of the first rotating member 71 and the second rotating member 72, an open groove 711 being provided on the first rotating member for the first guide plate 73 and the second guide plate 74 on the second rotating member 72 to slide inside the groove, a scraper 79 or a brush 78 being mounted on the side of the first guide plate 73 and the second guide plate 74 away from the first rotating member 71 and the second rotating member 72, and a diversion chute 711 being provided at the connection between the first guide plate 73 and the second guide plate 74 and the scraper 79 or the brush 78.

[0041] A limiting portion is provided inside the atomizing chamber 5 to limit the stable rotation of the first rotating member 71 and the second rotating member 72. The limiting portion is an arc-shaped sliding groove 75. One end of the second rotating member 74 is slidably connected to the limiting arc-shaped sliding groove 75. The first rotating member 71 is driven to rotate by a servo motor 76.

[0042] In one embodiment, a second rotating member 72 is slidingly sleeved inside the first rotating member 71 , and a sliding wheel 77 is provided at one end of the second rotating member 74 . When the first rotating member 71 is driven to rotate by a servo motor 76 , the sliding wheel 77 slides back and forth inside the arc-shaped sliding groove 75 .

[0043] During operation, the spray will continuously gather into water droplets and remain at the nozzle 22, and will drip when it gathers to a certain extent, so that the vertically arranged nozzles 22 will intermittently drip downward after the liquid accumulates, which may block the lower nozzle 22 multiple times, affecting the overall uniformity of the spray. Secondly, after each spray is completed, the spray is easy to adhere to the surface of the heat sink 1 to form water droplets, which will cause the temperature distribution of the coolant and the heat sink 1 itself to be uneven when used next time. Compared with the prior art, through the implementation of this embodiment, the first rotating member 71 and the second rotating member 72, in conjunction with the first guide plate 73 and the second guide plate 74 and the brush 78 and the scraper 79, can synchronously collect and discharge the droplets at the heat sink 1 and the nozzle 22, thereby improving the comprehensiveness of the droplet collection, and ultimately, each time the chip is turned on to work, each nozzle 22 will initially spray water mist directly toward the heat sink 1, thereby ensuring the initial uniformity of the spray.

[0044] A plurality of through holes 710 are provided at the connection between the first guide plate 73 and the second guide plate 74 and the first rotating member 71 and the second rotating member 72 . A drainage groove 713 is provided at the bottom of each of the first rotating member 71 and the second rotating member 72 .

[0045] The first guide plate 73 and the second guide plate 74 are both inclined relative to the first rotating member 71 and the second rotating member 72 .

[0046] In one embodiment, when the atomization cooling treatment of the electronic device is stopped, the servo motor 76 is started, and the servo motor 76 drives the first rotating member 71 and the second rotating member 72 to rotate. During the rotation, the first guide plate 73 and the second guide plate 74 drive the brush 78 and the scraper 79 to clean the water droplets adhered to the surface of the heat sink 1 and the nozzle 22. During the cleaning process, the water droplets will flow along the guide chute 711 to the first guide plate 73 and the second guide plate 74, and then flow into the first rotating member 71 and the second rotating member 72 through the through hole 710, and then be discharged through the drain groove 713. A drain port is provided at the bottom of the atomization chamber, and finally the coolant is discharged through the drain port, thereby achieving the effect of cleaning the atomization chamber 5 after use, ensuring the next cooling and heat dissipation needs of the electronic device.

[0047] like Figure 6 As shown, a first annular groove 81 is provided at the connection between the nozzle 22 and the fixed plate 21, and a second annular groove 82 is provided at the end of the nozzle 22 away from the fixed plate 21. A sliding column 83 is slidingly provided inside the first annular groove 81 and the second annular groove 82, and one end of the sliding column 83 is connected to the arc plate 84.

[0048] A liquid outlet 85 is formed at the bottom of the arc-shaped plate 84 , and a tongue plate 86 is provided below the liquid outlet 85 . The arc-shaped plate 85 is wide at the top and narrow at the bottom.

[0049] Furthermore, when the nozzle 22 is installed, no matter the nozzle 22 is rotated at any angle due to the installation, under the action of the first annular groove 81 and the second annular groove 82, the arc plate 84 is always located below the nozzle 22 under the cooperation of the sliding column 83 and its own gravity, so as to receive the droplets dripping from the spray port of the nozzle 22 during operation, without having to adjust the position of the arc plate 84. During operation, the continuously generated droplets can flow along the arc plate 84 to the liquid outlet 85 and then flow out along the tongue plate 86. The liquid outlet 85 is close to the nozzle 22. The plate-type nozzle 22 is set to prevent the droplets above from falling directly into the spray outlet of the nozzle 22 below. When the droplets gather at the lower position of the nozzle 22 and continue to drip, the curved plate 84 is set to be wide at the top and narrow at the bottom. The wider upper portion can collect most of the droplets produced by the spray outlet, and then concentrate them along the narrower part below the curved plate 84 to be discharged, so that the droplets flow to the surface of the nozzle 22, thereby ensuring that the initial uniformity is always maintained during the spraying process of the nozzle 22, thereby increasing the continuous uniformity of the spray.

[0050] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0051] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A jet spray cooling and heat dissipation device, comprising a liquid inlet and a heat dissipation portion for cooling electronic devices, a closed atomization chamber formed between the liquid inlet and the heat dissipation portion, and a spray portion detachably mounted on the liquid inlet, directed toward the atomization chamber, characterized in that: A first rotating member is rotatably mounted inside the atomizing chamber, a second rotating member is slidably mounted on the first rotating member, and a cleaning portion for cleaning water droplets is provided on the first rotating member and the second rotating member on the side facing the liquid inlet portion and the heat dissipation portion. A limiting portion is provided inside the atomizing chamber to limit the stable rotation of the first rotating member and the second rotating member, one end of the second rotating member is slidably connected to the limiting portion, and the first rotating member is driven to rotate by a power source; The cleaning portion includes a first guide plate and a second guide plate, wherein the first guide plate is mounted on one side of the first rotating member and the second rotating member, and the second guide plate is mounted on the other side of the first rotating member and the second rotating member, an open groove is provided on the first rotating member for the first guide plate and the second guide plate to slide inside the groove, a scraper or a brush is mounted on the first guide plate and the second guide plate on the side away from the first rotating member and the second rotating member, and a guide chute is provided at the connection between the first guide plate and the second guide plate and the scraper or the brush; The injection part includes a detachable fixed plate and a nozzle, the fixed plate is connected to the liquid inlet part, the nozzle is installed on the fixed plate, a first annular groove is provided at the connection between the nozzle and the fixed plate, and a second annular groove is provided at one end of the nozzle away from the fixed plate. Slide columns are slidably arranged inside the first and second annular grooves, and one end of the slide column is connected to the arc plate.

2. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: A second rotating member is provided in a sliding sleeve inside the first rotating member, a sliding wheel is provided at one end of the second rotating member, and the limiting portion is an arc-shaped sliding groove. When the first rotating member is driven to rotate by a power source, the sliding wheel slides back and forth inside the arc-shaped sliding groove.

3. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: A plurality of through holes are provided at the connection between the first guide plate and the second guide plate and the first rotating member and the second rotating member, and a drainage groove is provided at the bottom of the first rotating member and the second rotating member.

4. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: The first guide plate and the second guide plate are both arranged to be inclined relative to the first rotating member and the second rotating member.

5. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: A liquid outlet hole is provided at the bottom of the arc-shaped plate, and a tongue plate is provided below the liquid outlet hole.

6. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: The arc-shaped plate is arranged to be wider at the top and narrower at the bottom.

7. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: A liquid inlet cavity is provided in the middle of the liquid inlet portion, a liquid inlet port is provided on one side of the liquid inlet cavity, and a liquid discharge port is provided at the bottom of the atomizing cavity.

8. The jet spray cooling and heat dissipation device according to claim 1, characterized in that: The power source is a servo motor, and the servo motor drives one end of the first rotating member to reciprocate.

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