Method and device for transferring electronic component

Abstract

An electronic component transfer method for transferring an electronic component (1) having one end and the other end from a first holding member (20A) to a second holding member (20B) includes: a first step (D1) in which the distance between the first holding member and the second holding member to which the other end of the electronic component is bonded is shortened; bonding the other end of the electronic component to the second holding member; and a second step (D2 and D3, or D2 and D4) in which the electronic component adhered to the second holding member is separated from the first holding member by using the difference in adhesive force between the first holding member and the second holding member. The second step includes a distance increasing movement (D3) in which the distance between the first holding member and the second holding member is increased, and a position changing movement (D2 or D4) in which the distance between the first holding member and the second holding member is changed at least at the time of and / or before the start of the distance increasing movement. One of the first holding member and the second holding member is moved in parallel with respect to the other of the first holding member and the second holding member.

Description

Technical Field

[0001] The present invention relates to a transfer method and device for transferring an electronic component held by a first holding member to a second holding member. Background Art

[0002] For example, in a method for manufacturing an electronic component such as a multilayer capacitor, in which an external electrode is formed on an electronic component, one end of the electronic component is held on an adhesive sheet, and a conductive paste is applied to the other end (Patent Document 1). Figure 8 ).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-244104 Summary of the invention

[0006] Problems to be solved by the invention

[0007] As described in Patent Document 1 Figure 1 As shown, in order to form external electrodes at both ends of an electronic component, it is necessary to apply a conductive paste to the other end of the electronic component bonded by an adhesive plate at one end and dry it to form a first external electrode, and then form a second external electrode at the other end of the electronic component while the first external electrode is bonded to the adhesive plate.

[0008] However, after forming the first external electrode and before forming the second external electrode, it is troublesome to peel off the end portion adhered to the adhesive sheet and to re-adhere the first external electrode of the electronic component to the adhesive sheet.

[0009] An object of the present invention is to provide a method and apparatus for transferring an electronic component, which can directly and smoothly transfer an electronic component from a first holding member to a second holding member.

[0010] Means for solving problems

[0011] (1) One embodiment of the present invention relates to a method for transferring an electronic component having one end and the other end from a first holding member to a second holding member, wherein the method for transferring an electronic component comprises the following steps: a first step of shortening the distance between the first holding member to which the other end of the electronic component is bonded and the second holding member so that the one end of the electronic component is bonded to the second holding member; and a second step of utilizing a first bonding surface of the first holding member and a bonding force per unit area greater than that of the first bonding surface. Due to the difference in adhesive force between the second adhesive surfaces of the second holding component with a larger surface, the electronic component adhered to the second adhesive surface of the second holding component is peeled off from the first holding component. The second step includes a distance expansion movement and a position change movement. In the distance expansion movement, the distance between the first holding component and the second holding component is expanded. In the position change movement, at least when and / or before the start of the distance expansion movement, one of the first holding component and the second holding component is moved parallel to the other.

[0012] According to one embodiment of the present invention, the electronic component is tilted relative to the vertical line of the first holding member by the position change movement in the second process. As a result, the other end of the electronic component can be partially peeled off from the first adhesive surface of the first holding member. In this way, the adhesive force of the first adhesive surface of the first holding member on the electronic component can be weakened. At this time, one end of the electronic component may also be partially peeled off from the second adhesive surface of the second holding member. However, since the adhesive force per unit area of ​​the second adhesive surface of the second holding member is greater than that of the first adhesive surface of the first holding member, the electronic component is more strongly bonded to the second adhesive surface than the first adhesive surface. On the other hand, by the distance expansion movement simultaneously with or after the above-mentioned position change movement, the electronic component is completely peeled off from the first adhesive surface of the first holding member, and the electronic component is held only by the second holding member.

[0013] (2) In one embodiment (1) of the present invention, the second process may include the position change movement implemented before the start of the distance expansion movement and the distance expansion movement implemented thereafter. By implementing the position change movement before the start of the distance expansion movement, the other end of the electronic component is partially peeled off from the first adhesive surface of the first holding component during the distance expansion movement, thereby making it easy to detach the electronic component from the first holding component. In addition, the position change movement implemented before the start of the distance expansion movement may also be implemented multiple times as a process of linear movement, for example. This is effective for reliably detaching the electronic component from the first holding component.

[0014] (3) In one embodiment (1) of the present invention, the second step can simultaneously implement the distance expansion movement and the position change movement. In this way, the electronic component is separated from the first holding member while the local peeling of different regions is repeated, so that the electronic component can be reliably detached from the first holding member.

[0015] (4) In one embodiment (3) of the present invention, the position change movement can change the two-dimensional position obtained by projecting the electronic component onto the first adhesive surface of the first holding component in a manner in which the moving direction of the two-dimensional position within the surface of the first adhesive surface changes successively. In this way, by successively changing the moving direction of the two-dimensional position of the electronic component within the projection surface, the inclination of the central axis of the electronic component inclined relative to the perpendicular line of the first holding component changes successively. As a result, the local position of the other end of the electronic component peeled off from the first adhesive surface of the first holding component also changes successively. Therefore, by repeatedly performing local peeling in different areas, the electronic component can be easily detached from the first holding component.

[0016] (5) In one embodiment (1) of the present invention, the electronic component can have a first external electrode formed at one end and no second external electrode formed at the other end. In this case, the first external electrode is formed in advance at one end of the electronic component held by the first holding member before transfer. Thereafter, the second external electrode can be applied to the other end of the electronic component transferred from the first holding member to the second holding member.

[0017] (6) Another aspect of the present invention relates to an electronic component transfer device, comprising: a first holding member, which includes a first adhesive surface, and the first holding member allows the one end of an electronic component having one end and the other end to be bonded to the first adhesive surface so as to be able to hold the electronic component; a second holding member, which includes a second adhesive surface having an adhesive force per unit area greater than that of the first adhesive surface, and the second holding member allows the other end to be bonded to the second adhesive surface so as to be able to hold the electronic component; and a moving mechanism, which causes the first holding member and the second holding member to move relative to each other, and the moving mechanism moves the first holding member and the second holding member by shortening the surface of the other end to which the electronic component is bonded The distance between the first holding member and the second holding member is shortened so that the other end of the electronic component adheres to the second adhesive surface of the second holding member, and then the electronic component adhered to the second holding member is peeled off from the first adhesive surface of the first holding member by expanding the distance between the first holding member and the second holding member, and at least at the beginning and / or before the distance expansion movement, the other end of the electronic component is partially peeled off from the first adhesive surface by changing the position of one of the first holding member and the second holding member relative to the other. According to another embodiment (6) of the present invention, the method of one embodiment (1) of the present invention can be preferably implemented.

[0018] (7) In another aspect (6) of the present invention, aspects (2) to (5) of the present invention can also be applied. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a diagram showing an example of an electronic component manufactured by the method and apparatus for manufacturing an electronic component according to one embodiment of the present invention.

[0020] Figure 2 yes Figure 1 A schematic cross-sectional view of an electronic component.

[0021] Figure 3 This is a diagram showing an electronic component manufacturing apparatus according to one embodiment of the present invention.

[0022] Figure 4 yes Figure 3 Block diagram of a manufacturing apparatus.

[0023] Figure 5 This is a diagram showing the first step of the transfer method.

[0024] Figure 6 This is a diagram showing the second step of the transfer method according to the first embodiment.

[0025] Figure 7It is a diagram showing a state where electronic components are transferred.

[0026] Figure 8 This is a diagram showing a state where the electronic component is partially peeled off from the second holding member by the position change movement in the second step.

[0027] Fig. 9 This is a diagram showing the second step of the transfer method according to the second embodiment.

[0028] Fig.10 This is a diagram showing the position change movement in the second step of the second embodiment. DETAILED DESCRIPTION

[0029] In the following invention, many different embodiments and examples of different features for implementing the suggested subject matter are provided. Of course, these are merely exemplary and not restrictive. And, in the present invention, reference numerals and / or words are sometimes repeatedly referred to in various examples. Such repetition is for the sake of simplicity, and does not require itself to have a relationship with various embodiments and / or described structures. In addition, when the first element is described as being "connected" or "linked" to the second element, this description includes an embodiment in which the first element and the second element are directly connected or linked to each other, and also includes an embodiment in which the first element and the second element have more than one other element between them and are indirectly connected or linked to each other. In addition, when the first element is described as "moving" relative to the second element, this description includes an embodiment in which at least one of the first element and the second element moves relative to the other.

[0030] 1. Electronic components

[0031] Figure 1 An electronic component 1 manufactured by a manufacturing method according to an embodiment of the present invention is shown. Figure 2 The cross section of the paste material formed on the electronic component 1, for example, the first and second external electrodes 4A and 4B is schematically shown. Here, the size of the electronic component 1 to which the present invention is applied is not particularly limited, but it is suitable for an electronic component 1 that is ultra-miniaturized as the size is reduced. As an ultra-miniature electronic component 1, when Figure 1For example, the maximum length of one side of the rectangular (square or rectangular) cross section shown is set to L1, and when the length in the direction orthogonal to the rectangular cross section is set to L2, L1 = 500 μm or less and L2 = 1000 μm or less. Preferably, L1 = 300 μm or less and L2 = 600 μm or less, more preferably L1 = 200 μm or less and L2 = 400 μm or less, and more preferably L1 = 125 μm or less and L2 = 250 μm or less. In addition, the rectangle mentioned here includes a roughly rectangular shape with curved or chamfered corners in addition to a rectangle with two sides intersecting at an angle of strictly 90°. In addition, the present invention can of course also be applied to electronic components 1 other than rectangular cross sections.

[0032] exist Figure 2 In the embodiment, the first and second external electrodes 4A and 4B composed of the conductive paste layer are formed at the two end portions 2 and 2 of the electronic component 1. Each end portion 2 of the electronic component 1 includes an end face 2A, a side face 2B, and a corner portion 2C connecting the end face 2A and the side face 2B. In the present embodiment, the first external electrode 4A is first formed by coating and drying at one of the two end portions 2, and then the second external electrode 4B is coated at the other of the two end portions 2.

[0033] 2.Electronic component manufacturing equipment

[0034] Figure 3 A manufacturing apparatus 10 for implementing this embodiment is shown. Figure 4 The manufacturing device 10 includes a carrier plate (jig) 20 as a holding member for the electronic component 1, a moving mechanism 50, and a stage 100. Figure 3 The three orthogonal axes are defined as X, Y, and Z. The platform 100 can be used for the coating process of the first and second external electrodes 4A and 4B. Figure 5 ) between the electronic components 1, the platform 100 can be used, but the platform 100 can also be replaced by Figure 5 The transfer stage 200 shown. In this case, the moving mechanism 50 can be moved above the transfer stage 200 by a mechanism not shown.

[0035] The carrier 20 for holding a plurality of electronic components 1 hanging down has an adhesive surface for holding at least one, for example, a plurality of electronic components 1. The carrier 20 is detachably supported on the fixture fixing plate 30. A base 40 is fixed above the fixture fixing plate 30, and a platform 100 or a transfer stage 200 is arranged below.

[0036] The platform 100 is provided with a scraper unit 110 having a scraper 112 and a blade 114. The scraper unit 110 moves on the platform 100. The scraper unit 110 can form a dip layer of height H formed of the conductive paste 120 on the surface 101 of the platform 100 by moving the blade 114. The scraper unit 110 can scrape the dip layer of the conductive paste 120 from the surface 101 of the platform 100 by moving the scraper 112.

[0037] A moving mechanism 50 for moving the jig fixing plate 30 is provided on the base 40. Here, the moving mechanism 50 can include an X-axis driving unit 60, a Y-axis driving unit 70, and a Z-axis driving unit 80. In addition, the moving mechanism 50 only needs to move the jig fixing plate 30 and the platform 100 relative to each other in the X, Y, and Z axis directions. That is, the moving mechanism 50 can also move the platform 100 (transfer stage 200). Alternatively, a moving mechanism 50 for moving the jig fixing plate 30 and a moving mechanism 50 for moving the platform 100 (transfer stage 200) may also be provided. Alternatively, a part of the X-axis driving unit 60, the Y-axis driving unit 70, and the Z-axis driving unit 80 included in the moving mechanism 50 may move the jig fixing plate 30, and the other part may move the platform 100 (transfer stage 200).

[0038] The X-axis driving unit 60 can be composed of an X-table that can move relative to the base 40 in the X-axis direction along the X-axis guide 62. The Y-axis driving unit 70 can be composed of a Y-table that can move relative to the X-axis driving unit 60 in the Y-axis direction along the Y-axis guide 72. The Z-axis driving unit 80 is fixed to the Y-axis driving unit 70, for example, and can move the Z-axis 82 in the Z-axis direction. The fixture fixing plate 30 is fixed to the Z-axis 82. In addition, Figure 3 In the figure, illustration of a driving source for the X, Y, and Z axes, such as a motor and its driving force transmission mechanism, is omitted.

[0039] Thus, the jig plate 30 , the carrier plate 20 and the plurality of electronic components 1 can be moved relative to the stage 100 (transfer stage 200 ) in the Z-axis direction by the moving mechanism 50 , and can be moved along the XY plane parallel to the surface of the stage 100 .

[0040] like Figure 4As shown, the manufacturing device 10 has a control unit 90 that controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80. The control unit 90 is connected to an operation input unit 92 such as a keyboard. The control unit 90 includes a storage unit 91, in which operation information input via the operation input unit 92, pre-registered programs, etc. are stored. The control unit 90 controls the X-axis drive unit 60, the Y-axis drive unit 70, and the Z-axis drive unit 80 according to the data and programs stored in the storage unit 91. The control unit 90 can shorten the distance between the jig fixing plate 30 and the platform 100 (transfer stage 200) through the Z-axis drive unit 80 (distance shortening movement). In addition, the control unit 90 can move the jig fixing plate 30 in a moving trajectory within a plane parallel to the platform 100 (transfer stage 200), such as a straight line or a circular track, etc. (position change movement). Furthermore, the control unit 90 can increase the distance (distance expansion movement) between the jig fixing plate 30 and the platform 100 (transfer stage 200) through the Z-axis driving unit 80 while or after the linear or circular movement based on the X-axis driving unit 60 and the Y-axis driving unit 70.

[0041] 3. Manufacturing method of electronic components

[0042] In the manufacturing device 10 of the present embodiment, a pre-pressing process, a coating process, and a subsequent transfer process are performed for both ends 2 of the electronic component 1. The pre-pressing process is a process of bringing the end faces 2A of each of the plurality of electronic components 1 held on the carrier 20 into contact with the platform 100 before the coating process. The coating process is a process of bringing the end faces 2 including the end faces 2A of each of the plurality of electronic components 1 held on the carrier 20 into contact with the impregnation layer of the conductive paste formed on the surface 101 of the platform 100, and coating the conductive paste on the end faces 2 of each of the plurality of electronic components 1. The transfer process is a process of bringing the conductive paste coated on the end faces 2 of each of the plurality of electronic components 1 held on the carrier 20 into contact with the surface 101 of the platform 100, and transferring the excess conductive paste to the platform 100. Thereafter, the conductive paste is dried to form the first and second external electrodes 4A and 4B.

[0043] Here, in Figure 5 In the embodiment, the electronic component 1 having the first external electrode 4A formed at one end is held on the first carrier 20A. That is, the electronic component 1 held on the first carrier 20A forms the first external electrode 4A by undergoing the above-mentioned pre-pressing process, coating process, transfer process, and drying process. In order to form the second external electrode 4B at the other end of the electronic component 1, it is necessary to transfer the electronic component 1 from the first carrier 20A to the second carrier 20B.

[0044] Therefore, in Figure 5In the process, the first carrier plate 20A removed from the jig fixing plate 30 is held on the transfer stage 200. The first carrier plate 20A is fixed on the transfer stage 200 by vacuum adsorption, a clamp, etc., for example. Next, Figure 3 The jig fixing plate 30 and the second carrier plate 20B are moved to the upper side of the transfer stage 200 on which the first carrier plate 20A is arranged. Figure 5 The jig fixing plate 30 is omitted, and only one electronic component 1 is shown on the first carrier plate 20A.

[0045] exist Figure 5 In the embodiment, the first carrier 20A includes a first base material 21A and a first adhesive sheet (broadly, a first adhesive surface) 22A. The other end of the electronic component 1 having a first external electrode 4A formed at one end is bonded to the adhesive sheet 22A and held upright. The second carrier 20B also includes a first base material 21B and a second adhesive sheet 22B (broadly, a second adhesive surface). The first and second carriers 20A and 20B are arranged in a manner that the adhesive sheets 22A and 22B are opposed to each other.

[0046] 3.1. Method for transferring electronic components (Implementation 1)

[0047] 3.1.1. First step

[0048] like Figure 5 As shown in FIG. 1 , the distance between the first carrier 20A and the second carrier 20B to which the other end of the electronic component 1 is bonded is shortened. Figure 3 The Z-axis driving unit 80 shown in FIG. 1 moves the second carrier plate 20B along the Figure 5 The D1 direction is downward. Figure 6 As shown, the first external electrode 4A at one end of the electronic component 1 can be bonded to the adhesive sheet 22B of the second carrier 20B while the other end of the electronic component 1 is bonded to the adhesive sheet 22A of the first carrier 20A.

[0049] 3.1.2. Second step

[0050] like Figure 6 and Figure 7 As shown in FIG. 1 , the electronic component 1 bonded to the second carrier 20B is peeled off from the first carrier 20A by utilizing the difference in bonding strength between the first and second adhesive sheets 22A and 22B. Figure 6 In, through Figure 3 The X-axis driving unit 60 shown in FIG. Figure 6 After sliding in the D2 direction (hereinafter also referred to as D2 movement), Figure 3 The Z-axis driving unit 80 shown in FIG. Figure 6The D2 movement is a movement for changing the position of the first carrier plate 20A and the second carrier plate 20B so that one of the first carrier plate 20A and the second carrier plate 20B moves in parallel with respect to the other. The D3 movement is a distance expansion movement for expanding the distance between the first carrier plate 20A and the second carrier plate 20B. The D2 movement (sliding movement) implemented before the D3 movement can also be implemented multiple times in different directions. In addition, the D3 movement can also be implemented simultaneously with the D2 movement.

[0051] Here, through Figure 6 D2 moves as shown, Figure 8 As shown in FIG. 1 , the central axis P of the electronic component 1 is inclined relative to the vertical line of the first carrier 20A. Figure 8 As shown in FIG. 1 , the end face 2A of the electronic component 1 can be partially peeled off from the adhesive sheet 22A of the first carrier 20A. In this way, the adhesive force of the adhesive sheet 22A to the electronic component 1 can be weakened, making it easier to peel the electronic component 1 from the adhesive sheet 22A. At this time, the first external electrode 4A of the electronic component 1 may also be partially peeled off from the adhesive sheet 22B of the second carrier 20B. However, since the adhesive force per unit area of ​​the adhesive sheet 22B is greater than that of the adhesive sheet 22A, even if Figure 8 In the state, the electronic component 1 is also more strongly adhered to the adhesive sheet 22B than to the adhesive sheet 22A.

[0052] pass Figure 6 After the movement of D2 shown in the figure, the movement of D3 is performed, and the electronic component 1 is completely peeled off from the adhesive sheet 22A, as shown in the figure. Figure 7 As shown, the electronic component 1 is held only by the second carrier 20B. Afterwards, the second external electrode 4B can be formed on the electronic component 1 using the second carrier 20B in the same manner as the formation of the first external electrode 4A for the electronic component 1. In particular, by the above-mentioned transfer method, a plurality of electronic components 1 can be simultaneously transferred from the first carrier 20A to the second carrier 20B while maintaining the positional relationship of the plurality of electronic components 1 arranged and arranged on the first carrier 20A. In addition, in the first embodiment, the distance expansion movement can also be implemented simultaneously with the position change movement. In this case, the electronic component 1 partially peeled off by the position change movement can be separated from the first carrier 20A by the distance expansion movement implemented simultaneously.

[0053] 3.2. Method for transferring electronic components (Implementation 2)

[0054] In the second embodiment, the Figure 6 The second step (D2 movement and D3 movement) shown is changed to Fig. 9 The D3 movement and D4 movement shown. Fig. 9 In the process, the distance between the first and second carrier plates 20A and 20B is increased and moved (D3) at the same time. Fig.10D4 moves as shown. Fig.10 The D4 movement is the projection surface ( Fig.10 The D4 movement is also a position change movement that causes one of the first carrier 20A and the second carrier 20B to move parallel to the other. Specifically, in Fig.10 The moving direction of the two-dimensional position 1A (the tangent line 211 relative to the moving direction of the two-dimensional position 1A) is changed so that the two-dimensional position 1A becomes a part or the whole (ring) of the moving trajectory 210 of a circle, for example. Fig.10 The direction of the circle 210 shown in FIG. 210 changes successively. That is, Fig. 9 The simultaneous movement of the D3 movement and the D4 movement shown is by Figure 3 The X-axis driving unit 60, the Y-axis driving unit 70 and the Z-axis driving unit 80 cause the second carrier 20B to move spirally. Figure 8 As shown, the electronic component 1 is also partially peeled off from the adhesive sheet 22A of the first carrier 20A. The loop trajectory is not limited to a circle, and may be an ellipse or the like.

[0055] Furthermore, by making the two-dimensional position 1A of the electronic component 1 within the projection plane ( Fig.10 The moving direction of the tangent line 211 relative to the paper surface) Fig.10 The direction of the circle 210 shown in FIG. 21A changes successively, and the inclination of the central axis P of the electronic component 1 tilted relative to the perpendicular line of the first carrier 20A changes successively. As a result, the local position of the other end 2A of the electronic component 1 peeled off from the first adhesive sheet 22A of the first carrier 20A also changes successively. Therefore, by repeatedly performing local peeling of different regions, the electronic component 1 can be easily separated from the first carrier 20A.

[0056] In the second embodiment, the distance expansion movement and the position change movement are simultaneously performed in the second step. In this way, the electronic component 1 is separated from the first carrier 20A while the local peeling of different regions is repeated, so that the electronic component 1 can be smoothly and reliably separated from the first carrier 20A. Thus, as in the first embodiment, Figure 7 As shown, the electronic component 1 can be held only by the second carrier 20B.

[0057] In addition, the present invention is not limited to the above-mentioned embodiment, and various modifications can be implemented within the scope of the main purpose of the present invention. This transfer method can also be used for the transfer of electronic components before external electrodes are formed at one end and the other end. For example, a plurality of electronic components that are not formed with external electrodes before being held on the first carrier 20A are arranged by a guide having a plurality of guide holes and are held on a holding member. The holding member has an adhesive surface whose adhesive force per unit area is smaller than that of the first carrier 20A. This transfer method can also be used when transferring electronic components from the holding member to the first carrier 20A.

[0058] Description of symbols

[0059] 1: electronic component; 2: end; 2A: end face; 2B: side face; 2C: corner; 4A, 4B: paste material; 10: manufacturing device; 20, 20A, 20B: holding component (carrier); 21A, 21B: substrate; 22A: first bonding surface; 22B: second bonding surface; 30: fixture fixing plate; 40: base; 50: moving mechanism; 60: X-axis driving unit; 70: Y-axis driving unit; 80: Z-axis driving unit; 90: control unit; 91: storage unit; 92: operation input unit; 100: platform; 200: transfer stage; 210: moving trajectory of the circle; 211: tangent of the circle (successively changing moving direction); P: central axis of the electronic component.

Claims

1. A method for transferring an electronic component, wherein an electronic component having one end and another end is transferred from a first holding member to a second holding member, wherein: The electronic component transfer method has the following steps: The first step is to shorten the distance between the first holding member to which the other end of the electronic component is bonded and the second holding member so that the one end of the electronic component is bonded to the second holding member; as well as The second step is to peel the electronic component adhered to the second adhesive surface of the second holding member from the first holding member by utilizing the difference in adhesive force between the first adhesive surface of the first holding member and the second adhesive surface of the second holding member having an adhesive force per unit area greater than that of the first adhesive surface, The second step includes a distance expansion movement and a position change movement. In the distance expansion movement, the distance between the first holding component and the second holding component is expanded. In the position change movement, at least at the beginning of and / or before the beginning of the distance expansion movement, one of the first holding component and the second holding component is moved parallel to the other.

2. The method for transferring electronic components according to claim 1, wherein: The second step includes the position changing movement performed before the distance increasing movement is started and the distance increasing movement performed thereafter.

3. The method for transferring electronic components according to claim 1, wherein: The second step is to simultaneously perform the distance increasing movement and the position changing movement.

4. The method for transferring electronic components according to claim 3, wherein: In the position changing movement, the two-dimensional position obtained by projecting the electronic component onto the first adhesive surface of the first holding member is changed so that the moving direction of the two-dimensional position within the plane of the first adhesive surface is gradually changed.

5. The method for transferring electronic components according to claim 1, wherein: The electronic component has a first external electrode formed at the one end and no second external electrode formed at the other end.

6. A transfer device for electronic components, comprising: a first holding member including a first adhesive surface, the first holding member being capable of holding an electronic component having one end and another end by bonding the one end of the electronic component to the first adhesive surface; a second holding member including a second adhesive surface having an adhesive force per unit area greater than that of the first adhesive surface, the second holding member being capable of holding the electronic component by bonding the other end to the second adhesive surface; and a moving mechanism that moves the first holding member and the second holding member relatively, The moving mechanism moves by shortening the distance between the first holding member to which the other end of the electronic component is bonded and the second holding member, so that the other end of the electronic component is bonded to the second bonding surface of the second holding member. Then, the electronic component adhered to the second holding member is peeled off from the first adhesive surface of the first holding member by the distance enlarging movement to enlarge the distance between the first holding member and the second holding member. At least when and / or before the distance increasing movement starts, the other end of the electronic component is partially peeled from the first adhesive surface by causing one of the first holding member and the second holding member to change position relative to the other.

7. The electronic component transfer device according to claim 6, wherein: The moving mechanism performs the position changing movement before starting the distance increasing movement, and thereafter performs the distance increasing movement.

8. The electronic component transfer device according to claim 6, wherein: The moving mechanism performs the distance-enlarging movement and the position-changing movement simultaneously.

9. The electronic component transfer device according to claim 8, wherein: In the position changing movement, the two-dimensional position obtained by projecting the electronic component onto the first adhesive surface of the first holding member is changed so that the moving direction of the two-dimensional position within the plane of the first adhesive surface is gradually changed.

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