Heat sink component terminal

Abstract

A heat sink component may include a body including an electrically non-conductive thermally conductive material. At least one first terminal may be formed on a surface of the body. At least one second terminal may be formed on the surface of the body. A terminal spacing distance may be defined between the first terminal and the second terminal along the surface. The ratio of the length of the surface to the terminal spacing distance may be greater than about 10. Additionally or alternatively, a ratio of an area of the at least one body surface to a total terminal area may be less than 1.2. A component assembly may include a device having a plurality of terminals exposed on a top surface, and a heat source terminal and a heat sink terminal of a heat sink component may be connected with respective terminals of the device.

Description

[0001] Related Applications

[0002] This application is based upon and claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 390,655, filed on July 20, 2022, the entire contents of which are incorporated herein by reference. Background Art

[0003] Electrical circuits (e.g., power amplifier circuits) generate heat during normal operation. Heat accumulation may undesirably increase the temperature of various components of the circuit. If this heat is not adequately managed (e.g., by dissipating it to a heat sink), the electrical device may overheat, resulting in damage to the electrical component. Summary of the invention

[0004] According to one embodiment of the present invention, a heat sink component may include a body, the body includes a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. A heat source terminal may be formed on at least one body surface among the plurality of body surfaces. A heat sink terminal may be formed on at least one body surface among the plurality of body surfaces. A terminal spacing distance may be defined between the heat source terminal and the heat sink terminal along the at least one body surface. The ratio of the length of the at least one body surface to the terminal spacing distance may be greater than about 10.

[0005] According to another embodiment of the present invention, a heat sink component may include a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. A heat source terminal may be formed on at least one body surface among the plurality of body surfaces. A heat sink terminal may be formed on at least one body surface among the plurality of body surfaces. The at least one body surface may have an area defined by the product of the length of the at least one body surface and the width of the at least one body surface. The heat source terminal may have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal may have a heat sink terminal area defined by the product of the heat source terminal length and the heat source terminal width. The sum of the heat source terminal area and the heat sink terminal area may be the total terminal area. The ratio of the area of ​​the at least one body surface to the total terminal area may be less than 1.2.

[0006] According to another embodiment of the present invention, a heat sink component may include a body, the body includes a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. A heat source terminal may be formed on at least one body surface among the plurality of body surfaces. A heat sink terminal may be formed on at least one body surface among the plurality of body surfaces. A terminal spacing distance may be defined between the heat source terminal and the heat sink terminal along the at least one body surface. The terminal spacing distance may be offset from a transverse centerline axis extending in the transverse direction or a longitudinal centerline axis extending in the longitudinal direction.

[0007] According to another embodiment of the present invention, a heat sink component may include a body, which includes a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. The heat source terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may include a flange extending beyond the body.

[0008] According to another embodiment of the present invention, a heat sink component may include a body, the body includes a non-conductive heat-conducting material. The body may define a longitudinal direction, a transverse direction and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. The heat source terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface or the second side surface. The heat sink terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface or the second side surface. The heat source terminal may include a pair of bendable leads.

[0009] According to another embodiment of the present invention, a heat sink component may include a body, which includes a non-conductive heat-conducting material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. The heat source terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may be formed on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may include a pair of bendable leads.

[0010] According to another embodiment of the present invention, a heat sink component may include a body including a non-conductive heat-conducting material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. A heat source terminal may be formed on the top surface or the bottom surface. A heat sink terminal may be formed on the entire surface of the other of the top surface or the bottom surface. The heat source terminal may include a pair of leads.

[0011] According to another embodiment of the present invention, a heat sink component may include a body including a non-conductive heat-conducting material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The heat source terminal may be formed on the top surface or the bottom surface. The heat sink terminal may be formed on the entire surface of the other of the top surface or the bottom surface. The heat source terminal may include a pair of wire bonding pads.

[0012] According to another embodiment of the present invention, a component assembly may include a device including a top surface and a plurality of terminals exposed on the top surface. The component assembly may also include a heat sink component mounted to the device, such as a heat sink component described in any of the various embodiments discussed herein. A heat source terminal may be connected to one of the plurality of terminals of the device, and a heat sink terminal may be connected to another of the plurality of terminals of the device.

[0013] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The method may also include forming a heat source terminal on at least one body surface of the plurality of body surfaces, and forming a heat sink terminal on at least one body surface of the plurality of body surfaces to define a terminal spacing distance between the heat source terminal and the heat sink terminal along the at least one body surface. The ratio of the length of the at least one body surface to the terminal spacing distance may be greater than about 10.

[0014] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The method may also include forming a heat source terminal on at least one body surface of the plurality of body surfaces, and forming a heat sink terminal on at least one body surface of the plurality of body surfaces. The at least one body surface may have an area defined by the product of the length of the at least one body surface and the width of the at least one body surface. The heat source terminal may have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal may have a heat sink terminal area defined by the product of the heat source terminal length and the heat sink terminal width. The sum of the heat source terminal area and the heat sink terminal area may be the total terminal area. The ratio of the area of ​​the at least one body surface to the total terminal area may be less than 1.2.

[0015] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. The method may also include forming a heat source terminal on at least one body surface of the plurality of body surfaces, and forming a heat sink terminal on at least one body surface of the plurality of body surfaces to define a terminal spacing distance between the heat source terminal and the heat sink terminal along the at least one body surface. The terminal spacing distance may be offset from a transverse centerline axis extending in the transverse direction or a longitudinal centerline axis extending in the longitudinal direction.

[0016] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the transverse direction. The method may also include forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The method may also include forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may include a flange extending beyond the body.

[0017] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body, the body including a non-conductive heat-conducting material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The method may also include forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The method may also include forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat source terminal may include a pair of bendable leads.

[0018] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The method may also include forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The method may also include forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface. The heat sink terminal may include a pair of bendable leads.

[0019] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The method may also include forming a heat source terminal on the top surface or the bottom surface, and forming a heat sink terminal on the entire surface of the other of the top surface or the bottom surface. The heat source terminal may include a pair of leads.

[0020] According to another embodiment of the present invention, a method for manufacturing a heat sink component may include providing a body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface in the thickness direction, a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. The method may also include forming a heat source terminal on the top surface or the bottom surface, and forming a heat sink terminal on the entire surface of the other of the top surface or the bottom surface. The heat source terminal may include a pair of wire bonding pads. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In the remainder of the specification, a full and enabling disclosure of the present invention (including the best mode thereof) is more particularly described to one of ordinary skill in the art with reference to the accompanying drawings, in which:

[0022] Figure 1A is a perspective view of an example heat sink component having a terminal spacing distance between a first terminal and a second terminal according to aspects of the present disclosure;

[0023] Figure 1B yes Figure 1A a perspective view of a bottom surface of a heat sink component in FIG.

[0024] Figure 2 is a perspective view of a bottom surface of an example heat sink component according to aspects of the present disclosure, the example heat sink component having a first terminal and a second terminal spaced from an edge of a body of the heat sink component and a terminal spacing distance between the first terminal and the second terminal;

[0025] Figure 3 is a perspective view of an example heat sink component having fully enclosed first and second terminals according to aspects of the present disclosure;

[0026] Figure 4is a perspective view of an example heat sink component having partially enclosed first and second terminals according to aspects of the present disclosure;

[0027] Figure 5 is a perspective view of a bottom surface of an example heat sink component having a plurality of terminals configured for land grid array (LGA) type mounting according to aspects of the present disclosure;

[0028] Fig. 6A and Figure 6B is a perspective view of an example heat sink component having an offset terminal spacing distance according to aspects of the present disclosure;

[0029] 7A to 7F is a view of an example heat sink component having one or more flanges extending beyond a body of a corresponding heat sink component according to aspects of the present disclosure;

[0030] FIG. 8A to FIG. 8C is a perspective view of an example heat sink component according to aspects of the present disclosure, the example heat sink component having at least one lead extending from a first terminal and / or a second terminal;

[0031] Fig. 9A and Fig. 9B is a perspective view of an example heat sink component according to aspects of the present disclosure, the example heat sink component having a first terminal formed on a first surface and a second terminal formed on an entire surface of a second surface opposite to the first surface;

[0032] Fig. 10A An example arrangement of component assemblies according to aspects of the present disclosure is shown;

[0033] Fig. 10B The present disclosure includes Fig. 10A The device and Figure 1A Example component assembly of a heat sink component in;

[0034] Fig.11 An example heat sink component array according to aspects of the present disclosure is shown;

[0035] Figures 12 to 19 is a flow chart of a method of manufacturing a heat sink component according to aspects of the present disclosure; and

[0036] Fig. 20 is a flow chart of a method of manufacturing a heat sink component array according to aspects of the present disclosure.

[0037] Repeat use of reference characters in the present specification and drawings is intended to represent same or analogous features or elements of the invention. DETAILED DESCRIPTION

[0038] Those skilled in the art will appreciate that the present discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the invention, which are embodied in the exemplary structures.

[0039] In general, the present invention relates to a heat sink component with excellent heat dissipation capability. For example, the heat sink component may include a terminal configured to optimize the performance of the heat sink component. The heat sink component may include a body, which includes a non-conductive thermally conductive material. The body may define a thickness direction, a longitudinal direction, and a lateral direction perpendicular to each other. The body may have a plurality of body surfaces, such as: a top surface; a bottom surface opposite to the top surface in the thickness direction; and a plurality of side surfaces extending between the top surface and the bottom surface, such as a first end surface, a second end surface opposite to the first end surface in the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface in the lateral direction. One or more heat source terminals may be formed on one or more body surfaces among the plurality of body surfaces. One or more heat sink terminals may be formed on one or more body surfaces among the plurality of body surfaces.

[0040] As used herein, a layer "formed on" an object may include a layer formed directly on the object and a layer formed on one or more intermediate layers between the layer and the object. In addition, forming "on" the bottom surface means outward from the center of the component.

[0041] The heat source terminal can be configured to be connected to one or more corresponding electrical devices or electrical components, and conduct heat from these electrical devices or electrical components to the radiator component. The radiator terminal can be configured to conduct heat from the radiator component. For example, the one or more radiator terminals can connect the radiator component to the radiator to transfer heat from the one or more corresponding electrical devices or electrical components to the radiator via the radiator component.

[0042] In some embodiments, a heat source terminal and a heat sink terminal may be formed on the bottom surface of the body of the heat sink component. The heat source terminal may have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat source terminal length may extend in the longitudinal direction defined by the body of the heat sink component, and the heat source terminal width may extend in the lateral direction defined by the body of the heat sink component. The heat sink terminal may have a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The heat sink terminal length may extend in the longitudinal direction, and the heat sink terminal width may extend in the lateral direction.

[0043] A terminal spacing distance may be defined between the heat sink terminal and the heat source terminal. For example, the heat source terminal and the heat sink terminal may be spaced apart from each other in a longitudinal direction so that the terminal spacing distance may be defined in the longitudinal direction. The terminal spacing distance may be a longitudinal gap between the heat source terminal and the heat sink terminal. In some embodiments, the heat source terminal and the heat sink terminal may be spaced apart from each other in a transverse direction so that the terminal spacing distance may be defined in the transverse direction, for example, the terminal spacing distance may be a transverse gap between the heat source terminal and the heat sink terminal.

[0044] In some embodiments, the terminal spacing distance can be minimized, for example, to maximize the size of the heat source terminal, the size of the heat sink terminal, or the size of both the heat source terminal and the heat sink terminal. For example, in some embodiments, the heat source terminal and the heat sink terminal can be formed on the bottom surface of the body of the heat sink component. The bottom surface can have a length in the longitudinal direction between the first end of the body and the second end of the body, wherein the second end is opposite to the first end in the longitudinal direction. In addition, the bottom surface can have a width in the transverse direction between the first side of the body and the second side of the body, wherein the second side is opposite to the first side in the transverse direction. The bottom surface can have an area defined by the product of the length of the bottom surface and the width of the bottom surface. A ratio can be defined between the area of ​​the bottom surface and the total terminal area, wherein the total terminal area can be the sum of the heat source terminal area and the heat sink terminal area.

[0045] In some embodiments, the ratio of the area of ​​the bottom surface to the total terminal area can be less than about 2, in some embodiments less than about 1.5, in some embodiments less than about 1.2, in some embodiments less than about 1.1, in some embodiments less than about 1.05, and in some embodiments less than about 1.02.

[0046] In some embodiments, the ratio of the length of the bottom surface to the terminal spacing distance can be greater than about 2, in some embodiments greater than about 3, in some embodiments greater than about 5, in some embodiments greater than about 7, in some embodiments greater than about 10, in some embodiments greater than about 15, in some embodiments greater than about 20, in some embodiments greater than about 25, in some embodiments greater than about 30, and in some embodiments greater than about 35.

[0047] In some embodiments, the terminal spacing distance can be less than about 250 microns, in some embodiments less than about 200 microns, in some embodiments less than about 150 microns, in some embodiments less than about 100 microns, in some embodiments less than about 75 microns, in some embodiments less than about 50 microns, in some embodiments less than about 40 microns, in some embodiments less than about 30 microns, and in some embodiments less than about 20 microns.

[0048] In some embodiments, the heat source terminal and the heat sink terminal can be formed on a main body surface among the plurality of main body surfaces so that the main body surface is symmetrical about both the longitudinal centerline axis extending in the longitudinal direction and the transverse centerline axis extending in the transverse direction. The longitudinal centerline axis can be equidistant from the first side of the main body and the second side of the main body, the second side being opposite to the first side in the transverse direction. The transverse centerline axis can be equidistant from the first end of the main body and the second end of the main body, the second end being opposite to the first end in the longitudinal direction.

[0049] In some embodiments, the transverse centerline axis can bisect the terminal spacing distance. In some embodiments, the longitudinal centerline axis can bisect the terminal spacing distance.

[0050] The terminal spacing distance may be offset, for example, so that the body surface is not symmetrical about both the transverse centerline axis and the longitudinal centerline axis. In some embodiments, the terminal spacing distance may be offset from the transverse centerline axis. For example, the terminal spacing distance may be offset so that the terminal spacing distance is closer to the first end or the second end of the body than when the transverse centerline axis bisects the terminal spacing distance. In some embodiments, the terminal spacing distance may be offset from the longitudinal centerline axis. For example, the terminal spacing distance may be offset so that the terminal spacing distance is closer to the first side or the second side of the body than when the longitudinal centerline axis bisects the terminal spacing distance.

[0051] One or more heat source terminals and one or more heat sink terminals can have various configurations. In some embodiments, the one or more heat source terminals can be formed on a single body surface among the multiple body surfaces of the body of the heat sink component. For example, the one or more heat source terminals can be formed only on the bottom surface, or the one or more heat source terminals can be formed only on the top surface. In some embodiments, the one or more heat sink terminals can be formed on a single body surface among the multiple body surfaces. For example, the one or more heat sink terminals can be formed only on the bottom surface, or the one or more heat sink terminals can be formed only on the top surface. The one or more heat source terminals can be formed on the same body surface as the one or more heat sink terminals, or the one or more heat source terminals can be formed on different body surfaces.

[0052] In some embodiments, one or more heat source terminals may be completely wrapped terminals or partially wrapped terminals, or may be arranged as planar grid array terminals. For example, the heat source terminal may wrap the end of the body so that the heat source terminal is formed on the top surface, bottom surface, one end surface, and first side surface and second side surface of the body. As another example, the heat source terminal may partially wrap the end of the body so that the heat source terminal is formed on the top surface, bottom surface, and one end surface of the body, but not on the first side surface and / or second side surface of the body. In yet another example, a plurality of heat source terminals may be arranged into a grid or other suitable pattern, such as for LGA type installation. For example, in an embodiment in which a plurality of heat source terminals are formed on the bottom surface, each heat source terminal in the plurality of heat source terminals may be separated from the first end surface, the second end surface, the first side surface, and the second side surface, and the plurality of side surfaces may not contain conductive material. The one or more heat source terminals may be arranged in a manner aligned with the heat source terminals of the following device (e.g., circuit board, electrical component, etc.): the radiator component is configured to be mounted to the device.

[0053] In some embodiments, the one or more heat sink terminals may be fully wrapped terminals or partially wrapped terminals, or may be arranged as LGA terminals. For example, the heat sink terminal may wrap the end of the body so that the heat sink terminal is formed on the top surface, bottom surface, one end surface, and first side surface and second side surface of the body. As another example, the heat sink terminal may partially wrap the end of the body so that the heat sink terminal is formed on the top surface, bottom surface, and one end surface of the body, but not on the first side surface and / or second side surface of the body. In another example, a plurality of heat sink terminals may be arranged in a grid or other suitable pattern, such as for LGA type installation. For example, in an embodiment in which a plurality of heat sink terminals are formed on the bottom surface, each heat sink terminal in the plurality of heat sink terminals may be separated from the first end surface, the second end surface, the first side surface, and the second side surface, and the plurality of side surfaces may not contain conductive material. The one or more heat sink terminals may be arranged in a manner aligned with the heat sink terminals of the following device (e.g., circuit board, electrical component, etc.): the heat sink component is configured to be mounted to the device.

[0054] In some embodiments, the heat sink terminal includes at least one flange extending outward beyond the main body. The at least one flange can increase the bonding area at the heat sink terminal, which can improve the heat conduction through the heat sink component. For example, in some embodiments, the heat sink terminal can be formed on the bottom surface of the main body near the end of the main body, and the heat sink terminal can include a flange that extends outward from the main body beyond the first side, the second side, or one of the ends of the main body. In some embodiments, the flange is a first flange, and the heat sink terminal also includes a second flange that extends outward from the main body beyond the first side, the second side, or another of the ends of the main body. In some embodiments, the heat sink terminal also includes a third flange that extends outward from the main body beyond the remaining one of the first side, the second side, or the end of the main body. For example, the first flange can extend beyond the first side, the second flange can extend beyond the second side, and the third flange can extend beyond the end of the main body.

[0055] In some embodiments, the heat source terminal includes at least one flange extending outward beyond the main body. For example, in some embodiments, the heat source terminal can be formed on the bottom surface of the main body near the end of the main body, and the heat source terminal can include a flange that extends outward from the main body beyond the first side, the second side, or one of the ends of the main body. In some embodiments, the flange is a first flange, and the heat source terminal also includes a second flange that extends outward from the main body beyond the first side, the second side, or another of the ends of the main body. In some embodiments, the heat source terminal also includes a third flange that extends outward from the main body beyond the remaining one of the first side, the second side, or the end of the main body. For example, the first flange can extend beyond the first side, the second flange can extend beyond the second side, and the third flange can extend beyond the end of the main body.

[0056] In some embodiments, the heat sink terminal can be formed on the top surface and include a flange that is configured to bend downward toward the bottom surface to contact the heat sink. For example, the flange can be formed of a metal having properties (e.g., thickness, material properties, etc.) that allow the metal flange to bend downward to the heat sink of the device to which the heat sink component is mounted. The flange can contact the heat sink of the device, and in some embodiments, the flange can be fixed to the device so that heat conducted from one or more heat source terminals through the body to the flange of the heat sink terminal can be conducted out of the heat sink component and into the heat sink of the device, thereby conducting heat away from the heat source.

[0057] The heat sink component can be configured to be mounted to a device, which can be a circuit board, a multilayer ceramic component, or other suitable electrical device. The heat sink component can have various configurations and / or features for mounting to a device. In some embodiments, the heat source terminal can include at least one lead, can include at least one pair of ribbons or leads, can be configured to be welded to the device, and / or can include a pair of wire bonding pads.

[0058] In some embodiments, the heat sink component may include at least one pair of flexible leads or bendable leads. In some embodiments, the at least one pair of flexible leads or bendable leads may extend from a heat source terminal. In some embodiments, the at least one pair of flexible leads or bendable leads may extend from a heat sink terminal. In some embodiments, the at least one pair of bendable leads may include a first pair of bendable leads extending from a heat source terminal and a second pair of bendable leads extending from a heat sink terminal. For example, the flexible leads or bendable leads are flexed, bent or otherwise deformed to facilitate mounting the heat sink component on top of an existing component on a circuit board or the like.

[0059] In some embodiments, the heat sink terminal can be formed on the entire surface of a main body surface of the main body of the heat sink component. For example, the heat sink terminal can be formed on the entire bottom surface of the main body so that the heat sink terminal has a length and width consistent with the length and width range of the bottom surface without exposing the bottom surface. The heat source terminal can be formed on the main body surface opposite to the main body surface completely covered by the heat sink terminal, and the heat source terminal can include a pair of leads or a pair of wire bonding pads for connecting to a device (e.g., a circuit board, a multilayer ceramic capacitor, or other electrical component).

[0060] The component assembly may include: a device including a top surface and a plurality of terminals exposed on the top surface; and a heat sink component as described herein. A heat source terminal of the heat sink component may be connected to one of the plurality of terminals of the device, and a heat sink terminal of the heat sink component may be connected to another of the plurality of terminals of the device. In some embodiments, the device includes a circuit board. In some embodiments, the device includes a multilayer ceramic component.

[0061] In some embodiments, the heat sink component may have multiple heat source terminals, and the heat sink component may provide a connection between the heat source terminals. For example, the connection may be or include a direct electrical connection, so that the heat sink component acts as an interposer between the various heat source terminals. As another example, the connection may be or include a thin film component (e.g., a capacitor, an inductor, a resistor, etc.).

[0062] For example, the first heat source terminal and the second heat source terminal may be formed on the bottom surface of the main body, and the first via and the second via may be formed in the main body. The first via may be connected to the first heat source terminal, and the second via may be connected to the second heat source terminal. The first via and the second via may extend to the top surface of the main body. A thin film component may be formed on the top surface of the main body, and the thin film component may be electrically connected between the first via at the top surface and the second via at the top surface, so that the thin film component is electrically connected between the two heat source terminals. However, in other embodiments, a conductive trace may be formed on the top surface of the main body, and the via at the top surface may be electrically connected, so that the heat source terminals are electrically connected together through the conductive trace.

[0063] The heat sink component may include one or more thin film components. The one or more thin film components may include one or more of a resistor, a varistor, a capacitor, an inductor, and / or a combination thereof, such as a thin film filter. The thin film component may include one or more layers of conductive material, dielectric material, resistive material, inductive material, or other material accurately formed using "thin film" technology.

[0064] As an example, the heat sink component may include a thin film resistor. The resistor may include barium titanate, zinc oxide, or any other suitable dielectric material. For example, various additives that produce or enhance the voltage-dependent resistance of the dielectric material may be included in the dielectric material. For example, in some embodiments, the additive may include an oxide of: cobalt, bismuth, manganese, or a combination thereof. In some embodiments, the additive may include an oxide of: gallium, aluminum, antimony, chromium, titanium, lead, barium, nickel, vanadium, tin, or a combination thereof. The dielectric material may be doped with one or more additives in the following range: from about 0.5 mole percent to about 3 mole percent, and in some embodiments, from about 1 mole percent to about 2 mole percent. The average grain size of the dielectric material may affect the nonlinear characteristics of the dielectric material. In some embodiments, the average grain size may be in the range of from about 1 micron to 100 microns, and in some embodiments, in the range of from about 2 microns to 80 microns.

[0065] As another example, one or more thin film components may include a thin film resistor including one or more resistive layers. For example, the resistive layer may include tantalum nitride (TaN), nickel chromium (NiCr), tantalum aluminide, chromium silicon, titanium nitride, titanium tungsten, tantalum tungsten, oxides and / or nitrides of such materials, and / or any other suitable thin film resistive material. The resistive layer may have any suitable thickness.

[0066] As another example, one or more thin film components may include a thin film capacitor including one or more dielectric layers. As an example, the one or more dielectric layers may include one or more suitable ceramic materials. Examples of suitable materials include aluminum oxide (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), aluminum oxide (Al2O3), boron nitride (BN), silicon (Si), silicon carbide (SiC), silicon dioxide (SiO2), silicon nitride (Si3N4), gallium arsenide (GaAs), gallium nitride (GaN), zirconium dioxide (ZrO2), mixtures thereof, oxides and / or nitrides of such materials, or any other suitable ceramic material. Additional example ceramic materials include barium titanate (BaTiO3), calcium titanate (CaTiO3), zinc oxide (ZnO), ceramics containing low-fire glass, or other glass-bonded materials.

[0067] The thin film component may include one or more layers having a thickness in the range of from about 0.001 micrometers (μm) to about 1000 μm, in some embodiments from about 0.01 μm to about 100 μm, in some embodiments from about 0.1 μm to about 50 μm, in some embodiments from about 0.5 μm to about 20 μm. The respective one or more layers of material forming the thin film component may be applied using dedicated techniques based on etching, photolithography, plasma enhanced chemical vapor deposition (PECVD) processes or other techniques.

[0068] The body of the heat sink component may include a generally low thermal resistivity (e.g., less than about 6.67×10 -3 Meter degrees Celsius / Watt (m·°C / W) and generally high resistivity (e.g., greater than about 10 14 Ohm·cm (Ω·cm)) of any suitable material. 6.67×10 -3 A thermal resistivity of m·°C / W is equivalent to a thermal conductivity of about 150 Watts / meter·degree Celsius (W / m·°C). In other words, suitable materials for the body of the heat sink component may have a generally high thermal conductivity, such as greater than about 150 W / m·°C.

[0069] For example, in some embodiments, the body of the heat sink component may be made of a material having a thermal conductivity between about 100 W / m·°C and about 300 W / m·°C at about 22°C. In other embodiments, the body of the heat sink component may be made of a material having a thermal conductivity between about 125 W / m·°C and about 250 W / m·°C at about 22°C. In other embodiments, the body of the heat sink component may be made of a material having a thermal conductivity between about 150 W / m·°C and about 200 W / m·°C at about 22°C.

[0070] In some embodiments, the body of the heat sink component can include aluminum nitride, beryllium oxide, aluminum oxide, boron nitride, silicon nitride, magnesium oxide, zinc oxide, silicon carbide, any suitable ceramic material, and mixtures thereof.

[0071] In some embodiments, the body of the heat sink component may include aluminum nitride. For example, in some embodiments, the body of the heat sink component may be made of any suitable composition including aluminum nitride. In some embodiments, the body of the heat sink component may be made primarily of aluminum nitride. For example, the body of the heat sink component may contain additives or impurities. In other embodiments, the body of the heat sink component includes beryllium oxide. For example, in some embodiments, the body of the heat sink component may be made of any suitable composition including beryllium oxide. In some embodiments, the body of the heat sink component may be made primarily of beryllium oxide. For example, the body of the heat sink component may contain additives or impurities.

[0072] refer to Figure 1A and Figure 1B , the heat sink component 100 can be configured to increase or maximize contact between a heat source, a heat sink, or both, for example to conduct heat from the heat source to the heat sink. Such conduction of heat away from the heat source can help manage the temperature of a component or device that includes the heat source. For example, heat transfer from the heat source to the heat sink can help prevent overheating of a component or device that includes the heat source.

[0073] The heat sink component 100 may include a body 102 including a non-conductive thermally conductive material. The body may define a longitudinal direction X, a lateral direction Y, and a thickness direction Z that are perpendicular to each other. The body 102 may have a plurality of body surfaces 104, including: a top surface 104a; a bottom surface 104b opposite to the top surface 104a along the thickness direction Z; and a plurality of side surfaces, such as a first end surface 104c, a second end surface 104d opposite to the first end surface 104c along the longitudinal direction X, a first side surface 104e, and a second side surface 104f opposite to the first side surface 104e along the lateral direction Y. Figure 1A and Figure 1BAs shown, the plurality of side surfaces 104c, 104d, 104e, 104f extend along the thickness direction Z between the top surface 104a and the bottom surface 104b.

[0074] One or more heat source terminals 106 may be formed on at least one of the plurality of body surfaces 104 of the body 102. The one or more heat source terminals 106 may be configured to connect to one or more corresponding electrical devices or electrical components and conduct heat from the electrical devices or electrical components to the heat sink component 100. Figure 1A and Figure 1B In the embodiment of the present invention, the heat sink component 100 includes a heat source terminal 106 formed on the bottom surface 104b of the body 102. In other embodiments, the single heat source terminal 106 can be formed on the top surface 104a or one of the multiple side surfaces 104c, 104d, 104e, 104f. Other embodiments of the one or more heat source terminals 106 are described in more detail herein.

[0075] One or more heat sink terminals 108 may be formed on at least one of the plurality of body surfaces 104 of the body 102. The one or more heat sink terminals 108 may be configured to connect to a heat sink (e.g., a heat sink of a circuit board to which the heat sink component 100 is mounted). Figure 1A and Figure 1B As shown, the depicted embodiment of the heat sink component 100 includes a heat sink terminal 108 formed on the bottom surface 104b of the body 102. In other embodiments, the single heat sink terminal 108 can be formed on the top surface 104a or one of the multiple side surfaces 104c, 104d, 104e, 104f. Other embodiments of the one or more heat sink terminals 108 are described in more detail herein.

[0076] refer to Figure 1B The heat source terminal 106 may have a heat source terminal area defined by the product of the heat source terminal length 110 and the heat source terminal width 112. The heat source terminal length 110 may extend in a longitudinal direction X defined by the body 102, and the heat source terminal width 112 may extend in a transverse direction Y defined by the body 102.

[0077] The heat sink terminal 108 may have a heat sink terminal area defined by a heat sink terminal length 114 multiplied by a heat sink terminal width 116. The heat sink terminal length 114 may extend in a longitudinal direction X, and the heat sink terminal width 116 may extend in a lateral direction Y.

[0078] refer to Figure 1A, the bottom surface 104b may have an area defined by the product of a length 118 of the bottom surface 104b and a width 120 of the bottom surface 104b. The length 118 of the bottom surface 104b may extend along a longitudinal direction X between a first end 122 of the body 102 and a second end 124 of the body 102, wherein the second end 124 is opposite to the first end 122 in the longitudinal direction X. In addition, the width 120 of the bottom surface 104b may extend along a transverse direction Y between a first side 126 of the body 102 and a second side 128 of the body 102, wherein the second side 128 is opposite to the first side 126 in the transverse direction Y. Figure 1A As shown, the length 118 and width 120 of the bottom surface 104 b are also the length and width of the body 102 .

[0079] A ratio may be defined between the area of ​​the bottom surface 104b and the total terminal area, wherein the total terminal area is the sum of the heat source terminal area and the heat sink terminal area. In some embodiments, the ratio of the area of ​​the bottom surface 104b to the total terminal area may be less than about 2, such as less than about 1.5, less than about 1.2, less than about 1.1, less than about 1.05, or less than about 1.02.

[0080] A terminal spacing distance 130 may be defined between the heat source terminal 106 and the heat sink terminal 108. For example, the heat source terminal 106 and the heat sink terminal 108 may be spaced apart from each other in the longitudinal direction X, so that the terminal spacing distance 130 is defined in the longitudinal direction X, and the terminal spacing distance is a longitudinal gap between the heat source terminal 106 and the heat sink terminal 108.

[0081] In other embodiments, the heat source terminals 106 and the heat sink terminals 108 can be spaced apart from each other in the lateral direction Y such that a terminal spacing distance 130 is defined in the lateral direction Y, for example, the terminal spacing distance 130 can be a lateral gap between the heat source terminals 106 and the heat sink terminals 108. For example, in some embodiments, the heat sink component 100 can have an opposite geometry, wherein the heat source terminals 106 can be defined along the first side 126 of the body 102 instead of the first end 122, and the heat sink terminals 108 can be defined along the second side 128 of the body instead of the second end 124. The heat source terminals 106 and the heat sink terminals 108 can be spaced apart from each other in the lateral direction Y to define the terminal spacing distance 130.

[0082] A ratio may be defined between the length 118 of the bottom surface 104b and the terminal spacing distance 130. In some embodiments, the ratio of the length 118 of the bottom surface 104b to the terminal spacing distance 130 may be greater than about 2, e.g., greater than about 3, greater than about 5, greater than about 7, greater than about 10, greater than about 15, greater than about 20, greater than about 25, greater than about 30, or greater than about 35.

[0083] refer to Figure 1B , the heat source terminal 106 and the heat sink terminal 108 can be formed on a body surface 104 (e.g., bottom surface 104b) so that the body surface 104 is symmetrical about both a longitudinal centerline axis 132 extending in the longitudinal direction X and a transverse centerline axis 134 extending in the transverse direction Y. The longitudinal centerline axis 132 can be equidistant from the first side 126 and the second side 128 of the body 102. The transverse centerline axis 134 can be equidistant from the first end 122 and the second end 124 of the body 102. In some embodiments, for example, Figure 1A and Figure 1B In the illustrated embodiment, the transverse centerline axis 134 can bisect the terminal spacing distance 130. In other embodiments, the longitudinal centerline axis 132 can bisect the terminal spacing distance 130.

[0084] Go to Figure 2 , the heat sink component 200 may be generally similar to Figure 1A and Figure 1B The heat sink component 200 may be configured to ... Figure 2 As shown, the terminals 206 , 208 may both be formed on the bottom surface 204 b . A terminal spacing distance 230 may be defined between the heat source terminal 206 and the heat sink terminal 208 .

[0085] exist Figure 2 In the embodiment of the present invention, the heat source terminal 206 and the heat sink terminal 208 are each separated from a plurality of edges 236 defining the bottom surface 204b. For example, an edge spacing distance 238 may be defined between the heat source terminal 206 and the edge 236 of the bottom surface 204b extending in the longitudinal direction X. Figure 2 As shown, an edge separation distance 238 may be defined between the heat sink terminal 208 and an edge 236 of the bottom surface 204 b extending in the longitudinal direction X.

[0086] refer to Figure 3 , the heat sink component 300 may be similar to Figure 1A and Figure 1B The heat sink component 300 may include a heat source terminal 306, a heat sink terminal 308, a first end 322, a second end 324, a first side 326, and a second side 328. Figure 3In the embodiment of the present invention, each of the heat source terminal 306 and the heat sink terminal 308 completely wraps the corresponding end 322, 324 of the heat sink component 300. For example, the heat source terminal 306 can be formed on each surface (e.g., the top surface, bottom surface, first end surface, second end surface, first side surface, and second side surface of the body) of the body 302 (one end of the body is indicated by a dotted line) of the heat sink component 300 to completely wrap the first end 322. Similarly, the heat sink terminal 308 can be formed on each surface (e.g., the top surface, bottom surface, first end surface, second end surface, first side surface, and second side surface of the body) of the body of the heat sink component 300 to completely wrap the second end 324.

[0087] A terminal spacing distance 330 may be defined between the heat source terminals 306 and the heat sink terminals 308. A ratio may be defined between the length of the body of the heat sink component 300 and the terminal spacing distance 330. In some embodiments, the ratio of the length of the body to the terminal spacing distance 330 may be greater than about 2, greater than about 3 in some embodiments, greater than about 5 in some embodiments, greater than about 7 in some embodiments, greater than about 10 in some embodiments, greater than about 15 in some embodiments, greater than about 20 in some embodiments, greater than about 25 in some embodiments, greater than about 30 in some embodiments, and greater than about 35 in some embodiments.

[0088] Now go to Figure 4 , the heat sink component 400 may be generally similar to Figure 1A and Figure 1B The heat sink component 400 may include a body 402 having a plurality of body surfaces 404, a heat source terminal 406, a heat sink terminal 408, a first end 422, a second end 424, a first side 426, and a second side 428. Figure 4 In the embodiment of FIG. 4 , each of the heat source terminal 406 and the heat sink terminal 408 partially wraps around the corresponding end 422, 424 of the heat sink component 400. For example, as Figure 4 As shown, the heat source terminal 406 can be formed on multiple body surfaces 404 (e.g., the top surface, the bottom surface, and the first end surface) of the body 402 to partially wrap the first end 422. The heat sink terminal 408 can be formed on multiple body surfaces 404 (e.g., the top surface, the bottom surface, and the second end surface) of the body 402 to partially wrap the second end 424.

[0089] A terminal spacing distance 430 may be defined between the heat source terminals 406 and the heat sink terminals 408. A ratio may be defined between the length 418 of the body 402 of the heat sink component 400 and the terminal spacing distance 430. In some embodiments, the ratio of the length 418 of the body 402 to the terminal spacing distance 430 may be greater than about 2, greater than about 3 in some embodiments, greater than about 5 in some embodiments, greater than about 7 in some embodiments, greater than about 10 in some embodiments, greater than about 15 in some embodiments, greater than about 20 in some embodiments, greater than about 25 in some embodiments, greater than about 30 in some embodiments, and greater than about 35 in some embodiments.

[0090] Reference now Figure 5 , the heat sink component 500 may be generally similar to Figure 1A and Figure 1B The heat sink component 100 in the embodiment of the present invention can be configured. The heat sink component 500 can include a body 502, and a plurality of heat source terminals 506 can be formed on a bottom surface 504b of the body 502 of the heat sink component 500. The heat sink component 500 can be configured for planar grid array type installation, and the plurality of heat source terminals 106 can be arranged in various configurations. For example, the heat source terminals 106 can be arranged in a grid or other suitable pattern. The heat source terminals 106 can be arranged in a manner that is compatible with the following devices (e.g., circuit boards, electrical components, etc., such as Fig. 10A and Fig. 10B The heat sink component 500 is configured to be mounted to the device.

[0091] like Fig. 6A and Figure 6B As shown, the sizes of the heat source terminals and the heat sink terminals can be different from each other, so that the terminal spacing distance is offset from the centerline axis of the body. More specifically, in Fig. 6A and Figure 6B In the embodiment, the heat sink component 600 can be generally similar to Figure 1A and Figure 1B The heat sink component 600 may include a body 602, a heat source terminal 606 formed on at least one surface 604 of the body 602, and a heat sink terminal 608 formed on at least one surface 604 of the body 602. A terminal spacing distance 630 may be defined between the heat source terminal 606 and the heat sink terminal 608.

[0092] exist Fig. 6A In the embodiment depicted in , both the heat source terminal 606 and the heat sink terminal 608 are formed on the bottom surface 604b of the body 602. Figure 6BIn the embodiment, the heat source terminal 606 completely wraps the first end 622 of the body 602, so that the heat source terminal 606 is formed on each surface 604 of the body 602, and the heat sink terminal 608 completely wraps the second end 624 of the body 602, so that the heat sink terminal 608 is formed on each surface 604 of the body 602.

[0093] like Fig. 6A and Figure 6B As shown in both, the terminal spacing distance 630 can be offset toward one end or one side of the body 602. For example, referring to Fig. 6A , the terminal spacing distance 630 can be offset so that the bottom surface 604b is not symmetrical about both the longitudinal centerline axis 632 and the transverse centerline axis 634. Figure 6B , the terminal spacing distance 630 can be offset such that the heat sink component 600 is not symmetrical about both the longitudinal centerline axis 632 and the transverse centerline axis 634 .

[0094] In some embodiments, Fig. 6A and Figure 6B As shown, the terminal spacing distance 630 can be offset from the transverse centerline axis 634. For example, the terminal spacing distance 630 can be offset so that the terminal spacing distance 630 is compared to when the transverse centerline axis 634 bisects the terminal spacing distance 630 (e.g., as Figure 1B As shown in the embodiment of the present invention, the second end 624 of the body 602 is closer to the terminal spacing distance 130 and the transverse centerline axis 134.

[0095] 7A to 7F shows a general similarity Figure 1A and Figure 1B The heat sink component 700 is configured by using the heat sink component 100 in the embodiment of the present invention. The heat sink component 700 may include a body 702 and a plurality of body surfaces 704, the plurality of body surfaces including a top surface 704a, a bottom surface 704b, a first end surface 704c, a second end surface 704d, a first side surface 704e, and a second side surface 704f. A terminal spacing distance 730 may be defined between a heat source terminal 706 and a heat sink terminal 708 formed on at least one body surface 704 (e.g., the bottom surface 704b).

[0096] The heat sink terminal 708 may include at least one flange 740 extending outwardly beyond the body 702. For example, in some embodiments, the heat sink terminal 708 may be formed on the bottom surface 704b near the second end 724 of the body 702. The heat sink terminal 708 may include a flange 740 extending outwardly from the body 702 beyond one of the first side 726, the second side 728, or the second end 724 of the body 702. FIG. 7B to FIG. 7DIn some embodiments, the flange 740 is a first flange 740a extending outwardly beyond the first side 726 of the body 702, and the heat sink terminal 708 also includes a second flange 740b extending outwardly beyond the second end 724 of the body 702. In some embodiments, the heat sink terminal 708 also includes a third flange 740c extending outwardly from the body beyond the second side 728 of the body 702. Other numbers and configurations of flanges 740 may also be used, for example, flanges of different sizes, different numbers of flanges extending beyond one side or one end of the body, etc.

[0097] refer to Fig. 7E In some embodiments, the heat source terminal 706 may include at least one flange 742 extending outwardly beyond the body 702, and the at least one flange 742 may be provided in addition to or without one or more flanges 740 extending from the heat sink terminal 708. For example, the heat source terminal 706 may be formed on the bottom surface 704b of the body 702 near the first end 722 of the body 702. The heat source terminal 706 may include a flange 742 extending outwardly from the body 702 beyond one of the first side 726, the second side 728, or the first end 722, for example, as Fig. 7E As shown, extending outwardly beyond the first side 726. As described with respect to the heat sink terminal 708 and the flange 740, in other embodiments, one or more flanges 742 can extend outwardly beyond the body 702 from the heat source terminal 706, wherein the one or more flanges 742 extend outwardly beyond different sides or ends of the body 702 rather than as shown in the illustrated embodiment.

[0098] refer to Figure 7F In some embodiments, one or more flanges 740, 742 may be configured to bend or otherwise deform to be positioned to contact a mounting surface of a device or apparatus (e.g., a circuit board, etc.). Figure 7F As depicted, the heat sink terminal 708 can be formed on the top surface 704a of the body 702 of the heat sink component 700. The heat sink terminal 708 can include a flange 740 that is configured to bend downward toward the bottom surface 704b of the body 702 to, for example, contact a device (e.g., a reference device) to which the heat sink component 700 is mounted. Fig. 10A and Fig. 10BThe flange 740 may be formed of a metal having properties (e.g., thickness, material properties, etc.) that allow the flange 740 to be bent downward to the heat sink of the device 1002. The flange 740 may contact the heat sink of the device 1002, and in some embodiments, the flange may be secured to the top surface 1004 of the device 1002 using suitable fasteners 744, so that heat from the heat source terminal 706 through the body 702 to the heat sink terminal 708 of the flange 740 may be conducted from the heat sink component 700 to the heat sink of the device, thereby conducting heat away from the heat source in contact with the heat source terminal 706. The fasteners 744 may be any suitable mechanical fasteners or other types of fasteners, such as screws, adhesives, solder, etc.

[0099] In addition, if Fig. 7A and Fig. 7E As shown, one or more of the flanges 740, 742 may be integrally formed with the corresponding terminal from which the flanges 740, 742 extend. Fig. 7A and Fig. 7E As shown in the exemplary embodiment of FIG. 7 , the flange 740 may be integrally formed with the heat sink terminal 708 and as shown in FIG. Fig. 7E As shown in the exemplary embodiment of FIG. 7 , the flange 742 can be integrally formed with the heat source terminal 706. In other embodiments, one or more of the flanges 740, 742 can be joined to a corresponding terminal from which the flanges 740, 742 extend, or otherwise coupled to the corresponding terminal. For example, as FIG. 7B to FIG. 7D As shown, the flanges 740 a , 740 b , 740 c may be coupled to the heat sink terminal 708 in any suitable manner such that the respective flange 740 extends from the heat sink terminal 708 away from the body 702 of the heat sink component 700 .

[0100] As described herein, the heat sink component can be configured to be mounted to a device such as a circuit board, a multilayer ceramic component, or other suitable electrical device. The heat sink component can have various configurations and / or features for mounting to a device. In various embodiments, the heat source terminal can include at least one lead, can include at least one pair of straps or leads, can be configured for soldering to the device, and / or can include a pair of wire bonding pads.

[0101] Now go to FIG. 8A to FIG. 8C , the heat sink component 800 may be generally similar to Figure 1A and Figure 1B The heat sink component 800 may include one or more leads 846 extending from the heat source terminal 806, the heat sink terminal 808, or both. The heat source terminal 806 and the heat sink terminal 808 are each formed on the body 802 ( Figure 8C) of one or more surfaces 804 ( Figure 8C The one or more leads 846 can facilitate attachment of the heat sink component 800 to a device, such as to an existing component on a circuit board.

[0102] like Fig. 8A As shown, leads 846 extend from heat source terminals 806, for example, to attach to a device. Figure 8B , the first lead 846a extends from the heat source terminal 806, and the second lead 846b extends from the heat sink terminal 808. Figure 8C As shown, a first pair of leads 846 a extend from the heat source terminal 806 and a second pair of leads 846 b extend from the heat sink terminal 808 .

[0103] In some embodiments, the one or more leads 846 can be flexible or bendable leads. For example, at least one pair of flexible or bendable leads 846 can extend from the heat source terminal 806 and / or the heat sink terminal 808. The flexible or bendable leads 846 can be bent, curved, or otherwise deformed to facilitate mounting the heat sink component on top of an existing component on a circuit board or the like.

[0104] refer to Fig. 9A and Fig. 9B , the heat sink component 900 may be generally similar to Figure 1A and Figure 1B The heat sink component 900 may include a body 902 and a heat sink terminal 908 formed on the entire surface of a body surface 904 of the body 902. For example, the heat sink terminal 908 may be formed on the entire bottom surface 904b of the body 902, so that the heat sink terminal 908 has a length 914 and a width 916 that are consistent with the length 918 and the width 920 of the body 902 and the bottom surface 904b. Therefore, the heat sink terminal 908 covers the entire bottom surface 904b and does not expose the bottom surface 904b.

[0105] The heat source terminal 906 may be formed on the body surface 904 opposite to the body surface 904 completely covered by the heat sink terminal 908. Fig. 9A and Fig. 9B As shown, the heat sink terminal 908 is formed on the bottom surface 904b, and the heat source terminal 906 is formed on the top surface 904a, which is opposite to the bottom surface 904b in the thickness direction Z. The heat source terminal 906 may include a pair of leads 946 or a pair of wire bonding pads 948 for connecting to a device (e.g., a circuit board, a multilayer ceramic capacitor, or other electrical components as described herein).

[0106] Fig. 10A and Fig. 10BAn embodiment of a component assembly 1000 according to aspects of the present disclosure is shown. Fig. 10A Shows Figure 1A and Figure 1B The heat sink assembly 100 may be mounted to the device 1002 . Fig. 10B Shows the installation to Fig. 10A The heat sink component 100 of the component assembly 1000 is shown.

[0107] Component assembly 1000 may include a device 1002 including a top surface 1004 and a plurality of terminals exposed on top surface 1004 , such as one or more heat source terminals 1006 and one or more heat sink terminals 1008 .

[0108] The heat sink assembly 100 can be mounted to the device 1002. The heat sink assembly 100 can be generally similar to Figure 1A and Figure 1B The heat sink component 100 is configured. Fig. 10B As shown in FIG, the heat source terminal 106 of the heat sink component 100 is connected to the heat source terminal 1006 (indicated by dash-dot-dot-dash) of the device 1002, and the heat sink terminal 108 is connected to the heat sink terminal 1008 (indicated by dash-dot-dot-dash) of the device 1002.

[0109] The device 1002 may include a circuit board, a multilayer ceramic component, or other suitable electrical device. The terminals 1006 , 1008 of the device 1002 may be connected to embedded devices, electrodes, components (eg, capacitors, resistors, inductors, etc.) within the device 1002 .

[0110] refer to Fig.11 In some embodiments, a plurality of heat sink components 1100 (e.g., two or more heat sink components 1100) may be coupled to one or more heat sink flanges 1140 and / or one or more heat source flanges (not shown). Each heat sink component 1100 may be substantially similar to Figure 1A and Figure 1B The heat sink component 1100 may be configured according to the heat sink component 1100 in the embodiment. For example, each heat sink component 1100 may include a body 1102 and a plurality of body surfaces 1104, such as a top surface 1104a, a bottom surface 1104b, a first end surface 1104c, a second end surface 1104d, a first side surface 1104e, and a second side surface 1104f. A heat source terminal 1106 may be formed on at least a portion of at least one of the body surfaces 1104, and a heat sink terminal 1108 may be formed on at least a portion of at least one of the body surfaces 1104.

[0111] like Fig.11As shown, three heat sink components 1100 can be coupled together with a first heat sink flange 1140a and a second heat sink flange 1140b, and each heat sink component 1100 has a first side surface 1104e in contact with the first heat sink flange 1140a and a second side surface 1104f in contact with the second heat sink flange 1140b. When a plurality of heat sink components 1100 are coupled together using the first heat sink flange 1140a and the second heat sink flange 1140b, they can be referred to as a heat sink component array 1103.

[0112] like Fig.11 As further shown, the heat sink components 1100 are mounted in a spaced vertical orientation, wherein the plurality of heat sink components 1100 are spaced apart from one another by a component spacing distance 1101. The component spacing distance 1101 may allow gas to move between the heat sink components 1100 coupled together by the flange 1140. In other embodiments, a single heat sink component (e.g., heat sink component 100) may be spaced apart by a plurality of components. Fig.11 The vertical orientation shown is mounted to a Fig. 10A and Fig. 10B A heat sink for devices such as device 1002 described above.

[0113] It will be understood that if Fig.11 The two heat sink flanges 1140 shown disposed on opposite sides of the heat sink component array 1103 are merely examples. For example, in some embodiments, only one heat sink flange 1140 extending along one side of the heat sink component array 1103 may be provided. In other embodiments, two or more heat sink flanges 1140 may be provided on the same side of the heat sink component array 1103. In other embodiments, two or more heat sink flanges 1140 may be provided for the heat sink component array 1103, wherein at least one heat sink flange 1140 is provided on a different side of the heat sink component array 1103 than the other heat sink flanges 1140.

[0114] The heat sink flange 1140 and the heat source flange (when provided) can be configured similarly to the flanges 740, 742 described herein. For example, when the heat sink flange 1140 contacts one or more heat sink terminals 1108 of one or more heat sink components 1100, each heat source flange can contact one or more heat source terminals 1106 of the one or more heat sink components 1100. Similar to reference Fig. 7E As depicted by flange 742 , the heat source flange may be configured to conduct heat from the heat source to the heat sink component 1100 , for example to cool the heat source by conducting heat away from the heat source through the heat sink component 1100 .

[0115] Additionally, one or more heat sink flanges 1140 and / or heat source flanges may be configured to bend or otherwise deform to be positioned in contact with a device or mounting surface of a device (e.g., a circuit board, etc.). Fig.11 As shown, the heat sink terminal 1108 can be formed on the first side surface 1104e of the body 1102 of each heat sink component 1100. The first heat sink flange 1140a that contacts the heat sink terminal 1108 on the first side surface 1104e of each heat sink component 1100 can be configured to be bent outward or away from the heat sink component 1100 (for example, approximately parallel to the top surface 1104a and the bottom surface 1104b of the body 1102 of each heat sink component 1100) to, for example, contact the heat sink component 1100 to which it is mounted (for example, with reference to Fig. 10A and Fig. 10B 1002. Fig.11 As shown, the heat sink terminal 1108 can be formed on the second side surface 1104f of the body 1102 of each heat sink component 1100. The second heat sink flange 1140b that contacts the heat sink terminal 1108 on the second side surface 1104f of each heat sink component 1100 can be configured to be bent outward or away from the heat sink component 1100 (e.g., approximately parallel to the top surface 1104a and the bottom surface 1104b of the body 1102 of each heat sink component 1100) to, for example, contact the heat sink component 1100 to which it is mounted (e.g., reference Fig. 10A and Fig. 10B A heat sink of the device 1002 as described).

[0116] The heat sink flange 1140 can be formed of a metal having properties (e.g., thickness, material properties, etc.) that allow the heat sink flange 1140 to bend outwardly to the heat sink of the device 1002. The heat sink flange 1140 can contact the heat sink of the device 1002, and in some embodiments, the heat sink flange can be secured to the top surface 1004 of the device 1002 using a suitable fastener (not shown) so that heat conducted from the heat source terminals 1106 through the body 1102 of each heat sink component 1100 to one or more heat sink flanges 1140 in contact with one or more heat sink terminals 1108 can be conducted out of the heat sink component 1100 and into the heat sink of the device, thereby conducting heat away from the heat source in contact with the heat source terminals 1106. The fastener can be any suitable mechanical fastener or other type of fastener, such as a screw, adhesive, solder, etc. For example, the fastener can be a screw or the like that extends through a hole 1146 in the corresponding heat sink flange 1140.

[0117] Fig.12is a flow chart of a method 1200 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11 The method 1200 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1200 can be implemented with any suitable heat sink component. Fig.12 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0118] The method may include: at 1202, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction.

[0119] The method may include, at 1204 , forming a heat source terminal on at least one body surface of the plurality of body surfaces.

[0120] The method may include, at 1206 , forming a heat sink terminal on at least one body surface of the plurality of body surfaces to define a terminal spacing distance between the heat source terminal and the heat sink terminal along the at least one body surface.

[0121] A ratio of the length of the at least one body surface to the terminal separation distance may be greater than about ten.

[0122] Fig.13 is a flow chart of a method 1300 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11 The method 1300 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1300 can be implemented with any suitable heat sink component. Fig.13The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0123] The method may include: at 1302, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction.

[0124] The method may include, at 1304 , forming a heat source terminal on at least one body surface of the plurality of body surfaces.

[0125] The method may include, at 1306 , forming a heat sink terminal on the at least one body surface of the plurality of body surfaces.

[0126] The at least one main body surface may have an area defined by the product of the length of the at least one main body surface and the width of the at least one main body surface. The heat source terminal may have a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The radiator terminal may have a radiator terminal area defined by the product of the radiator terminal length and the radiator terminal width. The sum of the heat source terminal area and the radiator terminal area may be a total terminal area. The ratio of the area of ​​the at least one main body surface to the total terminal area may be less than 1.2.

[0127] Fig.14 is a flow chart of a method 1400 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11 The method 1400 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1400 can be implemented with any suitable heat sink component. Fig.14 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0128] The method may include: at 1402, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a plurality of body surfaces, the plurality of body surfaces including a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction.

[0129] The method may include, at 1404 , forming a heat source terminal on at least one body surface of the plurality of body surfaces.

[0130] The method may include, at 1406 , forming a heat sink terminal on the at least one body surface of the plurality of body surfaces to define a terminal spacing distance between the heat source terminal and the heat sink terminal along the at least one body surface.

[0131] The terminal spacing distance may be offset from a transverse centerline axis extending in a transverse direction or a longitudinal centerline axis extending in a longitudinal direction.

[0132] Fig.15 is a flow chart of a method 1500 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11 The method 1500 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1500 can be implemented with any suitable heat sink component. Fig.15 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0133] The method may include: at 1502, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the transverse direction.

[0134] The method may include, at 1504 , forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0135] The method may include, at 1506 , forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0136] The heat sink terminal may include a flange extending beyond the body.

[0137] Fig.16 is a flow chart of a method 1600 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11 The method 1600 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1600 can be implemented with any suitable heat sink component. Fig.16 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0138] The method may include: at 1602, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction.

[0139] The method may include, at 1604 , forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0140] The method may include, at 1606 , forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0141] The heat source terminal may include a pair of bendable leads.

[0142] Fig.17 is a flow chart of a method 1700 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11The method 1700 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1700 can be implemented with any suitable heat sink component. Fig.17 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0143] The method may include: at 1702, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the transverse direction.

[0144] The method may include, at 1704 , forming a heat source terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0145] The method may include, at 1706 , forming a heat sink terminal on at least one of the top surface, the bottom surface, the first end surface, the second end surface, the first side surface, or the second side surface.

[0146] The heat sink terminal may include a pair of flexible leads.

[0147] Fig.18 is a flow chart of a method 1800 of manufacturing a heat sink component according to aspects of the present disclosure. Figures 1A to 11 The method 1800 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1800 can be implemented with any suitable heat sink component. Fig.18 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0148] The method may include: at 1802, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the transverse direction.

[0149] The method may include, at 1804 , forming a heat source terminal on the top surface or the bottom surface.

[0150] The method may include, at 1806 , forming a heat sink terminal on an entire surface of the other of the top surface or the bottom surface.

[0151] The heat source terminal may include a pair of leads.

[0152] Fig.19 is a flow chart of a method 1900 of manufacturing a heat sink component according to various aspects of the present disclosure. Figures 1A to 11 The method 1900 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 1900 can be implemented with any suitable heat sink component. Fig.19 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0153] The method may include: at 1902, providing a body, the body including a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the transverse direction.

[0154] The method may include, at 1904 , forming a heat source terminal on the top surface or the bottom surface.

[0155] The method may include, at 1906 , forming a heat sink terminal on an entire surface of the other of the top surface or the bottom surface.

[0156] The heat source terminal may include a pair of wire bonding pads.

[0157] Fig. 20is a flow chart of a method 2000 of manufacturing a heat sink component array according to aspects of the present disclosure. Figures 1A to 11 The method 2000 is described with reference to the heat sink components 100, 200, 300, 400, 500, 600, 700, 800, 900, 1100 in the embodiment of the present invention. However, it should be understood that the disclosed method 2000 can be implemented with any suitable heat sink component. Fig. 20 The steps performed in a particular order are depicted for the purpose of illustration and discussion, but the methods discussed herein are not limited to any particular order or arrangement. It will be understood by those skilled in the art when using the disclosure provided herein that the individual steps of the methods disclosed herein may be omitted, rearranged, combined and / or adjusted in various ways without departing from the scope of the present disclosure.

[0158] The method may include: at 2002, providing a plurality of heat sink components, each heat sink component having a body, the body comprising a non-conductive thermally conductive material. The body may define a longitudinal direction, a transverse direction, and a thickness direction perpendicular to each other. The body may have a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the transverse direction.

[0159] The method may include, at 2004, forming a heat source terminal on at least one of a top surface, a bottom surface, a first end surface, a second end surface, a first side surface, or a second side surface of a body of each of the plurality of heat sink components.

[0160] The method may include, at 2006, forming a heat sink terminal on at least one of a top surface, a bottom surface, a first end surface, a second end surface, a first side surface, or a second side surface of a body of each of the plurality of heat sink components.

[0161] The method may include, at 2008, forming a heat sink flange in contact with a heat sink terminal of each of the plurality of heat sink components.

[0162] Optionally, as shown at 2010 , method 2000 can include forming a second heat sink flange in contact with a heat source terminal or a heat sink terminal of each of the plurality of heat sink components.

[0163] The heat sink flange may couple the plurality of heat sink components together, and the plurality of heat sink components may be spaced apart from each other by a component spacing distance.

[0164] application

[0165] The various embodiments of the heat sink components disclosed herein may have various applications.

[0166] Example applications include power processing systems and monolithic microwave integrated circuits (MMICs). The heat sink component can facilitate heat flow from a terminal of the device connected to a heat source terminal of the heat sink device. As an example, suitable electrical components of various embodiments can be connected to the terminals of the heat sink component. For example, the device may include a circuit board (e.g., with embedded components), a power amplifier, a filter, a synthesizer, a computer component, a power supply, and / or a diode. Specific examples of power amplifier types include gallium nitride (GaN) power amplifiers, and high radio frequency (radio frequency) amplifiers, etc. As described herein, examples of diodes that may be suitable for connection to a thermal component may include diodes that are particularly suitable for use in lasers among other types of diodes.

[0167] Those of ordinary skill in the art can practice these and other modifications and variations of the present invention without departing from the scope of the present invention. In addition, it should be understood that the various aspects of the various embodiments can be interchanged in whole or in part. In addition, those of ordinary skill in the art will appreciate that the foregoing description is only by way of example and is not intended to limit the present invention further described in the appended claims.

Claims

1. A radiator component, comprising: a body, the body comprising a non-conductive thermally conductive material, the body defining a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other, the body having a plurality of body surfaces, the plurality of body surfaces comprising a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction; a heat source terminal formed on at least one main body surface among the plurality of main body surfaces; as well as a heat sink terminal formed on at least one of the plurality of main body surfaces, wherein a terminal spacing distance is defined between the heat source terminal and the heat sink terminal along the at least one main body surface, and Wherein a ratio of a length of the at least one body surface to the terminal spacing distance is greater than about 10.

2. The heat sink component according to claim 1, wherein: the at least one body surface having an area defined by the product of the length of the at least one body surface and the width of the at least one body surface, The heat source terminal has a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal has a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The sum of the heat source terminal area and the heat sink terminal area is the total terminal area, and Wherein, a ratio of the area of ​​the at least one main body surface to the total terminal area is less than 1.

2.

3. The heat sink component according to claim 1, wherein: The at least one body surface is the bottom surface.

4. The heat sink component according to claim 1, wherein: The at least one body surface is the top surface.

5. The heat sink component according to claim 1, wherein: The body has a first end spaced from a second end along the longitudinal direction, wherein the heat source terminal wraps the first end so that the heat source terminal is formed on at least the top surface, the bottom surface and the first end surface, and The heat sink terminal wraps around the second end so that the heat sink terminal is formed on at least the top surface, the bottom surface and the second end surface.

6. The heat sink component according to claim 1, wherein: The at least one main body surface is the bottom surface, wherein the heat source terminal is spaced apart from each of the first end surface, the second end surface, the first side surface, and the second side surface, and the heat sink component further comprises: One or more additional heat source terminals are formed on the bottom surface, and each of the one or more additional heat source terminals is separated from the first end surface, the second end surface, the first side surface and the second side surface.

7. The heat sink component according to claim 1, wherein: The terminal spacing distance is defined in the longitudinal direction.

8. The heat sink assembly according to claim 1, wherein: The terminal spacing distance is defined in the lateral direction.

9. The heat sink assembly according to claim 1, wherein: The heat source terminal and the heat sink terminal are formed on the at least one body surface such that the at least one body surface is symmetrical about both a longitudinal centerline axis extending in the longitudinal direction and a transverse centerline axis extending in the transverse direction.

10. The heat sink component according to claim 9, wherein: The transverse centerline axis bisects the terminal spacing distance.

11. The heat sink component according to claim 9, wherein: The longitudinal centerline axis bisects the terminal spacing distance.

12. The heat sink assembly according to claim 1, wherein: The terminal spacing distance is offset from a transverse centerline axis extending in the transverse direction.

13. The heat sink assembly according to claim 1, wherein: The terminal spacing distance is offset from a longitudinal centerline axis extending in the longitudinal direction.

14. The heat sink assembly according to claim 1, wherein: The at least one body surface is the bottom surface, wherein the heat sink terminal is disposed proximate to the second end surface, and wherein the heat sink terminal comprises a first flange extending beyond one of the first side surface, the second side surface, or the second end surface.

15. The heat sink component according to claim 14, wherein The heat sink terminal includes a second flange extending beyond another of the first side surface, the second side surface, or the second end surface.

16. The heat sink component according to claim 15, wherein The heat sink terminal includes a third flange extending beyond a remaining one of the first side surface, the second side surface, or the second end surface.

17. The heat sink assembly according to claim 1, wherein: The heat source terminal includes at least one flange.

18. The heat sink assembly according to claim 1, wherein: The heat source terminal includes at least a pair of leads.

19. The heat sink component of claim 1, further comprising at least one pair of bendable leads extending from the heat source terminals.

20. The heat sink component of claim 1, further comprising at least one pair of bendable leads extending from the heat sink terminals.

21. The heat sink component of claim 1, further comprising a first pair of bendable leads extending from the heat source terminals and a second pair of bendable leads extending from the heat sink terminals.

22. The heat sink assembly of claim 1, wherein: The heat sink component includes a material having a thermal conductivity of from about 150 W / m·°C to about 300 W / m·°C at about 22°C.

23. A radiator component, comprising: a body, the body comprising a non-conductive thermally conductive material, the body defining a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other, the body having a plurality of body surfaces, the plurality of body surfaces comprising a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction; a heat source terminal formed on at least one main body surface among the plurality of main body surfaces; as well as a heat sink terminal formed on at least one of the plurality of main body surfaces, wherein the at least one main body surface has an area defined by the product of the length of the at least one main body surface and the width of the at least one main body surface, The heat source terminal has a heat source terminal area defined by the product of the heat source terminal length and the heat source terminal width. The heat sink terminal has a heat sink terminal area defined by the product of the heat sink terminal length and the heat sink terminal width. The sum of the heat source terminal area and the heat sink terminal area is the total terminal area, and Wherein, a ratio of the area of ​​the at least one main body surface to the total terminal area is less than 1.

2.

24. A component assembly comprising: a device comprising a top surface and a plurality of terminals exposed on the top surface; as well as A radiator component, the radiator component comprising: a body, the body comprising a non-conductive thermally conductive material, the body defining a longitudinal direction, a lateral direction, and a thickness direction perpendicular to each other, the body having a plurality of body surfaces, the plurality of body surfaces comprising a top surface, a bottom surface opposite to the top surface along the thickness direction, a first end surface, a second end surface opposite to the first end surface along the longitudinal direction, a first side surface, and a second side surface opposite to the first side surface along the lateral direction; a heat source terminal formed on at least one main body surface among the plurality of main body surfaces; and a heat sink terminal formed on at least one of the plurality of main body surfaces, wherein a terminal spacing distance is defined between the heat source terminal and the heat sink terminal along the at least one main body surface, wherein a ratio of a length of the at least one body surface to the terminal spacing distance is greater than about 10, and The heat source terminal is connected to one of the plurality of terminals of the device, and the heat sink terminal is connected to another of the plurality of terminals of the device.

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