Full-automatic screening and detecting machine for chips

Abstract

The invention discloses a full-automatic screening and detecting machine table for chips, which achieves full-automatic feeding, comprehensively detects the chips and ensures that the quality of the screened chips is stable and reliable. The invention relates to a wafer sorting machine, which comprises a rack, the rack comprises a working table and a top support, the working table of the rack is provided with a wafer caching and grading module and a chip detection assembly, and the top support is provided with a first wafer carrying module and a second wafer carrying module; the automatic feeding and multi-material-box caching transmission frame comprises a material box placing frame and a material box transferring mechanism which are arranged in a stacked mode, a top-layer LP platform of the material box placing frame is used for being in butt joint with a crown block and placing the material boxes or enabling the crown block to take away the material boxes, at least one layer of the material box placing frame is a wafer taking and placing station, and at least one layer of the material box transferring mechanism is a wafer taking and placing station. At least one layer of the material box placing frame is a material box buffering area, and the material box transferring mechanism is used for transferring material boxes at all positions.

Description

Technical Field

[0001] The present invention relates to the technical field of chip screening, and in particular to a fully automatic chip screening and testing machine. Background Art

[0002] At present, the chip screening machine is in semi-automatic mode, which requires manual loading and unloading of wafers and cassettes, which wastes manpower, has low equipment utilization rate, and does not have comprehensive chip detection function. There will be situations where defective products are used as good products, which affects the quality of related products. Therefore, it is urgent to develop fully automatic screening and detection machines to ensure the quality of chips after chip screening. Summary of the invention

[0003] In view of the above problems, the present invention provides a fully automatic chip screening and testing machine, which can automatically feed materials and perform comprehensive testing on chips to ensure that the quality of the screened chips is stable and reliable.

[0004] A fully automatic chip screening and testing machine, characterized in that it comprises:

[0005] A rack, comprising a work surface and a top bracket, wherein a wafer buffer and grading module and a chip detection component are arranged on the work surface of the rack, and a first wafer handling module and a second wafer handling module are arranged on the top bracket;

[0006] And an automatic loading and multi-box buffering and transporting rack for wafer boxes, which includes a stacked box placement rack and a box transfer mechanism, wherein the top LP platform of the box placement rack is used to dock with a crane and place boxes or allow the crane to take away boxes, at least one layer of the box placement rack is a wafer pick-and-place station, at least one layer of the box placement rack is a box buffer, and the box transfer mechanism is used to transfer boxes at various positions;

[0007] The automatic loading and multi-box buffer transfer frame of the wafer material box is arranged at the periphery of one end of the automatic loading and multi-box buffer transfer frame in the length direction of the wafer material box, the wafer buffer and grading module is arranged at a position of the work surface close to the automatic loading and multi-box buffer transfer frame of the wafer material box, and the chip detection component is arranged at a position of the work surface far away from the automatic loading and multi-box buffer transfer frame of the wafer material box;

[0008] The wafer buffer and binning module is provided with multiple groups of material boxes, and the multiple groups of material boxes of the wafer buffer and binning module are divided into a wafer to-be-inspected buffer area, an NG buffer area, an empty film wafer area, and a full wafer placement area;

[0009] The chip detection component includes a wafer inspection rack, a wafer chip placement rack, a rotary inspection machine, and a chip placement module. The wafer chip placement rack is provided with a good product placement rack and an NG product placement rack. The rotary inspection machine is provided with a feed wafer visual positioning and inspection mechanism, and an outgoing wafer and visual inspection mechanism. The chip placement module places the chip removed from the wafer inspection rack on the rotary inspection machine for multi-station inspection. The qualified chips are mounted on the good wafers of the good product placement rack through the chip placement module, and the NG chips are mounted on the NG wafers of the NG product placement rack through the chip placement module.

[0010] The first wafer transport module transfers the wafers in the material box at the wafer pick-and-place station to the material box in the wafer buffer area to be inspected, and at the same time transfers the wafers in the material boxes in the NG buffer area and the full wafer placement area to the receiving material box at the wafer pick-and-place station;

[0011] The second wafer transport module transfers the wafers in the material box in the wafer to be inspected buffer area to the wafer inspection placement rack, transfers the wafers with chips removed from the wafer inspection placement rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area.

[0012] It is further characterized by:

[0013] The material box placement rack includes multi-layer material rack areas on both sides and a material box conveying mechanism in the middle. The material box conveying mechanism includes a lifting mechanism, a translation mechanism on both sides, and a material box clamping cylinder. The material box conveying mechanism reasonably distributes the material boxes to corresponding positions to ensure the operations of placing material boxes, receiving material boxes, and delivering and receiving wafers corresponding to the overhead crane;

[0014] The first wafer handling module includes a first XYZ three-axis driving module and a horizontal and vertical flipping clamping mechanism. The horizontal and vertical flipping clamping mechanism includes a flipping motor with 90° horizontal and vertical flipping and a clamping cylinder assembly. When the flipping motor drives the clamping cylinder assembly to be set horizontally, it is used to place or remove the wafer from the wafer pick-and-place station. When the flipping motor drives the clamping cylinder assembly to be set vertically, it is used to place or remove the wafer from the corresponding material box of the wafer buffer and the grading module, which ensures the smooth and reliable operation of the entire structure.

[0015] A buffer support suction cup is provided at the bottom of the output end of the first wafer handling module, and the buffer support suction cup ensures that the vertical position of the wafer is stable and reliable when the clamping cylinder assembly is in a vertical state;

[0016] The rotating inspection machine is provided with a feeding wafer visual positioning and inspection mechanism, a discharging wafer and visual inspection mechanism, a chip correction visual station, and at least two groups of chip visual inspection stations. The rotating inspection machine is used for chip six-side inspection and IR inspection. The chip visual inspection station is provided with an AOI / IR integrated camera, which integrates visible light inspection and infrared penetration inspection, can identify the appearance defects and internal hidden defects of the chip, and through the four-sided prism design, can realize the inspection of 5 sides of the chip through 1 camera, so two groups of chip visual inspection stations can realize the inspection of all sides of the chip, saving 4 cameras, and greatly shortening the space and cost occupied by the inspection module;

[0017] The chip detection component also includes a nozzle detection visual station corresponding to the chip pick-and-place module and a nozzle wiping mechanism, which cleans and detects the nozzle without affecting production efficiency, effectively preventing the nozzle from contaminating and damaging the chip;

[0018] A wafer correction platform is also provided at the upper front end of the material box placement rack. The first wafer transport module takes the material sheet out of the material box at the wafer pick-up and placement station and places the wafer on the wafer correction platform for correction. Thereafter, the clamping claw of the clamping cylinder assembly takes away the corrected wafer to ensure that the position of the wafer is stable and reliable.

[0019] After adopting the structure of the present invention, the overhead crane delivers the material to the top LP platform of the material box placement rack, and the material box transfer mechanism transports it to the wafer pick-up and placement station. The redundant material boxes can be temporarily stored in the material box buffer. After the wafer pick-up and placement station is vacant, the material boxes in the material box buffer are transported to the wafer pick-up and placement station; the first wafer transport module takes the incoming material sheet from the material box at the wafer pick-up and placement station and puts it into the material box in the wafer buffer area to be inspected, and then the second wafer transport module takes and places the incoming wafer between the wafer buffer area to be inspected and the wafer inspection placement rack; the chips are placed one by one on the rotating inspection machine for screening through the chip pick-up and placement module, and the qualified chips are mounted on the good wafers of the good placement rack, and the NG chips are mounted on the N For the NG wafers on the G product placement rack, the second wafer handling module transfers the wafers with chips removed on the wafer inspection placement rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area; the first handling module then transfers the full wafers in the full wafer placement area and the NG buffer area to the wafer pick-and-place station, and the material box transfer mechanism transports the corresponding qualified material boxes and NG material boxes to the top-level LP platform, which are pulled away by the overhead crane; it automatically feeds materials and inspects the chip ring surface to ensure the stable and reliable quality of the screened chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the wafer routing process of the present invention;

[0022] Figure 3 Schematic diagram of the arrangement of the material box placement rack of the present invention (the arrow in the figure indicates the transfer movement direction of the material box transfer mechanism);

[0023] Figure 4 It is a partial enlarged structural schematic diagram of the present invention;

[0024] Figure 5 It is a partial enlarged schematic diagram of the output end of the first transport module of the present invention;

[0025] Figure 6 It is a schematic diagram of the top view of the chip detection component of the present invention;

[0026] The names corresponding to the serial numbers in the figure are as follows:

[0027] Rack 100, automatic loading of wafer cassettes and multi-cassette buffer transfer rack 200;

[0028] Work table 10, top support 20, wafer buffer and grading module 30, wafer buffer area 301 for inspection, NG buffer area 302, empty film wafer area 303, full wafer placement area 304, chip detection component 40, first wafer handling module 50, first XYZ three-axis drive module 51, horizontal and vertical flip clamping mechanism 52, flip motor 53, clamping cylinder assembly 54, buffer support suction cup 55, second wafer handling module 60, material box placement rack 70, top LP platform 71, wafer pick-and-place station 72, material box buffer area 73 , wafer correction platform 74, material box transfer mechanism 80, lifting mechanism 81, translation mechanism 82, material box clamping cylinder 83, wafer inspection placement rack 90, wafer chip placement rack 110, good product placement rack 111, NG product placement rack 112, rotary inspection machine 120, input wafer visual positioning and inspection mechanism 121, output wafer and visual inspection mechanism 122, chip correction visual station 123, chip visual inspection station 124, nozzle inspection visual station 125, nozzle wiping mechanism 126, chip pick-and-place module 130. DETAILED DESCRIPTION

[0029] A fully automatic chip screening and testing machine, see Figure 1-Figure 6 , which includes:

[0030] The rack 100 includes a work surface 10 and a top bracket 20. The work surface of the rack 100 is provided with a wafer buffer and grading module 30 and a chip detection component 40. The top bracket 20 is provided with a first wafer handling module 50 and a second wafer handling module 60.

[0031] And an automatic loading and multi-box buffering and transporting rack 200 for wafer boxes, which includes a stacked box placement rack 70 and a box transfer mechanism 80, wherein the top LP platform 71 of the box placement rack 70 is used to dock with a crane and place boxes or allow the crane to take away boxes, at least one layer of the box placement rack 70 is a wafer pick-and-place station 72, at least one layer of the box placement rack 70 is a box buffer 73, and the box transfer mechanism 80 is used to transfer boxes at various positions;

[0032] The automatic loading and multi-box buffering and transporting rack 200 of the wafer material box is arranged at the periphery of one end in the length direction of the rack 100, the wafer buffering and grading module 30 is arranged at the position of the work surface 10 close to the automatic loading and multi-box buffering and transporting rack 200 of the wafer material box, and the chip detection component 40 is arranged at the position of the work surface 10 far away from the automatic loading and multi-box buffering and transporting rack 200 of the wafer material box;

[0033] The wafer buffer and binning module 30 is provided with multiple groups of material boxes, and the multiple groups of material boxes of the wafer buffer and binning module are divided into a wafer to-be-inspected buffer area 301, an NG buffer area 302, an empty film wafer area 303, and a full wafer placement area 304;

[0034] The chip inspection component 40 includes a wafer inspection rack 90, a wafer chip placement rack 110, a rotary inspection machine 120, and a chip placement module 130. The wafer chip placement rack 110 is provided with a good product placement rack 111 and an NG product placement rack 112. The rotary inspection machine 120 is provided with a feed wafer visual positioning and inspection mechanism 121, and a discharge wafer and visual inspection mechanism 122. The chip placement module 130 places the chip removed from the wafer inspection rack 90 on the rotary inspection machine 120 for multi-station inspection. The qualified chips are mounted on the good wafers of the good product placement rack 111 through the chip placement module 130, and the NG chips are mounted on the NG wafers of the NG product placement rack 112 through the chip placement module 130.

[0035] The first wafer transport module 50 transfers the wafers in the material box at the wafer pick-up and placement station 72 to the material box of the wafer to-be-inspected buffer area 301, and at the same time transfers the wafers in the material boxes at the NG buffer area 302 and the full wafer placement area 304 to the receiving material box at the wafer pick-up and placement station 72;

[0036] The second wafer transport module 60 transfers the wafers in the material box of the wafer to be inspected buffer area 301 to the wafer inspection placement rack 90, transfers the wafers with chips removed from the wafer inspection placement rack 90 to the empty film wafer area 303, transfers the wafers in the empty film wafer area 303 to the wafer chip placement rack 110, transfers the good wafers with full chips on the wafer chip placement rack 110 to the full wafer placement area 304, and transfers the NG wafers with full NG chips on the wafer chip placement rack 110 to the material box of the NG buffer area 302.

[0037] In a specific embodiment, the material box placement rack 70 includes multi-layer material rack areas on both sides and a material box conveying mechanism 80 in the middle. The material box conveying mechanism 80 includes a lifting mechanism 81, a translation mechanism 82 on both sides, and a material box clamping cylinder 83. The material box conveying mechanism 80 reasonably distributes the material boxes to corresponding positions to ensure the operations of placing material boxes, receiving material boxes, and delivering and receiving wafers corresponding to the overhead crane;

[0038] The first wafer handling module 50 includes a first XYZ three-axis driving module 51, a horizontal and vertical flipping clamping mechanism 52, and the horizontal and vertical flipping clamping mechanism 52 includes a flipping motor 53 with 90° horizontal and vertical flipping, and a clamping cylinder assembly 54. When the flipping motor 53 drives the clamping cylinder assembly 54 to be set horizontally, it is used to place or remove the wafer from the wafer placement station 72. When the flipping motor 53 drives the clamping cylinder assembly 54 to be set vertically, it is used to place or remove the wafer from the corresponding material box of the wafer buffer and grading module 30, which ensures that the entire structure operates smoothly and reliably.

[0039] A buffer support suction cup 55 is provided at the bottom of the output end of the first wafer handling module 50. The buffer support suction cup 55 ensures that the vertical position of the wafer is stable and reliable when the clamping cylinder assembly 54 is in a vertical state.

[0040] The rotating inspection machine 120 is provided with a feeding wafer visual positioning and inspection mechanism 121, a discharging wafer and visual inspection mechanism 122, a chip correction visual station 123, and at least two groups of chip visual inspection stations 124. The rotating inspection machine 120 is used for six-side inspection and IR inspection of the chip. The chip visual inspection station 124 is provided with an AOI / IR integrated camera, which integrates visible light inspection and infrared penetration inspection, and can identify the appearance defects and internal hidden defects of the chip. Through the four-sided prism design, the detection of five sides of the chip can be realized through one camera. Therefore, two groups of chip visual inspection stations can realize the detection of all sides of the chip, saving four cameras, and greatly shortening the space and cost occupied by the inspection module;

[0041] The chip detection component 40 also includes a nozzle detection visual station 125 and a nozzle wiping mechanism 126 corresponding to the chip pick-and-place module 130, which clean and detect the nozzle without affecting the production efficiency, effectively preventing the nozzle from contaminating and damaging the chip;

[0042] A wafer correction platform 74 is also provided at the upper front end of the material box placement rack 70. The first wafer transport module 50 takes the wafer out of the material box at the wafer pick-up and placement station 72 and places it on the wafer correction platform 74 for correction. Thereafter, the clamping claw of the clamping cylinder assembly 54 takes away the corrected wafer to ensure that the position of the wafer is stable and reliable.

[0043] Its working principle is as follows: the overhead crane delivers the material to the top LP platform of the material box placement rack, and the material box transfer mechanism transports it to the wafer pick-and-place station. The excess material boxes can be temporarily stored in the material box buffer. After the wafer pick-and-place station is vacant, the material boxes in the material box buffer will be transported to the wafer pick-and-place station; the first wafer handling module takes the incoming material from the material box at the wafer pick-and-place station and puts it into the material box in the wafer inspection buffer area, and then the second wafer handling module takes and places the incoming wafers between the wafer inspection buffer area and the wafer inspection placement rack; the chips are placed one by one on the rotary inspection machine for screening through the chip pick-and-place module, and the qualified chips are mounted on the good wafers on the good placement rack, and the NG chips are mounted on the NG For NG wafers on the wafer inspection rack, the second wafer handling module transfers the wafers with chips removed on the wafer inspection rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area; the first handling module then transfers the full wafers in the full wafer placement area and the NG buffer area to the wafer pick-and-place station, and the material box transfer mechanism transports the corresponding qualified material boxes and NG material boxes to the top-level LP platform, which are pulled away by the overhead crane; it automatically feeds materials and inspects the chip ring surface to ensure the stable and reliable quality of the screened chips.

[0044] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0045] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A fully automatic chip screening and testing machine, characterized in that: It includes: A rack, comprising a work surface and a top bracket, wherein a wafer buffer and grading module and a chip detection component are arranged on the work surface of the rack, and a first wafer handling module and a second wafer handling module are arranged on the top bracket; And an automatic loading and multi-box buffering and transporting rack for wafer boxes, which includes a stacked box placement rack and a box transfer mechanism, wherein the top LP platform of the box placement rack is used to dock with a crane and place boxes or allow the crane to take away boxes, at least one layer of the box placement rack is a wafer pick-and-place station, at least one layer of the box placement rack is a box buffer, and the box transfer mechanism is used to transfer boxes at various positions; The automatic loading and multi-box buffer transfer frame of the wafer material box is arranged at the periphery of one end of the automatic loading and multi-box buffer transfer frame in the length direction of the wafer material box, the wafer buffer and grading module is arranged at a position of the work surface close to the automatic loading and multi-box buffer transfer frame of the wafer material box, and the chip detection component is arranged at a position of the work surface far away from the automatic loading and multi-box buffer transfer frame of the wafer material box; The wafer buffer and binning module is provided with multiple groups of material boxes, and the multiple groups of material boxes of the wafer buffer and binning module are divided into a wafer to-be-inspected buffer area, an NG buffer area, an empty film wafer area, and a full wafer placement area; The chip detection component includes a wafer inspection rack, a wafer chip placement rack, a rotary inspection machine, and a chip placement module. The wafer chip placement rack is provided with a good product placement rack and an NG product placement rack. The rotary inspection machine is provided with a feed wafer visual positioning and inspection mechanism, and an outgoing wafer and visual inspection mechanism. The chip placement module places the chip removed from the wafer inspection rack on the rotary inspection machine for multi-station inspection. The qualified chips are mounted on the good wafers of the good product placement rack through the chip placement module, and the NG chips are mounted on the NG wafers of the NG product placement rack through the chip placement module. The first wafer transport module transfers the wafers in the material box at the wafer pick-and-place station to the material box in the wafer buffer area to be inspected, and at the same time transfers the wafers in the material boxes in the NG buffer area and the full wafer placement area to the receiving material box at the wafer pick-and-place station; The second wafer transport module transfers the wafers in the material box in the wafer to be inspected buffer area to the wafer inspection placement rack, transfers the wafers with chips removed from the wafer inspection placement rack to the empty film wafer area, transfers the wafers in the empty film wafer area to the wafer chip placement rack, transfers the good wafers with full chips on the wafer chip placement rack to the full wafer placement area, and transfers the NG wafers with full NG chips on the wafer chip placement rack to the material box in the NG buffer area.

2. The fully automatic chip screening and testing machine according to claim 1, characterized in that: The material box placement rack includes multi-layer material rack areas on both sides and a material box conveying mechanism in the middle. The material box conveying mechanism includes a lifting mechanism, translation mechanisms on both sides, and a material box clamping cylinder. The material box conveying mechanism reasonably distributes the material boxes to corresponding positions to ensure the operations of placing material boxes, collecting material boxes, and sending and receiving wafers by the overhead crane.

3. The fully automatic chip screening and testing machine according to claim 1, characterized in that: The first wafer transport module includes a first XYZ three-axis drive module and a horizontal and vertical flipping clamping mechanism. The horizontal and vertical flipping clamping mechanism includes a flipping motor with 90° horizontal and vertical flipping and a clamping cylinder assembly. When the flipping motor drives the clamping cylinder assembly to be set horizontally, it is used to place or remove the wafer from the wafer placement station. When the flipping motor drives the clamping cylinder assembly to be set vertically, it is used to place or remove the wafer from the corresponding material box of the wafer cache and grading module.

4. The fully automatic chip screening and testing machine according to claim 3, characterized in that: A buffer support suction cup is arranged at the bottom of the output end of the first wafer transport module.

5. The fully automatic chip screening and testing machine according to claim 1, characterized in that: The rotating inspection machine is provided with a feeding wafer visual positioning and inspection mechanism, an outgoing wafer and visual inspection mechanism, a chip correction visual station, and at least two groups of chip visual inspection stations. The rotating inspection machine is used for chip six-sided inspection and IR inspection, and the chip visual inspection station is provided with an AOI / IR integrated camera.

6. The fully automatic chip screening and testing machine according to claim 5, characterized in that: The chip detection component also includes a nozzle detection visual station and a nozzle wiping mechanism corresponding to the chip pick-and-place module.

7. The fully automatic chip screening and testing machine according to claim 1, characterized in that: A wafer correction platform is also provided at the upper front end of the material box placement rack. The first wafer transport module takes the material sheet out of the material box at the wafer pick-up and placement station and places the wafer on the wafer correction platform for correction. Then the clamping claw of the clamping cylinder assembly takes away the corrected wafer.

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