Semiconductor chip packaging pin welding equipment
By designing a semiconductor chip packaging pin welding equipment with adjustment bracket, vertical adjustment bracket, lift support plate, wire feed fixing plate and wire feed tube, the problem of existing equipment lacks flexibility and adaptability when dealing with chips of different packaging sizes and pin layouts is solved, and the welding quality is improved and workers' labor intensity is reduced.
Patent Information
- Application Number
- CN202411677643.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-03-07
AI Technical Summary
The existing automated welding equipment lacks flexibility and adaptability when dealing with semiconductor chips of different package sizes and pin layouts, resulting in wire offset and affecting welding quality.
A semiconductor chip packaging pin welding equipment is designed. By adjusting the combination of the bracket, vertical adjustment frame, lifting support plate, wire feeding fixing plate and wire feeding tube, a large-scale adjustment in the horizontal and vertical directions is achieved to ensure the stability of the wire feeding process. By adjusting the coordination between the cylinder and the slider, the position of the wire feeding tube is accurately adjusted to avoid wire offset.
It improves the flexibility and adaptability of the equipment, ensures welding quality, reduces workers' labor intensity, improves work efficiency, and significantly improves welding accuracy and efficiency.
Smart Images
Figure CN119566652A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of semiconductor chip manufacturing, and in particular to a semiconductor chip packaging pin welding device. Background Art
[0002] During the semiconductor chip packaging process, the soldering of pins affects the electrical connection performance and ultimate reliability of semiconductor devices. With the rapid development of semiconductor technology, the requirements for soldering accuracy and efficiency are increasing. Traditional pin soldering methods mostly rely on manual operations, which have problems such as unstable soldering quality, low efficiency, and high labor intensity for workers.
[0003] In order to improve welding accuracy and efficiency, automated welding equipment has emerged. These devices realize automated control of the pin welding process by accurately controlling welding parameters and the motion trajectory of the welding head. However, existing automated welding equipment often lacks sufficient flexibility and adaptability when dealing with semiconductor chips with different package sizes and pin layouts. In the wire feeding process, the lack of stability during the wire feeding process can easily cause the wire to deviate, affecting the welding quality. Summary of the invention
[0004] In order to solve the above technical problems, the present invention provides a semiconductor chip packaging pin welding device which can ensure the stability of the wire feeding process, avoid wire deviation, and improve welding quality.
[0005] A semiconductor chip packaging pin welding device of the present invention comprises an adjustment bracket, a vertical adjustment bracket, a lifting support plate, a wire feeding fixing plate and a wire feeding tube, wherein the adjustment bracket is slidably provided with a vertical adjustment bracket, the vertical adjustment bracket is slidably provided with a lifting support plate, the wire feeding fixing plate is fixedly mounted on the lifting support plate, and the wire feeding tube is adjustable on the wire feeding fixing plate;
[0006] The adjusting bracket is slidably provided with a horizontal slide, the vertical adjusting bracket is installed on the horizontal slide, the vertical adjusting bracket is slidably provided with a lifting support plate, the lifting support plate is fixedly provided with a suspension plate, the suspension plate is provided with a welding head, the lifting support plate is fixedly provided with a wire feeding fixing plate, the wire feeding fixing plate is fixedly provided with an adjusting cylinder, the output end of the adjusting cylinder is fixedly provided with an adjusting block, the adjusting block is fixedly provided with a sliding block, the wire feeding fixing plate is fixedly provided with a guide slide bar, the sliding block is slidably clamped on the guide slide bar, a wire feeding adjusting rod is fixedly provided on the adjusting block, and a wire feeding tube is provided on the wire feeding adjusting rod.
[0007] A semiconductor chip packaging pin welding device of the present invention also includes a threaded rod and an adjusting motor. The threaded rod is rotatably installed in a vertical adjustment frame. A threaded ring is provided on the lifting support plate. The threaded ring on the lifting support plate is threadedly matched with the threaded rod. An adjusting motor is fixedly installed on the vertical adjustment frame. The output end of the adjusting motor is tightly connected to the input end of the threaded rod.
[0008] The present invention provides a semiconductor chip packaging pin welding device, wherein the outer cover of the regulating motor is provided with a protective cover.
[0009] The invention relates to a semiconductor chip packaging pin welding device, wherein the protective cover is provided with a plurality of heat dissipation ports.
[0010] The present invention provides a semiconductor chip packaging pin welding device, wherein an air suction pipe is fixedly inserted on the lifting support plate, an air suction hood is connected and installed at the bottom end of the air suction pipe, and an air supply pipe is connected and installed at the top end of the air suction pipe.
[0011] The semiconductor chip packaging pin welding device of the present invention, the gas delivery pipe is a telescopic hose.
[0012] The present invention provides a semiconductor chip packaging pin welding device, wherein a fixing clamp is fastened on the air intake pipe, a reinforcing rod is fixedly mounted on the fixing clamp, and the reinforcing rod is fastened to a wire feeding fixing plate.
[0013] In the semiconductor chip packaging pin welding device of the present invention, sealant is smeared on the connection interface between the air intake pipe and the air delivery pipe.
[0014] Compared with the prior art, the present invention has the following beneficial effects:
[0015] The equipment achieves a wide range of adjustment in the horizontal and vertical directions by adjusting the horizontal slide on the bracket and the lifting support plate on the vertical adjustment frame; the equipment can easily cope with semiconductor chips with different package sizes and pin layouts, improving the flexibility and adaptability of the equipment; the position of the wire feeding tube can be accurately adjusted by adjusting the cylinder and the adjusting block on the wire feeding fixing plate; the sliding clamping of the slider on the guide bar ensures the stability of the wire feeding process, effectively avoids the problem of wire deviation, and thus improves the welding quality; a welding head is provided on the suspension plate fixedly installed on the lifting support plate, which can accurately control the welding parameters and motion trajectory, and realizes the automatic control of the pin welding process; it not only improves the welding accuracy, but also significantly improves the welding efficiency; the equipment can realize the welding requirements of semiconductor chips with different package sizes and pin layouts through simple adjustment operations; this simple operation method reduces the labor intensity of workers and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present invention will be further described below in conjunction with the accompanying drawings.
[0017] Figure 1 It is a schematic diagram of the structure of the present invention;
[0018] Figure 2 This is a schematic diagram of the wire feeding tube installation structure;
[0019] Figure 3 It is a schematic diagram of the suction pipe installation structure;
[0020] Markings in the attached drawings: 1. Adjustment bracket; 2. Horizontal slide plate; 3. Vertical adjustment frame; 4. Lifting support plate; 5. Suspension plate; 6. Welding head; 7. Wire feeding fixing plate; 8. Adjustment cylinder; 9. Adjustment block; 10. Slider; 11. Guide slide bar; 12. Wire feeding adjustment rod; 13. Wire feeding tube; 14. Threaded rod; 15. Adjustment motor; 16. Protective cover; 17. Suction pipe; 18. Suction hood; 19. Air supply pipe; 20. Fixing clamp; 21. Reinforcement rod. DETAILED DESCRIPTION
[0021] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0022] like Figures 1 to 3 As shown, a semiconductor chip packaging pin welding device of the present invention comprises an adjusting bracket 1, a vertical adjusting bracket 3, a lifting support plate 4, a wire feeding fixing plate 7 and a wire feeding tube 13, wherein the adjusting bracket 1 is slidably provided with the vertical adjusting bracket 3, the vertical adjusting bracket 3 is slidably provided with the lifting support plate 4, the wire feeding fixing plate 7 is fixedly installed on the lifting support plate 4, and the wire feeding tube 13 is adjustable on the wire feeding fixing plate 7;
[0023] The adjusting bracket 1 is slidably provided with a horizontal slide plate 2, the vertical adjusting bracket 3 is installed on the horizontal slide plate 2, the vertical adjusting bracket 3 is slidably provided with a lifting support plate 4, the lifting support plate 4 is fixedly provided with a suspension plate 5, the suspension plate 5 is provided with a welding head 6, the lifting support plate 4 is fixedly provided with a wire feeding fixing plate 7, the wire feeding fixing plate 7 is fixedly provided with an adjusting cylinder 8, the output end of the adjusting cylinder 8 is fixedly provided with an adjusting block 9, the adjusting block 9 is fixedly provided with a slider 10, the wire feeding fixing plate 7 is fixedly provided with a guide slide bar 11, the slider 10 is slidably mounted on the guide slide bar 11, the adjusting block 9 is fixedly provided with a wire feeding adjusting rod 12, and the wire feeding adjusting rod 12 is provided with a wire feeding tube 13; the equipment realizes horizontal and vertical adjustment by adjusting the horizontal slide plate 2 on the bracket 1 and the lifting support plate 4 on the vertical adjusting bracket 3. Large upward adjustment range; enables the equipment to easily cope with semiconductor chips of different package sizes and pin layouts, and improves the flexibility and adaptability of the equipment; the position of the wire feeding tube 13 can be accurately adjusted by adjusting the cylinder 8 and the adjusting block 9 on the wire feeding fixing plate 7; the sliding clamping of the slider 10 on the guide slide 11 ensures the stability of the wire feeding process, effectively avoids the problem of welding wire deviation, and thus improves the welding quality; a welding head 6 is provided on the suspension plate 5 fixedly installed on the lifting support plate 4, which can accurately control the welding parameters and motion trajectory, and realizes the automatic control of the pin welding process; not only improves the welding accuracy, but also significantly improves the welding efficiency; the equipment can realize the welding requirements of semiconductor chips of different package sizes and pin layouts through simple adjustment operations; this simple operation method reduces the labor intensity of workers and improves work efficiency.
[0024] As a preferred embodiment of the above embodiment, it also includes a threaded rod 14 and an adjusting motor 15, the threaded rod 14 is rotatably installed in the vertical adjustment frame 3, the lifting support plate 4 is provided with a threaded collar, the threaded collar on the lifting support plate 4 is screwed together with the threaded rod 14, and the adjusting motor 15 is fixedly installed on the vertical adjustment frame 3, and the output end of the adjusting motor 15 is tightly connected with the input end of the threaded rod 14; the lifting support plate 4 can be accurately adjusted in the vertical direction by screwing together with the threaded collar on the threaded rod 14; when dealing with semiconductor chips with different package sizes and pin layouts, the equipment can accurately adjust the height of the welding head 6 and the wire feeding tube 13 to ensure the accuracy and stability of the welding process; the adjusting motor 15 and the screw The fastening connection of the threaded rod 14 enables the lifting and lowering of the lifting support plate 4 to be achieved electrically, thereby greatly improving the efficiency and convenience of adjustment; compared with manual adjustment, electric adjustment is not only faster, but also can reduce the labor intensity of the operator; the threaded fit between the threaded rod 14 and the threaded collar is self-locking, that is, in the absence of external force, the lifting support plate 4 can remain in the current position and will not drop on its own; the stability and reliability of the equipment are enhanced, ensuring the stable position of the welding head 6 and the wire feeding tube 13 during welding; since the design of the threaded rod 14 and the adjustment motor 15 allows the lifting support plate 4 to be adjusted in height within a larger range, the device can be suitable for semiconductor chips with different package sizes and pin layouts, and has strong adaptability.
[0025] As a preferred embodiment of the above embodiment, a protective cover 16 is provided on the outer side cover of the adjusting motor 15; the protective cover 16 can effectively shield and isolate the adjusting motor 15 to prevent it from being damaged by dust, debris or other impurities in the external environment during operation; the protective cover 16 can also prevent the operator from accidentally contacting the high-speed rotating motor parts during the operation of the equipment, thereby avoiding possible injury accidents; it helps to improve the safety performance of the overall equipment; by protecting the motor from damage, the protective cover 16 helps to extend the service life of the adjusting motor 15; the protective cover 16 can also prevent the accumulation of dust and debris in the area around the motor, keeping the equipment clean and beautiful.
[0026] As a preferred embodiment of the above embodiment, the protective cover 16 is provided with several groups of heat dissipation ports; the heat dissipation ports on the protective cover 16 can allow air circulation, and help to dissipate the heat generated by the regulating motor 15 during operation in time; it helps to prevent the motor from overheating, thereby maintaining its normal operating temperature and performance; through effective heat dissipation, it ensures that the regulating motor 15 will not malfunction or performance degradation due to excessive temperature during long-term operation; it helps to improve the overall operating stability and reliability of the equipment; through the design of the heat dissipation ports, the risk of damage to the motor due to overheating can be reduced, thereby extending its service life.
[0027] As a preferred embodiment of the above, an air suction pipe 17 is fixedly installed on the lifting support plate 4, and an air suction hood 18 is installed at the bottom end of the air suction pipe 17, and an air supply pipe 19 is installed at the top end of the air suction pipe 17; the harmful gases and smoke generated during the welding process are captured by the air suction hood 18, and discharged from the working area through the air suction pipe 17 and the air supply pipe 19, thereby significantly improving the working environment and protecting the health of the operators; the smoke and gas generated during the welding process will affect the line of sight of the welding head, resulting in a decrease in welding accuracy; by timely removing these pollutants, it can be ensured that the welding head always has a clear line of sight, thereby improving the welding quality and consistency; if the corrosive components in the welding smoke and gas stay inside the equipment for a long time, they may cause corrosion to the metal parts of the equipment and shorten the service life of the equipment; by timely removing these pollutants, the equipment can be protected from corrosion and its service life can be extended; the air suction pipe 17 and the air suction hood 18 can move with the lifting support plate 4, so as to adapt to the welding requirements of different heights and positions, so that the equipment can be more widely used in the welding of semiconductor chips with different package sizes and pin layouts.
[0028] As a preferred embodiment of the above embodiment, the air supply pipe 19 is a telescopic hose; the telescopic hose can be bent and stretched as needed to adapt to welding requirements of different heights and positions; the equipment can more accurately position the welding head and the suction hood when dealing with semiconductor chips of different package sizes and pin layouts, thereby ensuring welding quality and efficiency; compared with rigid pipes, telescopic hoses are less susceptible to physical damage and have a longer service life, reducing the frequency of replacement and maintenance and reducing maintenance costs; during the bending and stretching process of the telescopic hose, the airflow can still be transmitted smoothly, which helps to maintain a clean working environment and stable welding quality.
[0029] As a preferred embodiment of the above, a fixing clamp 20 is fastened on the suction pipe 17, and a reinforcing rod 21 is fixedly installed on the fixing clamp 20, and the reinforcing rod 21 is fastened to the wire feeding fixing plate 7; by using the fixing clamp 20 and the reinforcing rod 21 in coordination, the suction pipe 17 can be firmly fixed on the wire feeding fixing plate 7; this fixing method can effectively prevent the suction pipe 17 from loosening or deflecting due to vibration or external force during welding, thereby ensuring that the suction hood 18 can always be kept in the correct position, effectively removing harmful gases and smoke generated by welding. dust; the fixing clamp 20 and the reinforcing rod 21 increase the connection strength between the suction pipe 17 and the wire feeding fixing plate 7, so that the suction pipe 17 can withstand greater stress and pressure; it helps to extend the service life of the suction pipe 17 and reduce the cost and time loss caused by frequent replacement or maintenance; the stable connection of the suction pipe 17 can ensure that the suction hood 18 always works effectively during the welding process, and removes harmful gases and smoke in time, thereby protecting the health and safety of the operator; in addition, the firm connection can also reduce the potential safety risks caused by the loosening or falling off of the suction pipe 17.
[0030] As a preferred embodiment of the above embodiment, a sealant is applied to the connection interface between the intake pipe 17 and the gas supply pipe 19; the sealant can ensure that there is no gas leakage at the connection between the intake pipe 17 and the gas supply pipe 19; during the welding process, the suction hood 18 needs to effectively absorb the harmful gases and smoke generated by welding, and the use of sealant can ensure that these harmful gases and smoke will not leak out through the gap of the connection interface, thereby affecting the suction effect; applying sealant can not only provide physical sealing, but also increase the friction and stability of the connection interface; it helps to prevent the connection from loosening or falling off due to vibration or external force during the welding process, thereby ensuring the continuous and stable operation of the intake system.
[0031] A semiconductor chip packaging pin welding device of the present invention adjusts the positions of the adjustment bracket 1, the vertical adjustment bracket 3 and the horizontal slide plate 2 according to the size and pin layout of the semiconductor chip to be welded during operation to ensure that the welding head 6 is in the correct starting position; uses the adjustment cylinder 8 to adjust the position of the wire feeding adjustment rod 12 to ensure that the welding wire can be smoothly delivered to the welding point; places the semiconductor chip to be welded on the workbench and fixes it to ensure that the chip does not move during the welding process; turns on the adjustment motor 15, drives the lifting support plate 4 to move up and down through the threaded rod 14, and accurately positions the welding head 6 above the welding point; starts the welding program, and controls the welding head 6 to perform welding operations according to a preset path; during the welding process, the adjustment cylinder 8 adjusts the wire feeding speed according to the set parameters to ensure that the welding wire is smoothly delivered to the welding area; the suction hood 18 is started immediately after the welding starts, and the smoke generated during the welding process is collected and discharged through the suction pipe 17 and the air supply pipe 19; after completing the welding of all the pins of a chip, the welding program is stopped and the dust collection system is turned off; the chip is removed to check whether the welding quality meets the requirements.
[0032] The semiconductor chip packaging pin welding device of the present invention has a mounting method, a connecting method or a setting method which are all common mechanical methods and can be implemented as long as they can achieve their beneficial effects.
[0033] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.
Claims
1. A semiconductor chip packaging pin welding device, characterized in that: It includes an adjustment bracket, a vertical adjustment bracket, a lifting support plate, a wire feeding fixed plate and a wire feeding tube. The adjustment bracket is slidably provided with a vertical adjustment bracket, the vertical adjustment bracket is slidably provided with a lifting support plate, the wire feeding fixed plate is fixedly installed on the lifting support plate, and the wire feeding tube is adjustable on the wire feeding fixed plate; The adjusting bracket is slidably provided with a horizontal slide, the vertical adjusting bracket is installed on the horizontal slide, the vertical adjusting bracket is slidably provided with a lifting support plate, the lifting support plate is fixedly provided with a suspension plate, the suspension plate is provided with a welding head, the lifting support plate is fixedly provided with a wire feeding fixing plate, the wire feeding fixing plate is fixedly provided with an adjusting cylinder, the output end of the adjusting cylinder is fixedly provided with an adjusting block, the adjusting block is fixedly provided with a sliding block, the wire feeding fixing plate is fixedly provided with a guide slide bar, the sliding block is slidably clamped on the guide slide bar, a wire feeding adjusting rod is fixedly provided on the adjusting block, and a wire feeding tube is provided on the wire feeding adjusting rod.
2. A semiconductor chip packaging pin welding device as claimed in claim 1, characterized in that: It also includes a threaded rod and an adjusting motor. The threaded rod is rotatably installed in the vertical adjusting frame. The lifting support plate is provided with a threaded ring. The threaded ring on the lifting support plate is threadedly engaged with the threaded rod. The vertical adjusting frame is fixedly installed with an adjusting motor. The output end of the adjusting motor is tightly connected to the input end of the threaded rod.
3. A semiconductor chip packaging pin welding device as claimed in claim 2, characterized in that: The outer side cover of the regulating motor is provided with a protective cover.
4. A semiconductor chip packaging pin welding device as claimed in claim 3, characterized in that: The protective cover is provided with a plurality of heat dissipation openings.
5. A semiconductor chip packaging pin welding device as claimed in claim 1, characterized in that: An air suction pipe is fixedly installed on the lifting support plate, an air suction hood is connected and installed at the bottom end of the air suction pipe, and an air supply pipe is connected and installed at the top end of the air suction pipe.
6. A semiconductor chip packaging pin welding device as claimed in claim 5, characterized in that: The gas delivery pipe is a telescopic hose.
7. A semiconductor chip packaging pin welding device as claimed in claim 5, characterized in that: A fixing clamp is fastened on the suction pipe, a reinforcing rod is fixedly mounted on the fixing clamp, and the reinforcing rod is fastened to the wire feeding fixing plate.
8. A semiconductor chip packaging pin welding device as claimed in claim 5, characterized in that: The connection interface between the air intake pipe and the air delivery pipe is coated with sealant.