Cleaning system for heating plate and cleaning method thereof

Abstract

The invention discloses a cleaning system for a heating plate and a cleaning method thereof, and the cleaning system comprises a base on which the heating plate is fixed; the detection component is fixed on the base, and the end part of the detection component is positioned above the heating disc and is used for detecting the thickness of surface elements of the heating disc; the polishing assembly is arranged on the base, the end of the polishing assembly can move above the heating disc, and the polishing assembly is used for polishing the heating disc; and the control assembly is connected with the polishing assembly and the detection assembly and used for controlling the working time of the polishing assembly according to the element thickness detected by the detection assembly. According to the device, the working time of the grinding assembly is related to the thickness of an element, the grinding assembly is accurately controlled through the control assembly, and compared with traditional manual grinding, on one hand, the grinding thickness can be accurately controlled, and the situations that grinding is not thorough due to too short grinding time and a heating disc is abraded due to too long grinding time are avoided; and on the other hand, the cleaning efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a cleaning system and a cleaning method for a heating plate. Background Art

[0002] With the rapid development of semiconductor technology, the characteristic size of integrated circuit devices continues to shrink. In order to manufacture high-quality integrated circuit devices, the requirements for the manufacturing process and process results of integrated circuits are becoming more and more stringent, because the processing results of each process may affect the characteristics, quality and service life of the integrated circuit devices. In the semiconductor field, wafers are the basic materials for manufacturing integrated circuits, and various circuit element structures can be processed on wafers. Usually, the wafer is transferred to a high-temperature semiconductor reaction chamber and placed on a heating plate for process processing. Therefore, the parameters of the high-temperature semiconductor reaction chamber and the heating plate will affect the process results.

[0003] After the heating plate has been used for a period of time, it needs to be cleaned. The prior art uses fluoride ions to clean high-temperature semiconductor reaction chambers. When fluoride ions are used to clean the heating plate, the high-temperature fluoride ions will undergo a fluorination reaction with the heating plate. The material of the heating plate is usually ALN, Al alloy, etc. The compounds produced by the reaction will grow on the surface of the heating plate and need to be cleaned regularly, otherwise it will affect the performance of the chamber particles and the adsorption effect of the vacuum adsorption heating plate. The current method for cleaning fluoride ions is manual polishing, which determines the polishing time by visual judgment and simple sandpaper polishing and cleaning methods. This can easily cause dimensional deviations or thermal temperature uniformity that does not meet process requirements, which in turn leads to the scrapping of the heating plate, and the cost is relatively high. At the same time, the process performance of the machine may adjust the re-machine parameters due to the replacement of the heating plate, which prolongs the re-machine time and reduces the machine utilization rate. Summary of the invention

[0004] The embodiments of the present invention provide a cleaning system and a cleaning method for a heating plate, which solve the technical problems that the heating plate is easily scrapped and the utilization rate of the machine is affected by the traditional manual grinding of fluorine ion particles attached to the heating plate.

[0005] In order to solve the above problems, according to one aspect of the present application, an embodiment of the present invention provides a cleaning system for a heating plate, the cleaning system comprising:

[0006] a base on which a heating plate is fixed;

[0007] A detection component, fixed on the base and having an end thereof located above the heating plate, for detecting the thickness of elements on the surface of the heating plate;

[0008] A grinding assembly, which is arranged on the base and has an end portion capable of moving above the heating plate, and is used for grinding the heating plate;

[0009] A control component is connected to the grinding component and the detection component respectively, and is used to control the working time of the grinding component according to the thickness of the element detected by the detection component.

[0010] In some embodiments, the detection component includes an energy spectrometer and a scanning unit, and both the energy spectrometer and the scanning unit are connected to the control component; wherein the energy spectrometer is used to detect the type and content of elements on the surface of the heating disk, and the scanning unit is used to determine the position and thickness of the element by scanning when the type and content of the element on the surface of the heating disk meet preset requirements.

[0011] In some embodiments, the scanning unit is a photographic three-dimensional scanner.

[0012] In some embodiments, the grinding assembly includes a moving unit, a box, a driving member and a tool, the moving unit is connected to the box, the driving member is arranged in the box, and the tool is connected to the output end of the driving member; the moving unit drives the box to move, thereby driving the driving member and the tool to move.

[0013] In some embodiments, the moving unit includes a cylinder and a slide rail, and the cylinder and the slide rail are arranged in three groups so that the box can move in three directions: X, Y and Z.

[0014] In some embodiments, the grinding assembly further includes a tool magazine, which is fixed on one side of the base and contains tools of different models.

[0015] In some embodiments, the cleaning system further comprises a fixing component, one end of which is fixed to a side surface of the base, and the other end of which is connected to the heating plate.

[0016] In some embodiments, the fixing assembly includes a clamping ring, a fixing plate and a connecting piece, the clamping ring and the fixing plate are both fixed on one side of the base, the body of the heating plate is clamped in the clamping ring, and the handle of the heating plate is mounted on the fixing plate via the connecting piece.

[0017] According to another aspect of the present application, an embodiment of the present invention provides a cleaning method, which uses the above-mentioned cleaning system to clean the heating plate, and the cleaning method includes:

[0018] S1, the detection component detects the thickness of the surface elements of the heating plate in real time and transmits it to the control component;

[0019] S2, the control component determines the working time of the grinding component according to the received thickness; wherein the control component is preset with a corresponding relationship between the thickness of the element and the grinding time;

[0020] S3, the grinding component works according to the grinding time in S2 until the thickness of the surface element of the heating plate meets the requirement.

[0021] In some embodiments, when the detection component includes a spectrometer and a scanning unit,

[0022] The detection component in S1 detects the thickness of the elements on the surface of the heating plate in real time and transmits it to the control component, specifically: the energy spectrometer detects the type and content of the elements on the surface of the heating plate, and when the type of the surface elements contains fluoride, determines the content of the fluoride, and when the content of the fluoride meets the preset requirements, the scanning unit determines the position and thickness of the fluoride and transmits it to the control component;

[0023] The grinding component in S3 works according to the grinding time in S2, specifically: after the end of the grinding component moves to the position of the fluoride, it works according to the grinding time.

[0024] Compared with the prior art, the cleaning system for a heating plate of the present invention has at least the following beneficial effects:

[0025] The cleaning system for a heating plate provided by the present invention comprises: a base, on which a heating plate is fixed; a detection component, which is fixed on the base and whose end is located above the heating plate and is used to detect the thickness of the element on the surface of the heating plate; a polishing component, which is arranged on the base and whose end can move above the heating plate and is used to polish the heating plate; and a control component, which is respectively connected to the polishing component and the detection component and is used to control the working time of the polishing component according to the thickness of the element detected by the detection component.

[0026] When the cleaning system provided by this embodiment is used for cleaning, first, the detection component detects the thickness of the element on the surface of the heating plate and transmits it to the control component; then, the control component determines the working time of the polishing component according to the received thickness; wherein, the control component is preset with a corresponding relationship between the thickness of the element and the polishing time; finally, the polishing component works according to the polishing time determined above. In this process, the working time of the polishing component is related to the thickness of the element, and the polishing component is precisely controlled by the control component. Compared with the traditional manual polishing, this embodiment can accurately control the polishing thickness on the one hand, avoiding incomplete polishing due to too short polishing time and wear of the heating plate due to too long polishing time, and on the other hand, it also improves the cleaning efficiency.

[0027] The cleaning method provided by the present invention is designed based on the above-mentioned cleaning system for the heating plate. Its beneficial effects refer to the beneficial effects of the above-mentioned cleaning system for the heating plate, which will not be described in detail here.

[0028] In addition, in the cleaning machine provided by the present invention, the detection component detects the thickness of the surface element of the heating plate in real time, that is, while the polishing component is working according to the polishing time, the detection component is still working, and when it detects that the thickness of the surface element of the heating plate meets the requirement, the polishing component stops working. The detection component, the polishing component and the control component in the present invention form a closed-loop feedback system, which can prevent the surface of the heating plate from being uncleanly cleaned or the surface material from being polished too much.

[0029] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0031] Figure 1 is a schematic structural diagram of a cleaning system for a heating plate provided by an embodiment of the present invention;

[0032] Figure 2 is an exploded view of a cleaning system for a heating plate provided by an embodiment of the present invention;

[0033] Figure 3 is a schematic structural diagram of a heating plate in a cleaning system for a heating plate provided by an embodiment of the present invention;

[0034] Figure 4 is an exploded view of a heating plate in a cleaning system for a heating plate provided by an embodiment of the present invention;

[0035] Figure 5 is a structural schematic diagram of a grinding component in a cleaning system for a heating plate provided by an embodiment of the present invention;

[0036] Figure 6 is a system block diagram of a cleaning system for a heating plate provided by an embodiment of the present invention;

[0037] Figure 7 is a flow chart of a cleaning method provided by an embodiment of the present invention;

[0038] Reference numerals:

[0039] 1. Base; 11. Horizontal plate; 12. Vertical plate; 2. Detection component; 21. Energy spectrometer; 22. Scanning unit; 3. Grinding component; 31. Moving unit; 32. Box; 33. Driving part; 34. Tool; 35. Tool magazine; 4. Control component; 5. Heating plate; 51. Main body; 52. Handle; 6. Fixing component; 61. Clamping ring; 62. Fixing plate; 63. Connector; 64. Clamping block; 65. Matching hole. DETAILED DESCRIPTION

[0040] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0041] In the description of the present invention, it should be clarified that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, but are not necessarily used to describe a specific order or sequence; the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the referred device or element must have a specific direction or position, and therefore cannot be understood as a limitation on the present invention.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] After the heating plate has been used for a period of time, it needs to be cleaned. Fluoride ions are generally used for cleaning. During the cleaning process, high-temperature fluoride ions will react with the heating plate to produce fluoride. The heating plate material is usually ALN, Al alloy, etc. The fluoride produced by the reaction will grow on the surface of the heating plate and needs to be cleaned regularly, otherwise it will affect the performance of the chamber particles and the adsorption effect of the vacuum adsorption heating plate. The traditional cleaning method is manual grinding, which cannot accurately control the grinding thickness and is prone to incomplete grinding or excessive grinding.

[0044] In view of the above problems, this embodiment adopts automatic grinding to replace traditional manual grinding, which can accurately control the grinding thickness on the one hand, and improve the cleaning efficiency on the other hand.

[0045] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] Example 1

[0047] This embodiment provides a cleaning system for a heating plate, such as Figure 1-Figure 6 As shown, the cleaning system comprises:

[0048] A base 1, on which a heating disk 5 is fixed; a detection component 2, fixed on the base 1 and with its end located above the heating disk 5 for detecting the thickness of the surface elements of the heating disk 5; a polishing component 3, arranged on the base 1 and with its end able to move above the heating disk 5, for polishing the heating disk 5; a control component 4, respectively connected to the polishing component 3 and the detection component 2, for controlling the working time of the polishing component 3 through the thickness of the element detected by the detection component 2.

[0049] The base 1 is mainly used to fix the heating disk 5, the detection component 2 and the polishing component 3, and it can have a variety of specific structures. For example, in one embodiment, the base 1 includes a horizontal plate 11 and a vertical plate 12, and the end of the horizontal plate 11 and the end of the vertical plate 12 are connected to form an L-shaped structure, and the heating disk 5, the detection component 2 and the polishing component 3 are all arranged on the inner side of the L-shaped structure. One end of the detection component 2 is fixed on the vertical plate 12, and the other end of the detection component 2 faces the upper surface of the heating disk 5, which can detect the thickness of the surface elements of the heating disk 5, for example, the thickness of the fluoride on the surface of the heating disk 5. One end of the polishing component 3 is fixed on the vertical plate 12, and the other end of the polishing component 3 faces the upper surface of the heating disk 5, and the end of the polishing component 3 can move above the heating disk 5, and the purpose of the movement is to polish different positions. The control component 4 includes a PLC control system, i.e., a programmable logic controller. The PLC control system uses a type of programmable memory that stores programs internally, executes user-oriented instructions such as logic operations, sequential control, timing, counting and arithmetic operations, and controls various types of machinery or production processes through digital or analog input / output. In this embodiment, the control component 4 can control the working time of the grinding component 3 through the thickness of the element detected by the detection component 2.

[0050] When the cleaning system provided by this embodiment is used for cleaning, first, the detection component 2 detects the thickness of the element on the surface of the heating plate 5 and transmits it to the control component 4; then the control component 4 determines the working time of the grinding component 3 according to the received thickness; wherein the control component 4 is preset with a correspondence between the thickness of the element and the grinding time; finally, the grinding component 3 works according to the grinding time determined above. In this process, the working time of the grinding component 3 is related to the thickness of the element, and the grinding component 3 is precisely controlled by the control component 4. Compared with the traditional manual grinding, this embodiment can accurately control the grinding thickness on the one hand, avoiding incomplete grinding due to too short grinding time and wear of the heating plate 5 due to too long grinding time, and on the other hand, it also improves the cleaning efficiency.

[0051] In a specific embodiment, the detection component 2 includes an energy spectrometer 21 and a scanning unit 22, both of which are connected to the control component 4; wherein the energy spectrometer 21 is used to detect the type and content of the element on the surface of the heating plate 5, and the scanning unit 22 is used to determine the position and thickness of the element by scanning when the type and content of the element on the surface of the heating plate 5 meet the preset requirements. The scanning unit 22 is a photographic three-dimensional scanner.

[0052] Energy spectrometer 21 is also called EDS. EDS energy spectrometer analyzes the elemental composition in the material by measuring the functional relationship between X-ray intensity and X-ray energy. When a high-energy electron beam bombards the sample, the atoms in the sample are excited to emit characteristic X-rays, and the energy of these X-rays corresponds to the type of element. The EDS energy spectrometer can detect and analyze the energy of these X-rays to determine the type and content of elements in the sample. The principle of the photographic 3D scanner is similar to that of a camera taking photos. It is a product developed to meet the application needs of the industrial design industry. It combines the advantages of high-speed scanning and high precision, and can freely adjust the measurement range according to demand. It can handle everything from scanning small parts to measuring the entire body of the car, and has a very high performance-price ratio.

[0053] In this embodiment, the energy spectrometer 21 is used to detect the type and content of the elements on the surface of the heating disk 5, and the scanning unit 22 is used to determine the position and thickness of the element by scanning when the type and content of the elements on the surface of the heating disk 5 meet the preset requirements. In other words, the energy spectrometer 21 detects the type and content of the elements on the surface of the heating disk 5, and when the type of the surface elements contains fluoride, determines the content of the fluoride, and when the content of the fluoride meets the preset requirements, the scanning unit 22 determines the position and thickness of the fluoride and transmits it to the control component 4. When the type of surface elements does not contain fluoride, or the content of fluoride is relatively low, there is no need to polish, and the scanning unit 22 does not need to perform scanning at this time.

[0054] In a specific embodiment, the grinding assembly 3 includes a moving unit 31, a box 32, a driving member 33 and a cutter 34, wherein the moving unit 31 is connected to the box 32, the driving member 33 is arranged in the box 32, and the cutter 34 is connected to the output end of the driving member 33; the moving unit 31 drives the box 32 to move, thereby driving the driving member 33 and the cutter 34 to move. More specifically, the setting of the box 32 is mainly to realize the movement of the driving member 33 and the cutter 34. In this embodiment, the box 32 is located above the heating plate 5, and has a driving member 33 therein, the driving member 33 is a motor, the cutter 34 cooperates with the output end of the motor, and the cutter 34 is located outside the box 32; in this way, under the action of the moving unit 31, the box 32 can move, thereby driving the driving member 33 and the cutter 34 to move, and when the driving member 33 and the cutter 34 move to a suitable position, under the action of the driving member 33, the cutter 34 grinds and polishes the surface of the heating plate 5 at that position to remove the fluoride there. In this embodiment, the mobile unit 31 can be fixed on the base 1, and can also be installed above the entire base 1 through a bracket.

[0055] The cutter 34 in this embodiment can be a file or a pen knife, etc., and can also be a grinding wheel or a grinding head, etc. In the specific use process, the motor drives the cutter 34 to work on the surface of the heating plate 5 to grind the fluoride on the surface of the heating plate 5.

[0056] In a specific embodiment, the moving unit 31 includes a cylinder and a slide rail, and the cylinder and the slide rail are arranged in three groups so that the box 32 can move in three directions of X, Y and Z. The cylinder and the slide rail can be arranged on the base 1. For example, on the inner surface of the vertical plate 12 of the base 1, a first slide rail is arranged in the vertical direction, and a second slide rail is arranged in the horizontal direction. In addition, the vertical plate 12 has a certain thickness, and a third slide rail is arranged inside the vertical plate 12 along the thickness direction. Correspondingly, the cylinder includes a first cylinder, a second cylinder and a third cylinder. The output ends of the first cylinder, the second cylinder and the third cylinder all act on the box 32. Under the command of the control component 4, the first cylinder can make the box 32 move up and down along the first slide rail to adjust the height of the tool 34 in the Z direction. The second cylinder can make the box 32 move left and right along the second slide rail to adjust the position of the tool 34 in the X direction. The third cylinder can make the box 32 move forward and backward along the third slide rail to adjust the position of the tool 34 in the Y direction. Of course, the cylinder and the slide rail can also be installed above the entire base 1 through a bracket, and there is no connection relationship between the cylinder and the slide rail and the base 1.

[0057] In a specific embodiment, the grinding assembly 3 further includes a tool magazine 35, which is fixed to one side of the base 1 and contains tools of different types. When the thickness of the fluoride is different, the grinding and polishing efficiency can be higher by selecting different tools in the tool magazine 35.

[0058] In a specific embodiment, in order to ensure that the heating plate 5 can be stably fixed in the base 1, the cleaning system also includes a fixing component 6, one end of which is fixed to the side of the base 1, and the other end of the fixing component 6 is connected to the heating plate 5.

[0059] The fixing assembly 6 includes a clamping ring 61, a fixing plate 62 and a connecting piece 63. The clamping ring 61 and the fixing plate 62 are both fixed to one side of the base 1. The body 51 of the heating plate 5 is clamped in the clamping ring 61. The handle 52 of the heating plate 5 is installed on the fixing plate 62 through the connecting piece 63.

[0060] The general outline of the clamping ring 61 is an annular structure, and an extension plate extends outward from one side thereof, and the extension plate is fixed on the base 1. The interior of the clamping ring 61 is provided with a clamping block 64, and a plurality of clamping blocks 64 are provided and evenly distributed along the circumference. The body 51 of the heating plate 5 is clamped in the circular space surrounded by the plurality of clamping blocks 64. In order to ensure the stability of the heating plate 5, the handle 52 of the heating plate 5 is mounted on the fixing plate 62 through a connecting piece 63, wherein the connecting piece 63 is an aluminum substrate wrapped around the outside of the handle 52. One end of the fixing plate 62 is fixed on the base 1, and the other end has a matching hole 65, and the connecting piece 63 cooperates with the matching hole 65 to realize the installation of the handle 52 on the fixing plate 62. In this way, the body 51 and the handle 52 of the heating plate 5 are fixed by the clamping ring 61 and the fixing plate 62 respectively, so as to prevent the heating plate 5 from shaking during the grinding and polishing process.

[0061] The cleaning system for the heating plate provided in the present embodiment replaces manual grinding, improves cleaning efficiency, and improves the utilization efficiency of the machine; and in the cleaning process of the present embodiment, the detection component provides real-time feedback on the thickness of the fluoride until the cleaning is completed, thereby forming a closed-loop feedback system, which can prevent the surface of the heating plate from being uncleanly cleaned or the surface material from being over-grinded, thereby improving the machine's particle size performance, or extending the service life and replacement cost of the heating plate; in addition, the cleaning system provided in the present embodiment can also accurately control the grinding size of the surface of the heating plate, thereby improving the uniformity of the heat transfer temperature of the heating plate after cleaning.

[0062] Example 2

[0063] This embodiment provides a cleaning method, which uses the cleaning system described in Embodiment 1 to clean the heating plate. Figure 7 As shown, the cleaning method comprises:

[0064] S1, the detection component 2 detects the thickness of the surface elements of the heating plate 5 in real time and transmits it to the control component 4;

[0065] S2, the control component 4 determines the working time of the grinding component 3 according to the received thickness; wherein the control component 4 is preset with a corresponding relationship between the thickness of the element and the grinding time;

[0066] S3, the grinding assembly 3 works according to the grinding time in S2 until the thickness of the surface element of the heating plate 5 meets the requirement.

[0067] In this embodiment, the detection component 2 detects the thickness of the surface element of the heating plate 5 in real time, that is, while the grinding component 3 is working according to the grinding time in S2, the detection component 2 is still working, and when it detects that the thickness of the surface element of the heating plate 5 meets the requirement, the grinding component 3 stops working. In this embodiment, the detection component 2, the grinding component 3 and the control component 4 form a closed-loop feedback system, which can prevent the surface of the heating plate from being uncleaned or the surface material from being over-grinded.

[0068] In a specific embodiment, when the detection component 2 includes a spectrometer 21 and a scanning unit 22,

[0069] The detection component 2 in S1 detects the thickness of the surface elements of the heating disk 5 in real time and transmits it to the control component 4, specifically: the energy spectrometer 21 detects the type and content of the surface elements of the heating disk 5, and when the type of the surface elements contains fluoride, the content of the fluoride is determined, and when the content of the fluoride meets the preset requirements, the scanning unit 22 determines the position and thickness of the fluoride and transmits it to the control component 4; the polishing component 3 in S3 works according to the polishing time in S2, specifically: after the end of the polishing component 3 moves to the position of the fluoride, it works according to the polishing time. That is to say, the energy spectrometer 21 detects the type and content of the surface elements of the heating disk 5, and when the type of the surface elements contains fluoride, the content of the fluoride is determined, and when the content of the fluoride meets the preset requirements, the scanning unit 22 determines the position and thickness of the fluoride and transmits it to the control component 4. When the types of surface elements do not include fluoride, or the content of fluoride is relatively low, polishing is not necessary, and the scanning unit 22 does not need to perform scanning work at this time.

[0070] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A cleaning system for a heating plate, characterized in that: The cleaning system comprises: a base on which a heating plate is fixed; A detection component, fixed on the base and having an end thereof located above the heating plate, for detecting the thickness of elements on the surface of the heating plate; A grinding assembly, which is arranged on the base and has an end portion capable of moving above the heating plate, and is used for grinding the heating plate; A control component is connected to the grinding component and the detection component respectively, and is used to control the working time of the grinding component according to the thickness of the element detected by the detection component.

2. The cleaning system for a heating plate according to claim 1, characterized in that: The detection component includes an energy spectrometer and a scanning unit, both of which are connected to the control component; wherein the energy spectrometer is used to detect the type and content of elements on the surface of the heating disk, and the scanning unit is used to determine the position and thickness of the element by scanning when the type and content of the element on the surface of the heating disk meet preset requirements.

3. The cleaning system for a heating plate according to claim 2, characterized in that: The scanning unit is a photographic three-dimensional scanner.

4. The cleaning system for a heating plate according to claim 1, characterized in that: The grinding assembly includes a moving unit, a box, a driving member and a tool. The moving unit is connected to the box, the driving member is arranged in the box, and the tool is connected to the output end of the driving member. The moving unit drives the box to move, thereby driving the driving member and the tool to move.

5. The cleaning system for a heating plate according to claim 4, characterized in that: The moving unit includes a cylinder and a slide rail, and the cylinder and the slide rail are arranged in three groups so that the box can move in three directions of X, Y and Z.

6. The cleaning system for a heating plate according to claim 4, characterized in that: The grinding assembly also includes a tool magazine, which is fixed on one side of the base and contains tools of different models.

7. The cleaning system for a heating plate according to claim 1, characterized in that: The cleaning system further comprises a fixing component, one end of which is fixed to the side of the base, and the other end of which is connected to the heating plate.

8. The cleaning system for a heating plate according to claim 7, characterized in that: The fixing assembly includes a clamping ring, a fixing plate and a connecting piece. The clamping ring and the fixing plate are both fixed to one side of the base. The body of the heating plate is clamped in the clamping ring. The handle of the heating plate is installed on the fixing plate through the connecting piece.

9. A cleaning method, characterized in that: The cleaning method uses the cleaning system according to any one of claims 1 to 8 to clean the heating plate, and the cleaning method comprises: S1, the detection component detects the thickness of the surface elements of the heating plate in real time and transmits it to the control component; S2, the control component determines the working time of the grinding component according to the received thickness; wherein the control component is preset with a corresponding relationship between the thickness of the element and the grinding time; S3, the grinding component works according to the grinding time in S2 until the thickness of the surface element of the heating plate meets the requirement.

10. The cleaning method according to claim 9, characterized in that: When the detection component includes an energy spectrometer and a scanning unit, The detection component in S1 detects the thickness of the elements on the surface of the heating plate in real time and transmits it to the control component, specifically: the energy spectrometer detects the type and content of the elements on the surface of the heating plate, and when the type of the surface elements contains fluoride, determines the content of the fluoride, and when the content of the fluoride meets the preset requirements, the scanning unit determines the position and thickness of the fluoride and transmits it to the control component; The grinding component in S3 works according to the grinding time in S2, specifically: after the end of the grinding component moves to the position of the fluoride, it works according to the grinding time.

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