Implant machining apparatus

Abstract

The application relates to the technical field of implant processing equipment, and provides implant processing equipment, which comprises a frame body, a lifting platform, a lifting mechanism, a clamp, a rotating shaft, a driving mechanism and a laser, the lifting mechanism is used for driving the lifting platform to move up and down, the lifting mechanism is arranged on the frame body, the clamp is used for placing and fixing an implant, the rotating shaft is vertically arranged and rotationally connected to the frame body, the clamp is arranged at the top end of the rotating shaft, the driving mechanism is used for driving the rotating shaft to rotate, the driving mechanism is arranged on the frame body, the laser is used for emitting a laser beam to the implant on the clamp, and the laser is arranged on the lifting platform.

Description

Technical Field

[0001] This invention belongs to the technical field of implant processing equipment, and more specifically, relates to an implant processing device. Background Technology

[0002] Advantages of porous implants: The porous structure can effectively regulate the elastic modulus of the implant, making it closer to the elasticity of natural bone. This reduces stress shielding, allowing bone tissue to receive normal physiological load and preventing osteoporosis or bone resorption. Simultaneously, the porous structure allows for freer flow of blood and nutrients, facilitating nutrient transport and accelerating bone tissue formation on and within the implant surface, improving the health of the implant-bone interface and thus enhancing its long-term stability. (Reference patents: CN202410921499.3, CN202310042761.2, CN202210973324.8)

[0003] Current limitations in the manufacturing of porous implants: The porous structure is difficult to manufacture, typically requiring 3D metal printing methods such as selective laser melting (SLM) (see patents: CN202410921499.3, CN202310042816.X, CN202210973324.8), resulting in high costs and slow production efficiency. Furthermore, the density of 3D printed materials is usually lower than that of traditionally processed materials, especially in porous structures, where micropores or defects may exist, leading to reduced mechanical strength and increased susceptibility to fracture or fatigue damage under high occlusal forces. Additionally, 3D printing technology lacks the precision of CNC machining, particularly in controlling the uniformity of minute details, potentially resulting in insufficient precision in the connection between the implant and abutment, affecting the seal of the connection interface and increasing the risk of peri-implant inflammation and infection. Summary of the Invention

[0004] The purpose of this invention is to provide an implant processing device to solve the technical problem of difficulty in manufacturing porous implants in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is: to provide an implant processing device, comprising:

[0006] Frame;

[0007] Lifting platform;

[0008] A lifting mechanism; the lifting mechanism is used to drive the lifting platform to move up and down; the lifting mechanism is mounted on the frame;

[0009] Clamps; the clamps are used to place and fix the implant;

[0010] A rotating shaft; the rotating shaft is vertically arranged and rotatably connected to the frame; the clamp is located at the top of the rotating shaft;

[0011] Drive mechanism; the drive mechanism is used to drive the rotating shaft to rotate; the drive mechanism is mounted on the frame;

[0012] A laser; the laser is used to emit a laser beam toward the implant on the clamp; the laser is disposed on the lifting platform.

[0013] Furthermore, the lifting mechanism includes: a first motor mounted on the frame, a first annular transmission belt, a slide rail vertically mounted on the frame, a lifting platform slidably mounted on the slide rail, and a screw mounted on the frame and threadedly connected to the lifting platform; the first motor is connected to the screw via the first annular transmission belt.

[0014] Furthermore, the drive mechanism includes: a second motor and a second annular transmission belt mounted on the frame; the second motor is connected to the rotating shaft via the second annular transmission belt.

[0015] Furthermore, when the laser emits the laser beam, the first motor and the second motor stop rotating.

[0016] Furthermore, it also includes: a first reducer and a second reducer; the first motor is connected to the first annular transmission belt via the first reducer, and the second motor is connected to the second annular transmission belt via the second reducer.

[0017] Furthermore, the laser has a control unit for controlling the power of the laser beam.

[0018] Furthermore, the laser can process a hole array on the surface of the implant; the hole array has a diameter range of 300 to 800 μm and a porosity of 50% to 80% for each hole.

[0019] Furthermore, it also includes: a first seat body disposed on the lifting platform and having a first slide groove; the laser is slidably disposed in the first slide groove; and the extending direction of the first slide groove is parallel to the direction of the laser beam.

[0020] Furthermore, it also includes: a laser rangefinder mounted on the lifting platform; the clamp located between the laser rangefinder and the laser; and the laser beam and the ranging beam emitted by the laser rangefinder having opposite directions.

[0021] Furthermore, the diameter of the ranging beam emitted by the laser rangefinder is smaller than the spot diameter of the laser beam.

[0022] Furthermore, before the laser beam irradiates the implant, the laser rangefinder first measures the distance to the implant.

[0023] Furthermore, before the laser beam irradiates the implant, the laser rangefinder moves up and down with the lifting platform and measures the distance to the implant.

[0024] Furthermore, it also includes: a lens; the lens is located between the workstation and the laser rangefinder.

[0025] Furthermore, it also includes: a protective cover and a baffle; the baffle and the protective cover form a protective cover covering the outside of the laser rangefinder; the lens is detachably fixed to the baffle.

[0026] Furthermore, the number of lasers is multiple; the laser beams emitted by the multiple lasers can intersect each other on the surface of the implant to form through holes.

[0027] Furthermore, the number of lasers is multiple; the laser beams emitted by the multiple lasers have different powers and / or spot diameters.

[0028] Furthermore, it also includes: a conveyor plate and a second seat; the second seat is disposed on the lifting platform; the second seat has a second sliding groove, and the conveyor plate slides in the second sliding groove; the conveyor plate has a positioning hole; the clamp includes: a bearing outer ring that is engaged in the positioning hole, a bearing inner ring disposed inside the bearing outer ring, a tapered identification post disposed on the bearing inner ring, and a gripper disposed on the identification post for cooperating with the implant; the bearing inner ring is magnetic, and the top of the rotating shaft has a magnet for attracting the bearing inner ring.

[0029] Furthermore, it also includes: a nozzle for spraying onto the implant on the clamp and a gas source storing inert gas; the nozzle is connected to the gas source.

[0030] Furthermore, it also includes a counterweight block disposed at the bottom of the frame.

[0031] The beneficial effects of the implant processing equipment provided by this invention are as follows: Compared with the prior art, the implant processing equipment provided by this invention has a vertically arranged rotating shaft, which is directly or indirectly rotatably connected to the frame. The drive mechanism can drive the rotating shaft to rotate relative to the frame. A clamp is provided at the top of the rotating shaft, and the implant can be fixed on the clamp. When the rotating shaft rotates, it can drive the clamp to rotate, and when the clamp rotates, it can drive the implant to rotate. The lifting mechanism can drive the lifting platform to move up and down. A laser is provided on the lifting platform. The laser can move up and down with the lifting platform, and the laser emits a laser beam to irradiate the implant, which can perform laser processing on the implant. The laser beam can form a depression or hole on the implant, making it very convenient to process porous implants. Attached Figure Description

[0032] Figure 1 A three-dimensional schematic diagram of the implant processing equipment provided in an embodiment of the present invention. Figure 1 ;

[0033] Figure 2 A perspective view of the implant processing equipment (with the lifting platform hidden) provided in an embodiment of the present invention;

[0034] Figure 3 A three-dimensional schematic diagram of the implant processing equipment provided in an embodiment of the present invention. Figure 2 ;

[0035] Figure 4 A three-dimensional schematic diagram of an implant processing device (with two lasers) provided in an embodiment of the present invention;

[0036] Figure 5 A three-dimensional schematic diagram of an implant processing device (with four lasers) provided in an embodiment of the present invention;

[0037] Figure 6 A three-dimensional schematic diagram of the implant processing equipment (conveyor plate and clamp) provided in an embodiment of the present invention;

[0038] Figure 7 A top view schematic diagram of the implant processing equipment (conveyor plate and clamp) provided in an embodiment of the present invention;

[0039] Figure 8 for Figure 7 Schematic diagram of the internal clamps and rotating shaft in the AA cross section;

[0040] Figure 9 A three-dimensional schematic diagram of the implant processing equipment (with a baffle and protective cover on the outside of the laser rangefinder) provided in an embodiment of the present invention.

[0041] The following are the labeling elements in the figure:

[0042] 1-Frame; 21-Lifting platform; 22-First seat; 23-Second seat; 24-Transmitter plate; 3-Lifting mechanism; 31-First motor; 32-First annular transmission belt; 33-Slide rail; 34-Screw; 35-First reducer; 4-Clamp; 41-Bearing inner ring; 42-Bearing outer ring; 43-Identification post; 44-Holder; 5-Rotating shaft; 6-Drive mechanism; 61-Second motor; 62-Second annular transmission belt; 63-Second reducer; 7-Laser; 8-Laser rangefinder; 91-Lens; 92-Protective cover; 93-Baffle; 94-Nozzle; 95-Counterweight; 96-Implant. Detailed Implementation

[0043] It should be noted that the specific embodiments are only used to explain the present invention and are not intended to limit the present invention.

[0044] It should be noted that, in the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Here, A and B can be singular or plural, respectively.

[0045] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as "connected to" or "attached to" another component, it can be directly connected to or indirectly connected to that other component. When a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on that other component.

[0046] It should be noted that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0047] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0048] It should be noted that the term "multiple" means two or more, unless otherwise explicitly specified.

[0049] Please refer to the following: Figures 1 to 9 The implant processing equipment provided by this invention will now be described. The implant processing equipment includes: a frame 1, a lifting platform 21, a lifting mechanism 3, a clamp 4, a rotating shaft 5, a drive mechanism 6, and a laser 7; the lifting mechanism 3 is used to drive the lifting platform 21 to move up and down; the lifting mechanism 3 is mounted on the frame 1; the clamp 4 is used to place and fix the implant 96; the rotating shaft 5 is vertically arranged and rotatably connected to the frame 1; the clamp 4 is mounted on the top of the rotating shaft 5; the drive mechanism 6 is used to drive the rotating shaft 5 to rotate; the drive mechanism 6 is mounted on the frame 1; the laser 7 is used to emit a laser beam to the implant 96 on the clamp 4; the laser 7 is mounted on the lifting platform 21.

[0050] Thus, the rotating shaft 5 is vertically arranged and is directly or indirectly rotatably connected to the frame 1. The drive mechanism 6 can drive the rotating shaft 5 to rotate relative to the frame 1. A clamp 4 is provided at the top of the rotating shaft 5, and the implant 96 can be fixed on the clamp 4. When the rotating shaft 5 rotates, it can drive the clamp 4 to rotate, and when the clamp 4 rotates, it can drive the implant 96 to rotate. The lifting mechanism 3 can drive the lifting platform 21 to move up and down. A laser 7 is provided on the lifting platform 21. The laser 7 can move up and down with the lifting platform 21, and the laser 7 emits a laser beam to irradiate the implant 96 to perform laser processing on the implant 96. The laser beam irradiating the implant 96 can form a depression or hole on the implant 96, making it very convenient to process porous implants 96.

[0051] In one embodiment, the clamp 4 is a boss, and the cavity on the implant 96 (such as the cavity into which the abutment is inserted) is engaged with the boss.

[0052] In one embodiment, clamp 4 is a gripper.

[0053] In one embodiment, the implant 96 can be found in Chinese invention patent: (Publication No.: CN114767299A; Title: Self-tapping Dental Implant; Applicant: Guangdong Jianchi Biotechnology Co., Ltd.).

[0054] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, the lifting mechanism 3 includes: a first motor 31 mounted on the frame 1, a first annular transmission belt 32, a slide rail 33 vertically mounted on the frame 1, a lifting platform 21 slidably mounted on the slide rail 33, and a screw 34 mounted on the frame 1 and threadedly connected to the lifting platform 21; the first motor 31 is connected to the screw 34 via the first annular transmission belt 32. Thus, the first motor 31 drives the screw 34 to rotate via the first annular transmission belt 32, thereby driving the lifting frame to lift.

[0055] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, the drive mechanism 6 includes: a second motor 61 and a second annular transmission belt 62 mounted on the frame 1; the second motor 61 is connected to the rotating shaft 5 via the second annular transmission belt 62. Thus, the second motor 61 drives the rotating shaft 5 to rotate via the second annular transmission belt 62.

[0056] Further, please refer to Figures 1 to 9 In one specific embodiment of the implant processing equipment provided by the present invention, when the laser 7 emits a laser beam, the first motor 31 and the second motor 61 stop rotating. Thus, pulsed laser drilling is a continuous process; only when the surface to be drilled is relatively still can a complete and regular hole be formed. However, when pulsed laser drilling is performed while the first motor 31 and the second motor 61 are rotating, rounded rectangular holes will form on the surface of the implant 96, and the specified hole depth cannot be met. In one embodiment, for this reason, the first motor 31 and the second motor 61 should preferably be stepper motors, stopping their rotation after each specified number of steps and then performing pulsed laser drilling.

[0057] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a first reducer 35 and a second reducer 63; a first motor 31 is connected to a first annular transmission belt 32 via the first reducer 35, and a second motor 61 is connected to a second annular transmission belt 62 via the second reducer 63. This improves the movement accuracy of the implant 96 clamp 4 and the tray, making the laser drilling position more precise.

[0058] Further, please refer to Figures 1 to 9 In one specific embodiment of the implant processing equipment provided by the present invention, the laser 7 has a control unit for controlling the power of the laser beam. Thus, by controlling the output power of the laser generator to control the drilling depth, the top of the implant 96 is typically a solid part, requiring a deeper hole to reduce its modulus. However, the neck of the implant 96 has an interface, and the holes on its surface cannot penetrate to the interface, which would cause perforation. Furthermore, excessively deep holes at this location can easily lead to implant 96 breakage. Therefore, it is necessary to control the output power of the laser generator to create different hole depths.

[0059] Further, please refer to Figures 1 to 9As a specific embodiment of the implant processing equipment provided by the present invention, the laser 7 can process a hole array on the surface of the implant 96; the hole array has a diameter range of 300-800 μm and a porosity of 50%-80% for each hole. This is similar to the internal structure and modulus of the human jawbone, which contributes to the long-term stability of the implant 96.

[0060] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a first seat 22 disposed on a lifting platform 21 and having a first sliding groove; a laser 7 slidably disposed within the first sliding groove; and the extending direction of the first sliding groove is parallel to the direction of the laser beam. Thus, the laser 7 can be adjusted to focus its position by sliding along the first sliding groove.

[0061] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a laser rangefinder 8 disposed on the lifting platform 21; a clamp 4 located between the laser rangefinder 8 and the laser 7; the laser beam and the ranging beam emitted by the laser rangefinder 8 are in opposite directions. Thus, the laser rangefinder 8 can measure the distance to a point on the surface of the implant 96, and the lateral position of that point (lateral: refers to the radial direction of the rotating shaft 5 (or the direction of the laser beam)). Therefore, this lateral position information can be transmitted to a computer, and it can be determined whether the lateral position of the point is on the focal point. Subsequently, the laser generating device is moved according to the degree of deviation from the focal point, so that the drilling laser is focused on that point. Specifically, for example, the laser rangefinder 8 measures the distance to a certain point on the surface of the implant 96 as D1, and it is known that the distance from the central axis of the implant 96 (implant 96 clamp 4) to the laser rangefinder 8 is D2. Then the lateral position of the point is L1 = D2 - D1. At the same time, it is known that the distance from the pulse laser focus to the central axis of the implant 96 (implant 96 clamp 4) is L2. Therefore, the computer can compare the magnitudes of L1 and L2 to determine whether the point is at the focal point. If not, the computer controls the motor according to the magnitude of the deviation, so that the pulse laser generator moves along its pulse laser emission direction, bringing the focal point closer to the surface of the implant 96, that is, until L1 = L2.

[0062] Further, please refer to Figures 1 to 9 In one specific embodiment of the implant processing equipment provided by the present invention, the diameter of the ranging beam emitted by the laser rangefinder 8 is smaller than the spot diameter of the laser beam. This allows for control of the laser processing point.

[0063] Further, please refer to Figures 1 to 9As a specific embodiment of the implant processing equipment provided by the present invention, before the laser beam irradiates the implant 96, the laser rangefinder 8 first measures the distance to the implant 96. In this way, laser ranging and pulsed laser drilling are not performed simultaneously, avoiding interference with the accuracy of laser ranging, and at the same time providing reaction time for computer calculation and the movement of the laser generating device.

[0064] Further, please refer to Figures 1 to 9 In one specific embodiment of the implant processing equipment provided by the present invention, before the laser beam irradiates the implant 96, the laser rangefinder 8 moves up and down with the lifting platform 21 to measure the distance to the implant 96. Thus, the vertical movement of the laser rangefinder 8 allows for the acquisition of multiple lateral positions on the surface of the implant 96. The diameter of the implant 96 can be obtained from the largest lateral position. Furthermore, when the laser rangefinder 8 takes points at a fixed time frequency and moves vertically at a constant speed, the length of the implant 96 can be calculated based on the number of lateral positions. Once the diameter and length of the implant 96 are identified, a corresponding program can be used for drilling. For example, under uniform porosity conditions, smaller diameter implants 96 require fewer holes per cross-section to meet porosity requirements; therefore, the second motor 61 should be controlled to rotate more steps before pulsed laser drilling. Larger diameter implants 96 have a larger circumference, requiring more holes per cross-section to meet porosity requirements; therefore, the second motor 61 should be controlled to rotate less steps before pulsed laser drilling to ensure consistent porosity for implants 96 of each diameter. Under the same porosity conditions, the spacing of the perforation sections is consistent. Therefore, shorter implants 96 require fewer perforation sections, while longer implants 96 require more. Thus, the first motor 31 needs to control its rotation steps according to the length of the implant 96 until the Nth section completely covers the implant 96.

[0065] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a lens 91; the lens 91 is located between the workstation and the laser rangefinder 8. Thus, the lens 91 facilitates the measurement of the laser beam by the laser rangefinder 8 through the baffle 93 and the measurement of the surface of the implant 96. However, laser processing easily generates sputtering waste that contaminates the lens 91, therefore the lens 91 must be replaced promptly; a detachable function can improve replacement efficiency.

[0066] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a protective cover 92 and a baffle 93; the baffle 93 and the protective cover 92 form a protective cover over the outside of the laser rangefinder 8; the lens 91 is detachably fixed to the baffle 93. This prevents external contamination and processing waste from affecting the laser rangefinder 8, ensuring measurement accuracy.

[0067] Further, please refer to Figures 1 to 9 In one specific embodiment of the implant processing equipment provided by this invention, there are multiple lasers 7; the laser beams emitted by the multiple lasers 7 can intersect to form through holes on the surface of the implant 96. This interconnected hole structure allows the implant to interlock with the bone, thereby improving the bonding ability and thus providing higher stability. Simultaneously, the interconnected hole structure facilitates the free flow of blood and nutrients, promoting nutrient transport and accelerating bone tissue formation on and inside the implant 96. (For example, patent CN202410921499.3 provides a technical document based on the interconnected hole structure). The laser rangefinder 8 assists in adjusting the drilling method, which is crucial for the preparation of through holes. Since the surface of the implant 96 is composed of various curved surfaces, when the surface deviates from the predetermined plane, two holes cannot form an interconnection. Therefore, it is necessary to adjust the position of the pulsed laser generator according to the actual position of the drilling point on the implant 96 surface.

[0068] Further, please refer to Figures 1 to 9 In one specific embodiment of the implant processing equipment provided by this invention, there are multiple lasers 7; the laser beams emitted by the multiple lasers 7 have different powers and / or spot diameters. Thus, by controlling different pulsed laser generators to drill holes on the surface of the implant 96, parameters such as porosity, pore size, and pore depth are adjusted to achieve personalized drilling on the surface of the implant 96. This matches the bone strength and elastic modulus of the cortical bone, cancellous bone, or the entire implant socket interface, thereby designing a personalized porous implant 96. This improves the stress shielding effect, matches the bone strength and elastic modulus of the implant socket interface, effectively increases the bonding strength, improves the bone integration rate and long-term stability, and increases the implantation success rate. (For example, patent CN202310042761.2 forms a technical document based on adjusting porosity and pore size to match the bone strength and elastic modulus of the implant socket interface).

[0069] Further, please refer to Figures 1 to 9As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a conveyor plate 24 and a second seat 23; the second seat 23 is disposed on the lifting platform 21; the second seat 23 has a second sliding groove, and the conveyor plate 24 is slidably disposed in the second sliding groove; the conveyor plate 24 has a positioning hole; the clamp 4 includes: a bearing outer ring 42 clamped in the positioning hole, a bearing inner ring 41 disposed inside the bearing outer ring 42, a cone-shaped identification post 43 disposed on the bearing inner ring 41, and a clamping device 44 disposed on the identification post 43 for cooperating with the implant 96; the bearing inner ring 41 is magnetic, and the top of the rotating shaft 5 has a magnet for attracting the bearing inner ring 41. In this way, the conveyor plate 24 can slide freely with the implant 96 clamped, and at the same time, when the implant 96 clamp 4 is aligned with the rotating shaft 5, the bearing inner ring 41, under the attraction of the magnet, can provide the friction force required for the clamp 4 to rotate, ensuring its normal drilling operation.

[0070] In one embodiment, the tapered identification post 43 is coaxially arranged with the rotating shaft 5.

[0071] In one embodiment, the gripper 44 may be a clamp 4.

[0072] In one embodiment, the outer ring 42 of the bearing is inserted and fixed in the positioning hole.

[0073] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes: a nozzle 94 for spraying onto the implant 96 on the clamp 4 and a gas source storing inert gas; the nozzle 94 is connected to the gas source. In this way, the inert gas can prevent oxidation reaction from occurring in the laser irradiation area due to high temperature.

[0074] Further, please refer to Figures 1 to 9 As a specific embodiment of the implant processing equipment provided by the present invention, it further includes a counterweight block 95 disposed at the bottom of the frame 1. Thus, the counterweight block ensures the stability of the device's operation, thereby improving processing accuracy.

[0075] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. Implant processing equipment, characterized in that, include: Frame; Lifting platform; Lifting mechanism; The lifting mechanism is used to drive the lifting platform to move up and down; The lifting mechanism is mounted on the frame. Clamps; the clamps are used to place and fix the implant; A rotating shaft; the rotating shaft is vertically arranged and rotatably connected to the frame; the clamp is located at the top of the rotating shaft; Drive mechanism; the drive mechanism is used to drive the rotating shaft to rotate; the drive mechanism is mounted on the frame; Laser; The laser is used to emit a laser beam toward the implant on the clamp; The laser is mounted on the lifting platform; It also includes: a conveyor plate and a second seat; the second seat is disposed on the lifting platform; the second seat has a second sliding groove, and the conveyor plate slides in the second sliding groove; the conveyor plate has a positioning hole; the clamp includes: an outer bearing ring that is engaged in the positioning hole, an inner bearing ring disposed inside the outer bearing ring, a tapered identification post disposed on the inner bearing ring, and a gripper disposed on the identification post for cooperating with the implant; the inner bearing ring is magnetic, and the top of the rotating shaft has a magnet for attracting the inner bearing ring.

2. The implant processing equipment as described in claim 1, characterized in that, The lifting mechanism includes: a first motor mounted on the frame, a first annular transmission belt, a slide rail vertically mounted on the frame, a lifting platform slidably mounted on the slide rail, and a screw mounted on the frame and threadedly connected to the lifting platform; the first motor is connected to the screw via the first annular transmission belt.

3. The implant processing equipment as described in claim 2, characterized in that, The drive mechanism includes: a second motor and a second annular transmission belt mounted on the frame; the second motor is connected to the rotating shaft via the second annular transmission belt.

4. The implant processing equipment as described in claim 3, characterized in that, When the laser emits the laser beam, the first motor and the second motor stop rotating.

5. The implant processing equipment as described in claim 3, characterized in that, Also includes: A first reducer and a second reducer; the first motor is connected to the first annular transmission belt via the first reducer, and the second motor is connected to the second annular transmission belt via the second reducer.

6. The implant processing equipment as described in claim 1, characterized in that, The laser has a control unit for controlling the power of the laser beam.

7. The implant processing equipment as described in claim 1, characterized in that, The laser can process an array of holes on the surface of the implant; the diameter of each hole in the array ranges from 300 to 800 μm, and the porosity of the array is 50% to 80%.

8. The implant processing equipment as described in claim 1, characterized in that, Also includes: A first seat body is disposed on the lifting platform and has a first sliding groove; the laser is slidably disposed in the first sliding groove; and the extending direction of the first sliding groove is parallel to the direction of the laser beam.

9. The implant processing equipment as described in claim 1, characterized in that, Also includes: A laser rangefinder is mounted on the lifting platform; the clamp is located between the laser rangefinder and the laser; the laser beam and the ranging beam emitted by the laser rangefinder are in opposite directions.

10. The implant processing equipment as described in claim 9, characterized in that, The diameter of the ranging beam emitted by the laser rangefinder is smaller than the spot diameter of the laser beam.

11. The implant processing equipment as described in claim 9, characterized in that, Before the laser beam irradiates the implant, the laser rangefinder first measures the distance to the implant.

12. The implant processing equipment as described in claim 9, characterized in that, Before the laser beam irradiates the implant, the laser rangefinder moves up and down with the lifting platform and measures the distance to the implant.

13. The implant processing equipment as described in claim 1, characterized in that, The number of lasers is multiple; the laser beams emitted by the multiple lasers can intersect each other on the surface of the implant to form through holes.

14. The implant processing equipment as described in claim 1, characterized in that, The number of lasers is multiple; the laser beams emitted by the multiple lasers have different powers and / or spot diameters.

15. The implant processing equipment as described in claim 1, characterized in that, Also includes: A nozzle for spraying the implant onto the clamp and a gas source storing inert gas; the nozzle is connected to the gas source.

16. The implant processing equipment as described in claim 1, characterized in that, Also includes: The counterweight is located at the bottom of the frame.

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