Partial cladding plating process

Abstract

The local film covering electroplating process comprises the following steps: step one, providing a copper strip roll and at least one film roll, and the film is coated on one side; step two, loading the copper strip roll and the film roll into a film covering device respectively, wherein the copper strip is transported by a belt conveyor and a pair of rollers, and the film is attached to one side or both sides of the copper strip by a film attaching jig; step three, repeatedly bending and deforming the copper strip by a correction module to make the film better attached to the surface of the copper strip; step four, transporting the copper strip with the attached film into an electroplating tank to electroplate the area without the film; step five, outputting the copper strip after electroplating from the electroplating tank and drying the copper strip; and step six, peeling the film from the copper strip and then winding the copper strip. The copper strip is locally coated with the film, and then electroplated, so that the surface of the film covering area is not electroplated, thereby reducing the consumption of the electroplating solution and the electroplating cost.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy vehicles, and in particular to a local coating electroplating process for motor terminals. Background Art

[0002] During the current electroplating process, motor terminal strips are immersed in a plating solution, forming a plating coating across the entire metal surface. However, in some operational scenarios, motor terminals may not require a full electroplating coating, requiring only partial electroplating. However, existing electroplating equipment can only perform full-body plating, resulting in wasted plating material. Summary of the Invention

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a local coating electroplating process to solve the problem of waste of electroplating materials caused by the overall electroplating of terminal strips.

[0004] In order to solve the above technical problems, the present invention provides a local coating electroplating process, comprising:

[0005] Step 1: Provide a copper tape roll and at least one film roll, and apply glue on one side of the film;

[0006] Step 2: The copper strip roll and the film roll are respectively loaded into the laminating device, wherein the copper strip is conveyed by the material strip conveying roller, and the film is laminated to the partial surface of one side or both sides of the copper strip by the laminating jig;

[0007] Step 3: Use the correction module to correct the deformation of the copper strip by repeated bending to make the film fit better with the surface of the copper strip;

[0008] Step 4: transport the copper strip with the film into the electroplating tank and electroplate the uncoated area;

[0009] Step 5: The electroplated copper strip is taken out of the electroplating tank and dried;

[0010] Step 6: Peel the film off the copper tape and then roll up the copper tape.

[0011] In step 1, the width of the adhesive film does not exceed the width of the copper strip, and the adhesive film is an insulating adhesive film, and the adhesive layer of the adhesive film is also an insulating adhesive material.

[0012] In step 2, the width of the adhesive film is equal to the width of the film-coated area on the copper tape.

[0013] The laminating device described in step 2 includes:

[0014] The material belt conveying roller is used to clamp the conveying belt;

[0015] The film feeding platform is used to provide the film, and the bottom edge height of the film is not lower than the bottom edge height of the material strip;

[0016] Film laminating jig, used to attach the film to the material strip;

[0017] The correction module is used to correct the bending of the material strip that is bonded to the diaphragm.

[0018] In step three, the correction module includes a fixed roller and a movable laminating roller. There are multiple fixed rollers, and the distance between two adjacent fixed rollers is less than the radius of each fixed roller. The movable laminating roller can move toward the fixed roller and abut against the roller surface of the fixed roller. The movable laminating rollers and fixed rollers are arranged alternately, so that each movable laminating roller is located in the center plane between two adjacent fixed rollers. The range of movement of the movable laminating roller toward the fixed roller is adjusted to control the extent of repeated bending of the material strip and squeeze out the air between the film and the copper strip.

[0019] Before step 2, the method also includes adjusting the film roll height adjustment device and the film sheet height adjustment device so that before the film is attached to the copper tape, the bottom edge of the film remains horizontal and has the same height as the bottom edge of the film-attaching area, so that after being attached to the copper tape, the film covers the film-attaching area.

[0020] In step three, before the copper strip is deformed and corrected, the copper strip is also pre-deformed by passing through a pre-pressing roller.

[0021] The pre-pressing roller is located upstream of the fixed roller, and after being projected in the conveying direction of the material strip, the pre-pressing roller and the fixed roller have an overlapping area.

[0022] The width of the overlapping area does not exceed one third of the diameter of the fixed roller.

[0023] In step six, after the film is peeled off from the copper tape, the film is rolled up separately.

[0024] Also includes:

[0025] Step 7: Perform a coating treatment on the area electroplated in step 4, and then immerse it in a second electroplating tank again to perform a secondary electroplating treatment on the area electroplated in step 4;

[0026] Alternatively, the plated area and the partially coated area in step 4 are coated, and then immersed in the second electroplating tank again, and the uncoated area is subjected to a secondary electroplating treatment.

[0027] The local coating electroplating process provided by the present invention can avoid electroplating on the surface of the coated area by locally coating the copper strip and then electroplating the copper strip, thereby not only reducing the consumables of the electroplating solution and lowering the electroplating cost, but also maintaining the original properties of the copper strip in the coated area; the bending deformation of the copper strip after coating is corrected by a correction module, and in this process the adhesive film is tightly adhered to the surface of the copper strip, so that the air gap between the copper strip and the adhesive film is squeezed out, and the combination of the copper strip and the adhesive film is tighter, thereby eliminating the hidden danger of electroplating on the coated surface during the electroplating process.

[0028] By utilizing the local coating electroplating process provided by the present invention, multiple electroplating treatments can be performed on different areas, thereby achieving electroplating of different materials and being able to adapt to complex product electroplating requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 Schematic diagram of the structure of the film coating device according to an embodiment of the present invention;

[0030] Figure 2 This is a schematic structural diagram of a partial coating of a copper strip according to an embodiment of the present invention;

[0031] Figure 3 Schematic diagram of the structure of the partial coating of the copper strip according to an embodiment of the present invention.

[0032] In the figure: 1. Material belt conveying roller pair; 2. Film feeding platform; 3. Film laminating jig; 4. Correction module; 5. Fixed roller; 6. Pre-pressing roller; 7. Moving laminating roller; 8. Moving frame; 9. Driving device; 10. Horizontal cross plate; 11. Diaphragm height adjustment device.

[0033] 100 copper strip; 110 adhesive film; 120 plating. DETAILED DESCRIPTION

[0034] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0035] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] like Figure 1 As shown, the present invention provides a coating device, comprising:

[0038] The material belt conveying roller pair 1 is used to clamp the conveying material belt;

[0039] The film feeding platform 2 is used to provide the film, and the bottom edge height of the film is not lower than the bottom edge height of the material strip;

[0040] Film sticking jig 3, used to stick the film onto the material strip;

[0041] The correction module 4 is used to correct the bending of the material strip fitted with the diaphragm.

[0042] The correction module 4 includes a fixed roller 5 and a movable laminating roller 7. There are multiple fixed rollers, and the distance between two adjacent fixed rollers is less than the radius of the fixed roller; the movable laminating roller can move toward the fixed roller and can abut against the roller surface of the fixed roller. The movable laminating roller and the fixed roller are arranged alternately so that each movable laminating roller is located on the center plane between two adjacent fixed rollers.

[0043] The movable laminating roller 7 is mounted on a movable frame 8 , and the rear portion of the movable frame 8 is driven by a driving device 9 .

[0044] The driving device 9 is a cylinder or a screw rod, or may be other structures capable of driving the movable frame 8, such as a motor guide rail.

[0045] The adhesive film feeding platforms 2 are provided with two, which can be bonded to the material strip from both sides, so that the adhesive film can be bonded to the surface of both sides of the material strip according to the process requirements of the film bonding.

[0046] The two film feeding platforms 2 are located on the same horizontal plate 10 . This design allows the film feeding heights of the film feeding platforms 2 on both sides to be easily adjusted to be consistent.

[0047] The correction module 4 also includes a pre-pressing roller 6, which is located upstream of the fixed roller, and after being projected in the direction of material conveying, the pre-pressing roller can have an overlapping area with the fixed roller. Through the combined action of the pre-pressing roller 6 and the fixed roller adjacent to it, the film material strip that formally enters the correction process is pre-bent, and the bending amplitude is smaller than the bending amplitude between the movable laminating roller 7 and the fixed roller 5, so a gradual bending correction operation is performed.

[0048] The width of the overlapping area does not exceed one-third of the diameter of the fixed roller to minimize the pre-stressing bending of the strip.

[0049] The diameters of the pre-pressing roller 6, the fixed roller 5 and the movable laminating roller 7 are the same, thereby improving the replaceability of product parts and reducing the production cost of the entire machine.

[0050] The film feeding platform 2 is provided with a rotary material changing structure, with a rotating shaft in the middle and a film roll support shaft installed at each end. In this way, after using a roll of film, another roll of film can be immediately replaced by rotating the rotating shaft, so that the film laminating operation can be quickly resumed.

[0051] The film feed platform 2 is equipped with a film roll height adjustment device and a film sheet height adjustment device 11. The film roll height adjustment device is located at the bottom of the film roll, while the film sheet height adjustment device 11 is located in the film sheet feeding area. The film roll height adjustment device and the film sheet height adjustment device have the same adjustment height, ensuring that the film sheet and the material strip are completely parallel, thus preventing the film sheet from forming local wrinkles after being attached to the material strip. The height adjustment device 11 can be fine-tuned using a screw adjustment mechanism.

[0052] The laminating device provided by the present invention can adjust the laminating position of the diaphragm on the material strip, and correct it through a correction device after laminating, so as to achieve a better laminating effect. After squeezing the gap between the diaphragm and the material strip, there are no air bubbles, which is beneficial to the subsequent electroplating process and improves the quality of electroplating.

[0053] like Figure 2-3 As shown, the present invention provides a local film electroplating process, comprising:

[0054] Step 1: Provide a copper tape roll and at least one film roll, and apply glue on one side of the film;

[0055] Step 2: The copper strip roll and the film roll are respectively loaded into the laminating device, wherein the copper strip 100 is conveyed by the material strip conveying roller 1, and the film 110 is laminated to the partial surface of one side or both sides of the copper strip 100 by the film laminating jig 3;

[0056] Step 3: Correcting the copper strip 100 by repeated bending using the correction module 4 to improve the adhesion between the adhesive film 110 and the surface of the copper strip 100;

[0057] Step 4: transport the copper strip 100 with the adhesive film into the electroplating tank and electroplate the uncoated area;

[0058] Step 5: The electroplated copper strip 100 is taken out of the electroplating tank and dried.

[0059] Step 6: Peel the adhesive film 110 from the copper tape, and then roll up the copper tape 100.

[0060] In step 1, the width of the adhesive film 110 does not exceed the width of the copper strip, and the adhesive film 110 is an insulating adhesive film, and the adhesive layer of the adhesive film 110 is also an insulating adhesive material.

[0061] In step 2, the width of the adhesive film 110 is equal to the width of the film-coated area on the copper tape 100 .

[0062] The laminating device described in step 2 includes:

[0063] The material belt conveying roller pair 1 is used to clamp the conveying material belt;

[0064] The film feeding platform 2 is used to provide the film, and the bottom edge height of the film is not lower than the bottom edge height of the material strip;

[0065] Film sticking jig 3, used to stick the film onto the material strip;

[0066] The correction module 4 is used to correct the bending of the material strip fitted with the diaphragm.

[0067] In step three, the correction module includes a fixed roller and a movable laminating roller. There are multiple fixed rollers, and the distance between two adjacent fixed rollers is less than the radius of each fixed roller. The movable laminating roller can move toward the fixed roller and abut against the roller surface of the fixed roller. The movable laminating rollers and fixed rollers are arranged alternately, so that each movable laminating roller is located in the center plane between two adjacent fixed rollers. The range of movement of the movable laminating roller toward the fixed roller is adjusted to control the extent of repeated bending of the material strip and squeeze out the air between the film and the copper strip.

[0068] Before step 2, the method also includes adjusting the film roll height adjustment device and the film sheet height adjustment device so that before the film is attached to the copper tape, the bottom edge of the film remains horizontal and has the same height as the bottom edge of the film-attaching area, so that after being attached to the copper tape, the film covers the film-attaching area.

[0069] In step three, before the copper strip 100 is deformed and corrected, the copper strip 100 is also pre-deformed by passing through a pre-pressing roller 6 .

[0070] The pre-pressing roller 6 is located upstream of the fixed roller, and when projected in the conveying direction of the material strip, the pre-pressing roller and the fixed roller have an overlapping area.

[0071] In step six, after the adhesive film 110 is peeled off from the copper tape 100 , the adhesive film is rolled up separately.

[0072] It also includes the steps of secondary coating electroplating, and there are two options:

[0073] First, after completing step 6, the area electroplated in step 4 is subjected to a coating treatment, and then immersed in a second electroplating tank again to perform a secondary electroplating treatment on the area coated in step 4;

[0074] Secondly, after completing step six, the plated area and the partially coated area in step four are coated, and then immersed in the second electroplating tank again, and the uncoated area is subjected to a secondary electroplating treatment.

[0075] The local coating electroplating process provided by the present invention can avoid electroplating on the surface of the coated area by locally coating the copper strip and then electroplating the copper strip, thereby not only reducing the consumables of the electroplating solution and lowering the electroplating cost, but also maintaining the original properties of the copper strip in the coated area; the bending deformation of the copper strip after coating is corrected by a correction module, and in this process the adhesive film is tightly adhered to the surface of the copper strip, so that the air gap between the copper strip and the adhesive film is squeezed out, and the combination of the copper strip and the adhesive film is tighter, thereby eliminating the hidden danger of electroplating on the coated surface during the electroplating process.

[0076] By utilizing the local coating electroplating process provided by the present invention, multiple electroplating treatments can be performed on different areas, thereby achieving electroplating of different materials and being able to adapt to complex product electroplating requirements.

[0077] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. Local coating electroplating process, characterized in that: include: Step 1: Provide a copper tape roll and at least one film roll, and apply glue on one side of the film; Step 2: The copper strip roll and the film roll are respectively loaded into the laminating device, wherein the copper strip is conveyed by the material strip conveying roller, and the film is laminated to the partial surface of one side or both sides of the copper strip by the laminating jig; Step 3: Use the correction module to correct the deformation of the copper strip by repeated bending to make the film fit better with the surface of the copper strip; Step 4: transport the copper strip with the film into the electroplating tank and electroplate the uncoated area; Step 5: The electroplated copper strip is taken out of the electroplating tank and dried; Step 6: Peel the film off the copper tape, and then rewind the copper tape; The laminating device described in step 2 includes: The material belt conveying roller is used to clamp the conveying belt; The film feeding platform is used to provide the film, and the bottom edge height of the film is not lower than the bottom edge height of the material strip; Film laminating jig, used to attach the film to the material strip; Correction module, used to correct the bending of the material strip fitted with the diaphragm; In step three, the correction module includes a fixed roller and a movable laminating roller, there are multiple fixed rollers, and the distance between two adjacent fixed rollers is less than the radius of the fixed roller; the movable laminating roller can move toward the direction of the fixed roller and can abut against the roller surface of the fixed roller, and the movable laminating roller and the fixed roller are arranged alternately so that each movable laminating roller is located on the center plane between two adjacent fixed rollers; the amplitude of the movable laminating roller moving toward the fixed roller is adjusted to control the amplitude of repeated bending of the material strip and squeeze out the air between the film and the copper strip.

2. The local coating electroplating process according to claim 1, characterized in that: In step 1, the width of the adhesive film does not exceed the width of the copper strip, and the adhesive film is an insulating adhesive film, and the adhesive layer of the adhesive film is also an insulating adhesive material.

3. The local coating electroplating process according to claim 1, characterized in that: In step 2, the width of the adhesive film is equal to the width of the film-coated area on the copper tape.

4. The local coating electroplating process according to claim 1, characterized in that: Before step 2, the method also includes adjusting the film roll height adjustment device and the film sheet height adjustment device so that before the film is attached to the copper tape, the bottom edge of the film remains horizontal and has the same height as the bottom edge of the film-attaching area, so that after being attached to the copper tape, the film covers the film-attaching area.

5. The local coating electroplating process according to claim 1, characterized in that: In step three, before the copper strip is deformed and corrected, the copper strip is also pre-deformed by passing through a pre-pressing roller.

6. The local coating electroplating process according to claim 5, characterized in that: The pre-pressing roller is located upstream of the fixed roller, and after being projected in the conveying direction of the material strip, the pre-pressing roller and the fixed roller have an overlapping area.

7. The local coating electroplating process according to claim 1, characterized in that: The method further includes step seven, performing a coating treatment on the area electroplated in step four, and then immersing the area in a second electroplating tank again to perform a secondary electroplating treatment on the area coated in step four.

8. The local coating electroplating process according to claim 1, characterized in that: The method further includes step seven, coating the area electroplated in step four and the area partially coated, and then immersing the area in a second electroplating tank again to perform a secondary electroplating treatment on the uncoated area.

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