Sample preparation method for brazed joint

By using the brazing material of a plurality of second test pieces to the first test piece during the sample preparation of the brazing joint, the problems of cumbersome, unstable quality and high cost in the prior art are solved, and efficient and stable sample preparation of the brazing joint is achieved.

CN119574247APending Publication Date: 2025-03-07ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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Patent Information

Application Number
CN202411719748.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-27
Publication Date
2025-03-07

AI Technical Summary

Technical Problem

In the existing brazing joint sample preparation process, multiple base materials or combinations of solder materials need to be prepared separately, resulting in cumbersome process, unstable quality and high cost.

Method used

By providing a plurality of mounting parts on the first test piece, a plurality of second test pieces are respectively assembled at the mounting part, and the second test piece is connected to the first test piece by brazing material, and then the first test piece is cut to form a plurality of brazing joints.

Benefits of technology

This method simplifies the sample preparation process, improves the quality stability of the brazed joints, and reduces the sample preparation cost. It can simultaneously produce multiple brazed joint samples that meet the experimental requirements.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides a brazed joint sample preparation method, and relates to the field of brazed joint sample preparation. The brazed joint sample preparation method comprises the following steps: S10, arranging a plurality of mounting parts on a first test piece; s20, correspondingly assembling a plurality of second test pieces at the mounting parts respectively; s30, the multiple second test pieces are correspondingly connected with the first test piece through brazing filler metal; and S40, the second test piece and the first test piece are cut to form a plurality of brazed joints, and each brazed joint is composed of the first test piece, the brazing filler metal and the second test piece. According to the brazed joint sample preparation method, the plurality of second test pieces are simultaneously connected with the first test piece through the brazing filler metal, and then the first test piece is cut, so that the plurality of brazed joints can be simultaneously prepared, the sample preparation method is simple in process, the manufacturing cost is effectively reduced, and the sample quality can be ensured.
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Description

Technical Field

[0001] The present application relates to the field of brazing joint sample preparation, and in particular to a brazing joint sample preparation method. Background Art

[0002] Modern welding technology is an important technical foundation for industrial production and construction. Among them, brazing technology, with its unique advantages, plays an irreplaceable role in the field of dissimilar material connection and is widely used in aerospace, automotive engineering, electronic power, rail transportation, household appliances and refrigeration and other industrial fields. Brazing, as a precision welding process, is based on the use of brazing materials with a melting point lower than the weld itself. After being heated to the melting temperature of the brazing material, the liquid brazing material can penetrate and fill the tiny gaps between the solid workpieces, thereby achieving a firm connection between the metals. This process not only requires precise temperature control, but is also highly dependent on the performance of the brazing material itself, because the performance of the brazing material directly and significantly affects the final quality of the brazed joint.

[0003] In view of the significant differences in the physical and chemical properties of dissimilar materials, brazing research on different material combinations often requires a large number of experimental verifications and the use of a large number of different brazing fillers. However, in the existing brazing joint sample preparation process, multiple base materials or brazing filler combinations can only be sampled separately, and during multiple sample preparations, it is difficult to unify the temperature and insulation time, which leads to unstable brazing joint quality. Problems such as poor gap filling and partial gap not being filled are prone to occur, and the geometric shape and assembly gap of the brazing joint are also difficult to control. In addition, multiple sample preparations are costly. Summary of the invention

[0004] In view of this, the purpose of the present application is to provide a method for preparing samples of brazed joints, so as to solve the problems of complicated process, unstable quality of brazed joints and high cost caused by separate preparation of samples of existing multiple base materials or brazing material combinations.

[0005] According to the above object, the present invention provides a method for preparing a brazing joint sample, wherein the method for preparing a brazing joint sample comprises the following steps:

[0006] S10: setting a plurality of mounting parts on the first test piece;

[0007] S20: Assembling a plurality of second test pieces respectively and correspondingly at the mounting parts;

[0008] S30: Connecting a plurality of the second test pieces to the first test pieces correspondingly through solder;

[0009] S40: cutting the first test piece to form a plurality of brazing joints, each of which is composed of the first test piece, the brazing material, and the second test piece.

[0010] Preferably, the mounting portion is formed as a mounting hole, the second test piece is located in the mounting hole and forms a gap with the inner wall of the mounting hole, and the solder is filled in the gap;

[0011] Alternatively, the mounting portion is formed as a planar structure, and the second test piece is arranged on the surface of the first test piece through solder.

[0012] Preferably, gap columns are arranged at intervals in the gaps, and the melting point of the gap columns is higher than the melting point of the solder.

[0013] Preferably, the materials of the plurality of second test pieces are different, and the type of the solder used to connect each of the second test pieces is the same;

[0014] Alternatively, the materials of the plurality of second test pieces are the same, and the types of the solder used to connect each of the second test pieces are different;

[0015] Alternatively, the materials of the plurality of second test pieces are different, and the types of the solder used to connect each of the second test pieces are different;

[0016] Alternatively, the material of the plurality of second test pieces is the same, and the type of the solder applied to each of the second test pieces is the same, and the specification of the gap between each of the second test pieces and the corresponding mounting hole is different.

[0017] Preferably, the width of the gap is 0.01 mm to 0.5 mm.

[0018] Preferably, in the brazing joint, the first test piece is covered on the outer side of the second test piece, or the first test piece and the second test piece are stacked in sequence.

[0019] Preferably, when the solder is formed into a solid state, step S30 specifically includes:

[0020] S310: placing the brazing material between the first test piece and the second test piece, and adding brazing flux;

[0021] S320: placing the first test piece, the second test piece, and the solder in a heating furnace for heating to melt the solder.

[0022] Preferably, when the solder is formed into a solid state, step S30 specifically includes:

[0023] S310: forming the solder into a sheet structure;

[0024] S320: Wrapping the solder on the outer side of the second test piece to form an assembly;

[0025] S330: Dispose the assembly at the mounting portion, and form an interference fit between the assembly and the mounting portion.

[0026] Preferably, when the solder is in a liquid state, in step S30 , the solder is cast between the first test piece and the second test piece.

[0027] Preferably, in step S40, the brazing joint is made by a ring drill or wire cutting.

[0028] According to the brazing joint sample preparation method of the present invention, multiple second test pieces are connected to the first test piece at the same time through the brazing material, and then the first test piece is cut, so that multiple brazing joints can be made at the same time. The sample preparation method is simple in process, effectively reduces the manufacturing cost and can ensure the quality of the sample.

[0029] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 is a flow chart of a method for preparing a brazed joint sample according to an embodiment of the present invention;

[0032] Figure 2 is a schematic diagram of a first test piece according to a first embodiment of the present invention;

[0033] Figure 3 is a schematic diagram of connecting a first test piece and a second test piece according to a first embodiment of the present invention;

[0034] Figure 4 is a schematic diagram of a brazed joint according to a first embodiment of the present invention;

[0035] Figure 5 is a schematic diagram of a brazed joint provided with a gap column according to a first embodiment of the present invention;

[0036] Figure 6 is a schematic diagram of a first test piece according to a second embodiment of the present invention;

[0037] Figure 7is a schematic diagram of connecting a first test piece and a second test piece according to a second embodiment of the present invention;

[0038] Figure 8 is a schematic diagram of connecting a first test piece and a second test piece according to a third embodiment of the present invention;

[0039] Fig. 9 is a schematic diagram of a brazed joint according to a third embodiment of the present invention;

[0040] Fig.10 Schematic diagram of a brazing joint provided with gap columns according to a third embodiment of the present invention.

[0041] Icons: 1-first test piece; 10-mounting portion; 2-second test piece; 3-solder; 4-brazing joint; 5-gap column. DETAILED DESCRIPTION

[0042] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0043] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0044] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0045] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] According to the present invention, a method for preparing a brazed joint is provided, such as Figures 1 to 10 As shown, the method for preparing the brazed joint 4 in this embodiment includes the following steps:

[0048] S10: Arrange a plurality of mounting portions 10 on the first test piece 1;

[0049] S20: Assemble a plurality of second test pieces 2 respectively and correspondingly on the mounting parts 10;

[0050] S30: Connecting the plurality of second test pieces 2 to the first test piece 1 correspondingly through the solder 3;

[0051] S40 : cutting the first test piece 1 to form a plurality of brazing joints 4 , each of the brazing joints 4 being composed of the first test piece 1 , the brazing material 3 and the second test piece 2 .

[0052] Specifically, Figure 2 and Figure 8 As shown, the first test piece 1 is formed as a plate-like structure, and a plurality of mounting portions 10 are formed on the top of the first test piece 1, so that a plurality of second test pieces 2 can be connected to the first test piece 1 at the same time through the plurality of mounting portions 10, and then the first test piece 1 can be cut, so that a plurality of brazing joints 4 can be made at the same time.

[0053] Furthermore, the materials of the multiple second test pieces 2 can be set to be different, and the type of solder 3 used to connect each second test piece 2 can be set to be the same, so that a large number of solder joints 4 (samples) connected to different materials (of the second test pieces 2) can be prepared at one time; or, the material of the multiple second test pieces 2 can be the same, and the type of solder 3 used to connect each second test piece 2 can be different, that is, each second test piece 2 is connected to the first test piece 1 through a different solder 3, so that a solder joint 4 (sample) using different solders 3 can be prepared at one time; or, the material of the multiple second test pieces 2 can be set to be different, and the type of solder used to connect each second test piece 2 can be set to be different; or, the material of the multiple second test pieces 2 can be set to be the same, and the type of solder used for each second test piece 2 is the same, but the gap (between the second test piece 2 and the mounting hole described below) is different.

[0054] In this way, through this sample preparation method, multiple samples of brazed joints 4 that meet the experimental requirements can be prepared at one time, and the sample preparation process is efficient and convenient, and it can also facilitate the experimental needs of researchers for the "control variables" of the samples. It should be noted that there are no specific restrictions on the materials and specifications of the first test piece 1, the second test piece 2, and the brazing material 3, which should be determined comprehensively according to actual conditions such as experimental requirements.

[0055] In addition, the form of the mounting portion 10 formed on the top of the first test piece 1 is not fixed. For example, it can be formed as a mounting hole (which can be a through hole or a groove-like structure). In this case, the second test piece 2 can be arranged corresponding to the mounting hole. In order to facilitate the connection between the second test piece 2 and the first test piece 1, a gap should be formed between the inner wall of the mounting hole and the inner wall of the second test piece 2. Preferably, the width of the gap is 0.01mm to 0.5mm, and then the solder 3 is filled in the gap. Furthermore, in order to ensure that the assembly gap between the second test piece 2 and the mounting hole meets the requirements, a plurality of spaced-apart gap columns 5 (such as Figure 5 As shown), the melting point of the material of the gap column 5 needs to be higher than the melting point of the solder, so that the following assembly and the mounting portion can be formed into an interference fit. There is no specific limitation on the number and spacing of the gap columns 5, as long as the above technical effects can be achieved.

[0056] It should be noted that, in order to ensure the stability of the sample structure of the brazing joint 4, the contour structure of the mounting hole and the like need to correspond to the structure of the second test piece 2, and the structure of the brazing joint 4 also corresponds to the second test piece 2. For example, when the second test piece 2 is formed into a cylindrical shape, the mounting hole is formed into a cylindrical hole, and the brazing joint 4 is also formed into a cylindrical structure (such as Figures 2 to 4or, when the second test piece 2 is formed into a rectangular parallelepiped, the mounting hole is formed into a square hole, and the brazing joint 4 is formed into a rectangular parallelepiped structure (such as Figure 6 to Figure 7 When the mounting portion 10 is formed as a mounting hole, in the manufactured brazing joint 4, the first test piece 1 is covered on the outer side of the second test piece 2.

[0057] It should be further explained that the specific value of the width of the gap formed between the inner wall of the mounting hole and the inner wall of the second test piece 2 is not fixed. For example, according to the test requirements, when aluminum-based brazing material and vacuum brazing are used, the gap can be set to 0.01mm-0.05mm; when aluminum-based brazing material and brazing with flux are used, the gap can be set to 0.05mm-0.2mm. However, the specific specifications of the gap are not limited to this, but should be considered comprehensively according to the actual situation, such as the type of brazing material or the brazing method, so as to facilitate the study of the influence of different gaps on the brazed joint.

[0058] Or, if Figures 8 to 10 As shown, the mounting portion 10 can also be formed into a planar structure, that is, the second test piece 2 is arranged on the top of the first test piece 1 through the solder 3, and the solder 3 is located between the first test piece 1 and the second test piece 2. In the brazed joint 4 made in this case, the first test piece 1 and the second test piece 2 are stacked in sequence, and gap columns 5 (such as Fig.10 shown).

[0059] In this embodiment, the specific steps of the above step S30 can be determined comprehensively according to conditions such as the structure of the mounting portion 10 and the state of the solder 3 .

[0060] For example, when the solder 3 is formed into a solid state, step S30 specifically includes:

[0061] S310: placing the brazing material 3 between the first test piece 1 and the second test piece 2, and adding brazing agent;

[0062] S320: placing the first test piece 1, the second test piece 2, and the solder 3 in a heating furnace for heating to melt the solder 3.

[0063] When the mounting portion 10 is formed as a mounting hole, the solid solder 3 can be placed at the top of the gap between the first test piece 1 and the second test piece 2, and the melted solder 3 can flow into and cover the entire gap under the capillary action. When the mounting portion 10 is formed as a planar structure, the solder 3 can be located between the first test piece 1 and the second test piece 2.

[0064] Alternatively, when the mounting portion 10 is formed as a mounting hole and the solder 3 is formed in a solid state, step S30 may further include:

[0065] S310: forming the solder 3 into a thin sheet structure;

[0066] S320: Wrapping the solder 3 on the outer side of the second test piece 2 to form an assembly;

[0067] S330: Dispose the assembly at the mounting portion 10 so that the assembly and the mounting portion 10 form an interference fit.

[0068] When the solder 3 is in liquid state, in step S30 , the liquid solder 3 may be cast between the first test piece 1 and the second test piece 2 .

[0069] In addition, in step S40, the brazing joint 4 can be manufactured by machining such as a ring drill or wire cutting.

[0070] According to the method for preparing the brazing joint 4 as described above, multiple second test pieces 2 are simultaneously connected to the first test piece 1 through the brazing material 3, and then the first test piece 1 is cut, so that multiple brazing joints 4 can be made at the same time. The simple process of this method is extremely important for accelerating the research process, selecting the best brazing material 3, optimizing the brazing process, and improving the quality of the joint. The method for preparing the sample as described above can not only reduce the research cost, but also promote the application and promotion of brazing technology in a wider range of fields, and further promote the development and progress of industrial technology.

[0071] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present application, which are used to illustrate the technical solutions of the present application, rather than to limit them. The protection scope of the present application is not limited thereto. Although the present application is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed in the present application, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be described in the protection scope of the claims.

Claims

1. A method for preparing a brazed joint sample, characterized in that: The brazing joint sample preparation method comprises the following steps: S10: setting a plurality of mounting parts on the first test piece; S20: Assembling a plurality of second test pieces respectively and correspondingly at the mounting parts; S30: Connecting a plurality of the second test pieces to the first test pieces correspondingly through solder; S40: cutting the first test piece to form a plurality of brazing joints, each of which is composed of the first test piece, the brazing material, and the second test piece.

2. The method for preparing a brazed joint sample according to claim 1, wherein: The mounting portion is formed as a mounting hole, the second test piece is located in the mounting hole and forms a gap with the inner wall of the mounting hole, and the solder is filled in the gap; Alternatively, the mounting portion is formed as a planar structure, and the second test piece is arranged on the surface of the first test piece through solder.

3. The method for preparing a brazed joint sample according to claim 2, wherein: The gaps are also provided with gap columns at intervals, and the melting points of the gap columns are higher than the melting point of the solder.

4. The method for preparing a brazed joint sample according to claim 2, wherein: The materials of the plurality of second test pieces are different, and the type of the solder used to connect each of the second test pieces is the same; Alternatively, the materials of the plurality of second test pieces are the same, and the types of the solder used to connect each of the second test pieces are different; Alternatively, the materials of the plurality of second test pieces are different, and the types of the solder used to connect each of the second test pieces are different; Alternatively, the material of the plurality of second test pieces is the same, and the type of the solder applied to each of the second test pieces is the same, and the specification of the gap between each of the second test pieces and the corresponding mounting hole is different.

5. The method for preparing a brazed joint sample according to claim 2, wherein: The width of the gap is 0.01 mm to 0.5 mm.

6. The method for preparing a brazed joint sample according to claim 1, characterized in that: In the brazing joint, the first test piece is covered on the outer side of the second test piece, or the first test piece and the second test piece are stacked in sequence.

7. The method for preparing a brazed joint sample according to claim 1, characterized in that: When the solder is formed into a solid state, step S30 specifically includes: S310: placing the brazing material between the first test piece and the second test piece, and adding brazing flux; S320: placing the first test piece, the second test piece, and the solder in a heating furnace for heating to melt the solder.

8. The method for preparing a brazed joint sample according to claim 1, characterized in that: When the solder is formed into a solid state, step S30 specifically includes: S310: forming the solder into a sheet structure; S320: Wrapping the solder on the outer side of the second test piece to form an assembly; S330: Dispose the assembly at the mounting portion, and form an interference fit between the assembly and the mounting portion.

9. The method for preparing a brazed joint sample according to claim 1, wherein: When the solder is in a liquid state, in step S30 , the solder is cast between the first test piece and the second test piece.

10. The method for preparing a brazed joint sample according to claim 1, characterized in that: In step S40, the brazed joint is made by ring drilling or wire cutting.