A high stability semiconductor testing device

Abstract

The present invention relates to the field of semiconductor testing technology, and in particular to a high-stability semiconductor testing device, comprising a base and a cover plate, wherein a pressing mechanism is arranged on the cover plate, the pressing mechanism comprising a pressing block, pressing components are arranged on both sides of a limiting groove, and clamping components are arranged on the sides of the two pressing components. The present invention arranges the pressing mechanism and the pressing component, so that when pressure is applied, the pressing block not only acts on the middle of the top of the semiconductor chip, but also applies pressure to both sides of the top of the semiconductor chip through the pressing component, so as to ensure that all parts of the semiconductor chip are evenly stressed and avoid damage to the semiconductor chip caused by local stress concentration. At the same time, the pressing component drives the clamping component to clamp both sides of the semiconductor chip, stabilizes the positioning of the semiconductor chip, improves safety and contact stability, and is particularly suitable for high-precision testing environments, and effectively reduces poor contact or semiconductor chip damage caused by uneven force.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor testing, and in particular to a high-stability semiconductor testing device. Background Art

[0002] Semiconductor testing refers to the testing of electrical performance, function and reliability of semiconductor chips during their manufacturing and use. The semiconductor chip test socket is a device specially used for testing semiconductor chips. It is usually used in the testing process of semiconductor chip manufacturing, as well as the testing of semiconductor chips during the assembly and maintenance of electronic equipment.

[0003] The semiconductor test socket in the prior art generally consists of a base and a rotatable cover plate, and the cover plate is usually fixed to the base through an elastic connection. When in use, the semiconductor chip is placed in the limiting groove of the base, and the cover plate applies downward pressure to the semiconductor chip, so that the semiconductor chip contacts the probe on the base, thereby driving the electrical connection between the probe and the test board, and then realizing the detection of the semiconductor chip. However, during use, since the cover plate applies pressure to the semiconductor chip during the rotation process, a small inclination angle is usually formed. This non-vertical pressure may cause damage to the semiconductor chip, and even cause poor contact between the semiconductor chip and the probe, affecting the test effect.

[0004] Chinese patent CN118011191B discloses a semiconductor test socket and its digital detection system. The invention provides a semiconductor test socket including a detection seat, a lifting device, a rotating part, a pressure cover and a rotating device. The pressure cover is rotated to a state parallel to the detection seat by the rotating device, and a certain gap is retained between the pressure cover and the detection seat. Then the pressure cover is lowered by the lifting device to clamp and limit the test chip. In this process, the force applied to the chip is a vertical downward force, which avoids the problem of tilting and pressing in the prior art. However, since there is still a certain gap between the chip and the limiting groove, the cover plate is prone to uneven force when applying pressure to the chip, and can only apply pressure to a single point on the semiconductor chip, which causes the chip to have a certain degree of displacement in the limiting groove, thereby causing the chip to be in an unstable contact with the probe on the base, affecting the accuracy of the test results. Summary of the invention

[0005] In view of the above problems, a high-stability semiconductor testing device is provided. The present invention solves the problem of poor accuracy in semiconductor chip performance testing caused by uneven pressure on semiconductor chips caused by traditional equipment and existing technologies, such as damage to semiconductor chips and poor contact, through the provision of a pressing mechanism and a pressing assembly.

[0006] To solve the problems of the prior art, the present invention provides a high-stability semiconductor testing device, comprising a base and a cover plate rotatably arranged on the base, a pressing mechanism being arranged on the cover plate, and after the cover plate is rotated and buckled with the base, a certain gap is formed between the pressing mechanism and the semiconductor chip on the base; the pressing mechanism comprises a pressing block that can move along the height direction of the base; a limiting groove that matches the semiconductor chip is arranged on the base; rotatable pressing components are arranged on both sides of the limiting groove, and the two pressing components are arranged in a mirror-symmetrical state; when the pressing block moves downward toward the semiconductor chip, it can drive the two pressing components to rotate and apply pressure to the top two sides of the semiconductor chip; clamping components that can slide in the horizontal direction are arranged on the sides of the two pressing components, and the two clamping components are used to clamp the two sides of the semiconductor chip, and when the pressing component rotates, it can drive the clamping components to approach and press against the two sides of the semiconductor chip.

[0007] Preferably, a accommodating groove is provided in the base, a limiting frame matching with the accommodating groove is installed in the accommodating groove, the limiting groove is provided on the limiting frame, two pressing components and two clamping components are all provided on the limiting frame, a transmission component connected to the pressing component is provided on the base, and the transmission component is used to drive the clamping component to move.

[0008] Preferably, mounting grooves are provided on both sides of the limit frame, and the pressing assembly includes a supporting shaft and a pressing rod. The supporting shaft is rotatably arranged in the mounting groove in a horizontal state, the pressing rod is sleeved on the supporting shaft, and a bending portion deflected toward the side of the semiconductor chip is provided on the top of the pressing rod.

[0009] Preferably, the clamping assembly includes two clamping rods that can slide in a horizontal direction, the two clamping rods are respectively located on both sides of the pressing assembly, and two mounting holes matching the clamping rods are provided in the limit frame. A first limit plate is provided at one end of the clamping rod close to the semiconductor chip, and a first elastic member is provided on the clamping rod for driving the clamping rod to telescopically move in the mounting hole.

[0010] Preferably, the transmission assembly includes an E-shaped flow channel, in which a fluid medium is arranged, a first piston rod is arranged in the middle of the flow channel and is transmission-connected to the lower pressure rod, the two ends of the flow channel are respectively docked with two mounting holes on the limit frame, and second piston rods are arranged at both ends of the flow channel, and the retraction of the first piston rod will drive the two second piston rods to move out synchronously through the fluid medium.

[0011] Preferably, an inclined guide plate is fixedly connected to the lower pressure rod, a sliding rod that can slide in a horizontal direction is provided on the mounting groove, the sliding rod is connected to the first piston rod in the middle of the flow channel, a roller is provided on the end of the sliding rod close to the lower pressure rod, the roller and the guide plate are rollingly matched, and a second elastic member is provided between the sliding rod and the inner wall of the mounting groove for driving the end of the sliding rod to always contact the guide plate.

[0012] Preferably, the pressing mechanism further includes two elastic telescopic rods. After the cover plate is buckled with the base, the two elastic telescopic rods are respectively located above the two pressing rods, and the two elastic telescopic rods are both transmission-connected to the pressing block, and the elastic telescopic rods drive the pressing rods to rotate by rotating.

[0013] Preferably, the lower pressure block is a conical structure, and two transmission blocks that can slide radially along the lower pressure block are arranged on both sides of the lower pressure block in the cover plate. The transmission blocks are elastically connected to the inner wall of the cover plate, and the two transmission blocks slide in cooperation with the lower pressure block. Two U-shaped connecting pieces are arranged below the transmission block, and a connecting rod that rotatably cooperates with the two U-shaped connecting pieces is arranged at the top of the elastic telescopic rod. The transmission block can drive the elastic telescopic rod to rotate through the two U-shaped connecting pieces and the connecting rod.

[0014] Preferably, a pressure sensor is provided at the bottom of the lower pressing block.

[0015] Preferably, a threaded rod is provided on the lower pressing block, and the threaded rod passes through the cover plate and is threadably matched with the cover plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] After the cover plate of the present invention is rotated and fastened with the base, the pressing mechanism is moved, and the semiconductor chip is operated through the pressing block and the pressing assembly to realize the detection of the semiconductor chip. The problem of semiconductor chip deviation caused by single-point vertical pressure commonly seen in traditional equipment is avoided through the setting of multi-point clamping and uniform pressure. Specifically, when the pressing block applies pressure to the semiconductor chip, it is not only concentrated on the middle of the semiconductor chip, but also presses on both sides of the top of the semiconductor chip through the pressing assembly. This multi-point pressure method can ensure that each part of the semiconductor chip is evenly stressed, avoiding the phenomenon of local stress concentration, thereby reducing the risk of damage to the semiconductor chip. While applying pressure, the pressing assembly also drives the clamping assembly to clamp the side of the semiconductor chip, further stabilizing the positioning of the semiconductor chip and improving the safety and contact stability of the semiconductor chip. It is particularly suitable for testing environments with high-precision requirements for semiconductor chips, and can effectively reduce the situation of poor contact or semiconductor chip damage caused by uneven pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The present invention is a schematic diagram of the three-dimensional structure of a high-stability semiconductor testing device when a cover plate and a base are buckled together.

[0019] Figure 2 The invention discloses a three-dimensional structure diagram of a high-stability semiconductor testing device when a cover plate and a base are not fastened together.

[0020] Figure 3The present invention is a three-dimensional cross-sectional structural schematic diagram of a downward pressing mechanism in a high-stability semiconductor testing device when the downward pressing mechanism is in operation.

[0021] Figure 4 The present invention is a schematic diagram of the cross-sectional structure of a downward pressing mechanism in a high-stability semiconductor testing device when it is working.

[0022] Figure 5 The present invention is a schematic diagram of the cross-sectional structure of a high-stability semiconductor testing device.

[0023] Figure 6 The present invention is a three-dimensional structural schematic diagram of a cover plate and a pressing mechanism in a high-stability semiconductor testing device.

[0024] Figure 7 The invention is a three-dimensional structural diagram of a lower pressing block, a transmission block and an elastic telescopic rod in a high-stability semiconductor testing device.

[0025] Figure 8 The present invention is a schematic diagram of a three-dimensional structure in which a semiconductor chip is placed on a base in a high-stability semiconductor testing device.

[0026] Fig. 9 The present invention is a three-dimensional structural schematic diagram of a base and a limit frame in a high-stability semiconductor testing device.

[0027] Fig.10 The present invention is a schematic diagram of the three-dimensional structure of a base in a high-stability semiconductor testing device.

[0028] Fig.11 The invention is a schematic diagram of the cross-sectional structure of a base and a limit frame in a high-stability semiconductor testing device.

[0029] Fig.12 The exploded diagram is of a pressing component, a transmission component and a clamping component in a high-stability semiconductor testing device.

[0030] The numbers in the figure are:

[0031] 1. Base; 11. Accommodating groove; 12. Transmission assembly; 121. Channel; 1211. First piston rod; 1212. Second piston rod; 2. Limiting frame; 21. Limiting groove; 22. Pressing assembly; 221. Mounting groove; 2211. Support shaft; 2212. Pressing rod; 22121. Bending portion; 22122. Guide plate; 2213. Sliding rod; 22131. Roller; 22132. Second elastic member; 23. Clamping assembly; 231. Clamping rod; 232. First limiting plate; 233. First elastic member; 24. Mounting hole; 3. Cover plate; 31. Pressing mechanism; 311. Pressing block; 3111. Pressure sensor; 3112. Threaded rod; 312. Elastic telescopic rod; 3121. Connecting rod; 313. Transmission block; 3131. U-shaped connector; 4. Semiconductor chip. DETAILED DESCRIPTION

[0032] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0033] like Figures 1 to 5 and Figures 7 to 9 As shown: a high-stability semiconductor testing device, comprising a base 1 and a cover plate 3 rotatably arranged on the base 1, a pressing mechanism 31 is arranged on the cover plate 3, and after the cover plate 3 is rotated and buckled with the base 1, a certain gap is formed between the pressing mechanism 31 and the semiconductor chip 4 on the base 1; the pressing mechanism 31 comprises a pressing block 311 which can move along the height direction of the base 1; a limiting groove 21 which matches the semiconductor chip 4 is arranged on the base 1; both sides of the limiting groove 21 are provided with rotatable pressing components 22, and the two pressing components 22 are arranged in a mirror-symmetrical state; when the pressing block 311 moves downward toward the semiconductor chip 4, it can drive the two pressing components 22 to rotate and apply pressure to the top two sides of the semiconductor chip 4; the sides of the two pressing components 22 are provided with clamping components 23 which can slide in the horizontal direction, and the two clamping components 23 are used to clamp the two sides of the semiconductor chip 4, and when the pressing component 22 rotates, it can drive the clamping components 23 to approach and press against the two sides of the semiconductor chip 4.

[0034] During operation, the cover plate 3 is engaged with the base 1 by rotation. After the engagement, there is a certain gap between the pressing mechanism 31 and the semiconductor chip 4 on the base 1. At this time, by starting the pressing mechanism 31, the pressing block 311 in the pressing mechanism 31 can move along the height direction of the base 1, so that the pressing block 311 approaches the center of the semiconductor chip 4. At the same time, the movement of the pressing block 311 drives the rotation of the two pressing assemblies 22 connected to it, so that the two pressing assemblies 22 arranged in mirror symmetry can clamp the top two sides of the semiconductor chip 4. When the pressing block 311 applies pressure to the semiconductor chip 4, it not only focuses on the middle of the top of the semiconductor chip 4, but also applies preliminary pressure to the top two sides of the semiconductor chip 4 through the pressing assembly 22, and finally presses the semiconductor chip 4 through the pressing block 311. Pressure is applied to the top middle of the chip 4 to ensure that the semiconductor chip 4 is evenly stressed, thereby avoiding damage or poor contact of the semiconductor chip 4 due to single-point pressure. Before the pressing component 22 contacts the semiconductor chip 4, the movement of the pressing component 22 also drives the movement of the clamping component 23 connected thereto, so that the two clamping components 23 can clamp the two sides of the semiconductor chip 4, thereby ensuring that the semiconductor chip 4 will not undergo lateral displacement during the test, thereby significantly improving the contact stability during the test. As the pressing block 311 is further pressed downward, the pressing mechanism 31 can evenly apply vertical pressure to the semiconductor chip 4, thereby ensuring that the semiconductor chip 4 can drive the probe on the base 1 to make stable electrical contact with the test equipment, thereby achieving reliable testing of the performance of the semiconductor chip 4.

[0035] When the pressing block 311 moves, the pressing assembly 22 and the clamping assembly 23 are automatically driven to move without manual adjustment or additional power source, thereby realizing the automation of the semiconductor chip 4 testing process and improving the testing efficiency. Compared with the traditional testing device, the design of clamping and evenly applying pressure to the semiconductor chip 4 at multiple points avoids the problem of damage or displacement of the semiconductor chip 4 caused by only a single vertical pressure, thereby greatly improving the performance testing accuracy and reliability of the semiconductor chip 4.

[0036] like Figures 1 to 4 and Figures 7 to 10 As shown: a receiving groove 11 is provided in the base 1, a limiting frame 2 matching with the receiving groove 11 is installed in the receiving groove 11, a limiting groove 21 is provided on the limiting frame 2, two pressing components 22 and two clamping components 23 are all provided on the limiting frame 2, a transmission component 12 which is transmission-connected with the pressing component 22 is provided on the base 1, and the transmission component 12 is used to drive the clamping component 23 to move.

[0037] By setting a receiving groove 11 in the base 1, the receiving groove 11 is installed and matched with the limit frame 2, so that the limit frame 2 can be stably fixed in the base 1. This modular design not only increases the stability of the structure, but also makes the installation between the limit frame 2 and the base 1 easier, effectively reducing the difficulty of assembly and maintenance of the entire device. By setting the pressing component 22 and the clamping component 23 on the limit frame 2, the various components work together in an overall framework. The transmission component 12 set on the base 1 is connected to the pressing component 22 through transmission, and can drive the synchronous movement of the clamping component 23. Through the integrated transmission design, during the pressing process of the semiconductor chip 4, it is possible to press down the top two sides of the semiconductor chip 4 and clamp the two sides of the semiconductor chip 4 at the same time, thereby improving work efficiency and ensuring that the clamping force of the semiconductor chip 4 is uniform and stable, thereby avoiding damage to the semiconductor chip 4 caused by uneven force.

[0038] like Figures 1 to 4 and Figures 7 to 12 As shown: installation grooves 221 are set on both sides of the limit frame 2, and the pressing assembly 22 includes a support shaft 2211 and a pressing rod 2212. The support shaft 2211 is horizontally rotatably set in the installation groove 221, and the top of the pressing rod 2212 is provided with a bending portion 22121 deflected toward the side of the semiconductor chip 4.

[0039] By setting installation grooves 221 on both sides of the limit frame 2, the support shaft 2211 of the pressing assembly 22 is horizontally rotated and installed in the installation groove 221, so that the pressing assembly can realize smooth rotation and pressing action on the support shaft 2211, effectively improving the control of the pressing force on both sides of the semiconductor chip 4, ensuring that the pressing process is more uniform and stable, and reducing the risk of damage to the semiconductor chip 4 due to uneven force application. The bending portion 22121 set on the top of the pressing rod 2212 can more accurately apply pressure to the top edge of the semiconductor chip 4. The design of the bending portion 22121 effectively enhances the directionality and stability of the pressure, avoids the displacement of the semiconductor chip 4 during the pressing process, ensures the uniform distribution of the pressing force, and ensures that the semiconductor chip 4 maintains a stable position during operation. The operator can flexibly adjust the pressing position and strength of the pressing rod 2212 by adjusting the rotation angle of the support shaft 2211 to adapt to semiconductor chips 4 of different types and sizes, thereby greatly improving the versatility and operational flexibility of the device.

[0040] like Figure 3 , Figure 4 and Figures 7 to 12As shown: the clamping assembly 23 includes two clamping rods 231 that can slide in the horizontal direction, and the two clamping rods 231 are respectively located on both sides of the pressing assembly 22. The limiting frame 2 is provided with two mounting holes 24 that match the clamping rods 231. A first limiting plate 232 is provided at one end of the clamping rod 231 close to the semiconductor chip 4, and a first elastic member 233 is provided on the clamping rod 231 for driving the clamping rod 231 to telescopically move in the mounting hole 24.

[0041] With the two clamping rods 231 respectively located on both sides of the pressing assembly 22, the clamping rods 231 can stably clamp the semiconductor chip 4 from both sides at the same time, thereby ensuring the stability of the semiconductor chip 4 during the entire test process and preventing the semiconductor chip 4 from lateral displacement or shaking during the test or pressure application process. By setting the first limit plate 232 and the first elastic member 233, the moving range of the clamping rod 231 can be accurately controlled, so that the clamping rod 231 is located in the mounting hole 24 in the initial state. After the pressing rod 2212 drives the transmission assembly 12, the clamping rod 231 is pushed by the transmission assembly 12, so that the clamping rod 231 extends out of the mounting hole 24 to clamp the semiconductor chip 4, further enhancing the safety and reliability of the device. At the same time, the clamping rod 231 can automatically retract back into the mounting hole 24 without using external force, reducing the steps of human intervention, and maintaining an efficient working rhythm when the device is reset, ensuring that the semiconductor chip 4 can be quickly clamped or released, greatly improving the operating efficiency.

[0042] like Figure 3 , Figure 4 and Figures 7 to 12 As shown: the transmission assembly 12 includes an E-shaped flow channel 121, in which a fluid medium is arranged, a first piston rod 1211 is arranged in the middle of the flow channel 121 for transmission connection with the lower pressure rod 2212, and both ends of the flow channel 121 are respectively connected to the two mounting holes 24 on the limit frame 2, and second piston rods 1212 are arranged at both ends of the flow channel 121, and the retraction of the first piston rod 1211 will drive the two second piston rods 1212 to move out synchronously through the fluid medium.

[0043] In the initial state, the ends of the first piston rod 1211 and the second piston rod 1212 are flush with the inner wall of the limit frame 2. When the pressing rod 2212 moves, the first piston rod 1211 moves into the flow channel 121. At this time, the movement of the first piston rod 1211 drives the flowing medium in the flow channel 121, so that the two second piston rods 1212 extend out, thereby extending into the mounting hole 24 to hold the clamping rod 231, thereby realizing the movement of the clamping assembly 23. Through the setting of the E-shaped flow channel 121, the first piston rod 1211 and the two second piston rods 1212 can realize synchronous movement through the flow of the fluid medium, ensuring that the two clamping rods 231 simultaneously hold and clamp the semiconductor chip 4. Such synchronous movement improves the clamping accuracy of the entire device and effectively prevents the semiconductor from being damaged due to asynchronism during the clamping process. The uneven force on chip 4 further ensures the stability of semiconductor chip 4 during the test. The fluid medium can be hydraulic oil or gas, which makes the transmission process between the first piston rod 1211 and the second piston rod 1212 smoother and avoids the jamming phenomenon caused by friction or mechanical errors in traditional mechanical transmission. The use of hydraulic oil or gas makes the entire transmission assembly 12 operate more smoothly and reduces mechanical wear, greatly improving the service life and reliability of the device. The retraction action of the first piston rod 1211 can not only drive the second piston rod 1212 to move out for supporting, but also automatically reset the entire system through the return of hydraulic oil or gas after the operation is completed, ensuring that the test device can quickly return to its initial state after each operation, saving time for subsequent test operations and improving overall work efficiency.

[0044] Sealing rings are provided on the first piston rod 1211 and the second piston rod 1212 to ensure that the flowing medium will not leak. The transmission is carried out through the flowing medium, and the transmission process is smoother and the force is more evenly applied, thereby avoiding damage to the semiconductor chip 4 caused by excessive force in traditional mechanical transmission. The use of hydraulic oil or gas as a transmission medium can provide a moderate buffering effect, reduce the direct impact of external force on the semiconductor chip 4, and improve the safety of the semiconductor chip 4. The entire device is easy to maintain and clean, which reduces the maintenance cost of the equipment and improves the overall utilization efficiency.

[0045] like Figure 3 , Figure 4 and Figures 7 to 12As shown: an inclined guide plate 22122 is fixedly connected to the lower pressure rod 2212, a sliding rod 2213 that can slide in a horizontal direction is provided on the mounting groove 221, the sliding rod 2213 is connected to the first piston rod 1211 in the middle of the flow channel 121, and a roller 22131 is provided on the end of the sliding rod 2213 close to the lower pressure rod 2212, the roller 22131 and the guide plate 22122 are rollingly matched, and a second elastic member 22132 is provided between the sliding rod 2213 and the inner wall of the mounting groove 221 for driving the end of the sliding rod 2213 to always contact with the guide plate 22122.

[0046] By setting the inclined guide plate 22122 and the lower pressure rod 2212, the lower pressure rod 2212 can drive the guide plate 22122 fixedly connected thereto to move when it rotates toward the semiconductor chip 4, so that the guide plate 22122 pushes the roller 22131, and the movement of the roller 22131 drives the sliding rod 2213 to move toward the limit frame 2. At this time, the movement of the sliding rod 2213 will squeeze the second elastic member 22132. After the sliding rod 2213 extends into the middle part of the flow channel 121, the sliding rod 2213 squeezes the first piston rod 1211, so that the fluid medium can drive the clamping assembly 23 through the second piston rod 1212, so that the clamping assembly 23 clamps the semiconductor chip 4. In the above manner, the lower pressure rod 2212 can first fix the semiconductor chip 4 before pressing the edge of the semiconductor chip 4, thereby ensuring that the semiconductor The stability of the chip 4 in the limit groove 21. At the same time, combined with the settings of the flow channel 121, the first piston rod 1211 and the second piston rod 1212, when the sliding rod 2213 applies pressure to the first piston rod 1211, the force direction can be effectively converted into the clamping force direction of the clamping assembly 23 on the semiconductor chip 4, thereby achieving a precise clamping effect. Through the setting of the roller 22131, the guide plate 22122 can maintain a stable guiding effect and avoid jamming due to unstable sliding or uneven force, thereby ensuring the uniformity of force on the semiconductor chip 4 and the smoothness of equipment operation. Through the setting of the second elastic member 22132, the roller 22131 and the guide plate 22122 maintain continuous and reliable contact to avoid gaps or detachment, thereby ensuring that the sliding rod 2213 can respond to the movement of the guide plate 22122 in real time to achieve precise clamping operations.

[0047] like Figures 1 to 6 As shown: the pressing mechanism 31 also includes two elastic telescopic rods 312. After the cover plate 3 is buckled with the base 1, the two elastic telescopic rods 312 are respectively located above the two pressing rods 2212, and the two elastic telescopic rods 312 are both transmission-connected with the pressing block 311. The elastic telescopic rods 312 drive the pressing rod 2212 to rotate by rotating.

[0048] After the cover plate 3 and the base 1 are buckled together, the movement of the lower pressing block 311 will drive the two elastic telescopic rods 312 connected to them, and the rotation of the elastic telescopic rods 312 will drive the two lower pressing rods 2212 to rotate toward the semiconductor chip 4 until the lower pressing rods 2212 press the top edge of the semiconductor. The elastic telescopic rods 312 have certain elasticity and telescopic characteristics, so that the elastic telescopic rods 312 can always maintain contact with the lower pressing rods 2212 during rotation, and after the cover plate 3 is separated from the base 1, they can be easily stored in the cover plate 3 through their own contraction, saving space and reducing the complexity of external hanging components. This compact design not only facilitates the integration and installation of the device, but also can reduce the device operation obstacles caused by insufficient space, and is suitable for smaller operating spaces; at the same time, it can effectively buffer pressure fluctuations and friction during the pressing process, reduce the wear of mechanical parts, extend the service life of the device, and reduce the maintenance frequency and cost.

[0049] It should be noted that there are various transmission methods for the elastic telescopic rod 312 and the lower pressure rod 2212. For example, the rotation of the elastic telescopic rod 312 can be achieved by setting a gear and rack mechanism between the lower pressure rod 2212 and the elastic telescopic rod 312; or the same effect can be achieved through a lever mechanism. Since the relevant technology has been widely used in the existing field, it will not be described in detail here.

[0050] like Figures 1 to 6 As shown: the lower pressing block 311 is a conical structure, and two transmission blocks 313 that can slide radially along the lower pressing block 311 are arranged on both sides of the lower pressing block 311 in the cover plate 3, and the transmission blocks 313 are elastically connected to the inner wall of the cover plate 3, and the two transmission blocks 313 slide in cooperation with the lower pressing block 311, and two U-shaped connecting pieces 3131 are arranged below the transmission block 313, and a connecting rod 3121 that rotatably cooperates with the two U-shaped connecting pieces 3131 is arranged at the top of the elastic telescopic rod 312, and the middle part of the elastic telescopic rod 312 is also rotatably connected to the inner wall of the cover plate 3, and the transmission block 313 can drive the elastic telescopic rod 312 to rotate through the two U-shaped connecting pieces 3131 and the connecting rod 3121.

[0051] The conical setting of the lower pressing block 311 combined with the radial sliding of the transmission block 313 ensures the uniform transmission of force. The cross-section of the transmission block 313 is preferably a wedge-shaped that matches the lower pressing block 311, so that the lower pressing block 311 can drive the two transmission blocks 313 to slide radially along the lower pressing block 311 when moving toward the semiconductor chip 4. Since the transmission block 313 is elastically connected to the inner wall of the cover plate 3, the elastic member will be compressed at this time, thereby driving the transmission block 313 to move horizontally, and driving the elastic telescopic rod 312 to rotate from the side facing the inner wall of the cover plate 3 to the center side of the cover plate 3 through the two U-shaped connecting members 3131 and the connecting rod 3121. In this process, the elastic telescopic rod 312 will contact the lower pressing rod 2212, thereby realizing that the elastic telescopic rod 312 drives the lower pressing rod 2212 The rotation forms pressure on the pressing rod 2212, so that the pressing rod 2212 can apply pressure to both sides of the top of the semiconductor chip 4 after the rotation. After the pressing block 311 is reset, the elastic member will drive the transmission block 313 to reset, so that the transmission block 313 always keeps in contact with the pressing block 311. This function not only simplifies the operation process, but also reduces the maintenance requirements of the pressing device, and increases the automation and durability of the system. Through the coordinated work of the transmission block 313, the elastic telescopic rod 312, the U-shaped connecting piece 3131 and the connecting rod 3121, a complex pressing action is realized, and the structural design is compact, which reduces the space occupied by the device. This compact setting is particularly suitable for use in high-precision test sockets that require miniaturization, thereby improving the space utilization of the overall device.

[0052] like Figures 1 to 5 As shown: a pressure sensor 3111 is provided at the bottom of the lower pressing block 311 .

[0053] By setting the pressure sensor 3111, the real-time monitoring function of the pressure can be realized when the pressing block 311 presses down the semiconductor chip 4, which can ensure that the pressure applied to the semiconductor chip 4 during the pressing process is always within an appropriate range. This can effectively avoid damage to the semiconductor chip 4 or unstable fixation caused by excessive or insufficient pressing force. Combined with the control system, the pressure sensor 3111 can provide real-time feedback of the applied pressure data, thereby automatically adjusting the pressing process of the pressing block 311, ensuring the accuracy and consistency of each operation, and improving production efficiency and product quality.

[0054] like Figures 1 to 5 As shown: a threaded rod 3112 is provided on the lower pressing block 311, and the threaded rod 3112 passes through the cover plate 3 and is threadably matched with the cover plate 3.

[0055] Through the threaded cooperation between the threaded rod 3112 and the cover plate 3, the user can adjust the position and applied pressure of the lower pressing block 311 by rotating the threaded rod 3112. This structure can achieve precise adjustment of the clamping force to ensure that the clamping process can adapt to semiconductor chips 4 of different thicknesses or sizes. The setting of the threaded rod 3112 simplifies the adjustment process of the clamping mechanism. Accurate height adjustment can be achieved through simple rotation, thereby improving the operability and user-friendliness of the equipment. In order to improve the degree of automation, the threaded rod 3112 can be controlled by rotating the drive motor to automatically adjust the pressure between the lower pressing block 311 and the semiconductor chip 4.

[0056] Working principle: At the beginning of the test, the semiconductor chip 4 is placed in the limiting groove 21 on the base 1. The limiting frame 2 in the base 1 ensures that the semiconductor chip 4 is accurately placed and provides a preliminary positioning function. The cover plate 3 is rotated and buckled with the base 1 to preliminarily align the pressing mechanism 31 with the semiconductor chip 4. However, at this time, a certain gap is still maintained between the pressing block 311 in the pressing mechanism 31 and the semiconductor chip 4. After starting the pressing mechanism 31, the pressing block 311 gradually descends along the height direction of the base 1, and acts together through the pressing assembly 22 connected thereto. The downward movement of the pressing block 311 will simultaneously drive the two transmission blocks 313 to move relative to each other in the radial direction, thereby driving the elastic telescopic rod 312 to rotate through the transmission block 313, and driving the pressing rod 2212 around the support shaft through the rotation of the elastic telescopic rod 312. 2211 rotates, so that the pressing rod 2212 can clamp the top two sides of the semiconductor chip 4, providing a clamping force for the top edge. At the same time, during the movement of the pressing component 22, the transmission component 12 is also driven to work. The transmission component 12 transmits power through hydraulic or pneumatic means to make the clamping component 23 slide in the horizontal direction. The clamping component 23 clamps the two sides of the semiconductor chip 4 by extending the clamping rod 231, further preventing the semiconductor chip 4 from any displacement or loosening during the test. After clamping and pressing are completed, the semiconductor chip 4 is electrically contacted with the probe on the base 1 to achieve stable electrical performance testing. After the test is completed, the transmission system is automatically reset by hydraulic or gas reflux, and the pressing mechanism 31 and the clamping component 23 release the semiconductor chip 4 at the same time to prepare for the next operation.

[0057] The above embodiments only express one or several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A high-stability semiconductor testing device, comprising a base (1) and a cover (3) rotatably disposed on the base (1), characterized in that: A pressing mechanism (31) is provided on the cover plate (3); after the cover plate (3) is rotated and fastened with the base (1), a certain gap is provided between the pressing mechanism (31) and the semiconductor chip (4) on the base (1); the pressing mechanism (31) comprises a pressing block (311) that can move along the height direction of the base (1); The base (1) is provided with a limiting groove (21) that matches the semiconductor chip (4); Rotatable pressing components (22) are provided on both sides of the limiting groove (21), and the two pressing components (22) are arranged in a mirror-symmetrical state; when the pressing block (311) moves downward toward the semiconductor chip (4), it can drive the two pressing components (22) to rotate, thereby applying pressure to the top two sides of the semiconductor chip (4); A clamping assembly (23) capable of sliding in a horizontal direction is disposed on the sides of the two pressing assemblies (22). The two clamping assemblies (23) are used to clamp the two sides of the semiconductor chip (4). When the pressing assemblies (22) rotate, the clamping assemblies (23) can be driven to approach and press against the two sides of the semiconductor chip (4).

2. A high stability semiconductor testing device according to claim 1, characterized in that: A receiving groove (11) is provided in the base (1), a limiting frame (2) matched therewith is installed in the receiving groove (11), the limiting groove (21) is provided on the limiting frame (2), two pressing components (22) and two clamping components (23) are both provided on the limiting frame (2), a transmission component (12) connected to the pressing component (22) is provided on the base (1), and the transmission component (12) is used to drive the clamping component (23) to move.

3. A high stability semiconductor testing device according to claim 2, characterized in that: Both sides of the limit frame (2) are provided with mounting grooves (221), and the pressing assembly (22) comprises a support shaft (2211) and a pressing rod (2212), the support shaft (2211) being rotatably arranged in the mounting groove (221) in a horizontal state, the pressing rod (2212) being sleeved on the support shaft (2211), and a bending portion (22121) being deflected toward the semiconductor chip (4) is provided at the top of the pressing rod (2212).

4. A high stability semiconductor testing device according to claim 3, characterized in that: The clamping assembly (23) comprises two clamping rods (231) that can slide in a horizontal direction. The two clamping rods (231) are respectively located on two sides of the pressing assembly (22). Two mounting holes (24) that match the clamping rods (231) are provided in the limiting frame (2). A first limiting plate (232) is provided at one end of the clamping rod (231) close to the semiconductor chip (4). The clamping rod (231) is provided with a first elastic member (233) for driving the clamping rod (231) to telescopically move in the mounting hole (24).

5. A high stability semiconductor testing device according to claim 4, characterized in that: The transmission assembly (12) comprises an E-shaped flow channel (121), wherein a fluid medium is arranged in the flow channel (121), and a first piston rod (1211) is arranged in the middle of the flow channel (121) and is transmission-connected to the lower pressure rod (2212), and the two ends of the flow channel (121) are respectively connected to the two mounting holes (24) on the limit frame (2), and the two ends of the flow channel (121) are provided with a second piston rod (1212) for driving the clamping rod (231), and the retraction of the first piston rod (1211) will drive the two second piston rods (1212) to move out synchronously through the fluid medium.

6. A high stability semiconductor testing device according to claim 5, characterized in that: The lower pressure rod (2212) is fixedly connected to an inclined guide plate (22122); the mounting groove (221) is provided with a sliding rod (2213) capable of sliding in a horizontal direction; the sliding rod (2213) is butted against a first piston rod (1211) in the middle of the flow channel (121); a roller (22131) is provided at one end of the sliding rod (2213) close to the lower pressure rod (2212); the roller (22131) and the guide plate (22122) are in rolling engagement; and a second elastic member (22132) is provided between the sliding rod (2213) and the inner wall of the mounting groove (221) for driving the end of the sliding rod (2213) to always be in contact with the guide plate (22122).

7. A high stability semiconductor testing device according to claim 3, characterized in that: The pressing mechanism (31) further comprises two elastic telescopic rods (312). After the cover plate (3) and the base (1) are buckled, the two elastic telescopic rods (312) are respectively located above the two pressing rods (2212). The two elastic telescopic rods (312) are both transmission-connected to the pressing block (311). The elastic telescopic rods (312) drive the pressing rods (2212) to rotate by rotating.

8. A high stability semiconductor testing device according to claim 7, characterized in that: The lower pressing block (311) is a conical structure. Two transmission blocks (313) capable of sliding radially along the lower pressing block (311) are arranged on both sides of the lower pressing block (311) in the cover plate (3). The transmission blocks (313) are elastically connected to the inner wall of the cover plate (3). The two transmission blocks (313) are slidably matched with the lower pressing block (311). Two U-shaped connecting pieces (3131) are arranged below the transmission blocks (313). A connecting rod (3121) rotatably matched with the two U-shaped connecting pieces (3131) is arranged at the top end of the elastic telescopic rod (312). The transmission block (313) can drive the elastic telescopic rod (312) to rotate through the two U-shaped connecting pieces (3131) and the connecting rod (3121).

9. A high stability semiconductor testing device according to any one of claims 1 to 8, characterized in that: A pressure sensor (3111) is provided at the bottom of the lower pressing block (311).

10. A high stability semiconductor testing device according to any one of claims 1 to 8, characterized in that: The lower pressing block (311) is provided with a threaded rod (3112), which passes through the cover plate (3) and is threadably engaged with the cover plate (3).

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