Integrated miniature optical fiber reflection substrate and manufacturing method thereof

Abstract

The invention discloses an integrated miniature optical fiber reflection substrate and a manufacturing method thereof, belongs to the technical field of optical fiber reflection substrates, and solves the problems that the performance of an optical fiber reflector is influenced and the stable operation of an optical fiber communication and optical fiber sensing system is threatened. Comprising a substrate, a rectangular groove is formed in the substrate, a V-shaped groove located at the tail end of the rectangular groove is formed in the substrate, the rectangular groove is perpendicular to the V-shaped groove, the tail end of the rectangular groove does not exceed the groove bottom of the V-shaped groove, the inner wall of the V-shaped groove is arranged to be a reflecting surface, an optical fiber is arranged in the rectangular groove, and the rectangular groove is filled with UV epoxy glue to fix the optical fiber. The structure is miniaturized, glue filling and air gaps in a light path are reduced, the influence on optical performance is reduced, the application range is wider, the device integration degree is higher, the rectangular fixing groove is high in precision, the optical fiber fixing reliability is higher, a reflecting surface and a substrate are integrated, the stability and precision of a reflected light beam are improved, displacement of the reflected light beam is prevented, and the device is suitable for large-scale popularization and application. Therefore, accurate reflection of light is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of optical fiber reflective substrates, and in particular to an integrated micro optical fiber reflective substrate and a manufacturing method thereof. Background Art

[0002] Fiber optic reflectors are a type of equipment specifically used in fiber optic communications and optical systems. They are usually used to adjust the propagation path of optical signals or control the reflection characteristics of signals. It consists of two parts: an optical fiber and a reflector. The optical fiber reflects or scatters the optical signal through the reflector, changing the direction or characteristics of the light beam. It is usually used in fiber optic sensing, fiber lasers, and fiber optic transmission systems. In fiber optic communications, the main function of a fiber optic reflector is to achieve signal reflection or signal enhancement. It can effectively reflect the optical signal back to the source end, thereby increasing the signal strength or adjusting the transmission path. The working principle of a fiber optic reflector is based on the law of reflection of light, that is, the angular relationship between the incident light and the reflected light. By precisely designing the shape and material of the reflector, it can be efficiently reflected within a specific wavelength range. Common fiber optic reflectors are of two types: fixed reflectors and adjustable reflectors. The former is usually used in stable optical systems, while the latter is used in situations where dynamic adjustment is required. With the continuous development of fiber optic technology, fiber optic reflectors play a vital role in many high-precision optical measurements, laser equipment, and sensing systems.

[0003] It can be seen that fiber optic reflectors play a vital role in the fields of fiber optic communications and fiber optic sensing. Their main function is to guide the light in the optical path for reflection.

[0004] Currently, the fiber optic reflectors used in these fields achieve internal reflection of light by gluing a reflective lens at the end of the optical fiber. However, this structure has some potential problems. For example, the glue filling or air gap that may exist in the optical path, as well as the slight displacement of the reflective lens, may affect the optical performance and reliability of the device.

[0005] Glue filling in optical components is usually used to fix lenses or ensure structural stability. However, the refractive index of glue is different from that of lenses. If the refractive index of glue does not match that of lens material, it will cause light to refract when passing through the contact area, changing the propagation direction or focus of light, thereby affecting the optical effect of the reflector. In addition, the transparency, stability and durability of glue will also affect the long-term performance of the reflector. For example, glue may age, turn yellow or foam during long-term use, which will cause light scattering and reduce the reflection efficiency of the reflector.

[0006] Air gaps can cause light scattering and reflection losses, especially when there is a large air gap between the reflector and other optical components. The refractive index of air itself is low, and it differs greatly from the refractive index of other optical components. When light passes through such gaps, it is easy to refract and deflect, causing light propagation loss or inaccurate focus. This not only reduces the efficiency of the optical system, but can also cause image blur or signal attenuation.

[0007] Any slight displacement of the reflector will change the path of the reflected light and affect its original optical path. Especially in precision optical systems, slight displacement may cause the focusing deviation of the light beam or the change of the reflection angle, making the working effect of the optical system unstable or inaccurate. For example, micro-displacement in laser and fiber-optic communication systems may cause signal loss, increased system noise or transmission errors. Therefore, the precise positioning of the reflector is crucial to ensure the optical performance of the system.

[0008] Therefore, during the manufacturing process, the optical fiber is first bonded and fixed through a ceramic ferrule. This step usually uses epoxy resin glue, but this glue will produce large stress when curing. During subsequent processing, transportation and use, this stress is likely to cause cracks in the bonding interface between the epoxy resin glue and the optical fiber coating glue. These cracks will significantly reduce the bending resistance of the fiber optic reflector pigtail, and in severe cases may even cause the entire device to fail. Therefore, these problems not only affect the performance of the fiber optic reflector, but also pose a threat to the stable operation of fiber optic communication and fiber optic sensing systems.

[0009] Therefore, an integrated micro optical fiber reflective substrate and a manufacturing method thereof are proposed to solve or alleviate the above problems. Summary of the invention

[0010] The purpose of the present invention is to solve the shortcomings of the prior art and to propose an integrated micro-optical fiber reflective substrate and a manufacturing method thereof.

[0011] In order to achieve the above object, the present invention adopts the following technical solutions:

[0012] An integrated micro-fiber reflective substrate comprises a substrate, wherein a rectangular groove is provided on the substrate, a V-shaped groove is provided on the substrate at the end of the rectangular groove, the rectangular groove is vertically arranged to the V-shaped groove, the end of the rectangular groove does not exceed the groove bottom of the V-shaped groove, the inner wall of the V-shaped groove is arranged as a reflective surface, the rectangular groove is used to arrange an optical fiber, and the rectangular groove is used to fill UV epoxy glue to fix the optical fiber.

[0013] The present invention also provides a method for manufacturing an integrated micro-optical fiber reflective substrate, which is used to manufacture the integrated micro-optical fiber reflective substrate as described above, comprising the following steps:

[0014] S1 coating, coating the photoresist uniformly on the surface of the substrate by spin coating;

[0015] S2 exposure, pre-baking the substrate after the glue coating, sending the pre-baking substrate into the exposure machine and exposing it through the mask to generate a rectangular groove pattern on the substrate;

[0016] S3 development, developing the exposed substrate to remove the photoresist at the rectangular groove pattern and form a rectangular groove on the substrate;

[0017] S4 etching, etching the rectangular groove of the developed substrate;

[0018] S5 thinning, thinning the etched substrate to reduce the thickness from 725 μm to less than 225 μm;

[0019] S6 constructs a reflective surface, cutting a V-shaped groove perpendicular to the rectangular groove on the thinned substrate, and the end of the rectangular groove does not exceed the bottom of the V-shaped groove;

[0020] S7 reflective surface polishing, polishing the reflective surface to control the roughness of the reflective surface to less than 10nm;

[0021] S8 package, push the optical fiber into the rectangular groove and fill the rectangular groove with UV epoxy glue to fix the optical fiber.

[0022] Preferably, the S1 coating is to evenly coat the photoresist on the substrate surface by spin coating, comprising the following steps:

[0023] Dropping photoresist on the center of the substrate surface in a clean room;

[0024] The substrate is rotated to form a photoresist film on the surface of the substrate by spin coating, and the thickness of the photoresist film is 2-6 μm.

[0025] Preferably, the S2 exposure, performing a pre-baking treatment on the substrate after the glue coating, sending the substrate after the pre-baking treatment into an exposure machine and exposing it through a mask, generating a rectangular groove pattern on the substrate, comprises the following steps:

[0026] The glue-coated substrate is placed in an oven for soft baking to complete the pre-baking process;

[0027] After the pre-baking treatment, the substrate is placed in an exposure machine, and the pattern of the rectangular groove is projected onto the photoresist through the mask;

[0028] The photoresist is exposed to light of a specific wavelength to form a pattern of rectangular grooves with a length of 4500 μm and a width of 130 μm.

[0029] Preferably, the rectangular groove has a length of 4500 μm, a width of 130 μm and a groove depth of 3 μm.

[0030] Preferably, the step S6 of constructing the reflective surface includes cutting a V-shaped groove perpendicular to the rectangular groove on the thinned substrate, and the end of the rectangular groove does not exceed the bottom of the V-shaped groove, and includes the following steps:

[0031] The thinned substrate is temporarily bonded to an 8-inch quartz wafer;

[0032] Fix the quartz wafer bonded with the substrate on the workbench of the dicing machine by vacuum adsorption or clamping;

[0033] A V-shaped groove perpendicular to the rectangular groove is cut on the substrate by a dicing machine, and the end of the rectangular groove does not exceed the bottom of the V-shaped groove. The thickness of the ultra-thin circular saw blade in the dicing machine is 200 μm.

[0034] Preferably, the step S7 of polishing the reflecting surface, polishing the reflecting surface to control the roughness of the reflecting surface to be less than 10 nm, comprises the following steps:

[0035] The substrate with the reflective surface is immersed in a silica suspension polishing liquid to polish the reflective surface, and the roughness of the reflective surface is controlled to be less than 10nm;

[0036] The reflective surface is coated according to the different reflected wavelengths.

[0037] Preferably, the method further includes S7.5.1 dicing, in which the polished substrate is diced and divided into each unit.

[0038] Preferably, S7.5.2 is also included to perform a size test on each unit after slicing, with the edge size error controlled within ±0.5μm, the reflection surface angle controlled within ±0.5°, the rectangular groove width error controlled within ±2μm, and the rectangular groove depth error controlled within ±10μm.

[0039] Preferably, it also includes S8.5, secondary test, performing light transmission test on the packaged product;

[0040] S9 warehousing: numbering, packaging, and warehousing of qualified products.

[0041] The present invention has the following beneficial effects:

[0042] 1. The structure of the present invention is miniaturized, which reduces the glue filling and air gap in the optical path to reduce the impact on optical performance, has a wider application range, and makes the device more integrated;

[0043] 2. High-precision rectangular fixing groove, higher reliability of optical fiber fixing;

[0044] 3. The reflective surface is integrated with the substrate to improve the stability and accuracy of the reflected light beam and prevent it from shifting, thus ensuring accurate reflection of the light;

[0045] 4. Wafer batch production can be used to improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0047] Figure 1 It is a schematic structural diagram of the integrated micro optical fiber reflective substrate in the present invention;

[0048] Figure 2 It is a schematic diagram of assembling the integrated micro optical fiber reflective substrate of the present invention;

[0049] Figure 3 It is a flowchart of the method for manufacturing the integrated micro optical fiber reflective substrate of the present invention;

[0050] Figure 4 Schematic diagram of wafer manufacturing for the integrated micro-optical fiber reflective substrate in the invention.

[0051] 1. Substrate; 2. Reflection surface; 3. Rectangular groove; 4. Optical fiber. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0053] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0055] In the description of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the invention is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0056] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0057] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] Integrated micro-fiber reflective substrate, such as Figure 1 and Figure 2 As shown, it includes a substrate 1, a rectangular groove 3 is opened on the substrate 1, a V-shaped groove is opened on the substrate 1 at the end of the rectangular groove 3, the rectangular groove 3 is vertically arranged to the V-shaped groove, the end of the rectangular groove 3 does not exceed the bottom of the V-shaped groove, the inner wall of the V-shaped groove is arranged as a reflecting surface 2, the rectangular groove 3 is used to arrange the optical fiber 4, and the rectangular groove 3 is used to fill UV epoxy glue to fix the optical fiber 4, and the specifications of the rectangular groove 3 are 4500μm in length, 130μm in width, and 3μm in depth.

[0059] The integrated micro optical fiber 4 reflective substrate structure is miniaturized, and glue filling and air gaps in the optical path are reduced to reduce the impact on optical performance. The high-precision rectangular groove 3 has a higher reliability in fixing the optical fiber 4. The reflective surface 2 is integrated with the substrate 1 to improve the stability and accuracy of the reflected light beam and prevent it from shifting, thereby ensuring accurate reflection of light.

[0060] The present invention also provides a method for manufacturing an integrated micro optical fiber 4 reflective substrate. Figure 3 As shown, the manufacturing method of the above integrated micro optical fiber 4 reflective substrate includes the following steps:

[0061] S1 coating, coating the surface of substrate 1 with photoresist uniformly by spin coating, S1 coating, coating the surface of substrate 1 with photoresist uniformly by spin coating, comprising the following steps: dripping photoresist on the center of the surface of substrate 1 in a clean room; rotating substrate 1 to form a photoresist film on the surface of substrate 1 by spin coating, wherein the thickness of the photoresist film is 2-6 μm;

[0062] The photoresist solution will be dropped onto the center of the silicon wafer, and then the substrate 1 will rotate at high speed, so that the photoresist solution is evenly distributed on the entire surface of the substrate 1 under the action of centrifugal force, and a thin and uniform photoresist film is formed. The speed and time of spin coating will affect the thickness of the photoresist film.

[0063] S2 exposure, pre-baking the substrate 1 after the glue coating, sending the substrate 1 after the pre-baking treatment into the exposure machine and exposing it through the mask, generating a rectangular groove 3 pattern on the substrate 1, S2 exposure, pre-baking the substrate 1 after the glue coating, sending the substrate 1 after the pre-baking treatment into the exposure machine and exposing it through the mask, generating a rectangular groove 3 pattern on the substrate 1, including the following steps: placing the substrate 1 after the glue coating in an oven for soft baking to complete the pre-baking treatment; placing the substrate 1 after the pre-baking treatment in the exposure machine, projecting the pattern of the rectangular groove 3 onto the photoresist through the mask; exposing the photoresist using light of a specific wavelength to form a rectangular groove 3 pattern with a length of 4500μm and a width of 130μm;

[0064] After spin coating, substrate 1 would be placed in a baking oven and soft-baked usually, and the purpose is to allow solvent volatilization, make the photoresist layer more stable, and reduce the deformation in the subsequent exposure process. Substrate 1 would be placed in an exposure machine, and by mask or photomask, required pattern would be projected onto the photoresist, and exposed with the light of specific wavelength (such as ultraviolet light). The exposure process would cause the chemical property of the photoresist to change. In the present embodiment, the pattern shape of the mask is 4500 microns long, 130 microns wide rectangle, 3000 microns horizontally at intervals of the rectangle, 6000 microns vertically at intervals, the mask is positioned above the silicon chip of the glue coating, and ultraviolet light is irradiated on the glue coating silicon chip by the pattern of the rectangular area, making one by one 4500 microns long, 130 microns wide photoresist denaturation of the rectangular area.

[0065] S3 development, developing the exposed substrate 1, removing the photoresist at the rectangular groove 3 pattern and forming the rectangular groove 3 on the substrate 1;

[0066] The exposed substrate 1 needs to be treated with a developer, which will dissolve the exposed photoresist. After development, rectangular grooves 3 with a length of 4500 microns, a width of 130 microns, and a depth of about 3 μm will be left on the substrate 1.

[0067] S4 etching, etching the rectangular groove 3 of the developed substrate 1, using a reactive ion etcher to etch the rectangular groove 3 area, the etching depth is adjusted according to the type of optical fiber 4, taking a common single-mode optical fiber 4 with a diameter of 125 μm as an example, the etching depth is controlled between 130-140 μm;

[0068] Dry etching is a technology used to remove materials from the surface of a wafer in semiconductor manufacturing. Compared with wet etching, it mainly relies on gas chemicals and plasma to achieve material removal. Radio frequency energy is used to generate an electric field in the reaction chamber. Under the action of the electric field, gas molecules are decomposed into charged particles (such as ions and free electrons) and neutral atoms to form plasma. The charged particles in the plasma will accelerate to move toward the surface of the wafer under the action of the electric field. The developed substrate 1 is placed in the dry etching chamber, and the high-speed plasma gas impacts the surface of the substrate 1 from top to bottom. After physical impact and chemical reaction, the photoresist on the silicon wafer and the exposed silicon in the rectangular area with a length of 4500 microns and a width of 130 microns are stripped, that is, the 3-micron thick photoresist and the silicon in the rectangular area are both being stripped, and the stripping speeds of the two are different. By controlling the etching time, only the silicon in the rectangular area can be etched to the desired depth, and finally the excess photoresist on the substrate 1 is washed away.

[0069] S5 thinning, thinning the etched substrate 1 to reduce the thickness from 725 μm to less than 225 μm;

[0070] "Thinning" refers to the removal of a portion of the material on the back of the chip by physical or chemical methods to reduce the thickness of the chip. It is done by using a grinding wheel with diamond particles, rotating under high pressure and contacting the chip to remove the material on the back of the chip. The original thickness of the 8-inch substrate 1 is 725 microns. According to different customer needs, the back of the substrate 1 (the side without the processed pattern) is mechanically ground by a diamond grinding wheel to control the substrate 1 to the desired size.

[0071] S6 constructs the reflecting surface 2, cuts a V-shaped groove perpendicular to the rectangular groove 3 on the thinned substrate 1, and the end of the rectangular groove 3 does not exceed the bottom of the V-shaped groove, S6 constructs the reflecting surface 2, cuts a V-shaped groove perpendicular to the rectangular groove 3 on the thinned substrate 1, and the end of the rectangular groove 3 does not exceed the bottom of the V-shaped groove, including the following steps, such as Figure 4 As shown, the thinned substrate 1 is temporarily bonded to an 8-inch quartz wafer; the quartz wafer bonded with the substrate 1 is fixed on the workbench of the dicing machine by vacuum adsorption or clamping; a V-shaped groove perpendicular to the rectangular groove 3 is cut on the substrate 1 at the end of the rectangular groove 3 by the dicing machine, and the end of the rectangular groove 3 does not exceed the bottom of the V-shaped groove. The thickness of the ultra-thin circular saw blade in the dicing machine is 200 μm, wherein the angle of the V-shaped groove can be adjusted according to the different angles of the reflected light;

[0072] The dicing machine is a key device used to divide the complete wafer into individual chips in the semiconductor packaging process. First, the wafer will be placed on the workbench of the dicing machine and fixed by vacuum adsorption or clamps to ensure that it will not move during the cutting process. The dicing machine uses an ultra-thin circular saw blade with diamond particles for cutting. The diameter of the saw blade is usually very small to ensure that the cutting path is as narrow as possible, thereby maximizing the number of chips that can be produced per wafer. In this embodiment, an ultra-thin saw blade with a thickness of 200 microns is used and the angle of the front end of the saw blade is trimmed to 90 degrees. By precisely controlling the feed speed of the saw blade and the pressure on the wafer, cutting is performed along the end of the rectangular groove 3 of the substrate 1, and the cutting depth is controlled at 130-150 microns. A 90-degree V-groove will be formed in the area cut by the blade.

[0073] S7 polishing the reflective surface 2, polishing the reflective surface 2, and controlling the roughness of the reflective surface 2 to be less than 10nm, S7 polishing the reflective surface 2, polishing the reflective surface 2, and controlling the roughness of the reflective surface 2 to be less than 10nm, including the following steps: immersing the substrate 1 with the reflective surface constructed in a silica suspension polishing liquid to polish the reflective surface 2, and controlling the roughness of the reflective surface 2 to be less than 10nm; coating the reflective surface 2 according to different reflected wavelengths;

[0074] The dicing machine blade is constructed with a 90-degree V-groove, one of which is 45 degrees to the rectangular groove 3, which can reflect the light in the optical fiber 4 in the rectangular groove 3 at 45 degrees. However, the reflective surface 2 is too rough to form a mirror reflection. By immersing it in a silica suspension polishing liquid, the silica in the suspension can continuously rub the reflective surface 2, thereby continuously removing the extremely small raised parts on the surface to achieve a mirror effect. Depending on the wavelength of the reflection, the reflective surface can be coated to improve the reflectivity, which can be increased to more than 99.5%.

[0075] S7.5.1 scribing, scribing and dividing the polished substrate 1 into each unit;

[0076] The dicing machine is a key device used to divide the complete wafer into individual chips in the semiconductor packaging process. After the wafer is manufactured, it is usually a whole piece with many circuits with the same functions integrated on it. In order to facilitate packaging and use, these circuits need to be divided into independent chips, and the reflective substrate on the substrate 1 is cut according to the size of 3000X6000 microns.

[0077] S7.5.2 Once tested, the size of each unit after dicing shall be tested, and the edge size error shall be controlled within ±0.5μm, the angle of the reflective surface 2 shall be controlled within the range of ±0.5°, the width error of the rectangular groove 3 shall be controlled within ±2μm, and the depth error of the rectangular groove 3 shall be controlled within ±10μm. The size of the diced product shall be measured under a high-precision measuring microscope;

[0078] S8 packaging, pushing the optical fiber 4 into the rectangular groove 3 and filling the rectangular groove 3 with UV epoxy glue to fix the optical fiber 4;

[0079] The qualified products are packaged, and the optical fiber 4 and the substrate 1 are packaged on the 13-axis adjustment coupling table. The optical fiber 4 is pushed along the rectangular groove 3 and stops in front of the reflective surface 2. The optical fiber 4 is fixed to the substrate 1 with UV epoxy glue in the guide groove of the optical fiber 4. The filling amount of the UV epoxy glue is controlled so that the glue covers the entire rectangular groove 3 without overflowing to the end face of the optical fiber 4. The optical fiber 4 is fixed to the rectangular groove 3. The other end of the optical fiber 4 is connected to the light source. The light passes through the optical fiber 4 and hits the 45-degree reflective surface 2 to realize the change of the optical path.

[0080] S8.5, secondary test, conduct light transmission test on the packaged products;

[0081] S9 warehousing: numbering, packaging, and warehousing of qualified products.

[0082] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An integrated micro optical fiber reflective substrate, characterized in that: The invention comprises a substrate (1), wherein a rectangular groove (3) is provided on the substrate (1), wherein a V-shaped groove is provided on the substrate (1) and is located at the end of the rectangular groove (3), wherein the rectangular groove (3) is arranged perpendicular to the V-shaped groove, wherein the end of the rectangular groove (3) does not exceed the bottom of the V-shaped groove, wherein the inner wall of the V-shaped groove is arranged as a reflecting surface (2), wherein an optical fiber (4) is arranged in the rectangular groove (3), and wherein the rectangular groove (3) is filled with UV epoxy glue to fix the optical fiber (4).

2. A method for manufacturing an integrated micro-fiber reflective substrate, for manufacturing an integrated micro-fiber reflective substrate as claimed in claim 1, characterized in that: The following steps are included: S1 coating, uniformly coating the photoresist on the surface of the substrate (1) by spin coating; S2 exposure, performing a pre-baking treatment on the substrate (1) after the glue coating, sending the substrate (1) after the pre-baking treatment into an exposure machine and exposing it through a mask, thereby generating a rectangular groove (3) pattern on the substrate (1); S3 development, developing the exposed substrate (1), removing the photoresist at the rectangular groove (3) pattern and forming the rectangular groove (3) on the substrate (1); S4 etching, etching the rectangular groove (3) of the developed substrate (1); S5 thinning, thinning the etched substrate (1) to reduce the thickness from 725 μm to less than 225 μm; S6: constructing a reflective surface (2), cutting a V-shaped groove perpendicular to the rectangular groove (3) on the thinned substrate (1), and the end of the rectangular groove (3) does not exceed the bottom of the V-shaped groove; S7: polishing the reflection surface (2), polishing the reflection surface (2) to control the roughness of the reflection surface (2) to be less than 10 nm; S8 packaging, pushing the optical fiber (4) into the rectangular groove (3) and filling the rectangular groove (3) with UV epoxy glue to fix the optical fiber (4).

3. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 2, characterized in that: The S1 coating is to evenly coat the surface of the substrate (1) with photoresist by spin coating, and comprises the following steps: Dropping photoresist onto the center of the surface of a substrate (1) in a clean room; The substrate (1) is rotated to form a photoresist film on the surface of the substrate (1) by spin coating, wherein the thickness of the photoresist film is 2-6 μm.

4. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 2, characterized in that: The S2 exposure is to perform a pre-baking treatment on the substrate (1) after the glue coating, and then the substrate (1) after the pre-baking treatment is sent into an exposure machine and exposed through a mask to generate a rectangular groove (3) pattern on the substrate (1), including the following steps: Placing the glue-coated substrate (1) in an oven for soft baking to complete the pre-baking process; The substrate (1) after the pre-baking treatment is placed in an exposure machine, and the pattern of the rectangular groove (3) is projected onto the photoresist through a mask; The photoresist is exposed to light of a specific wavelength to form a pattern of rectangular grooves (3) with a length of 4500 μm and a width of 130 μm.

5. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 2, characterized in that: The specifications of the rectangular groove (3) are 4500 μm in length, 130 μm in width and 3 μm in depth.

6. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 2, characterized in that: The S6 constructs the reflective surface (2), cuts a V-shaped groove perpendicular to the rectangular groove (3) on the thinned substrate (1), and the end of the rectangular groove (3) does not exceed the bottom of the V-shaped groove, comprising the following steps: Temporarily bonding the thinned substrate (1) to an 8-inch quartz wafer; Fixing the quartz wafer bonded with the substrate (1) on a workbench of a dicing machine by vacuum adsorption or clamping; A V-shaped groove arranged perpendicular to the rectangular groove (3) is cut on the substrate (1) at the end of the rectangular groove (3) by a dicing machine, and the end of the rectangular groove (3) is arranged not to exceed the bottom of the V-shaped groove. The thickness of the ultra-thin circular saw blade in the dicing machine is 200 μm.

7. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 2, characterized in that: The S7 reflecting surface (2) polishing includes polishing the reflecting surface (2) to control the roughness of the reflecting surface (2) to be less than 10 nm, comprising the following steps: The substrate (1) having the reflective surface structured is immersed in a silica suspension polishing liquid to polish the reflective surface (2), and the roughness of the reflective surface (2) is controlled to be less than 10 nm; The reflective surface (2) is coated according to different reflected wavelengths.

8. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 7, characterized in that: The process also includes S7.5.1 dicing, which is to dicing the polished substrate (1) into each unit.

9. The method for manufacturing an integrated micro-optical fiber reflective substrate according to claim 8, characterized in that: It also includes a test in S7.5.2, which performs a size test on each unit after slicing. The edge size error is controlled within ±0.5μm, the angle of the reflection surface (2) is controlled within the range of ±0.5°, the width error of the rectangular groove (3) is controlled within ±2μm, and the depth error of the rectangular groove (3) is controlled within ±10μm.

10. The method for manufacturing an integrated micro optical fiber reflective substrate according to claim 9, characterized in that: It also includes S8.5, secondary test, which is to conduct light transmission test on the packaged products; S9 warehousing: numbering, packaging, and warehousing of qualified products.

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