Package substrate magnetic embedding method and package substrate

Abstract

The invention discloses a packaging substrate magnet burying method and a packaging substrate. The magnetic embedding method for the packaging substrate comprises the following steps: S100, forming a first mounting hole in a core plate; s200, filling the first mounting hole with a magnetic material and carrying out curing treatment to form a magnetic core; s300, forming a second mounting hole in the core plate, wherein the second mounting hole penetrates through the magnetic core; s400, carrying out copper deposition and electroplating treatment on the core plate; s500, the second mounting hole is filled with a resin material, and curing treatment is carried out; and S600, carrying out copper deposition and electroplating treatment on the core plate. According to the packaging substrate magnetic embedding method, the flexible magnetic material is embedded, so that the magnetic material is efficiently embedded into the packaging substrate, and remarkable performance improvement and efficiency optimization are realized. The requirement of embedding of the magnetic material on the precision of a mounting hole is low, the attaching effect of the magnetic material and the hole wall is good, a gap is not prone to being generated between the magnetic core and the hole wall, and therefore the good electromagnetic anti-interference effect is achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a packaging substrate embedding method and a packaging substrate. Background Art

[0002] As the integrated circuit field develops towards miniaturization, integration and intelligence, the continuously decreasing chip size and increasingly complex chip functions make Moore's Law increasingly difficult to develop. As an important electronic technology in the chip industry, microsystem technology has been continuously developed and increasingly widely used.

[0003] With the rapid development of electronic technology, the requirements for packaging substrates are increasing, especially in terms of high-frequency, high-speed signal transmission and electromagnetic compatibility. In traditional methods, the magnetic core is often a finished product, and the magnetic core is buried in the hole on the core board after opening a hole on the core board. However, due to manufacturing errors in the magnetic core and processing errors in the opening of the hole, the embedding process of the magnetic core often faces problems such as insufficient precision, weak bonding force, and easy generation of gaps, which affects the overall performance and reliability of the substrate. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a method for embedding magnets in a packaging substrate, wherein the embedding of the magnetic material has low requirements on the precision of the mounting hole, has a good bonding effect with the hole wall, and is unlikely to produce a gap between the magnetic core and the hole wall, and has a good electromagnetic anti-interference effect.

[0005] The present invention also provides a packaging substrate manufactured by the packaging substrate embedding method.

[0006] According to the first aspect of the present invention, the method for embedding magnets in a packaging substrate comprises the following steps:

[0007] S100, forming a first mounting hole on the core plate;

[0008] S200, filling the first mounting hole with magnetic material and performing a curing process to form a magnetic core;

[0009] S300, forming a second mounting hole on the core plate, wherein the second mounting hole passes through the magnetic core;

[0010] S400, performing copper deposition and electroplating treatment on the core board;

[0011] S500, filling the second mounting hole with a resin material and performing a curing process;

[0012] S600, performing copper deposition and electroplating treatment on the core board.

[0013] The method for embedding magnets in a packaging substrate according to an embodiment of the present invention has at least the following beneficial effects:

[0014] The packaging substrate embedding method of the embodiment of the present application embeds flexible magnetic materials to efficiently embed magnetic materials inside the packaging substrate, thereby achieving significant performance improvement and efficiency optimization. The embedding of the magnetic material has low requirements on the precision of the mounting hole, and has a good fit with the hole wall. It is not easy to generate a gap between the magnetic core and the hole wall, thereby having a good electromagnetic anti-interference effect.

[0015] According to some embodiments of the present invention, before step S100, the following steps are also included:

[0016] S10, forming a third mounting hole on the core plate;

[0017] S20, performing copper deposition and electroplating treatment on the core board;

[0018] S30, filling the third mounting hole with resin material and performing a curing process.

[0019] According to some embodiments of the present invention, between step S400 and step S500, the following steps are further included:

[0020] S410, forming a third mounting hole on the core plate;

[0021] S420, performing copper deposition and electroplating treatment on the core board.

[0022] According to some embodiments of the present invention, between step S200 and step S300, the following steps are further included:

[0023] S210, performing copper deposition and electroplating treatment on the core board;

[0024] S220, forming a third mounting hole on the core plate.

[0025] According to some embodiments of the present invention, between step S200 and step S300, the following steps are further included:

[0026] S210, performing copper deposition and electroplating treatment on the core board;

[0027] S220, forming a third mounting hole on the core plate;

[0028] S230, performing copper deposition and electroplating treatment on the core board.

[0029] According to some embodiments of the present invention, after step S230, the following steps are further performed:

[0030] S240, forming fourth mounting holes on the core board, performing copper deposition and electroplating processes on the core board, and repeating the punching, copper deposition and electroplating processes until the number of the fourth mounting holes reaches a set number.

[0031] According to some embodiments of the present invention, in step S500, a resin material is filled into the second mounting hole and the third mounting hole.

[0032] According to some embodiments of the present invention, after the mounting holes on the core board are filled with materials, they are required to undergo curing, brushing and leveling processes.

[0033] According to some embodiments of the present invention, the packaging substrate embedding method further includes the following steps:

[0034] S700, forming a conductive pattern on the outermost copper layer;

[0035] S800, performing a layer-building operation on the core board, and forming a conductive pattern on the newly added copper layer, wherein the conductive patterns of adjacent copper layers are electrically connected.

[0036] According to the packaging substrate of the second aspect of the present invention, the packaging substrate is manufactured by the packaging substrate embedding method described in any one of the above embodiments.

[0037] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0039] Figure 1 This is a schematic diagram of a process of Embodiment 1 of the present invention;

[0040] Figure 2 This is a schematic diagram of the packaging substrate structure of the first embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of the process of Embodiment 2 of the present invention;

[0042] Figure 4 This is a schematic diagram of the packaging substrate structure of the second embodiment of the present invention;

[0043] Figure 5 This is a schematic diagram of the process of Embodiment 3 of the present invention;

[0044] Figure 6 This is a schematic diagram of the packaging substrate structure of the third embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of a flow chart of Embodiment 4 of the present invention;

[0046] Figure 8 This is a schematic diagram of the packaging substrate structure of embodiment 4 of the present invention.

[0047] Reference numerals:

[0048] Core board 100 ; first mounting hole 110 ; magnetic material 115 ; second mounting hole 120 ; third mounting hole 130 ; resin material 140 ; ​​first copper layer 150 ; second copper layer 160 ; third copper layer 170 ; fourth copper layer 180 . DETAILED DESCRIPTION

[0049] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0050] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0051] In the description of the present invention, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0052] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0053] In the description of the present invention, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0054] As the integrated circuit field develops towards miniaturization, integration and intelligence, the continuously decreasing chip size and increasingly complex chip functions make Moore's Law increasingly difficult to develop. As an important electronic technology in the chip industry, microsystem technology has been continuously developed and increasingly widely used.

[0055] With the rapid development of electronic technology, the requirements for packaging substrates are increasing, especially in terms of high-frequency, high-speed signal transmission and electromagnetic compatibility. In traditional methods, the magnetic core is often a finished product, and the magnetic core is buried in the hole on the core board after opening a hole on the core board. However, due to manufacturing errors in the magnetic core and processing errors in the opening of the hole, the embedding process of the magnetic core often faces problems such as insufficient precision, weak bonding force, and easy generation of gaps, which affects the overall performance and reliability of the substrate.

[0056] In order to solve the above problems, the present application proposes a method for embedding magnets in a packaging substrate, which includes the following steps:

[0057] Step S100, forming a first mounting hole 110 on the core board 100;

[0058] Specifically, Figure 1 As shown in step S100, the core board 100 is a resin board with double-sided copper cladding, and the first mounting hole 110 is set through the core board 100. The first mounting hole 110 can be drilled by a drilling device or obtained by laser.

[0059] Step S200, filling the first mounting hole 110 with a magnetic material 115 and performing a curing process;

[0060] The magnetic material 115 may be a magnetic paste, which is mainly composed of magnetic powder and polymer materials, and has a certain viscosity and ductility. Compared with liquid, magnetic paste has higher viscosity and slower fluidity; and compared with solid, magnetic paste has greater deformation ability and stronger binding force. Therefore, magnetic paste has no fixed shape and can be deformed when subjected to external pressure.

[0061] After being filled into the first mounting hole 110, the magnetic paste can be adapted to the shape of the first mounting hole 110 after being compressed and deformed and fits tightly with the hole wall of the first mounting hole 110. For example: when the first mounting hole 110 is a square hole, the magnetic paste is in the shape of a square column; when the first mounting hole 110 is a circular hole, the magnetic paste is in the shape of a cylinder. Furthermore, there is no need to worry that the processing error of the first mounting hole 110 will affect the fit between the magnetic material 115 and the hole wall. The introduction of the magnetic paste can adapt to various hole positions and has a good attachment effect. It is understandable that after the filling is completed, the semi-solid magnetic paste needs to be cured to ensure the stability of the magnetic material 115 in the first mounting hole 110. The curing treatment can be hot air drying, infrared heating, etc., so that the semi-solid magnetic paste forms a solid magnetic core.

[0062] Step S300, forming a second mounting hole 120 on the core plate 100, wherein the second mounting hole 120 passes through the magnetic core;

[0063] like Figure 1 As shown, the second mounting hole 120 is arranged through the magnetic core, and two ends thereof respectively penetrate to the two side surfaces of the core plate 100 along the thickness direction to form openings.

[0064] Step S400, copper deposition and electroplating treatment are performed on the core board 100;

[0065] The core board 100 is subjected to copper deposition and electroplating treatment in sequence. In the manufacturing process of the core board 100, it is usually necessary to first perform a copper deposition process and then perform an electroplating process. It should be noted that the copper deposition process is first performed to form a conductive copper layer on the open surface of the core board 100. The copper deposition layer can enhance the adhesion between the electroplated copper layer and the core board 100 substrate in the subsequent process, ensuring that the electroplated copper layer can be firmly attached to the core board 100. At the same time, the copper deposition layer can also provide a uniform deposition surface for the electroplated copper layer, thereby ensuring the uniformity and density of the electroplated copper layer. The electroplating process is used to further thicken the copper layer to form a uniform and dense electroplated copper layer on the open surface of the core board 100, thereby improving the conductivity and reliability of the circuit board.

[0066] It should be noted that the copper deposition layer and the electroplated copper layer are not only formed on the surface of the core board 100. During the copper deposition and electroplating process, the plating solution enters the second mounting hole 120 through the opening on the surface of the core board 100, and forms a copper deposition layer and an electroplated copper layer on the hole wall of the second mounting hole 120, so that a conductive path is formed in the second mounting hole 120 connecting the surface circuits on both sides of the core board 100.

[0067] It is understandable that in order to improve the copper plating effect, the hole wall of the second mounting hole 120 needs to be debonded before copper plating to prevent residual resin slag from affecting the contact between the copper plating solution and the hole wall of the second mounting hole 120.

[0068] Step S500, filling the second mounting hole 120 with a resin material 140 and performing a curing process;

[0069] The second mounting hole 120 is filled with the resin material 140 to avoid affecting the quality of the subsequent lamination process. In addition, the filling resin material 140 can also effectively prevent pollutants from entering the via hole and avoid corrosion, thereby improving the reliability and stability of the circuit board.

[0070] Step S600 , copper deposition and electroplating are performed on the core board 100 .

[0071] It should be noted that, unlike the copper plating and electroplating in step S400, the main purpose of the copper plating and electroplating in step S400 is to form a conductive path on the inner wall of the second mounting hole 120 to achieve electrical connection between different layers of the package substrate and ensure that the current can be smoothly transmitted between the layers. In step S600, the copper plating and electroplating mainly form a copper layer on the surface of the core board 100, which, on the one hand, covers and closes the first mounting hole 110 so that the magnetic core and the resin material 140 are both located in a closed chamber. On the other hand, the copper layer on the surface of the core board 100 can also serve as the etching basis for the subsequent conductive pattern.

[0072] Based on the above, the packaging substrate embedding method of the embodiment of the present application achieves efficient embedding of the magnetic material 115 inside the packaging substrate by embedding the flexible magnetic material 115, thereby achieving significant performance improvement and efficiency optimization. The embedding of the magnetic material 115 has low requirements on the precision of the mounting hole, and has a good fit with the hole wall. It is not easy to generate a gap between the magnetic core and the hole wall, thereby having a good electromagnetic anti-interference effect.

[0073] Furthermore, in the actual production process, there are mounting holes that do not need to be embedded with magnets. Therefore, based on the method for embedding magnets in the packaging substrate in the above embodiment, there are also the following embodiments:

[0074] like Figure 1 and Figure 2 As shown, the packaging substrate embedding method of embodiment 1:

[0075] Step S10, forming a third mounting hole 130 on the core plate 100;

[0076] Specifically, a third mounting hole 130 is drilled through the core board 100 by a process such as a drill or laser, and a glue removal process is performed on the hole wall of the third mounting hole 130 .

[0077] Step S20, copper deposition and electroplating treatment are performed on the core board 100;

[0078] Specifically, for the sake of distinction, step S20 is recorded as the first copper plating process of Example 1. After the first copper plating process, the first copper layer 150 is formed on both sides of the core board 100 along its thickness direction and on the hole wall of the third mounting hole 130 to form a stable conductive path.

[0079] Step S30, filling the third mounting hole 130 with resin material 140 and performing a curing process;

[0080] Specifically, the resin material 140 is precisely inserted into the third mounting hole 130 by using a plugging device, and the height of the resin material 140 after brushing is ensured to be flush with the first copper layer 150 on the surface of the core board 100. Then, the resin material 140 is cured and its bonding with the core board 100 is enhanced by baking.

[0081] Step S100, forming a first mounting hole 110 on the core board 100;

[0082] Specifically, a through first mounting hole 110 is formed on the core board 100 by drilling with a drill or laser processing.

[0083] Step S200, filling the first mounting hole 110 with a magnetic material 115 and performing a curing process;

[0084] Specifically, in a vacuum environment, the magnetic material 115 is accurately filled into the first mounting hole 110 formed in step S100 using a plugging device, and then brushed to ensure that the height of the magnetic material 115 after brushing is flush with the first copper layer 150 on the surface of the core board 100. Finally, the magnetic material 115 is baked to solidify the magnetic material 115 and enhance its bonding with the core board 100.

[0085] Step S300, forming a second mounting hole 120 on the core plate 100, wherein the second mounting hole 120 passes through the magnetic core;

[0086] Step S400, copper deposition and electroplating treatment are performed on the core board 100;

[0087] For the sake of distinction, step S400 is recorded as the second copper plating process of Embodiment 1. After the second copper plating process, the second copper layer 160 is formed on both side surfaces of the core board 100 along the thickness direction and on the hole wall of the second mounting hole 120 .

[0088] Step S500, filling the second mounting hole 120 with a resin material 140 and performing a curing process;

[0089] Specifically, in a vacuum environment, the resin material 140 is accurately filled into the second mounting hole 120 formed in step S500 using a plugging device, and then brushed to ensure that the height of the resin material 140 after brushing is flush with the copper layer on the surface of the core board 100 after the second copper plating treatment. Finally, the resin material 140 is baked to solidify the resin material 140 and enhance its bonding with the magnetic core.

[0090] Step S600 , copper deposition and electroplating are performed on the core board 100 .

[0091] For the sake of distinction, step S600 is recorded as the third copper electroplating process of Embodiment 1. After the third copper electroplating process, a third copper layer 170 is formed on both sides of the core board 100 along the thickness direction.

[0092] The packaging substrate embedding method based on the first embodiment has the following technical effects:

[0093] 1. High-efficiency embedding technology: The magnetic material 115 is directly embedded into the core board 100 by printing. Compared with the technology of embedding solid magnetic cores in the traditional magnetic embedding process, this technology simplifies the operation process and improves the accuracy and efficiency of material embedding.

[0094] 2. Brush drilling optimization: After the magnetic material 115 is embedded, it is finely processed by brushing and drilling technology. This step not only ensures the flatness of the surface of the magnetic material 115, but also provides accurate hole positions for the production of the inductor circuit structure through drilling. Compared with other methods, the brush drilling technology can more effectively reduce the damage of the magnetic material 115 during the processing process and maintain its original magnetic permeability and saturation current characteristics.

[0095] 3. Process design: In order to solve the problem of erosion of magnetic material 115 in the degumming step in the traditional process, the process is adjusted to use the copper layer formed by the second copper plating treatment to effectively support and protect the magnetic material 115 layer. Based on the inductance calculation formula, if the coil length is the same, the higher the magnetic permeability of the core, the greater the inductance of the coil. By using a magnetic material 115 embedded in the magnetic integrated inductor to replace the hollow inductor of the conventional substrate, the magnetic material 115 inserted in the substrate improves the magnetic permeability of the inductor element, making the inductor element more compact, while reducing problems such as electromagnetic crosstalk in the circuit.

[0096] 4. Product application scope: Due to the inconsistency between the embedded magnetic material and the height of the plug holes of different trees, the structural difference leads to the difference in production process, and the plug hole times and grinding times need to be increased to meet the product functional requirements. This type of process design is suitable for some complex products with multiple functional holes or requiring multiple plug selection processes.

[0097] In summary, the packaging substrate embedding method of the first embodiment provides an innovative solution for the high-precision embedding of the magnetic material 115 in the packaging substrate. The present invention optimizes the manufacturing process, effectively protects the magnetic material 115 from damage by chemicals and realizes the inductor structure, thereby realizing the design of a magnetic integrated inductor embedded in the magnetic material 115, ensuring that it can fully exert its high magnetic permeability performance advantage in the packaging substrate, thereby improving the overall performance of the electronic product and promoting the miniaturization process of the electronic product.

[0098] like Figure 3 and Figure 4 As shown, the packaging substrate embedding method of the second embodiment:

[0099] Step S100, forming a first mounting hole 110 on the core board 100;

[0100] Step S200, filling the first mounting hole 110 with a magnetic material 115 and performing a curing process;

[0101] Specifically, Figure 3 As shown, a first mounting hole 110 for filling magnetic paste is precisely made on a core board 100 with copper cladding on both sides, and then a plugging and printing device is used in a vacuum environment to accurately fill the first mounting hole 110 with magnetic material 115. This process ensures that the magnetic material 115 is tightly combined with the core board 100, and avoids the generation of bubbles and gaps.

[0102] Then, the core board 100 filled with the magnetic material 115 is baked to solidify the magnetic material 115 and enhance its bonding with the core board 100. After that, through brushing and leveling processes, it is ensured that the surface copper height of the surface of the magnetic material 115 is completely consistent with that of the surface of the core board 100, laying a solid foundation for subsequent processing.

[0103] Step S300, forming a second mounting hole 120 on the core plate 100, wherein the second mounting hole 120 passes through the magnetic core;

[0104] Step S400, copper deposition and electroplating treatment of the core board 100;

[0105] For the sake of distinction, step S400 is recorded as the first copper electroplating process of Embodiment 2. After the first copper electroplating process, a first copper layer 150 is formed on both side surfaces of the core board 100 and the hole wall of the second mounting hole 120 .

[0106] Step S410, forming a third mounting hole 130 on the core plate 100;

[0107] Step S420, copper deposition and electroplating treatment are performed on the core board 100;

[0108] For the sake of distinction, step S420 is recorded as the second copper plating process of Embodiment 2. After the second copper plating process, the second copper layer 160 is formed on both sides of the core board 100 , the wall of the second mounting hole 120 , and the wall of the third mounting hole 130 .

[0109] Step S500, filling the second mounting hole 120 with a resin material 140 and performing a curing process;

[0110] In this step, the second mounting hole 120 and the third mounting hole 130 can be filled with the resin material 140 simultaneously to reduce the number of times the plugging process is performed and simplify the process flow. In addition, the resin material 140 in the second mounting hole 120 and the third mounting hole 130 needs to be baked, brushed, leveled, etc., so that both ends of the resin material 140 are flush with the copper layer of the second copper plating treatment on the surface of the core board 100.

[0111] Step S600 , copper deposition and electroplating are performed on the core board 100 .

[0112] For the sake of distinction, step S600 is recorded as the third copper electroplating process of Embodiment 2. After the third copper electroplating process, a third copper layer 170 is formed on both sides of the core board 100 .

[0113] Compared with the existing embedded magnetic technology, the present invention uses innovative printing, brush drilling and inductor circuit structure manufacturing methods to efficiently embed magnetic material 115 inside the package substrate, achieving significant performance improvement and efficiency optimization, and can achieve the following effects:

[0114] 1. By controlling the thickness of the copper layer on the core board 100 and the second mounting hole 120 with high precision, it is ensured that the copper layer can realize the supporting structure of the conductive coil and the magnetic material 115, which can not only meet the electrical performance requirements, but also effectively protect the magnetic material 115 layer below to prevent unnecessary damage during subsequent processing. By controlling the copper thickness during the process, the problems such as uneven thermal stress and increased signal transmission loss caused by excessively thick or thin copper layers are reduced, thereby improving the overall quality and reliability of the package substrate.

[0115] 2. Optimization of inductor circuit structure: The inductor circuit structure is directly made on the magnetic material 115. Based on the inductance calculation formula, if the coil length is the same, the larger the cross-sectional area, the greater the coil inductance. Increasing the copper thickness of the magnetic material hole is equivalent to increasing the cross-sectional area of ​​the coil according to the electromagnetic principle, which effectively increases the inductance value of the product. This design realizes an embedded magnetic integrated inductor, which effectively improves the inductance value density and packaging efficiency. This type of design is mainly suitable for high-frequency and high-current products.

[0116] 3. Performance improvement and loss reduction: The present invention uses a high permeability magnetic material 115. The higher permeability and larger saturation current enable the inductor component to exhibit better performance in high-frequency and high-power applications. In addition, combined with the brush drilling technology, the eddy current loss in the magnetic material 115 is effectively reduced. The reduction of eddy current loss not only improves the overall efficiency of the circuit board, but also extends the service life of the equipment.

[0117] In summary, the method for embedding magnetic materials in the packaging substrate of the second embodiment of the present invention achieves performance improvements in inductance density, magnetic permeability, saturation current, eddy current loss, etc. by efficiently embedding magnetic material 115 inside the core board 100 and multi-layer electroplating design inside the magnetic material hole. This technology provides strong support for the miniaturization, high performance and high-efficiency packaging of electronic products, and effectively realizes the widespread application of high-frequency and high-power magnetic inductors.

[0118] like Figure 5 and Figure 6 As shown, the packaging substrate embedding method of embodiment 3:

[0119] Step S100, forming a first mounting hole 110 on the core board 100;

[0120] Specifically, the core board 100 with copper cladding on both sides is drilled for the first time, and then the hole walls are cleaned to form a hole structure for filling the magnetic material 115 .

[0121] Step S200, filling the first mounting hole 110 with a magnetic material 115 and performing a curing process;

[0122] Specifically, the first mounting hole 110 formed in step S100 is plugged with magnetic paste, and then the surface of the core board 100 is brushed to ensure that the surface of the magnetic paste is flush with the copper surface of the core board 100 .

[0123] Step S210, copper deposition and electroplating treatment are performed on the core board 100;

[0124] For the sake of distinction, step S210 is recorded as the first copper electroplating process of Embodiment 3. After the first copper electroplating process, a first copper layer 150 is formed on both sides of the core board 100 to protect the embedded magnetic material 115 .

[0125] Step S220, forming a third mounting hole 130 on the core plate 100;

[0126] Specifically, the second drilling is performed, and then the hole wall is cleaned to form a hole structure for filling the resin material 140 .

[0127] Step S300, forming a second mounting hole 120 on the core plate 100, wherein the second mounting hole 120 passes through the magnetic core;

[0128] Specifically, the third drilling is performed, and then the hole wall is cleaned to provide good copper electroplating conditions.

[0129] Step S400, copper deposition and electroplating treatment are performed on the core board 100;

[0130] For the sake of distinction, step S400 is recorded as the second copper plating process of embodiment 3. After the second copper plating process, a second copper layer 160 is formed on both sides of the core board 100 , the hole wall of the second mounting hole 120 , and the hole wall of the third mounting hole 130 .

[0131] Step S500, filling the second mounting hole 120 with a resin material 140 and performing a curing process;

[0132] In this step, the second mounting hole 120 and the third mounting hole 130 can be plugged with the resin material 140 at the same time, and the surface of the core board 100 can be brushed to remove excess resin so that the surface of the resin material 140 is flush with the copper layer formed after the second copper electroplating treatment on the surface of the core board 100.

[0133] Step S600 , copper deposition and electroplating are performed on the core board 100 .

[0134] For the sake of distinction, step S600 is recorded as the third copper electroplating process of Embodiment 3. After the third copper electroplating process, a third copper layer 170 is formed on both side surfaces of the core board 100 .

[0135] The following effects can be achieved by the packaging substrate embedding method of the third embodiment:

[0136] Compared with the existing buried magnetic technology, the low-difficulty manufacturing process reduces equipment and production costs, and realizes the miniaturization and centralization of buried magnetic substrates. The magnetic material 115 is embedded in the interior of the packaging substrate by printing, and then the magnetic material 115 is brushed and drilled, and then the inductor circuit structure is made. The electromagnetic principle is used to increase the current per unit area and the inductance per unit area of ​​the substrate, thereby achieving an improvement in the inductance density and packaging efficiency, higher magnetic permeability and larger saturation current, and also reducing the turbine loss in the magnetic material 115 by drilling holes in the magnetic paste.

[0137] like Figure 7 and Figure 8 As shown, the packaging substrate embedding method of the fourth embodiment:

[0138] Step S100, forming a first mounting hole 110 on the core board 100;

[0139] Specifically, the core board 100 with copper cladding on both sides is drilled for the first time, and then the hole walls are cleaned to form a hole structure for filling the magnetic material 115 .

[0140] Step S200, filling the first mounting hole 110 with a magnetic material 115 and performing a curing process;

[0141] Specifically, the first mounting hole 110 formed in step S100 is plugged with magnetic paste, and then the board surface is brushed to ensure that the surface of the magnetic paste is flush with the copper layer on the surface of the core board 100.

[0142] Step S210, copper deposition and electroplating treatment are performed on the core board 100;

[0143] For the sake of distinction, step S210 is recorded as the first copper electroplating process of the fourth embodiment. After the first copper electroplating process, a first copper layer 150 is formed on the surface of the core board 100 to protect the embedded magnetic material 115 .

[0144] Step S220, forming a third mounting hole 130 on the core plate 100;

[0145] The second drilling is performed, and then the hole wall is cleaned to form a hole structure for filling the resin material 140 .

[0146] Step S230, performing copper deposition and electroplating treatment on the core board 100;

[0147] For ease of distinction, step S230 is recorded as the second copper plating treatment of Example 4. After the second copper plating treatment, a second copper layer 160 is formed on the surface of the core board 100 and the hole wall of the third mounting hole 130 to form a hole structure with a conductive path.

[0148] It should be noted that, in some further embodiments, after step S230, the following steps are further performed:

[0149] Step S240, forming a fourth mounting hole (not shown in the figure) on the core board 100, performing copper deposition and electroplating treatment on the core board 100, and repeating the punching, copper deposition and electroplating treatment until the number of the fourth mounting holes reaches the set number.

[0150] Step S300, forming a second mounting hole 120 on the core plate 100, wherein the second mounting hole 120 passes through the magnetic core;

[0151] Drill a third hole at the location where the magnetic paste is buried, and then clean the hole wall to provide good copper electroplating conditions.

[0152] Step S400, copper deposition and electroplating treatment are performed on the core board 100;

[0153] For easy distinction, step S400 is recorded as the third copper electroplating treatment of Example 4. After the third copper electroplating treatment, a third copper layer 170 is formed on the surface of the core board 100, the hole wall of the second mounting hole 120 and the hole wall of the third mounting hole 130.

[0154] Step S500, filling the second mounting hole 120 with a resin material 140 and performing a curing process;

[0155] The second mounting hole 120 is filled with resin, and the surface of the core board 100 is brushed and cleaned to make the resin surface flush with the copper layer formed by the third copper plating treatment on the surface of the core board 100. At the same time, the third mounting hole 130 can be filled with resin.

[0156] Step S600 , copper deposition and electroplating are performed on the core board 100 .

[0157] For ease of distinction, step S600 is recorded as the fourth copper plating treatment of Example 4. After the fourth copper plating treatment, a fourth copper layer 180 is formed on the surface of the core board 100 to achieve a conductive circuit between the second mounting hole 120 and the third mounting hole 130.

[0158] It can be understood that, in the fourth embodiment, the copper thickness of the second mounting hole 120 and the copper thickness of the third mounting hole 130 can be differentiated by four copper electroplating processes.

[0159] Based on the above, in step S500 of the second to fourth embodiments, both the second mounting hole 120 and the third mounting hole 130 need to be filled with the resin material 140 .

[0160] In addition, after the mounting holes in any of the above embodiments are filled with materials, for example, after the first mounting hole 110 is filled with magnetic material 115, after the second mounting hole 120 is filled with resin material 140, and after the third mounting hole 130 is filled with resin material 140, they all need to undergo curing, brushing and leveling processes.

[0161] To ensure that the magnetic material 115 is tightly bonded to the wall of the first mounting hole 110 without the presence of air bubbles or gaps, in the above embodiment, step S200 may be performed in a vacuum environment.

[0162] In some embodiments, the method for embedding magnets in a packaging substrate further includes the following steps:

[0163] S700, forming a conductive pattern on the outermost copper layer;

[0164] S800 , performing a layer-building operation on the core board 100 , and forming a conductive pattern on the newly added copper layer, and the conductive patterns of adjacent copper layers are electrically connected.

[0165] Specifically, through ABF (a kind of pressing material) pressing, blind hole laser, D+P (debonding and copper deposition), film pasting, exposure, development, electroplating, etching, and film stripping, complex and precise multi-layer graphics and blind hole structures are constructed layer by layer to achieve the miniaturization and centralized design goals of buried magnetic substrates.

[0166] The second aspect of the present application further proposes a packaging substrate, which is manufactured by the packaging substrate embedding method mentioned in any of the above embodiments.

[0167] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present invention. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A method for embedding magnets in a packaging substrate, characterized in that: The following steps are involved: S100, forming a first mounting hole on the core plate; S200, filling the first mounting hole with magnetic material and performing a curing process to form a magnetic core; S300, forming a second mounting hole on the core plate, wherein the second mounting hole passes through the magnetic core; S400, performing copper deposition and electroplating treatment on the core board; S500, filling the second mounting hole with a resin material and performing a curing process; S600, performing copper deposition and electroplating treatment on the core board.

2. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that: Before step S100, the following steps are also included: S10, forming a third mounting hole on the core plate; S20, performing copper deposition and electroplating treatment on the core board; S30, filling the third mounting hole with resin material and performing a curing process.

3. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that: Between step S400 and step S500, the following steps are also included: S410, forming a third mounting hole on the core plate; S420, performing copper deposition and electroplating treatment on the core board.

4. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that: Between step S200 and step S300, the following steps are also included: S210, performing copper deposition and electroplating treatment on the core board; S220, forming a third mounting hole on the core plate.

5. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that: Between step S200 and step S300, the following steps are also included: S210, performing copper deposition and electroplating treatment on the core board; S220, forming a third mounting hole on the core plate; S230, performing copper deposition and electroplating treatment on the core board.

6. The method for embedding magnets in a packaging substrate according to claim 5, characterized in that: After step S230, the following steps are further performed: S240, forming fourth mounting holes on the core board, performing copper deposition and electroplating processes on the core board, and repeating the punching, copper deposition and electroplating processes until the number of the fourth mounting holes reaches a set number.

7. The method for embedding magnets in a packaging substrate according to any one of claims 3 to 6, characterized in that: In step S500 , the second mounting hole and the third mounting hole are filled with resin material.

8. The method for embedding magnets in a packaging substrate according to any one of claims 1 to 6, characterized in that: After the mounting holes on the core board are filled with materials, they all need to go through curing, brushing and leveling processes.

9. The method for embedding magnets in a packaging substrate according to claim 1, characterized in that: The packaging substrate embedding method further comprises the following steps: S700, forming a conductive pattern on the outermost copper layer; S800, performing a layer-building operation on the core board, and forming a conductive pattern on the newly added copper layer, wherein the conductive patterns of adjacent copper layers are electrically connected.

10. A packaging substrate, characterized in that: The packaging substrate is manufactured by the packaging substrate embedding method according to any one of claims 1 to 9.

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