Wafer substrate positioning method and device, equipment, storage medium and program product

Abstract

The invention provides a wafer substrate positioning method and device, equipment, a storage medium and a program product, and relates to the technical field of semiconductors, and the method does not depend on a wafer substrate image and an edge detection algorithm, but carries out the calculation through data collected in a wafer substrate rotation process, determines the deviation between a wafer substrate and a rotary suction cup, and carries out the positioning of the wafer substrate. And positioning deviation correction is carried out based on the deviation between the wafer substrate and the rotary suction cup, so that the problem of poor positioning effect caused by reduction of image quality can be avoided, and the accuracy and reliability of a wafer substrate positioning result are improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer substrate positioning method, device, equipment, storage medium and program product. Background Art

[0002] In the semiconductor manufacturing industry, wafer substrates are the basic materials for manufacturing chips, and their processing accuracy and quality control are crucial. Before the wafer substrate is chamfered, accurate positioning and correction of the center position of the wafer substrate (i.e. the center of the circle) and the processing groove position on the wafer substrate are key links to ensure the smooth progress of subsequent processing steps and product quality.

[0003] Most wafer substrates are circular, but in order to meet the needs of loading and unloading in the project, it is necessary to cut processing grooves around the wafer substrate. At present, the processing grooves on the wafer substrate can be divided into two types: orientation plane (Orientation Plat, OF) and V-shaped notch (i.e. Notch mouth). The positioning method for wafer substrates with orientation planes is relatively mature, but the positioning method used for wafer substrates with orientation planes is usually difficult to directly apply to wafer substrates with V-shaped notches. Therefore, it is necessary to explore the positioning method of wafer substrates with V-shaped notches.

[0004] In some related technologies, there are a variety of technical solutions for determining the center of the wafer substrate and the position of the V-shaped notch. The basic process of the common method is as follows: first, the wafer substrate is photographed from different angles or positions by three cameras to obtain images of the wafer substrate; then, these images are converted into grayscale images to simplify subsequent processing; then, the grayscale images are edge detected to extract the edge contour of the wafer substrate and obtain a series of edge pixel points; finally, these edge pixel points are further processed and analyzed to determine the exact position of the center of the wafer substrate and the V-shaped notch.

[0005] However, this method based on multiple camera image sampling has some obvious problems and limitations in practical applications: Since this method relies on image processing and edge detection algorithms, it is easily affected by environmental factors such as light changes, camera lens contamination or wafer surface defects, etc. These factors may lead to image quality degradation, thereby affecting the accuracy and stability of edge detection, and further affecting the positioning effect of the wafer substrate. Summary of the invention

[0006] The present invention provides a wafer substrate positioning method, device, equipment, storage medium and program product, which are used to solve the defects of low accuracy and poor positioning effect of the wafer substrate positioning method in the prior art.

[0007] The present invention provides a wafer substrate positioning method, which is applied to a wafer substrate positioning device. The wafer substrate positioning device comprises a deflection correction component and an adjustment mechanism. The deflection correction component comprises a deflection correction mounting frame, a rotating suction cup and a deflection correction sensor. The rotating suction cup is rotatably connected to the deflection correction mounting frame, the deflection correction sensor is installed on the deflection correction mounting frame, and the adjustment mechanism and the deflection correction component are relatively arranged in a first direction. The method comprises: obtaining a radius R of a calibration piece, a first shielding amount t of the calibration piece by the deflection correction sensor, and a first reference line LA; placing a wafer substrate to be positioned on the rotating suction cup, controlling the rotation of the rotating suction cup, and collecting the rotation angle of the wafer substrate to be positioned in real time during the rotation of the rotating suction cup. and a second shielding amount of the correction sensor for the wafer substrate to be positioned ; Based on the radius R of the calibration piece and the second occlusion amount and the first shielding amount t, determine the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck ; Determine the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Is it the data on the second circular edge of the wafer substrate to be positioned? If the rotation angle of the wafer substrate to be positioned is The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck is the data on the second circular edge of the wafer substrate to be positioned, then according to the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck , based on the least squares method, the coordinates of the center of the circle of the wafer substrate to be positioned in the rectangular coordinate system are fitted ( , ); The rectangular coordinate system takes the center of the rotating suction cup as the origin, the first direction as the horizontal axis, and the second direction as the vertical axis, and the second direction is perpendicular to the first direction; based on the center coordinates ( , ), determine the center position deviation between the center of the wafer substrate to be positioned and the center of the rotating chuck and angle deviation β; according to the center position deviation , angle deviation β and the first reference line LA, and through the adjustment mechanism, the center of the wafer substrate to be positioned is positioned and corrected; after the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected.

[0008] According to a wafer substrate positioning method provided by the present invention, the center position deviation The calculation formula is: ; ; ; ; ; in, is the first transition variable; is the second transition variable; is the coordinate of the center of the circle ( , )’s horizontal axis; is the coordinate of the center of the circle ( , ) of the vertical coordinate; the calculation formula for the angle deviation β is:

[0009] Among them, π is the ratio of circumference to diameter; is the coordinate of the center of the circle ( , )’s horizontal axis; is the coordinate of the center of the circle ( , )’s vertical coordinate.

[0010] According to a wafer substrate positioning method provided by the present invention, the V-shaped notch includes a first end point and a second end point; determining the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned, including: according to the rotation angle of the wafer substrate to be positioned currently sampled The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck , the rotation angle of the wafer substrate to be positioned for the next sampling The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck for the next sampling , respectively determine the first endpoint coordinates of the first endpoint in the polar coordinate system and the second endpoint coordinates of the second endpoint in the polar coordinate system ; The polar coordinate system takes the center of the rotating chuck as the pole and the first direction as the polar axis; based on the coordinates of the first endpoint and the second endpoint coordinates , determine the maximum angle value and minimum angle value , and calculate the maximum angle value and minimum angle value Based on the difference, determine the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned; wherein the first endpoint and the second endpoint satisfy and ; is the transition variable calculated for the current sample, The transition variable calculated for the next sampling, A preset threshold for determining the first endpoint and the second endpoint.

[0011] According to a wafer substrate positioning method provided by the present invention, according to the center position deviation , angle deviation β and the first reference line LA, positioning and correcting the center of the wafer substrate to be positioned through the adjustment mechanism, including: based on the angle deviation β, controlling the rotation of the rotary chuck to rotate the center of the wafer substrate to be positioned to the second reference line LB; the second reference line LB passes through the center of the rotary chuck, and the second reference line is parallel to the first reference line LA; based on the center position deviation The wafer substrate to be positioned is moved by adjusting the mechanism so that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck.

[0012] According to a wafer substrate positioning method provided by the present invention, after the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected, including: after determining that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck, a coaxial wafer substrate to be positioned is obtained; controlling the rotation of the rotating chuck, and during the rotation of the rotating chuck, real-time acquisition of the rotation angle of the coaxial wafer substrate to be positioned The third shielding amount of the coaxial wafer substrate to be positioned by the correction sensor Based on the radius R of the calibration piece, the first occlusion amount t and the third occlusion amount , determine the distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck ; Determine the rotation angle of the coaxial wafer substrate to be positioned The distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck Is it the data on the V-shaped notch of the coaxial wafer substrate to be positioned? If the rotation angle of the coaxial wafer substrate to be positioned is The distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck For the data on the V-shaped notch of the coaxial wafer substrate to be positioned, the polar coordinates of the V-shaped notch are calculated using a fourth-order polynomial. Perform fitting calculation to determine the angle deviation of the V-shaped notch; based on the angle deviation of the V-shaped notch, control the rotation of the rotary suction cup to rotate the bottom of the V-shaped notch to the second reference line LB.

[0013] According to a wafer substrate positioning method provided by the present invention, the formula of the quartic polynomial is: ; in, For polar coordinates The results of the fitting; For polar coordinates The results of the fitting; is the first coefficient, is the second coefficient, is the third coefficient, is the fourth coefficient; is the fifth coefficient; the angular deviation of the V-shaped notch is the minimum root value obtained by derivation of the quartic polynomial.

[0014] The present invention also provides a wafer substrate positioning device, which uses any of the above-mentioned wafer substrate positioning methods, and the wafer substrate positioning device includes: a device main body; a deflection correction component, which is installed on the device main body, and the deflection correction component includes a deflection correction mounting frame, a rotating suction cup and a deflection correction sensor, the deflection correction mounting frame is installed on the device main body, the rotating suction cup is rotatably connected to the deflection correction mounting frame, the rotating suction cup is used to place the wafer substrate to be positioned, and the deflection correction sensor is installed on the deflection correction mounting frame; an adjustment mechanism, which is installed on the device main body, and the adjustment mechanism and the deflection correction component are arranged relatively to each other.

[0015] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, any of the above-mentioned wafer substrate positioning methods is implemented.

[0016] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the computer program implements any of the above-mentioned wafer substrate positioning methods.

[0017] The present invention also provides a computer program product, comprising a computer program, which implements any of the above-mentioned wafer substrate positioning methods when executed by a processor.

[0018] The wafer substrate positioning method, device, equipment, storage medium and program product provided by the present invention do not rely on the wafer substrate image and edge detection algorithm, but calculate through the data collected during the rotation of the wafer substrate to determine the deviation between the wafer substrate and the rotating chuck, and perform positioning and deviation correction based on the deviation between the wafer substrate and the rotating chuck, which can avoid the problem of poor positioning effect due to the degradation of image quality and improve the accuracy and reliability of the wafer substrate positioning results. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a schematic flow chart of the wafer substrate positioning method provided by the present invention.

[0021] Figure 2 The figure is a schematic diagram of the assembly structure of the wafer substrate positioning device provided by the present invention.

[0022] Figure 3 This is one of the schematic diagrams of the positioning process of the wafer substrate positioning device provided by the present invention.

[0023] Figure 4 This is the second schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention.

[0024] Figure 5 This is the third schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention.

[0025] Figure 6 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figures 1 to 5 , Figure 1 is a schematic flow chart of a wafer substrate positioning method provided by the present invention, Figure 2 is a schematic diagram of the assembly structure of the wafer substrate positioning device provided by the present invention, Figure 3 This is one of the schematic diagrams of the positioning process of the wafer substrate positioning device provided by the present invention. Figure 4 This is the second schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention. Figure 5 This is the third schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention.

[0028] In this embodiment, the wafer substrate positioning method is applied to a wafer substrate positioning device.

[0029] like Figures 2 to 5 As shown, the wafer substrate positioning device includes a device body 5, a correction component and an adjustment mechanism 1. The correction component includes a correction mounting frame 6, a rotating suction cup 3 and a correction sensor 4. The correction mounting frame 6 is installed on the device body 5. The rotating suction cup 3 is rotatably connected to the correction mounting frame 6. The correction sensor 4 is installed on the correction mounting frame 6 through a sensor fixing plate 7. The adjustment mechanism 1 and the correction component are relatively arranged in a first direction.

[0030] The first direction is the direction in which the deviation-correcting component points to the adjustment mechanism 1 .

[0031] Specifically, the deviation correction component also includes a direct drive motor 2, which is mounted on the deviation correction mounting frame 6, and the rotating suction cup 3 is mounted on the direct drive motor 2, and the direct drive motor 2 can drive the rotating suction cup 3 to rotate.

[0032] The adjustment mechanism 1 is a robot, which includes a horizontal moving component 12 (i.e., the radial moving axis of the robot), an adsorption component 16, a rotating component 17, a mounting table 13, and a height moving component 11. The horizontal moving component 12 is mounted on the rotating component 17, the suction cup mounting plate 15 is mounted on the horizontal moving component 12, and the adsorption component 16 is mounted on the suction cup mounting plate 15, and is used to adsorb or release the wafer substrate 8 to be positioned.

[0033] Optionally, the correction sensor 4 is a linear laser sensor, which includes a transmitting end 41 and a receiving end 42 .

[0034] The wafer substrate positioning method includes steps S110 to S180, each of which is specifically as follows: S110: Obtain the radius R of the calibration object, the first shielding amount t of the calibration object by the correction sensor, and the first reference line LA.

[0035] Specifically, Figure 3As shown, before positioning the wafer substrate 8 to be positioned, the calibration piece needs to be calibrated first: the calibration piece 9 with a radius of R and a straight edge 92 is adjusted coaxially with the vacuum rotary suction cup 3; the vacuum negative pressure of the vacuum rotary suction cup 3 is turned on, the calibration piece 9 is adsorbed, and the circular edge 91 of the calibration piece 9 is within the measurement range of the correction sensor 4, and the direct drive motor 2 is controlled to drive the rotary suction cup 3 to rotate a certain angle. At the same time, the correction sensor 4 collects data of the first circular edge 91 of the calibration piece 9, and the arithmetic mean of the values ​​collected by the correction sensor 4 is taken to obtain the first shielding amount of the correction sensor 4 on the calibration piece. t, used to determine the position of the correction sensor 4 relative to the vacuum rotary suction cup 3; adjust the straight edge 92 on the calibration piece 9 to be parallel to the horizontal moving component 12 of the adjustment mechanism 1, that is, adjust the radial moving axis of the manipulator to be parallel, and ensure that the adjustment mechanism 1 does not interfere with the vacuum rotary suction cup 3 when positioning the wafer substrate 8 or the calibration piece 9 up and down, record the angle A of the rotary motor 14 and the angle B of the direct drive motor 2 on the adjustment mechanism 1 at this time, and record the direction of movement of the horizontal moving component 12 of the adjustment mechanism 1 at this time as the first reference line LA; the negative pressure of the vacuum rotary suction cup 3 is disconnected, and the calibration piece 9 is removed.

[0036] S120: placing the wafer substrate to be positioned on the rotating chuck, controlling the rotating chuck to rotate, and collecting the rotation angle of the wafer substrate to be positioned in real time during the rotation of the rotating chuck and a second shielding amount of the correction sensor for the wafer substrate to be positioned .

[0037] Specifically, Figure 4 As shown, the wafer substrate 8 to be positioned includes a second circular edge 81 and a V-shaped notch 82, and the V-shaped notch 82 includes a first endpoint E and a second endpoint F; the wafer substrate 8 to be positioned is placed on the vacuum rotating suction cup 3 by adjusting the adsorption component 16 of the mechanism 1, the negative pressure of the adsorption component 16 on the adjustment mechanism 1 is disconnected, and the negative pressure of the vacuum rotating suction cup 3 is turned on, thereby adsorbing the wafer substrate 8 to be positioned on the vacuum rotating suction cup 3.

[0038] Furthermore, the direct drive motor 2 is controlled to drive the rotating chuck 3 to rotate at a constant speed for one circle, and during the rotation of the rotating chuck 3, the rotation angle of the wafer substrate 8 to be positioned is collected in real time. At the same time, the correction sensor 4 can collect the second shielding amount of the correction sensor 4 on the wafer substrate 8 to be positioned in real time. , completing the collection of edge data of the wafer substrate 8 to be positioned.

[0039] S130: Based on the radius R of the calibration piece and the second occlusion amount and the first shielding amount t, determine the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck .

[0040] Specifically, the data collected by the correction sensor 4 is processed: based on the radius R of the calibration piece and the second shielding amount and the first shielding amount t, determine the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 , The calculation formula is as follows: .

[0041] S140: Determine the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned.

[0042] S150: If the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck is the data on the second circular edge of the wafer substrate to be positioned, then according to the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck , based on the least squares method, the coordinates of the center of the circle of the wafer substrate to be positioned in the rectangular coordinate system are fitted ( , ).

[0043] The rectangular coordinate system takes the center of the rotating suction cup as the origin, the first direction as the horizontal axis, and the second direction as the vertical axis, and the second direction is perpendicular to the first direction.

[0044] like Figure 3 As shown, in this embodiment, a rectangular coordinate system is established with the center O1 of the rotating chuck as the origin, the first direction as the horizontal axis (x-axis), and the second direction as the vertical axis (y-axis); generally, when the wafer substrate 8 to be positioned is placed on the vacuum rotating chuck 3, the center O3 of the wafer substrate 8 to be positioned is not completely coaxial with the center O1 of the rotating chuck 3, so it is necessary to position and correct the center O3 of the wafer substrate 8 to be positioned.

[0045] After the coordinate system is determined, the rotation angle of the wafer substrate 8 to be positioned can be and the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 , based on the least square method, the coordinates of the center O3 of the wafer substrate 8 to be positioned in the rectangular coordinate system are fitted ( , ).

[0046] S160: Based on the center coordinates ( , ), determine the center position deviation between the center of the wafer substrate to be positioned and the center of the rotating chuck and angular deviation β.

[0047] S170: Based on center position deviation , angle deviation β and the first reference line LA, and through the adjustment mechanism, the center of the wafer substrate to be positioned is positioned and corrected.

[0048] S180: After the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected.

[0049] The wafer substrate positioning method provided in this embodiment does not rely on the wafer substrate image and edge detection algorithm, but calculates through the data collected during the rotation of the wafer substrate to determine the deviation between the wafer substrate and the rotating chuck, and performs positioning and deviation correction based on the deviation between the wafer substrate and the rotating chuck. This can avoid the problem of poor positioning effect due to the degradation of image quality and improve the accuracy and reliability of the wafer substrate positioning results.

[0050] In some embodiments, the center position deviation The calculation formula is: ; ; ; ; ; in, is the first transition variable; is the second transition variable; is the coordinate of the center of the circle ( , )’s horizontal axis; is the coordinate of the center of the circle ( , ) of the vertical coordinate; the calculation formula for the angle deviation β is:

[0051] Among them, π is the ratio of circumference to diameter; is the coordinate of the center of the circle ( , )’s horizontal axis; is the coordinate of the center of the circle ( , )’s vertical coordinate.

[0052] In some embodiments, the V-shaped notch includes a first end point and a second end point. The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned, including: according to the rotation angle of the wafer substrate to be positioned currently sampled The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck , the rotation angle of the wafer substrate to be positioned for the next sampling The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck for the next sampling , respectively determine the first endpoint coordinates of the first endpoint in the polar coordinate system and the second endpoint coordinates of the second endpoint in the polar coordinate system ; The polar coordinate system takes the center of the rotating chuck as the pole and the first direction as the polar axis; based on the coordinates of the first endpoint and the second endpoint coordinates , determine the maximum angle value and minimum angle value , and calculate the maximum angle value and minimum angle value Based on the difference, determine the rotation angle of the wafer substrate to be positioned The distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned; wherein the first endpoint and the second endpoint satisfy and ; is the transition variable calculated for the current sample, The transition variable calculated for the next sampling, A preset threshold for determining the first endpoint and the second endpoint.

[0053] like Figures 3 to 5 As shown, the wafer substrate 8 to be positioned comprises a second round edge 81 and a V-shaped notch 82, and the V-shaped notch 82 comprises a first end point E and a second end point F; and the distance from the point on the edge of the wafer substrate 8 to be positioned to the center of the rotating chuck 3 Afterwards, it is necessary to determine the rotation angle of the wafer substrate 8 to be positioned and the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 It is the data on the second circular edge 81 of the wafer substrate 8 to be positioned, or the data on the V-shaped notch 82 .

[0054] Specifically, this embodiment uses the differential method to determine the positions of the first endpoint E and the second endpoint F on the second circular edge 81 of the wafer substrate 8 to be positioned; wherein the first endpoint E and the second endpoint F satisfy the following formula: ; ; in, is the transition variable calculated for the current sample, The transition variable calculated for the next sampling, A preset threshold for determining the first endpoint E and the second endpoint F; is the rotation angle of the wafer substrate 8 to be positioned that is currently sampled; is the rotation angle of the wafer substrate 8 to be positioned for the next sampling; is the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3; It is the distance from the point on the edge of the wafer substrate 8 to be positioned for the next sampling to the center O1 of the rotating chuck 3.

[0055] Furthermore, if Figures 3 to 5 As shown, a polar coordinate system is established with the center O1 of the rotating suction cup 3 as the pole and the first direction as the polar axis. After determining the first endpoint E and the second endpoint F using the above formula, the first endpoint coordinate of the first endpoint E in the polar coordinate system is determined. and the second endpoint coordinates of the second endpoint F in the polar coordinate system .

[0056] Further, based on the first endpoint coordinate and the second endpoint coordinates , determine the maximum angle value and minimum angle value , and calculate the maximum angle value and minimum angle value The difference ; Among them, the maximum angle value and minimum angle value The calculation formula is as follows: ; ; Among them, max is the maximum value function and min is the minimum value function.

[0057] Furthermore, based on the difference , determine the rotation angle of the wafer substrate 8 to be positioned and the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 Whether it is data on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0058] Specifically, if , then the rotation angle of the wafer substrate 8 to be positioned is , these points are on the V-shaped notch 82 , and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0059] Specifically, if , then the rotation angle of the wafer substrate 8 to be positioned is , these points are on the V-shaped notch 82 , and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0060] in, It is a threshold value for determining the starting position of the V-shaped notch 82 of the wafer substrate 8 to be positioned.

[0061] In some embodiments, based on the center position deviation , angle deviation β and the first reference line LA, positioning and correcting the center of the wafer substrate to be positioned through the adjustment mechanism, including: based on the angle deviation β, controlling the rotation of the rotary chuck to rotate the center of the wafer substrate to be positioned to the second reference line LB; the second reference line LB passes through the center of the rotary chuck, and the second reference line is parallel to the first reference line LA; based on the center position deviation The wafer substrate to be positioned is moved by adjusting the mechanism so that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck.

[0062] Specifically, the direct drive motor 2 is controlled to drive the rotating suction cup 3 to rotate by an angle deviation β, and the center O3 of the wafer substrate 8 to be positioned is rotated to the second reference line LB which is parallel to the first reference line LA and passes through the center O1 of the rotating suction cup 3, and the center O3 of the wafer substrate 8 to be positioned is between the center O1 of the vacuum rotating suction cup 3 and the rotation center O2 of the adjustment mechanism 1; the rotating motor 14 on the adjustment mechanism 1 rotates to move the horizontal moving component 12 of the adjustment mechanism 1 to the first reference line LA; the adjustment mechanism 1 moves up along the Z axis (here the height moving component 11 is the Z axis) to make the adsorption component 16 contact the wafer substrate 8 to be positioned, and start the vacuum adsorption of the wafer substrate 8 to be positioned, and the negative pressure on the vacuum rotating suction cup 3 is disconnected; the adjustment mechanism 1 drives the wafer substrate 8 to be positioned to move up along the Z axis, and the horizontal moving component 12 of the adjustment mechanism 1 moves toward the center O1 of the vacuum rotating suction cup 3 by the center position deviation calculated above. , so that the center O3 of the wafer substrate 8 to be positioned is coaxial with the center O1 of the rotating suction cup 3, the adjustment mechanism 1 drives the wafer substrate 8 to be positioned to descend along the Z axis, and the wafer substrate 8 to be positioned is placed on the vacuum rotating suction cup 3, the negative pressure of the vacuum rotating suction cup 3 is turned on, and the wafer substrate 8 to be positioned is adsorbed, the negative pressure of the adsorption component 16 of the adjustment mechanism 1 is disconnected, and the adjustment mechanism 1 is moved to the initial position.

[0063] In some embodiments, after the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected, including: after determining that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck, a coaxial wafer substrate to be positioned is obtained; controlling the rotation of the rotating chuck, and collecting the rotation angle of the coaxial wafer substrate to be positioned in real time during the rotation of the rotating chuck The third shielding amount of the coaxial wafer substrate to be positioned by the correction sensor Based on the radius R of the calibration piece, the first occlusion amount t and the third occlusion amount , determine the distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck ; Determine the rotation angle of the coaxial wafer substrate to be positioned The distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck Is it the data on the V-shaped notch of the coaxial wafer substrate to be positioned? If the rotation angle of the coaxial wafer substrate to be positioned is The distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck For the data on the V-shaped notch of the coaxial wafer substrate to be positioned, the polar coordinates of the V-shaped notch are calculated using a fourth-order polynomial. A fitting calculation is performed to determine the angle deviation of the V-shaped notch; based on the angle deviation of the V-shaped notch, the rotary suction cup is controlled to rotate to rotate the bottom of the V-shaped notch to the second reference line LB.

[0064] After the center O3 of the wafer substrate 8 to be positioned is positioned and corrected (i.e., the center O3 of the wafer substrate 8 to be positioned placed on the vacuum rotating chuck 3 is coaxial with the center O1 of the vacuum rotating chuck 3), the wafer substrate 8 to be positioned is used as a coaxial wafer substrate to be positioned.

[0065] Furthermore, the wafer substrate 8 to be positioned after the coaxial adjustment is measured: the direct drive motor 2 is controlled to drive the rotating chuck 3 to rotate at a constant speed for one circle, and during the rotation of the rotating chuck 3, the rotation angle of the wafer substrate 8 to be positioned after the coaxial adjustment is collected in real time. The third shielding amount of the wafer substrate 8 to be positioned after the coaxial adjustment of the deflection correction sensor pair , completing the collection of edge data of the wafer substrate 8 to be positioned after coaxial adjustment.

[0066] Further, based on the radius R of the calibration member 9, the first shielding amount t and the third shielding amount , determine the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 after adjusting the coaxiality , The calculation formula is as follows: .

[0067] Further, the rotation angle of the wafer substrate 8 to be positioned after the coaxial adjustment is determined. The distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 after the coaxial adjustment , whether it is the data on the V-shaped notch 82 of the wafer substrate 8 to be positioned after the coaxial adjustment.

[0068] Specifically, a polar coordinate system is established with the center O1 of the rotating suction cup 3 as the pole and the first direction as the polar axis, and according to the formula and formula After determining the first endpoint E and the second endpoint F of the wafer substrate to be positioned 8 after the coaxial adjustment, determine the endpoint coordinates of the first endpoint E of the wafer substrate to be positioned 8 after the coaxial adjustment in the polar coordinate system. and the endpoint coordinates of the second endpoint F in the polar coordinate system .

[0069] in, is the transition variable calculated for the current sample, The transition variable calculated for the next sampling, A preset threshold for determining the first endpoint E and the second endpoint F; The rotation angle of the wafer substrate 8 to be positioned after the coaxial adjustment for the current sampling; The rotation angle of the wafer substrate 8 to be positioned after coaxial adjustment for the next sampling; is the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 after the coaxial adjustment of the current sampling; The distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 after the coaxial adjustment for the next sampling.

[0070] Furthermore, based on the endpoint coordinates and endpoint coordinates , determine the maximum angle value and minimum angle value , and calculate the maximum angle value and minimum angle value The difference ; Among them, the maximum angle value and minimum angle value The calculation formula is as follows: ; ; Among them, max is the maximum value function and min is the minimum value function.

[0071] Specifically, if , then adjust the rotation angle of the wafer substrate 8 to be positioned after the coaxial , these points are on the V-shaped notch 82 , and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0072] Specifically, if , then adjust the rotation angle of the wafer substrate 8 to be positioned after the coaxial , these points are on the V-shaped notch 82 , and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0073] in, It is a threshold value for determining the starting position of the V-shaped notch 82 of the wafer substrate 8 to be positioned.

[0074] Furthermore, if the rotation angle of the wafer substrate 8 to be positioned after coaxial adjustment is The distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 after the coaxial adjustment In order to adjust the data on the V-shaped notch 82 of the wafer substrate 8 to be positioned after the coaxial, the polar coordinates of the V-shaped notch 82 are calculated using a fourth-order polynomial. A fitting calculation is performed to determine the angle deviation of the V-shaped notch 82 .

[0075] The formula of the quartic polynomial is: ; That is: ; Among them, For polar coordinates The results of the fitting; For polar coordinates The results of the fitting; is the first coefficient, is the second coefficient, is the third coefficient, is the fourth coefficient; is the fifth coefficient; The rotation angle of the wafer substrate 8 to be positioned after the coaxial adjustment when the collected point is the position of the V-shaped notch 82; To adjust the rotation angle of the wafer substrate 8 to be positioned after coaxial When , the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3; k is a constant, k=4; n is the number of fitting items.

[0076] Furthermore, we take the derivative of the quartic polynomial and set it equal to 0, that is, , and solve this equation to obtain three roots; the minimum root value γ is the angular value of the bottom N of the V-notch 82 in the polar coordinate system, that is, the angular deviation of the V-notch.

[0077] Further, based on the angular deviation γ of the V-notch, control the rotation of the rotary suction cup to rotate the bottom N of the V-notch 82 to the second reference line LB.

[0078] Specifically, if the angular deviation γ > A, control the rotary suction cup 3 to rotate clockwise by an angle of γ - A; if the angular deviation γ < A, control the rotary suction cup 3 to rotate counterclockwise by an angle of γ - A, so as to rotate the bottom N of the V-notch 82 to the second reference line LB that is parallel to the first reference line LA and passes through the center O1 of the rotary suction cup 3, and complete the positioning and deviation correction of the V-notch 82 of the wafer substrate 8 to be positioned.

[0079] In some embodiments, the formula of the quartic polynomial is: ; where is the result of fitting the polar coordinate ; is the result of fitting the polar coordinate ; is the first coefficient, is the second coefficient, is the third coefficient, is the fourth coefficient; is the fifth coefficient; the angular deviation of the V-notch is the minimum root value obtained by performing a derivative operation on the quartic polynomial.

[0080] The wafer substrate positioning method provided in this embodiment can collect the edge data of the wafer substrate by using a deviation correction sensor and a direct drive motor. The data collection method is stable and reliable, and the cost is low; at the same time, using the direct drive motor to directly drive the vacuum rotary suction cup to rotate can eliminate the reduction unit, with high stability and high positioning accuracy.

[0081] The present invention also provides a wafer substrate positioning device. Please refer to Figures 2 to 5 , in this embodiment, the wafer substrate positioning device uses any of the above wafer substrate positioning methods. The wafer substrate positioning device includes: a device main body; a deviation correction assembly, the deviation correction assembly is installed on the device main body, the deviation correction assembly includes a deviation correction mounting frame, a rotary suction cup and a deviation correction sensor, the deviation correction mounting frame is installed on the device main body, the rotary suction cup is rotatably connected to the deviation correction mounting frame, the rotary suction cup is used for placing the wafer substrate to be positioned, and the deviation correction sensor is installed on the deviation correction mounting frame; an adjustment mechanism, the adjustment mechanism is installed on the device main body, and the adjustment mechanism and the deviation correction assembly are arranged opposite to each other.

[0082] The present invention also provides an electronic device. Figure 6is a schematic diagram of the structure of the electronic device provided by the present invention, such as Figure 6 As shown, the electronic device may include: a processor 610, a communication interface 620, a memory 630 and a communication bus 640, wherein the processor 610, the communication interface 620 and the memory 630 communicate with each other through the communication bus 640. The processor 610 may call the logic instructions in the memory 630 to execute the wafer substrate positioning method.

[0083] In addition, the logic instructions in the above-mentioned memory 630 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0084] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which is implemented when the computer program is executed by a processor to execute the wafer substrate positioning method provided by the above-mentioned methods.

[0085] The present invention also provides a computer program product, which includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the wafer substrate positioning method provided by the above methods.

[0086] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0087] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer substrate positioning method, characterized in that: Applicable to a wafer substrate positioning device, the wafer substrate positioning device comprises a deflection correction component and an adjustment mechanism, the deflection correction component comprises a deflection correction mounting frame, a rotating suction cup and a deflection correction sensor, the rotating suction cup is rotatably connected to the deflection correction mounting frame, the deflection correction sensor is installed on the deflection correction mounting frame, and the adjustment mechanism and the deflection correction component are arranged relatively in a first direction; The method comprises: Acquire a radius R of the calibration object, a first shielding amount t of the calibration object by the correction sensor, and a first reference line LA; The wafer substrate to be positioned is placed on the rotating chuck, the rotating chuck is controlled to rotate, and during the rotation of the rotating chuck, the rotation angle of the wafer substrate to be positioned is collected in real time. and a second shielding amount of the correction sensor on the wafer substrate to be positioned ; Based on the radius R of the calibration piece and the second occlusion amount and the first shielding amount t, determine the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck ; Determine the rotation angle of the wafer substrate to be positioned and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned; If the rotation angle of the wafer substrate to be positioned is and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck is the data on the second circular edge of the wafer substrate to be positioned, then according to the rotation angle of the wafer substrate to be positioned and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck , based on the least square method, the coordinates of the center of the circle of the wafer substrate to be positioned in the rectangular coordinate system are fitted ( , ); the rectangular coordinate system takes the center of the rotating suction cup as the origin, the first direction as the horizontal axis, and the second direction as the vertical axis, and the second direction is perpendicular to the first direction; Based on the center coordinates of the circle ( , ), determine the center position deviation between the center of the wafer substrate to be positioned and the center of the rotating chuck and angular deviation β; According to the center position deviation , the angle deviation β and the first reference line LA, and positioning and correcting the center of the wafer substrate to be positioned through the adjustment mechanism; After the center of the wafer substrate to be positioned is positioned and rectified, the V-shaped notch of the wafer substrate to be positioned is positioned and rectified.

2. The wafer substrate positioning method according to claim 1, characterized in that: The center position deviation The calculation formula is: ； ； ； ； ； in, is the first transition variable; is the second transition variable; is the center coordinate of the circle ( , )’s horizontal axis; is the center coordinate of the circle ( , )’s ordinate; The calculation formula of the angle deviation β is: Among them, π is the ratio of circumference to diameter; is the center coordinate of the circle ( , )’s horizontal axis; is the center coordinate of the circle ( , )’s vertical coordinate.

3. The wafer substrate positioning method according to claim 1, characterized in that: The V-shaped notch includes a first endpoint and a second endpoint; Determining the rotation angle of the wafer substrate to be positioned and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned, including: According to the rotation angle of the wafer substrate to be positioned currently sampled and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck currently sampled , the rotation angle of the wafer substrate to be positioned for the next sampling and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck for the next sampling , respectively determine the first endpoint coordinates of the first endpoint in the polar coordinate system and the second endpoint coordinates of the second endpoint in the polar coordinate system ; The polar coordinate system has the center of the rotating chuck as the pole and the first direction as the polar axis; Based on the first endpoint coordinates and the second endpoint coordinates , determine the maximum angle value and minimum angle value , and calculate the maximum angle value and minimum angle value The difference between Based on the difference, the rotation angle of the wafer substrate to be positioned is determined. and the distance from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the second circular edge of the wafer substrate to be positioned; Wherein, the first endpoint and the second endpoint satisfy and ; is the transition variable calculated for the current sample, The transition variable calculated for the next sampling, A preset threshold for determining the first endpoint and the second endpoint.

4. The wafer substrate positioning method according to claim 1, characterized in that: The center position deviation , the angle deviation β and the first reference line LA, and positioning and correcting the center of the wafer substrate to be positioned through the adjustment mechanism, including: Based on the angle deviation β, the rotation of the rotary chuck is controlled to rotate the center of the wafer substrate to be positioned to a second reference line LB; the second reference line LB passes through the center of the rotary chuck, and the second reference line is parallel to the first reference line LA; Based on the center position deviation , the wafer substrate to be positioned is moved by the adjustment mechanism so that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck.

5. The wafer substrate positioning method according to claim 4, characterized in that: After the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected, including: After determining that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck, obtaining a coaxial wafer substrate to be positioned; Control the rotation of the rotating chuck, and collect the rotation angle of the coaxial wafer substrate to be positioned in real time during the rotation of the rotating chuck and a third shielding amount of the correction sensor on the coaxial wafer substrate to be positioned ; Based on the radius R of the calibration piece, the first occlusion amount t and the third occlusion amount , determine the distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck ; Determine the rotation angle of the coaxial wafer substrate to be positioned and the distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck Whether it is data on the V-shaped notch of the coaxial wafer substrate to be positioned; If the rotation angle of the coaxial wafer substrate to be positioned is and the distance from the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck is the data on the V-shaped notch of the coaxial wafer substrate to be positioned, and the polar coordinates of the V-shaped notch are calculated using a fourth-order polynomial. Perform fitting calculation to determine the angle deviation of the V-shaped notch; Based on the angle deviation of the V-shaped notch, the rotary suction cup is controlled to rotate so as to rotate the bottom of the V-shaped notch to the second reference line LB.

6. The wafer substrate positioning method according to claim 5, characterized in that: The formula of the quartic polynomial is: ； in, For the polar coordinates In The results of the fitting; For the polar coordinates In The results of the fitting; is the first coefficient, is the second coefficient, is the third coefficient, is the fourth coefficient; is the fifth coefficient; The angle deviation of the V-shaped notch is the minimum root value obtained by performing a derivative operation on the fourth-order polynomial.

7. A wafer substrate positioning device, characterized in that: Using the wafer substrate positioning method according to any one of claims 1 to 6, the wafer substrate positioning device comprises: Device body; A deflection correction component, the deflection correction component is installed on the device body, the deflection correction component includes a deflection correction mounting frame, a rotating suction cup and a deflection correction sensor, the deflection correction mounting frame is installed on the device body, the rotating suction cup is rotatably connected to the deflection correction mounting frame, the rotating suction cup is used to place the wafer substrate to be positioned, and the deflection correction sensor is installed on the deflection correction mounting frame; An adjustment mechanism is installed on the device body, and the adjustment mechanism and the deviation correction component are arranged relative to each other.

8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the wafer substrate positioning method according to any one of claims 1 to 6 is implemented.

9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the wafer substrate positioning method according to any one of claims 1 to 6 is implemented.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the wafer substrate positioning method according to any one of claims 1 to 6 is implemented.

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