Improvement method of MK3 equipment bearing platform

Abstract

The invention relates to an improvement method of an MK3 equipment bearing table, and belongs to the technical field of silicon wafer mobile processing equipment, the MK3 equipment bearing table comprises a bearing machine table, a wafer carrying table is arranged in the bearing machine table, and a sinking groove is arranged between the periphery of the wafer carrying table and the bearing machine table. Comprising the following operation steps: 1, pasting a film on a slide holder; and 2, testing and confirming a difference value after film pasting. And thirdly, the flatness and the appearance yield are 100%, namely 25 pcs, the processing levels before and after film pasting are equivalent, and no obvious difference exists. And 4, judging that the particles are qualified if the film is not influenced on the particle level after being pasted on the slide holder. And 5, judging that the surface metal level is not influenced after the film is pasted on the slide holder, and judging that the slide holder is qualified. 6, testing the MK3 equipment subjected to film pasting, wherein the flatness, the appearance and the particles all accord with the specification level in the society; and the surface metal level reaches the standard. A thin film is pasted on the test carrying table, and the problem that particles are adhered when the MK3 equipment carrying table carries out carrying motion on a silicon wafer is solved through multiple tests and improvement.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer mobile processing equipment, and in particular to an improvement method for a MK3 equipment carrier platform. Background Art

[0002] Contact length measuring devices are widely used in the measurement of precision components, such as the field of shape measurement of optical components. However, when using a contact length measuring device to measure a component, the measuring head of the contact length measuring device needs to keep in contact with the component and move relative to the component, so the contact length measuring device is usually installed on a carrier and moves with the carrier.

[0003] The MK3 equipment carrier currently used for 12-inch silicon wafers has particles at fixed points. According to statistics, the particle defect rate of product batches tested by this machine is 100%. Summary of the invention

[0004] The present invention mainly solves the deficiencies in the prior art and provides an improved method for an MK3 device carrier. By sticking a thin film on the test carrier and through multiple tests and improvements, the problem of particle adhesion when the MK3 device carrier carries a silicon wafer is solved.

[0005] The above technical problems of the present invention are mainly solved by the following technical solutions: An improved method for a MK3 equipment carrier includes a carrier, a wafer carrier is provided inside the carrier, and a sink is provided between the periphery of the wafer carrier and the carrier. The following steps are included: Step 1: Put a film on the slide stage.

[0006] Step 2: Test after film application to confirm the difference. The thickness of the film applied minus the thickness of the film not applied is ≤18A, and the difference is ≤0.35%.

[0007] Step 3: The flatness and appearance yield is 100%, that is, 25pcs, and the main parameters of flatness are SFQR\ ESFQR\ NT. The process level before and after film pasting is equivalent, with no obvious difference.

[0008] Step 4: The film on the slide table has no effect on the particle level and is judged to be qualified.

[0009] Step 5: The film on the carrier has no effect on the surface metal level and is judged to be qualified.

[0010] Step 6: After film application, the MK3 equipment is used for testing. The flatness, appearance and particles all meet the internal specifications; the surface metal level meets the standards.

[0011] Preferably, a coating plate movably crimped to the carrier table is provided at the rear end of the carrier table, a coating plate is provided on the coating plate for placing the film, film clamping frames are provided on both sides of the coating groove, film clamping fixing blocks fixed to the coating plate are provided at both ends of the film clamping frame, a film clamping shaft plugged into the film clamping frame is provided on the film clamping block, the film is fixed by the film clamping frame during the flipping and coating process, and when the film is covered on the carrier table, the film clamping frame is opened to complete the film sticking process.

[0012] Preferably, the coating board is provided with coating rotating rods on both sides of the lower end, the front end of the coating rotating rods is provided with a coating seat integrated with the carrying machine, and a rotating pin is used between the coating rotating rods and the coating seat to realize the flipping of the coating board during the coating process.

[0013] Preferably, a coating diagonal support rod is provided between the rear lower end of the coating rotary rod and the coating seat to provide auxiliary support to the coating rotary rod.

[0014] Preferably, the film clamping frame includes a clamping plate, and film clamping connecting rods movably plugged with the film clamping shaft are provided between the two sides of the rear end of the clamping plate and the film clamping fixing block, a pressure rod is provided between the rear ends of the two film clamping connecting rods, and a torsion spring is provided between the film clamping connecting rod and the film clamping shaft. After the pressure rod is pressed down, the clamping plate is driven to separate from the film by the film clamping connecting rod.

[0015] Preferably, the film laminating groove is provided with a plurality of suction cups for limiting the adsorption of the film, and the rear end of the suction cups is provided with a cylinder which is screwed and fixed to the film laminating plate and is connected to the suction cups by a pipeline. The suction cups are sucked by the cylinders to achieve adsorption of the film, and the suction cups are inflated by the cylinders to achieve lamination and detachment of the film.

[0016] The present invention can achieve the following effects: The present invention provides an improved method for an MK3 device carrier platform. Compared with the prior art, a thin film is attached to the test carrier platform. After multiple tests and improvements, the problem of particle adhesion when the MK3 device carrier platform carries and moves on a silicon wafer is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the top structure of the present invention.

[0018] Figure 2 It is a side structural schematic diagram of the present invention.

[0019] Figure 3 It is a structural schematic diagram of the film clamping frame of the present invention.

[0020] In the figure: carrying machine 1, sink 2, film carrier 3, rotating pin 4, coating rotary rod 5, coating seat 6, film clamping frame 7, film clamping fixing block 8, coating plate 9, coating groove 10, suction cup 11, film clamping connecting rod 12, pressure rod 13, clamping plate 14, cylinder 15, coating diagonal support rod 16, torsion spring 17, film clamping shaft 18. DETAILED DESCRIPTION

[0021] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0022] Example: Figure 1 , Figure 2 and Figure 3 As shown, an improved method for the MK3 equipment carrier includes a carrier 1, a wafer carrier 3 is arranged inside the carrier 1, and a sink 2 is arranged between the periphery of the wafer carrier 3 and the carrier 1. The following steps are included: The first step: stick a film on the carrier table 3.

[0023] The rear end of the carrier 1 is provided with a film-coating plate 9 that is movably pressed with the film carrier 3. Film-coating rotating rods 5 are provided on both sides of the lower end of the film-coating plate 9. A film-coating seat 6 that is integrated with the carrier 1 is provided at the front end of the film-coating rotating rod 5. A rotating pin 4 is used between the film-coating rotating rod 5 and the film-coating seat 6 to realize the flipping of the film-coating plate 9 during the film-coating process. A film-coating diagonal support rod 16 that provides auxiliary support for the film-coating rotating rod 5 is provided between the rear lower end of the film-coating rotating rod 5 and the film-coating seat 6. The film-coating plate 9 is provided with a film-coating groove 10 for placing a film. The film-coating groove 10 is provided with four suction cups 11 that are distributed in an annular manner with equal spacing and are used to limit the absorption of the film. The rear end of the suction cups 11 is provided with a cylinder 15 that is screwed and fixed to the film-coating plate 9 and is connected to the suction cups 11 through a pipeline; the suction cups 11 are sucked by the cylinder 15 to realize the absorption of the film, and the suction cups 11 are inflated by the cylinder 15 to realize the lamination and separation of the film.

[0024] Film clamping frames 7 are provided on both sides of the film laminating groove 10, and film clamping fixing blocks 8 fixed to the film laminating plate 9 are provided at both ends of the film clamping frames 7, and film clamping shafts 18 plugged into the film clamping frames 7 are provided on the film clamping fixing blocks 8. The film is fixed by the film clamping frames 7 during the film flipping and laminating process, and the film clamping frames 7 are opened after the film is covered on the film carrier 3 to complete the film laminating process. The film clamping frame 7 includes a clamping plate 14, and film clamping connecting rods 12 movably plugged into the film clamping shafts 18 are provided between the two sides of the rear end of the clamping plate 14 and the film clamping fixing blocks 8, and a pressure rod 13 is provided between the rear ends of the two film clamping connecting rods 12, and a torsion spring 17 is provided between the film clamping connecting rods 12 and the film clamping shafts 18. After the pressure rod 13 is pressed down, the film clamping connecting rods 12 drive the clamping plate 14 to separate from the film.

[0025] Step 2: Test after film application to confirm the difference. The thickness of the film applied minus the thickness of the film not applied is ≤18A, and the difference is ≤0.35%.

[0026] Step 3: The flatness and appearance yield is 100%, that is, 25pcs, and the main parameters of flatness are SFQR\ ESFQR\ NT. The process level before and after film pasting is equivalent, with no obvious difference.

[0027] Step 4: After the film is applied to the slide table 3, there is no influence on the particle level, and it is judged as qualified.

[0028] Step 5: After the film is applied to the wafer stage 3, there is no influence on the surface metal level, and it is judged to be qualified.

[0029] Step 6: After film application, the MK3 equipment is used for testing. The flatness, appearance and particles all meet the internal specifications; the surface metal level meets the standards.

[0030] In summary, the improved method of the MK3 device carrier, by sticking a thin film on the test carrier, has solved the problem of particle adhesion when the MK3 device carrier carries the silicon wafer after multiple tests and improvements.

[0031] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A method for improving a MK3 equipment carrier, comprising a carrier (1), wherein a wafer carrier (3) is provided inside the carrier (1), and a sink (2) is provided between the periphery of the wafer carrier (3) and the carrier (1); characterized in that The steps are as follows: Step 1: attach a film to the slide table (3); Step 2: Test and confirm the difference after film application. The film thickness after film application minus the film thickness without film application is ≤18A, and the difference is ≤0.35%; Step 3: The flatness and appearance yield is 100%, i.e. 25pcs, and the main parameters of flatness are SFQR\ ESFQR\ NT. The process level before and after film lamination is the same, with no obvious difference; Step 4: The film on the slide table (3) has no effect on the particle level after being pasted, and is judged to be qualified; Step 5: The film on the wafer stage (3) has no effect on the metal level on the surface after pasting, and is judged as qualified; Step 6: After film application, the MK3 equipment is used for testing. The flatness, appearance and particles all meet the internal specifications; the surface metal level meets the standards.

2. The improved method of the MK3 equipment carrier according to claim 1, characterized in that: The rear end of the carrier platform (1) is provided with a coating plate (9) which is movably crimped with the film carrier (3); the coating plate (9) is provided with a coating groove (10) for placing a film; both sides of the coating groove (10) are provided with a film clamping frame (7); both ends of the film clamping frame (7) are provided with a film clamping fixing block (8) fixed to the coating plate (9); the film clamping fixing block (8) is provided with a film clamping shaft (18) plugged into the film clamping frame (7); the film is fixed by the film clamping frame (7) during the flipping and coating process; when the film is covered on the film carrier (3), the film clamping frame (7) is opened to complete the film sticking process.

3. The improved method of the MK3 equipment carrier according to claim 2, characterized in that: The laminating plate (9) is provided with laminating rotating rods (5) on both sides of the lower end, and the front end of the laminating rotating rods (5) is provided with a laminating seat (6) which is integrated with the carrier platform (1). A rotating pin shaft (4) is used between the laminating rotating rods (5) and the laminating seat (6), and the laminating plate (9) is turned over during the laminating process by rotating the pin shaft (4).

4. The improved method of the MK3 equipment carrier according to claim 3, characterized in that: A coating oblique support rod (16) for auxiliary support of the coating rotary rod (5) is provided between the rear lower end of the coating rotary rod (5) and the coating seat (6).

5. The improved method of the MK3 equipment carrier according to claim 2, characterized in that: The film clamping frame (7) comprises a clamping plate (14), and a film clamping connecting rod (12) movably plugged with the film clamping shaft (18) is provided between the two sides of the rear end of the clamping plate (14) and the film clamping fixing block (8), and a pressure rod (13) is provided between the rear ends of the two film clamping connecting rods (12), and a torsion spring (17) is provided between the film clamping connecting rod (12) and the film clamping shaft (18); by pressing the pressure rod (13) downward, the clamping plate (14) is driven by the film clamping connecting rod (12) to separate from the film.

6. The improved method of the MK3 equipment carrier according to claim 2, characterized in that: The film coating groove (10) is provided with a plurality of suction cups (11) for limiting the position of the film and adsorbing the film. The rear end of the suction cups (11) is provided with a cylinder (15) which is screw-fixed to the film coating plate (9) and is connected to the suction cups (11) through a pipeline. The suction cups (11) are adsorbed by the cylinders (15), and the film is coated and detached by inflating the suction cups (11) through the cylinders (15).

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