A semiconductor device processing clamping tool

Abstract

The present invention discloses a semiconductor device processing clamping tool, which relates to the field of semiconductor clamping. The semiconductor device processing clamping tool includes at least three first drive assemblies, which are evenly distributed in a ring shape; at least two second drive assemblies are provided on the first drive assembly; a clamping roller is provided at the end of the second drive assembly; and a limit member is provided at the end of the clamping roller, which can control the rotation of the clamping roller. Through the coordinated use of the first drive assembly, the second drive assembly, and the limit member, the present invention enables the semiconductor device processing clamping tool to be suitable for wafers of different diameters, and can also rotate the clamping roller when the wafer needs to be rotated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor clamping, in particular to a semiconductor device processing clamping tool. Background Art

[0002] In the semiconductor manufacturing process, wafer processing requires multiple high-precision and high-complexity steps, such as photolithography, etching, deposition, and polishing. In order to ensure the stability and accuracy of processing, wafer clamping technology is crucial. Wafers usually have a large diameter (such as 200mm, 300mm) and a small thickness, which makes them susceptible to external forces during processing, which may cause deformation or damage. Therefore, a reliable clamping device is required to fix the wafer while avoiding excessive stress on the wafer surface and edges.

[0003] Existing wafer clamping devices mainly include vacuum adsorption clamping and mechanical clamping. Vacuum adsorption clamping achieves fixation by applying negative pressure to the back of the wafer. It has the advantages of large contact area and is less likely to cause local stress concentration. However, its effectiveness is reduced when the vacuum environment is unstable or the wafer surface is rough. Mechanical clamping applies mechanical force to the edge of the wafer through clamping claws or fixing rings. It can provide a high clamping force, but it is prone to edge stress concentration, causing the edge of the wafer to break or produce microcracks. In addition, as the size of wafers increases and the thickness decreases, higher requirements are placed on the stability and precision of the clamping device. Traditional clamping methods can no longer meet the needs of the new generation of semiconductor manufacturing technology. Summary of the Invention

[0004] In view of the above problems existing in the prior art, the present invention is proposed.

[0005] Therefore, the problem to be solved by the present invention is that mechanical clamping easily causes wafer edge breakage or microcracks.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: A semiconductor device processing clamping tool, comprising: a first drive assembly, at least three of which are provided and evenly distributed in a ring shape;

[0007] At least two second drive assemblies are provided on the first drive assembly; a clamping roller is provided at the end of the second drive assembly; a limiting member is provided at the end of the clamping roller, and the limiting member can control the rotation of the clamping roller.

[0008] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, the first driving assembly includes a first hydraulic cylinder and a first telescopic column that slides with it, the end of the first telescopic column is fixedly connected to the movable seat through a first connecting sleeve, and the movable seat slides with the base.

[0009] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, the second driving assembly includes a second hydraulic cylinder and a second telescopic column slidingly matched therewith; the oil inlets of the second hydraulic cylinder are correspondingly installed with solenoid valves and pressure sensors.

[0010] As a preferred solution of the semiconductor device processing clamping tool of the present invention, a second connecting sleeve is further provided at the end of the second telescopic column, and the clamping roller is in sliding cooperation with the second connecting sleeve.

[0011] As a preferred solution of the semiconductor device processing clamping tool described in the present invention, the limiting member includes a first limiting plate provided at the end of the clamping roller and a fixed shaft provided in the middle of the first limiting plate.

[0012] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, the limiting member also includes a second limiting plate arranged on the top of the first limiting plate, the second limiting plate is slidably matched with the fixed shaft and a first spring is also arranged between the two.

[0013] As a preferred solution of the semiconductor device processing clamping tool of the present invention, a slider is further provided on the top of the second limiting plate, and the slider is a square block.

[0014] As a preferred solution of the semiconductor device processing clamping tool of the present invention, a limiting groove is further provided inside the second connecting sleeve, and the sliding block is placed in the limiting groove and slidably cooperates with the limiting groove.

[0015] As a preferred solution of the semiconductor device processing clamping tool of the present invention, the depth of the limiting groove gradually decreases from the end away from the second telescopic column to the end close to the second telescopic column.

[0016] As a preferred solution of the semiconductor device processing clamping tooling described in the present invention, a second spring and a stop block are further provided between the first limiting plate and the inner wall of the limiting groove, and one end of the stop block is in contact with the side wall of the first limiting plate.

[0017] The beneficial effects of the present invention are as follows: through the coordinated use of the first drive assembly, the second drive assembly and the limiter, the semiconductor device processing clamping tool can be adapted to wafers of different diameters, and the clamping rod can also rotate when the wafer needs to be rotated. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is an overall schematic diagram of the clamping tooling for semiconductor device processing.

[0020] Figure 2 This is a structural diagram of the clamping tooling for semiconductor device processing.

[0021] Figure 3 Schematic diagram of the second drive unit of the clamping tool for semiconductor device processing.

[0022] Figure 4 A cross-sectional view of the second drive unit of the semiconductor device processing clamping tool.

[0023] Figure 5 for Figure 4 A magnified view of center.

[0024] Figure 6 Schematic diagram of the limiter for the clamping tooling for semiconductor device processing.

[0025] Figure 7 Schematic diagram of clamping tooling for semiconductor device processing. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it individually or selectively refer to an embodiment that is mutually exclusive of other embodiments.

[0029] Example 1

[0030] Reference Figures 1 to 7, which is the first embodiment of the present invention, provides a semiconductor device processing clamping tool, including a first driving component 100, a second driving component 200 and a limiting member 300.

[0031] Specifically, at least three first drive assemblies 100 are provided and evenly distributed in a ring shape; at least two second drive assemblies 200 are provided on the first drive assembly 100; a clamping roller 201 is provided at the end of the second drive assembly 200; a limit member 300 is provided at the end of the clamping roller 201, and the limit member 300 can control the rotation of the clamping roller 201. Several second drive assemblies 200 are evenly provided on the side of the first drive assembly 100 close to the center of the circle. When a wafer is placed in the middle of the second drive assemblies 200, the second drive assembly 200 in the middle will first contact the edge of the wafer, and the second drive assemblies 200 on the left and right ends will also contact the edge of the wafer in turn. Finally, several second drive assemblies 200 will press against the corresponding wafer edges to clamp.

[0032] Furthermore, the first drive assembly 100 includes a first hydraulic cylinder 101 and a first telescopic column 102 that slides with it. The end of the first telescopic column 102 is fixedly connected to the movable base 104 via a first connecting sleeve 103, and the movable base 104 slides with the base 105. Three through slots are evenly arranged in the base 105, corresponding one to each of the three first drive assemblies 100. The direction of the through slots is consistent with the extension direction of the first drive assembly 100. A protrusion is fixedly provided in the middle of the bottom of the movable base 104. The movable base 104 slides with the through slots via the protrusion. The sliding direction of the movable base 104 moves along the diameter direction of the ring. When the wafer is placed in the clamping fixture, the movable base 104 drives the second drive assembly 200 to move toward the center of the circle to clamp the wafer. The first telescopic column 102 is arranged inside the first hydraulic cylinder 101 and slides with the first hydraulic cylinder 101. When the first hydraulic cylinder 101 pushes the first telescopic column 102 forward, the second drive assembly 200 fixedly connected to it also moves forward.

[0033] The second drive assembly 200 includes a second hydraulic cylinder 206 and a second telescopic column 202 that slidably engages with it. Each oil inlet of the second hydraulic cylinder 206 is equipped with a corresponding solenoid valve 203 and a pressure sensor 204. The second drive assembly 200 is fixedly mounted above the movable base 104. The pressure sensor 204 is used to monitor the pressure of the second hydraulic cylinder 206. When the pressure in the cylinder reaches a certain value, the solenoid valve 203 is closed. During operation, several second drive assemblies 200 are aligned with the wafer edge. The second hydraulic cylinder 206 closest to the wafer edge, after receiving oil through the oil circuit, pushes the second telescopic column 202 until the second telescopic column 202 contacts the wafer edge and stops moving. At this point, when the oil pressure in the second hydraulic cylinder 206 reaches the set value, the solenoid valve 203 of the current second drive assembly 200 is closed, the second hydraulic cylinder 206 maintains pressure, and the next second drive assembly 200 moves. This continues in this manner. When all second drive assemblies 200 have contacted their second telescopic columns 202 with the wafer edge, the clamping operation is complete.

[0034] A second connecting sleeve 205 is also provided at the end of the second telescopic column 202, with the clamping roller 201 slidingly engaged with the second connecting sleeve 205. The second connecting sleeve 205 is sleeved onto one end of the second telescopic column 202 and secured with four bolts. The bolts penetrate the second connecting sleeve 205 and the second telescopic column 202 to secure the stopper to the end of the second drive assembly 200. The second connecting sleeve 205 has an opening at the end closest to the wafer, and the clamping roller 201 is positioned within the opening and slidingly engages with the inner wall of the opening.

[0035] The limiting member 300 includes a first limiting plate 301 disposed at the end of the clamping roller 201 and a fixed shaft 302 disposed in the middle of the first limiting plate 301. The limiting member 300 also includes a second limiting plate 303 disposed at the top of the first limiting plate 301. The second limiting plate 303 and the fixed shaft 302 are slidably engaged, with a first spring 304 disposed therebetween. A slider 303a is also disposed at the top of the second limiting plate 303. The slider 303a is a square block. The depth of the limiting groove 205a gradually decreases from the end away from the second telescopic column 202 to the end closer to the second telescopic column 202. A second spring 306 and a stop 305 are also disposed between the first limiting plate 301 and the inner wall of the limiting groove 205a. One end of the stop 305 engages the side wall of the first limiting plate 301. The limiting member 300 is arranged between the clamping roller 201 and the second connecting sleeve 205, the first limiting plate 301 is fixedly arranged on the upper side of the clamping roller 201, the fixed shaft 302 is fixedly arranged in the middle of the upper side of the first limiting plate 301, one end of the first spring 304 is fixedly connected to the fixed shaft 302, and the bottom of the second limiting plate 303 and the slider 303a is provided with an empty groove, and the fixed shaft 302 cooperates with the empty groove. The opposite side of the first limiting plate 301 and the second limiting plate 303 is provided with a rough surface. When the second limiting plate 303 is pressed downward under pressure, it will contact and get stuck with the first limiting plate 301, so that no relative sliding will occur between the first limiting plate 301 and the second limiting plate 303.

[0036] Among them, the slider 303a is set to a bevel shape at a corner close to the second telescopic column 202, the limiting groove 205a is a rectangular groove on the left side close to the second telescopic column 202, and a right-angled trapezoidal groove on the right side. The hypotenuse of the limiting groove 205 corresponds to the bevel of the slider 303a. In the initial state, the limiting member 300 is located on the right side of the limiting groove 205. At this time, when the wafer needs to be rotated, since the clamping roller 201 is a cylinder and the fixed shaft 302 rotates with the second limiting plate 303, all the clamping rollers 201 can rotate with the rotation of the wafer, and the second limiting plate 303 and the slider 303a, since the slider 303a is a square, are always It cannot rotate. When the clamping roller 201 is pushed to move in the direction of the second telescopic column 202, the stop block 305 moves to the left, squeezing the second spring 306, and the slider 303a will move to the left and downward along the hypotenuse, and the second limit plate 303 will also move to the left and downward. The second limit plate 303 descends and fits tightly with the first limit plate 301 and is stuck to form a whole. Since the second limit plate 303 cannot rotate, the first limit plate 301 fixed with it cannot rotate at this time, thereby clamping the edge of the wafer, that is, ensuring that the clamping roller 201 cannot rotate during clamping, which can achieve a better clamping effect.

[0037] When in use, the wafer is placed in the center of the base 105, and the three first drive assemblies 100 are started at the same time. The first hydraulic cylinder 101 pushes the first telescopic column 102 to move toward the center of the circle, and several second drive assemblies 200 also move accordingly. The second hydraulic cylinder 206 of the second drive assembly 200 in the middle position is supplied with oil by the oil pipe to push the second telescopic column 202 forward until the clamping roller 201 is attached to the edge of the wafer. At this time, the pressure sensor 204 detects that the hydraulic value of the second hydraulic cylinder 206 reaches the upper limit and closes the solenoid valve 203. The oil tank no longer supplies oil to the second hydraulic cylinder 206 of the second drive assembly 200 in the middle position, and then supplies oil to the remaining drive assemblies 200 and repeats the previous process until all the clamping rollers 201 are attached to the edge of the wafer. The second telescopic columns 202 of all second drive assemblies 200 are extended to different lengths, but the terminals are all attached to the edge of the wafer, so that the edges of the wafer can be clamped. Regardless of the size of the wafer diameter, several clamping rollers 201 can contact the edge of the wafer and clamp the wafer under the action of the second hydraulic cylinder 206. When the clamping rollers 201 contact the wafer, they will be squeezed by the wafer and move toward the second telescopic column 202. Since the inclined surface of the slider 303a can descend along one side of the limiting groove 205, the limiting member 300 will eventually be squeezed to the left side of the limiting groove 205. The lower side of the second limiting plate 303 and the upper side of the first limiting plate 301 are squeezed together and no relative sliding occurs. When the bottom of the clamping roller 201 is blocked, the entire clamping roller 201 and the limiting member are fixed and will no longer move. Several annularly distributed clamping rollers 201 clamp the wafer. When the wafer needs to be rotated, the first telescopic column 102 is moved back a little, the second spring 306 rebounds, and the limit member 300 is pushed back to its original position. The compressed first spring 304 returns to its original state, and the first limit plate 301 and the second limit plate 303 are separated. At this time, the fixed shaft 302 can rotate again, and the clamping roller 201 can rotate.

[0038] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A semiconductor device processing clamping tool, characterized by: include, First drive components (100), at least three of which are provided and evenly distributed in a ring shape; At least two second drive assemblies (200) are provided on the first drive assembly (100); A clamping roller (201) is provided at the end of the second driving assembly (200); A limiting member (300) is provided at the end of the clamping roller (201), and the limiting member (300) is capable of controlling the rotation of the clamping roller (201); The second drive assembly (200) includes a second hydraulic cylinder (206) and a second telescopic column (202) slidably engaged therewith; the oil inlets of the second hydraulic cylinder (206) are each correspondingly installed with a solenoid valve (203) and a pressure sensor (204); A second connecting sleeve (205) is also provided at the end of the second telescopic column (202), and the clamping roller (201) is slidably engaged with the second connecting sleeve (205); The limiting member (300) comprises a first limiting plate (301) arranged at the end of the clamping roller (201) and a fixed shaft (302) arranged in the middle of the first limiting plate (301); The limiting member (300) further includes a second limiting plate (303) disposed on top of the first limiting plate (301), the second limiting plate (303) and the fixed shaft (302) being in sliding engagement with each other, with a first spring (304) disposed therebetween. A slider (303a) is also provided on the top of the second limiting plate (303), and the slider (303a) is a square block; A limiting groove (205a) is further provided inside the second connecting sleeve (205), and the sliding block (303a) is placed in the limiting groove (205a) and slidably engaged therewith; The depth of the limiting groove (205a) gradually decreases from an end away from the second telescopic column (202) to an end close to the second telescopic column (202).

2. The semiconductor device processing clamping tool according to claim 1, wherein: The first driving assembly (100) comprises a first hydraulic cylinder (101) and a first telescopic column (102) slidably engaged with the first telescopic column (102), the end of the first telescopic column (102) being fixedly connected to a movable seat (104) via a first connecting sleeve (103), and the movable seat (104) slidably engages with a base (105).

3. The semiconductor device processing clamping tool according to claim 2, characterized in that: A second spring (306) and a stopper (305) are further provided between the first limiting plate (301) and the inner wall of the limiting groove (205a), and one end of the stopper (305) is in contact with the side wall of the first limiting plate (301).

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