Parallel type semiconductor circuit

Abstract

The invention relates to the technical field of circuits, and provides a parallel type semiconductor circuit which comprises a plurality of circuit boards, the plurality of circuit boards are arranged in an attached mode, each circuit board comprises a plurality of first pins, a plurality of second pins and a plurality of jacks which are formed in an inward concave mode and correspond to the plurality of second pins, the plurality of first pins penetrate through the circuit board and extend outwards, and the plurality of second pins are respectively positioned in the plurality of jacks; the first ends of the plurality of first pins in one circuit board are respectively connected to the electric control board; and the plurality of first pins of one of the two adjacent circuit boards are respectively inserted into the plurality of jacks of the other circuit board and are in contact with the second pins in the jacks. According to the parallel type semiconductor circuit, parallel type integration of a plurality of circuit boards is achieved, miniaturization of electric control is achieved, arrangement is more flexible, and cost is lower.

Description

Technical Field

[0001] The present invention relates to the field of circuit technology, and in particular to a parallel semiconductor circuit. Background Art

[0002] Semiconductor circuits are also called modular intelligent power modules (MIPMs). They not only integrate power switching devices and drive circuits, but also have built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send detection signals to the CPU or DSP for interrupt processing. They are composed of high-speed, low-power consumption tube cores, optimized gate-level drive circuits and fast protection circuits, which can prevent the IPM itself from being damaged even if a load accident or improper use occurs. They generally use IGBTs as power switching elements and have an integrated structure with built-in current sensors and drive circuits.

[0003] The semiconductor circuit needs to assemble the low-voltage control circuits such as IC drive control circuit, IPM sampling amplifier circuit and PFC current protection circuit and the inverter circuit composed of high-voltage semiconductor circuit on the same circuit board. However, the semiconductor circuit boards in the prior art can only integrate a single circuit module, and the integration of multiple circuit modules has not been realized, which makes it impossible to miniaturize the electronic control. Summary of the invention

[0004] The present invention provides a semiconductor circuit, aiming to solve the problem that the prior art cannot realize the integration of multiple circuit modules, thus resulting in the inability to realize miniaturization of electric control.

[0005] An embodiment of the present invention provides a parallel semiconductor circuit, which includes:

[0006] A plurality of circuit boards, the plurality of circuit boards are arranged in a close relationship, each of the circuit boards comprises a plurality of first pins, a plurality of second pins and a plurality of sockets which are inwardly recessed and correspond to the plurality of second pins, the plurality of first pins extend outward through the circuit boards, and the plurality of second pins are respectively located in the plurality of sockets;

[0007] an electric control board, wherein the first ends of the plurality of the first pins in one of the circuit boards are respectively connected to the electric control board;

[0008] The plurality of first pins of one of the two adjacent circuit boards are respectively inserted into the plurality of insertion holes of the other circuit board and contact the second pins in the insertion holes.

[0009] Preferably, a plurality of the circuit boards are arranged in parallel.

[0010] Preferably, the circuit boards include two.

[0011] Preferably, the parallel semiconductor circuit further includes a heat sink; and the heat dissipation surfaces of the plurality of circuit boards are respectively attached to the same side of the heat sink.

[0012] Preferably, each of the circuit boards further comprises:

[0013] Metal substrate;

[0014] An insulating layer, the insulating layer being disposed on one side of the metal substrate;

[0015] A circuit wiring layer, the circuit wiring layer is arranged on a side of the insulating layer away from the metal substrate;

[0016] A plurality of components, wherein the plurality of components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other;

[0017] A package body, wherein the package body covers the plurality of the first pins, the plurality of the second pins, the metal substrate, the circuit wiring layer, and the plurality of the components;

[0018] The first ends of the plurality of first pins extend outward through the package body respectively, the second ends of the plurality of first pins and the second ends of the plurality of second pins are respectively fixed to a side of the circuit wiring layer away from the insulating layer, and the socket is formed by an inward depression of the package body corresponding to the position of the second pin.

[0019] Preferably, the circuit board further comprises a green oil layer which is arranged on the circuit wiring layer to avoid all the components.

[0020] Preferably, the plurality of components include at least chip resistors and chip capacitors that are spaced apart on the circuit wiring layer.

[0021] Preferably, the circuit board further comprises a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively arranged on a side of the plurality of heat sinks away from the circuit wiring layer.

[0022] Preferably, electrical connections are achieved between the plurality of components and between the components and the circuit wiring layer by binding metal wires.

[0023] Compared with the prior art, the parallel semiconductor circuit in the present invention realizes parallel integration of multiple circuit boards by making each circuit board include multiple first pins, multiple second pins and multiple sockets that are recessed inward and correspond to the multiple second pins, and making the multiple first pins extend outward through the circuit board, and the multiple second pins are respectively located in the multiple sockets, and making the first ends of the multiple first pins in one of the circuit boards respectively connected to the electric control board, and making the multiple first pins of one of the two adjacent circuit boards respectively inserted into the multiple sockets of the other circuit board and contacting with the second pins in the sockets, thereby realizing miniaturization of the electric control, making the layout more flexible, and reducing the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:

[0025] Figure 1 It is a structural schematic diagram of a parallel semiconductor circuit provided by an embodiment of the present invention, without showing an electric control board and a heat sink.

[0026] Among them, 10, circuit board; 11, first pin; 12, second pin, 13, jack; 14, metal substrate; 15, insulation layer; 16, circuit wiring layer; 17, components; 171, chip resistor; 172, chip capacitor; 173, heat sink; 18, package; 19, green oil layer; 110, binding metal wire. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The embodiment of the present invention provides a parallel semiconductor circuit, combining Figure 1 As shown, it includes a plurality of circuit boards 10 and an electric control board.

[0029] The circuits in the circuit board 10 include a PFC circuit and an inverter circuit; the electric control board is used to control and manage the circuit board 10 to ensure the normal operation of the electrical equipment using the circuit board 10 .

[0030] A plurality of circuit boards 10 are arranged in a close connection, and each circuit board 10 comprises a plurality of first pins 11, a plurality of second pins 12, and a plurality of sockets 13 which are recessed inward and correspond to the plurality of second pins 12. The plurality of first pins 11 extend outward through the circuit board 10, and the plurality of second pins 12 are respectively located in the plurality of sockets 13; the first ends of the plurality of first pins 11 in one of the circuit boards 10 are respectively connected to the electric control board; the plurality of first pins 11 of one of the two adjacent circuit boards 10 are respectively inserted into the plurality of sockets 13 of the other circuit board 10 and contact the second pins 12 in the sockets 13.

[0031] The material of the first pin 11 and the second pin 12 are both C194 (-1 / 2H), chemical composition: Cu≧97.0%, Fe=2.4%, P=0.03%, Zn=0.12%; or KFC (-1 / 2H), chemical composition: Cu≧99.6%, Fe=0.1% or 0.05%~0.15%, P=0.03% or 0.025%~0.04%; a copper plate with a thickness of 0.5mm is stamped by machining to form the required shape, and then the surface is first nickel-plated with a thickness of 0.1-0.5um, and then tin-plated with a thickness of 2-5um.

[0032] Specifically, the plurality of circuit boards 10 are arranged in parallel. Of course, according to actual needs, the plurality of circuit boards 10 may not be arranged in parallel.

[0033] In this embodiment, the circuit boards 10 include two with the same structure. Of course, according to actual needs, the circuit boards 10 may also include three, four, five, etc. with the same structure.

[0034] Specifically, the circuit board 10 includes: a metal substrate 14 , an insulating layer 15 , a circuit wiring layer 16 , a plurality of components 17 and a packaging body 18 .

[0035] The insulating layer 15 is arranged on one side of the metal substrate 14; the circuit wiring layer 16 is arranged on the side of the insulating layer 15 away from the metal substrate 14; a plurality of components 17 are arranged at intervals on the side of the circuit wiring layer 16 away from the insulating layer 15, and the plurality of components 17 and the components 17 and the circuit wiring layer 16 are electrically connected to each other; the package body 18 covers the plurality of first pins 11, the plurality of second pins 12, the metal substrate 14, the circuit wiring layer 16 and the plurality of components 17.

[0036] The first ends of the multiple first pins 11 extend outward through the package body 18 respectively, the second ends of the multiple first pins 11 and the second ends of the multiple second pins 12 are respectively fixed to the side of the circuit wiring layer 16 away from the insulating layer 15, and the socket 13 is formed by the inward depression of the package body 18 corresponding to the position of the second pin 12.

[0037] The metal substrate 14 serves as a carrier of the entire internal circuit of the circuit board 10 and plays a role in heat dissipation for the entire circuit board 10; the insulating layer 15 is used to prevent the circuit wiring layer 16 and the metal substrate 14 from being energized, causing the risk of short circuit or leakage in the internal circuit; the circuit wiring layer 16, also known as the copper foil layer, is used to form the required circuit by etching, and at the same time serves as a welding medium (pad) to realize the electrical connection between the surface mount components 17 and the circuit; the package body 18 is a powdered molding compound made of epoxy resin as the base resin, high-performance phenolic resin as the curing agent, silicon micropowder as the filler, and a variety of additives. It is extruded into the mold cavity by heat transfer molding and the components 17 therein are embedded, and at the same time cross-linked and cured to form a device with a certain external structure.

[0038] In this embodiment, the circuit board 10 further includes a green oil layer 19 disposed on the circuit wiring layer 16 to avoid all components 17 .

[0039] The green oil layer 19 is also called a protective layer, which is used to prevent tinning at places where tinning should not be applied, increase the withstand voltage between circuits, prevent short circuits caused by circuit oxidation or contamination, and protect the circuits.

[0040] In this embodiment, the plurality of components 17 at least include chip resistors 171 and chip capacitors 172 that are spaced apart and arranged on the circuit wiring layer 16 .

[0041] The chip resistor 171 is connected to the gate of the IGBT chip in the circuit board 10 to limit the switching speed of the IGBT by limiting the current; the chip capacitor 172 plays the role of filtering, coupling, and bootstrapping in the semiconductor circuit. Of course, according to actual needs, the multiple components 17 also include the chips required to form the circuit board 10.

[0042] In this embodiment, the circuit board 10 further includes a plurality of heat sinks 173 disposed at intervals on the circuit wiring layer 16, and some components 17 are disposed on the plurality of heat sinks 173. The heat sinks 173 and the components 17 disposed on the heat sinks 173 are called semi-finished components, and the components 17 disposed on the heat sinks 173 are high-voltage power components with high heat dissipation requirements.

[0043] The heat sink 173 uses a copper surface silver plating process to achieve a better fit between the component 17 and the heat sink 173, thereby improving the heat dissipation capacity.

[0044] In this embodiment, electrical connections are achieved between the multiple components 17 and between the components 17 and the circuit wiring layer 16 through binding metal wires 110 .

[0045] The binding metal wire 110 is generally made of gold, aluminum, copper or the like, and is used to achieve electrical connection between components 17 in the circuit.

[0046] In this embodiment, the connecting column is a flexible column structure, which can not only realize the electrical connection between the two circuit boards 10, but also enable the connecting column to select different folding modes according to the rotation direction for easy transportation.

[0047] In this embodiment, the parallel semiconductor circuit further includes a heat sink; the heat dissipation surfaces of the two circuit boards 10 are respectively attached to the same side of the heat sink. The heat sink is used to dissipate heat from the two circuit boards 10 at the same time.

[0048] The parallel semiconductor circuit in the embodiment of the present invention is realized by making each circuit board 10 include a plurality of first pins 11, a plurality of second pins 12, and a plurality of plug holes 13 formed inwardly and corresponding to the plurality of second pins 12, and making the plurality of first pins 11 extend outward through the circuit board 10, and the plurality of second pins 12 are respectively located in the plurality of plug holes 13, and making the first ends of the plurality of first pins 11 in one of the circuit boards 10 respectively connected to the electric control board, and at the same time making the plurality of first pins 11 of one of the two adjacent circuit boards 10 respectively inserted into the plurality of plug holes 13 of the other circuit board 10 and contacting the second pins 12 in the plug holes 13, thereby realizing a plurality of circuits. The parallel integration of the board 10 makes the electronic control miniaturized and more flexible in layout, with lower cost; at the same time, this integration method can be flexibly applied to occasions of various current levels, and the working requirements of larger current can be achieved by simply increasing the number of parallel circuit boards 10. Moreover, since this integration method can flexibly replace or increase or decrease the number of circuit boards 10, it can not only adapt to the use scenarios of different power, but also only need to be replaced when one of the circuit boards 10 fails, without scrapping the entire product, which not only reduces the cost but also improves the rework efficiency; in addition, this integration method only requires one electronic control board to complete the control of multiple circuit boards 10, which not only reduces the production cost but also simplifies the process and technology.

[0049] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0050] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A parallel semiconductor circuit, characterized in that: The parallel semiconductor circuit comprises: A plurality of circuit boards, the plurality of circuit boards are arranged in a close relationship, each of the circuit boards comprises a plurality of first pins, a plurality of second pins and a plurality of sockets which are inwardly recessed and correspond to the plurality of second pins, the plurality of first pins extend outward through the circuit boards, and the plurality of second pins are respectively located in the plurality of sockets; an electric control board, wherein the first ends of the plurality of the first pins in one of the circuit boards are respectively connected to the electric control board; The plurality of first pins of one of the two adjacent circuit boards are respectively inserted into the plurality of insertion holes of the other circuit board and contact the second pins in the insertion holes.

2. The parallel semiconductor circuit according to claim 1, characterized in that: A plurality of the circuit boards are arranged in parallel.

3. The parallel semiconductor circuit according to claim 2, characterized in that: The circuit board includes two.

4. The parallel semiconductor circuit according to claim 2, characterized in that: The parallel semiconductor circuit also includes a heat sink; the heat dissipation surfaces of the plurality of circuit boards are respectively attached to the same side of the heat sink.

5. The parallel semiconductor circuit according to any one of claims 1 to 4, characterized in that: Each of the circuit boards also comprises: Metal substrate; An insulating layer, the insulating layer being disposed on one side of the metal substrate; A circuit wiring layer, the circuit wiring layer is arranged on a side of the insulating layer away from the metal substrate; A plurality of components, wherein the plurality of components are arranged at intervals on a side of the circuit wiring layer away from the insulating layer, and the plurality of components and the components and the circuit wiring layer are electrically connected to each other; A package body, wherein the package body covers the plurality of the first pins, the plurality of the second pins, the metal substrate, the circuit wiring layer, and the plurality of the components; The first ends of the plurality of first pins extend outward through the package body respectively, the second ends of the plurality of first pins and the second ends of the plurality of second pins are respectively fixed to a side of the circuit wiring layer away from the insulating layer, and the socket is formed by an inward depression of the package body corresponding to the position of the second pin.

6. The parallel semiconductor circuit according to claim 5, characterized in that: The circuit board also includes a green oil layer which is arranged on the circuit wiring layer to avoid all the components.

7. The parallel semiconductor circuit according to claim 5, characterized in that: The plurality of components at least include chip resistors and chip capacitors that are spaced apart and arranged on the circuit wiring layer.

8. The parallel semiconductor circuit according to claim 5, characterized in that: The circuit board also includes a plurality of heat sinks spaced apart on the circuit wiring layer, and some of the components are respectively arranged on a side of the plurality of heat sinks away from the circuit wiring layer.

9. The parallel semiconductor circuit according to claim 5, characterized in that: Electrical connection is achieved between the plurality of components and between the components and the circuit wiring layer by binding metal wires.

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