Heat dissipation cabinet

Abstract

The invention provides a heat dissipation cabinet. The heat dissipation cabinet comprises a cabinet body and at least one fan arranged in the cabinet body. The cabinet body is provided with a containing space, an air inlet and an air outlet, and a first electronic device and a second electronic device are arranged in the containing space in a stepped mode. Due to the stepped configuration, the horizontal direction and the vertical direction of the first electronic equipment are not interfered by the second electronic equipment. Therefore, when the fan guides a gas to pass through the first electronic equipment for heat dissipation, the problem that the flow direction of the gas is disturbed or the temperature is unstable due to interference of the second electronic equipment is solved. Therefore, the gas for heat dissipation flows smoothly, and heat energy can be discharged more stably and quickly.

Description

Technical Field

[0001] The present application relates to a heat dissipation cabinet for accommodating electronic equipment or electrical equipment, and in particular, through the improvement of the structural configuration, the problem of interference of heat dissipation gas is avoided, and the heat dissipation gas flows smoothly, so as to discharge the heat energy generated by the electronic equipment or electrical equipment more stably and quickly. Background Art

[0002] In the field of measurement, when an electronic device under test is subjected to electrical measurement, the input power required by the electronic device under test gradually increases, but a single electronic device that provides output power is no longer able to provide the input power required by the electronic device under test. Therefore, multiple electronic devices can be connected in series or in parallel to selectively add up the output power of each electronic device and input it to the electronic device under test to perform electrical measurement on the electronic device under test.

[0003] For the convenience of management and control, multiple electronic devices can be placed in a cabinet together. And because each electronic device generates heat during operation, the cabinet must have a corresponding heat dissipation mechanism to discharge the heat generated by multiple electronic devices in the same cabinet.

[0004] Generally speaking, when more than two electronic devices are placed in a cabinet, the configuration relationship between each electronic device may cause the heat generated by each electronic device to interfere with each other, thereby reducing the heat dissipation efficiency of the heat dissipation mechanism. The following is a further explanation based on the different configurations between each electronic device:

[0005] 1. Please refer to Figure 6 , Figure 6 This is a schematic diagram of the first internal configuration of a cabinet in the prior art. As shown in the figure, the two electronic devices 61 and 62 configured in the cabinet 6 are arranged one above the other, and there is a gap between the two electronic devices 61 and 62, and an interlaced space is formed in the gap (as shown by the dotted circle in the figure). Part of the hot air discharged from the electronic device 61 (as shown by the arrow in the figure) will inevitably pass through the interlaced space and then be sucked into the electronic device 62. Since the electronic device 62 inhales part of the hot air discharged from the electronic device 61, the heat dissipation effect of the electronic device 62 is affected.

[0006] 2. Please refer to Figure 7 , Figure 7Schematic diagram of the second internal configuration of the cabinet in the prior art. As shown in the figure, the two electronic devices 71 and 72 configured in the cabinet 7 are arranged one in front and one in the back, wherein the electronic device 71 is located in the front and the electronic device 72 is located in the back. Although this configuration can avoid the mutual interference of the two electronic devices 71 and 72 during heat dissipation, the disadvantage is that there is insufficient space for dismantling or maintaining the electronic device 72 located in the back, and it is not easy to dismantle or repair it. Specifically, when the electronic device 72 in the back fails and needs to be repaired, since the electronic device 72 is arranged directly behind the electronic device 71, the maintenance personnel must bypass the electronic device 71 to dismantle or repair the electronic device 72. Summary of the invention

[0007] The heat dissipation cabinet of the present application is used to install a first electronic device and a second electronic device, and includes a cabinet body and at least one fan. The cabinet body has a accommodating space, an air inlet and an air outlet. The first electronic device and the second electronic device are installed in the accommodating space in a stepped manner. The first electronic device and the second electronic device divide the accommodating space into an air inlet area and an air outlet area. The air inlet area is connected to the air inlet, and the air outlet area is connected to the air outlet. The fan is installed in the cabinet body. The fan is used to guide a gas from the air inlet into the air inlet area, a part of the gas passes through the first electronic device from the air inlet area into the air outlet area to form a first heat dissipation path, and another part of the gas passes through the second electronic device from the air inlet area into the air outlet area to form a second heat dissipation path. The gas on the first heat dissipation path and the gas on the second heat dissipation path do not interfere with each other.

[0008] Since the first electronic device and the second electronic device are arranged in a stepped shape, the horizontal and vertical directions of the first electronic device will not be interfered with by the second electronic device. Therefore, when the gas is dissipated through the first electronic device, the gas flow will not be disturbed or the temperature will be unstable due to the interference of the second electronic device. When the gas flows smoothly, the heat energy can be discharged more stably and quickly, thereby stabilizing and improving the heat dissipation effect; similarly, the horizontal and vertical directions of the second electronic device will not be interfered with by the first electronic device, and the heat energy can be discharged more stably and quickly, thereby stabilizing and improving the heat dissipation effect. In addition, space can be reserved for the disassembly and maintenance of the first electronic device or the second electronic device.

[0009] In a preferred embodiment, the accommodating space is provided with a first frame and a second frame, the first frame having a first bottom frame and a first vertical frame, the first vertical frame being vertically connected to the rear side of the first bottom frame, and a first open area being provided between the first bottom frame and the first vertical frame, the first open area accommodating the first electronic device, the second frame having a second bottom frame and a second vertical frame, the second vertical frame being vertically connected to the rear side of the second bottom frame, and a second open area being provided between the second bottom frame and the second vertical frame, the second open area accommodating the second electronic device.

[0010] In a preferred embodiment, the rear side surface of the first vertical frame is flush with the front side edge of the second bottom frame, and the top side edge of the first vertical frame is flush with the bottom side surface of the second bottom frame.

[0011] In a preferred embodiment, the front side of the second bottom frame is vertically connected to at least one lug, and the lug is fixed to the rear side surface of the first vertical frame.

[0012] In a preferred embodiment, the rear surface of the second vertical frame is flush with the front edge of the first bottom frame, and the top edge of the first vertical frame is flush with the bottom surface of the second bottom frame.

[0013] In a preferred embodiment, the cabinet body has an installation opening, a door panel is installed at the installation opening, and the first open area and the second open area both face the installation opening.

[0014] In a preferred embodiment, the air outlet area is equipped with a partition, the first electronic device and the second electronic device are located in front of the partition, a duct is formed between the rear side of the partition and the inner side of the cabinet body, an electrical device is installed in the air inlet area, the gas enters the duct from the air inlet area through the electrical device to form a third heat dissipation path, and the gas on the third heat dissipation path, the gas on the first heat dissipation path and the gas on the second heat dissipation path do not interfere with each other. The cabinet body has an air duct outlet, the air duct outlet is connected to the air duct, and the fan is installed at the air duct outlet.

[0015] In a preferred embodiment, the fan is installed at the air inlet, the air outlet, the first heat dissipation path or the second heat dissipation path.

[0016] The details of other effects and embodiments of the present application are described below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 It is a schematic diagram on the right side of the first embodiment of the overall structure of the heat dissipation cabinet of the present application;

[0019] Figure 2 It is a schematic diagram of the right side of the first embodiment structure of the first frame and the second frame of the heat dissipation cabinet of the present application;

[0020] Figure 3 It is a schematic diagram of the right side of the second embodiment structure of the first frame and the second frame of the heat dissipation cabinet of the present application;

[0021] Figure 4 This is a right side schematic diagram of the third embodiment of the overall structure of the heat dissipation cabinet of the present application;

[0022] Figure 5 It is a right side schematic diagram of the fourth embodiment of the overall structure of the heat dissipation cabinet of the present application;

[0023] Figure 6 It is a schematic diagram of the first internal configuration of a cabinet in the prior art;

[0024] Figure 7 It is a schematic diagram of the second internal configuration of the cabinet in the prior art.

[0025] Explanation of symbols

[0026] 1: Cabinet body 11: Accommodation space

[0027] 111: Air inlet area 112: Air outlet area

[0028] 12: Air inlet 13: Air outlet

[0029] 14: First frame 141: First bottom frame

[0030] 142: First vertical frame 143: First open area

[0031] 15: Second frame 151: Second bottom frame

[0032] 152: Second vertical frame 153: Second open area

[0033] 154: Lug 16: Mounting port

[0034] 17: Door panel 18: Partition panel

[0035] 19: Air duct 191: Air duct outlet

[0036] 2: First electronic device 3: Second electronic device

[0037] 4: Electrical equipment 5: Fan

[0038] 6: Cabinet 61: Electronic equipment

[0039] 62: Electronic equipment 7: Cabinet

[0040] 71: Electronic equipment 72: Electronic equipment

[0041] A: Gas W1: First heat dissipation path

[0042] W2: Second heat dissipation path W3: Third heat dissipation path

[0043] L1: Chain line L2: Chain line

[0044] L3: Chain line L4: Chain line DETAILED DESCRIPTION

[0045] The positional relationships described in the following embodiments include: up, down, left and right. Unless otherwise specified, they are all based on the directions in which the components are drawn in the drawings.

[0046] See also Figure 1 , Figure 1 The right side schematic diagram of the first embodiment of the overall structure of the heat dissipation cabinet of the present application. As shown in the figure, the present embodiment includes a cabinet body 1, and the cabinet body 1 has a containing space 11, an air inlet 12 and an air outlet 13. Figure 1 In the illustrated embodiment, the accommodating space 11 is enclosed inside the cabinet body 1, and the air inlet 12 is located at the front side of the cabinet body 1, and the air outlet 13 is located at the top side of the cabinet body 1. In this embodiment, the position of the air inlet 12 on the cabinet body 1 is not limited, and the air inlet 12 can be located on any side of the cabinet body 1, as long as the position of the air inlet 12 can smoothly allow the gas to pass through the air inlet 12 and enter the accommodating space 11. Similarly, this embodiment also does not limit the position of the air outlet 13 on the cabinet body 1, and the air outlet 13 can be located on any side of the cabinet body 1, as long as the position of the air outlet 13 can smoothly allow the gas to pass through the air outlet 13 from the accommodating space 11 and be discharged from the cabinet body 1.

[0047] In addition, a first electronic device 2 and a second electronic device 3 are installed in the accommodation space 11 in a stepped manner. Figure 1The embodiment drawn is a right side perspective, in which the diagonal of the first electronic device 2 is connected to the diagonal of the second electronic device 3, and the diagonal of the first electronic device 2 is in the same direction as the diagonal of the second electronic device 3. More specifically, the upper right corner of the first electronic device 2 is connected to the lower left corner of the second electronic device 3. Therefore, the outlines of the first electronic device 2 and the second electronic device 3 are stepped from the lower left to the upper right. Since the first electronic device 2 and the second electronic device 3 are in such a configuration, no gap is generated between the first electronic device 2 and the second electronic device 3. In this way, the accommodating space 11 can be divided into an air inlet area 111 and an air outlet area 112 with the first electronic device 2 and the second electronic device 3 as the dividing line. Among them, the air inlet area 111 is connected to the air inlet 12, and the air outlet area 112 is connected to the air outlet 13.

[0048] Then, at Figure 1 In the illustrated embodiment, a gas A for heat dissipation can enter the air inlet area 111 through the air inlet 12, and the gas A can pass through the first electronic device 2 or the second electronic device 3 in the air inlet area 111. Part of the gas A passes through the first electronic device 2 from the air inlet area 111 to the air outlet area 112 to form a first heat dissipation path W1, and another part of the gas A passes through the second electronic device 3 from the air inlet area 111 to the air outlet area 112 to form a second heat dissipation path W2. Since there is no gap between the first electronic device 2 and the second electronic device 3, after entering the air inlet area 111, the gas A can only enter the air outlet area 112 through the first electronic device 2 or the second electronic device 3, so that the first heat dissipation path W1 and the second heat dissipation path W2 form two independent paths for the gas A to pass through. In other words, the gas A has no other path (gap) to flow except through the first electronic device 2 or the second electronic device 3, so that the gas A will not flow randomly, and further, the gas A passing through the first electronic device 2 on the first heat dissipation path W1 and the gas A passing through the second electronic device 3 on the second heat dissipation path W2 will not interfere with each other. In practice, the front and rear ends of the first electronic device 2 and the second electronic device 3 both have holes or grooves for gas to pass through (not shown in the figure), in order to match the flow field direction of the gas A from bottom to top (equivalent to Figure 1 In order to determine the direction of the first heat dissipation path W1 and the second heat dissipation path W2, the first electronic device 2 and the second electronic device 3 must be flipped forward or backward by 90 degrees, so that the holes or grooves for gas to pass through on the first electronic device 2 and the second electronic device 3 are turned from the front and rear ends to the upper and lower ends, so that the gas A can pass through the first electronic device 2 or the second electronic device 3 from bottom to top, thereby achieving the purpose of heat dissipation.

[0049] At Figure 1In the embodiment shown, the accommodation space 11 is further provided with a first frame 14 and a second frame 15, the first frame 14 is used to install the first electronic device 2, and the second frame 15 is used to install the second electronic device 3. The installation method may be any method such as using threads, tenons, quick release parts, positioning slide rails, fasteners, nails, adhesives or welding, as long as the installation between the first electronic device 2 and the first frame 14, the installation between the first frame 14 and the accommodation space 11, the installation between the second electronic device 3 and the second frame 15, or the installation between the second frame 15 and the accommodation space 11 will not be easily separated or dropped, it belongs to the scope of the installation described in this embodiment.

[0050] For the design of the first frame 14 and the second frame 15, please refer to Figure 2 , Figure 2 The first embodiment of the heat dissipation cabinet of the present application is a schematic diagram of the first frame 14 and the second frame 15 on the right side. As shown in the figure, the first frame 14 is a thin plate-shaped frame, and the first frame 14 has a first bottom frame 141 and a first vertical frame 142. In this embodiment, the first vertical frame 142 is vertically connected to the rear side of the first bottom frame 141, so that the first bottom frame 141 and the first vertical frame 142 are L-shaped, and there is a first open area 143 between the first bottom frame 141 and the first vertical frame 142, and the first open area 143 accommodates the first electronic device 2, so that the first electronic device 22 can be installed on the first frame 14. Next, the second frame 15 has a second bottom frame 151 and a second vertical frame 152. The second vertical frame 152 is vertically connected to the rear side of the second bottom frame 151, so that the second bottom frame 151 and the second vertical frame 152 are L-shaped, and a second open area 153 is provided between the second bottom frame 151 and the second vertical frame 152. The second open area 153 accommodates the second electronic device 3, so that the second electronic device 3 can be installed on the second frame 15.

[0051] At Figure 2 In the embodiment shown, the second frame 15 is located at the upper right of the first frame 14. More specifically, the rear surface of the first vertical frame 142 is flush with the front edge of the second bottom frame 151 (the flush baseline is equivalent to Figure 2 The top edge of the first vertical frame 142 is flush with the bottom surface of the second bottom frame 151 (the flush baseline is equivalent to Figure 2 In this way, when the first electronic device 2 is mounted on the first frame 14 and the second electronic device 3 is mounted on the second frame 15, the first electronic device 2 and the second electronic device 3 can be arranged in a step-like manner from the lower left to the upper right. In addition, in one example, the front side of the second bottom frame 151 is vertically connected to at least one lug 154, and the lug 154 is used to be fixed on the rear side surface of the first vertical frame 142, so that the first vertical frame 142 and the second bottom frame 151 are in a close fit.

[0052] The above-mentioned embodiment is only the first embodiment in which the first electronic device 2 and the second electronic device 3 are in a stepped shape. In order to more fully understand the features of the present application, another embodiment is disclosed below.

[0053] See also Figure 3 , Figure 3 This is a schematic diagram of the second embodiment of the structure of the first frame 14 and the second frame 15 in the heat dissipation cabinet of the present application. Figure 3 In the embodiment shown, the second frame 15 is located at the upper left of the first frame 14. More specifically, the rear surface of the second vertical frame 152 is flush with the front edge of the first bottom frame 141 (the flush baseline is equivalent to Figure 3 The top edge of the first vertical frame 142 is flush with the bottom surface of the second bottom frame 151 (the flush baseline is equivalent to Figure 2 Thus, when the first electronic device 2 is mounted on the first frame 14 and the second electronic device 3 is mounted on the second frame 15, the first electronic device 2 and the second electronic device 3 may be arranged in a stepped manner from the lower right to the upper left.

[0054] It is worth mentioning that the features disclosed in the first and second embodiments above are that only two electronic devices (the first electronic device 2 and the second electronic device 3) are installed. In other possible embodiments, three, four or more electronic devices may be added. Similarly, each electronic device is installed on a frame. As long as each electronic device is installed in the accommodating space 11 in a stepped manner, it can be regarded as a further embodiment of the present application.

[0055] See also Figure 4 , Figure 4 This is a schematic diagram of the third embodiment of the overall structure of the cabinet body 1 of the present application. Figure 4 In the illustrated embodiment, the cabinet body 1 further has an installation opening 16, which is located at the front side of the cabinet body 1. A door panel 17 is installed at the installation opening 16, and the door panel 17 is used to open or close the installation opening 16. When the first frame 14 or the second frame 15 is installed in the accommodating space 11, the first open area 143 and the second open area 153 both face the installation opening 16 (in this embodiment, equivalent to the front side of the cabinet body 1). After the operator opens the door panel 17, he can directly face the first open area 143 and the second open area 153, and can directly place the first electronic device 2 in the first open area 143, or place the second electronic device 3 in the second open area 153. Similarly, it is also convenient when maintaining the first electronic device 2 or the second electronic device 3.

[0056] See also Figure 5 , Figure 5This is a schematic diagram of the fourth embodiment of the overall structure of the cabinet body 1 of the present application. Figure 5 In the embodiment shown, the air outlet area 112 is also provided with a partition 18, the first electronic device 2 and the second electronic device 3 are located in front of the partition 18, a duct 19 is formed between the rear side of the partition 18 and the inner side of the cabinet body 1, and the cabinet body 1 has a duct outlet 191, which is connected to the duct 19, and an electrical device 4 is installed in the air inlet area 111, and the gas A enters the duct 19 from the air inlet area 111 through the electrical device 4 to form a third heat dissipation path W3. Since there is no gap between the first electronic device 2 and the second electronic device 3, and there is no gap between the second electronic device 3 and the partition 18, after entering the air inlet area 111, the gas A can only enter the air outlet area 112 through the first electronic device 2 or the second electronic device 3, or enter the duct 19 through the electrical device 4. The first heat dissipation path W1, the second heat dissipation path W2 and the third heat dissipation path W3 form three independent paths for the gas A to pass through. In other words, in addition to the three paths of passing through the first electronic device 2, the second electronic device 3 or entering the air duct 19, there is no other path (gap) for gas A to flow, so that gas A will not run around, and further, gas A passing through the first electronic device 2 on the first heat dissipation path W1, gas A passing through the second electronic device 3 on the second heat dissipation path W2, and gas A passing through the electrical device 4 on the third heat dissipation path W3 will not interfere with each other. The installation method can be any method such as using threads, tenons, quick release parts, positioning slides, fasteners, nails, adhesives or electric welding. As long as the installation between the air outlet area 112 and the partition 18, or the installation between the air inlet area 111 and the electrical device 4 will not be easily separated or dropped, it belongs to the scope of the installation described in this embodiment.

[0057] Also, please see Figure 1 , Figure 4-5 In the above embodiments, at least one fan 5 is installed in the cabinet body 1, and the fan 5 is used to guide the air A through the first heat dissipation path W1, the second heat dissipation path W2 or the third heat dissipation path W3. In the embodiments shown in Figures 1 and 4, the fan 5 is installed at the air outlet 13. Figure 5In the embodiment shown, the fan 5 is installed at the air outlet 13 and the air duct outlet 191. In the above embodiment, the position where the fan 5 is installed is not limited. In other embodiments, the fan 5 can also be installed at the air inlet 12, the air outlet 13, the first heat dissipation path W1, the second heat dissipation path W2 or the third heat dissipation path W3. As long as the fan 5 can guide the gas A through the first heat dissipation path W1, the second heat dissipation path W2 or the third heat dissipation path W3, it belongs to the category of installing the fan 5 in the cabinet body 1. The installation method may be any method such as using threads, latches, quick-release parts, positioning slides, fasteners, nails, adhesives or electric welding. As long as the installation between the fan 5 and the air inlet 12, the installation between the fan 5 and the air outlet 13, the installation between the fan 5 and the air duct outlet 191, the installation between the fan 5 and the first heat dissipation path W1, the installation between the fan 5 and the second heat dissipation path W2, or the installation between the fan 5 and the third heat dissipation path W3 will not be easily separated or dropped, it falls within the scope of the installation described in this embodiment.

[0058] In the above embodiments, the first electronic device 2, the second electronic device 3 and the electrical device 4 can be devices that generate heat, such as servers, power supplies, electronic loads, electronic measuring instruments, etc. However, the first electronic device 2 and the second electronic device 3 can be the same device, the first electronic device 2 and the electrical device 4 can be different devices, or the second electronic device 3 and the electrical device 4 can be different devices.

[0059] In summary, the cabinet body of the present application has the first electronic device and the second electronic device inside thereof arranged in a stepped manner. Therefore, the horizontal and vertical directions of the first electronic device will not be interfered with by the second electronic device. Therefore, when the gas is dissipated through the first electronic device, the interference of the second electronic device will not cause problems such as the gas flow being disturbed or the temperature being unstable. When the gas flows smoothly, the heat energy can be discharged more stably and quickly, thereby stabilizing and improving the heat dissipation effect; similarly, the horizontal and vertical directions of the second electronic device will not be interfered with by the first electronic device, and the heat energy can be discharged more stably and quickly, thereby stabilizing and improving the heat dissipation effect. In addition, space can be reserved for the disassembly and maintenance of the first electronic device or the second electronic device.

[0060] The embodiments and / or implementation methods described above are only used to illustrate the preferred embodiments and / or implementation methods for realizing the technology of the present application, and are not intended to limit the implementation methods of the technology of the present application in any form. Any technical personnel in this field may make slight changes or modifications to other equivalent embodiments without departing from the scope of the technical means disclosed in the content of the present application, but they should still be regarded as technologies or embodiments that are essentially the same as the present application.

Claims

1. A heat dissipation cabinet for installing a first electronic device and a second electronic device, characterized in that: The heat dissipation cabinet comprises: A cabinet body having a housing space, an air inlet and an air outlet, wherein the first electronic device and the second electronic device are installed in the housing space in a stepped manner, and the first electronic device and the second electronic device divide the housing space into an air inlet area and an air outlet area, wherein the air inlet area communicates with the air inlet, and the air outlet area communicates with the air outlet; and At least one fan installed in the cabinet body; The fan is used to guide a gas from the air inlet into the air inlet area, a portion of the gas passes through the first electronic device from the air inlet area into the air outlet area to form a first heat dissipation path, and another portion of the gas passes through the second electronic device from the air inlet area into the air outlet area to form a second heat dissipation path, and the gas on the first heat dissipation path and the gas on the second heat dissipation path do not interfere with each other.

2. The heat dissipation cabinet according to claim 1, characterized in that: The accommodating space is provided with a first frame and a second frame, the first frame having a first bottom frame and a first vertical frame, the first vertical frame being vertically connected to the rear side of the first bottom frame, and a first open area being provided between the first bottom frame and the first vertical frame, the first open area accommodating the first electronic device, the second frame having a second bottom frame and a second vertical frame, the second vertical frame being vertically connected to the rear side of the second bottom frame, and a second open area being provided between the second bottom frame and the second vertical frame, the second open area accommodating the second electronic device.

3. The heat dissipation cabinet according to claim 2, characterized in that: The rear side surface of the first vertical frame is flush with the front side edge of the second bottom frame, and the top side edge of the first vertical frame is flush with the bottom side surface of the second bottom frame.

4. The heat dissipation cabinet according to any one of claims 2 to 3, characterized in that: The front side of the second bottom frame is vertically connected to at least one lug, and the lug is fixed on the rear side surface of the first vertical frame.

5. The heat dissipation cabinet according to claim 2, characterized in that: The rear side surface of the second vertical frame is flush with the front side edge of the first bottom frame, and the top side edge of the first vertical frame is flush with the bottom side surface of the second bottom frame.

6. The heat dissipation cabinet according to claim 2, characterized in that: The cabinet body has an installation opening, a door panel is installed at the installation opening, and the first open area and the second open area both face the installation opening.

7. The heat dissipation cabinet according to any one of claims 1 to 6, characterized in that: The air outlet area is provided with a partition, the first electronic device and the second electronic device are located on the front side of the partition, an air duct is formed between the rear side of the partition and the inner side of the cabinet body, an electrical device is installed in the air inlet area, the gas enters the air duct from the air inlet area through the electrical device to form a third heat dissipation path, and the gas on the third heat dissipation path, the gas on the first heat dissipation path and the gas on the second heat dissipation path do not interfere with each other.

8. The heat dissipation cabinet according to claim 7, characterized in that: The cabinet body has an air duct outlet, the air duct outlet is communicated with the air duct, and the fan is installed at the air duct outlet.

9. The heat dissipation cabinet according to any one of claims 1 to 8, characterized in that: The fan is installed on the air inlet, the air outlet, the first heat dissipation path or the second heat dissipation path.

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