Patterning method of organic solar cell

Abstract

The invention discloses a patterning method of an organic solar cell. The patterning method mainly comprises the following steps: step 1, cutting a selected protective film according to a preset pattern; secondly, the organic solar cell comprises a substrate, and a first electrode layer is manufactured on the substrate; 3, plating a photovoltaic layer on the first electrode layer; 4, plating a second electrode layer on the photovoltaic layer; 5, attaching a protective film on the second electrode layer; step 6, carrying out dry etching on the substrate attached with the protective film; seventhly, the protective film is torn off after the substrate is subjected to dry etching, in this way, after the first electrode layer, the photovoltaic layer and the second electrode layer are manufactured and fixed on the substrate, the customized patterned protective film is attached, then dry etching treatment is conducted on the attached substrate, compared with a wet etching process, the operation process is simple, the cost is low, and the production efficiency is high. The influence of wet etching chemical liquid medicine on the photovoltaic layer is avoided, and the effect of effectively protecting the photovoltaic layer is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of battery patterning, and in particular to a method for patterning an organic solar cell. Background Art

[0002] With the development of science and technology, energy is becoming more and more important. People are using solar energy more and more widely. Solar cells are also becoming more and more popular. Organic solar cells are favored by the market because they are relatively soft. The patterning of the surface of solar cells can achieve improvements in optimizing the light capture structure on the surface of the cell, reducing surface recombination, optimizing the electrode layout, and improving the aesthetics of the cell. However, most organic solar cells are currently manufactured by solution method. If wet etching is used, it is easy to damage the organic photovoltaic layer, resulting in the performance of the cell being affected, which greatly restricts its development. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for patterning an organic solar cell without damaging the organic photovoltaic layer.

[0004] The objective of the present invention is achieved through the following technical solutions:

[0005] A patterning method for an organic solar cell mainly comprises the following steps:

[0006] The first step is to cut the selected protective film according to the preset pattern;

[0007] In the second step, the organic solar cell includes a substrate, and a first electrode layer is formed on the substrate;

[0008] In the third step, the first electrode layer is plated with a photovoltaic layer;

[0009] Step 4: plating a second electrode layer on the photovoltaic layer;

[0010] Step 5: attaching the protective film onto the second electrode layer;

[0011] Step 6, dry etching the substrate after attaching the protective film;

[0012] In the seventh step, the protective film is removed from the substrate after dry etching.

[0013] The present invention attaches the patterned cut protective film to a solar cell having the first electrode layer, the second electrode layer and a photovoltaic layer between the two layers for dry etching, thereby avoiding the influence of the etching chemical solution on the photovoltaic layer in traditional wet etching. Moreover, since the protective film is cut according to a preset pattern, it is ensured that during the dry etching process, the electrode layer and the photovoltaic layer will not be corroded, thereby maintaining their integrity and conductive properties.

[0014] In a preferred embodiment of the present invention, the dry etching adopts a laser or plasma etching process.

[0015] In a preferred embodiment of the present invention, the dry etching gas used in the dry etching is SF 6 , Cl 2 or 2 .

[0016] In a preferred embodiment of the present invention, the preset pattern on the protective film is cut by laser.

[0017] In a preferred embodiment of the present invention, the protective film is made of PI, PET or PE.

[0018] In a preferred embodiment of the present invention, the side of the protective film that is attached to the substrate has weak adhesion, and its peeling force is 1-10g / 25mm.

[0019] In a preferred embodiment of the present invention, the protective film wraps around the edge of the substrate.

[0020] In a preferred embodiment of the present invention, before the third step, a first pattern is etched on the first electrode layer, and before the fourth step, a second pattern is etched on the second electrode layer.

[0021] In a preferred embodiment of the present invention, the first pattern is formed by wet etching.

[0022] In a preferred embodiment of the present invention, the second pattern is formed by vapor deposition using a MASK mask.

[0023] The patterning method of the organic solar cell of the present invention is to attach a layer of customized patterned protective film after the first electrode layer, the photovoltaic layer and the second electrode layer are manufactured and fixed on the substrate, so as to protect the electrode layer and the photovoltaic layer on the substrate from physical damage, chemical corrosion and environmental pollution, and then perform dry etching on the attached substrate. Compared with the wet etching process, the operation process is simple, and the influence of the wet etching chemical solution on the photovoltaic layer is avoided, so as to achieve the effect of effectively protecting the photovoltaic layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is a flow chart of the patterning method of the organic solar cell of the present invention;

[0026] Figure 2 This is a schematic diagram of a solar cell before dry etching according to Example 1 of the present invention;

[0027] Figure 3 It is a schematic diagram of the protective film of the present invention;

[0028] Figure 4 This is a schematic diagram of a solar cell before dry etching according to Example 2 of the present invention;

[0029] Figure 5 This is a schematic diagram of the first electrode layer of Example 2;

[0030] Figure 6 This is a schematic diagram of the second electrode layer of Example 2. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0032] It should be noted that the terms “first”, “second” and similar expressions used in this document are only for illustrative purposes and do not represent the only implementation methods.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] See also Figures 1 to 3 The patterning method of an organic solar cell mainly comprises the following steps:

[0035] The first step is to pattern-cut the selected protective film 5 according to a preset pattern;

[0036] In the second step, the organic solar cell includes a substrate 1, and a first electrode layer 2 is formed on the substrate 1;

[0037] In the third step, the first electrode layer 2 is plated with a photovoltaic layer 3;

[0038] Step 4: Plating a second electrode layer 4 on the photovoltaic layer 3;

[0039] Step 5: attaching a protective film 5 onto the second electrode layer 4;

[0040] Step 6: dry etching the substrate 1 after the protective film 5 is attached;

[0041] In the seventh step, the protective film 5 is removed from the substrate 1 after dry etching.

[0042] The present invention attaches the patterned cut protective film 5 to the solar cell substrate 1 having the first electrode layer 2, the second electrode layer 4 and the photovoltaic layer 3 between the two layers for dry etching. Since the protective film 5 has a preset pattern corresponding to the desired etching pattern, it is easy to ensure the accuracy and integrity of the etching pattern. In the dry etching process, only the area not covered by the protective film is etched, thereby achieving accurate control of the etching pattern. In this way, the method of attaching the protective film 5 for dry etching avoids the influence of the etching chemical solution on the photovoltaic layer in traditional wet etching. Moreover, due to the protection of the protective film 5, it is ensured that during the dry etching process, the electrode layers 2, 4 and the photovoltaic layer 3 can maintain their integrity and conductive properties.

[0043] In specific implementation, dry etching can adopt laser or plasma etching process. In Example 1, dry etching adopts plasma etching process, and the main steps include the first step of cleaning the solar cell substrate processed by the above-mentioned patterning method; the second step of placing the processed substrate 1 into the cavity of the plasma etcher; the third step of vacuuming and fixing the substrate to ensure stability and accuracy during the etching process; the fourth step of setting the etching time and etching parameters, and starting the etcher; the fifth step of monitoring and adjusting according to the predetermined etching time and etching parameters.

[0044] In this embodiment, the dry etching gas used in the dry etching process may be SF 6 , Cl 2 or 2 The dry etching gas is activated into active particles in the plasma environment. These active particles react chemically with the etched material to form volatile products and are removed.

[0045] In the specific implementation of this embodiment, the protective film 5 can be made of a weakly sticky film material of PI, PET or PE with a peeling force of 1-10g / 25mm, and the preset pattern 51 on the protective film 5 is cut by laser to ensure accurate molding.

[0046] See also Figure 4 In the second embodiment, the protective film package 5 in this embodiment wraps the edge of the substrate 1 because the process requires to ensure that the substrate is fully protected during the dry etching process to prevent harmful substances or damage to the edge of the substrate during the placement process.

[0047] In this embodiment, see Figure 5-6The first electrode layer 2 is provided with a first pattern 21, and the second electrode layer 4 is provided with a second pattern 41. Before the photovoltaic layer 3 is plated on the first electrode layer 2 in the third step, the first electrode layer 2 is wet-etched to form the first pattern 21. The first pattern 21 of the first electrode layer 2 is preferably etched using a suitable wet etching solution, which can only remove unnecessary parts of the first electrode layer 2 without affecting the photovoltaic layer 3 to be plated thereon. The process is simple, the cost is low, and the damage to the substrate 1 is relatively small; before the second electrode layer 4 is plated on the photovoltaic layer 3 in the fourth step, the second electrode layer 4 is evaporated using a MASK mask to form the second pattern 41. Since the evaporated material will only be deposited at the holes of the MASK mask, the second electrode layer 4 is evaporated using the patterned MASK mask, which can ensure that the second pattern 41 of the second electrode layer 4 will not affect the photovoltaic layer 3 thereunder, and can avoid the contamination and damage of the photovoltaic layer 3 by harmful chemicals that may be used in the traditional photolithography process.

[0048] It should be noted that the preset pattern 51, the first pattern 21, and the second pattern 41 in the drawings of the present application are schematic diagrams and do not constitute actual limitations to the present application.

[0049] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A patterning method for an organic solar cell, mainly comprising the following steps: The first step is to cut the selected protective film according to the preset pattern; In the second step, the organic solar cell includes a substrate, and a first electrode layer is formed on the substrate; In the third step, the first electrode layer is plated with a photovoltaic layer; Step 4: coating the photovoltaic layer with a second electrode layer; Step 5: attaching the protective film onto the second electrode layer; Step 6, dry etching the substrate after attaching the protective film; In the seventh step, the protective film is removed from the substrate after dry etching.

2. The method for patterning an organic solar cell according to claim 1, characterized in that: The dry etching adopts a laser or plasma etching process.

3. The method for patterning an organic solar cell according to claim 1, characterized in that: The dry etching gas used in the dry etching is SF6, Cl2 or O2.

4. The method for patterning an organic solar cell according to claim 1, characterized in that: The preset pattern on the protective film is cut by laser.

5. The method for patterning an organic solar cell according to claim 1, characterized in that: The material of the protective film is PI, PET or PE.

6. The method for patterning an organic solar cell according to claim 1, characterized in that: The side of the protective film attached to the substrate has weak adhesiveness, and its peeling force is 1-10g / 25mm.

7. The method for patterning an organic solar cell according to claim 1, characterized in that: The protective film wraps around the edge of the substrate.

8. The method for patterning an organic solar cell according to claim 1, characterized in that: Before the third step, a first pattern is etched on the first electrode layer, and before the fourth step, a second pattern is etched on the second electrode layer.

9. The method for patterning an organic solar cell according to claim 8, characterized in that: The first pattern is formed by wet etching.

10. The method for patterning an organic solar cell according to claim 8, characterized in that: The second pattern is formed by vapor deposition using a MASK mask.

Images