A blanking mechanism for semiconductor device processing

Abstract

The present invention discloses a blanking mechanism for semiconductor device processing, which relates to the technical field of semiconductor device processing and includes a guiding component, a displacement component and a blanking component. The guiding component includes a guiding disk, a landing seat, a ventilation groove, a waste outlet, a blanking port, a first electromagnet and a second electromagnet. The landing seat is arranged inside the guiding disk. Benefiting from the annular design of the guiding disk and the displacement disk, the device can perform reciprocating blanking in a circular manner. Compared with the traditional blanking method using a manipulator, it can carry out blanking operations more efficiently. At the same time, it can automatically realize the quality inspection of semiconductor devices and the screening of defective products during the circular rotation. In addition, the circular rotation blanking also makes the structure of the device more compact, saving more space compared with the blanking using a manipulator. Moreover, the device of the present invention adopts a point-to-point blanking method without using precision positioning components, which not only saves costs but also has a lower failure rate than the blanking using a manipulator.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device processing, and particularly to a blanking mechanism for semiconductor device processing. Background Art

[0002] Semiconductor devices refer to various electronic components manufactured using the special electrical properties of semiconductor materials (such as silicon, germanium, etc.). Due to their unique properties, these devices play an extremely important role in modern electronic technology. According to different functions and structures, semiconductor devices are divided into diodes, transistors, integrated circuits, etc. With the development of science and technology, new semiconductor materials and technologies have emerged continuously, promoting the research and application of more high-performance and lower-power semiconductor devices, and greatly driving the progress and development of information technology and related fields. During the processing of semiconductor devices, a blanking mechanism is usually required to make them fall onto the surface of the PCB board for subsequent assembly.

[0003] Common blanking mechanisms for semiconductor device processing on the market are often in the form of a manipulator. However, when using a manipulator for blanking, the blanking speed is often slow due to the long displacement stroke of the manipulator, and displacement accuracy errors are likely to occur when the displacement speed of the manipulator is fast. In addition, using a manipulator for blanking cannot detect semiconductor devices. If the semiconductor device body is damaged, it will cause PCB board failures after assembly with the PCB board.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a blanking mechanism for semiconductor device processing is proposed. Summary of the Invention

[0005] The purpose of the present invention is to provide a blanking mechanism for semiconductor device processing to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A blanking mechanism for semiconductor device processing, including a guiding component, a displacement component, and a blanking component. The guiding component includes a guiding disk, a landing seat, a ventilation groove, a waste outlet, a blanking port, a first electromagnet, and a second electromagnet. A landing seat is arranged inside the guiding disk, a waste outlet is opened inside the guiding disk, a blanking port is opened inside the guiding disk, a first electromagnet and a second electromagnet are buried inside the guiding disk. A fixing frame is arranged at the outer end of the guiding disk, and a material cylinder is arranged at the outer end of the fixing frame. A motor is arranged at the outer end of the guiding disk, and a driving gear is arranged at the output end of the motor. A displacement component is arranged inside the guiding disk. A suction and blowing integrated machine is arranged at the top end of the fixing frame, and a blowing port is arranged at the outer side of the bottom of the suction and blowing integrated machine. A vision camera is arranged at the outer end of the fixing frame.

[0007] Further, the displacement component includes a displacement disk, meshing grooves, balls, a material receiving disk, a clamping seat, a tension spring, an armature, and a magnetic force transmission plate. The outer end of the displacement disk is provided with meshing grooves, and balls are arranged at the bottom end of the displacement disk. The inner sides of both ends of the displacement disk are provided with material receiving disks, and clamping seats are arranged inside the material receiving disks. A tension spring is arranged between the material receiving disks, and an armature is arranged at the outer end of the material receiving disk. A magnetic force transmission plate is embedded inside the displacement disk.

[0008] Further, the guiding disk is sleeved and connected with the displacement disk, and the balls are in contact with the lower surface of the displacement disk.

[0009] Further, the driving gear is meshed with the meshing grooves, and the displacement disk rotates inside the guiding disk through the meshing of the driving gear and the meshing grooves.

[0010] Further, the magnetic force transmission plate transmits the magnetic forces of the first electromagnet and the second electromagnet, and the magnetic force transmission plate is electromagnetically adsorbed and connected with the armature.

[0011] Further, the material receiving disks are elastically connected through the tension spring, and the material receiving disks are fixedly connected with the armature.

[0012] Further, a suction pipe is arranged at the top end of the suction and blowing integrated machine, and a docking seat is arranged at the end of the suction pipe. An electric push rod is arranged at the bottom end of the docking seat, and an airtight cover is arranged at the bottom end of the electric push rod. An air suction hose is arranged between the docking seat and the airtight cover. A blanking component is arranged at the outer side of the bottom of the guiding disk.

[0013] Further, the blanking component includes a blanking seat A, a blanking seat B, a pressure spring, an airtight soft film, a suction groove, and an electric control stopper. The blanking seat B is arranged at the outer side of the bottom of the blanking seat A, and a pressure spring is arranged between the blanking seat A and the blanking seat B. An airtight soft film is arranged between the blanking seat A and the blanking seat B. A suction groove is arranged at the outer side of the bottom of the blanking seat B, and an electric control stopper is arranged at the inner side of the bottom of the blanking seat B.

[0014] Further, the suction pipe is communicated with the airtight cover through the docking seat and the air suction hose, and the airtight cover is communicated with the inside of the blanking seat A and the blanking seat B through a blanking port.

[0015] Further, the blanking seat A is sleeved and connected with the blanking seat B, and the blanking seat B is elastically connected with the blanking seat A through the pressure spring.

[0016] The present invention provides a blanking mechanism for semiconductor device processing, and has the following beneficial effects:

[0017] 1. The rotation of the displacement disk of the present invention can drive the semiconductor device to move to the intersection of the magnetic force transfer plate and the first electromagnet and the second electromagnet. At this time, the magnetic forces of the first electromagnet and the second electromagnet can be transferred to the magnetic force transfer plate, enabling the magnetic force transfer plate to obtain magnetic force. After the magnetic force transfer plate generates magnetic force, it can attract the armature. After the armature is attracted, it can pull the material receiving tray to displace in the direction of the magnetic force transfer plate and stretch the tension spring. This enables the material receiving trays on both sides of the device to generate an outward pulling force on the fixed semiconductor device. If the current semiconductor device has internal damage or cracks, it will be damaged or broken under this pulling force. Through this design, the device can detect whether the current semiconductor device is damaged, and the device can adjust the pulling force by controlling the magnetic force magnitudes of the first electromagnet and the second electromagnet. This enables the device to flexibly adjust the pulling force magnitude according to the type of the detected semiconductor device, making the use of the device more flexible. At the intersection of the magnetic force transfer plate and the first electromagnet and the second electromagnet, the material receiving tray is exactly at the top of the ventilation groove. During the pulling test process, through the operation of the suction and blowing integrated machine, high-speed air flow can be blown out through the air blowing port. This enables the high-speed air flow to blow on the surface of the semiconductor device and pass through the ventilation groove. Through the blowing of the high-speed air flow in cooperation with the pulling in the above process, if there are cracks or fragments burst out on the surface of the semiconductor device, they will be blown out of the ventilation groove under the blowing of the high-speed air flow. This enables it to be easier to photograph the damaged state after the semiconductor device is moved to the bottom of the vision camera.

[0018] 2. After the semiconductor device of the present invention is moved to the top of the blanking port, the clamping seat releases the semiconductor device, enabling the semiconductor device to enter the inside of the blanking A seat from the blanking port. Since the blanking A seat is connected to the blanking B seat, finally the semiconductor device will fall to the bottom of the blanking B seat and be blocked by the electric control stopper. The inner contour size of the bottom of the blanking B seat matches the outer contour size of the semiconductor device, enabling the semiconductor device to block the bottom of the blanking B seat. After the semiconductor device has completed blanking, through the operation of the electric push rod, it can drive the sealing cover to fit with the top surface of the displacement disk. Through the buckling of the sealing cover, it can be connected to the inside of the displacement disk, the blanking A seat and the blanking B seat. At this time, the suction and blowing integrated machine performs suction work, and the suction force can be transferred to the inside of the sealing cover through the suction pipe, the docking seat and the suction hose. And at this time, the sealing cover is connected to the inside of the blanking B seat, and the suction force can be transferred to the outside of the device through the suction groove. The landing point when the outer contour of the blanking B seat completely fits with the outer contour of the material seat is the assembly point of the semiconductor device and the PCB board, and the material seat can load the PCB board. After the suction force is transferred from the suction groove to the outside, under the action of the suction force, the blanking B seat will squeeze the pressure spring for position adjustment until it fits with the material seat. Through this design, if the positioning point of the blanking B seat material seat is offset, the device can still adjust the blanking B seat to the specified blanking point. And under the action of the suction force, the device can also effectively clean the dust and foreign matters adhered to the surfaces of the PCB board and the material seat, avoiding short circuits due to dust and foreign matters when the semiconductor device is installed on the PCB board.

[0019] 3. Benefiting from the annular design of the guiding disk and the displacement disk, the device can perform reciprocating blanking in a circular motion. Compared with the traditional blanking method using a manipulator, it can perform blanking operations more efficiently. At the same time, it can automatically detect the quality of semiconductor devices and screen out defective products during the circular rotation process. In addition, the circular rotation blanking makes the structure of the device more compact, saving more space compared with the blanking using a manipulator. And this device adopts a point-to-point blanking method without using precision positioning components, which not only saves costs but also has a lower failure rate than the blanking using a manipulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 FIG. A is a schematic perspective view of the overall structure of a blanking mechanism for semiconductor device processing according to the present invention;

[0021] Figure 2 FIG. B is a schematic perspective view of the overall structure of a blanking mechanism for semiconductor device processing according to the present invention;

[0022] Figure 3 FIG. C is a schematic perspective view of the overall structure of a blanking mechanism for semiconductor device processing according to the present invention;

[0023] Figure 4 FIG. is a schematic top view of the displacement component of a blanking mechanism for semiconductor device processing according to the present invention;

[0024] Figure 5 For a blanking mechanism for semiconductor device processing according to the present invention Figure 4 The enlarged schematic view at position A in;

[0025] Figure 6 FIG. is a schematic view of the overall structure of the displacement component of a blanking mechanism for semiconductor device processing according to the present invention;

[0026] Figure 7 FIG. is a schematic view of the blanking state of the blanking position B of a blanking mechanism for semiconductor device processing according to the present invention;

[0027] Figure 8 FIG. is a schematic cross-sectional view of the overall structure of a blanking mechanism for semiconductor device processing according to the present invention;

[0028] Figure 9 FIG. is a schematic cross-sectional view of the overall structure of a blanking mechanism for semiconductor device processing according to the present invention.

[0029] In the figure: 1. Guide component; 101. Guide disk; 102. Landing seat; 103. Ventilation groove; 104. Waste outlet; 105. Feeding port; 106. First electromagnet; 107. Second electromagnet; 2. Fixed frame; 3. Cylinder; 4. Motor; 5. Driving gear; 6. Displacement component; 601. Displacement disk; 602. Engaging tooth groove; 603. Ball; 604. Material receiving tray; 605. Engaging seat; 606. Tension spring; 607. Armature; 608. Magnetic force transfer plate; 7. Suction and blowing integrated machine; 8. Blowing port; 9. Vision camera; 10. Suction pipe; 11. Docking seat; 12. Electric push rod; 13. Sealing cover; 14. Suction hose; 15. Material dropping component; 1501. Material dropping seat A; 1502. Material dropping seat B; 1503. Pressure spring; 1504. Sealing soft film; 1505. Suction groove; 1506. Electric control stop block. Detailed implementation manners

[0030] Please refer to Figures 1 to 9 , the present invention provides a technical solution: a feeding mechanism for semiconductor device processing, including a guide component 1, a displacement component 6 and a material dropping component 15. The guide component 1 includes a guide disk 101, a landing seat 102, a ventilation groove 103, a waste outlet 104, a feeding port 105, a first electromagnet 106 and a second electromagnet 107. A landing seat 102 is arranged inside the guide disk 101, and a waste outlet 104 is opened inside the guide disk 101. A feeding port 105 is opened inside the guide disk 101. The first electromagnet 106 and the second electromagnet 107 are buried inside the guide disk 101. A fixed frame 2 is arranged at the outer end of the guide disk 101, and a cylinder 3 is arranged at the outer end of the fixed frame 2. A motor 4 is arranged at the outer end of the guide disk 101, and a driving gear 5 is arranged at the output end of the motor 4. A displacement component 6 is arranged inside the guide disk 101. A suction and blowing integrated machine 7 is arranged at the top end of the fixed frame 2, and a blowing port 8 is arranged at the outer bottom of the suction and blowing integrated machine 7. A vision camera 9 is arranged at the outer end of the fixed frame 2.

[0031] Please refer to Figures 1 to 9, the displacement component 6 includes a displacement disk 601, an engaging tooth groove 602, a ball 603, a material receiving disk 604, a clamping seat 605, a tension spring 606, an armature 607, and a magnetic force transmission plate 608. An engaging tooth groove 602 is provided at the outer end of the displacement disk 601, and a ball 603 is provided at the bottom end of the displacement disk 601. Material receiving disks 604 are provided on both inner sides of the displacement disk 601, and a clamping seat 605 is arranged inside the material receiving disk 604. A tension spring 606 is provided between the material receiving disks 604, and an armature 607 is provided at the outer end of the material receiving disk 604. A magnetic force transmission plate 608 is embedded inside the displacement disk 601. The guiding disk 101 is sleeved and connected with the displacement disk 601, and the ball 603 is in contact with the lower surface of the displacement disk 601. The driving gear 5 is engaged with the engaging tooth groove 602, and the displacement disk 601 rotates inside the guiding disk 101 through the engagement of the driving gear 5 and the engaging tooth groove 602. The magnetic force transmission plate 608 transmits the magnetic forces of the first electromagnet 106 and the second electromagnet 107, and the magnetic force transmission plate 608 is electromagnetically adsorbed and connected with the armature 607. The material receiving disks 604 are elastically connected through the tension spring 606, and the material receiving disk 604 is fixedly connected with the armature 607. A suction pipe 10 is arranged at the top end of the suction and blowing integrated machine 7, and a docking seat 11 is provided at the end of the suction pipe 10. An electric push rod 12 is arranged at the bottom end of the docking seat 11, and an airtight cover 13 is provided at the bottom end of the electric push rod 12. An air suction hose 14 is provided between the docking seat 11 and the airtight cover 13. A blanking component 15 is provided on the outer side of the bottom of the guiding disk 101. The blanking component 15 includes a blanking seat A 1501, a blanking seat B 1502, a pressure spring 1503, an airtight soft film 1504, a suction groove 1505, and an electric control stopper 1506. A blanking seat B 1502 is provided on the outer side of the bottom of the blanking seat A 1501, and a pressure spring 1503 is provided between the blanking seat A 1501 and the blanking seat B 1502. An airtight soft film 1504 is provided between the blanking seat A 1501 and the blanking seat B 1502. A suction groove 1505 is provided on the outer side of the bottom of the blanking seat B 1502, and an electric control stopper 1506 is provided on the inner side of the bottom of the blanking seat B 1502. The suction pipe 10 is connected to the airtight cover 13 through the docking seat 11 and the air suction hose 14, and the airtight cover 13 is connected to the inside of the blanking seat A 1501 and the blanking seat B 1502 through a blanking port 105. The blanking seat A 1501 is sleeved and connected with the blanking seat B 1502, and the blanking seat B 1502 is elastically connected with the blanking seat A 1501 through the pressure spring 1503;

[0032] The specific operation is as follows. By the operation of the barrel 3, the semiconductor device to be processed can be sent out from its bottom outlet. The landing seat 102 and the bottom outlet of the barrel 3 are on the same vertical line, which enables the semiconductor device moved out from the inside of the barrel 3 to fall onto the top of the landing seat 102. And the receiving tray 604 is arranged at the outer end of the top of the landing seat 102, which enables the semiconductor device to be surrounded by the receiving tray 604 after falling onto the top of the landing seat 102. At this time, by the operation of the engaging seat 605, the semiconductor device can be clamped. At this time, by the motor 4 driving the driving gear 5 to rotate, the driving gear 5 can drive the displacement disk 601 to rotate inside the guiding disk 101 through the engagement with the meshing tooth grooves 602. Since the engaging seat 605 is clamping the semiconductor device at this time, the semiconductor device can rotate together with the rotation of the displacement disk 601. Through the rotation of the displacement disk 601, the semiconductor device can be moved to the intersection of the magnetic force transfer plate 608, the first electromagnet 106 and the second electromagnet 107. At this time, the magnetic forces of the first electromagnet 106 and the second electromagnet 107 can be transferred to the magnetic force transfer plate 608, making the magnetic force transfer plate 608 obtain magnetic force. After the magnetic force transfer plate 608 generates magnetic force, it can attract the armature 607. After the armature 607 is attracted, it can pull the receiving tray 604 to displace in the direction of the magnetic force transfer plate 608 and stretch the tension spring 606. This enables the receiving trays 604 on both sides of the device to generate an outward pulling force on the fixed semiconductor device. If the current semiconductor device has internal damage or cracks, it will be damaged or broken under this pulling force. Through this design, the device can detect whether the current semiconductor device is damaged. And the device can adjust the pulling force by controlling the magnetic force magnitudes of the first electromagnet 106 and the second electromagnet 107. This enables the device to flexibly adjust the pulling force magnitude according to the type of the detected semiconductor device, making the use of the device more flexible. At the intersection of the magnetic force transfer plate 608, the first electromagnet 106 and the second electromagnet 107, the receiving tray 604 is exactly at the top of the ventilation groove 103. During the pulling test process, by the operation of the suction and blowing integrated machine 7, high-speed air flow can be blown out through the blowing port 8. This enables the high-speed air flow to blow on the surface of the semiconductor device and pass through the ventilation groove 103. Through the blowing of the high-speed air flow in cooperation with the pulling in the above process, if there are cracks or fragments cracked out on the surface of the semiconductor device, they will be blown out of the ventilation groove 103 under the blowing of the high-speed air flow. This enables the damaged state of the semiconductor device to be more easily photographed after it is moved to the bottom of the vision camera 9. And the semiconductor device detected as qualified by the vision camera 9 will be moved to the top of the blanking port 105, and the unqualified one will be released by the engaging seat 605 to move the semiconductor device out of the device from the waste outlet 104. After the qualified semiconductor device is moved to the top of the blanking port 105, the engaging seat 605 releases the semiconductor device, which enables the semiconductor device to enter the inside of the blanking A seat 1501 from the blanking port 105. Since the blanking A seat 1501 is connected to the blanking B seat 1502,Finally, the semiconductor device will fall to the bottom of the blanking seat B 1502 and be blocked by the electric control stopper 1506. The inner contour size of the bottom of the blanking seat B 1502 matches the outer contour size of the semiconductor device, which enables the semiconductor device to block the bottom of the blanking seat B 1502. After the semiconductor device is blanked, the electric push rod 12 works to drive the sealing cover 13 to fit with the top surface of the displacement plate 601. Through the fastening of the sealing cover 13, it can communicate with the inside of the displacement plate 601, the blanking seat A 1501 and the blanking seat B 1502. At this time, the suction and blowing integrated machine 7 performs the suction work. The suction force can be transmitted to the inside of the sealing cover 13 through the suction pipe 10, the docking seat 11, and the suction hose 14. And the sealing cover 13 is connected to the inside of the blanking seat B 1502 at this time, and the suction force can be transmitted to the outside of the equipment through the suction groove 1505. The landing point when the outer contour of the blanking seat B 1502 completely fits with the outer contour of the seat is the assembly point of the semiconductor device and the PCB board, and the seat can load the PCB board. After the suction force is transmitted from the suction groove 1505 to the outside, under the action of the suction force, the blanking seat B 1502 will squeeze the compression spring 1503 for adjustment until it fits with the seat. Through this design, if the positioning point of the blanking seat B 1502 seat is offset, the equipment can still adjust the blanking seat B 1502 to the specified blanking point. And under the action of the suction force, the equipment can also effectively clean the dust and foreign matters adhering to the surfaces of the PCB board and the seat, avoiding short circuits caused by dust and foreign matters when the semiconductor device is installed on the PCB board. Thanks to the circular design of the guide plate 101 and the displacement plate 601, the equipment can perform reciprocating blanking in a circular manner. Compared with the traditional blanking method using a manipulator, it can perform blanking operations more efficiently. At the same time, it can automatically perform quality inspection of semiconductor devices and screening of unqualified products during the circular rotation process. In addition, the circular rotation blanking also makes the structure of the equipment more compact, saving more space compared to the blanking using a manipulator. And this equipment adopts a point-to-point blanking method and does not require the use of precision positioning components, which not only saves costs but also has a lower failure rate than the blanking using a manipulator.,

[0033] In summary, for the blanking mechanism used in the processing of semiconductor devices, during use, first, the material cylinder 3 works to send out the semiconductor devices to be processed from its bottom outlet. The landing seat 102 and the bottom outlet of the material cylinder 3 are on the same vertical line, which enables the semiconductor devices moved out from the inside of the material cylinder 3 to fall onto the top of the landing seat 102. And the receiving tray 604 is arranged at the outer end of the top of the landing seat 102, which enables the semiconductor devices to be surrounded by the receiving tray 604 after falling onto the top of the landing seat 102. At this time, through the work of the clamping seat 605, the semiconductor devices can be clamped;

[0034] Then, the motor 4 drives the rotation of the driving gear 5, enabling the driving gear 5 to drive the displacement disk 601 to rotate inside the guiding disk 101 through meshing with the meshing tooth groove 602. Since the clamping seat 605 is in a clamping state for the semiconductor device at this time, the semiconductor device can rotate together with the rotation of the displacement disk 601. Through the rotation of the displacement disk 601, the semiconductor device can be driven to move to the intersection of the magnetic force transfer plate 608, the first electromagnet 106, and the second electromagnet 107. At this time, the magnetic forces of the first electromagnet 106 and the second electromagnet 107 can be transferred to the magnetic force transfer plate 608, enabling the magnetic force transfer plate 608 to obtain magnetic force. After the magnetic force transfer plate 608 generates magnetic force, it can attract the armature 607. After the armature 607 is attracted, it can pull the material receiving tray 604 to displace in the direction of the magnetic force transfer plate 608 and stretch the tension spring 606. This enables the material receiving trays 604 on both sides of the device to generate an outward pulling force on the fixed semiconductor device. If the current semiconductor device has internal damage or cracks, it will be damaged or broken under this pulling force. Through this design, the device can detect whether the current semiconductor device is damaged, and the device can adjust the pulling force by controlling the magnetic force magnitudes of the first electromagnet 106 and the second electromagnet 107. This enables the device to flexibly adjust the pulling force magnitude according to the type of the detected semiconductor device, making the use of the device more flexible;

[0035] Next, at the intersection of the magnetic force transfer plate 608, the first electromagnet 106, and the second electromagnet 107, the material receiving tray 604 is exactly at the top of the ventilation groove 103. During the pulling test process, through the operation of the suction and blowing integrated machine 7, high-speed air flow can be blown out through the air blowing port 8. This enables the high-speed air flow to blow on the surface of the semiconductor device and pass through the ventilation groove 103. Through the blowing of the high-speed air flow in cooperation with the pulling in the above process, if there are cracks or fragments burst out on the surface of the semiconductor device, they will be blown out of the ventilation groove 103 under the blowing of the high-speed air flow. This enables the semiconductor device to be more easily photographed in a damaged state after moving to the bottom of the vision camera 9, and the semiconductor device detected as qualified by the vision camera 9 will move to the top of the blanking port 105, while the unqualified ones will be released by the clamping seat 605 and the semiconductor device will be removed from the device through the waste outlet 104;

[0036] Subsequently, after the qualified semiconductor device moves to the top of the blanking port 105, the clamping seat 605 releases the semiconductor device, enabling the semiconductor device to enter the inside of the blanking seat A 1501 from the blanking port 105. Since the blanking seat A 1501 is connected to the blanking seat B 1502, finally the semiconductor device will fall to the bottommost part of the blanking seat B 1502 and be blocked by the electric control block 1506. The inner contour size at the bottommost part of the blanking seat B 1502 matches the outer contour size of the semiconductor device, enabling the semiconductor device to block the bottom of the blanking seat B 1502;

[0037] Finally, after the blanking of the semiconductor device is completed, the electric push rod 12 works to drive the closed cover 13 to fit with the top surface of the displacement plate 601. Through the fastening of the closed cover 13, it can communicate with the inside of the displacement plate 601, the inside of the blanking seat A 1501 and the inside of the blanking seat B 1502. At this time, the suction and blowing integrated machine 7 performs suction work. The suction force can be transmitted to the inside of the closed cover 13 through the suction pipe 10, the docking seat 11, and the suction hose 14. And the closed cover 13 is connected to the inside of the blanking seat B 1502 at this time. The suction force can be transmitted to the outside of the device through the suction groove 1505. The landing point when the outer contour of the blanking seat B 1502 completely fits with the outer contour of the material seat is the assembly point of the semiconductor device and the PCB board. And the material seat can load the PCB board. After the suction force is transmitted from the suction groove 1505 to the outside, under the action of the suction force, the blanking seat B 1502 will squeeze the compression spring 1503 for position adjustment until it fits with the material seat. Through this design, if the positioning point of the blanking seat B 1502 material seat is offset, the device can still adjust the blanking seat B 1502 to the specified blanking point. And under the action of the suction force, the device can also effectively clean the dust and foreign objects adhering to the surfaces of the PCB board and the material seat, avoiding short circuits caused by dust and foreign objects when the semiconductor device is installed on the PCB board.

[0038] The embodiments of the present invention are given for purposes of illustration and description, and are not exhaustive or limit the invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to best explain the principles of the invention and its practical application, and to enable those of ordinary skill in the art to understand the invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A blanking mechanism for semiconductor device processing, characterized in that: The invention comprises a guide assembly (1), a displacement assembly (6) and a blanking assembly (15), wherein the guide assembly (1) comprises a guide plate (101), a landing seat (102), a venting groove (103), a waste outlet (104), a blanking port (105), a first electromagnet (106) and a second electromagnet (107), a landing seat (102) is provided inside the guide plate (101), a waste outlet (104) is provided inside the guide plate (101), a blanking port (105) is provided inside the guide plate (101), a first electromagnet (106) and a second electromagnet (107) are buried inside the guide plate (101), An electromagnet (106) and a second electromagnet (107), a fixing frame (2) is arranged on the outer end of the guide plate (101), and a barrel (3) is arranged on the outer end of the fixing frame (2), a motor (4) is arranged on the outer end of the guide plate (101), and a driving gear (5) is arranged on the output end of the motor (4), a displacement assembly (6) is arranged inside the guide plate (101), an exhaust and blow-in machine (7) is arranged on the top end of the fixing frame (2), and an air blowing port (8) is arranged on the outer side of the bottom of the exhaust and blow-in machine (7), and a visual camera (9) is arranged on the outer end of the fixing frame (2).

2. A blanking mechanism for semiconductor device processing according to claim 1, characterized in that: The displacement assembly (6) comprises a displacement disc (601), an engaging tooth groove (602), a ball bearing (603), a receiving disc (604), a snap-fit seat (605), a tension spring (606), an armature (607) and a magnetic force transmission plate (608). The outer end of the displacement disc (601) is provided with an engaging tooth groove (602), and the bottom end of the displacement disc (601) is provided with a ball bearing (603). The displacement disc (601) is provided with receiving discs (604) on both sides thereof, and the receiving disc (604) is provided with a snap-fit seat (605). A tension spring (606) is provided between the receiving discs (604), and the outer end of the receiving disc (604) is provided with an armature (607). The magnetic force transmission plate (608) is embedded in the displacement disc (601).

3. A blanking mechanism for semiconductor device processing according to claim 2, characterized in that: The guide plate (101) is sleeve-connected to the displacement plate (601), and the ball (603) is in contact with the lower surface of the displacement plate (601).

4. A blanking mechanism for semiconductor device processing according to claim 2, characterized in that: The driving gear (5) is meshed with the meshing tooth groove (602), and the displacement disc (601) rotates inside the guide disc (101) through the meshing of the driving gear (5) and the meshing tooth groove (602).

5. A blanking mechanism for semiconductor device processing according to claim 2, characterized in that: The magnetic force transmission plate (608) transmits the magnetic force of the first electromagnet (106) and the second electromagnet (107), and the magnetic force transmission plate (608) is connected to the armature (607) by electromagnetic attraction.

6. A blanking mechanism for semiconductor device processing according to claim 2, characterized in that: The receiving trays (604) are elastically connected to each other via a tension spring (606), and the receiving tray (604) is fixedly connected to the armature (607).

7. A blanking mechanism for semiconductor device processing according to claim 1, characterized in that: A suction pipe (10) is arranged at the top of the suction and blowing machine (7), and a docking seat (11) is arranged at the end of the suction pipe (10), an electric push rod (12) is arranged at the bottom end of the docking seat (11), and a sealed cover (13) is arranged at the bottom end of the electric push rod (12), an air suction hose (14) is arranged between the docking seat (11) and the sealed cover (13), and a blanking assembly (15) is arranged on the outer side of the bottom of the guide plate (101).

8. A material unloading mechanism for semiconductor device processing according to claim 7, characterized in that: The blanking assembly (15) includes a blanking seat A (1501), a blanking seat B (1502), a pressure spring (1503), a sealed soft film (1504), a suction groove (1505) and an electric control block (1506). The blanking seat B (1502) is provided on the outer side of the bottom of the blanking seat A (1501), and a pressure spring (1503) is provided between the blanking seat A (1501) and the blanking seat B (1502). A sealed soft film (1504) is provided between the blanking seat A (1501) and the blanking seat B (1502). A suction groove (1505) is provided on the outer side of the bottom of the blanking seat B (1502), and an electric control block (1506) is provided on the inner side of the bottom of the blanking seat B (1502).

9. A material unloading mechanism for semiconductor device processing according to claim 8, characterized in that: The suction pipe (10) is connected to the sealed cover (13) through the docking seat (11) and the suction hose (14), and the sealed cover (13) is connected to the inside of the blanking seat A (1501) and the blanking seat B (1502) through the discharge port (105).

10. A material unloading mechanism for semiconductor device processing according to claim 8, characterized in that: The blanking seat A (1501) is sleeve-connected with the blanking seat B (1502), and the blanking seat B (1502) is elastically connected to the blanking seat A (1501) via a pressure spring (1503).

Images