Automatic laser processing device and method for diamond material

Abstract

The automatic laser processing device comprises a feeding system and a discharging system, and further comprises a multi-shaft transmission system, a laser processing system, a laser processing system, a laser processing system, a laser processing system and a laser processing system, and the multi-shaft transmission system is used for transmitting diamond wafers and is connected with the feeding system; the spatial position adjusting system comprises a rotatable jig; the measurement identification system is used for measuring and positioning the diamond wafer and is arranged in the moving range of the spatial position adjusting system; the laser processing system is arranged opposite to the spatial position adjusting system; the central control system is electrically connected with all the systems; wherein the spatial position adjusting system can adjust the spatial position of the diamond wafer, so that the side surface of the diamond wafer is aligned with the laser processing system, and the processing of the side surface of the diamond wafer is realized. According to the scheme, advanced technologies such as an automatic feeding and discharging system, a measurement and recognition system, a multi-axis transmission system and a spatial position adjusting system are adopted, and automatic sampling, sample loading, positioning and machining of wafers are achieved.

Description

Technical Field

[0001] The invention relates to the technical field of diamond processing, and in particular to an automated laser processing device and a processing method for diamond materials. Background Art

[0002] Diamond is a typical hard and brittle material that is difficult to process. Currently, the main methods for cutting diamond are water jet cutting, diamond blade cutting and laser cutting. Laser cutting uses a focused high-power density laser beam to irradiate the workpiece, causing the irradiated material to melt, vaporize and ablate rapidly, thereby cutting the workpiece. When cutting diamond, its position needs to be fixed. However, in laser cutting, the cutting range is limited. When cutting at different positions, the position of the diamond needs to be fixed again before processing, which is inefficient. Existing laser cutting devices for diamond are difficult to automatically cut and process the positions of diamonds in all directions and angles. As for the fixation of diamonds, one of the current mainstream methods is to use a fixture, using glue adhesion or adsorption to fix one or several diamond particles on both sides of the fixture, and then manually position and process them. Since each laser processing requires manual removal and fixation of diamond particles, as well as manual measurement of diamond size, the entire process consumes a lot of manpower and machine time, and is inefficient. At the same time, this operation method requires high experience of the operator, limiting the number of machines that can be maintained by a single person. In addition, manual operation also leads to low positioning accuracy, which reduces the product yield. This production method is not conducive to effective monitoring and control of the product production process, further affecting product quality and production efficiency. Therefore, improving the convenience and accuracy of diamond processing positioning and improving the automation level of diamond laser cutting devices are issues that the industry needs to solve urgently.

[0003] Patent application number CN202411095069.7 discloses a diamond laser processing machine tool, including a bed, a gantry, a first slide and a second slide, a first laser assembly and a first glue dispensing assembly are arranged on the first Z-axis slide saddle, a first AC axis turntable is arranged on the first slide, a first glue positioning seat is arranged on the first AC axis turntable, a second AC axis turntable is arranged on the second slide, and a second glue positioning seat is arranged on the second AC axis turntable. In this scheme, the blank adopts the processing strategy of crown first and pavilion later, and effectively utilizes the double-station design of the machine tool, so that when processing the pavilion of a blank, another station can simultaneously pre-process the next blank, realizing the parallel operation of the processing and preparation process, and significantly improving the overall processing efficiency. Although this scheme realizes the parallel operation of some processes, it still requires manual replacement and positioning of diamonds, which may become a bottleneck in the entire processing process. Although the double-station design is adopted, it is impossible to realize the automatic all-round processing of diamond materials. Therefore, experienced operators are still required for precise positioning and operation. Summary of the invention

[0004] In response to the problems of inefficient manual operation, inaccurate positioning, low yield rate, etc. in the laser processing of diamond materials in the prior art mentioned in the background technology, this solution adopts advanced technologies such as automatic loading and unloading mechanism, measurement and identification system, multi-axis transmission system and spatial position adjustment system to realize automatic sampling, loading, positioning and processing of wafers, and realize fully automatic, high-precision and size-indifferent diamond material processing.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: An automated laser processing device for diamond materials, comprising a loading system and a unloading system, and further comprising: Multi-axis transmission system, which transmits diamond wafers and is connected to the feeding system; A spatial position adjustment system connected to the multi-axis transmission system, including a turntable; A measurement and recognition system is used to measure and locate the diamond wafer and is arranged within the moving range of the spatial position adjustment system; The laser processing system is arranged relative to the spatial position adjustment system; A central control system, electrically connected to the above systems; Among them, the spatial position adjustment system can adjust the spatial position of the diamond wafer so that the side of the diamond wafer is aligned with the laser processing system to achieve processing of the side of the diamond wafer.

[0006] The device realizes the full process automation of diamond wafer processing through the collaborative work of multiple subsystems. The connection between the multi-axis transmission system and the feeding system ensures the precise transmission of the wafer and can achieve sub-micron positioning accuracy. The turntable design of the spatial position adjustment system is the core innovation of this device. It can accurately adjust the spatial position of the wafer so that the side of the wafer is aligned with the laser processing system. This solution breaks through the limitation that the traditional processing method can only process the plane and improves the flexibility and comprehensiveness of the processing. The measurement and recognition system is set within the moving range of the spatial position adjustment system. This layout can realize real-time monitoring and feedback of the wafer and improve the adaptability and accuracy of the processing process. The relative setting of the laser processing system and the spatial position adjustment system ensures that the laser beam can be accurately focused on the processing surface of the wafer. The central control system realizes intelligent control of the entire processing process through electrical connection with each subsystem, which not only improves the processing efficiency and reduces the dependence on the operator's experience, but also significantly improves the product yield. In the long run, the application of this automation device will promote the development of the diamond material processing industry towards intelligent manufacturing and lay a technical foundation for more complex and sophisticated diamond processing needs in the future.

[0007] Preferably, the feeding system includes a silo and a material taking device, wherein a plurality of material trays for storing diamond wafers are arranged in the silo; the material taking device includes a positioning mechanism and a suction nozzle, wherein the positioning mechanism controls the suction nozzle to move in a three-dimensional space, and a micro-hole array is arranged on the surface of the suction nozzle, which is connected to a vacuum pump to realize the grabbing of diamond wafers. The design of providing a plurality of material trays for storing diamond wafers in the silo can improve the continuous working capacity of the device and reduce the frequent manual feeding. The positioning mechanism of the material taking device can control the suction nozzle to move in a three-dimensional space, and this design improves the flexibility and accuracy of material taking. A micro-hole array is arranged on the surface of the suction nozzle and is connected to a vacuum pump, and the stable grabbing of diamond wafers can be realized by using the vacuum adsorption principle. Compared with the traditional mechanical clamping method, vacuum adsorption can better protect the surface of the wafer and reduce damage. At the same time, this design is also suitable for wafers of different sizes and shapes, and improves the adaptability of the device. Compared with manual feeding, the automatic feeding system can shorten the feeding time from minutes to seconds, while ensuring the consistency of the feeding position, and providing a stable foundation for subsequent processing.

[0008] Furthermore, the suction nozzle of the material taking device also includes an air-inflating and pressure-relieving mechanism, which includes an air pump and a control valve, and is connected to the micropore array of the suction nozzle; when the diamond wafer needs to be released, the control valve is opened, and the micro air pump inflates the micropore array to overcome the vacuum suction force to achieve the release and transfer of the diamond wafer. The precise release and transfer of the diamond wafer is achieved by adding an air-inflating and pressure-relieving mechanism. The active release function is added on the basis of the original vacuum adsorption by using the pneumatic principle. Specifically, the air-inflating and pressure-relieving mechanism includes a micro air pump and a control valve, and is connected to the micropore array of the suction nozzle. When the wafer needs to be released, the control valve is opened, and the air pump inflates the micropores to generate an outward airflow pressure to overcome the vacuum suction force to achieve the wafer detachment. This design has the advantage of being more controllable than the passive release method that simply relies on cutting off the vacuum source. The air-inflating and pressure-relieving can be completed within milliseconds, which is conducive to improving the working efficiency of the equipment. At the same time, by adjusting the inflation pressure, the precise release control of wafers of different weights and sizes can also be achieved to prevent the wafers from falling or shifting in position. In addition, active inflation can remove possible tiny particles in the micropores and keep the adsorption nozzle clean. This design can reduce the impact force on the wafer and reduce defects such as edge cracking.

[0009] Furthermore, the measurement and identification system includes a thickness measuring device and a visual recognition device. The thickness measuring device includes a thickness measuring probe and a movable slide rail, and the thickness measuring device can accurately obtain the thickness of the wafer. The visual recognition device includes a light source module, a high-resolution camera and an image processing unit. The image processing unit adopts a deep learning algorithm to identify diamond wafers of different shapes and sizes and locate the edge and direction of the wafer. The light source module and the high-resolution camera are fixedly installed on the gantry, and cooperate with the spatial position adjustment system to use the center point of the fixture on the sample table as a reference to position the wafer. The control system automatically obtains the wafer position information and adjusts the processing starting point position. The system can accurately locate the edge and direction of the wafer, record the shape and size information of the wafer, and provide accurate wafer parameters for subsequent processing.

[0010] Furthermore, the multi-axis transmission system includes a Y-axis mobile platform and a Z-axis lifting mechanism; the Y-axis mobile platform includes a drive motor and a grating ruler; the Z-axis lifting mechanism adopts ball screw transmission and is connected to a servo motor to realize flexible material collection and loading of diamond wafers in the YZ plane. The Y-axis mobile platform adopts a combination of a drive motor and a grating ruler, which can achieve high-precision linear positioning. As a position feedback element, the grating ruler has a resolution of up to micron level, which can provide accurate position information for the system and effectively eliminate the cumulative error in mechanical transmission. The drive motor provides stable and controllable power output, and can achieve smooth and precise movement by forming a closed-loop control with the grating ruler. The Z-axis lifting mechanism adopts a solution combining ball screw transmission and servo motor. This design provides high rigidity and high-precision motion control in the vertical direction. The ball screw has the characteristics of low friction and high efficiency, and can accurately convert rotational motion into linear motion, while the use of the servo motor ensures rapid response and precise positioning of the motion.

[0011] Furthermore, the laser processing system includes a laser and an optical path system, and a galvanometer and a field mirror are sequentially arranged at the lower part of the laser. The optical path system guides the laser beam generated by the laser to the galvanometer, and the field mirror and the galvanometer work together to focus the laser beam on the processing surface of the diamond wafer. As an energy source, the laser can select an appropriate wavelength and power according to the characteristics of the diamond material to achieve the best processing effect. The galvanometer is one of the core components of the system. It uses a high-speed rotating mirror to control the direction of the laser beam to achieve fast and accurate two-dimensional scanning, and can also move the focus up and down to complete the cutting trajectory in the Z-axis direction. The field mirror works in conjunction with the galvanometer, and its main function is to focus the laser beam on the processing surface of the diamond wafer. The design of the field mirror needs to take into account the high refractive index and thermal conductivity of diamond to ensure that the laser energy is highly concentrated on the wafer surface while minimizing the heat-affected zone. This configuration can achieve an extremely small spot size, which can theoretically reach the diffraction limit, which is conducive to improving the processing accuracy. The combination of the galvanometer and the field mirror can also ensure that the spot characteristics are consistent throughout the scanning range, and can ensure the uniformity of large-area processing. The system design allows precise control of the energy density and pulse characteristics of the laser, which helps optimize processing parameters and achieve high-quality cutting or surface treatment. In addition, technicians can integrate a real-time monitoring system to monitor the processing process through spectral analysis or high-speed imaging to achieve closed-loop control.

[0012] The spatial position adjustment system includes an X-axis guide rail and a Y-axis slide, a turntable is provided on the Y-axis slide, a sample stage is provided on the turntable, a fixture provided on the sample stage is used to adsorb the wafer, and the fixture is connected to a vacuum pipe to adsorb the wafer; the turntable is connected to a transmission motor, and the transmission motor can control the turntable to achieve 360° rotation, so as to achieve spatial position adjustment and all-round processing of the diamond wafer. The turntable can accurately control the spatial position of the wafer, thereby accurately matching the laser beam, so that the laser beam can irradiate any part of the wafer at the optimal angle, which is particularly suitable for the processing of complex-shaped wafers or the fine processing of the side of the wafer.

[0013] The present invention also discloses a method for automated laser processing of diamond materials using the above device, comprising the following steps: Place the tray containing diamond wafers into the silo; The wafer is grabbed by a material taking device and transferred to a spatial position adjustment system; Measure and locate the wafer using the measurement and recognition system; The central control system allocates processing parameters based on wafer information; Control the spatial position adjustment system to adjust the wafer position so that the side of the wafer is aligned with the laser; The laser processing system performs cutting processing on the wafer; Transfer the processed wafers to the unloading system.

[0014] The method systematically integrates the above-mentioned technical features and presents a highly automated and intelligent processing flow. First, the tray containing the diamond wafer is placed in the hopper. This step provides a stable material input for the entire processing process. Subsequently, the wafer is grabbed by the material picking device and transferred to the spatial position adjustment system. This process uses the above-mentioned precision adsorption and release mechanism to ensure the safe and accurate transmission of the wafer. The key link of the method is to measure and locate the wafer using the measurement and recognition system, which provides the necessary parameter information for subsequent processing. This step fully utilizes the advantages of the deep learning algorithm and can quickly and accurately identify wafers of different shapes and sizes, laying the foundation for personalized processing. The central control system allocates processing parameters according to the wafer information, which reflects the intelligent characteristics of the method and can optimize the processing strategy according to the specific situation of each wafer. The spatial position adjustment system is controlled to adjust the wafer position so that the side of the wafer is aligned with the laser, realizing the precise positioning and posture adjustment of the wafer. The laser processing system cuts the wafer. During this process, the coordinated work of the galvanometer and the field mirror ensures that the laser beam can be accurately focused on the processing surface to achieve high-quality cutting. Finally, the processed wafer is transferred to the unloading system to complete the entire processing cycle. This method automates the entire process from loading to unloading, improves production efficiency, and enhances chip processing consistency.

[0015] Preferably, in the visual recognition process, a high-resolution camera is used to capture the wafer image, and the wafer edge is identified by an image processing unit, the wafer size and direction are calculated, and a processing path is generated. In the image acquisition process, the selection and arrangement of the light source need to consider the optical properties of the diamond wafer, such as reflectivity and transparency, to obtain the best image contrast and details. Identifying the wafer edge by the image processing unit is the core step of this solution, involving a variety of advanced image processing algorithms, such as edge detection, morphological processing, and contour tracking. Considering the complex shapes and tiny defects that may exist in diamond wafers, these algorithms need to have high robustness and accuracy. Calculating the wafer size and direction is based on further analysis of the edge recognition results. This step involves technologies such as geometric feature extraction and main direction analysis. Generating a processing path reflects the close integration of visual recognition and processing planning. The generation of the processing path needs to comprehensively consider the shape, size, direction, and predetermined processing requirements of the wafer, involving a complex path planning algorithm. This vision-based path generation method improves the flexibility and adaptability of the system and can cope with the processing requirements of wafers of different batches and specifications. From the perspective of precision control, the high-precision geometric information provided by visual recognition helps to improve the accuracy of the entire processing process. In addition, this method also makes it possible to achieve closed-loop control, for example, visual inspection can be performed again during the processing process and processing parameters can be adjusted in real time.

[0016] Furthermore, during the laser processing, the central control system adjusts the laser parameters and controls the tilt angle of the wafer through the spatial position adjustment system to achieve precise processing of the side of the wafer. The central control system adjusts the laser parameters, which is the core feature of this solution. The adjustment of laser parameters includes power, pulse width, repetition frequency, etc., which need to be optimized in real time according to the specific situation of the wafer. Controlling the tilt angle of the wafer through the spatial position adjustment system allows the laser beam to irradiate the side of the wafer at the optimal incident angle. The change in the incident angle will affect the distribution and absorption efficiency of the laser energy on the surface of the material. By accurately controlling the tilt angle, energy utilization can be optimized and processing efficiency and quality can be improved. The accuracy of side processing directly affects the geometric accuracy and surface quality of the wafer, which is particularly important for some special applications (such as optical devices or precision mechanical parts). This method realizes the coordinated control of laser parameters and spatial position, forming a complex control system with multiple inputs and outputs. The system needs to process the feedback information from the sensors built into the laser processing system and the measurement and identification system in real time, such as laser power monitoring, position encoder feedback, etc., and make rapid adjustments according to the preset control strategy.

[0017] Therefore, the present invention has the following beneficial effects: (1) Automatic loading and unloading can reduce manual operation time, significantly speeding up the loading and unloading process of each wafer, thereby improving overall production efficiency; (2) The measurement and recognition system can accurately identify the shape and position of the wafer, ensuring that the starting point of the laser processing is accurate, thereby improving the positioning accuracy of the cutting and improving product quality; (3) Reduce reliance on operator experience and the need for highly skilled workers, thereby reducing labor costs, while also reducing the workload of operators and improving the safety of the working environment; (4) Improve the standardization and consistency of the processing process through information-based digital control technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a processing flow diagram of the present invention.

[0019] Figure 2 It is a schematic diagram of the device structure of the present invention.

[0020] Figure 3 yes Figure 2 Schematic diagram of the structure of the medium space adjustment system.

[0021] 1. Loading system, 2. Unloading system, 3. Multi-axis transmission system, 4. Measurement and identification system, 41. Visual recognition device, 42. Thickness measuring device, 421. Thickness measuring probe, 422. Mobile slide rail, 5. Spatial position adjustment system, 51. Control motor group, 6. Laser processing system, 7. Central control system, 71. Human-computer interaction system, 8. Material bin, 9. Retrieving device, 10. Adsorption nozzle, 11. Inflatable pressure relief mechanism, 12. High-resolution camera, 13. Light source module, 14. Image processing unit, 15. X-axis guide rail, 151. Y-axis slide, 16. Y-axis moving platform, 17. Z-axis lifting mechanism, 18. Laser, 19. Galvanometer, 20. Field mirror, 21. Sample stage, 22. Unloading bin, 23. Turntable, 24. Transmission motor, 25. Material carrier. DETAILED DESCRIPTION

[0022] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0023] Example 1 like Figure 1 , 2 As shown, the present invention provides an automated laser processing device for diamond materials and its workflow, which realizes automated precision processing of diamond wafers by integrating multiple functional modules such as a feeding system 1, a multi-axis transmission system 3, a measurement and identification system 4, a spatial position adjustment system 5, a laser processing system 6 and a feeding system 2. The feeding system 1 adopts a combination of a silo 8 and a material pick-up device 9. A plurality of material carriers 25 for storing diamond wafers are arranged in the silo 8. The material pick-up device 9 uses a suction nozzle 10 with a micro-hole array, and generates suction through a vacuum pump to achieve accurate grasping of the wafer. In order to improve the flexibility of picking up materials, the suction nozzle 10 is also equipped with an air-inflating and force-relieving mechanism 11, which inflates the micro-hole array through a control valve and a micro air pump to overcome the vacuum suction to achieve the release and transfer of the wafer. The multi-axis transmission system 3 is composed of a Y-axis moving platform 16 and a Z-axis lifting mechanism 17. A driving motor and a grating ruler are used to achieve high-precision positioning. The ball screw transmission cooperates with a servo motor to achieve precise control of the Z axis, ensuring accurate positioning and transmission of the wafer in the vertical plane. The measurement and recognition system 4 includes a thickness measuring device 42 and a visual recognition device 41. The thickness measuring device 42 includes a thickness measuring probe 421 and a movable slide rail 422. The thickness measuring device can accurately obtain the sample thickness. The visual recognition device 41 includes a high-resolution camera 12, a light source module 13 and an image processing unit 14. The camera 12 and the light source module 13 are fixedly installed on the gantry. The deep learning algorithm is used to realize the recognition, edge positioning and direction determination of wafers of different shapes and sizes. Figure 3As shown, the spatial position adjustment system 5 includes an X-axis guide rail 15 and a Y-axis slide 151. The spatial position adjustment system 5 includes a control motor group 51 connected to the central control system. A turntable 23 is arranged on the Y-axis slide. A transmission motor 24 is used to connect the turntable 23 which can rotate 360 ​​degrees. A sample table 21 for placing the diamond to be processed is arranged on the turntable. A fixture is arranged on the sample table. The fixture is connected to the vacuum pipe to achieve precise spatial position adjustment of the wafer. The laser processing system 6 is composed of a laser 18, a galvanometer 19 and a field lens 20. The laser beam is guided to the galvanometer by the optical path system, and the galvanometer and the field lens work together to focus the laser on the wafer processing surface. The core advantage of this device is that it can achieve precise processing of the side of the diamond wafer, which is achieved by adjusting the inclination angle of the wafer by the spatial position adjustment system 5 so that its side is aligned with the laser processing system 6. The entire processing process is uniformly dispatched by the central control system 7, and the processing parameters are allocated according to the visual recognition results, the laser parameters are adjusted, the spatial position adjustment is controlled, and the fully automated operation is realized. Of course, the central control system 7 is integrated into the human-machine interaction system 71, and an additional human-machine interaction system 71 is set outside the automated operating system for insurance to ensure that the operator can intervene in time. In addition, by adding a multi-station design, the processing efficiency can be further improved. The processing accuracy of this device is mainly limited by the laser spot size, the positioning accuracy of the multi-axis transmission system 3, and the resolution of the measurement and recognition system 4. According to the diffraction limit theory, the laser spot diameter d≈1.22λ / NA, where λ is the laser wavelength and NA is the numerical aperture of the focusing lens. Assuming a laser with a wavelength of 1064nm and a focusing lens with NA=0.85, the theoretical minimum spot diameter is about 1.5μm. Considering the heat-affected zone in actual processing, a processing accuracy of about 5μm can be achieved. The multi-axis transmission system 3 uses a high-precision grating ruler, and the positioning accuracy can reach submicron level, which will not become a limiting factor. The resolution of the measurement and recognition system 4 depends on the camera pixel and field of view. Assuming a 4K resolution camera with a field of view of 10 mm × 10 mm is used, the single pixel resolution is about 2.5 μm, which can be further improved to sub-micron level through sub-pixel algorithm. In summary, the device proposed in this embodiment can theoretically achieve micron-level processing accuracy, meeting the requirements of most diamond material processing.

[0024] Specifically, the device realizes the full process automation of diamond wafer processing through the collaborative work of multiple subsystems. The connection between the multi-axis transmission system 3 and the feeding system 1 ensures the precise transmission of the wafer and can achieve sub-micron positioning accuracy. The measurement and identification system 4 is set within the moving range of the spatial position adjustment system 5, which can realize real-time monitoring and feedback of the wafer and improve the adaptability and accuracy of the processing process. The turntable design of the spatial position adjustment system 5 is the core innovation of this device. It can accurately adjust the spatial position of the wafer so that the side of the wafer is aligned with the laser processing system 6. This solution breaks through the limitation that the traditional processing method can only process the plane and improves the flexibility and comprehensiveness of the processing. The relative setting of the laser processing system 6 and the spatial position adjustment system 5 ensures that the laser beam can be accurately focused on the processing surface of the wafer. The central control system 7 realizes the intelligent control of the entire processing process through the electrical connection with each subsystem, which not only improves the processing efficiency and reduces the dependence on the operator's experience, but also significantly improves the product yield. In the long run, the application of this automation device will promote the development of the diamond material processing industry in the direction of intelligent manufacturing and lay a technical foundation for more complex and sophisticated diamond processing needs in the future.

[0025] The feeding system 1 includes a silo 8 and a material taking device 9. The silo 8 is provided with a plurality of material trays for storing diamond wafers. The material taking device 9 includes a positioning mechanism and a suction nozzle 10. The positioning mechanism controls the suction nozzle 10 to move in a three-dimensional space. The surface of the suction nozzle 10 is provided with a micropore array, which is connected to a vacuum pump to achieve the grabbing of diamond wafers. The suction nozzle 10 of the material taking device 9 also includes an inflation and release mechanism 11, which includes an air pump and a control valve, and is connected to the micropore array of the suction nozzle 10. When the diamond wafer needs to be released, the control valve is opened, and the micro air pump inflates the micropore array to overcome the vacuum suction force, thereby achieving the release and transfer of the diamond wafer. The accurate release and transfer of the diamond wafer can be achieved by adding the inflation and release mechanism 11.

[0026] The silo 8 is provided with a plurality of material carriers 25 for storing diamond wafers, which improves the continuous working capacity of the device and reduces frequent manual loading. The positioning mechanism of the material picking device 9 can control the adsorption nozzle 10 to move in the YZ plane. This design improves the flexibility and accuracy of material picking. The surface of the adsorption nozzle 10 is provided with a micropore array and is connected to a vacuum pump. The vacuum adsorption principle can be used to achieve stable grasping of diamond wafers. Compared with the traditional mechanical clamping method, vacuum adsorption can better protect the surface of the wafer and reduce damage. At the same time, this design is also suitable for wafers of different sizes and shapes, improving the adaptability of the device. Compared with manual loading, the automatic loading system 1 can shorten the loading time from minutes to seconds, while ensuring the consistency of the loading position, providing a stable foundation for subsequent processing. The inflation and relief mechanism 11 includes a micro air pump and a control valve, which is connected to the micropore array of the adsorption nozzle 10. When the wafer needs to be released, the control valve is opened, and the air pump inflates the micropores to generate an outward air flow pressure to overcome the vacuum suction to achieve wafer detachment. Compared with the passive release method that simply relies on cutting off the vacuum source, this design has the advantages of being faster and more controllable. The inflation release can be completed within milliseconds, which is conducive to improving the working efficiency of the equipment. At the same time, by adjusting the inflation pressure, it is also possible to achieve precise release control of chips of different weights and sizes to prevent the chips from falling or shifting. In addition, active inflation can also remove tiny particles that may exist in the micropores and keep the adsorption nozzle 10 clean. This solution can reduce the impact force on the chip and reduce defects such as edge cracking.

[0027] In addition, the measurement and recognition system 4 includes a thickness measuring device 42 and a visual recognition device 41. The thickness measuring device 42 includes a thickness measuring probe 421 and a movable slide rail 422, and the thickness measuring device 42 can accurately obtain the thickness of the wafer. The visual recognition device 41 includes a high-resolution camera 12, a light source module 13 and an image processing unit 14; the image processing unit 14 adopts a deep learning algorithm to identify diamond wafers of different shapes and sizes and locate the edge and direction of the wafer.

[0028] The high-resolution camera 12 and the light source module 13 are fixedly mounted on the gantry; the image processing unit 14 uses a deep learning algorithm to identify diamond wafers of different shapes and sizes and locate the edge and direction of the wafer. The light source module 13 can provide consistent and controllable lighting conditions, reduce ambient light interference, and improve image quality and recognition accuracy. The image processing unit 14 uses a deep learning algorithm, which can learn to recognize diamond wafers of various shapes and sizes through a large number of sample training, and has strong adaptability and robustness. Compared with traditional rule-based image processing methods, deep learning algorithms can better handle challenges in actual production environments such as complex backgrounds and uneven lighting. In addition, the deep learning model can be continuously optimized, and the recognition accuracy is continuously improved as data accumulates. The system can accurately locate the edge and direction of the wafer, providing key parameters for subsequent processing. This high-precision measurement and positioning significantly reduces uncertainty in the processing process and helps to improve the accuracy and yield of the entire production line.

[0029] The Y-axis moving platform 16 adopts a combination of a drive motor and a grating ruler. This configuration can achieve high-precision linear positioning. As a position feedback element, the grating ruler has a resolution of up to micron level, which can provide the system with accurate position information and effectively eliminate the cumulative error in mechanical transmission. The drive motor provides stable and controllable power output, and through the formation of closed-loop control with the grating ruler, smooth and precise movement can be achieved. The Z-axis lifting mechanism 17 adopts a solution combining ball screw transmission and servo motor to provide high rigidity and high-precision motion control in the vertical direction. The ball screw has the characteristics of low friction and high efficiency, and can accurately convert rotational motion into linear motion, while the servo motor ensures rapid response and precise positioning of the motion. The design of this multi-axis system makes it possible to realize complex motion trajectories and precise position control. Through appropriate control algorithms, a smooth acceleration curve can be achieved, mechanical vibration can be reduced, and processing quality can be improved.

[0030] The laser processing system 6 in this embodiment includes a laser 18 and an optical path system. A galvanometer 19 and a field lens 20 are sequentially arranged at the lower part of the laser 18. The optical path system guides the laser beam generated by the laser 18 to the galvanometer, and the field lens and the galvanometer work together to focus the laser beam on the processing surface of the diamond wafer. As an energy source, the laser 18 can select an appropriate wavelength and power according to the characteristics of the diamond material to achieve the best processing effect. The design of the optical path system ensures high-quality transmission of the laser beam and reduces energy loss and beam distortion. The galvanometer uses a high-speed rotating reflector to control the direction of the laser beam to achieve fast and accurate two-dimensional scanning, and can also move the focus up and down to complete the cutting trajectory in the Z-axis direction. The use of the galvanometer improves the processing speed and flexibility of the system, making it possible to cut and engrave complex graphics. The field lens works in conjunction with the galvanometer, and its main function is to focus the laser beam on the processing surface of the diamond wafer. The design of the field lens needs to take into account the high refractive index and thermal conductivity of diamond to ensure that the laser energy is highly concentrated on the wafer surface while minimizing the heat-affected zone. This configuration can achieve extremely small spot sizes, which is beneficial for improving processing accuracy. The combination of the galvanometer and field lens can also ensure consistent spot characteristics throughout the entire scanning range, which is essential for uniformity in large-area processing. The design of the system allows precise control of the energy density and pulse characteristics of the laser, which helps to achieve high-quality cutting or surface treatment. In addition, technicians in this field can integrate a real-time monitoring system to monitor the processing process through spectral analysis or high-speed imaging to achieve closed-loop control.

[0031] In this embodiment, the automated laser processing device for diamond materials has high flexibility and precision in practical applications. The operation process begins by placing a tray carrying diamond wafers into the material bin 8 of the loading system 1. The material removal device 9 controls the suction nozzle 10 to move in the vertical plane through the positioning mechanism, and uses the suction force generated by the micropore array and the vacuum pump to accurately grab the wafer. It is worth noting that damage to the wafer surface should be avoided during the material removal process, which can be achieved by controlling the suction force and the contact area.

[0032] After the wafer is transferred to the spatial position adjustment system 5, the measurement and recognition system 4 starts working. The movable slide rail 422 of the thickness measuring device 42 controls the thickness measuring probe 421 to move above the wafer, and the thickness measuring probe 421 probes down and accurately touches the surface of the wafer to obtain thickness information. The light source module 13 provides uniform lighting, the high-resolution camera 12 captures the wafer image, and the image processing unit 14 uses a deep learning algorithm for analysis. This step can not only identify the shape and size of the wafer, but also locate the edge and determine the direction, providing accurate data for subsequent processing. In actual applications, wafers of different shapes or sizes may be encountered, so the algorithm needs to have sufficient adaptability and robustness.

[0033] The central control system 7 allocates processing parameters according to the visual recognition results, and this process is adjusted according to the size of different wafers. The spatial position adjustment system 5 then starts to work, and the turntable 23 is rotated 360 degrees through the transmission motor 24 to accurately align the side of the wafer with the laser processing system 6.

[0034] After the laser processing system 6 is started, the laser beam generated by the laser 18 is guided to the galvanometer through the optical path system, and then the galvanometer and the field lens work together to focus the laser on the wafer processing surface. In order to improve the processing efficiency, it is possible to consider using multiple laser beams for simultaneous processing, but this requires a more complex optical path design and synchronous control system.

[0035] After processing, the multi-axis transmission system 3 transfers the wafer to the unloading system 2, which includes a unloading bin 22 arranged on the Y-axis slide. In actual production, it is necessary to perform quality inspection on the processed wafers, which can be achieved by adding an additional visual inspection module to ensure that each wafer meets the quality standards.

[0036] During the entire processing process, precise control of the multi-axis transmission system 3 is crucial. The Y-axis mobile platform 16 uses a drive motor and a grating ruler to achieve sub-micron positioning, and the Z-axis lifting mechanism 17 uses a ball screw transmission and a servo motor to ensure precise control in the vertical direction. In practical applications, it may be necessary to consider the impact of ambient temperature changes on equipment accuracy, and high accuracy can be maintained by adding a temperature compensation system.

[0037] It is worth noting that the processing flow of a wafer is as described above. After the processing of a wafer is completed, the central control system 7 of the device can control the program to automatically jump to the loading of the next wafer and repeat the above processing steps. After each wafer is processed, the detailed processing information shown in the following table can be exported, or the detailed processing information can be exported in batches after a batch of wafers are processed.

[0038] The following is a technical parameter analysis of this embodiment and the conventional processing comparison example: Example Comparative Example Sample length, width, height 7mm*7mm*1mm 7mm*7mm*1mm Loading time <4s ≥30s Cutting start time <10s ≥80s Cutting size 7mm*7mm 7mm*7mm Cutting thickness ≥150μm ≥250μm Laser positioning to the cutting starting point <3s ≥60s Total cutting time 15min 15min As can be seen from the table, this patent solution can improve processing efficiency, accuracy and consistency. For example, compared with traditional manual operation, the loading time of this system is shortened to less than 4 seconds, the cutting start time is shortened to less than 10 seconds, and the time for laser positioning to the cutting start point is shortened to less than 3 seconds. In addition, this system can achieve a minimum cutting thickness of 150 microns, which is much better than the 200 microns of the traditional method. These performance improvements are due to the precise design and advanced control strategy of the system. For example, the deep learning algorithm used by the measurement and recognition system 4 can adapt to wafers of different shapes and sizes, improving the flexibility and adaptability of the system.

[0039] It is also worth noting that in this embodiment, in order to further improve production efficiency, a multi-station design can be considered to process multiple wafers at the same time. This requires corresponding expansion and synchronous control of the feeding system 1, the measurement and identification system 4 and the laser processing system 6. In addition, artificial intelligence algorithms can be introduced to optimize processing parameters and path planning, realize adaptive processing, and improve processing quality and efficiency. In actual production, the maintenance and calibration of the device are also issues that need attention. An automatic calibration program can be designed to regularly check and adjust the accuracy of each system. For the laser 18, its output power and beam quality need to be monitored and replaced or maintained when necessary. The probe, camera and light source of the measurement and identification system 4 also need to be cleaned and calibrated regularly to ensure measurement and recognition accuracy.

[0040] Example 2 In this embodiment, based on Embodiment 1, integrated 3D vision technology is introduced to more accurately measure the thickness and surface profile of the wafer. An adaptive control algorithm can also be introduced to dynamically optimize control parameters by real-time analysis of processing effects. In-situ monitoring technologies such as spectral analysis or high-speed imaging are integrated to achieve real-time monitoring and feedback of the processing process.

[0041] In addition, in this embodiment, the device has broad application prospects in the field of diamond processing. It can not only be used for conventional cutting and slicing, but also can achieve complex shape engraving and microstructure processing by adjusting laser parameters and processing strategies. For example, it can be used to make diamond microlens arrays or optical diffraction elements. In addition, by replacing the laser source and adjusting the optical path system, the device can also be extended to the processing of other hard materials, such as sapphire, silicon carbide, etc.

Claims

1. An automated laser processing device for diamond materials, comprising a loading system and a unloading system, characterized in that: Also includes: Multi-axis transmission system, which transmits diamond wafers and is connected to the feeding system; A spatial position adjustment system, connected to the multi-axis transmission system, includes a turntable; A measurement and recognition system is used to measure and locate the diamond wafer and is arranged within the moving range of the spatial position adjustment system; The laser processing system is arranged relative to the spatial position adjustment system; A central control system, electrically connected to the above systems; Among them, the spatial position adjustment system can adjust the spatial position of the diamond wafer so that the side of the diamond wafer is aligned with the laser processing system to achieve processing of the side of the diamond wafer.

2. The device according to claim 1, characterized in that The feeding system includes a silo and a material taking device. The silo is provided with a plurality of material trays for storing diamond wafers. The material taking device includes a positioning mechanism and a suction nozzle. The positioning mechanism controls the movement of the suction nozzle. The surface of the suction nozzle is provided with a micropore array and is connected to a vacuum pump to realize the grabbing of diamond wafers.

3. The device according to claim 2, characterized in that The suction nozzle of the material taking device also includes an inflation and release mechanism, which includes an air pump and a control valve and is connected to the micropore array of the suction nozzle; when the diamond wafer needs to be released, the control valve is opened, and the micro air pump inflates the micropore array to overcome the vacuum suction force and realize the release and transfer of the diamond wafer.

4. The device according to claim 1, characterized in that The measurement and identification system includes a thickness measuring device and a visual identification device; the thickness measuring device includes a thickness measuring probe and a movable slide rail; the visual identification device includes a high-resolution camera, a light source module and an image processing unit, and the high-resolution camera and the light source module are fixedly installed on a gantry; the image processing unit adopts a deep learning algorithm to identify diamond wafers of different shapes and sizes and locate the edge and direction of the wafer.

5. The device according to claim 1, characterized in that The multi-axis transmission system includes a Y-axis moving platform and a Z-axis lifting mechanism; the Y-axis moving platform includes a driving motor and a grating ruler; the Z-axis lifting mechanism adopts ball screw transmission and is connected to a servo motor to realize the positioning and transmission of the diamond wafer in the vertical plane.

6. The device according to claim 1, characterized in that The laser processing system includes a laser and an optical path system. A galvanometer and a field mirror are sequentially arranged at the lower part of the laser. The optical path system guides the laser beam generated by the laser to the galvanometer. The field mirror and the galvanometer work together to focus the laser beam onto the processing surface of the diamond wafer.

7. The device according to claim 1, characterized in that The spatial position adjustment system includes an X-axis guide rail and a Y-axis slide, the Y-axis slide is provided with a turntable, the turntable is provided with a sample table, and the sample table is provided with a fixture capable of adsorbing a wafer; the turntable is connected to a transmission motor, and the transmission motor can control the turntable to achieve 360° rotation.

8. An automated laser processing method for diamond materials using the device according to any one of claims 1 to 7, characterized in that: The following steps are involved: Place the tray containing diamond wafers into the silo of the loading system; The wafer is grabbed by a material taking device and transferred to a spatial position adjustment system; Measure and locate the wafer using the measurement and recognition system; The central control system allocates processing parameters based on wafer information; Control the spatial position adjustment system to adjust the wafer position so that the side of the wafer is aligned with the laser; The laser processing system performs cutting processing on the wafer; Transfer the processed wafers to the unloading system.

9. The method according to claim 8, characterized in that During the visual recognition process, a high-resolution camera is used to capture the wafer image, and the image processing unit is used to identify the wafer edge, calculate the wafer size and direction, and generate the processing path.

10. The method according to claim 8, characterized in that During the laser processing, the central control system adjusts the laser parameters and controls the tilt angle of the wafer through the spatial position adjustment system to achieve precise processing of the side of the wafer.

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