A grinding method, device, electronic device and storage medium

Abstract

The present invention discloses a grinding method, apparatus, electronic device, and storage medium. The method includes obtaining a preset grinding file for an object to be ground, the preset grinding file including the object's initial and target thicknesses; upon determining that the current grinding operation is executable, reversely calculating the target thickness at each grinding stage based on the initial thickness, target thickness, and preset grinding amount parameters; and grinding the object according to the target thickness at each grinding stage. The technical solution of the present invention reduces manual dependency, reduces modification complexity to a certain extent, and improves modification accuracy.

Description

Technical Field

[0001] The present invention relates to the field of grinding technology, and in particular to a grinding method, a grinding device, an electronic device and a storage medium. Background Art

[0002] If the target thickness of each stage of the grinding formula is modified manually, problems are likely to occur (for example, the target thickness of the previous grinding stage is smaller than the target thickness of the next grinding stage, etc.), and the changes are large. Therefore, manual modification is prone to complex modifications and errors. Summary of the Invention

[0003] The present invention provides a grinding method, device, electronic device and storage medium to solve the problem that the target thickness is easily complicated and prone to errors during the manual modification stage, reduce manual dependence, reduce modification complexity to a certain extent and improve modification accuracy.

[0004] According to one aspect of the present invention, there is provided a grinding method, the method comprising:

[0005] Obtaining a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground;

[0006] When it is determined that the current grinding operation is executable, reversely calculating the target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter;

[0007] The object to be ground is ground according to the target thickness of each grinding stage point.

[0008] According to another aspect of the present invention, there is provided a grinding device, comprising:

[0009] A grinding file acquisition module is used to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground;

[0010] a stage target thickness calculation module, configured to reversely calculate the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and a preset grinding amount parameter when determining that the current grinding operation is executable;

[0011] The grinding operation execution module is used to grind the object to be ground according to the stage target thickness of each grinding stage point.

[0012] According to another aspect of the present invention, an electronic device is provided, comprising:

[0013] at least one processor; and

[0014] a memory communicatively connected to the at least one processor; wherein,

[0015] The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor so that the at least one processor can perform the grinding method according to any embodiment of the present invention.

[0016] According to another aspect of the present invention, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the grinding method according to any embodiment of the present invention when executed.

[0017] The technical solution of the embodiment of the present invention obtains a preset grinding file of the object to be ground, which includes the initial thickness and target thickness of the object to be ground; when it is determined that the current grinding operation is executable, the stage target thickness of each grinding stage point is reversely calculated based on the initial thickness, target thickness and preset grinding amount parameters; the object to be ground is ground according to the stage target thickness of each grinding stage point, and a technical means of automatically reversely calculating the stage target thickness is adopted, which solves the problem of manual modification of the stage target thickness in the prior art, which is prone to complexity and error, reduces manual dependence, reduces modification complexity to a certain extent and improves modification accuracy.

[0018] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A flow chart of a grinding method provided in Example 1 of the present invention;

[0021] Figure 2 A schematic diagram of setting grinding amount parameters provided in Example 1 of the present invention;

[0022] Figure 3 A schematic diagram of the application process of a grinding method is provided for this embodiment;

[0023] Figure 4 A schematic structural diagram of a grinding device provided in Example 2 of the present invention;

[0024] Figure 5 It is a schematic structural diagram of an electronic device for implementing the grinding method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0027] Example 1

[0028] Figure 1 This is a flow chart of a grinding method provided in the first embodiment of the present invention. This embodiment is applicable to the case where an object to be ground is ground. The method can be performed by a grinding device, which can be implemented in the form of hardware and / or software. The grinding device can be configured in the controller of the grinding device. Figure 1 As shown, the method includes:

[0029] S110 , obtaining a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground.

[0030] The object to be ground may refer to an industrial component that needs to be ground. The preset grinding file may be a file containing a grinding recipe pre-designed for the object to be ground, and the grinding recipe may refer to a grinding plan. The initial thickness of the object to be ground may refer to the original thickness of the object to be ground before the grinding operation is performed. The target thickness of the object to be ground may refer to the final thickness of the object to be ground after all grinding operations are performed according to the grinding requirements. For example, if the current grinding requirement is to grind object 1 from 1000um to 500um, then 1000um is the initial thickness of object 1, and 500um is the target thickness of object 1.

[0031] In this embodiment, before the grinding operation is planned for the object to be ground, a grinding file pre-designed for the object to be ground may be loaded first, and the initial thickness and target thickness of the object to be ground may be read from the grinding file.

[0032] S120 , when it is determined that the current grinding operation is executable, reversely calculating the target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameters.

[0033] The preset grinding amount parameter may refer to a grinding amount parameter value set for a certain grinding stage on the grinding device. Figure 2 The grinding operation may include coarse grinding and fine grinding, wherein the coarse grinding operation may include the grinding amount of the P1-P2 stage and the grinding amount of the p2-P3 stage, and the fine grinding operation may include the grinding amount of the P1-P2 stage, the grinding amount of the p2-P3 stage and the total grinding amount of the fine grinding stage. Figure 2 The grinding amount parameters of the medium-coarse grinding operation are 50 μm in the P1-P2 stage, 30 μm in the P2-P3 stage, 15 μm in the P1-P2 stage, 8 μm in the P2-P3 stage, and 30 μm in the total grinding amount of the fine grinding stage. Each grinding stage point can be the start time point and the end time point of the grinding stage, refer to Figure 2 , P1, P2, and P3 are the grinding stage points. The stage target thickness can refer to the thickness of the object to be ground at the end of the grinding stage, for example Figure 2 In the rough grinding operation, the thickness of the object to be ground corresponding to the P2 stage point is the stage target thickness of the P1-P2 stage, and the thickness of the object to be ground corresponding to the P3 stage point is the stage target thickness of the P2-P3 stage.

[0034] Since the grinding parameters cannot be completely limited in the actual grinding process, such as the stage before the PI stage point, the preset grinding amount parameters involved in this embodiment can be part of the grinding amount parameters in the complete grinding process. In order to meet the grinding requirements of the target thickness after the grinding is completed, the stage target thickness of each grinding stage point can be reversely calculated when it is determined that the current preset grinding file and the current grinding operation corresponding to the preset grinding amount parameters are executable, so that grinding is performed according to the stage target thickness.

[0035] In one case, determining that the current grinding operation is executable may include: determining the theoretical total grinding amount of the object to be ground based on the initial thickness and the target thickness; calculating the actual planned stage grinding amount based on preset grinding amount parameters, and determining the actual planned total grinding amount of the object to be ground based on the actual planned stage grinding amount; when the theoretical total grinding amount is greater than or equal to the actual planned total grinding amount, determining that the current grinding operation of the object to be ground is executable.

[0036] The theoretical grinding amount may refer to the total grinding amount of the object to be ground corresponding to the grinding requirements. Specifically, the theoretical grinding amount may be determined by the difference between the initial thickness and the target thickness of the object to be ground. The actual planned grinding amount may refer to the planned grinding amount for the rough grinding stage and the planned grinding amount for the fine grinding stage. The actual planned total grinding amount may refer to the sum of the planned grinding amounts for the rough grinding stage and the planned grinding amounts for the fine grinding stage.

[0037] For example, if the initial thickness of the object to be ground is 1000um and the target thickness is 500um, the theoretical total grinding amount is 500um. Figure 2 The planned grinding amount in the rough grinding stage can be 50+30=80um, and the planned grinding amount in the fine grinding stage can be 30um. The actual planned total grinding amount can be 80+30=110um. In this case, the theoretical total grinding amount > the actual planned total grinding amount. Therefore, the actual grinding plan is executable, and it can be determined that the current grinding operation of the object to be ground is executable.

[0038] Based on the above situation, the method may further include: when the theoretical total grinding amount is less than the actual planned total grinding amount, determining that the current grinding operation of the object to be ground is executable.

[0039] For example, if the initial thickness of the object to be ground is 1000um and the target thickness is 900um, the theoretical total grinding amount is 100um, and the reference Figure 2 The actual planned total grinding amount is 110 μm. In this case, the theoretical total grinding amount is less than the actual planned total grinding amount. If grinding is performed according to the actual planned total grinding amount, the target thickness of the object to be ground will be less than 900 μm. Therefore, the actual grinding plan is not executable, and it can be determined that the current grinding operation of the object to be ground is not executable.

[0040] In another case, determining that the current grinding operation is executable may include: calculating the grinding amount of the specified stage of fine grinding based on the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters; when the grinding amount of the specified stage of fine grinding is less than or equal to the total grinding amount of the fine grinding operation in the preset grinding amount parameters, determining that the current grinding operation of the object to be ground is executable.

[0041] refer to Figure 2 The grinding amount of the third stage of fine grinding can refer to the grinding amount of 8um in the P2-P3 stage, the grinding amount of the second stage of fine grinding can refer to the grinding amount of 15um in the P1-P2 stage, and the grinding amount of the specified stage of fine grinding can refer to 15+8=23um. In this case, 23um<30um, then the grinding amount of the specified stage of fine grinding is less than the total grinding amount of the fine grinding operation, and the remaining grinding space can be left for the stage between the fine grinding points P1. Therefore, the grinding operation in this case is executable, and it can be determined that the current grinding operation of the object to be ground is executable.

[0042] Based on the above another situation, it may also include determining that the current grinding operation of the object to be ground is not executable when the grinding amount in the specified fine grinding stage is greater than the total grinding amount of the fine grinding operation in the preset grinding amount parameter.

[0043] For example, if Figure 2 The grinding amount in the specified stage of medium fine grinding is 15+8=23um, and the total grinding amount of the fine grinding operation is 20um. At this time, 23um>20um. The grinding operation in this case is not executable, so it can be determined that the current grinding operation of the object to be ground is not executable.

[0044] In an optional embodiment, reverse calculating the stage target thickness of each grinding stage point based on the initial thickness, target thickness and preset grinding amount parameters may include: reverse calculating the stage target thickness of the fourth stage point of the fine grinding operation, the stage target thickness of the third stage point, the stage target thickness of the second stage point, the stage target thickness of the first stage point and the grinding amount of the first stage of fine grinding based on the initial thickness, target thickness and the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters; reverse calculating the stage target thickness of the fourth stage point of the rough grinding operation, the stage target thickness of the third stage point, the stage target thickness of the second stage point and the grinding amount of the first stage of rough grinding based on the stage target thickness of the first stage point in the fine grinding operation, the grinding amount of the third stage of rough grinding and the grinding amount of the second stage of rough grinding in the preset grinding amount parameters.

[0045] In this embodiment, reference Figure 2For example, the initial thickness of the object to be ground is 1000um, and the target thickness is 500um. The target thickness of the fine grinding operation P3 stage point can be determined to be 500um according to the target thickness. The target thickness of the P2 stage point can be further determined to be 508um in combination with the grinding amount of the third stage of fine grinding. The target thickness of the P1 stage point can be determined to be 523um in combination with the grinding amount of the second stage of fine grinding. The grinding amount of the first stage of fine grinding (i.e., the fine grinding stage before the P1 stage point) can be determined to be 7um in combination with the total grinding amount of the fine grinding operation. The target thickness of the first stage of fine grinding (P0 stage point) is 530um.

[0046] refer to Figure 2 According to the target thickness of the fine grinding PO stage point, the stage target thickness of the rough grinding P3 stage point is determined to be 530um, and further combined with the rough grinding amount of the third stage, the stage target thickness of the rough grinding P2 stage point is determined to be 560um, and further combined with the rough grinding amount of the second stage, the stage target thickness of the rough grinding P1 stage point is determined to be 610um, and further combined with the initial thickness of the object to be ground, the rough grinding amount of the first stage (i.e., the rough grinding stage before the rough grinding PI point) is determined to be 390um.

[0047] S130 , grinding the object to be ground according to the target thickness of each grinding stage point.

[0048] In this embodiment, the object to be ground may be ground according to the target thickness at each grinding stage, the grinding amount in the first stage of rough grinding, and the grinding amount in the first stage of fine grinding as described in the above examples.

[0049] Optionally, when it is determined that the current grinding operation is not executable, the current grinding operation is marked as being unable to be ground, and a preset grinding file is switched to return to the operation of determining whether the current grinding operation is executable.

[0050] In order to make those skilled in the art better understand the grinding method of this embodiment, Figure 3 A schematic diagram of the application process of a grinding method is provided for this embodiment. A grinding file is loaded, and the grinding amount and the initial and target thicknesses of the object to be ground are determined to be legal (i.e., executable). If legal, the target thickness of each stage point can be reversely calculated, and the calculated target thickness can be displayed on the interface of the grinding device, and the grinding operation can be performed according to the target thickness. If illegal, it can be marked as unground, and the grinding file can be switched back to determine whether it is legal. After marking it as unground, the grinding amount, initial thickness, or target thickness can be modified to determine whether it is legal.

[0051] The technical solution of this embodiment is to obtain a preset grinding file of the object to be ground, which includes the initial thickness and target thickness of the object to be ground; when it is determined that the current grinding operation is executable, the stage target thickness of each grinding stage point is reversely calculated based on the initial thickness, target thickness and preset grinding amount parameters; the object to be ground is ground according to the stage target thickness of each grinding stage point, and a technical means of automatically reversely calculating the stage target thickness is adopted, which solves the problem of manual modification of the stage target thickness in the prior art, which is prone to complexity and error, reduces manual dependence, reduces modification complexity to a certain extent and improves modification accuracy.

[0052] Example 2

[0053] Figure 4 This is a schematic diagram of the structure of a grinding device provided in Example 2 of the present invention. Figure 3 As shown, the apparatus includes: a grinding file acquisition module 210, a stage target thickness calculation module 220 and a grinding operation execution module 230. Among them:

[0054] A grinding file acquisition module 210 is used to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground;

[0055] a stage target thickness calculation module 220 for reversely calculating the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and a preset grinding amount parameter when determining that the current grinding operation is executable;

[0056] The grinding operation execution module 230 is configured to grind the object to be ground according to the target thickness of each grinding stage point.

[0057] The technical solution of this embodiment is to obtain a preset grinding file of the object to be ground, which includes the initial thickness and target thickness of the object to be ground; when it is determined that the current grinding operation is executable, the stage target thickness of each grinding stage point is reversely calculated based on the initial thickness, target thickness and preset grinding amount parameters; the object to be ground is ground according to the stage target thickness of each grinding stage point, and a technical means of automatically reversely calculating the stage target thickness is adopted, which solves the problem of manual modification of the stage target thickness in the prior art, which is prone to complexity and error, reduces manual dependence, reduces modification complexity to a certain extent and improves modification accuracy.

[0058] Optionally, the stage target thickness calculation module 220 includes a first executable judgment unit configured to:

[0059] determining a theoretical total grinding amount of the object to be ground according to the initial thickness and the target thickness;

[0060] Calculating the actual planned stage grinding amount according to the preset grinding amount parameter, and determining the actual planned total grinding amount of the object to be ground according to the actual planned stage grinding amount;

[0061] When the theoretical total grinding amount is greater than or equal to the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

[0062] Optionally, the stage target thickness calculation module 220 further includes a first unexecutable judgment unit configured to:

[0063] In a case where the theoretical total grinding amount is less than the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

[0064] Optionally, the stage target thickness calculation module 220 includes a second executable judgment unit configured to:

[0065] Calculating the grinding amount for a designated stage of fine grinding according to the grinding amount for the third stage of fine grinding and the grinding amount for the second stage of fine grinding in the preset grinding amount parameters;

[0066] When the grinding amount in the specified fine grinding stage is less than or equal to the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is executable.

[0067] Optionally, the stage target thickness calculation module 220 further includes a second unexecutable judgment unit configured to:

[0068] In a case where the grinding amount in the specified fine grinding stage is greater than the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is not executable.

[0069] Optionally, the stage target thickness calculation module 220 may be specifically used to:

[0070] According to the initial thickness, the target thickness and the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters, reversely calculating the stage target thickness at the fourth stage point of the fine grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point, the stage target thickness at the first stage point and the grinding amount of the first stage of fine grinding;

[0071] According to the stage target thickness at the first stage point in the fine grinding operation, the rough grinding third stage grinding amount and the rough grinding second stage grinding amount in the preset grinding amount parameters, the stage target thickness at the fourth stage point of the rough grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point and the rough grinding first stage grinding amount are reversely calculated.

[0072] Optionally, the grinding device further includes an operation return execution module, configured to:

[0073] If it is determined that the current grinding operation is not executable, the current grinding operation is marked as being unable to be ground, and the preset grinding file is switched to return to the operation of determining whether the current grinding operation is executable.

[0074] The polishing device provided in the embodiment of the present invention can execute the polishing method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0075] Example 3

[0076] Figure 5 A schematic diagram of the structure of an electronic device 300 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0077] like Figure 5 As shown, the electronic device 300 includes at least one processor 301, and a memory connected to the at least one processor 301, such as a read-only memory (ROM) 302, a random access memory (RAM) 303, etc., wherein the memory stores a computer program that can be executed by the at least one processor, and the processor 301 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 302 or the computer program loaded from the storage unit 308 to the random access memory (RAM) 303. Various programs and data required for the operation of the electronic device 300 can also be stored in the RAM 303. The processor 301, ROM 302 and RAM 303 are connected to each other via a bus 304. An input / output (I / O) interface 305 is also connected to the bus 304.

[0078] Multiple components in the electronic device 300 are connected to the I / O interface 305, including an input unit 306, such as a keyboard, a mouse, etc.; an output unit 307, such as various types of displays, speakers, etc.; a storage unit 308, such as a magnetic disk, an optical disk, etc.; and a communication unit 309, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 309 allows the electronic device 300 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0079] Processor 301 can be various general-purpose and / or specialized processing components with processing and computing capabilities. Some examples of processor 301 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. Processor 301 performs the various methods and processes described above, such as the grinding method.

[0080] In some embodiments, the grinding method can be implemented as a computer program that is tangibly contained in a computer-readable storage medium, such as storage unit 308. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 300 via ROM 302 and / or communication unit 309. When the computer program is loaded into RAM 303 and executed by processor 301, one or more steps of the grinding method described above can be performed. Alternatively, in other embodiments, processor 301 can be configured to perform the grinding method in any other suitable manner (e.g., by means of firmware).

[0081] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system comprising at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0082] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when the computer program is executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer program may be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0083] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0084] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0085] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0086] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0087] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0088] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A grinding method, characterized in that: include: Obtaining a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground; When it is determined that the current grinding operation is executable, reversely calculating the target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter; Grinding the object to be ground according to the target thickness of each grinding stage point; The determining that the current grinding operation is executable includes: determining a theoretical total grinding amount of the object to be ground according to the initial thickness and the target thickness; Calculating the actual planned stage grinding amount according to the preset grinding amount parameter, and determining the actual planned total grinding amount of the object to be ground according to the actual planned stage grinding amount; When the theoretical total grinding amount is greater than or equal to the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

2. The method according to claim 1, characterized in that Also includes: In a case where the theoretical total grinding amount is less than the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

3. The method according to claim 1, characterized in that Determine whether the current grinding operation is executable, including: Calculating the grinding amount for a designated stage of fine grinding according to the grinding amount for the third stage of fine grinding and the grinding amount for the second stage of fine grinding in the preset grinding amount parameters; When the grinding amount in the specified fine grinding stage is less than or equal to the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is executable.

4. The method according to claim 3, characterized in that Also includes: In a case where the grinding amount in the specified fine grinding stage is greater than the total grinding amount of the fine grinding operation in the preset grinding amount parameter, it is determined that the current grinding operation of the object to be ground is not executable.

5. The method according to claim 1, wherein Reversely calculating the target thickness of each grinding stage point according to the initial thickness, the target thickness and the preset grinding amount parameter, including: According to the initial thickness, the target thickness and the total grinding amount of the fine grinding operation, the grinding amount of the third stage of fine grinding and the grinding amount of the second stage of fine grinding in the preset grinding amount parameters, reversely calculating the stage target thickness at the fourth stage point of the fine grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point, the stage target thickness at the first stage point and the grinding amount of the first stage of fine grinding; According to the stage target thickness at the first stage point in the fine grinding operation, the rough grinding third stage grinding amount and the rough grinding second stage grinding amount in the preset grinding amount parameters, the stage target thickness at the fourth stage point of the rough grinding operation, the stage target thickness at the third stage point, the stage target thickness at the second stage point and the rough grinding first stage grinding amount are reversely calculated.

6. The method according to claim 2 or 4, characterized in that Also includes: If it is determined that the current grinding operation is not executable, the current grinding operation is marked as being unable to be ground, and the preset grinding file is switched to return to the operation of determining whether the current grinding operation is executable.

7. A grinding device, characterized in that: include: A grinding file acquisition module is used to acquire a preset grinding file of the object to be ground, wherein the preset grinding file includes an initial thickness and a target thickness of the object to be ground; a stage target thickness calculation module, configured to reversely calculate the stage target thickness of each grinding stage point according to the initial thickness, the target thickness and a preset grinding amount parameter when determining that the current grinding operation is executable; a grinding operation execution module, configured to grind the object to be ground according to the target thickness of each grinding stage point; The stage target thickness calculation module includes a first executable judgment unit for: determining a theoretical total grinding amount of the object to be ground according to the initial thickness and the target thickness; Calculating the actual planned stage grinding amount according to the preset grinding amount parameter, and determining the actual planned total grinding amount of the object to be ground according to the actual planned stage grinding amount; When the theoretical total grinding amount is greater than or equal to the actually planned total grinding amount, it is determined that the current grinding operation of the object to be ground is executable.

8. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the grinding method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the grinding method according to any one of claims 1 to 6 when executed.

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