A production process of a full opening composite mesh plate of steel wire mesh and electroforming alloy plate

Abstract

The application discloses a production process of a full-opening composite mesh plate of a steel wire mesh and an electroformed alloy plate, and relates to the field of mesh plate production.S1: the steel wire mesh is subjected to inspection treatment;S2: braiding treatment;S3: rolling treatment: the steel wire mesh after the first flat meshing is subjected to appearance inspection, and is cleaned after the inspection is qualified; and the steel wire mesh is subjected to the second flat meshing treatment after the rolling treatment is completed;S4: the reservation of the warp steel wire: the warp steel wire is reserved according to the size of the prefabricated pattern; the braided mesh plate is cut into a sheet-shaped mesh cloth, and is uniformly laid on an electroformed mold; the surface of the mold is provided with a vacuum evaporation nano coating;S5: the pasting treatment of the photoresist film.The production process of the full-opening composite mesh plate of the steel wire mesh and the electroformed alloy plate has the advantages that the composite mesh plate manufactured by the process is designed in a full-opening mode, and the printability of the mesh plate, the line height-width ratio and the printing filling are greatly improved.

Description

Technical Field

[0001] The invention relates to the field of mesh plate production, and in particular to a production process of a fully-open composite mesh plate of a steel wire mesh and an electroformed alloy plate. Background Art

[0002] The stencil is a stencil used by SMT production lines to print solder paste or patch adhesive on substrates such as PCBs and FPCs.

[0003] When preparing the stencil, most of the time there is a lack of weaving links, and the weaving process of the warp and weft is missing, which will affect the production of the subsequent alloy layer, the pattern production will also be affected, and its printability will also be affected to a certain extent. Its printing fill and line aspect ratio will also affect the quality of the stencil.

[0004] Therefore, it is necessary to propose a full-opening composite mesh production process of steel wire mesh and electroformed alloy plate to solve the above problems. Summary of the Invention

[0005] The main purpose of the present invention is to provide a production process for a fully-open composite mesh plate of a steel wire mesh and an electroformed alloy plate, which can effectively solve the problems in the background technology.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] A process for producing a fully open composite mesh plate of a steel wire mesh and an electroformed alloy plate comprises the following steps:

[0008] S1: Inspection of the wire mesh: including inspection of the diameter, tension and appearance of the wire mesh. The diameter of the wire mesh is 11 microns, the tension of the wire mesh is 424N, and the appearance needs to be free of damage and corrosion.

[0009] S2: Weaving: Adjust and bolt the precision wire mesh weaving equipment. Use the precision wire mesh weaving equipment to weave the inspected wire mesh, including sizing and threading. After weaving, remove the mesh from the machine and flatten it. After flattening, place it aside for future use.

[0010] S3: rolling and pressing: the steel wire mesh is inspected for appearance after the first flattening, cleaned after passing the inspection, and then packaged. After the packaged process is completed, it is cleaned, and then rolled and pressed. After the rolling and pressing process is completed, the steel wire mesh is flattened for the second time, and then packaged after the second flattening process. After packaging, it is placed for future use.

[0011] S4: Warp steel wire reservation: Warp steel wire is reserved according to the size of the prefabricated pattern, the woven steel mesh is cut into sheet mesh, and evenly laid on the electroforming mold. The surface of the electroforming mold is vacuum-deposited with nano-coating;

[0012] S5: application of photoresist film: apply photoresist film evenly on the surface of the evenly laid steel mesh. The thickness of the photoresist film is selected according to the designed thickness. The application steps include: applying the photoresist film on the steel mesh plate and baking it at a temperature of 200°C for 10 minutes. After baking, perform photolithography on it. After photolithography, perform development. After development, perform baking. After baking, prepare the electroforming tank to generate an electroformed metal layer. After the electroformed metal layer is generated, perform stripping. After stripping, use ultrasonic waves to clean impurities. After cleaning, stretch the mesh and inspect it.

[0013] Preferably, in step S3, a hydrocarbon solvent is used as a cleaning agent to clean the wire mesh plate, the surface of the wire mesh plate is first dehydrated, and after dehydration, the wire mesh plate is sprayed and cleaned with a hydrocarbon solvent. After the spray cleaning is completed, the surface of the wire mesh plate is flushed and struck, wherein the spraying pressure is 6 MPa. After the cleaning is completed, the wire mesh plate is dried by vacuum drying.

[0014] Preferably, in step S3, during rolling, the rolling range does not exceed 70%, the reduction rate of the first pass does not exceed 40%, the reduction rates of the next two passes do not exceed 60%, and the reduction rate of the last pass does not exceed 12%.

[0015] Preferably, in step S5, the photoresist comprises the following preparation steps:

[0016] 1. Preparation of reagents: tetrahydrofuran, cyclohexanone, N,N-dimethylformamide, ethylene glycol ethyl ether acetate, acetone, sodium hydroxide, film-forming resin, and photoinitiator;

[0017] 2. Add film-forming resin, photoinitiator, tetrahydrofuran, cyclohexanone, N,N-dimethylformamide, ethylene glycol ethyl ether acetate, and sodium hydroxide to acetone to form a solution with a concentration of 10%-20%. Stir to completely dissolve it, then perform coarse filtration first, and then fine filtration through a 0.2μm filter element to complete the preparation of the photoresist.

[0018] Preferably, the film-forming resin is a polymer prepared under the conditions of an initiator concentration of 1%, a polymerization temperature of 70° C., and a monomer ratio of MMA:MA:MAC of 6:1:2.

[0019] Beneficial effects

[0020] Compared with the prior art, the steel wire mesh and electrocast alloy plate full-opening composite mesh plate production process has the following beneficial effects:

[0021] The steel wire mesh and electrocast alloy plate full-opening composite mesh plate production process, the composite mesh plate produced by the process adopts a full-opening design, greatly improving the printability of the mesh plate, and the line height-width ratio and printing filling. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is the weaving flowchart of the steel wire mesh plate of the present application;

[0023] Figure 2 is the steel wire mesh weaving diagram designed by the present application. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, purposes and effects of the present application easy to understand, the present application is further described below in combination with specific embodiments.

[0025] As shown in Figure 1-Figure 2 A steel wire mesh and electrocast alloy plate full-opening composite mesh plate production process, comprising the following operation steps:

[0026] S1: inspecting and treating the steel wire mesh: including inspecting the diameter, tensile force and appearance of the steel wire mesh, wherein the diameter of the steel wire mesh is 11 microns, the tensile force of the steel wire mesh is 424 N, and the appearance needs to be free of damage and corrosion;

[0027] S2: weaving treatment: adjusting and clamping the precision metal wire mesh weaving equipment, and weaving the inspected steel wire mesh using the precision metal wire mesh weaving equipment, including sizing and buckling, after weaving, taking the woven steel wire mesh out of the machine, and performing a first flat mesh treatment on the woven steel wire mesh, and placing the flat mesh for standby after the flat mesh treatment is completed;

[0028] S3: rolling treatment: inspecting the appearance of the first flat mesh, cleaning it after the inspection is passed, performing a simple packaging treatment after the cleaning is completed, washing it after the simple packaging treatment is completed, performing a rolling treatment after the washing is completed, performing a second flat mesh treatment on the steel wire mesh after the rolling treatment is completed, and packaging the steel wire mesh after the second flat mesh treatment is completed, and placing the packaged steel wire mesh for standby;

[0029] The steel mesh is cleaned with hydrocarbon solvent as a cleaning agent. The surface of the steel mesh is first dehydrated. After dehydration, the steel mesh is sprayed with hydrocarbon solvent for cleaning. After the spray cleaning is completed, the surface of the steel mesh is scour and struck. The spray pressure is 6MPa. After cleaning, the steel mesh is dried by vacuum drying. During rolling, the rolling process does not exceed 70%, the reduction rate of the first pass does not exceed 40%, the reduction rate of the next two passes does not exceed 60%, and the reduction rate of the last pass does not exceed 12%;

[0030] S4: Warp steel wire reservation: Warp steel wire is reserved according to the size of the prefabricated pattern, the woven steel mesh is cut into sheet mesh, and evenly laid on the electroforming mold. The surface of the electroforming mold is vacuum-deposited with nano-coating;

[0031] S5: applying a photoresist film: applying a photoresist film evenly on the surface of a uniformly laid steel mesh, wherein the thickness of the photoresist film is selected according to the designed thickness, including the following applying steps: applying the photoresist film on the steel mesh plate, baking it at a temperature of 200°C for 10 minutes, performing a photolithography process on it after the baking is completed, performing a development process on it after the photolithography is completed, performing a baking process after the development is completed, and preparing an electroforming tank after the baking is completed to generate an electroformed metal layer, performing a stripping process after the electroformed metal layer is generated, and cleaning impurities by ultrasonic wave after the stripping is completed. After the cleaning is completed, the mesh is stretched and tested;

[0032] The preparation steps of photoresist include:

[0033] 1. Preparation of reagents: tetrahydrofuran, cyclohexanone, N,N-dimethylformamide, ethylene glycol ethyl ether acetate, acetone, sodium hydroxide, film-forming resin, and photoinitiator. The film-forming resin is a polymer prepared under the conditions of an initiator concentration of 1%, a polymerization temperature of 70°C, and a monomer ratio of MMA:MA:MAC of 6:1:2.

[0034] 2. Add film-forming resin, photoinitiator, tetrahydrofuran, cyclohexanone, N,N-dimethylformamide, ethylene glycol ethyl ether acetate, and sodium hydroxide to acetone to form a solution with a concentration of 10%-20%. Stir to completely dissolve it, then perform coarse filtration first, and then fine filtration through a 0.2μm filter element to complete the preparation of the photoresist.

[0035] The performance of the fully open composite stencil prepared by this process is compared with the common stencils on the market. The fully open composite stencil prepared by this process is an example, and the common stencils on the market are recorded as comparative examples. The following is a comparison table:

[0036]

[0037] It can be seen that the performance of the fully open composite mesh produced by this process is better than the common mesh on the market.

[0038] The composite stencil produced by this process adopts a fully open design, which greatly improves the printability of the stencil, as well as the line aspect ratio and print fill.

[0039] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A process for producing a fully open composite mesh panel of a steel wire mesh and an electroformed alloy plate, characterized in that: The following steps are included: S1: Inspection of the wire mesh: including inspection of the diameter, tension and appearance of the wire mesh. The diameter of the wire mesh is 11 microns, the tension of the wire mesh is 424N, and the appearance needs to be free of damage and corrosion. S2: Weaving: Adjust and bolt the precision wire mesh weaving equipment. Use the precision wire mesh weaving equipment to weave the inspected wire mesh, including sizing and threading. After weaving, remove the mesh from the machine and flatten it. After flattening, place it aside for future use. S3: rolling treatment: the steel wire mesh is inspected for appearance after the first flattening, and is cleaned after passing the inspection. After cleaning, it is packaged, and after the package is cleaned, it is rolled after cleaning. During rolling, the rolling process does not exceed 70%, the first pass reduction rate does not exceed 40%, the next two passes reduction rate does not exceed 60%, and the last pass reduction rate does not exceed 12%. After the rolling treatment, the steel wire mesh is flattened for the second time, and is packaged after the second flattening. After packaging, it is placed for standby use; S4: Warp steel wire reservation: Warp steel wire is reserved according to the size of the prefabricated pattern, the woven steel mesh is cut into sheet mesh, and evenly laid on the electroforming mold. The surface of the electroforming mold is vacuum-deposited with nano-coating; S5: application of photoresist film: apply photoresist film evenly on the surface of the evenly laid steel mesh. The thickness of the photoresist film is selected according to the designed thickness. The application steps include: applying the photoresist film on the steel mesh plate and baking it at a temperature of 200°C for 10 minutes. After baking, perform photolithography on it. After photolithography, perform development. After development, perform baking. After baking, prepare the electroforming tank to generate an electroformed metal layer. After the electroformed metal layer is generated, perform stripping. After stripping, use ultrasonic waves to clean impurities. After cleaning, stretch the mesh and inspect it.

2. The process for producing a fully-open composite mesh of a steel wire mesh and an electroformed alloy plate according to claim 1, characterized in that: In step S3, a hydrocarbon solvent is used as a cleaning agent to clean the wire mesh plate. The surface of the wire mesh plate is first dehydrated. After dehydration, the wire mesh plate is sprayed and cleaned with a hydrocarbon solvent. After spray cleaning, the surface of the wire mesh plate is flushed and struck, wherein the spraying pressure is 6 MPa. After cleaning, the wire mesh plate is dried by vacuum drying.

3. The process for producing a fully-open composite mesh of a steel wire mesh and an electroformed alloy plate according to claim 1, characterized in that: In step S5, the photoresist comprises the following preparation steps:

1. Preparation of reagents: tetrahydrofuran, cyclohexanone, N,N-dimethylformamide, ethylene glycol ethyl ether acetate, acetone, sodium hydroxide, film-forming resin, and photoinitiator; 2. Add film-forming resin, photoinitiator, tetrahydrofuran, cyclohexanone, N,N-dimethylformamide, ethylene glycol ethyl ether acetate, and sodium hydroxide to acetone to form a solution with a concentration of 10%-20%. Stir to completely dissolve it, then perform coarse filtration first, and then fine filtration through a 0.2μm filter element to complete the preparation of the photoresist.

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