Electrostatic chuck temperature control system, semiconductor device and temperature control method

Abstract

The invention discloses an electrostatic chuck temperature control system, semiconductor equipment and a temperature control method. The electrostatic chuck temperature control system comprises a chuck body; each circle of fluid medium channel is independently arranged and is distributed outwards in the radial direction of the center position of the disc body; the plurality of temperature detectors are arranged in the disc body and are respectively positioned on the side edges of the plurality of circles of fluid medium channels; the fluid medium sources are independently connected with the multiple circles of fluid medium channels respectively; and the flow control module is connected with the multiple temperature detectors and the fluid medium source, and the flow control module is used for controlling the fluid medium source to provide the same or different flows of fluid media for the multiple circles of fluid medium channels according to the temperature information detected by the multiple temperature detectors. The disc body is provided with the multiple circles of independent fluid medium channels, the temperature detector is additionally arranged to detect the real-time temperature value of the disc body, the flow control module independently adjusts the flow of the multiple circles of fluid medium channels according to the real-time temperature value, and therefore control over the temperature of the disc body is achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an electrostatic chuck temperature control system, semiconductor equipment and a temperature control method. Background Art

[0002] In the existing semiconductor device manufacturing process, one of the main steps is to form a thin film on the semiconductor chip through the chemical reaction of gas deposition. This type of deposition process is called CVD (chemical vapor deposition) process. In the conventional CVD process, the reaction gas flows to the surface of the wafer, and a thermochemical reaction occurs on the surface of the wafer to produce the desired thin film.

[0003] PECVD technology can generate plasma to promote the excitation or dissociation of reactant gases by applying radio frequency to the reaction area close to the wafer surface through plasma-enhanced CVD process; compared with conventional thermal CVD process, the high reactivity in plasma can reduce the energy required for chemical reactions, thereby reducing the temperature required for such chemical vapor deposition processes. Furthermore, existing HDP CVD technology can use high-density plasma to form high-density plasma under low vacuum pressure to make the plasma more active.

[0004] In the application of HDP CVD technology, an electrostatic chuck is used to support the wafer in the reaction chamber. When improving WPH (production efficiency), there will be a first-wafer effect. The reason is analyzed as the first wafer has just been cleaned, and the temperature of the electrostatic chuck temperature control system is inconsistent with the second and third wafers. Therefore, a solution is needed to effectively adjust the surface temperature of the electrostatic chuck.

[0005] In the prior art solution for adjusting the surface temperature of the electrostatic chuck, only a fixed water flow rate is used to control the temperature through a circle of water channels provided on the electrostatic chuck, resulting in relatively poor adjustability of the surface temperature of the electrostatic chuck. Summary of the invention

[0006] The purpose of the present invention is to provide an electrostatic chuck temperature control system, semiconductor equipment and temperature control method, aiming to solve the problem that the adjustability of the surface temperature of the existing electrostatic chuck is still relatively poor.

[0007] In order to solve the above technical problems, the object of the present invention is achieved through the following technical solutions: to provide an electrostatic chuck temperature control system, comprising:

[0008] Plate body;

[0009] A plurality of circles of fluid medium channels, each circle being independently arranged and distributed radially outward from the center of the disk body;

[0010] A plurality of temperature detectors are arranged in the disk body and are respectively located at the sides of the plurality of circles of fluid medium channels;

[0011] A fluid medium source is independently connected to the multiple turns of fluid medium channels;

[0012] A flow control module is connected to a plurality of temperature detectors and a fluid medium source, and is used to control the fluid medium source to provide the same or different flow rates of fluid medium to a plurality of fluid medium channels according to the temperature information detected by the plurality of temperature detectors.

[0013] Furthermore, two ends of each circle of fluid medium channels form a medium inlet and a medium outlet on the bottom of the disk body, and the fluid medium source is connected to the medium inlet and the medium outlet of each fluid medium channel through an input pipeline and an output pipeline respectively.

[0014] Furthermore, a plurality of mounting holes are provided in the disk body; and a plurality of temperature detectors are respectively installed in the plurality of mounting holes.

[0015] Furthermore, a plurality of temperature detectors are arranged close to the surface of the tray for placing wafers.

[0016] Furthermore, the flow control module includes:

[0017] A control center, used for receiving and processing temperature data detected by a plurality of temperature detectors;

[0018] A plurality of control valves are electrically connected to the control center and are respectively located on the input pipeline corresponding to each circle of the fluid medium channel.

[0019] Furthermore, the multiple circles of fluid medium channels include a first fluid medium channel and a second fluid medium channel; the first fluid medium channel is arranged in the inner circle of the disk body; and the second fluid medium channel is arranged in the outer circle of the disk body.

[0020] Furthermore, the plurality of temperature detectors include a first temperature detector and a second temperature detector; the first temperature detector is disposed at one side of the first fluid medium channel, and the second temperature detector is disposed at one side of the second fluid medium channel.

[0021] An embodiment of the present invention further provides a semiconductor device, comprising the electrostatic chuck temperature control system as described above.

[0022] The embodiment of the present invention further provides a temperature control method, which is applied to the electrostatic chuck temperature control system as described above, comprising:

[0023] Using a plurality of temperature detectors to respectively detect the real-time temperature values ​​at a plurality of positions on the disk body radially outward from the center, obtain a plurality of real-time temperature values ​​and send them to the flow control module;

[0024] Confirm the temperature requirement of the disk;

[0025] The flow control module controls the fluid medium source to input fluid medium of different flow rates into multiple circles of fluid medium channels according to real-time temperature values ​​detected by multiple temperature detectors, so as to independently adjust the temperature of the disk body from the center radially outward until the disk body reaches the required temperature requirement.

[0026] Further, according to the temperature requirement of the disk body, the flow control module controls the fluid medium source to input the same or different flow rates of fluid medium into multiple circles of fluid medium channels according to the real-time temperature values ​​detected by multiple temperature detectors, so as to independently adjust the temperature of the disk body from the center radially outward until the disk body reaches the required temperature requirement, including:

[0027] When the temperature requirement of the disk body is uniform temperature, confirming the required target temperature value;

[0028] Acquire multiple real-time temperature values ​​detected by multiple temperature detectors;

[0029] Accelerating the fluid flow rate of the fluid medium channel corresponding to the real-time temperature value higher than the target temperature value, so that the temperature around the corresponding fluid medium channel decreases and approaches the target temperature value;

[0030] reducing the fluid flow rate of the fluid medium channel corresponding to the real-time temperature value lower than the target temperature value, so that the temperature around the corresponding fluid medium channel rises and approaches the target temperature value;

[0031] When the difference between the multiple real-time temperature values ​​reaches a preset threshold, it is determined that the temperature of the disk has reached uniformity.

[0032] Furthermore, the flow control module controls the fluid medium source to input the same or different flow rates of fluid medium into the multiple circles of fluid medium channels according to the real-time temperature values ​​detected by the multiple temperature detectors, so as to independently adjust the temperature of the disk body from the center radially outward until the disk body reaches the required temperature requirement, including:

[0033] When the temperature requirement of the disk body is that there is a temperature difference between the inner and outer rings, confirming the target temperature value of the inner ring and the target temperature value of the outer ring;

[0034] Acquire real-time temperature values ​​of the inner circle of the disk and the outer circle of the disk respectively detected by a plurality of temperature detectors;

[0035] According to the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is adjusted so that the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value;

[0036] The fluid flow rate in the fluid medium channel of the outer ring of the disk body is adjusted according to the outer ring target temperature value, so that the real-time temperature value of the outer ring of the disk body reaches the inner ring target temperature value.

[0037] Further, the step of adjusting the fluid flow rate in the fluid medium channel of the inner ring of the disk body according to the inner ring target temperature value so that the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value includes:

[0038] When the real-time temperature value of the inner ring of the disk body is higher than the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is accelerated to reduce the temperature of the inner ring of the disk body until the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value;

[0039] When the real-time temperature value of the inner ring of the disk body is lower than the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is reduced to increase the temperature of the inner ring of the disk body until the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value;

[0040] Furthermore, the step of adjusting the fluid flow rate in the fluid medium channel of the outer ring of the disk body according to the outer ring target temperature value so that the real-time temperature value of the outer ring of the disk body reaches the inner ring target temperature value includes:

[0041] When the real-time temperature value of the outer ring of the disk body is higher than the outer ring target temperature value, the fluid flow rate in the fluid medium channel of the outer ring of the disk body is accelerated to reduce the temperature of the outer ring of the disk body until the real-time temperature value of the outer ring of the disk body reaches the outer ring target temperature value;

[0042] When the real-time temperature value of the outer ring of the disk body is lower than the outer ring target temperature value, the fluid flow in the fluid medium channel of the outer ring of the disk body is correspondingly reduced to increase the temperature of the outer ring of the disk body until the real-time temperature value of the outer ring of the disk body reaches the outer ring target temperature value.

[0043] The beneficial effects of the embodiments of the present invention are as follows: a plurality of independent fluid medium channels are arranged at the radially outward position of the center of the disk body, and a temperature detector is added to detect the real-time temperature value of the radially outward position of the center of the disk body, and the real-time temperature value is transmitted to the flow control module, and the flow control module independently adjusts the flow of the plurality of fluid medium channels according to the real-time temperature value, thereby realizing the control of the temperature of the disk body, which has the advantage of good adjustability. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0045] Figure 1 A schematic diagram of the bottom structure of a disk body provided in an embodiment of the present invention.

[0046] Figure 2 A schematic diagram of the bottom cross-sectional structure of a disk body provided in an embodiment of the present invention.

[0047] Figure 3 A schematic structural diagram of an electrostatic chuck temperature control system provided in an embodiment of the present invention.

[0048] Figure 4 A schematic flow chart of a temperature control method provided in an embodiment of the present invention.

[0049] Figure 5 A schematic diagram of a sub-process of the temperature control method provided in an embodiment of the present invention.

[0050] Figure 6 A schematic diagram of another sub-process of the temperature control method provided in an embodiment of the present invention.

[0051] Description of the symbols in the figure:

[0052] 1. Disk body; 11. First fluid medium channel; 111. First medium inlet; 112. First medium outlet; 12. Second fluid medium channel; 121. Second medium inlet; 122. Second medium outlet; 13. First temperature detector; 131. First mounting hole; 14. Second temperature detector; 141. Second mounting hole; 15. Input pipeline; 16. Output pipeline; 2. Flow control module; 3. Fluid medium source. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0055] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, the singular forms "a", "an" and "the" are intended to include plural forms unless the context clearly indicates otherwise.

[0056] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0057] See also Figures 1 to 3 , an embodiment of the present invention provides an electrostatic chuck temperature control system, comprising:

[0058] Plate body;

[0059] Multiple circles of fluid medium channels, each circle is independently arranged and distributed radially outward from the center of the disc body;

[0060] A plurality of temperature detectors are arranged in the disk body and are respectively located at the sides of the plurality of circles of fluid medium channels;

[0061] A fluid medium source is independently connected to the multiple turns of fluid medium channels;

[0062] The flow control module is connected to multiple temperature detectors and a fluid medium source. The flow control module is used to control the fluid medium source to provide the same or different flow rates of fluid medium to multiple circles of fluid medium channels according to the temperature information detected by the multiple temperature detectors.

[0063] In this embodiment, the disk body is in the shape of a disk, the upper surface of the disk body is used to place wafers, the multiple circles of fluid medium channels are independent channels, do not interfere with each other, the multiple circles of fluid medium channels are radially distributed outward from the center of the disk body, and at least one circle is distributed in the inner circle and the outer circle of the disk body. Correspondingly, in order to better control the temperature of the disk body, multiple temperature detectors are set on the disk body, the number of temperature detectors can be the same as the number of fluid medium channels and one-to-one correspondence, a temperature detector is located on one side of a circle of fluid medium channels, and is used to detect the real-time temperature value near each circle of fluid medium channels, that is, it can detect the real-time temperature value of the inner and outer circles of the disk body.

[0064] Based on this, this embodiment uses multiple temperature detectors to detect real-time temperature values ​​at the radially outward position of the center of the disk, and transmits multiple real-time temperature values ​​to the flow control module. The flow control module independently adjusts the flow of multiple circles of fluid medium channels according to the real-time temperature values, thereby achieving control of the inner and outer circle temperatures of the disk surface, which has the advantage of good adjustability.

[0065] In one embodiment, multiple temperature detectors can also be set on one side of each circle of fluid medium channels. The multiple temperature detectors are evenly distributed along the path of the circle of fluid medium channels, and the real-time temperature values ​​of more positions around the circle can be detected, and the average value can be taken as the final real-time temperature value.

[0066] In one embodiment, the fluid medium may be a liquid medium or a gaseous medium, such as cooling water, cold air, etc. In this embodiment, cooling water is preferably used for temperature control.

[0067] For ease of understanding, a specific embodiment is used for detailed description: the multiple circles of fluid medium channels include a first fluid medium channel and a second fluid medium channel; the first fluid medium channel is arranged in the inner circle of the disk body; the second fluid medium channel is arranged in the outer circle of the disk body; correspondingly, the multiple temperature detectors include a first temperature detector and a second temperature detector; the first temperature detector is arranged on one side of the first fluid medium channel, and the second temperature detector is arranged on one side of the second fluid medium channel.

[0068] In this specific embodiment, the medium flow in the first fluid medium channel and the second fluid medium channel will affect the temperature around the first fluid medium channel and the second fluid medium channel, that is, affect the temperature of the inner circle and the outer circle of the disk. It can be understood that if the disk needs to maintain uniform temperature, the real-time temperature values ​​of the inner circle and the outer circle of the disk are detected by the first temperature detector and the second temperature detector respectively, and the flow of the fluid medium channel corresponding to the position with high real-time temperature value is reduced, and the flow of the fluid medium channel corresponding to the position with low real-time temperature value is increased, so that the real-time temperature values ​​of the inner circle and the outer circle of the disk are gradually reduced until the temperature uniformity requirement is met. It can also be understood that in order to adjust the film quality of the wafer, some processes require that the inner circle and the outer circle of the disk maintain a certain temperature difference. In this case, the temperature of the inner and outer circles can be independently adjusted by independently adjusting the flow of the corresponding fluid medium channel, so as to meet the requirement of maintaining the temperature difference between the inner and outer circles.

[0069] In one embodiment, both ends of each circle of fluid medium channels form a medium inlet and a medium outlet on the bottom of the disk, and the fluid medium source is connected to the medium inlet and the medium outlet of each fluid medium channel through an input pipeline and an output pipeline respectively.

[0070] In this embodiment, the fluid medium source inputs the fluid medium to the medium inlet through the input pipeline, the fluid medium enters and flows in the fluid medium channel, thereby exchanging heat with the disk body, thereby adjusting the temperature of the disk body, and then flows out from the medium outlet after the heat exchange and refluxes through the output pipeline, thereby realizing circulation.

[0071] In this embodiment, the medium inlet and the medium outlet adopt a quick interface structure with good sealing performance to achieve stable connection, thereby ensuring the stability of heat exchange.

[0072] In one embodiment, a plurality of mounting holes are formed in the disk body; and a plurality of temperature detectors are respectively mounted in the plurality of mounting holes.

[0073] In this embodiment, the positions of the multiple mounting holes correspond one by one to one on one side of the multi-circle fluid medium channel. If we continue to take the first fluid medium channel and the second fluid medium channel in the above example as an example, two mounting holes can be set, namely the first mounting hole and the second mounting hole. The first mounting hole and the second mounting hole are respectively opened in the inner circle and the outer circle of the disk body. Correspondingly, two temperature detectors are set, namely the first temperature detector and the second temperature detector. The first temperature detector and the second temperature detector are respectively installed in the first mounting hole and the second mounting hole, thereby realizing real-time temperature detection of the inner and outer circles of the disk body.

[0074] Specifically, a plurality of temperature detectors may be arranged close to the surface of the disk for placing wafers; the real-time temperature value of the disk surface (ie, the upper surface) may be obtained more accurately, making the temperature control of the disk surface more precise.

[0075] In one embodiment, the flow control module includes: a control center and multiple control valves; the control center is used to receive and process temperature data detected by multiple temperature detectors; the multiple control valves are electrically connected to the control center and are respectively located on the input pipeline corresponding to each circle of fluid medium channels.

[0076] In this embodiment, multiple temperature detectors and the control center can be connected by wired or wireless communication, and the real-time temperature values ​​of multiple positions on the disk can be collected in real time, and temperature analysis can be performed. Multiple control valves are respectively located on the input pipeline corresponding to each circle of fluid medium channels. The control valves are automatic valves that can adjust different openings. After the control center analyzes each real-time temperature value and calculates the flow required for each circle of fluid medium channels, each control valve is controlled to adjust to a different opening to achieve independent control of the flow of each fluid medium channel.

[0077] An embodiment of the present invention further provides a semiconductor device, including the above electrostatic chuck temperature control system.

[0078] See also Figure 4 The embodiment of the present invention further provides a temperature control method, which is applied to the above electrostatic chuck temperature control system, comprising:

[0079] S401, using multiple temperature detectors to respectively detect real-time temperature values ​​at multiple positions on the disk body radially outward from the center, obtain multiple real-time temperature values ​​and send them to the flow control module;

[0080] S402. According to the temperature requirement of the disk body, the flow control module controls the fluid medium source to input different flow rates of fluid medium into multiple circles of fluid medium channels according to the real-time temperature values ​​detected by multiple temperature detectors, so as to independently adjust the temperature of the disk body from the center radially outward until the disk body reaches the required temperature requirement.

[0081] In this embodiment, real-time temperature value detection is performed on the radially outward position of the center of the disk body through multiple temperature detectors, and multiple real-time temperature values ​​are transmitted to the flow control module. The flow control module independently adjusts the flow of multiple circles of fluid medium channels according to the real-time temperature values, thereby realizing the control of the inner and outer circle temperatures of the disk body surface, which has the advantage of good adjustability.

[0082] See also Figure 5 , step S402 includes:

[0083] S501, when the temperature requirement of the disk body is uniform temperature, confirm the required target temperature value;

[0084] S502, obtaining multiple real-time temperature values ​​detected by multiple temperature detectors;

[0085] S503, speeding up the fluid flow rate of the fluid medium channel corresponding to the real-time temperature value higher than the target temperature value so as to reduce the temperature around the corresponding fluid medium channel; reducing the fluid flow rate of the fluid medium channel corresponding to the real-time temperature value lower than the target temperature value so as to increase the temperature around the corresponding fluid medium channel; until the difference between the multiple real-time temperature values ​​reaches a preset threshold.

[0086] In this embodiment, the real-time temperature values ​​of various positions (inner and outer ring positions) of the disk body are detected respectively by multiple temperature detectors, and the flow rate of the fluid medium channel corresponding to the position with a high real-time temperature value is reduced, while the flow rate of the fluid medium channel corresponding to the position with a low real-time temperature value is increased. This can gradually reduce the real-time temperature values ​​of the inner and outer rings of the disk body until the temperature uniformity requirement is met.

[0087] More specifically, a target temperature value can be set, and the flow rates of various fluid medium channels can be adjusted so that the collected real-time temperature values ​​gradually approach the target temperature value. When the difference between all real-time temperature values ​​and the target temperature value reaches a preset threshold (for example, less than 1°C), it is determined that the surface of the disk used to place the wafers meets the temperature uniformity requirement.

[0088] See also Figure 6 , step S402 further includes:

[0089] S601, when the temperature requirement of the disk body is that there is a temperature difference between the inner and outer rings, confirm the target temperature value of the inner ring and the target temperature value of the outer ring;

[0090] S602, obtaining multiple real-time temperature values ​​detected by multiple temperature detectors;

[0091] S603, when the real-time temperature value of the inner ring of the disk body is higher than the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is accelerated to reduce the temperature of the inner ring of the disk body; when the real-time temperature value of the inner ring of the disk body is lower than the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is reduced to increase the temperature of the inner ring of the disk body; until the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value;

[0092] S604. When the real-time temperature value of the outer ring of the disk is higher than the outer ring target temperature value, the fluid flow rate in the fluid medium channel of the outer ring of the disk is accelerated to reduce the temperature of the outer ring of the disk; when the real-time temperature value of the outer ring of the disk is lower than the outer ring target temperature value, the fluid flow rate in the fluid medium channel of the outer ring of the disk is correspondingly reduced to increase the temperature of the outer ring of the disk; until the real-time temperature value of the outer ring of the disk reaches the outer ring target temperature value.

[0093] In this embodiment, some processes require that the inner and outer rings of the disk body maintain a certain temperature difference in order to adjust the wafer film quality. In this case, the temperatures of the inner and outer rings can be independently adjusted by independently adjusting the flow rates of the corresponding fluid medium channels. That is, the requirement of maintaining the temperature difference between the inner and outer rings of the disk body can be achieved based on the process of steps S601 to S604, and the temperature control of the inner and outer rings with a temperature difference of -20-+20°C can be achieved.

[0094] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. An electrostatic chuck temperature control system, characterized in that: include: Plate body; A plurality of circles of fluid medium channels, each circle being independently arranged and distributed radially outward from the center of the disk body; A plurality of temperature detectors are arranged in the disk body and are respectively located at the sides of the plurality of circles of fluid medium channels; A fluid medium source is independently connected to the multiple turns of fluid medium channels; A flow control module is connected to a plurality of temperature detectors and a fluid medium source, and is used to control the fluid medium source to provide the same or different flow rates of fluid medium to a plurality of fluid medium channels according to the temperature information detected by the plurality of temperature detectors.

2. The electrostatic chuck temperature control system according to claim 1, characterized in that: The two ends of each circle of fluid medium channels form a medium inlet and a medium outlet at the bottom of the disk body, and the fluid medium source is connected to the medium inlet and the medium outlet of each fluid medium channel through an input pipeline and an output pipeline respectively.

3. The electrostatic chuck temperature control system according to claim 1, characterized in that: The disk body is provided with a plurality of mounting holes; a plurality of temperature detectors are respectively mounted in the plurality of mounting holes.

4. The electrostatic chuck temperature control system according to claim 1, characterized in that: A plurality of temperature detectors are arranged close to the surface of the tray for placing wafers.

5. The electrostatic chuck temperature control system according to claim 2, characterized in that: The flow control module comprises: A control center, used for receiving and processing temperature data detected by a plurality of temperature detectors; A plurality of control valves are electrically connected to the control center and are respectively located on the input pipeline corresponding to each circle of the fluid medium channel.

6. The electrostatic chuck temperature control system according to claim 1, characterized in that: The multi-ring fluid medium channel comprises a first fluid medium channel and a second fluid medium channel; the first fluid medium channel is arranged in the inner ring of the disk body; the second fluid medium channel is arranged in the outer ring of the disk body.

7. The electrostatic chuck temperature control system according to claim 6, characterized in that: The plurality of temperature detectors include a first temperature detector and a second temperature detector; the first temperature detector is disposed at one side of the first fluid medium channel, and the second temperature detector is disposed at one side of the second fluid medium channel.

8. A semiconductor device, characterized in that: It comprises the electrostatic chuck temperature control system as described in any one of claims 1 to 7.

9. A temperature control method, applied to the electrostatic chuck temperature control system according to any one of claims 1 to 7, characterized in that: include: Using a plurality of temperature detectors to respectively detect the real-time temperature values ​​at a plurality of positions on the disk body radially outward from the center, obtain a plurality of real-time temperature values ​​and send them to the flow control module; Confirm the temperature requirement of the disk; The flow control module controls the fluid medium source to input fluid medium of different flow rates into multiple circles of fluid medium channels according to real-time temperature values ​​detected by multiple temperature detectors, so as to independently adjust the temperature of the disk body from the center radially outward until the disk body reaches the required temperature requirement.

10. The temperature control method according to claim 9, characterized in that: The flow control module controls the fluid medium source to input the same or different flow rates of fluid medium into the multiple circles of fluid medium channels according to the real-time temperature values ​​detected by the multiple temperature detectors, so as to independently adjust the temperature of the disc body from the center radially outward until the disc body reaches the required temperature requirement, including: When the temperature requirement of the disk body is uniform temperature, confirming the required target temperature value; Acquire multiple real-time temperature values ​​detected by multiple temperature detectors; Accelerating the fluid flow rate of the fluid medium channel corresponding to the real-time temperature value higher than the target temperature value, so that the temperature around the corresponding fluid medium channel decreases and approaches the target temperature value; reducing the fluid flow rate of the fluid medium channel corresponding to the real-time temperature value lower than the target temperature value, so that the temperature around the corresponding fluid medium channel rises and approaches the target temperature value; When the difference between the multiple real-time temperature values ​​reaches a preset threshold, it is determined that the temperature of the disk has reached uniformity.

11. The temperature control method according to claim 9, characterized in that: The flow control module controls the fluid medium source to input the same or different flow rates of fluid medium into the multiple circles of fluid medium channels according to the real-time temperature values ​​detected by the multiple temperature detectors, so as to independently adjust the temperature of the disc body from the center radially outward until the disc body reaches the required temperature requirement, including: When the temperature requirement of the disk body is that there is a temperature difference between the inner and outer rings, confirming the target temperature value of the inner ring and the target temperature value of the outer ring; Acquire real-time temperature values ​​of the inner circle of the disk and the outer circle of the disk respectively detected by a plurality of temperature detectors; According to the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is adjusted so that the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value; The fluid flow rate in the fluid medium channel of the outer ring of the disk body is adjusted according to the outer ring target temperature value, so that the real-time temperature value of the outer ring of the disk body reaches the inner ring target temperature value.

12. The temperature control method according to claim 11, characterized in that: The step of adjusting the fluid flow rate in the fluid medium channel of the inner ring of the disk body according to the inner ring target temperature value so that the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value comprises: When the real-time temperature value of the inner ring of the disk body is higher than the inner ring target temperature value, the fluid flow rate in the fluid medium channel of the inner ring of the disk body is accelerated to reduce the temperature of the inner ring of the disk body until the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value; When the real-time temperature value of the inner ring of the disk body is lower than the inner ring target temperature value, the fluid flow in the fluid medium channel of the inner ring of the disk body is reduced to increase the temperature of the inner ring of the disk body until the real-time temperature value of the inner ring of the disk body reaches the inner ring target temperature value.

13. The temperature control method according to claim 11, characterized in that: The step of adjusting the fluid flow rate in the fluid medium channel of the outer ring of the disk body according to the outer ring target temperature value so that the real-time temperature value of the outer ring of the disk body reaches the inner ring target temperature value comprises: When the real-time temperature value of the outer ring of the disk body is higher than the outer ring target temperature value, the fluid flow rate in the fluid medium channel of the outer ring of the disk body is accelerated to reduce the temperature of the outer ring of the disk body until the real-time temperature value of the outer ring of the disk body reaches the outer ring target temperature value; When the real-time temperature value of the outer ring of the disk body is lower than the outer ring target temperature value, the fluid flow in the fluid medium channel of the outer ring of the disk body is correspondingly reduced to increase the temperature of the outer ring of the disk body until the real-time temperature value of the outer ring of the disk body reaches the outer ring target temperature value.

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