Chip for gas sensor and gas sensor
By opening slots on the substrate of the gas sensor chip to form interlaced tortuous channels, the problem of uneven gas flow in the prior art is solved, and a more stable gas sensing effect is achieved.
Patent Information
- Application Number
- CN202510152922.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-12
- Publication Date
- 2025-03-11
AI Technical Summary
Existing gas sensor chips are difficult to provide sufficient and uniform gas flow while maintaining structural integrity, resulting in poor measurement stability and accuracy.
Using a strip-shaped first substrate and a second substrate, a plurality of slots are spaced apart in the centers, a staggered arrangement is arranged to form a tortuous channel, extending from the head of the chip to the tail, ensuring the stability of gas flow.
The flow rate of the gas to be measured is reduced through the tortuous channel, ensuring the stability of the oxygen concentration in the inner cavity of the chip, reducing the impact of external airflow fluctuations on the reading, and improving the stability and measurement accuracy of the chip.
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Figure CN119595737A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of gas sensors, and in particular to a chip for a gas sensor and a gas sensor. Background Art
[0002] Gas sensors, especially nitrogen oxide gas sensors, play an important role in the fields of industry, environmental monitoring and automobile emission control. These sensors usually contain a ceramic chip for accurately measuring the concentration of nitrogen oxides. In order to achieve accurate gas concentration measurement, the gas sensor chip requires a reference gas channel. Ambient air containing nitrogen oxides enters the chip as a reference gas to provide a stable reference point for comparison. However, how to design a ventilation structure that can provide sufficient gas flow without affecting the overall structural integrity of the chip has always been a technical difficulty faced by technicians in this field.
[0003] Existing gas sensor chip ventilation structures generally adopt two main solutions.
[0004] like Figure 1 As shown in the figure, the first solution is to create a long slot inside the chip so that the gas can enter from one end of the chip to the other. This long slot structure can achieve gas transmission, but the long slot is prone to offset during the manufacturing process, resulting in inconsistent vent sizes, which affects product performance and consistency. In addition, the long slot structure will also reduce the overall bending strength of the chip, reducing the overall structural strength of the chip.
[0005] like Figure 2 As shown, the second solution is to print a layer of porous alumina slurry A on the surface of the reference electrode. Although this structure can improve the strength of the chip, its ventilation performance is poor and it cannot provide enough reference air for the electrodes inside the chip.
[0006] It can be seen that the existing technology cannot provide sufficient and uniform gas flow while maintaining the integrity of the chip structure, resulting in insufficient buffering for external air flow fluctuations and poor measurement stability and accuracy. Summary of the invention
[0007] In view of the above technical problems existing in the prior art, the present invention provides a chip for a gas sensor and a gas sensor, which solves the problem of simultaneously satisfying the chip structure completeness and the gas flow problem.
[0008] To achieve the above object, the present invention adopts the following technical solution: A chip for a gas sensor includes a reference gas vent, wherein the reference gas vent includes a first substrate and a second substrate arranged in a strip shape. A plurality of first slots are provided at intervals in the center of the first substrate, and the first slots form a plurality of first protrusions in the portion of the center of the first substrate where no slots are provided, the plurality of first slots are located in the center of the first substrate and distributed along the length direction, and the plurality of first protrusions are arranged in a row along the length direction of the first substrate; a plurality of second slots are provided at intervals in the center of the second substrate, and the second slots form a plurality of second protrusions in the portion of the center of the second substrate where no slots are provided, the plurality of second slots are located in the center of the second substrate and distributed along the length direction, and the plurality of second protrusions are arranged in a row along the length direction of the second substrate; the sides of the first substrate and the second substrate are closed, so that the two opposite surfaces of the first substrate and the second substrate constitute a gas channel, one end of the gas channel is a chip head, and the other end is a chip tail; in the gas channel, the first protrusions and the second protrusions are arranged alternately to form a tortuous channel, the tortuous channel extends from the chip head to the chip tail, and an air inlet is formed at the chip tail.
[0009] As an embodiment of the present invention, the reference gas ventilation portion also includes: a first external substrate and a second external substrate, the first external substrate and the second external substrate are stacked on the outside of the first substrate and the second substrate respectively, wherein a reference electrode is arranged on the first external substrate or the second external substrate, the reference electrode is arranged in the direction of the chip head, and is connected to the tortuous channel through the first slot or the second slot.
[0010] As an embodiment of the present invention, the length of the first slot is greater than the unslotted portion of the second substrate, and the length of the second slot is greater than the unslotted portion of the first substrate, so that the first protrusion and the second protrusion can be staggered and form a tortuous channel.
[0011] As an embodiment of the present invention, the protrusion heights of the first substrate and the second substrate are respectively located in the middle of the first substrate and the second substrate.
[0012] As an embodiment of the present invention, the slot size of the first slot and the second slot is 10*0.7mm, and the filling area is 7mm 2 , so that the groove width of the first substrate and the second substrate after sintering is 0.56mm.
[0013] As an embodiment of the present invention, the first slots and the second slots are evenly distributed, so that the intervals between adjacent first protrusions and second protrusions are the same.
[0014] As an embodiment of the present invention, the heating portion is printed on a third substrate, the third substrate is stacked on the outside of the reference gas vent, and the surface of the third substrate has an opening for connection.
[0015] As an embodiment of the present invention, the gas measuring part is printed on a fourth substrate, and the fourth substrate is stacked on the outside of the reference gas ventilation part; the front end of the gas measuring part has an inlet for the gas to be measured, and the position of the inlet for the gas to be measured has a detection electrode and an oxygen pumping electrode, the detection electrode is arranged near the chip head, and the oxygen pumping electrode pumps out the oxygen in the gas to be measured, so that the detection electrode detects the content of nitrogen oxides.
[0016] As an embodiment of the present invention, the main electrode portion is printed on a fifth substrate, and the fifth substrate is stacked on the outside of the gas measuring portion or the heating portion; the main electrode portion has a positive electrode, which is used to adsorb oxygen ions pumped out by the oxygen pumping electrode and discharge them to the outside of the chip.
[0017] As an embodiment of the present invention, the lead connection part is printed on the sixth substrate, and the sixth substrate is stacked on the outside of the gas measuring part or the heating part; the lead connection part is connected to the detection electrode and the oxygen pumping electrode through the slurry, and is directly connected to the positive electrode.
[0018] To achieve the above object, the present invention also discloses a gas sensor which adopts the above chip.
[0019] In the above technical scheme, the present invention can reduce the flow rate of the gas to be measured through a gas channel with a tortuous channel, ensure the stability of the oxygen concentration in the internal cavity of the chip, reduce abnormal readings due to excessively fast external gas flow rate, and improve the stability of the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 It is an existing gas sensor chip with a long slot type ventilation slot; Figure 2 The existing method is to print a layer of alumina slurry-type ventilation groove on the surface of the reference electrode; Figure 3 is an exploded view of the sensor chip of the present invention; Figure 4 is a cutaway stereogram of a sensor chip; Figure 5 yes Figure 4 A partial enlarged view of Figure 6 is a cross-sectional view of a sensor chip according to another embodiment; Figure 7 It is a schematic diagram of the airflow in a tortuous channel. DETAILED DESCRIPTION
[0022] The following is a further clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings and embodiments. Obviously, the described embodiments are used to explain the technical solutions of the present invention, and do not mean that all implementation methods of the present invention have been exhaustively listed.
[0023] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.
[0024] Gas sensors, especially NOx sensors, play a vital role in various industries and applications, providing essential data for safety, environmental monitoring and process control. However, existing gas sensor technologies often face the problem of chip stability and measurement accuracy, especially for NOx sensors.
[0025] Reference Figure 3 The gas sensor chip structure shown in the figure mainly adopts a stacked structure, and each functional component is printed on a substrate of different layers, and finally the multi-layer substrate is stacked to form a final chip structure. The stacked chip structure includes a main electrode part 4, a gas measurement part 2, a reference gas ventilation part 1, a heating part 3 and a lead connection part 5 in sequence. The main improvement of the present invention lies in the structure of the reference gas ventilation part 1. Figures 3 to 6 In the figure, H indicates the chip head direction, and T indicates the chip tail direction.
[0026] like Figures 3 to 6 As shown, the reference gas vent 1 comprises a first substrate 11 and a second substrate 13 which are arranged opposite to each other, and the first substrate 11 and the second substrate 13 are both long strip-shaped components, especially rectangular strip-shaped components. The first substrate 11 and the second substrate 13 are arranged face to face, and have two surfaces facing each other. A plurality of first protrusions 12 are formed on a surface of the first substrate 11 facing the second substrate 13, and the plurality of first protrusions 12 are arranged in at least one row along the length direction of the first substrate 11; a plurality of second protrusions 14 are formed on a surface of the second substrate 13 facing the first substrate 11, and the plurality of second protrusions 14 are arranged in at least one row along the length direction of the second substrate 13.
[0027] The first protrusion 12 and the second protrusion 14 are realized by opening slots on the first substrate 11 and the second substrate 13. Specifically, a plurality of first slots 15 are opened at intervals in the center of the first substrate 11, and the first slots 15 penetrate the first substrate 11. From the cross-section of the center of the first substrate 11, the first slots 15 form a "concave" part, and the first substrate part without slots is "convex" relative to the "concave" part. That is, the first slots 15 form a plurality of first protrusions 12 in the center of the first substrate 11 without slots, and the plurality of first slots 15 are located in the center of the first substrate 11 and distributed along the length direction, and the plurality of first protrusions 12 are arranged in a row along the length direction of the first substrate 11. Similar to the first substrate 11, a plurality of second slots 16 are spaced apart at the center of the second substrate 13. The second slots 16 form a plurality of second protrusions 14 in the portion of the second substrate 13 where no slots are formed. The plurality of second slots 16 are located at the center of the second substrate 13 and are distributed along the length direction. The plurality of second protrusions 14 are arranged in a row along the length direction of the second substrate 13.
[0028] The sides of the first substrate 11 and the second substrate 13 are closed, so that the two opposing surfaces of the first substrate 11 and the second substrate 13 constitute a gas channel. Generally, one end of the gas channel can be defined as the chip head, and the other end can be defined as the chip tail. In the gas channel, the first protrusions 12 and the second protrusions 14 are staggered to form a tortuous channel, which extends from the chip head to the chip tail, and forms an air inlet 10 at the chip tail. When the first protrusions 12 and the second protrusions 14 are arranged in opposite rows, the cross-section of the tortuous channel can be as follows: Figures 4 to 6 shown.
[0029] Continue as Figures 3 to 6 As shown, a first outer substrate 17 and a second outer substrate 18 are respectively disposed on the outer sides of the first substrate 11 and the second substrate 13, and the first substrate 11, the second substrate 13, the first outer substrate 17 and the second outer substrate 18 together constitute a reference gas vent. The first outer substrate 17 and the second outer substrate 18 are respectively stacked on the outer sides of the first substrate 11 and the second substrate 13, wherein a reference electrode 19 is disposed on the first outer substrate 17 or the second outer substrate 18. Figure 3 It is shown that the reference electrode 19 is arranged on the first external substrate 17, but those skilled in the art can understand that the reference electrode 19 can also be arranged on the second external substrate 18 symmetrically located with respect to the first external substrate 17. The reference electrode 19 is arranged in the direction of the chip head, and it protrudes from the upper surface of the first external substrate 17, so that it can extend into the first substrate 11 through the first slot 15 (or the second slot 16 if it is arranged on the second external substrate 18) and thus communicate with the tortuous channel. The first external substrate 17 has a wire connected to the reference electrode 19, and the wire extends along the length direction of the first external substrate 17 from the chip head direction to the chip tail direction.
[0030] In the molding process of the first protrusion 12 and the second protrusion 14, the present invention grooves the surface of the first substrate 11 to form the first protrusion 12, and the grooves of the first substrate 11 are evenly distributed along the longitudinal axis of the first substrate 11. Correspondingly, the surface of the second substrate 13 is grooved to form the second protrusion 14, and the grooves of the second substrate 13 are evenly distributed along the longitudinal axis of the second substrate 13. During assembly, the grooves of the first substrate 11 and the grooves of the second substrate 13 are staggered, so that the first protrusion 12 and the second protrusion 14 are staggered.
[0031] like Figures 4 to 6 As shown, the reference gas vent 1 eventually forms an air intake structure of a tortuous channel, which can be composed of two slotted first substrates 11 and second substrates 13, two long strip substrate layers are stacked vertically, and each layer contains a plurality of the above-mentioned first slots 15 and second slots 16, respectively. This staggered arrangement can create a non-linear path for gas flow. Air is introduced into the reference gas vent 1, and the air enters from the air inlet 10, moves along the tortuous channel, and flows to the reference electrode 19 near the chip head position, so that the reference electrode 19 measures the content of the corresponding compound in the air as reference data.
[0032] Those skilled in the art will understand that Figures 4 to 6 The cross-sections of the first slot hole 15 and the second slot hole 16 are shown to be rectangular, and the cross-sections of the corresponding first protrusion 12 and the second protrusion 14 are also rectangular. However, the rectangular cross-section is not the only option of the present invention. In other variations, the shape of the slot can also be a rounded rectangle, a trapezoid or other reasonable shapes, so that the first protrusion 12 and the second protrusion 14 can also be other corresponding reasonable shapes, which can achieve the technical purpose of the present invention and achieve the technical effect of the present invention.
[0033] As a preferred embodiment of the present invention, the length of each of the first slots 15 and the second slots 16 on the first substrate 11 and the second substrate 13 needs to be greater than the length of the unslotted portion, so that a tortuous channel can be formed. That is, the length of the first slot 15 is greater than the length of the unslotted portion on the second substrate, and the length d1 of the second slot 16 is greater than the length d2 of the unslotted portion on the first substrate, so that the first protrusion 12 and the second protrusion 14 can be staggered and form a tortuous channel, such as Figure 6 At the same time, Figure 6 Shown is a Figure 4 and Figure 5The structure is symmetrically arranged, that is, the reference electrode 19 is arranged on the second outer substrate 18, and extends into the second substrate 13 through the second slot 16, so as to communicate with the tortuous channel. Those skilled in the art can understand that the first substrate 11 and the second substrate 13 of the reference gas vent 1 are two substrates symmetrically arranged with each other, and the various arrangements of the two can be interchanged, and both can achieve the technical purpose of the present invention and achieve the technical effect of the present invention.
[0034] As another variation of the first slots 15 and the second slots 16 , the distribution of the slots along the axes of the first substrate 11 and the second substrate 13 may also be different. Figures 4 to 6 The grooves shown are arranged in a repetitive and uniform pattern along the length of the structure. That is, the grooves of the first substrate 11 and the second substrate 13 are evenly distributed, so that the spacing distances between adjacent first protrusions 12 and second protrusions 14 are the same. However, in other embodiments, this arrangement can also be uneven, such as having more grooves near one end of the chip, or having a longer length of the grooves, etc. This arrangement can achieve an uneven distribution of the grooves, so that the spacing distribution of the first protrusions 12 and the second protrusions 14 is also uneven, for example, the first protrusions 12 / second protrusions 14 at the head of the chip are more sparsely distributed (the length of the grooves is larger), and the first protrusions 12 / second protrusions 14 at the tail of the chip are more densely distributed (the length of the grooves is smaller), which allows for more precise control of the gas flow along the length of the chip.
[0035] As another variation of the first substrate 11 and the second substrate 13, the present invention can further include a third substrate on this basis. In this case, the chip can include more than two layers of gas channels, and each gas channel can be a tortuous channel. At this time, the air enters from the tortuous channel at one end of the chip head, and enters the next layer of gas channels when it flows to the tail of the chip and flows in the reverse direction, and so on. At the same time, the slots in each tortuous channel can be staggered relative to the adjacent layer. This configuration can increase the total length of the gas flow path, further slow down the gas flow and enhance stability.
[0036] Reference Figure 5 In the cross-sectional view of the gas channel of the tortuous channel structure shown, the protrusion heights of the first substrate 11 and the second substrate 13 are respectively located in the middle position of the first substrate 11 and the second substrate 13, and there are arrows in the tortuous channel indicating the downward direction, indicating the flow of gas or fluid through the first protrusion 12 and the second protrusion 14. Figure 5 The arrangement shown may create a series of chambers or channels between the first substrate 11 and the second substrate 13. An incoming gas or fluid may flow downwardly into these chambers, thereby buffering the gas flow rate.
[0037] As a preferred solution of the present invention, the slot size of the first substrate 11 and the second substrate 13 is 10*0.7mm, and the filling area is 7mm 2 The above parameters are calculated according to the shrinkage rate of the substrate to calculate the slotting range of the first slot 15 and the second slot 16, and are obtained through repeated parameter experiments and tests, so that the slotting width of the first substrate 11 and the second substrate 13 after sintering is 0.56mm.
[0038] Back to Figure 3 In the chip structure shown, the reference gas vent 1 is located in the middle layer of the chip, and the other layers of the chip are stacked on both sides of the reference gas vent 1 in sequence according to their structural positions. Figure 3 As shown, the heating portion 3 is printed on the third substrate, and the third substrate is stacked on the outside of the reference gas vent portion 1. The gas measurement portion 2 is printed on the fourth substrate, and the fourth substrate is stacked on the outside of the reference gas vent portion 1. The main electrode portion 4 is printed on the fifth substrate, and the fifth substrate is stacked on the outside of the gas measurement portion 2. The lead connection portion 5 is printed on the sixth substrate, and the sixth substrate is stacked on the outside of the heating portion 3.
[0039] The function of the heating part 3 is to provide controlled heating to the gas to be measured and to provide the necessary operating temperature for maintaining gas measurement and analysis. The heating part 3 is located on the third substrate of the sensor chip, close to one side of the gas channel and extending along the length of the chip. This arrangement allows heat to be effectively transferred to the gas measurement component above. Ensure that the temperature distribution of the sensing element is uniform. As a preferred embodiment, the third substrate material used for the heating part 3 can be selected from a material that can withstand high temperatures while maintaining structural integrity. For example, the third substrate can be made of ceramic materials or composite materials. These materials provide enhanced thermal stability and mechanical strength, thereby helping to improve the overall durability and performance of the sensor chip under various operating conditions. The heating part 3 can be a heating electrode, and the heating part 3 can provide heating to other electrodes on the chip, especially the reference electrode 19, the oxygen pumping electrode 21 and the detection electrode 22.
[0040] The front end of the gas measuring unit 2 has an inlet 20 for the gas to be measured, and the inlet 20 for the gas to be measured is located in the head direction of the chip. A detection electrode 22 and an oxygen pumping electrode 21 are arranged at the inlet 20 for the gas to be measured. The oxygen pumping electrode 21 pumps out the oxygen in the gas to be measured, so that the detection electrode 22 detects the content of nitrogen oxides. The detection electrode 22 can form a chemical reaction with specific molecules of the gas to be measured, such as nitrogen oxides, to detect the content of nitrogen oxides in the gas to be measured. The detection electrode 22 of the gas measuring unit 2 detects the value of the nitrogen oxide content in the gas to be measured, and compares the value with the value of the corresponding compound content in the air detected by the reference electrode 19, so as to obtain the final detection data. Based on this principle, the inlet 20 for the gas to be measured and the air inlet 10 of the chip of the present invention are respectively located in the head direction and the tail direction of the chip, and the two gases enter the chip from different directions and do not interfere with each other.
[0041] The main electrode part 4 is located at the outermost layer of the layered structure of the chip. The main electrode part 4 has a positive electrode, which is connected to the tortuous channel and is arranged near the tail of the chip, so that the positive electrode is exposed to the gas flow to be measured. The main electrode part 4 serves as the positive electrode of all other electrodes, and also plays the role of adsorbing the oxygen ions pumped out by the oxygen pumping electrode 21 and discharging them to the outside of the chip. The main electrode part 4 is at the top layer of the overall chip structure and can directly contact the gas to be measured.
[0042] The lead connection part 5 serves as a connection interface for the detection electrode 22, the oxygen pumping electrode 21 and the positive electrode. It can have a total of 8 leads, connecting 8 electrodes, connected in different ways. The main electrode can be directly connected to the lead on the surface, and the other internal electrodes are connected to the internal electrodes and leads by leading the electrodes to the side of the chip, and then applying slurry on the side to connect the internal electrodes to the leads. The lead connection part 5 is also located at the outermost layer of the chip layer structure. The lead connection part 5 can also include a conductive path or terminal to allow electrical signals to be transmitted from the detection electrode 22 and the positive electrode. As a preferred embodiment of the lead connection part 5, it can be made of a material that provides both mechanical stability and electrical conductivity. The material selection can depend on factors such as the conditions of use of the chip and the specific requirements of the electrode connection. At the same time, the lead connection part 5 can also include a structure that is convenient for connection to an external connector or circuit board. These structures may include pads, pin connectors or other types of electrical interfaces, so that the chip can be integrated into a larger system or measurement equipment.
[0043] The chip with a stacked structure disclosed in the present invention can be used in a nitrogen oxide sensor as a core component of the nitrogen oxide sensor. Such a sensor can have a wide range of applications, for example, in environmental monitoring. The tortuous channel of the sensor chip slows down the gas flow and can provide a longer interaction time between the gas to be measured and the chip, which can enhance the sensor's ability to accurately measure low-concentration pollutants or nitrogen oxide gases in outdoor or industrial air quality monitoring systems. The present invention can be applied in a wide range of fields that require precise gas sensing, including but not limited to environmental monitoring, industrial process control, automobile exhaust testing, and even extended to the field of medical diagnosis. The technical solution disclosed in the present invention can make gas measurement more reliable and accurate.
[0044] Those skilled in the art will appreciate that the terms "install", "connect", "assemble", "stack", etc., used in the present invention should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, indirectly connected through an intermediate medium, or connected inside two components. However, if other words have the same purpose, they can be replaced by other expressions.
[0045] Those skilled in the art should recognize that the above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention. As long as they are within the spirit of the present invention, any changes or modifications to the above embodiments will fall within the scope of the claims of the present invention.
Claims
1. A chip for a gas sensor, comprising a reference gas vent, wherein the reference gas vent comprises a first strip-shaped substrate and a second strip-shaped substrate arranged opposite to each other, characterized in that: A plurality of first slots are provided at intervals in the center of the first substrate, the first slots form a plurality of first protrusions in a portion of the center of the first substrate where no slot is provided, the plurality of first slots are located in the center of the first substrate and are distributed along the length direction, and the plurality of first protrusions are arranged in a row along the length direction of the first substrate; A plurality of second slots are provided at intervals in the center of the second substrate, the second slots form a plurality of second protrusions in a portion of the second substrate where no slot is provided, the plurality of second slots are located in the center of the second substrate and are distributed along the length direction, and the plurality of second protrusions are arranged in a row along the length direction of the second substrate; The side surfaces of the first substrate and the second substrate are closed, so that two opposite surfaces of the first substrate and the second substrate constitute a gas channel, one end of the gas channel is the chip head, and the other end is the chip tail; In the gas channel, the first protrusions and the second protrusions are arranged alternately to form a tortuous channel, the tortuous channel extends from the chip head to the chip tail, and an air inlet is formed at the chip tail.
2. The chip for a gas sensor according to claim 1, characterized in that: The reference gas vent further comprises: A first external substrate and a second external substrate, wherein the first external substrate and the second external substrate are stacked on the outsides of the first substrate and the second substrate respectively, wherein a reference electrode is arranged on the first external substrate or the second external substrate, the reference electrode is arranged in the direction of the chip head, and is connected to the tortuous channel through the first slot or the second slot.
3. The chip for gas sensor according to claim 1, characterized in that: The length of the first slot is greater than the unslotted portion of the second substrate, and the length of the second slot is greater than the unslotted portion of the first substrate, so that the first protrusion and the second protrusion can be staggered to form a tortuous channel.
4. The chip for a gas sensor according to claim 1, characterized in that: The protrusion heights of the first substrate and the second substrate are respectively located in the middle of the first substrate and the second substrate.
5. The chip for a gas sensor according to claim 1, characterized in that: The slot size of the first slot and the second slot is 10*0.7mm, and the filling area is 7mm 2 , so that the groove width of the first substrate and the second substrate after sintering is 0.56mm.
6. The chip for gas sensor according to claim 5, characterized in that: The first slots and the second slots are evenly distributed, so that the intervals between adjacent first protrusions and second protrusions are the same.
7. The chip for a gas sensor according to claim 1, characterized in that: It also includes a heating portion, which is printed on a third substrate. The third substrate is stacked on the outside of the reference gas vent, and the surface of the third substrate has an opening for connection.
8. The chip for gas sensor according to claim 7, characterized in that It also includes a gas measuring part, which is printed on a fourth substrate, and the fourth substrate is stacked on the outside of the reference gas ventilation part; the front end of the gas measuring part has an inlet for the gas to be measured, and the position of the inlet for the gas to be measured has a detection electrode and an oxygen pumping electrode, the detection electrode is arranged near the head of the chip, and the oxygen pumping electrode pumps out the oxygen in the gas to be measured, so that the detection electrode detects the content of nitrogen oxides.
9. The chip for a gas sensor according to claim 8, characterized in that: It also includes a main electrode part, which is printed on a fifth substrate, and the fifth substrate is stacked on the outside of the gas measurement part or the heating part; the main electrode part has a positive electrode, and the positive electrode is used to adsorb oxygen ions pumped out by the oxygen pumping electrode and discharge them to the outside of the chip.
10. The chip for a gas sensor according to claim 9, characterized in that: It also includes a lead connection part, which is printed on a sixth substrate, and the sixth substrate is stacked outside the gas measurement part or the heating part; the lead connection part is connected to the detection electrode and the oxygen pumping electrode through slurry, and is directly connected to the positive electrode.
11. A gas sensor, characterized in that: Comprising a chip as described in any one of claims 1-10.
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