An OSFP package high-speed optical module structure

Abstract

The present application discloses an OSFP packaged high-speed optical module structure, which relates to the technical field of optical module structure, including a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving end optoelectronic chip, and a transmitting end optoelectronic chip; the fixing component serves as the basic support structure of the optical module; the shell is a rectangular structure, serving as the external protective shell of the optical module, the bottom surface of the shell is placed on the external mounting surface, providing stable support for the entire optical module, the circuit board is a rectangular body, fixedly connected to the inner bottom wall of the shell, used to connect and support electronic components, and the thermal pad is a rectangular body, which fits tightly on the top of the circuit board, and is used to efficiently transfer the generated heat to the heat dissipation component. The present invention optimizes the heat dissipation component to achieve all-round heat dissipation support for the optical module, from low temperature startup to high temperature operation, ensuring that the optical module can operate stably under different temperature conditions.

Description

Technical Field

[0001] The present invention relates to the technical field of optical module structures, and particularly to an OSFP package high-speed optical module structure. Background Art

[0002] With the rapid development of electronic technology, the chip density on circuit boards is getting higher and higher, and the power consumption is also increasing. This leads to a sharp increase in the heat generated by chips during operation. When the chip temperature is too high, the performance of its internal components will be affected, and even the chip may fail. The traditional heat dissipation housing has poor heat dissipation effect in high-temperature environments, causing the chip to be in a high-temperature state for a long time, increasing the risk of failure. To ensure the normal operation of the chip, these heats must be dissipated in time. The traditional heat dissipation housing is usually made of metal materials, and the heat generated by the chip is transferred to the surface of the housing through heat conduction, and then the heat is dissipated into the air by relying on natural convection or forced air cooling. However, this method often has poor effects in high-temperature environments because the high-temperature environment will slow down the air flow speed, affecting the heat dissipation effect. Summary of the Invention

[0003] By providing an OSFP package high-speed optical module structure in the embodiments of the present application, through the optimization of the heat dissipation component in the present invention, the all-round heat dissipation support for the optical module is realized, ensuring the stable operation of the optical module under different temperature conditions from low-temperature startup to high-temperature operation.

[0004] The embodiments of the present application provide an OSFP package high-speed optical module structure, including a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving-end optoelectronic chip, and a transmitting-end optoelectronic chip;

[0005] The fixing component serves as the basic support structure of the optical module;

[0006] The fixing component includes a housing, a circuit board, a thermal pad, and a cover plate;

[0007] The housing is a cuboid structure and serves as the external protection shell of the optical module. It is made of high-strength and high-thermal-conductivity aluminum alloy material, having excellent corrosion resistance and wear resistance;

[0008] The bottom surface of the housing is placed on an external mounting surface, providing stable support for the entire optical module. The circuit board is a rectangular body, fixedly connected to the inner bottom wall of the housing, used for connecting and supporting electronic components, and adopting a high-performance epoxy resin glass fiber cloth board (FR-4), having excellent electrical performance and heat resistance;

[0009] The heat-conducting pad is a rectangular body, closely attached to the top of the circuit board, used to efficiently transfer the generated heat to the heat dissipation component, made of high thermal conductivity silicone material, with excellent thermal conductivity and flexibility;

[0010] The cover plate is a rectangular body, fixedly connected to the top of the housing by screws or other fastening means, used to enclose the internal structure of the optical module, prevent dust and moisture from invading, made of stainless steel material, with high strength and good rust prevention performance;

[0011] The heat dissipation component adopts a multi-layer capsule structure;

[0012] The heat dissipation component includes a first capsule. The first capsule is an ellipsoidal body, and the inside of the first capsule is filled with calcium chloride hexahydrate, which serves as a heat absorption and dissipation medium.

[0013] The heat dissipation component further includes a second capsule, a third capsule, a fourth capsule, a fifth capsule, and a sixth capsule. Each capsule is an ellipsoidal body, and they are nested layer by layer to form a multi-level heat dissipation structure;

[0014] The second capsule, the third capsule, the fourth capsule, the fifth capsule, and the sixth capsule are respectively filled with sodium sulfate decahydrate, sodium carbonate decahydrate, copper sulfate pentahydrate, ferrous sulfate heptahydrate, and sodium acetate trihydrate. Each capsule absorbs or releases heat through the chemical substances inside it when the temperature changes, enhancing the heat dissipation effect. The capsule is made of a polymer material with high strength and high sealing performance, such as polyimide or polytetrafluoroethylene, to ensure that it can withstand certain pressure and temperature changes and prevent the leakage of internal chemical substances;

[0015] The heat dissipation component further includes heat-conducting silicone;

[0016] There is heat-conducting silicone connected between the heat-conducting pad and the first capsule. The heat-conducting silicone is a cylindrical body, made of high thermal conductivity silicone, with excellent thermal conductivity and flexibility. Nickel-titanium shape memory metal is arranged inside the heat-conducting silicone, and the heat-conducting silicone evenly conducts the heat generated inside the optical module to the capsule;

[0017] The connection component is responsible for the signal transmission between the optical module and external devices;

[0018] The connection component includes a mounting board, an electrode array, a high-speed wire, a main board, and a gold finger end;

[0019] The mounting board is a rectangular body, fixedly connected to the top of the cover plate by screws, serving as the basic support structure of the connection component, made of high-quality aluminum alloy material, with excellent thermal conductivity and mechanical strength;

[0020] The electrode array is a circular hole array, which is opened on one side of the top of the mounting board and is used to dock with the electrodes of external devices. It is composed of multiple gold-plated copper contacts arranged in a circular hole array;

[0021] The high-speed line is a rectangular body, one end is connected to the electrode array, and the other end is connected to the main board through internal wiring for realizing the transmission of high-speed signals. It uses a coaxial cable with low loss and high-frequency response and has excellent signal transmission performance;

[0022] The main board is a rectangular body, fixedly connected to the top of the mounting board, and is provided with complex circuits and components on it for processing and amplifying the transmitted signals. It is composed of a composite of multiple layers of copper foil and fiberglass cloth board and has a complex circuit and component layout;

[0023] The gold finger end is set on one side of the top of the main board and is used to dock with the slot of the external device to realize stable signal transmission. It is made of gold-plated copper sheets and has good electrical conductivity and wear resistance;

[0024] The positioning component is responsible for the optical signal transmission and positioning inside the optical module;

[0025] The positioning component includes an electrical connection box, a first cavity, a second cavity, electrode holes, optical fibers, connection ends, and optical interfaces;

[0026] The electrical connection box is a rectangular body, providing internal connection and support for the optical module. It is made of high-strength plastic or metal and has excellent insulation performance and mechanical strength;

[0027] The first cavity and the second cavity are both opened on one side of the top of the electrical connection box and are of rectangular body structure. The electrode holes are penetrated and opened on the other side of the electrical connection box;

[0028] The optical fiber is a cylindrical body, one end is fixedly connected to the electrical connection box, and the other end is connected to the optical interface through the connection end to form an optical signal transmission channel. It is a single-mode or multi-mode optical fiber made of high-purity silica material and has excellent transmission performance and anti-bending performance;

[0029] The connection end and the optical interface are such that the connection end is an extension part of the optical fiber and is connected to the optical interface through a specific connection method. It is made of ceramic or metal and has good optical performance and mechanical strength;

[0030] The optical interface is of a boss-shaped body structure and is used to dock with the optical fiber of the external device. It is made of precisely machined metal or plastic and has a standardized interface shape and size;

[0031] The array electrode holes of the electrical connection component box are aligned with the positions of the electrode array one by one and are connected by welding to realize the conduction of the internal circuit;

[0032] The first cavity and the second cavity are of the same size. A receiving-end optoelectronic chip and a transmitting-end optoelectronic chip are respectively connected in the first cavity and the second cavity. Both the receiving-end optoelectronic chip and the transmitting-end optoelectronic chip are made of high-performance optoelectronic conversion materials, and can convert optical signals into electrical signals or convert electrical signals into optical signals, so as to realize the functions of receiving and transmitting optical signals;

[0033] The electrical connection box is clamped between the mounting board and the main board. Description of the Drawings

[0034] Figure 1 It is a three-dimensional structural schematic diagram of a fixing component of an OSFP package high-speed optical module structure according to the present invention;

[0035] Figure 2 It is a three-dimensional structural schematic diagram of a connection component of an OSFP package high-speed optical module structure according to the present invention;

[0036] Figure 3 It is a three-dimensional structural schematic diagram of a positioning component of an OSFP package high-speed optical module structure according to the present invention;

[0037] Figure 4 It is a three-dimensional structural schematic diagram of a receiving-end optoelectronic chip and a transmitting-end optoelectronic chip of an OSFP package high-speed optical module structure according to the present invention;

[0038] Figure 5 It is a three-dimensional structural schematic diagram of a housing of an OSFP package high-speed optical module structure according to the present invention;

[0039] Figure 6 It is a three-dimensional structural schematic diagram of a heat dissipation component of an OSFP package high-speed optical module structure according to the present invention;

[0040] Figure 7 It is a structural schematic diagram of the bent state of a nickel-titanium shape memory metal of an OSFP package high-speed optical module structure according to the present invention.

[0041] Figure 8 It is a structural schematic diagram of the vertical state of a nickel-titanium shape memory metal of an OSFP package high-speed optical module structure according to the present invention

[0042] Figure 9 It is a three-dimensional structural schematic diagram of a heat-conducting silicone, a nickel-titanium shape memory metal and a heat-conducting pad of a heat dissipation component of an OSFP package high-speed optical module structure according to the present invention

[0043] In the figure:

[0044] 110, housing; 120, circuit board; 130, heat-conducting pad; 140, cover plate;

[0045] 210. Mounting board; 211. Electrode array; 212. High-speed wire; 220. Main board; 221. Gold finger end;

[0046] 310. Electrical connection box; 320. First cavity; 330. Second cavity; 340. Electrode hole; 350. Optical fiber; 360. Connection end; 370. Optical interface;

[0047] 410. First capsule; 411. Calcium chloride hexahydrate; 420. Second capsule; 421. Sodium sulfate decahydrate; 430. Third capsule; 431. Sodium carbonate decahydrate; 440. Fourth capsule; 441. Copper sulfate pentahydrate; 450. Fifth capsule; 451. Ferrous sulfate heptahydrate; 460. Sixth capsule; 461. Sodium acetate trihydrate; 470. Thermal conductive silica gel; 471. Nickel-titanium shape memory alloy;

[0048] 500. Receiver optoelectronic chip;

[0049] 600. Transmitter optoelectronic chip. Detailed implementation mode

[0050] For ease of understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0051] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation mode.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs; the terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0053] Please refer to Figure 1, which is a structure of an OSFP-packaged high-speed optical module according to the present invention; through the optimization and improvement of the heat dissipation component of an OSFP-packaged high-speed optical module structure in the prior art, the first capsule contains calcium chloride hexahydrate, and the first capsule serves as the initial heat dissipation unit of the heat dissipation component. Calcium chloride hexahydrate starts to absorb heat in a wide temperature range of 30 - 117 °C, and provides a stable heat dissipation effect for the optical module through the dissolution process. Its low-temperature startup characteristic ensures that the optical module can obtain effective heat dissipation protection at the initial stage of startup, which helps to extend the service life of the chip. The second capsule contains sodium sulfate decahydrate, which starts to absorb heat at 32.4 °C, providing further heat dissipation support for the optical module. The heat absorption temperature of sodium sulfate decahydrate is moderate, and it can maintain a stable heat dissipation performance when the optical module operates in a lower temperature range, ensuring that the chip temperature will not rise excessively. The third capsule contains sodium carbonate decahydrate. Similar to the second capsule, sodium carbonate decahydrate starts to absorb heat at 33.5 °C, providing additional heat dissipation support for the optical module. Its slightly higher heat absorption temperature enables the third capsule to continue to play a heat dissipation role when the optical module operates in a slightly higher temperature range, forming a relay with the second capsule to ensure the continuity of the heat dissipation effect. The fourth capsule contains copper sulfate pentahydrate, which starts to decompose and absorb heat in the range of 45 - 110 °C, providing heat dissipation support at medium and high temperatures. The wide heat absorption temperature range of copper sulfate pentahydrate enables the heat dissipation component to adapt to a variety of temperature environments, ensuring that the optical module can operate stably under different conditions. The fifth capsule contains ferrous sulfate heptahydrate, which starts to decompose and absorb heat at 56 - 64 °C, and has a strong heat absorption capacity, enabling ferrous sulfate heptahydrate to still provide an effective heat dissipation effect when the optical module operates at a higher temperature, ensuring that the chip will not be damaged due to overheating. The sixth capsule contains sodium acetate trihydrate as the high-temperature heat dissipation unit of the heat dissipation component. Sodium acetate trihydrate starts to decompose and absorb heat in the range of 58 - 120 °C, providing the main heat dissipation support at high temperatures. Its high-temperature startup characteristic enables the heat dissipation component to still maintain a stable heat dissipation performance when the optical module operates at an extremely high temperature, ensuring that the optical module can still operate normally at the high-temperature limit. The thermal conductive silica gel has excellent thermal conductivity and can quickly conduct the heat generated by the heating element to other heat dissipation components. The thermal conductive silica gel is internally wrapped with nickel-titanium shape memory metal, enabling it to form a morphological change according to the temperature change, thereby driving the tightness of the attachment between each dielectric layer. The combined use of the capsule, the thermal conductive silica gel, and the chemical substances in the capsule realizes the all-round heat dissipation support for the optical module. From low-temperature startup to high-temperature operation, each capsule plays its unique role, jointly ensuring that the optical module can operate stably under different temperature conditions. The wide applicable temperature range, high heat dissipation performance, and stable working performance of the heat dissipation component provide a reliable heat dissipation method for the OSFP-packaged high-speed optical module.

[0054] Example 1

[0055] Such as Figures 1 to 5As shown in the figure, an OSFP packaged high-speed optical module structure is provided in an embodiment of the present application, which includes a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving-end optoelectronic chip 500, and a transmitting-end optoelectronic chip 600;

[0056] The fixing component serves as the basic support structure of the optical module;

[0057] The fixing component includes a housing 110, a circuit board 120, a thermal pad 130, and a cover plate 140;

[0058] The housing 110 is a cuboid structure and serves as the external protective shell of the optical module. It is made of high-strength and high-thermal-conductivity aluminum alloy material, with excellent corrosion resistance and wear resistance;

[0059] The bottom surface of the housing 110 is placed on an external mounting surface to provide stable support for the entire optical module. The circuit board 120 is a rectangular body and is fixedly connected to the inner bottom wall of the housing 110 for connecting and supporting electronic components. It uses a high-performance epoxy resin glass fiber cloth board (FR-4), with excellent electrical performance and heat resistance;

[0060] The thermal pad 130 is a rectangular body and is closely attached to the top of the circuit board 120 for efficiently transferring the generated heat to the heat dissipation component. It has excellent thermal conductivity and softness;

[0061] The cover plate 140 is a rectangular body and is fixedly connected to the top of the housing 110 by screws or other fastening means to enclose the internal structure of the optical module and prevent dust and moisture from invading. It is made of stainless steel material, with high strength and good rust prevention performance;

[0062] The heat dissipation component adopts a multi-layer capsule structure;

[0063] The heat dissipation component includes a first capsule 410. The first capsule 410 is an ellipsoidal body, and the inside of the first capsule 410 is filled with calcium chloride hexahydrate 411 as the heat absorption and dissipation medium. The capsule is made of high-strength and high-sealing polymer materials, such as polyimide or polytetrafluoroethylene, to ensure that it can withstand certain pressure and temperature changes and prevent internal chemical substances from leaking;

[0064] The connecting component is responsible for signal transmission between the optical module and external devices;

[0065] The connecting component includes a mounting board 210, an electrode array 211, a high-speed wire 212, a main board 220, and a gold finger end 221;

[0066] The mounting board 210 is a rectangular body, fixed and connected to the top of the cover board 140 by screws. As the basic support structure of the connection component, it is made of high-quality aluminum alloy material, with excellent heat conduction performance and mechanical strength;

[0067] The electrode array 211 is a circular hole array, opened on one side of the top of the mounting board 210, used for docking with the electrodes of external devices, and is composed of multiple gold-plated copper contacts, arranged in a circular hole array;

[0068] The high-speed line 212 is a rectangular body, one end is connected to the electrode array 211, and the other end is connected to the main board 220 through internal wiring, used to achieve the transmission of high-speed signals. It uses a coaxial cable with low loss and high frequency response, and has excellent signal transmission performance;

[0069] The main board 220 is a rectangular body, fixedly connected to the top of the mounting board 210, and is provided with complex circuits and components on it, used to process and amplify the transmitted signals. It is composed of a multi-layer copper foil and a fiberglass cloth board, and has a complex circuit and component layout;

[0070] The gold finger end 221 is set on one side of the top of the main board 220, used for docking with the slot of external devices to achieve stable signal transmission. It is made of gold-plated copper sheets and has good electrical conductivity and wear resistance;

[0071] The positioning component is responsible for the optical signal transmission and positioning inside the optical module;

[0072] The positioning component includes an electrical connection box 310, a first cavity 320, a second cavity 330, an electrode hole 340, an optical fiber 350, a connection end 360, and an optical interface 370;

[0073] The electrical connection box 310 is a rectangular body, providing internal connection and support for the optical module. It is made of high-strength plastic or metal and has excellent insulation performance and mechanical strength;

[0074] The first cavity 320 and the second cavity 330 are both opened on one side of the top of the electrical connection box 310, and are rectangular body structures. The electrode hole 340 is penetrated and opened on the other side of the electrical connection box 310;

[0075] The optical fiber 350 is a cylindrical body, one end is fixedly connected to the electrical connection box 310, and the other end is connected to the optical interface 370 through the connection end 360, forming an optical signal transmission channel. It is made of high-purity silica material and has excellent transmission performance and anti-bending performance;

[0076] The connection end 360 and the optical interface 370 are such that the connection end 360, as an extension of the optical fiber 350, is connected to the optical interface 370 through a specific connection method. It is made of ceramic or metal and has good optical performance and mechanical strength;

[0077] The optical interface 370 has a boss-shaped structure and is used to dock with the optical fiber 350 of an external device. It is made of precisely machined metal or plastic and has a standardized interface shape and size;

[0078] The array electrode holes 340 of the electrical connection component box are aligned one by one with the electrode array 211 and are connected by welding to achieve the conduction of the internal circuit;

[0079] The first cavity 320 and the second cavity 330 are of the same size. A receiving-end optoelectronic chip 500 and a transmitting-end optoelectronic chip 600 are respectively connected in the first cavity 320 and the second cavity 330. The receiving-end optoelectronic chip 500 and the transmitting-end optoelectronic chip 600 are both made of high-performance optoelectronic conversion materials and can convert optical signals into electrical signals or electrical signals into optical signals, so as to realize the functions of receiving and transmitting optical signals; the electrical connection box 310 is clamped between the mounting board 210 and the main board 220.

[0080] The technical solutions in the embodiments of the present application described above have at least the following technical effects or advantages:

[0081] The first bladder 410, as a packaging structure, mainly serves to package and protect the calcium chloride hexahydrate 411 inside. It provides a closed environment to prevent the calcium chloride hexahydrate 411 from directly contacting the external environment, thereby avoiding its contamination or physical damage. The first bladder 410 is closely attached near the chip or component that needs to dissipate heat to ensure the heat conduction efficiency. The first bladder 410 has good heat conductivity and can quickly conduct the heat generated by the chip to the calcium chloride hexahydrate 411, which helps to accelerate the endothermic process of the calcium chloride hexahydrate 411 and improve the heat dissipation efficiency. The calcium chloride hexahydrate 411 will gradually lose its crystal water at about 30°C, and this process is an endothermic process. When the optical module is working, the heat generated by the chip will be conducted to the calcium chloride hexahydrate 411, prompting it to gradually lose its crystal water and absorb a large amount of heat. The endothermic phase change method can effectively reduce the temperature of the chip and prevent it from overheating. Since the phase change temperature of the calcium chloride hexahydrate 411 is relatively low (about 30°C), it can effectively absorb heat within the normal working temperature range of the optical module. The temperature regulation mechanism helps to maintain the stability of the temperature inside the optical module and improve the reliability and stability of the system. After the calcium chloride hexahydrate 411 loses its crystal water, it can be restored to its crystal hydrate state by heating or other means, so as to realize recycling. The heat dissipation component can be used for a long time without frequently replacing materials, reducing the maintenance cost.

[0082] Example Two

[0083] In order to further improve the applicability of the OSFP package high-speed optical module structure of the present application and the convenience during use, the embodiments of the present application have optimized and improved the heat dissipation component. Specifically:

[0084] As Figure 6 shown, the heat dissipation component further includes a second bladder 420, a third bladder 430, a fourth bladder 440, a fifth bladder 450, and a sixth bladder 460. Each bladder is an ellipsoid, and they are nested layer by layer to form a multi-level heat dissipation structure;

[0085] The second bladder 420, the third bladder 430, the fourth bladder 440, the fifth bladder 450, and the sixth bladder 460 are respectively filled with sodium sulfate decahydrate 421, sodium carbonate decahydrate 431, copper sulfate pentahydrate 441, ferrous sulfate heptahydrate 451, and sodium acetate trihydrate 461. Each bladder absorbs or releases heat through the chemical substances inside it when the temperature changes, enhancing the heat dissipation effect. The bladder is made of a polymer material with high strength and high sealing performance, such as polyimide or polytetrafluoroethylene, to ensure that it can withstand certain pressure and temperature changes while preventing the leakage of internal chemical substances;

[0086]

[0087] Through the synergistic effect of multiple bladders, efficient cooling of the continuously working chip is achieved. The heat dissipation component includes a second bladder 420, a third bladder 430, a fourth bladder 440, a fifth bladder 450, and a sixth bladder 460. Each bladder contains a specific chemical substance, and these substances gradually absorb heat when reaching their lowest starting temperature, jointly providing heat dissipation support for the optical module.

[0088] The second bladder 420 contains sodium sulfate decahydrate 421, which starts to absorb heat and dissolve at 32.4 °C, providing initial heat dissipation support for the optical module. Its low-temperature startup characteristic ensures that the optical module can obtain effective heat dissipation effect at the initial stage of startup, which helps to extend the service life of the chip.

[0089] The third bladder 430 contains sodium carbonate decahydrate 431, and its heat absorption starting temperature is 33.5 °C, slightly higher than that of sodium sulfate decahydrate 421, enabling the two to work synergistically within a similar temperature range, strengthening the heat dissipation effect in the medium and low temperature sections, and ensuring that the temperature of the optical module will not rise excessively during continuous operation.

[0090] The fourth capsule 440 contains copper sulfate pentahydrate 441, which absorbs heat and decomposes in the range of 45 - 110 °C, providing heat dissipation support for the optical module at medium and high temperatures. Its wide heat absorption temperature range enables the heat dissipation component to adapt to various temperature environments, ensuring the stable operation of the optical module under different conditions.

[0091] Ferrous sulfate heptahydrate 451 in the fifth capsule 450 starts to decompose and absorb heat at 56 - 64 °C, with strong heat absorption ability. This characteristic enables ferrous sulfate heptahydrate 451 to still exhibit excellent heat dissipation effect in a relatively high temperature range, forming a relay with the fourth capsule 440 to ensure stable heat dissipation support for the optical module in the high temperature section.

[0092] The sixth capsule 460 contains sodium acetate trihydrate 461, which absorbs heat and decomposes in the range of 58 - 120 °C, providing the main heat dissipation support for the optical module at high temperatures. The high temperature activation characteristic of sodium acetate trihydrate 461 enables the heat dissipation component to maintain stable heat dissipation performance when the optical module operates at extremely high temperatures, ensuring that the chip will not be damaged due to overheating.

[0093] Through the combined use, all-round heat dissipation support for the optical module is achieved. From low-temperature startup to high-temperature operation, each capsule plays its unique role, jointly ensuring the stable operation of the optical module under different temperature conditions. The wide applicable temperature range, high heat dissipation performance, and stable working performance of the heat dissipation component provide reliable heat dissipation effect for the OSFP-packaged high-speed optical module.

[0094] Embodiment 3

[0095] In order to further improve the applicability of an OSFP-packaged high-speed optical module structure of the present application and the convenience during use, the heat dissipation component in the embodiment of the present application is optimized and improved. Specifically:

[0096] As Figures 7 - 8 shown, the heat dissipation component further includes thermal conductive silicone 470;

[0097] There is thermal conductive silicone 470 connected between the thermal conductive pad 130 and the first capsule 410. The thermal conductive silicone 470 is in a cylindrical shape. The thermal conductive silicone 470 has excellent thermal conductivity and flexibility. Nickel-titanium shape memory metal 471 is arranged inside the thermal conductive silicone 470. The thermal conductive silicone 470 evenly conducts the heat generated inside the optical module to the capsule;

[0098] The thermal conductive silica gel 470 has excellent thermal conductivity and can quickly conduct the heat generated by the heating element to other heat dissipation components. The nickel-titanium shape memory metal 471 is encapsulated inside the thermal conductive silica gel 470, enabling it to form a morphological change according to the temperature change, thereby driving the tightness of the attachment between each dielectric layer, which helps to maintain the optimal heat dissipation effect at different temperatures. The thermal conductive silica gel 470 also plays a sealing and protective role, preventing dust and other impurities from entering the optical module, and at the same time protecting the heating element from mechanical damage. The nickel-titanium shape memory metal 471 has a unique shape memory effect and can return to the preset shape at a specific temperature, enabling the thermal conductive silica gel 470 to automatically adjust its morphology when the temperature changes, thereby optimizing the heat dissipation effect. The nickel-titanium shape memory metal 471 also has good superelasticity and can withstand large deformations and quickly return to its original shape after unloading, enabling the thermal conductive silica gel 470 to maintain stable performance when being squeezed or stretched. As the temperature inside the optical module changes, the nickel-titanium shape memory metal 471 will undergo a morphological change, which will drive the change in the tightness of the attachment between the thermal conductive silica gel 470 and each dielectric layer in contact with it. When the temperature rises, the morphological change of the alloy may increase the contact area and tightness between the thermal conductive silica gel 470 and the dielectric layer, thereby improving the heat conduction efficiency; when the temperature drops, it may reduce the contact area and tightness to reduce the heat conduction rate and prevent overcooling. The morphological change of the nickel-titanium shape memory metal 471 may also guide the air flow inside the optical module. When the temperature rises, the morphological change of the alloy may form an air flow channel more conducive to heat dissipation, thereby accelerating the dissipation of heat; when the temperature drops, it may reduce the air flow to maintain an appropriate temperature.

[0099] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, various changes and modifications can be made to the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An OSFP packaged high-speed optical module structure, characterized in that: It includes a fixing component, a connecting component, a positioning component, a heat dissipation component, a receiving-end photoelectric chip, and a transmitting-end photoelectric chip; the fixing component serves as the basic supporting structure of the optical module; the fixing component includes a shell, a circuit board, a thermal pad, and a cover plate; the shell is a rectangular structure, serving as an external protective shell of the optical module, the bottom surface of the shell is placed on the external mounting surface, and provides stable support for the entire optical module, the circuit board is a rectangular body, fixedly connected to the inner bottom wall of the shell, and used to connect and support electronic components, the thermal pad is a rectangular body, tightly fitted on the top of the circuit board, and used to efficiently transfer the generated heat to the heat dissipation component, the cover plate is a rectangular body, fixedly connected to the top of the shell by screws or other fastening methods, and used to close the internal structure of the optical module , to prevent dust and moisture from intruding; the heat dissipation component adopts a multi-layer capsule structure; the heat dissipation component includes a first capsule, the first capsule is an ellipsoid, and the first capsule is filled with calcium chloride hexahydrate as a heat absorption and heat dissipation medium; the heat dissipation component also includes a second capsule, a third capsule, a fourth capsule, a fifth capsule and a sixth capsule, each capsule is an ellipsoid, and each capsule is wrapped in layers to form a multi-level heat dissipation structure; the second capsule, the third capsule, the fourth capsule, the fifth capsule and the sixth capsule are respectively filled with sodium sulfate decahydrate, sodium carbonate decahydrate, copper sulfate pentahydrate, ferrous sulfate heptahydrate and sodium acetate trihydrate, each capsule absorbs or releases heat through the chemical substances inside it when the temperature changes, thereby enhancing the heat dissipation effect, and the heat dissipation component as a whole is tightly fitted on top of the thermal pad.

2. The OSFP packaged high-speed optical module structure according to claim 1, characterized in that: The heat dissipation component adopts a multi-layer capsule structure; The heat dissipation component also includes thermally conductive silicone (470) A thermally conductive silica gel (470) is connected between the thermally conductive pad (130) and the first capsule (410); the thermally conductive silica gel (470) is cylindrical; nickel-titanium memory metal (471) is arranged inside the thermally conductive silica gel (470); the thermally conductive silica gel (470) evenly conducts heat generated inside the optical module to the capsule.

3. The OSFP packaged high-speed optical module structure according to claim 2, characterized in that: The connection component is responsible for signal transmission between the optical module and the external device; The connection component comprises a mounting board (210), an electrode array (211), a high-speed line (212), a main board (220) and a gold finger terminal (221); The mounting board (210) is a rectangular body, fixedly connected to the top of the cover plate (140) by screws, and serves as a basic support structure for connecting components. The electrode array (211) is a circular hole array, which is provided on one side of the top of the mounting board (210) and is used to connect with the electrodes of an external device. The high-speed line (212) is a rectangular body, one end of which is connected to the electrode array (211), and the other end of which is connected to the main board (220) through internal wiring to achieve high-speed signal transmission. The main board (220) is a rectangular body, which is fixedly connected to the top of the mounting board (210), and is provided with complex circuits and components for processing and amplifying the transmitted signals. The gold finger end (221) is provided on one side of the top of the main board (220) and is used to connect with the slot of the external device to achieve stable signal transmission.

4. The OSFP packaged high-speed optical module structure according to claim 1, characterized in that: The positioning component is responsible for the transmission and positioning of optical signals inside the optical module; The positioning assembly comprises an electrical connection box (310), a first cavity (320), a second cavity (330), an electrode hole (340), an optical fiber (350), a connection end (360), and an optical interface (370); The electrical connection box (310) is a rectangular body, providing internal connection and support for the optical module; the first cavity (320) and the second cavity (330) are both opened on one side of the top of the electrical connection box (310) and are rectangular structures; the electrode hole (340) is opened through the other side of the electrical connection box (310); the optical fiber (350) is a cylindrical body, one end of which is fixedly connected to the electrical connection box (310) and the other end is connected to the optical interface (370) through the connection end (360) to form a transmission channel for optical signals; the connection end (360) and the optical interface (370) are the connection end (360) as an extension of the optical fiber (350), connected to the optical interface (370) through a specific connection method; the optical interface (370) is a boss-shaped structure, used for docking with the optical fiber (350) of an external device.

5. The OSFP packaged high-speed optical module structure according to claim 4, characterized in that: The array electrode holes (340) of the electrical connection component box are aligned one by one with the positions of the electrode array (211), and are connected by welding to achieve conduction of the internal circuit.

6. The OSFP packaged high-speed optical module structure according to claim 4, characterized in that: The first cavity (320) and the second cavity (330) are of the same size, and a receiving end optoelectronic chip (500) and a transmitting end optoelectronic chip (600) are respectively connected to the first cavity (320) and the second cavity (330).

7. The OSFP packaged high-speed optical module structure according to claim 4, characterized in that: The electrical connection box (310) is clamped between the mounting board (210) and the main board (220).

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