Electronic chip production monitoring system based on multi-light source compensation

Abstract

The invention relates to the technical field of electronic component automatic production equipment, in particular to an electronic chip production monitoring system based on multi-light-source compensation, which comprises a workbench, the top of the workbench is inclined, and a feeding module, a spot welding module, an image detection module and a discharging module are sequentially arranged on the workbench from high to low; the feeding module is used for sequentially conveying chips in the material box; the spot welding module is used for carrying out spot welding on the chip located at the welding position; the image detection module is used for collecting a detection image of the spot-welded chip; the discharging module is used for sequentially conveying the chips detected to be qualified by the image detection module to a qualified tray. The workbench is provided with a conveying channel and a positioning module, the conveying channel is used for moving a chip, and the positioning module is used for positioning the chip and allowing the spot welding module to perform spot welding and the image detection module to collect a detection image. By adopting the scheme, the technical problem of inaccurate image detection caused by solder paste light reflection in the chip production process in the prior art can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of automatic production equipment for electronic components, and in particular to an electronic chip production monitoring system based on multi-light source compensation. Background Art

[0002] During the chip production process, it is necessary to undergo a variety of tests, such as solder testing. Image analysis is used to determine whether the solder points on the chip meet the requirements, so as to ensure the production quality of the chip. In order to improve production efficiency, chip production equipment is developing towards automation and intelligence. Most inspection items have changed from manual inspection to automatic inspection. Most of the automatic inspection of chips relies on image analysis. Therefore, the clarity of the image collected by the CCD camera largely determines the accuracy of the inspection. However, in actual applications, solder paste has reflection problems, and it is easy to lose target features during image recognition, which has a great impact on the accuracy of image recognition and reduces the detection accuracy of solder inspection items. Summary of the invention

[0003] The present invention aims to provide an electronic chip production monitoring system based on multi-light source compensation, which can solve the technical problem in the prior art that inaccurate image detection is caused by solder paste reflection during chip production.

[0004] The present invention provides the following basic scheme: An electronic chip production monitoring system based on multi-light source compensation includes a workbench, the top of which is inclined, and a loading module, a spot welding module, an image detection module and a unloading module are arranged on the workbench in descending order; The loading module is used to transport the chips in the material box in sequence; The spot welding module is used to spot weld the chip located at the welding position; The image detection module is used to collect the detection image of the chip after spot welding; The unloading module is used to sequentially transport the qualified chips detected by the image detection module to the qualified tray; The workbench is provided with a conveying channel and a positioning module. The conveying channel is used for chip movement, and the positioning module is used for positioning the chip, for spot welding by the spot welding module, and for collecting and detecting images by the image detection module. The image detection module includes an image collector and a two-color light source for supplementing light for the chip. The two-color light source includes a ring-shaped light source body with a hollow middle. The image collector is located above the two-color light source, and the connection direction of the image collector and the two-color light source is perpendicular to the top of the workbench.

[0005] Furthermore, the loading module includes a loading rack and a material box channel. The material box channel is connected to the head end of the conveying channel. The material box channel is used to place a material box with an open end. The loading rack abuts against the sides of the two ends of the material box.

[0006] Furthermore, the loading module also includes a material box push rod, a material box rack and a telescopic stop block, the telescopic stop block is against one side of the material box, and the telescopic direction of the telescopic stop block is parallel to the side wall of the material box; a push rod hole is provided on the side of the material box channel away from the telescopic stop block, and the free end of the material box push rod passes through the push rod hole and is against the side of the material box away from the telescopic stop block; the top of the material box rack is open, the material box rack and the telescopic stop block are located on the same side of the material box channel, and the material box rack is used to place empty material boxes.

[0007] Furthermore, the spot welding module includes a telescopic pressure block and a spot welder. The telescopic pressure block has a telescopic direction perpendicular to the top of the workbench. The telescopic pressure block can abut against the top of the chip. The spot welder is used to spot weld the chip after the telescopic pressure block abuts against the chip.

[0008] Furthermore, there are two groups of spot welding modules, each group of spot welding modules includes a telescopic pressure block and a spot welder, the spot welder in one group of spot welding modules is used to spot weld one side of the chip, and the spot welder in the other group of spot welding modules is used to spot weld the other side of the chip.

[0009] Furthermore, a red light source and a blue light source are provided on the light source body, the blue light source is far away from the image collector, and the image collector is directly opposite to the hollowed-out middle portion.

[0010] Furthermore, the unloading module includes a rotary pusher, and a plurality of material slots for chips to move are opened on the qualified tray. The end of the conveying channel is connected to the material slot. The rotary pusher is used to abut against the chip and push the chip into the material slot from the end of the conveying channel.

[0011] Furthermore, the positioning module includes a telescopic blocking rod and a telescopic side abutment plate. The telescopic direction of the telescopic blocking rod is perpendicular to the moving direction of the chip. The telescopic blocking rod is located on the moving trajectory of the chip. The telescopic direction of the telescopic side abutment plate is perpendicular to the moving direction of the chip. The telescopic side abutment plate can abut against the side of the chip.

[0012] Furthermore, a fault rejection module is also provided on the workbench, and the fault rejection module is used to move the chips that are unqualified by the image detection module to the fault tray.

[0013] Furthermore, the fault rejection module includes a mobile frame and a clamp, the clamp is installed on the mobile frame, the clamp is used to clamp the unqualified chips detected by the image detection module from the conveying channel, the mobile frame is used to move the clamp after clamping the chip, and the clamp is also used to place the clamped chip on the fault tray.

[0014] Implementation process and beneficial effects of the basic plan: 1. In this scheme, a loading module and a unloading module are set to realize automatic loading and unloading of chips; a spot welding module is set to realize spot welding of the chip's solder joints; an image detection module is set to collect the detection image of the chip after spot welding, so as to perform image recognition on the solder joints and realize automatic detection of whether the chip spot welding is qualified or not. In the automatic production process of chips, the image detection module is set with a two-color light source, and a variety of fill light sources are provided through the two-color light source to supplement the light source for image acquisition, so as to improve the imaging degree and recognition degree of the collected image. The two-color light source adopts a ring-shaped light source body. With this design, first, the light source light is softer, the light is evenly distributed on the chip surface, and the chip image is clear; second, the light source is avoided from being concentrated at one point, which makes it difficult to coordinate between the light source and the image collector. For example, the image collector needs to face the chip. When the light source is concentrated, in order to realize the light source supplement, the light source needs to be set on one side of the chip, so that the light intensity on the side of the chip close to the light source is greater than that on the other side. The light distribution is uneven, and the accuracy of the detection result based on the collected image will be affected. With this design, the coordinated interference between the two-color light source and the image collector is reduced, and the clarity of the collected image is improved. By adopting this solution, a two-color light source is set to perform light compensation, improve the reflection of spot solder paste, and improve the accuracy of image recognition and image detection.

[0015] 2. In this solution, the setting of the loading rack can place multiple material boxes at one time. The material boxes are limited by the loading rack. When the material boxes in the material box channel are loaded. The setting of the material box push rod pushes the empty material box. At this time, the telescopic block has retracted, and the empty material box falls from one side of the conveying channel to the material box rack, and the empty material box is collected by the material box rack. When the chip moves to the end of the conveying channel, there is an angle between the inclined workbench table and the qualified tray, and the chip no longer moves. The setting of the rotary pusher pushes the chip into the qualified tray by rotation. When the next chip is pushed into the qualified tray, the chip is pushed to move along the material slot, so that the chip is arranged in the material slot. With this solution, the batch loading of the material box and the batch collection of the empty material box are realized through the setting of the loading rack, the material box push rod, the material box rack and the telescopic block. At the same time, the chips are arranged in the qualified tray by the rotary pusher, and the automatic unloading of the chips is realized, which is convenient for the subsequent batch transportation of chips.

[0016] 3. In this solution, the top of the workbench is inclined, the conveying channel is set on the top of the workbench, the chip is placed in the conveying channel, and the inclined setting is used to realize the automatic falling of the chip. The positioning module is set on the workbench. During the movement of the chip, the telescopic blocking rod is extended to block the chip at the specified position, so that the chip is located at the specified position, which is convenient for performing production operations at the specified position, such as dispensing, soldering, image acquisition, etc. At the same time, combined with the setting of the telescopic side abutment plate, the telescopic side abutment plate abuts against the chip at the specified position, and pushes the chip against the conveying channel, so as to fix the chip. The setting of the telescopic pressure block, when the chip is at the specified position, the telescopic pressure block moves down to contact the top of the chip and applies a certain pressure to further improve the stability of the chip positioning. At the same time, when the spot welder is welding, it is prevented that the solder paste sticks to drive the chip to move, causing the chip to shift and interfere with the automated production of the chip.

[0017] 4. In this solution, a fault rejection module is set up to automatically reject unqualified chips based on the detection results of the image detection module. The mobile rack is set up to control the movement of the clamp to facilitate the clamp to clamp the chip. The clamp is set up to clamp and release the chip by rising and falling. The fault tray is set up to temporarily place unqualified chips to avoid confusion between qualified chips and unqualified chips. With this solution, unqualified chips are automatically rejected through the setting of the fault rejection module, and qualified chips are automatically collected. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Figure 2 A top view of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Figure 3 It is a structural schematic diagram of a feeding module of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Figure 4 It is a structural schematic diagram of a loading module from another perspective of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Figure 5 It is a structural schematic diagram of a spot welding module of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Figure 6 for Figure 5 The enlarged schematic diagram of point A in the middle; Figure 7 It is a structural schematic diagram of an image detection module of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Figure 8 It is a structural schematic diagram of a blanking module of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Fig. 9 for Figure 8 The enlarged schematic diagram of point B in the middle; Fig.10 It is a structural schematic diagram of a workbench, a positioning module, and a conveying channel of an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention; Fig.11 for Fig.10 The enlarged schematic diagram of the center C; Fig.12 It is a structural schematic diagram of a fault elimination module in an embodiment of an electronic chip production monitoring system based on multi-light source compensation of the present invention. DETAILED DESCRIPTION

[0019] The following is further described in detail through specific implementation methods: The reference numerals in the drawings of the specification include: workbench 1, loading module 2, spot welding module 3, image detection module 4, unloading module 5, conveying channel 6, positioning module 7, fault rejection module 8, material box 9, installation box 10, material box channel 201, limit rod 202, guide arc surface 203, material box push rod 204, material box frame 205, telescopic stopper 206, push rod hole 207, limit push rod hole 208, telescopic pressure block 301, spot welder 302, installation section 3 03, connecting section 304, pressing section 305, screw pair mechanism 306, crank-connecting rod mechanism 307, image collector 401, two-color light source 402, mounting rod 403, rotary pusher 501, push rod 502, push block 503, tray guide rail 504, tray transmission assembly 505, qualified tray 506, telescopic blocking rod 701, telescopic side abutment plate 702, clamper 801, faulty tray 802, slide rail column 803, clamping slide rail 804.

[0020] Example Electronic chip production monitoring system based on multi-light source compensation, as shown in the attached Figure 1 , 2 As shown, it includes a workbench 1, on which a loading module 2, a spot welding module 3, an image detection module 4 and a unloading module 5 are arranged in order from high to low; The loading module 2 is used to sequentially convey the chips in the material box 9; The spot welding module 3 is used to spot weld the chip located at the welding position; The image detection module 4 is used to collect the detection image of the chip after spot welding; The unloading module 5 is used to sequentially convey the qualified chips detected by the image detection module 4 to the qualified tray 506; The workbench 1 is provided with a conveying channel 6 and a positioning module 7. The conveying channel 6 is used for moving the chip, and the positioning module 7 is used for positioning the chip for the spot welding module 3 to perform spot welding and the image detection module 4 to collect detection images.

[0021] The workbench 1 is also provided with a fault rejection module 8 , which is used to move the chips detected as unqualified by the image detection module 4 to the fault tray 802 .

[0022] The top of the workbench 1 is inclined. Specifically, two long pillars and two short pillars are provided at the bottom of the workbench 1. The length of the long pillar is greater than that of the short pillar. The two long pillars are located on the same side, and the two short pillars are located on the other side, so that the top of the workbench 1 is inclined. A conveying groove is provided at the top of the conveying channel 6. The chip is placed in the conveying groove and moves along the conveying groove.

[0023] The conveying channel 6 is provided with a loading position, a spot welding position, a detection position, a fault position and a unloading position, and the spot welding position includes a left spot welding position and a right spot welding position. The number of positioning modules 7 is multiple, and in the present embodiment, the number of positioning modules 7 is five. The five positioning modules 7 are respectively located at the loading position, the left spot welding position, the right spot welding position, the detection position and the fault position. During the production process, the chip moves along the conveying channel 6, the chip is located at the loading position waiting for welding, the chip is located at the left spot welding position for the spot welding module 3 to perform spot welding, the chip is located at the right spot welding position for the spot welding module 3 to perform spot welding, the chip is located at the detection position for the image detection module 4 to collect the detection image, and the chip is located at the fault position for the fault rejection module 8 to clamp and reject. The unloading module 5 is located at the end of the conveying channel 6, and the chip is located at the unloading position for the unloading module 5 to transport it to the qualified tray 506.

[0024] As attached Figure 3 , 4 As shown, the loading module 2 includes a loading rack and a material box channel 201, the material box channel 201 is connected to the head end of the conveying channel 6, the material box channel 201 is used to place the material box 9 with an open end, and the loading rack abuts against the sides of the two ends of the material box 9. The material box 9 is used to store the chips to be processed. The material box 9 is in a long strip shape, and the chips are arranged one by one in the material box 9. When in use, open one end of the material box 9, the end of the opening of the material box 9 faces downward, that is, it is located at the end of the material box channel 201. Under the action of gravity, the chips in the material box 9 fall out from the opening and enter the head end of the conveying channel 6, that is, enter the head end of the conveying groove.

[0025] Specifically: the material box channel 201 is arranged at the top of the workbench 1, and a material box 9 groove is provided at the top of the material box channel 201, and the material box 9 groove is connected to the conveying groove, and the length of the material box 9 groove is equal to the length of the material box 9, and one side wall of the material box 9 groove is connected to the outer side wall of the material box channel 201, and the empty material box 9 in the material box 9 groove can be translated and dropped from this side. The loading rack includes two groups of limit racks, and the two groups of limit racks are respectively located at the two ends of the material box channel 201, and each group of limit racks includes two oppositely arranged limit rods 202, and the top of the opposite side of the limit rod 202 is provided with a guide arc surface 203, and the two ends of the material box 9 enter between the two limit rods 202 along the guide arc surface 203, and fall into the material box 9 groove along the limit rod 202, and multiple material boxes 9 can be put in at one time, and the material box 9 is located between the two limit rods 202, and is stacked in sequence, and the material box 9 at the bottom of the stacked material boxes 9 is located in the material box 9 groove. One limiting rod 202 in the same group contacts one side of the material box 9 , and the other limiting rod 202 contacts other material boxes 9 except the bottommost material box 9 .

[0026] The loading module 2 also includes a material box push rod 204, a material box frame 205 and a telescopic stop block 206, the telescopic stop block 206 is against one side of the material box 9, and the telescopic direction of the telescopic stop block 206 is parallel to the side wall of the material box 9; a push rod hole 207 is provided on the side of the material box channel 201 away from the telescopic stop block 206, and the free end of the material box push rod 204 passes through the push rod hole 207 and is against the side of the material box 9 away from the telescopic stop block 206; the top of the material box frame 205 is open, the material box frame 205 and the telescopic stop block 206 are located on the same side of the material box channel 201, and the material box frame 205 is used to place empty material boxes 9.

[0027] Specifically: a telescopic through hole is provided on the workbench 1, one end of the telescopic stopper 206 passes through the telescopic through hole and abuts against one side of the material box 9, and the telescopic stopper 206 and the limiting rod 202 simultaneously limit the material box 9 in the groove of the material box 9. In this embodiment, the telescopic stopper 206 is driven by a cylinder so that the telescopic stopper 206 is extended and retracted in a direction parallel to the side wall of the material box 9. A push rod hole 207 is provided on the side wall of the groove of the material box 9 away from the telescopic stopper 206, and the number of the push rod holes 207 is three, and the push rod holes 207 are evenly distributed on the same side of the groove of the material box 9. In this embodiment, the push rod holes 207 distributed at both ends are respectively located at the two ends of the groove of the material box 9, and the limiting rod 202 is provided with a limiting push rod hole 208 that is opposite to the two push rod holes 207 and has the same shape. The free end of the material box push rod 204 is provided with three push rod ends, wherein two push rod ends respectively pass through the limit push rod hole 208 and the push rod hole 207 in sequence and abut against one side of the material box 9, and one push rod end passes through the push rod hole 207 and abuts against one side of the material box 9. In this embodiment, the material box push rod 204 is driven by a cylinder, and the cylinder drives the material box push rod 204 to extend and retract, so that the push rod end pushes the empty material box 9 out of the groove of the material box 9. The material box frame 205 includes two U-shaped frames, the opening of the U-shaped frame faces upward, the two U-shaped frames are located on one side of the material box channel 201, and are connected to the side of the material box channel 201 away from the material box push rod 204 (that is, the two U-shaped frames and the telescopic stopper 206 are located on the same side of the material box channel 201), and the two U-shaped frames are provided with a material box 9 baffle on the side away from each other. The empty material box 9 pushed out from the groove of the material box 9 falls into the U-shaped frame from the opening of the U-shaped frame. The two ends of the empty material box 9 are respectively located in the two U-shaped frames. The empty material boxes 9 are uniformly collected by the two U-shaped frames, and a large number of empty material boxes 9 can be collected and unloaded at one time.

[0028] As attached Figure 5 , 6 As shown, the spot welding module 3 includes a telescopic pressure block 301 and a spot welder 302. The telescopic direction of the telescopic pressure block 301 is perpendicular to the top of the workbench 1. The telescopic pressure block 301 can be against the top of the chip. The spot welder 302 is used to spot weld the chip after the telescopic pressure block 301 is against the chip. In this embodiment, both sides of the electronic chip need to be spot welded, so the number of spot welding modules 3 is set to two groups, each group of spot welding modules 3 includes a telescopic pressure block 301 and a spot welder 302, the spot welder 302 in one group of spot welding modules 3 is used to spot weld one side of the chip, and the spot welder 302 in the other group of spot welding modules 3 is used to spot weld the other side of the chip.

[0029] Specifically: the telescopic pressure block 301 includes a mounting section 303 perpendicular to the top of the workbench 1, a connecting section 304 and a pressing section 305 parallel to the top of the workbench 1, and the mounting section 303, the connecting section 304 and the pressing section 305 are connected in sequence. The telescopic pressure block 301 is installed on the top of the workbench 1 through a pressure block installation assembly, and the pressure block installation assembly includes a mounting plate, a cylinder is installed on the mounting plate, and a pressure block installation block is connected to the free end of the cylinder. A pressure block guide rail is provided between the pressure block installation block and the mounting plate, and the pressure block installation block can move along the length direction of the pressure block guide rail. The mounting section 303 is connected to the side of the pressure block installation block away from the mounting plate. In this embodiment, the telescopic pressure block 301 is driven by the cylinder, so that the telescopic pressure block 301 is extended and retracted in a direction perpendicular to the top of the workbench 1, so that the pressing section 305 is against the top of the electronic chip, fixing the position of the electronic chip, and facilitating the subsequent spot welder 302 to weld the electronic chip.

[0030] The spot welder 302 uses an existing electronic chip soldering machine. The spot welder 302 is installed on the top of the workbench 1 through a spot welding mounting assembly. The spot welding mounting assembly includes a power source, a lead screw pair mechanism 306, a crank connecting rod mechanism 307, and an auxiliary structure. The auxiliary structure is a general structure set by a technician in the field to realize the corresponding action. For example, the lead screw in the lead screw pair structure needs to be rotated during use. The technician in the field knows that the two ends of the lead screw are installed on the workbench 1 through a mounting seat, and the lead screw is connected to the mounting seat in rotation, so that when the lead screw rotates, the lead screw slider on the lead screw moves along the axial straight line of the lead screw. For example, the power source is connected to the lead screw pair mechanism 306 by transmission, and the power source is a motor. The technician in the field knows that the output shaft of the motor and the lead screw of the lead screw pair can be connected by a pulley transmission. For example, the crank connecting rod mechanism 307 is installed on the lead screw slider of the lead screw pair mechanism 306. The technician in the field knows that the lead screw slider is provided with a mounting frame, and the crank connecting rod mechanism 307 is installed on the mounting frame.

[0031] The power source includes a screw auxiliary power source and a crank power source. In this embodiment, both the screw auxiliary power source and the crank power source are motors. The screw auxiliary power source is installed on the workbench 1. The screw auxiliary mechanism 306 includes a screw, a screw slider connected to the screw for rotation, and a screw guide rail for limiting the movement of the screw slider. The screw guide rail and the screw are installed on the workbench 1. The screw slider is slidably connected to the screw guide rail. The length direction of the screw guide rail is parallel to the length direction of the conveying channel 6. The screw auxiliary power source is connected to the screw for transmission. Driven by the screw auxiliary power source, the screw rotates, and under the limiting action of the screw guide rail, the screw slider moves along the length direction of the screw guide rail.

[0032] The crank power source is mounted on the lead screw slider, the crank-connecting rod mechanism 307 includes a crank, a connecting rod eccentrically hinged to the crank, a crank slider hinged to the connecting rod, and a crank guide rail, the crank, the connecting rod, and the crank slider are sequentially connected in a transmission manner, the crank and the crank guide rail are both mounted on the lead screw slider, the crank slider is slidably connected to the crank guide rail, the length direction of the crank guide rail is perpendicular to the top of the workbench 1, the crank power source is connected in a transmission manner to the crank, and the spot welder 302 is mounted on the crank slider. Driven by the crank power source, the crank rotates, driving the connecting rod to move, and under the limiting action of the crank guide rail, the crank slider moves along the length direction of the crank guide rail, thereby driving the spot welder 302 to move.

[0033] During use, the position of the spot welder 302 in a direction parallel to the length of the conveying channel 6 is changed by the screw sub-mechanism 306, and the position of the spot welder 302 in a direction perpendicular to the top of the workbench 1 is changed by the crank-connecting rod mechanism 307, so that the spot welder 302 can be lowered, moved along the length of the conveying channel 6, and risen, thereby realizing the welding of electronic chips.

[0034] As attached Figure 7 As shown, the image detection module 4 includes an image collector 401 and a two-color light source 402 for supplementing light to the chip. The two-color light source 402 includes a ring-shaped light source body, the middle of which is hollowed out. The image collector 401 is located above the two-color light source 402, and the connection direction between the image collector 401 and the two-color light source 402 is perpendicular to the top of the workbench 1. A red light source and a blue light source are provided on the light source body, the blue light source is away from the image collector 401, and the image collector 401 is directly opposite to the hollow middle.

[0035] Specifically, the image collector 401 and the two-color light source 402 are mounted on the top of the workbench 1 through the mounting rod 403. The image collector 401 and the two-color light source 402 are both mounted on the mounting rod 403, for example, by a clamp. The image collector 401 and the two-color light source 402 are both slidably connected to the mounting rod 403. The setting of the mounting rod 403 provides a mounting component for the image collector 401 and the two-color light source 402. Based on the position and height of the conveying channel 6, the height of the image collector 401 and the two-color light source 402 can be adjusted to adapt to image detection in different chip production equipment.

[0036] The two-color light source 402 includes a ring-shaped light source body, and a red light source and a blue light source arranged on the light source body. In this embodiment, the light source body is connected to the clamp by bolts, and the red light source and the blue light source are embedded in the light source body. The middle part of the light source body is hollowed out, and the red light source and the blue light source are circumferentially distributed with the axial direction of the light source body as the axis, that is, the red light source and the blue light source are distributed in a ring. The blue light source is far away from the image collector 401. In this embodiment, the red light source is located above the blue light source. The image collector 401 is located above the two-color light source 402, and the image collector 401 is directly opposite to the hollow middle part, and the hollow middle part is directly opposite to the chip. The image collector 401 collects images of the chip through the hollow middle part. The image collector 401 is connected to the clamp by bolts, and the image collector 401 adopts an existing CCD camera.

[0037] The image collector 401 is used to collect the detection image of the chip after spot welding. The image detection module 4 also includes a processor, which is used to perform image recognition and analysis on the collected detection image and output the image detection result of whether the chip welding is qualified.

[0038] As attached Figure 8 , 9 As shown, the unloading module 5 includes a rotary pusher 501, and a plurality of material slots for chips to move are opened on the qualified tray 506. The end of the conveying channel 6 is connected to the material slot. The rotary pusher 501 is used to abut against the chip and push the chip from the end of the conveying channel 6 into the material slot.

[0039] Specifically: the chip with qualified image detection structure will be moved to the end of the conveying channel 6, and the rotary pusher 501 is set at the end of the conveying channel 6. The rotary pusher 501 includes a rotating shaft, and the free end of the rotating shaft is circumferentially connected to two push rods 502. The free ends of the push rods 502 are provided with push blocks 503. The push block 503 of the push rod 502 located at the top faces the head end of the conveying channel 6. The two push rods 502 are symmetrically arranged around the center of the rotating shaft. The rotating shaft rotates under power drive, driving the push rod 502 to rotate. During the rotation process, the push block 503 on the push rod 502 contacts the chip at the end of the conveying channel 6 and pushes the chip to move in the direction away from the head end of the conveying channel 6, that is, the chip at the end of the conveying channel 6 is pushed into the qualified push plate. The power of the rotating shaft is a motor. A pusher mounting plate is provided on the top of the workbench 1. The end of the rotating shaft away from the pusher rod 502 passes through the pusher mounting plate and is rotatably connected with the pusher mounting plate. The pusher mounting plate is arranged on one side of the conveying channel 6. The motor is installed on the side of the pusher mounting plate away from the conveying channel 6. The motor output shaft is transmission-connected with one end of the rotating shaft passing through the pusher mounting plate.

[0040] It also includes an installation box 10, which is located below the workbench 1. Specifically, the ends of the long pillars and the segment pillars away from the workbench 1 are connected to the top of the installation box 10. The unloading module 5 also includes a tray guide rail 504, which is arranged on the top of the installation box 10. The length direction of the tray guide rail 504 is perpendicular to the length direction of the conveying channel 6. A tray transmission assembly 505 is also installed on the top of the installation box 10. The tray transmission assembly 505 is a belt transmission assembly, which adopts the existing pulley transmission, including two pulleys, and a transmission belt driven by the pulley. A plurality of material slots for chip movement are provided on the qualified tray 506, and the ends of the material slots can be connected to the end of the conveying groove. A tray connection block is provided at the bottom of the qualified tray 506, and the tray connection block is connected to the transmission belt, and the tray connection block is slidably connected to the tray guide rail 504. A motor is installed in the installation box 10, and the output shaft of the motor passes through the top of the installation box 10 and is connected to the pulley transmission. Driven by the motor, the tray transmission assembly 505 drives the qualified tray 506 to move along the length direction of the vertical conveying channel 6, so that the material slot is opposite to the conveying groove, which is convenient for the rotating pusher 501 to push the chip at the end of the conveying channel 6 into the material slot.

[0041] As attached Fig.10 , 11 As shown, the positioning module 7 includes a telescopic blocking rod 701 and a telescopic side abutment plate 702. The telescopic blocking rod 701 is telescopic in a direction perpendicular to the moving direction of the chip. The telescopic blocking rod 701 is located on the moving track of the chip. The telescopic side abutment plate 702 is telescopic in a direction perpendicular to the moving direction of the chip. The telescopic side abutment plate 702 can abut against the side of the chip. A notch is provided on the conveying channel 6 for the telescopic blocking rod 701 and the telescopic side abutment plate 702 to extend and retract, that is, a notch is provided on one side of the conveying groove for the telescopic blocking rod 701 and the telescopic side abutment plate 702 to extend and retract. Specifically: a strip guide is provided at the bottom of the conveying groove, the length direction of the strip guide is parallel to the length direction of the conveying groove, the bottom of the chip has pins, the bottom of the chip contacts the strip guide, and the pins are located on both sides of the strip guide. The setting of the strip guide limits the chip and provides support at the same time, reducing the wear of the chip pins during the movement process.

[0042] The telescopic blocking rod 701 is telescopically extended in a direction perpendicular to the moving direction of the chip on the conveying channel 6, and the side of the telescopic blocking rod 701 can contact the chip. Specifically, the positioning module 7 also includes a first cylinder, the first cylinder includes a piston rod, the piston rod of the first cylinder is connected to the telescopic blocking rod 701, and the telescopic direction of the piston rod of the first cylinder is perpendicular to the moving direction of the chip on the conveying channel 6. In this embodiment, the first cylinder is installed on the workbench 1, the piston rod of the first cylinder is connected to a blocking slider, the telescopic blocking rod 701 is connected to one end of the blocking slider away from the first cylinder, and the blocking slider and the telescopic blocking rod 701 are integrally formed.

[0043] The telescopic direction of the telescopic side abutment plate 702 is perpendicular to the moving direction of the chip on the conveying channel 6, and the end of the telescopic side abutment plate 702 can abut against the chip. Specifically, the positioning module 7 also includes a second cylinder, and the second cylinder includes another piston rod. The piston rod of the second cylinder is connected to the telescopic side abutment plate 702, and the telescopic direction of the piston rod of the second cylinder is perpendicular to the moving direction of the chip on the conveying channel 6. In this embodiment, the second cylinder is installed on the workbench 1, and the piston rod of the second cylinder is connected to the other side abutment slider, and the telescopic side abutment plate 702 is connected to the top of the side abutment slider. In other embodiments, in order to facilitate the fault removal module 8 to clamp the chip, the telescopic side abutment plate 702 of the positioning module 7 located at the fault position includes a left abutment plate and a right abutment plate, and the left abutment plate and the right abutment plate are relatively telescopic, and the ends of the left abutment plate and the right abutment plate can respectively abut against the two sides of the chip.

[0044] Taking the spot welding of the spot welding module 3 as an example, before the chip moves to the spot welding position along the conveying channel 6, the telescopic blocking rod 701 at the spot welding position extends, and the telescopic blocking rod 701 is located on the moving track of the chip. When the chip reaches the spot welding position, it is blocked by the telescopic blocking rod 701. At this time, the telescopic side abutment plate 702 extends to contact the chip and pushes the chip toward the groove wall of the conveying groove and abuts against it, thereby fixing the chip. Then the spot welding module 3 spot welds the chip.

[0045] As attached Fig.12 As shown, the fault rejection module 8 includes a mobile frame and a clamp 801. The clamp 801 is installed on the mobile frame. The clamp 801 is used to clamp the unqualified chips detected by the image detection module 4 from the conveying channel 6. The mobile frame is used to move the clamp 801 after clamping the chip. The clamp 801 is also used to place the clamped chip on the fault tray 802.

[0046] Specifically: the fault tray 802 is installed on the top of the workbench 1, and the fault tray 802 is located on one side of the conveying channel 6. The fault tray 802 is provided with convex strips parallel to the length direction of the conveying channel 6. The two sides of the convex strips are inclined, and the distance between the two opposite sides of adjacent convex strips gradually increases outward along the fault tray 802. The fault tray 802 is also provided with a fault baffle, which is connected to the lowest point of the top of the fault tray 802. The unqualified chips moved to the fault tray 802 are limited by the convex strips, fall along the space between the two convex strips, and contact the fault baffle.

[0047] The mobile frame includes a slide rail column 803, a slide column slider, a clamping slide rail 804, a clamping slider and a clamping cylinder. The slide rail column 803 is connected to the top of the workbench 1. The slide rail column 803 and the faulty tray 802 are located on different sides of the conveying channel 6. The slide column slider is slidably connected to the slide rail column 803. The slide column slider moves in a direction vertical to the top of the workbench 1, thereby adjusting the height between the clamp 801 and the conveying channel 6.

[0048] The length direction of the clamping slide rail 804 is parallel to the top of the workbench 1 and perpendicular to the length direction of the conveying channel 6. One end of the clamping slide rail 804 is connected to the slide block, and a clamping motor is also installed on the slide block. The clamping motor is connected to a belt drive assembly. The belt drive assembly can be an existing pulley drive, including two pulleys and a transmission belt driven by the pulleys. The two pulleys are installed at both ends of the clamping slide rail 804, and one pulley rotates under the drive of the clamping motor. The belt drive assembly is a very mature technology. Its structure and installation are both existing technologies, so they will not be repeated.

[0049] The clamping slider is connected to the transmission belt, and the clamping slider is slidably connected to the clamping slider. The clamping slider moves along the length direction of the clamping slide rail 804 under the drive of the clamping motor, thereby controlling the clamper 801 to move between the conveying channel 6 and the fault tray 802. The clamping cylinder is installed on the clamping slider, and the clamping slider is also provided with a clamper 801 guide rail. The free end of the clamping cylinder is connected to the clamper 801, and the clamper 801 is slidably connected to the clamper 801 guide rail. The clamper 801 is driven by the clamping cylinder to move in a direction perpendicular to the top of the workbench 1, thereby realizing the lifting and lowering of the clamper 801 above the conveying channel 6 and the fault tray 802, thereby clamping the chip on the conveying channel 6 and placing the chip on the fault tray 802.

[0050] In addition, a display is installed on the top of the installation box 10, through which the detection image collected by the image acquisition module can be displayed. A counter is also installed on the conveying channel 6, and the counter can be an infrared counter. The number of chips produced can be known through the counter, and the automatic production of chips can be controlled in combination with the number of counters.

[0051] The specific implementation process is as follows: The staff puts the material box 9 with the end opening on the loading rack, and the material box 9 falls into the groove of the material box 9. The material box 9 is blocked, and the workbench 1 is tilted, so that the chips in the material box 9 fall along the conveying channel 6, and then are blocked by the positioning module 7 at the loading position, waiting for spot welding. When all the chips in the material box 9 fall, the telescopic stopper 206 shrinks, and the material box push rod 204 extends, pushing the empty material box 9 out of the groove of the material box 9 and falling into the material box rack 205, realizing the automatic collection of the empty material box 9.

[0052] During spot welding, the positioning module 7 at the loading position releases the chip, and the chip falls along the conveying channel 6 to the spot welding position, and is then blocked by the positioning module 7 at the spot welding position. At this time, the telescopic pressing block 301 descends, presses the chip, and then the spot welder 302 is started to spot weld the chip. In this embodiment, two groups of spot welding modules 3 are set, and the above spot welding operation is repeated twice to complete the welding on both sides of the chip.

[0053] After spot welding, the positioning module 7 at the spot welding position releases the chip, and the chip falls along the conveying channel 6 to the detection position, and is then blocked by the positioning module 7 at the detection position. At this time, the image acquisition module collects the detection image of the chip after spot welding to determine whether the chip welding in the detection image is qualified.

[0054] When the chip fails the inspection, the positioning module 7 at the inspection position releases the chip, and the chip falls along the conveying channel 6 to the fault position, and is then blocked by the positioning module 7 at the fault position. At this time, the fault removal module 8 clamps the chip and moves the chip to the fault tray 802, thereby realizing the automatic removal of chips with unqualified welding.

[0055] When the chip is qualified in the inspection, the positioning module 7 at the inspection position releases the chip, and the chip falls along the conveying channel 6 to the unloading position, and is then pushed into the qualified tray 506 by the rotary pusher 501 at the unloading position to realize the unloading of the qualified chip for welding. When the material slot facing the conveying groove in the qualified tray 506 is full of chips, the qualified tray 506 moves so that the next material slot faces the conveying groove. When each material slot in the qualified tray 506 is full of chips, the batch transportation of the chips after welding can be realized by transporting the qualified tray 506.

[0056] The above is only an embodiment of the present invention. The common sense such as the known specific structure and characteristics in the scheme is not described in detail here. The ordinary technicians in the relevant field know all the common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all the existing technologies in the field, and have the ability to apply the conventional experimental means before that date. The ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the enlightenment given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the practicality of the patent. The protection scope required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. An electronic chip production monitoring system based on multi-light source compensation, characterized in that: It includes a workbench, the top of which is inclined, and a loading module, a spot welding module, an image detection module and a unloading module are arranged on the workbench in descending order; The loading module is used to transport the chips in the material box in sequence; The spot welding module is used to spot weld the chip located at the welding position; The image detection module is used to collect the detection image of the chip after spot welding; The unloading module is used to sequentially transport the qualified chips detected by the image detection module to the qualified tray; The workbench is provided with a conveying channel and a positioning module. The conveying channel is used for chip movement, and the positioning module is used for positioning the chip, for spot welding by the spot welding module, and for collecting and detecting images by the image detection module. The image detection module includes an image collector and a two-color light source for supplementing light for the chip. The two-color light source includes a ring-shaped light source body with a hollow middle. The image collector is located above the two-color light source, and the connection direction of the image collector and the two-color light source is perpendicular to the top of the workbench.

2. The electronic chip production monitoring system based on multi-light source compensation according to claim 1 is characterized in that: The loading module includes a loading rack and a material box channel. The material box channel is connected to the head end of the conveying channel. The material box channel is used to place material boxes with open ends. The loading rack abuts against the sides of the two ends of the material box.

3. The electronic chip production monitoring system based on multi-light source compensation according to claim 2 is characterized in that: The loading module also includes a material box push rod, a material box rack and a telescopic stop block, the telescopic stop block is against one side of the material box, and the telescopic direction of the telescopic stop block is parallel to the side wall of the material box; a push rod hole is provided on the side of the material box channel away from the telescopic stop block, and the free end of the material box push rod passes through the push rod hole and is against the side of the material box away from the telescopic stop block; the top of the material box rack is open, the material box rack and the telescopic stop block are located on the same side of the material box channel, and the material box rack is used to place empty material boxes.

4. The electronic chip production monitoring system based on multi-light source compensation according to claim 2 is characterized in that: The spot welding module includes a telescopic pressing block and a spot welder. The telescopic pressing block has a telescopic direction perpendicular to the top of the workbench and can abut against the top of the chip. The spot welder is used to spot weld the chip after the telescopic pressing block abuts against the chip.

5. The electronic chip production monitoring system based on multi-light source compensation according to claim 4 is characterized in that: There are two groups of spot welding modules, each group of spot welding modules includes a telescopic pressing block and a spot welder. The spot welder in one group of spot welding modules is used for spot welding one side of the chip, and the spot welder in the other group of spot welding modules is used for spot welding the other side of the chip.

6. The electronic chip production monitoring system based on multi-light source compensation according to claim 4 is characterized in that: A red light source and a blue light source are arranged on the light source body. The blue light source is far away from the image collector, and the image collector is directly opposite to the hollow middle part.

7. The electronic chip production monitoring system based on multi-light source compensation according to claim 6, characterized in that: The unloading module includes a rotary pusher. A plurality of material slots for chips to move are provided on the qualified tray. The end of the conveying channel is connected with the material slot. The rotary pusher is used to abut against the chip and push the chip into the material slot from the end of the conveying channel.

8. The electronic chip production monitoring system based on multi-light source compensation according to claim 7 is characterized in that: The positioning module includes a telescopic blocking rod and a telescopic side abutment plate. The telescopic blocking rod is located on the moving trajectory of the chip and the telescopic side abutment plate is perpendicular to the moving direction of the chip. The telescopic side abutment plate can abut against the side of the chip.

9. The electronic chip production monitoring system based on multi-light source compensation according to any one of claims 1 to 8, characterized in that: The workbench is also provided with a fault rejection module, which is used to move the chips that are unqualified by the image detection module to the fault tray.

10. The electronic chip production monitoring system based on multi-light source compensation according to claim 9, characterized in that: The fault rejection module includes a mobile frame and a clamp. The clamp is installed on the mobile frame. The clamp is used to clamp the unqualified chips detected by the image detection module from the conveying channel. The mobile frame is used to move the clamp after clamping the chip. The clamp is also used to place the clamped chip on the fault tray.

Images