A silicon wafer edge efficient peeling device and method

Abstract

The present invention relates to a silicon wafer edge efficient stripping device, comprising a loading station, a stripping station, a cleaning station and a collecting station arranged in sequence along the transmission direction of the silicon wafer; the stripping station is provided with a processing mechanism for transferring silicon wafers and performing strong acid corrosion on the edges of the silicon wafers to remove silicon dioxide oxide films, and the collecting station is provided with a storage mechanism for storing silicon wafers; by arranging the processing mechanism, the present invention solves the technical problem that when the stripping width requirements are different for silicon wafers, the position of hydrofluoric acid cannot be effectively controlled, thereby resulting in low stripping efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of efficient silicon wafer edge peeling, and in particular to a device and method for efficient silicon wafer edge peeling. Background Art

[0002] Silicon wafers are widely used in the solar industry, semiconductor industry, new energy vehicles, aerospace, micro-electromechanical systems, military fields and other industries. In the production of silicon wafers, a layer of silicon dioxide oxide film needs to be formed on the back of the silicon wafer, and the unnecessary parts at the edge need to be peeled off and removed using hydrofluoric acid to form the state required by the product.

[0003] Patent document with patent number CN116959971A discloses a method for removing SiO2 from the edge of a silicon wafer. The method for removing SiO2 from the edge of a silicon wafer provided in the present invention comprises the following steps: placing a protective cover on the surface of a silicon wafer, placing the surface of the silicon wafer to be protected in the protective cover, using a mixture of nitrogen and hydrofluoric acid solution to spray and etch the area of ​​the silicon wafer exposed outside the protective cover to remove SiO2, using nitrogen to blow dry the liquid on the surface of the silicon wafer, and removing the silicon wafer from the protective cover for storage. The protective cover is provided with a sealing ring, which is in close contact with the edge of the silicon wafer to seal and isolate the surface of the silicon wafer covered in the protective cover.

[0004] However, in actual use, the inventors found that the existing suction cups are of uniform size. Using the same suction cup to meet the peeling width requirements of different customers leads to a technical problem of low peeling efficiency when peeling silicon wafers with a larger width. Summary of the invention

[0005] The purpose of the present invention is to address the shortcomings of the prior art and, by setting up a processing mechanism, solve the technical problem that when the stripping width requirements of silicon wafers are different, the position of hydrofluoric acid cannot be effectively controlled, thereby resulting in low stripping efficiency.

[0006] In view of the above technical problems, the technical solution is as follows: a silicon wafer edge efficient peeling device, comprising:

[0007] Along the direction of silicon wafer transmission, there are loading stations, stripping stations, cleaning stations and collection stations in sequence;

[0008] The stripping station is provided with a processing mechanism for transferring silicon wafers and performing strong acid etching on the edges of the silicon wafers to remove the silicon dioxide oxide film, and the collecting station is provided with a storage mechanism for storing silicon wafers;

[0009] The processing mechanism includes a negative pressure component arranged on a reaction box and used for carrying silicon wafers for mobile processing, an auxiliary component arranged on the reaction box and used for lifting silicon wafers for auxiliary positioning processing, an adjustment component arranged on the negative pressure component and used for adapting to silicon wafers of different sizes, a driving component arranged on the negative pressure component and used for cooperating with the auxiliary component to drive the negative pressure component to rotate, and an acid supply component arranged on the adjustment component and used for conveying strong acid to corrode the edges of silicon wafers.

[0010] Preferably, the negative pressure assembly comprises a connecting pipe connected to the transfer device via a mounting seat, a negative pressure suction cup connected to the connecting pipe, and a sealing ring connected to the negative pressure suction cup.

[0011] Preferably, the auxiliary component includes a first motor connected to the reaction box, a receiving plate connected to the output end of the first motor via a support frame, and a plurality of groups of limiting rings connected to the receiving plate via springs.

[0012] Preferably, the adjustment assembly includes a mounting tube connected to the mounting seat and located outside the connecting tube, a first limit seat connected to the mounting tube and sleeved on the negative pressure suction cup, a first sealing ring connected to the first limit seat, multiple groups of first positioning rods connected to the first limit seat, a second limit seat connected to the first positioning rod through a first positioning ring, a second sealing ring connected to multiple second limit seats, a second positioning rod connected to the second limit seat, a third limit seat connected to the second positioning rod through a second positioning ring, and a third sealing ring connected to the third limit seat.

[0013] Preferably, the drive assembly includes an inner rod connected to a mounting seat, a sleeve rod connected to a reaction box, a first belt transmission member having two ends respectively connected to an output end of a first motor and the sleeve rod, a second belt transmission member having two ends respectively connected to a connecting pipe and the inner rod, a first gear connected to the inner rod, a second gear connected to the mounting seat through a first rotating shaft and meshing with the first gear for transmission, and a third belt transmission member having two ends respectively connected to the first rotating shaft and the mounting tube.

[0014] Preferably, the acid supply assembly includes multiple groups of nozzles respectively arranged on the first limit seat, the second limit seat and the third limit seat, multiple groups of guide pipes respectively arranged on the first limit seat and the second limit seat and connected to the nozzles, a three-way ball valve arranged at the connection between the guide pipe and the nozzle, a second rotating shaft connected to the three-way ball valve and passing through the nozzle, a third gear connected to the second rotating shaft, and multiple groups of adjustment racks respectively connected to the inside of the first limit seat and the second limit seat through telescopic parts and meshing with the third gear for transmission.

[0015] Preferably, the edges of the first limiting seat, the second limiting seat and the third limiting seat are all chamfered.

[0016] Preferably, the storage mechanism includes a storage component disposed on the reaction box and used to store silicon wafers, and a positioning component disposed on the reaction box and used to control the movement state of the silicon wafers before storage.

[0017] Preferably, the storage assembly comprises a first conveying platform and a second conveying platform arranged on the reaction box, and a storage basket connected to the output end of the first driving cylinder through a bracket;

[0018] The positioning assembly includes a second driving cylinder connected to the reaction box, a blocking frame connected to the output end of the second driving cylinder and located on the second conveying platform, a second motor connected to the reaction box, an air guide cover connected to the reaction box and sleeved on the outside of the output end of the second motor, a fan connected to the output end of the second motor, a screw connected to the output end of the second motor, a driving block connected to the screw, a driving rod connected to the reaction box and cooperating with the driving block to drive the first conveying platform to rotate a certain angle, multiple groups of exhaust holes opened on the air guide cover, multiple air guide pipes connected to the air guide cover and corresponding to the exhaust holes, arc grooves opened on the air guide pipes and corresponding to the exhaust holes, a follower gear arranged on the air guide pipe, and an active rack connected to the driving block and meshing with the follower gear for transmission.

[0019] A silicon wafer edge efficient peeling process, applied to a silicon wafer edge efficient peeling device, comprises the following steps:

[0020] Step 1: Loading process: First, the robot takes out the silicon wafer from the carrier basket and places it on the edge-finding device. Then, the edge-finding device positions the silicon wafer by the cross-cutting edge of the silicon wafer. Then, the robot transfers the edge-finding silicon wafer to the platform device to wait for transfer processing.

[0021] Step 2, the stripping process, first the negative pressure component moves to transfer the edge-finding silicon wafer to the auxiliary component position through negative pressure grabbing, then the negative pressure component carries the silicon wafer downward and combines with the auxiliary component, at this time the silicon wafer is confined in a certain space, then the driving component and the auxiliary component cooperate to drive the silicon wafer to rotate forward, and at the same time drive the regulating component to rotate reversely, during the process the acid supply component sprays strong acid from the edge of the regulating component at a certain angle, the spray direction of the strong acid is opposite to the rotation direction of the silicon wafer edge, thereby accelerating the stripping efficiency;

[0022] Step 3, cleaning process, the peeled silicon wafer is driven by the negative pressure component to the cleaning station, and the strong acid on the surface of the silicon wafer is removed under the spraying action of multiple water columns;

[0023] Step 4, the collection process, the silicon wafers after cleaning are sent to the collection station, where the storage component cooperates with the positioning component to guide the silicon wafers for collection, and in the process, the position states of multiple silicon wafers before and after are kept consistent. Finally, the negative pressure component returns to the cleaning station to complete the drying work, and then starts the next cycle of work.

[0024] Beneficial effects of the present invention:

[0025] (1) In the present invention, by setting an adjustment component in the processing mechanism, the suction cup is changed from a state of uniform size to a state in which the diameter can be adjusted to a certain extent according to the set value, thereby meeting the production requirements of different peeling widths of silicon wafers, ensuring the peeling efficiency while greatly improving the adaptability of the device, which is conducive to improving the production efficiency of the product;

[0026] (2) In the present invention, by setting the acid supply component, the driving component and the auxiliary component in the processing mechanism, the bottom of the silicon wafer is first lifted and fixed, and the position state is more stable during rotation. Then, the silicon wafer rotates in the forward direction and the acid supply component rotates in the reverse direction. By spraying hydrofluoric acid, a high-speed fluid is formed, which impacts the surface of the silicon wafer in the reverse direction and flows from the inside to the outside along the surface of the silicon wafer, and quickly corrodes and peels. After a certain amount of spraying, under the limitation of the auxiliary component, a small range of peeling space and a limited amount of hydrofluoric acid are used to achieve efficient peeling and reduce the amount of hydrofluoric acid used. Technical effect.

[0027] (3) In the present invention, chamfers are set on the edges of the first limit seat, the second limit seat and the third limit seat to change the original situation that the silicon wafer directly enters the acid solution. However, the acid solution mainly slowly penetrates between the suction cup and the silicon wafer through capillary action. The acid solution cannot quickly contact the silicon wafer, resulting in slow stripping efficiency. The chamfers are used to increase the open space, accelerate the flow of the acid solution, and increase the contact area between the hydrofluoric acid and the silicon wafer, thereby achieving efficient stripping.

[0028] (4) In the present invention, by providing a positioning component in the storage mechanism, the silicon wafer can be supported by the airflow to reduce the pressure on the receiving surface during the process of sliding down along the inclined surface for collection, thereby reducing the possibility of scratches between the two and ensuring the quality of the silicon wafer. At the same time, the wind force is used to lift the silicon wafer from the tail, so that the front end cross-cutting edge of the silicon wafer is pressed against the blocking frame during the sliding process, thereby ensuring the uniform state of the silicon wafer during the collection process.

[0029] In summary, the equipment has the advantages of fast stripping efficiency, stable position state during silicon wafer processing, high product quality, and reduced acid usage. It is particularly suitable for the field of efficient silicon wafer edge stripping technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0032] Figure 2 It is a structural diagram of the processing mechanism.

[0033] Figure 3 It is a schematic diagram of the structure of the negative pressure component.

[0034] Figure 4 A schematic diagram of the structure of the auxiliary components.

[0035] Figure 5 Schematic diagram of the structure of the adjustment component.

[0036] Figure 6 It is a schematic diagram of the structure of the acid supply component.

[0037] Figure 7 This is a schematic diagram of the structure after the acid supply component is separated.

[0038] Figure 8 Schematic diagram of acid flow.

[0039] Fig. 9 Schematic diagram of the position of the three-way ball valve.

[0040] Fig.10 for Fig. 9 Enlarged schematic diagram of part A.

[0041] Fig.11 Schematic diagram of the relative movement of the acid solution and the silicon wafer during the stripping process.

[0042] Fig.12 A schematic diagram of the structure of the storage mechanism.

[0043] Fig.13 It is a structural diagram of the positioning component.

[0044] Fig.14 It is a schematic diagram of the structure of the arc groove.

[0045] Fig.15 Schematic diagram of the falling state of a silicon wafer.

[0046] Fig.16 A schematic diagram of the workflow. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings.

[0048] Embodiment 1

[0049] like Figure 1 to Figure 2 As shown, a silicon wafer edge efficient peeling device comprises:

[0050] Along the transmission direction of the silicon wafer 200, a loading station I, a stripping station II, a cleaning station III and a collecting station IV are sequentially arranged;

[0051] The stripping station II is provided with a processing mechanism 1 for transferring the silicon wafer 200 and performing strong acid corrosion on the edge of the silicon wafer 200 to remove the silicon dioxide oxide film, and the collecting station IV is provided with a storage mechanism 2 for storing the silicon wafer 200;

[0052] The processing mechanism 1 includes a negative pressure component 11 arranged on the reaction box 100 and used to carry the silicon wafer 200 for mobile processing, an auxiliary component 12 arranged on the reaction box 100 and used to lift the silicon wafer 200 for auxiliary positioning processing, an adjustment component 13 arranged on the negative pressure component 11 and used to adapt to silicon wafers 200 of different sizes, a driving component 14 arranged on the negative pressure component 11 and used to cooperate with the auxiliary component 12 to drive the negative pressure component 11 to rotate, and an acid supply component 15 arranged on the adjustment component 13 and used to transport strong acid to corrode the edge of the silicon wafer 200.

[0053] In this embodiment, by setting the adjustment component 13 in the processing mechanism 1, the suction cup is changed from the original uniform size state to a state in which the diameter can be adjusted to a certain extent according to the set value, thereby meeting the production requirements of different peeling widths of the silicon wafer 200, ensuring the peeling efficiency while greatly improving the adaptability of the device, which is beneficial to improving the production efficiency of the product.

[0054] In detail, the robot first takes out the silicon wafer 200 in the carrying basket and places it on the edge-finding device. Then, the edge-finding device positions the silicon wafer 200 by cutting the edge of the silicon wafer 200. Then, the robot transfers the edge-finding silicon wafer 200 to the platform device to wait for transfer processing. The negative pressure component 11 moves to transfer the edge-finding silicon wafer 200 to the position of the auxiliary component 12 through negative pressure grabbing. Then, the negative pressure component 11 carries the silicon wafer 200 and moves downward and combines with the auxiliary component 12. At this time, the silicon wafer 200 is confined in a certain space, and then the driving component 14 and the auxiliary component 12 cooperate to drive the silicon wafer 200 to rotate forward. , and at the same time drives the adjusting component 13 to rotate in the opposite direction. During the process, the acid supply component 15 sprays strong acid from the edge of the adjusting component 13 at a certain angle. The spraying direction of the strong acid is opposite to the rotation direction of the edge of the silicon wafer 200, thereby accelerating the stripping efficiency. The stripped silicon wafer 200 is driven by the negative pressure component 11 to reach the cleaning station III position, and the strong acid on the surface of the silicon wafer 200 is removed under the spraying action of multiple water columns. The silicon wafer 200 after cleaning is sent to the collection station IV, where the storage component 21 cooperates with the positioning component 22 to guide the collection of the silicon wafer 200, and keeps the position state of multiple silicon wafers 200 in the front and back consistent during the collection process.

[0055] Further, if Figures 1 to 3As shown, the negative pressure assembly 11 includes a connecting pipe 113 connected to the transfer device 112 through a mounting seat 111 , a negative pressure suction cup 114 connected to the connecting pipe 113 , and a sealing ring 115 connected to the negative pressure suction cup 114 .

[0056] In this embodiment, by providing a negative pressure suction cup 114 located in the middle of the processing mechanism 1, the fixing effect of the silicon wafer 200 with different peeling width requirements is consistent, thereby ensuring the stability of the silicon wafer 200 during the processing.

[0057] In detail, first, the transfer device 112 drives the mounting seat 111 on the negative pressure assembly 11 to move downward, and then the mounting seat 111 drives the connecting tube 113 and the negative pressure suction cup 114 to move downward to the top of the silicon wafer 200, and then under the action of negative pressure, the silicon wafer 200 is fixed on the negative pressure suction cup 114 in cooperation with the sealing ring 115.

[0058] Further, if Figures 2 to 4 As shown, the auxiliary component 12 includes a first motor 121 connected to the reaction box 100, a receiving plate 123 connected to the output end of the first motor 121 through a support frame 122, and multiple groups of limiting rings 125 connected to the receiving plate 123 through springs 124.

[0059] In this embodiment, by providing a receiving plate 123, when the silicon wafer 200 is rotated and peeled, in addition to the negative pressure on the top, there is also bottom support and auxiliary limitations around it, thereby ensuring the position of the silicon wafer 200. The provision of multiple sets of limit rings 125 also meets the needs of processing silicon wafers 200 of different diameters.

[0060] In detail, when the negative pressure assembly 11 drives the silicon wafer 200 to move downward onto the receiving plate 123 , the spring 124 cooperates with the redundant limiting ring 125 to move downward to avoid the silicon wafer 200 falling into the corresponding limiting ring 125 .

[0061] It should be noted that the spring 124 has a small effect here and cannot cause damage to the silicon wafer 200 .

[0062] Further, if Figures 2 to 5As shown, the adjustment component 13 includes a mounting tube 131 connected to the mounting seat 111 and located outside the connecting tube 113, a first limiting seat 132 connected to the mounting tube 131 and sleeved on the negative pressure suction cup 114, a first sealing ring 133 connected to the first limiting seat 132, multiple groups of first positioning rods 134 connected to the first limiting seat 132, a second limiting seat 136 connected to the first positioning rod 134 through a first positioning ring 135, a second sealing ring 137 connected to multiple second limiting seats 136, a second positioning rod 138 connected to the second limiting seat 136, a third limiting seat 139 connected to the second positioning rod 138 through a second positioning ring 130, and a third sealing ring 1310 connected to the third limiting seat 139.

[0063] In this embodiment, by setting the first limit seat 132, the second limit seat 136 and the third limit seat 139, in conjunction with the first sealing ring 133, the second sealing ring 137 and the third sealing ring 1310, the peeling width can be adjusted, thereby meeting different processing needs and improving the adaptability of the device. The first sealing ring 133, the second sealing ring 137 and the third sealing ring 1310 themselves have a certain elasticity, and are stretched and deformed as the adjustment component 13 is adjusted, and can then be restored as the adjustment component 13 is reset.

[0064] In detail, when it is necessary to process silicon wafers 200 with different peeling widths, the staff can pull the third limit seats 139 on all sides outward. After breaking through the limit, the third limit seat 139 uses the second positioning ring 130 to move along the second positioning rod 138 to the other end and re-fix it, so that the width of the acid can be peeled off. When it is necessary to further increase the peeling width, continue to pull the third limit seat 139, and the pulling force causes the second limit seat 136 to break through the limit, and move and re-fix it like the third limit seat 139, thereby completing the adjustment.

[0065] It should be noted that the limiting effect of the third limit seat 139 comes from the convex point engagement structure between the second positioning ring 130 and the second positioning rod 138, and the limiting effect of the second limit seat 136 is consistent with the principle of the third limit seat 139, but the limiting effect is significantly enhanced; in addition, the limiting effect can also be achieved by setting screws and rotating extrusion.

[0066] Further, if Figures 2 to 4As shown, the driving assembly 14 includes an inner rod 141 connected to the mounting seat 111, a sleeve rod 142 connected to the reaction box 100, a first belt transmission member 143 whose two ends are respectively connected to the output end of the first motor 121 and the sleeve rod 142, a second belt transmission member 144 whose two ends are respectively connected to the connecting pipe 113 and the inner rod 141, a first gear 145 connected to the inner rod 141, a second gear 147 connected to the mounting seat 111 through a first rotating shaft 146 and meshing with the first gear 145 for transmission, and a third belt transmission member 148 whose two ends are respectively connected to the first rotating shaft 146 and the mounting tube 131.

[0067] In this embodiment, the driving component 14 is set to make the silicon wafer 200 rotate in the forward direction, and the acid supply component 15 rotates in the reverse direction. In combination with the spraying of hydrofluoric acid, a high-speed fluid is formed to impact the surface of the silicon wafer 200. The interaction force improves the glass effect and increases the efficiency.

[0068] In detail, after the silicon wafer 200 is in place, the inner rod 141 is driven by the mounting seat 111 to engage with the sleeve rod 142, and then the first motor 121 drives the receiving plate 123 and the limit ring 125 to rotate through the output end, and at the same time drives the connecting pipe 113 to rotate through the first belt transmission member 143 and the second belt transmission member 144, and the connecting pipe 113 drives the silicon wafer 200 to rotate through the negative pressure suction cup 114. During the process, the inner rod 141 drives the mounting tube 131 to rotate through the first gear 145, the second gear 147 and the third belt transmission member 148, and the mounting tube 131 drives the adjusting component 13 to rotate in the opposite direction, thereby driving the acid sprayed from the acid supply component 15 to move in the opposite direction of the silicon wafer 200.

[0069] Further, if Figures 6 to 11 As shown, the acid supply component 15 includes a plurality of groups of nozzles 151 respectively arranged on the first limit seat 132, the second limit seat 136 and the third limit seat 139, a plurality of groups of guide pipes 152 respectively arranged on the first limit seat 132 and the second limit seat 136 and connected to the nozzles 151, a three-way ball valve 153 arranged at the connection between the guide pipe 152 and the nozzle 151, a second rotating shaft 154 connected to the three-way ball valve 153 and passing through the nozzle 151, a third gear 155 connected to the second rotating shaft 154, and a plurality of groups of adjusting racks 157 respectively connected to the inside of the first limit seat 132 and the second limit seat 136 through telescopic members 156 and meshing with the third gear 155 for transmission.

[0070] In this embodiment, the acid supply component 15 is provided in conjunction with the adjustment component 13, thereby achieving a change in the injection position of the acid solution, so that no matter how the stripping width changes, the acid solution can always be sprayed outward from the innermost side of the stripping area, thereby ensuring the effect of the acid impact and improving the stripping efficiency.

[0071] In detail, during the reverse rotation of the silicon wafer 200 and the acid supply component 15, the acid liquid is sprayed outwardly from the edge of the third limit seat 139 through the cooperation of the nozzle 151, the guide tube 152 and the three-way ball valve 153 on the first limit seat 132, the second limit seat 136 and the third limit seat 139. When the stripping width is changed, for example, the third limit seat 139 is separated, and the adjustment rack 157 connected to the second limit seat 136 moves driven by the telescopic member 156, and then drives the three-way ball valve 153 to rotate 90° through the third gear 155 and the second rotating shaft 154. At this time, the nozzle 151 on the second limit seat 136 is disconnected from the guide tube 152, and the upper and lower parts are connected. Then, during subsequent stripping, the acid liquid will be sprayed outwardly from the edge of the second limit seat 136; after a certain amount of spraying, the limited hydrofluoric acid reacts in the small stripping space formed by the limit ring 125, thereby achieving efficient stripping and reducing the amount of hydrofluoric acid used.

[0072] It should be noted that the ends of the nozzle 151 are all arranged in an arc shape and tilted; after stripping, the acid liquid in the limit ring 125 is squeezed by the external scraper to squeeze multiple limit rings 125 to make it avoid, and then the scraper moves back and forth to discharge and collect the acid liquid to the surroundings, which is not shown in the specific structure diagram.

[0073] Further, if Figure 3 As shown, the edges of the first limiting seat 132 , the second limiting seat 136 and the third limiting seat 139 are all provided with chamfers 300 .

[0074] In this embodiment, by setting chamfers 300 on the edges of the first limit seat 132, the second limit seat 136 and the third limit seat 139, the original silicon wafer 200 is changed to directly enter the acid solution. However, the acid solution mainly penetrates slowly into the space between the suction cup and the silicon wafer 200 through capillary action, and the acid solution cannot quickly contact the silicon wafer 200, resulting in slow stripping efficiency. The chamfer 300 is used to increase the open space, accelerate the flow of the acid solution, and increase the contact area between the hydrofluoric acid and the silicon wafer 200, thereby achieving efficient stripping.

[0075] Further, if Fig.12 As shown, the storage mechanism 2 includes a storage component 21 disposed on the reaction box 100 and used to store the silicon wafer 200 and a positioning component 22 disposed on the reaction box 100 and used to control the movement state of the silicon wafer 200 before storage.

[0076] It is worth mentioning that the storage mechanism 2 can make the position of the silicon wafer 200 more uniform during the storage process, while avoiding damage to the silicon wafer 200 as much as possible.

[0077] In detail, first, the negative pressure component 11 places the cleaned silicon wafer 200 on the storage component 21 , and then the positioning component 22 cooperates with the storage component 21 to place the silicon wafer 200 in the storage component 21 .

[0078] It should be noted that after the negative pressure assembly 11 completes the placement of the silicon wafer 200, it first returns to the cleaning station III to complete the drying work, and then starts the next cycle of work.

[0079] Embodiment 2

[0080] like Figures 12 to 15 As shown, the components identical or corresponding to those in the first embodiment are marked with the corresponding reference numerals in the first embodiment. For the sake of simplicity, only the differences from the first embodiment are described below. The second embodiment differs from the first embodiment in that:

[0081] Further, if Figures 12 to 15 As shown, the storage assembly 21 includes a first conveying platform 211 and a second conveying platform 212 disposed on the reaction box 100 and a storage basket 215 connected to the output end of the first driving cylinder 214 through a bracket 213;

[0082] The positioning assembly 22 includes a second driving cylinder 221 connected to the reaction box 100, a blocking frame 222 connected to the output end of the second driving cylinder 221 and located on the second conveying platform 212, a second motor 223 connected to the reaction box 100, an air guide hood 224 connected to the reaction box 100 and sleeved on the outside of the output end of the second motor 223, a fan blade 225 connected to the output end of the second motor 223, a screw rod 226 connected to the output end of the second motor 223, a driving block 227 connected to the screw rod 226, and a fan blade 225 connected to the output end of the second motor 223. A driving rod 228 is provided on the reaction box 100 and cooperates with the driving block 227 to drive the first conveying platform 211 to rotate a certain angle, a plurality of exhaust holes 220 are provided on the air guide cover 224, a plurality of air guide pipes 229 are connected to the air guide cover 224 and arranged corresponding to the exhaust holes 220, an arc groove 2210 is provided on the air guide pipe 229 and arranged corresponding to the exhaust holes 220, a follower gear 2211 is provided on the air guide pipe 229, and an active rack 2212 is connected to the driving block 227 and meshes with the follower gear 2211 for transmission.

[0083] It is worth mentioning that by setting the positioning component 22 in the storage mechanism 2, the silicon wafer 200 can be supported by the airflow to reduce the pressure on the receiving surface during the collection process of sliding down along the inclined surface, thereby reducing the possibility of scratches between the two, ensuring the quality of the silicon wafer 200. At the same time, the wind force is used to lift the silicon wafer 200 from the tail, so that the front end cross-cutting edge of the silicon wafer 200 is pressed against the blocking frame 222 during the sliding process, thereby ensuring the uniform state of itself during collection.

[0084] In detail, first, the silicon wafer 200 is placed on the first conveyor platform 211, and then the second motor 223 is started, and the fan blades 225 blow the air flow into the air guide cover 224. At the same time, the output end of the second motor 223 drives the screw rod 226 to rotate, so that the driving block 227 moves forward. The driving block 227 first drives the driving rod 228 to move upward through the inclined surface, and then drives the first conveyor platform 211 to tilt. Then the silicon wafer 200 slides downward under the action of gravity and contacts the blocking frame 222 to stop. Next, driven by the second driving cylinder 221, the silicon wafer 200 moves together with the blocking frame 222, and at the same time, the active rack 2212 on the driving block 227 drives the follower gear 2211 on the air guide duct 229 to rotate. When the air duct 229 rotates along with the follower gear 2211, the arc groove 2210 is aligned with the exhaust hole 220 on the air duct cover 224. At this time, the airflow is discharged from the air duct cover 224 to the air duct 229 and moves upward. The ejected airflow is mainly concentrated at the tail of the silicon wafer 200, so that the silicon wafer 200 has a tendency to continue to tilt, thereby reducing the pressure of the silicon wafer 200 on the second conveyor platform 212. However, the cross-cutting edge of the silicon wafer 200 will press against the blocking frame 222, thereby ensuring its own state to enter the storage basket 215. Finally, the first driving cylinder 214 drives the storage basket 215 to move upward to a certain height through the bracket 213, thereby completing the avoidance with the blocking frame 222, and each part begins to reset.

[0085] Embodiment 3

[0086] like Fig.16 As shown, a silicon wafer edge efficient peeling process is applied to a silicon wafer edge efficient peeling device, comprising the following steps:

[0087] Step 1, loading process, first the robot takes out the silicon wafer 200 from the carrying basket and places it on the edge finding device, then the edge finding device positions the silicon wafer 200 by cutting the edge of the silicon wafer 200, and then the robot transfers the edge-finding silicon wafer 200 to the platform device to wait for transfer processing;

[0088] Step 2, the stripping process, first the negative pressure component 11 moves to transfer the edge-finding silicon wafer 200 to the position of the auxiliary component 12 through negative pressure grabbing, then the negative pressure component 11 carries the silicon wafer 200 to move downward and combines with the auxiliary component 12, at this time the silicon wafer 200 is confined in a certain space, then the driving component 14 and the auxiliary component 12 cooperate to drive the silicon wafer 200 to rotate forward, and at the same time drive the regulating component 13 to rotate reversely, during the process, the acid supply component 15 sprays strong acid from the edge of the regulating component 13 at a certain angle, and the spraying direction of the strong acid is opposite to the rotation direction of the edge of the silicon wafer 200, thereby accelerating the stripping efficiency;

[0089] Step 3, cleaning process, the peeled silicon wafer 200 is driven by the negative pressure assembly 11 to the cleaning station III, and the strong acid on the surface of the silicon wafer 200 is removed under the spraying action of multiple water columns;

[0090] Step 4, the collection process, the silicon wafer 200 after cleaning is sent to the collection station IV, where the storage component 21 cooperates with the positioning component 22 to guide the collection of the silicon wafer 200, and in the process, the position state of multiple silicon wafers 200 before and after is kept consistent when collected. Finally, the negative pressure component 11 returns to the cleaning station III to complete the drying work, and then starts the next cycle of work.

[0091] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "front and back", "left and right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the invention.

[0092] Of course, in the present technical solution, those skilled in the art should understand that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0093] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art under the technical guidance of the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A highly efficient silicon wafer edge peeling device, characterized in that: include: Along the direction of silicon wafer transmission, there are loading stations, stripping stations, cleaning stations and collection stations in sequence; The stripping station is provided with a processing mechanism for transferring silicon wafers and performing strong acid etching on the edges of the silicon wafers to remove the silicon dioxide oxide film, and the collecting station is provided with a storage mechanism for storing silicon wafers; The processing mechanism includes a negative pressure component arranged on the reaction box and used for carrying the silicon wafer for mobile processing, an auxiliary component arranged on the reaction box and used for lifting the silicon wafer for auxiliary positioning processing, an adjustment component arranged on the negative pressure component and used for adapting to silicon wafers of different sizes, a driving component arranged on the negative pressure component and used for cooperating with the auxiliary component to drive the negative pressure component to rotate, and an acid supply component arranged on the adjustment component and used for conveying strong acid to corrode the edge of the silicon wafer; The negative pressure assembly includes a connecting pipe connected to the transfer device through a mounting seat, a negative pressure suction cup connected to the connecting pipe, and a sealing ring connected to the negative pressure suction cup; The auxiliary assembly includes a first motor connected to the reaction box, a receiving plate connected to the output end of the first motor through a support frame, and a plurality of groups of limit rings connected to the receiving plate through springs; The adjustment component includes a mounting tube connected to the mounting seat and located outside the connecting tube, a first limit seat connected to the mounting tube and sleeved on the negative pressure suction cup, a first sealing ring connected to the first limit seat, multiple groups of first positioning rods connected to the first limit seat, a second limit seat connected to the first positioning rod through a first positioning ring, a second sealing ring connected to multiple second limit seats, a second positioning rod connected to the second limit seat, a third limit seat connected to the second positioning rod through a second positioning ring, and a third sealing ring connected to the third limit seat.

2. The silicon wafer edge efficient peeling device according to claim 1, characterized in that: The driving assembly includes an inner rod connected to a mounting seat, a sleeve rod connected to a reaction box, a first belt transmission member whose two ends are respectively connected to an output end of a first motor and the sleeve rod, a second belt transmission member whose two ends are respectively connected to a connecting pipe and the inner rod, a first gear connected to the inner rod, a second gear connected to the mounting seat through a first rotating shaft and meshing with the first gear for transmission, and a third belt transmission member whose two ends are respectively connected to the first rotating shaft and the mounting tube.

3. The silicon wafer edge efficient peeling device according to claim 2, characterized in that: The acid supply assembly includes multiple groups of nozzles respectively arranged on the first limit seat, the second limit seat and the third limit seat, multiple groups of guide pipes respectively arranged on the first limit seat and the second limit seat and connected to the nozzles, a three-way ball valve arranged at the connection between the guide pipe and the nozzle, a second rotating shaft connected to the three-way ball valve and passing through the nozzle, a third gear connected to the second rotating shaft, and multiple groups of adjustment racks respectively connected to the inside of the first limit seat and the second limit seat through telescopic parts and meshing with the third gear for transmission.

4. The silicon wafer edge efficient peeling device according to claim 3, characterized in that: The edges of the first limiting seat, the second limiting seat and the third limiting seat are all provided with chamfers.

5. The silicon wafer edge efficient peeling device according to claim 1, characterized in that: The storage mechanism comprises a storage component arranged on the reaction box and used for storing silicon wafers, and a positioning component arranged on the reaction box and used for controlling the movement state of the silicon wafers before storage.

6. The silicon wafer edge efficient peeling device according to claim 5, characterized in that: The storage assembly includes a first conveying platform and a second conveying platform disposed on the reaction box and a storage basket connected to the output end of the first driving cylinder through a bracket; The positioning assembly includes a second driving cylinder connected to the reaction box, a blocking frame connected to the output end of the second driving cylinder and located on the second conveying platform, a second motor connected to the reaction box, an air guide cover connected to the reaction box and sleeved on the outside of the output end of the second motor, a fan connected to the output end of the second motor, a screw connected to the output end of the second motor, a driving block connected to the screw, a driving rod connected to the reaction box and cooperating with the driving block to drive the first conveying platform to rotate a certain angle, multiple groups of exhaust holes opened on the air guide cover, multiple air guide pipes connected to the air guide cover and corresponding to the exhaust holes, arc grooves opened on the air guide pipes and corresponding to the exhaust holes, a follower gear arranged on the air guide pipe, and an active rack connected to the driving block and meshing with the follower gear for transmission.

7. A silicon wafer edge efficient peeling process, applied to a silicon wafer edge efficient peeling device as claimed in any one of claims 1 to 6, characterized in that: The following steps are involved: Step 1: Loading process: First, the robot takes out the silicon wafer from the carrier basket and places it on the edge-finding device. Then, the edge-finding device positions the silicon wafer by the cross-cutting edge of the silicon wafer. Then, the robot transfers the edge-finding silicon wafer to the platform device to wait for transfer processing. Step 2, the stripping process, first the negative pressure component moves to transfer the edge-finding silicon wafer to the auxiliary component position through negative pressure grabbing, then the negative pressure component carries the silicon wafer downward and combines with the auxiliary component, at this time the silicon wafer is confined in a certain space, then the driving component and the auxiliary component cooperate to drive the silicon wafer to rotate forward, and at the same time drive the regulating component to rotate reversely, during the process the acid supply component sprays strong acid from the edge of the regulating component at a certain angle, the spray direction of the strong acid is opposite to the rotation direction of the silicon wafer edge, thereby accelerating the stripping efficiency; Step 3, cleaning process, the peeled silicon wafer is driven by the negative pressure component to the cleaning station, and the strong acid on the surface of the silicon wafer is removed under the spraying action of multiple water columns; Step 4, the collection process, the silicon wafers after cleaning are sent to the collection station, where the storage component cooperates with the positioning component to guide the silicon wafers for collection, and in the process, the position states of multiple silicon wafers before and after are kept consistent. Finally, the negative pressure component returns to the cleaning station to complete the drying work, and then starts the next cycle of work.

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