An intelligent radio frequency transceiver device

Abstract

The present invention relates to the field of wireless communication devices, and discloses an intelligent radio frequency transceiver device, which includes a controller, a housing, and a circuit board located inside the housing. A number of module units are provided on the circuit board. A heat dissipation module is provided inside the housing, and a sensor module is also provided inside the housing. The sensor module is used to detect the temperature inside the housing in real time. The heat dissipation module is electrically connected to the controller to adjust the heat dissipation module according to the temperature inside the housing. A shock absorption module is also provided inside the housing to reduce the impact on the circuit board during dropping or collision. By setting the heat dissipation module, the present invention utilizes the angle adjustment component of the heat dissipation module to realize the intelligent adjustment of the angle of the heat dissipation fan by using the thermal contraction characteristics of the shape memory alloy spring, which not only improves the heat dissipation efficiency, reduces the cost, but also optimizes the space utilization, and can relieve the heat dissipation problem of the device.

Description

Technical Field

[0001] The present invention relates to the field of wireless communication devices, and particularly to an intelligent radio frequency transceiver device. Background Art

[0002] As a core component of a wireless communication system, the mechanical structure design of a radio frequency transceiver device is directly related to the performance, reliability, and service life of the device. Traditional radio frequency transceiver devices face a series of challenges.

[0003] Firstly, a large amount of heat is generated during the operation of a radio frequency transceiver device. If the heat dissipation is poor, it will cause the internal temperature of the device to be too high, thus affecting the stability and life of electronic components. Traditional heat dissipation designs usually use heat sinks, fans, and other heat dissipation components. However, these methods rely too much on temperature sensors. Although they can enable the fan to dissipate heat in a timely manner, they cannot dissipate heat directionally according to the different heat on the circuit board, resulting in the unified air flow direction being unable to meet the demand for excessive local heat, and there is still a situation of excessive local temperature, which affects the stability of the internal circuit board. Summary of the Invention

[0004] The purpose of the present invention is to provide an intelligent radio frequency transceiver device to solve the technical problem that the existing fan cannot dissipate heat directionally according to the different heat on the circuit board, resulting in the unified air flow direction being unable to meet the demand for excessive local heat, and there is still a situation of excessive local temperature, which affects the stability of the internal circuit board.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] An intelligent radio frequency transceiver device includes a controller, a housing, and a circuit board located inside the housing. A number of module units are arranged on the circuit board. A heat dissipation module is arranged inside the housing, and a sensor module is also arranged inside the housing. The sensor module is used to detect the temperature inside the housing in real time. The heat dissipation module is electrically connected to the controller to adjust the heat dissipation module according to the temperature inside the housing;

[0007] A shock absorption module is further arranged inside the housing to reduce the impact on the circuit board during dropping or collision.

[0008] Further, the heat dissipation module includes heat sinks. There are multiple heat sinks, and the heat sinks are arranged on the circuit board and correspond to the module units one by one. Heat dissipation holes are arranged on the housing, and the heat dissipation holes are used to dissipate the heat inside the housing to the outside of the housing;

[0009] The heat dissipation module further includes a heat dissipation fan, which is movably connected inside the housing. An angle adjustment component is provided on one side of the heat dissipation fan, and the angle adjustment component is used to adjust the air flow direction of the heat dissipation fan according to the heat concentration area inside the housing.

[0010] Furthermore, the angle adjustment component includes a plurality of pull ropes, which are evenly distributed along the circumference of the heat dissipation fan. The other ends of the pull ropes are movably connected to the inner side wall of the housing. A shape memory alloy spring is strung on each pull rope. Four pull ropes are in a group and at least one group is provided.

[0011] Furthermore, ventilation slots are also provided on the side wall of the housing. A ventilation component is provided in each ventilation slot. The plurality of ventilation components are connected by a connecting rod. The ventilation component cooperates with the angle adjustment component. When the shape memory alloy springs strung on the plurality of pull ropes all contract and maintain balance, the ventilation component is made to work to open the ventilation slots provided on the side wall of the housing.

[0012] Furthermore, the ventilation component includes a ventilation baffle, which is slidably installed in the ventilation slot. Open slots are provided on the upper and lower sides of the ventilation baffle. Adjacent ventilation baffles are fixedly connected by the connecting rod. A sliding part is provided on the inner side surface of the ventilation baffle, and the sliding part is connected to the pull rope. A limit orifice plate is provided on the inner side wall of the housing corresponding to the position of the ventilation baffle. The pull rope passes through the limit orifice plate. A touch switch is provided at the bottom of the limit orifice plate. A pressing part is provided on the pull rope. The plurality of touch switches are connected in series and electrically connected to the controller;

[0013] A dynamic bladder is provided in the open slot at the bottom of the ventilation baffle. The dynamic bladder is electrically connected to the controller. The dynamic bladder becomes hard when powered on and soft when powered off.

[0014] Furthermore, when all the plurality of touch switches are in a pressed state, the dynamic bladder is powered on and becomes hard under the control of the controller, and the pull rope drives the plurality of ventilation baffles to move upward simultaneously to open the ventilation slots for ventilation.

[0015] Furthermore, the shock absorption module includes at least one shock absorption layer made of an elastic material. The shock absorption layer is provided on the bottom side wall of the housing, and a shock absorption layer is also provided on the inner side wall of the housing. By providing the shock absorption layer between the circuit board and the housing, it is used to absorb and disperse the impact force generated during dropping or collision;

[0016] A bracket is further provided on the inner wall of the housing. An elastic connecting piece is provided on the bracket, and the end of the elastic connecting piece is connected to the circuit board.

[0017] Further, the elastic connecting member is one of a shock-absorbing spring or a shock-absorbing rubber pad.

[0018] Advantages of the present invention:

[0019] (1) In the present invention, a plurality of stay ropes are evenly distributed in four directions or eight directions, and then the heat generated in each direction is identified by connecting the shape memory alloy springs in series. When the temperature of the shape memory alloy spring reaches a certain value, it contracts and resets, causing the cooling fan to be pulled and offset in that direction, so that the cooling fan concentrates the air flow below that direction, thereby achieving the method of preferentially cooling the circuit board area with higher heat, keeping the local temperature of the circuit board within a controllable range, and maximizing the utilization of the cooling fan's capacity.

[0020] (2) Through the ingenious combination of the stay ropes and the shape memory alloy springs, the present invention can flexibly adjust the angle of the cooling fan without adding an additional space burden. This compact design enables the cooling system to better adapt to various compact electronic device environments. Moreover, since the component can automatically adjust the angle of the cooling fan according to the heat distribution, the air flow can be more concentratedly blown towards the high-temperature area, thereby improving the cooling efficiency, reducing the overall temperature of the circuit board, and extending the service life of the electronic device. By reducing the number of electronic components and simplifying the system design, the component reduces the risk of system failures, improves the reliability and stability of the system. At the same time, the durability of the shape memory alloy spring also ensures the long-term stable operation of the cooling system. Description of the Drawings

[0021] The present invention will be further described below with reference to the drawings.

[0022] Figure 1 is a partial three-dimensional schematic diagram of the present invention;

[0023] Figure 2 is an internal structure schematic diagram of the present invention;

[0024] Figure 3 is a structural schematic diagram of the heat dissipation module of the present invention;

[0025] Figure 4 is a state schematic diagram of the dynamic capsule in the present invention.

[0026] Description of the Drawings: 1. Housing; 2. Circuit board; 3. Heat dissipation module; 32. Heat dissipation holes; 33. Heat dissipation fan; 34. Angle adjustment component; 341. Pull rope; 342. Memory alloy spring; 343. Ventilation groove; 344. Ventilation component; 345. Link; 3441. Ventilation baffle; 3442. Opening groove; 3443. Sliding part; 3444. Limit hole plate; 3445. Touch switch; 3446. Pressing part; 3447. Dynamic capsule; 4. Shock absorption module; 41. Shock absorption layer; 42. Bracket; 43. Elastic connecting piece. Detailed Implementation Manner

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to Figures 1-4 As shown, the present invention is an intelligent radio frequency transceiver device, including a controller, a housing 1 and a circuit board 2 located inside the housing 1. A number of module units are provided on the circuit board 2. The module units are the module units of the existing radio frequency transceiver module and will not be elaborated here. A heat dissipation module 3 is provided inside the housing 1, and a sensor module is also provided inside the housing 1. The sensor module is used to detect the temperature inside the housing 1 in real time. The heat dissipation module 3 is electrically connected to the controller to adjust the heat dissipation module 3 according to the temperature inside the housing 1; the sensor module is a temperature sensor;

[0029] A shock absorption module 4 is further provided inside the housing 1 to reduce the impact on the circuit board 2 during dropping or collision.

[0030] The heat dissipation module 3 includes heat dissipation fins. A plurality of heat dissipation fins are provided. The heat dissipation fins are arranged on the circuit board 2 and correspond to the module units one by one. Heat dissipation holes 32 are provided on the housing 1. The heat dissipation holes 32 are used to dissipate the heat inside the housing 1 to the outside of the housing 1;

[0031] The heat dissipation module 3 further includes a heat dissipation fan 33. The heat dissipation fan 33 is movably connected inside the housing 1. An angle adjustment component 34 is provided on one side of the heat dissipation fan 33. The angle adjustment component 34 is used to adjust the air flow direction of the heat dissipation fan 33 according to the heat concentration area inside the housing 1.

[0032] The angle adjustment assembly 34 includes a plurality of stay ropes 341. The plurality of stay ropes 341 are evenly distributed along the circumference of the heat dissipation fan 33. The other ends of the stay ropes 341 are movably connected to the inner side wall of the housing 1. A shape memory alloy spring 342 is strung on each stay rope 341. Four stay ropes 341 form a group and at least one group is provided.

[0033] In the present invention, by evenly arranging a plurality of stay ropes 341 in four directions or eight directions, and then identifying the heat generated in each direction by stringing the shape memory alloy springs 342, when the temperature of the shape memory alloy spring 342 is reached, it will shrink and reset, so that the heat dissipation fan 33 is pulled to deflect in this direction, so that the heat dissipation fan 33 concentrates the air flow below this direction, and further achieves the way of preferentially dissipating heat from the circuit board 2 area with higher heat, so that the local temperature of the circuit board 2 is maintained within a controllable range, so as to maximize the utilization of the capacity of the heat dissipation fan 33;

[0034] By the above method, it is not necessary to arrange a plurality of temperature sensors. On the one hand, due to the thermal contraction characteristics of the shape memory alloy spring 342, this assembly can intelligently respond to the heat changes in different areas of the circuit board 2 without relying on additional temperature sensors; this adaptive heat dissipation adjustment mechanism enables the heat dissipation fan 33 to automatically adjust the angle according to the heat distribution and preferentially dissipate heat from the high-temperature area, thus improving the heat dissipation efficiency; on the other hand, compared with the traditional heat dissipation system based on temperature sensors, this assembly avoids the arrangement of a plurality of temperature sensors and related circuit connections, simplifies the system design, and reduces the production cost; at the same time, the use of the shape memory alloy spring 342 also reduces the number of electronic components, further saving costs;

[0035] In addition, through the ingenious combination of the stay ropes 341 and the shape memory alloy springs 342, this assembly can flexibly adjust the angle of the heat dissipation fan 33 without increasing the additional space burden; this compact design enables the heat dissipation system to better adapt to various compact electronic device environments; and because this assembly can automatically adjust the angle of the heat dissipation fan 33 according to the heat distribution, the air flow can be more concentratedly blown to the high-temperature area, thus improving the heat dissipation efficiency, reducing the overall temperature of the circuit board 2, and prolonging the service life of the electronic device. By reducing the number of electronic components and simplifying the system design, this assembly reduces the risk of system failures, improves the reliability and stability of the system. At the same time, the durability of the shape memory alloy spring 342 also ensures the long-term stable operation of the heat dissipation system;

[0036] In summary, the angle adjustment component 34 utilizes the thermal contraction characteristics of the shape memory alloy spring 342 to achieve intelligent adjustment of the angle of the cooling fan 33, which not only improves the heat dissipation efficiency, reduces costs, but also optimizes space utilization and enhances system reliability, providing a more efficient and reliable heat dissipation solution for electronic devices.

[0037] A ventilation slot 343 is further provided on the side wall of the housing 1. A ventilation component 344 is arranged in each ventilation slot 343. A plurality of the ventilation components 344 are connected by a connecting rod 345. The ventilation component 344 cooperates with the angle adjustment component 34. When the shape memory alloy springs 342 strung on the plurality of pull ropes 341 all contract and maintain balance, the ventilation component 344 is made to work to open the ventilation slot 343 provided on the side wall of the housing 1.

[0038] The ventilation component 344 includes a ventilation baffle 3441. The ventilation baffle 3441 is slidably installed in the ventilation slot 343, and opening slots 3442 are formed on the upper and lower sides of the ventilation baffle 3441. Adjacent ventilation baffles 3441 are fixedly connected by the connecting rod 345. A sliding portion 3443 is provided on the inner side surface of the ventilation baffle 3441. The sliding portion 3443 is connected to the pull rope 341. A limiting orifice plate 3444 is provided on the inner side wall of the housing 1 corresponding to the position of the ventilation baffle 3441. The pull rope 341 passes through the limiting orifice plate 3444. A touch switch 3445 is provided at the bottom of the limiting orifice plate 3444. A pressing portion 3446 is provided on the pull rope 341. A plurality of the touch switches 3445 are connected in series and electrically connected to the controller;

[0039] A dynamic bladder 3447 is arranged in the opening slot 3442 at the bottom of the ventilation baffle 3441. The dynamic bladder 3447 is electrically connected to the controller. The dynamic bladder 3447 becomes hard when electrified and soft when powered off.

[0040] When a plurality of the touch switches 3445 are all in the pressed state, the dynamic bladder 3447 is electrified and becomes hard under the control of the controller, and the pull rope 341 drives a plurality of the ventilation baffles 3441 to move upward simultaneously to open the ventilation slot 343 for ventilation.

[0041] In the present invention, in order to solve the problem that when the overall temperature inside the housing 1 is too high, it is impossible to quickly cool down only by adjusting the fan air direction, the ventilation component 344 is provided. By using a plurality of ventilation slots 343 provided around the housing 1, once the shape memory alloy springs 342 strung on the four pull ropes 341 all thermally contract to the limit state, resulting in the cooling fan 33 being in a balanced state, which affects the rapid export of heat inside the housing 1;

[0042] Therefore, through the common traction effect of the multiple pull ropes 341 when they are contracted upward, the pressing part 3446 is driven to contact the touch switch 3445 at the bottom of the limiting hole; because the multiple ventilation baffles 3441 are connected as a whole by the connecting rod 345, and the weight of the ventilation baffles 3441 themselves, a single pull rope 341 cannot drive the multiple ventilation baffles 3441 to move upward when it is contracted. Therefore, the single pull rope 341 will form a force to pull the cooling fan 33 to deflect. Once the temperature is too high, the multiple pull ropes 341 are balanced due to the contraction of the memory alloy spring 342, so the traction force will be applied to the ventilation baffle 3441. The traction force of the multiple pull ropes 341 is used to pull the ventilation baffle 3441 upward, so that when the four touch switches 3445 are all touched, the controller controls the dynamic capsule 3447 to move upward. The dynamic capsule 3447 is energized to make the electrorheological fluid or magnetorheological fluid filled in the dynamic capsule 3447 harden, so that the dynamic capsule 3447 arranged under the ventilation baffle 3441, which was originally pulled up by the pull rope 341, falls and stretches under the action of gravity. Once energized, the dynamic capsule 3447 in the falling and stretched state forms a supporting force for the ventilation baffle 3441, so that the ventilation baffle 3441 always maintains an open state, and multiple ventilation baffles 3441 are moved up at the same time through the connecting rod 345 for linkage, forming a fully ventilated state to maximize internal heat dissipation and ventilation. When the temperature drops, the memory alloy spring 342 stretches again, thereby releasing the balance state, so that the dynamic capsule 3447 is powered off and returns to a soft state and cannot provide support. The ventilation baffle 3441 moves down and resets, waiting for the next emergency heat dissipation situation to come before continuing to work.

[0043] The shock absorbing module 4 includes at least one shock absorbing layer 41 made of elastic material, and the shock absorbing layer 41 is arranged on the bottom side wall of the shell 1. The shock absorbing layer 41 is also arranged on the inner side wall of the shell 1. The shock absorbing layer 41 is arranged between the circuit board 2 and the shell 1 to absorb and disperse the impact force generated when falling or colliding.

[0044] A bracket 42 is further disposed on the inner wall of the housing 1 , and an elastic connector 43 is disposed on the bracket 42 . The end of the elastic connector 43 is connected to the circuit board 2 .

[0045] The elastic connecting member 43 is a shock absorbing spring or a shock absorbing rubber pad.

[0046] In the present invention, by providing a shock-absorbing module 4, the shock-absorbing layer 41 in the shock-absorbing module 4 is utilized for isolation. Once the device drops or collides, the shock-absorbing layer 41 between the circuit board 2 and the housing 1 can be used to absorb and disperse the impact force, so as to reduce the damage to the circuit board 2. In order to further enhance the ability of the shock-absorbing module 4, an elastic connection method is added. By installing the circuit board 2 on the bracket 42 through the elastic connecting member 43, shock absorption can be carried out when suffering from dropping or collision, and damage to the circuit board 2 caused by hard contact can be avoided as much as possible, so as to prevent serious failures.

[0047] The above has described in detail an embodiment of the present invention, but the content described is only the preferred embodiment of the present invention and cannot be considered as defining the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of the application of the present invention should still fall within the scope covered by the patent of the present invention.

Claims

1. An intelligent radio frequency transceiver device, comprising a controller, a housing (1) and a circuit board (2) located inside the housing (1), wherein a plurality of module units are arranged on the circuit board (2), and is characterized in that, Inside the housing (1), a heat dissipation module (3) is provided. Inside the housing (1), a sensor module is also provided. The sensor module is used to detect the temperature inside the housing (1) in real time. The heat dissipation module (3) is electrically connected to the controller to adjust the heat dissipation module (3) according to the temperature inside the housing (1). A shock absorption module (4) is also provided inside the housing (1) to reduce the impact on the circuit board (2) during dropping or collision. The heat dissipation module (3) includes heat sinks. There are multiple heat sinks. The heat sinks are arranged on the circuit board (2) and are arranged in one-to-one correspondence with the module units. Heat dissipation holes (32) are provided on the housing (1). The heat dissipation holes (32) are used to dissipate the heat inside the housing (1) to the outside of the housing (1). The heat dissipation module (3) further includes a cooling fan (33). The cooling fan (33) is movably connected inside the housing (1). An angle adjustment component (34) is provided on one side of the cooling fan (33). The angle adjustment component (34) is used to adjust the air flow direction of the cooling fan (33) according to the heat concentration area inside the housing (1). The angle adjustment component (34) includes a plurality of stay ropes (341). The plurality of stay ropes (341) are evenly distributed along the circumferential direction of the cooling fan (33). The other ends of the stay ropes (341) are movably connected to the inner side wall of the housing (1). A shape memory alloy spring (342) is strung on each stay rope (341). Four stay ropes (341) form a group and at least one group is provided. A ventilation slot (343) is further provided on the side wall of the housing (1). A ventilation component (344) is provided in each ventilation slot (343). The plurality of ventilation components (344) are connected by a connecting rod (345). The ventilation component (344) cooperates with the angle adjustment component (34). When the shape memory alloy springs (342) strung on the plurality of stay ropes (341) all contract and maintain balance, the ventilation component (344) works to open the ventilation slot (343) provided on the side wall of the housing (1). The ventilation component (344) includes a ventilation baffle (3441). The ventilation baffle (3441) is slidably installed in the ventilation slot (343). Open slots (3442) are provided on the upper and lower sides of the ventilation baffle (3441). Adjacent ventilation baffles (3441) are fixedly connected by the connecting rod (345). A sliding portion (3443) is provided on the inner side surface of the ventilation baffle (3441). The sliding portion (3443) is connected to the stay rope (341). A limit orifice plate (3444) is provided on the inner side wall of the housing (1) corresponding to the position of the ventilation baffle (3441). The stay rope (341) passes through the limit orifice plate (3444). A touch switch (3445) is provided at the bottom of the limit orifice plate (3444). A pressing portion (3446) is provided on the stay rope (341). The plurality of touch switches (3445) are connected in series and electrically connected to the controller. A dynamic capsule (3447) is provided in the open slot (3442) at the bottom of the ventilation baffle (3441). The dynamic capsule (3447) is electrically connected to the controller. The dynamic capsule (3447) hardens when powered on and softens when powered off. When the plurality of touch switches (3445) are all in the pressed state, the dynamic capsule (3447) is powered on and hardened under the control of the controller, and the stay ropes (341) drive the plurality of ventilation baffles (3441) to move upward simultaneously to open the ventilation slot (343) for ventilation.

2. The intelligent radio frequency transceiver device according to claim 1, wherein The shock absorption module (4) includes at least one shock absorption layer (41) made of an elastic material. The shock absorption layer (41) is provided on the bottom side wall of the housing (1). A shock absorption layer (41) is also provided on the inner side wall of the housing (1). By providing the shock absorption layer (41) between the circuit board (2) and the housing (1), it is used to absorb and disperse the impact force generated during dropping or collision. A bracket (42) is further provided on the inner wall of the housing (1), and an elastic connecting member (43) is provided on the bracket (42), and the end of the elastic connecting member (43) is connected to the circuit board (2).

3. The intelligent radio frequency transceiver device according to claim 2, characterized in that, The elastic connecting member (43) is one of a damping spring or a damping rubber pad.

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