Die for manually welding circuit board and welding method

Abstract

The invention relates to a mold for manually welding a circuit board, which comprises a first mold plate, the surface of the first mold plate is provided with a limiting groove, a component can be placed in the limiting groove, the limiting groove comprises a plurality of limiting parts, the groove depths of the plurality of limiting parts are different, and the circuit board can be placed above the first mold plate. The device has the effects that the difficulty in the manual welding process is reduced, components in the welding process are limited, and the welding precision is improved.

Description

Technical Field

[0001] The present application relates to the field of circuit board manufacturing, and in particular to a mold for manually welding a circuit board and a welding method thereof. Background Art

[0002] At present, the process of welding electronic circuits is mainly divided into two categories: one is manual welding and the other is automatic welding. Manual welding of electronic circuits occupies a relatively high position in welding. Welding is an important technology in the assembly of electronic products. It is widely used in electronic product experiments, debugging, and production, and the workload is quite large. The quality of welding will directly affect the quality of the product. In addition to the reasons of components, most of the failures of electronic products are caused by poor welding quality. Therefore, it is very necessary to master skilled welding operation skills.

[0003] With respect to the above-mentioned related technologies, the inventors believe that during the welding process, since components need to be limited during manual welding, the operator needs to use one hand to limit the components and the other hand to weld, which results in high welding difficulty and low precision. Summary of the invention

[0004] In order to reduce the difficulty in the manual soldering process, limit the components during the soldering process, and improve the soldering accuracy, the present application provides a mold for manually soldering a circuit board and a soldering method thereof.

[0005] The present application provides a mold for manually welding a circuit board, which adopts the following technical solution:

[0006] A mold for manually soldering a circuit board includes a first template. A limiting groove is provided on the surface of the first template. Components can be placed inside the limiting groove. The limiting groove includes a plurality of limiting parts. The groove depths of the plurality of limiting parts are different. The circuit board can be placed above the first template.

[0007] Optionally, the limiting groove includes a first limiting portion, the first limiting portion is used to place a diode, a second limiting portion is opened on one side of the first limiting portion, the second limiting portion is used to place a sliding rheostat, a third limiting portion is opened on one side of the second limiting portion, the third limiting portion is used to place a capacitor, a fourth limiting portion is opened on one side of the third limiting portion, the fourth limiting portion is used to place a transistor, and when components are placed inside the corresponding limiting grooves, the heights of the components extending out of the surface of the first template are the same.

[0008] Optionally, the first limiting portion is relatively connected to the second limiting portion, and the third limiting portion is relatively connected to the second limiting portion.

[0009] Optionally, liquid for heat dissipation may be injected into the limiting groove.

[0010] Optionally, a second template is further included, wherein the second template includes a first section and a second section, and the first section and the second section are vertically arranged.

[0011] Optionally, the length of the first section is greater than the width of the second section, and a slot is formed at a connection position between the first section and the second section.

[0012] Optionally, scale lines are provided on the edge of the second template.

[0013] Optionally, a welding method comprises:

[0014] S01: bending different components at the edge of the second template as needed;

[0015] S02: Position and place the bent components on the circuit board;

[0016] S03: placing the first template upside down on the circuit board, so that the components on the circuit board are placed inside the corresponding limiting grooves, so that different components are supported on the circuit board;

[0017] S04: Turn over the circuit board and the second template together, and weld the circuit board and components after turning over.

[0018] In summary, the present application includes at least one of the following beneficial technical effects:

[0019] 1. By placing different components into the corresponding limiting grooves, the pins of the components can be at the same height distance from the circuit board, making it easier for operators to solder and fix the pins of the components on the circuit board.

[0020] 2. The problem of different lengths of the pins caused by bending the pins and long welding time caused by repeated bending and trimming is solved, so that the length of the pins can be adjusted through the second mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of a first template of a mold for manual soldering of a circuit board in an embodiment of the present application.

[0022] Figure 2 It is a structural schematic diagram of a second template of a mold for manual soldering of circuit boards in an embodiment of the present application.

[0023] Figure 3 It is a schematic flow chart of the welding method in the embodiment of the present application.

[0024] Explanation of the accompanying drawings: 1. first template; 2. second template; 21. first subsection; 22. second subsection; 3. limiting groove; 31. first limiting portion; 32. second limiting portion; 33. third limiting portion; 34. fourth limiting portion; 35. fifth limiting portion; 36. sixth limiting portion. DETAILED DESCRIPTION

[0025] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0027] The following is combined with Figure 1-2 This application is described in further detail.

[0028] The present application embodiment discloses a mold for manually soldering a circuit board. Figure 1 A mold for manually soldering a circuit board includes a first template 1 and a second template 2. The first template 1 is provided with a limiting groove 3. The components to be soldered on the circuit board are limited at different positions of the limiting groove 3 according to their height and width, so that the height of the components extending from the first template 1 is the same, thereby unifying the position height of the soldering between the components and the circuit board. The second template 2 is used to bend the pins of the components.

[0029] The limiting groove 3 includes a first limiting portion 31, a second limiting portion 32 is vertically provided at one end of the first limiting portion 31, a third limiting portion 33 is provided on the side of the second limiting portion 32 away from the first limiting portion, and a fourth limiting portion 34 is provided between the first limiting portion 31 and the third limiting portion 33. The first limiting portion 31 and the second limiting portion 32 are relatively connected, and the third limiting portion 33 and the second limiting portion 32 are relatively connected. The groove depths of the first limiting portion 31, the second limiting portion 32, the third limiting portion 33 and the fourth limiting portion 34 are different.

[0030] The first limiting portion 31 is used to place a diode, the second limiting portion 32 is used to place a sliding rheostat, the third limiting portion 33 is used to place a capacitor, and the fourth limiting portion 34 is used to place a transistor. The height of the pins of the diode placed inside the first limiting portion 31, the height of the pins of the sliding rheostat placed inside the second limiting portion 32, the height of the pins of the capacitor placed inside the third limiting portion 33, and the height of the pins of the transistor placed inside the fourth limiting portion 34 are the same, so that when the circuit board is placed on the first template 1, the height positions between the pins and the circuit board can be unified.

[0031] The first template 1 is provided with a fifth limiting portion 35 at the position of the second limiting portion 32, and the fifth limiting portion 35 is relatively connected to the second limiting portion 32. The first template 1 is provided with a sixth limiting portion 36 at the position of the third limiting portion 33, and the sixth limiting portion 36 is relatively connected to the third limiting portion 33. The groove depth of the fifth limiting portion 35 is greater than the groove depth of the second limiting portion 32, and the groove depth of the sixth limiting portion 36 is greater than the groove depth of the third limiting portion 33.

[0032] The second template 2 is an "L"-shaped structure, and includes a first subsection 21 arranged horizontally and a second subsection 22 arranged vertically, and the first subsection 21 and the second subsection 22 are fixedly connected and relatively vertically arranged. The length of the first subsection 21 is greater than the width of the second subsection 22, so that a slot is formed between the first subsection 21 and the second subsection 22.

[0033] Graduation lines are arranged at the edge of the second template 2, so that the operator can use different prefabricated edges to bend the pins according to different length requirements.

[0034] The present application also provides a welding method, which specifically includes the following steps:

[0035] S01: Bend the pins of the diode, the sliding resistor, the capacitor and the transistor at the edge of the second template 2 according to the requirements;

[0036] S02: Place the diode, sliding resistor, capacitor and transistor on the corresponding circuit board;

[0037] S03: The first template 1 is placed upside down on the circuit board, so that the diode, the sliding rheostat, the capacitor and the transistor are placed inside the corresponding limiting grooves 3, and then different components are supported on the circuit board accordingly;

[0038] S04: Flip the circuit board and the first template 1 together, and weld the circuit board and components after flipping. During the welding process, liquid such as water or cooling oil can be injected into the limiting groove 3 to cool the high temperature generated by the welding of components.

[0039] The implementation principle of a mold for manual soldering of circuit boards in an embodiment of the present application is: the pins of components are bent in a targeted manner through a second template 2, thereby reducing the uneven length of pins caused by manual bending, and preventing bending from causing excessive soldering time and complicated soldering.

[0040] The bent components are pre-fixed on the circuit board, and the first template 1 is turned upside down on the circuit board so that different components are placed into the corresponding limiting grooves 3. After the first template 1 and the circuit board are turned over together, cooling liquid is injected into the limiting grooves 3, and then the circuit board and the components are welded.

[0041] In the present invention, the term "plurality" means at least two or more than two, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0042] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A mold for manual soldering of circuit boards, characterized in that: The invention comprises a first template (1), wherein a limiting groove (3) is provided on the surface of the first template (1), components can be placed inside the limiting groove (3), the limiting groove (3) comprises a plurality of limiting parts, the groove depths of the plurality of limiting parts are different, and a circuit board can be placed above the first template (1).

2. A mold for manual soldering of circuit boards according to claim 1, characterized in that: The limiting groove (3) comprises a first limiting portion (31), the first limiting portion (31) being used to place a diode; a second limiting portion (32) is provided on one side of the first limiting portion (31), the second limiting portion (32) being used to place a sliding rheostat; a third limiting portion (33) is provided on one side of the second limiting portion (32), the third limiting portion (33) being used to place a capacitor; a fourth limiting portion (34) is provided on one side of the third limiting portion (33), the fourth limiting portion (34) being used to place a triode; when components are placed inside the corresponding limiting groove (3), the heights of the components extending from the surface of the first template (1) are the same.

3. The mold for manual soldering of a circuit board according to claim 2, characterized in that: The first limiting portion (31) is relatively connected to the second limiting portion (32), and the third limiting portion (33) is relatively connected to the second limiting portion (32).

4. The mold for manual soldering of a circuit board according to claim 1, characterized in that: Liquid for heat dissipation can be injected into the interior of the limiting groove (3).

5. The mold for manual soldering of a circuit board according to claim 1, characterized in that: It also includes a second template (2), wherein the second template (2) includes a first section (21) and a second section (22), wherein the first section (21) and the second section (22) are vertically arranged.

6. The mold for manual soldering of a circuit board according to claim 5, characterized in that: The length of the first section (21) is greater than the width of the second section (22), and a slot is formed at a connection position between the first section (21) and the second section (22).

7. The mold for manual soldering of a circuit board according to claim 5, characterized in that: The edge of the second template (2) is provided with scale lines.

8. A welding method, characterized in that: A mold for manually soldering a circuit board according to any one of claims 1 to 7, the method comprising: S01: bending different components at the edge of the second template (2) as required; S02: Position and place the bent components on the circuit board; S03: placing the first template (1) upside down on the circuit board, so that the components on the circuit board are placed inside the corresponding limiting grooves (3), so that different components are supported on the circuit board; S04: Turning over the circuit board and the first template (1) together, and welding the circuit board and components after turning over.

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