Internal and external double liquid cooling heat dissipation device and method for logging instrument

Abstract

The present application belongs to the technical field of well logging, and discloses a double-liquid cooling and heat dissipation device and method for a well logging instrument, which comprises an adiabatic bottle, a liquid cooling framework, a liquid cooling module, a heat storage module, a working mode switching valve and an active cooling mechanism, the liquid cooling framework, the liquid cooling module, the heat storage module and the working mode switching valve are sequentially connected and arranged in the adiabatic bottle, the framework cooling pipeline of the liquid cooling framework, the flow channel in the liquid cooling module and the heat storage module spiral channel of the heat storage module are sequentially connected and communicated to form a pipeline system, the working mode switching valve is connected to the pipeline system, and the active cooling mechanism is detachably connected to the pipeline system; the heat dissipation device is in an internal circulation working mode or an external circulation working mode by opening or closing the working mode switching valve; the internal circulation working mode and the external circulation working mode correspond to a downhole working state of the well logging instrument and an out-of-well state after the working is completed, respectively. The present application improves the cooling and heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of well logging, and more particularly relates to an internal and external dual-liquid cooling heat dissipation device and method for a well logging instrument. BACKGROUND

[0002] With the development of society and industry, the demand for oil and gas resources is increasing, and the exploitation of oil and gas resources is becoming more and more in-depth. The well logging instrument is a device used for exploring the distribution of underground oil and gas resources, and the chips and electronic circuits inside the device face a serious risk of thermal failure. In the high-temperature environment of the well, not only is the electronic circuit inside the well logging instrument affected by the high temperature outside, but the heat generated by the chip itself can also cause heat accumulation and form local hot spots, leading to failure of the electronic circuit and the chip. In addition, after completing the exploration task and returning to the ground, the well logging instrument may need to return to the well for further work in a short period of time, which requires rapid cooling of the well logging instrument. However, direct exposure of the chip to the external environment can cause thermal stress damage or condensation of moisture.

[0003] To address the problem of high-temperature burnout of the internal chip and electronic circuit of the well logging instrument and the difficulty in cooling the well logging instrument in a short period of time after work is completed, patent CN117119758A discloses a "well logging instrument heat management skeleton with embedded pipeline". During operation of the well logging instrument, the heat of the chip is conducted to the heat storage module through the embedded high-thermal-conductivity copper pipe. After work is completed, the heat inside the system is discharged by flowing fluid into the internal flow channel. This method improves the heat conduction capacity of the system, prolongs the maximum working time of the well logging instrument, and also significantly shortens the cooling time after the well logging instrument stops working, thereby improving the working efficiency of the well logging instrument.

[0004] However, due to the limited heat conduction capacity, there is inevitably a large temperature difference between the chip and the heat storage module, and the sensible heat of the phase change material is not fully utilized. When the cooling medium is introduced after work is completed, the cooling effect is greatly affected by the initial temperature of the medium. Due to the lack of active cooling mechanism, it is difficult to ensure the cooling speed of the system. SUMMARY

[0005] To address the above defects or improvement needs of the prior art, the present application provides an internal and external dual-liquid cooling heat dissipation device and method for a well logging instrument, which aims to solve the problem of slow cooling after the well logging instrument stops working.

[0006] To achieve the above object, according to one aspect of the present application, a double-liquid cooling heat dissipation device for a logging instrument is provided, which comprises an adiabatic bottle, a liquid cooling framework, a liquid cooling module, a heat storage module, a working mode switching valve and an active cooling mechanism, the liquid cooling framework, the liquid cooling module, the heat storage module and the working mode switching valve are sequentially connected and arranged in the adiabatic bottle, the framework cooling pipeline of the liquid cooling framework, the flow channel in the liquid cooling module and the heat storage module spiral channel of the heat storage module are sequentially connected to form a pipeline system, the working mode switching valve is connected to the pipeline system, and the active cooling mechanism is detachably connected to the pipeline system.

[0007] The working mode switching valve is opened or closed to make the heat dissipation device in an internal circulation working mode or an external circulation working mode; the internal circulation working mode and the external circulation working mode correspond to a downhole working state of the logging instrument and a state outside the well after the working is completed, respectively; when the heat dissipation device is in the internal circulation working mode, the active cooling mechanism is disconnected from the pipeline system; when the heat dissipation device is in the external circulation working mode, the active cooling mechanism is connected to the pipeline system.

[0008] Further, the adiabatic bottle is provided with a receiving cavity, which penetrates one end of the adiabatic bottle, so that the adiabatic bottle forms a closed end and an open end; the receiving cavity is used for accommodating the liquid cooling framework, the liquid cooling module, the heat storage module and the working mode switching valve; a vacuum layer is formed in the wall of the receiving cavity; the two opposite ends of the receiving cavity are respectively provided with a first thermal insulation plug and a second thermal insulation plug, and the first thermal insulation plug and the second thermal insulation plug are respectively located at the closed end and the open end; the first thermal insulation plug and the second thermal insulation plug are respectively connected to the liquid cooling framework and the heat storage module, and the working mode switching valve is arranged in the second thermal insulation plug.

[0009] Further, the liquid cooling framework is internally formed with an S-shaped framework cooling pipeline; the liquid cooling framework is provided with a first recess and a second recess, two chips of the logging instrument are respectively arranged in the first recess and the second recess, and the two chips are respectively attached to the bottom surface of the first recess and the bottom surface of the second recess through a thermal interface material.

[0010] Further, the liquid cooling framework is provided with a first receiving groove and a second receiving groove at the two opposite ends thereof, one end of the first thermal insulation plug is arranged in the first receiving groove; the liquid cooling framework comprises a liquid cooling framework upper framework and a liquid cooling framework lower framework which are connected, and the first receiving groove and the second receiving groove are formed by the liquid cooling framework upper framework and the liquid cooling framework lower framework; the first recess and the second recess are respectively formed in the liquid cooling framework upper framework and the liquid cooling framework lower framework.

[0011] Further, the liquid cooling framework is connected to the liquid cooling module by a sealing joint, and an O-shaped groove is formed on the outer circumferential surface of the sealing joint, and a sealing ring is arranged in the O-shaped groove to achieve sealing.

[0012] Further, the heat storage module comprises a plurality of sealing joints, a heat storage module shell, a heat storage module spiral pipe and a heat storage module plug, the sealing joints are arranged at the two opposite ends of the heat storage module shell respectively, and the heat storage module is connected to the liquid cooling module and the active cooling mechanism through the sealing joints.

[0013] Further, the heat storage module shell is in a columnar shape, and comprises a heat storage module upper end cover, a heat storage module shell and a heat storage module lower end cover, the heat storage module upper end cover and the heat storage module lower end cover are arranged at the two ends of the heat storage module shell respectively, the heat storage module shell is formed with a third receiving groove, the third receiving groove penetrates through the heat storage module shell and is used for accommodating the heat storage module spiral pipe, and the third receiving groove is filled with a phase change material.

[0014] Further, the liquid cooling module comprises an adapter, a liquid compensator and a high-temperature-resistant circulating pump, the adapter is formed with a first flow channel and a second flow channel penetrating through, one end of the first flow channel and the second flow channel is connected to the two ends of the framework cooling pipe through the sealing joints respectively, and the other end is connected to the heat storage module spiral pipe through the sealing joints, the high-temperature-resistant circulating pump is arranged on the first flow channel, and the liquid compensator is arranged on the second flow channel.

[0015] Further, the active cooling mechanism is connected to the heat storage module through an external circulation quick structure, and the working mode switching module is connected to the heat storage module spiral pipe.

[0016] The application further provides an internal and external double-liquid cooling heat dissipation method for a logging instrument, wherein the heat dissipation method adopts the internal and external double-liquid cooling heat dissipation device for a logging instrument to dissipate heat and cool the logging instrument, and when the logging instrument is working in a well, the heat dissipation device adopts an internal circulation working mode to dissipate heat, and when the logging instrument returns to the outside of the well after the well operation is completed, the heat dissipation device adopts an external circulation working mode to dissipate heat.

[0017] Overall, compared with the prior art, the internal and external double-liquid cooling heat dissipation device and method for a logging instrument provided by the application mainly have the following beneficial effects:

[0018] 1. The active cooling mechanism is detachably connected to the pipeline system, and the heat dissipation device is in an internal circulation working mode or an external circulation working mode by opening or closing the working mode switching valve; the internal circulation working mode and the external circulation working mode correspond to the downhole working state of the logging instrument and the state outside the well after the working is completed, respectively; when the heat dissipation device is in the internal circulation working mode, the active cooling mechanism is disconnected from the pipeline system; when the heat dissipation device is in the external circulation working mode, the active cooling mechanism is connected to the pipeline system, and the active cooling mechanism participates in the work to realize the rapid cooling of the logging instrument.

[0019] 2. After the logging instrument returns to the ground after the working is completed, the working mode switching valve is closed, the active cooling mechanism is connected by using the quick connector, the working mode of the pipeline system is switched to the external circulation, the high-temperature circulating working medium in the inside enters the active cooling mechanism, the circulating working medium is rapidly cooled by using the refrigeration effect of the active cooling mechanism, and then reenters the inside of the pipeline system driven by the active cooling mechanism to complete the external circulation, the heat in the inside of the pipeline system is rapidly led out by using the low-temperature working medium, the chip is protected, and the rapid heat dissipation of the pipeline system is realized, so that the logging instrument can return to the downhole for secondary operation in a short time, and the working efficiency is improved.

[0020] 3. In the initial stage, the high-temperature resistant circulating pump does not work, and the heat of the chip is transmitted to the heat storage module for storage by the heat conduction of the skeleton. When the chip is about to reach the temperature upper limit, the high-temperature resistant circulating pump is started, and the cooling working medium is driven to continuously circulate in the pipeline system, so that the heat of the chip is forcibly transmitted to the heat storage module for storage. The forced convection heat exchange process is adopted to replace the heat conduction process, the heat transmission capacity is greatly improved, the thermal resistance between the chip and the heat storage module is reduced, the heat of the chip is rapidly transmitted to the heat storage module for storage, the longest working time of the logging instrument is prolonged, and the problem of high-temperature burning of the logging instrument is effectively solved. At the same time, the opening and closing of the high-temperature resistant circulating pump is remotely controlled, the working time of the high-temperature resistant circulating pump is reduced, the heat production of the high-temperature resistant circulating pump is reduced, and the overall heat production of the pipeline system is reduced to the greatest extent.

[0021] 4. The internal circulation and the external circulation of the pipeline system share the skeleton cooling pipeline in the liquid cooling skeleton, the internal flow channel in the adapter and the spiral pipeline of the heat storage module, the space inside the system is fully utilized, the processing steps of the instrument are reduced, and the manufacturing cost of the instrument is reduced.

[0022] 5. The S-shaped skeleton cooling pipeline inside the liquid cooling skeleton can maximize the heat exchange between the chip and the circulating working medium, quickly lead out the heat of the chip, and if multiple different power heat sources are distributed at different positions of the skeleton, the S-shaped skeleton cooling pipeline can also make the temperatures of the multiple heat sources consistent as much as possible, thereby prolonging the maximum working time of the system. The spiral cooling pipeline inside the heat storage module can greatly increase the contact area between the pipeline wall and the phase change material, greatly enhance the heat exchange between the circulating working medium and the phase change material, fully utilize the latent heat of the phase change material, improve the uniformity of the system, and prolong the working time of the system.

[0023] 6. The pipelines inside the pipeline system are connected by sealed joints, which ensures the sealing of the pipeline connection and avoids liquid leakage that may cause short circuit of electronic circuits and failure of instruments.

[0024] 7. The outer circulation inlet and outlet pipelines of the pipeline system and the inlet and outlet pipelines of the active cooling mechanism are provided with outer circulation quick connectors at the ends, which can realize quick connection between pipelines, reduce the operation difficulty of field operation, reduce the connection time of the device, and improve the working efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a sectional view of an internal and external double liquid cooling heat dissipation device for a logging instrument provided by the present application;

[0026] Figure 2 is Figure 1 a local sectional view of the internal and external double liquid cooling heat dissipation device for a logging instrument in

[0027] Figure 3 is Figure 1 a schematic view of the liquid cooling skeleton and the chip of the internal and external double liquid cooling heat dissipation device for a logging instrument in

[0028] Figure 4 is Figure 1 a schematic view of the sealed joint of the internal and external double liquid cooling heat dissipation device for a logging instrument in

[0029] Figure 5 is Figure 1 a schematic view of the heat storage module of the internal and external double liquid cooling heat dissipation device for a logging instrument in

[0030] Figure 6 is Figure 1 a schematic view of the plug of the heat storage module of the internal and external double liquid cooling heat dissipation device for a logging instrument in

[0031] Figure 7 is Figure 1 a schematic view of the outer circulation quick connector of the internal and external double liquid cooling heat dissipation device for a logging instrument in

[0032] Figure 8 is Figure 1 Fig. 2 is a schematic diagram of the active cooling mechanism of the inner and outer dual liquid cooling heat dissipation device for logging instrument in Fig. 1.

[0033] In all the drawings, the same reference signs are used to represent the same elements or structures, wherein: 1 is an adiabatic bottle, 2 is a first insulation plug, 3 is a vacuum layer, 4 is a skeleton cooling pipeline, 5 is a liquid cooling skeleton, 501 is an upper skeleton of the liquid cooling skeleton, 502 is a lower skeleton of the liquid cooling skeleton, 6 is a liquid compensator, 7 is a high-temperature-resistant circulating pump, 8 is an adapter, 9 is a sealing joint, 901 is an inner passage of the sealing joint, 902 is an O-shaped groove of the sealing joint, 10 is a heat storage module shell, 1001 is a through shell of the heat storage module, 1002 is an upper end cover of the heat storage module, 1003 is a lower end cover of the heat storage module, 1004 is a plug of the heat storage module, 1005 is an O-shaped groove of the plug of the heat storage module, 1006 is an outer hexagonal groove, 11 is a phase change material, 12 is a spiral pipeline of the heat storage module, 13 is a working mode switching valve, 14 is a second insulation plug, 15 is an outer circulating water outlet pipeline, 16 is an outer circulating water inlet pipeline, 17 is an outer circulating quick joint, 1701 is a male joint of the quick joint, 1702 is a female joint of the quick joint, 18 is a chip, 19 is a thermal interface material, 20 is an active cooling mechanism, 2001 is a compressor, 2002 is a condenser, 2003 is an expansion valve, 2004 is an evaporator, 2005 is a cooling water inlet, 2006 is a cooling water outlet, 21 is a cooling mechanism water inlet pipeline, and 22 is a cooling mechanism water outlet pipeline. DETAILED DESCRIPTION

[0034] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as there is no conflict.

[0035] Please refer to Figure 1 and Figure 2The application provides a double-liquid cooling heat dissipation device for a logging instrument, which comprises an adiabatic bottle 1, a liquid cooling framework 5, a liquid cooling module, a heat storage module, a working mode switching valve 13 and an active cooling mechanism 20, the liquid cooling framework 5, the liquid cooling module, the heat storage module and the working mode switching valve 13 are sequentially connected and arranged in the adiabatic bottle 1, the framework cooling pipeline 4 of the liquid cooling framework 5, the flow channel in the liquid cooling module and the heat storage module spiral channel of the heat storage module are sequentially connected and communicated to form a pipeline system, the working mode switching valve 13 is connected to the pipeline system, and the active cooling mechanism 20 is detachably connected to the pipeline system. The heat dissipation device is in an internal circulation working mode or an external circulation working mode by opening or closing the working mode switching valve 13; the internal circulation working mode and the external circulation working mode correspond to the downhole working state of the logging instrument and the state outside the well after the working is completed, respectively. When the heat dissipation device is in the internal circulation working mode, the active cooling mechanism 20 is disconnected from the pipeline system; when the heat dissipation device is in the external circulation working mode, the active cooling mechanism 20 is connected to the pipeline system.

[0036] The adiabatic bottle 1 is provided with a receiving cavity penetrating one end of the adiabatic bottle 1, so that the adiabatic bottle 1 forms a closed end and an open end. The receiving cavity is used for accommodating the liquid cooling framework, the liquid cooling module, the heat storage module and the working mode switching valve 13. A vacuum layer 3 is formed in the wall of the receiving cavity.

[0037] The two opposite ends of the receiving cavity are respectively provided with a first heat insulation plug 2 and a second heat insulation plug 14, and the first heat insulation plug 2 and the second heat insulation plug 14 are respectively located at the closed end and the open end. In the embodiment, the first heat insulation plug 2 is T-shaped, and the second heat insulation plug 14 is rectangular; the first heat insulation plug 2 and the second heat insulation plug 14 are respectively connected to the liquid cooling framework and the heat storage module, and the working mode switching valve 13 is arranged in the second heat insulation plug 14.

[0038] Please refer to Figure 3The liquid cooling framework includes a liquid cooling framework upper framework 501 and a liquid cooling framework lower framework 502 connected with each other, and the first receiving groove and the second receiving groove are formed by the liquid cooling framework upper framework 501 and the liquid cooling framework lower framework 502. Surfaces opposite to each other of the liquid cooling framework upper framework 501 and the liquid cooling framework lower framework 502 are provided with a first groove and a second groove, respectively. Two chips 18 of the logging instrument are arranged in the first groove and the second groove, respectively, and the two chips 18 are tightly attached to the bottom surface of the first groove and the bottom surface of the second groove through a thermal interface material 19, so as to reduce the contact thermal resistance between the chips 18 and the liquid cooling framework, and make the heat of the chips 18 be conducted to the liquid cooling framework more quickly. An S-shaped framework cooling pipeline 4 is formed in the liquid cooling framework. Specifically, the liquid cooling framework upper framework 501 and the liquid cooling framework lower framework 502 are provided with partial framework cooling pipelines 4, respectively, and the framework cooling pipelines 4 are connected in a sealed manner through welding.

[0039] The open end is also provided with a first receiving hole and a second receiving hole, and the first receiving hole and the second receiving hole penetrate the open end. The first receiving hole and the second receiving hole are connected with two ends of the framework cooling pipeline 4, respectively. A sealing joint 9 is arranged in the first receiving hole and the second receiving hole, respectively, and the sealing joint 9 is connected with the framework cooling pipeline 4. The liquid cooling framework is connected with the liquid cooling module in a sealed manner through the sealing joint, so as to ensure good sealing performance.

[0040] Please refer to Figure 4 The sealing joint is in a stepped shape, and a through sealing joint inner channel 901 is formed in the sealing joint in an axial direction. An O-shaped groove of the sealing joint is formed on an outer circumferential surface of the sealing joint, and a sealing ring is arranged in the O-shaped groove 902 of the sealing joint to achieve sealing, and the sealing ring is tightly attached to a wall surface to achieve good sealing effect. In the embodiment, the diameter of the sealing joint inner channel 901 is 4 mm.

[0041] Please refer to Figure 5 and Figure 6 The heat storage module includes a plurality of sealing joints, a heat storage module shell 10, a heat storage module spiral pipeline 12 and a heat storage module plug 1004. The plurality of sealing joints are arranged at two opposite ends of the heat storage module shell 10, and the heat storage module is connected with the liquid cooling module and the active cooling mechanism 20 through the plurality of sealing joints. The heat storage module spiral pipeline 12 is arranged in the heat storage module shell 10 and is connected with the sealing joints. The heat storage module plug 1004 is arranged at one end of the heat storage module shell 10 adjacent to the liquid cooling module.

[0042] The heat storage module shell 10 is cylindrical, which includes a heat storage module upper end cover 1002, a heat storage module shell 1001 and a heat storage module lower end cover 1003, and the heat storage module upper end cover 1002 and the heat storage module lower end cover 1003 are respectively arranged at both ends of the heat storage module shell 1001. The heat storage module shell 1001 is formed with a third receiving groove, which penetrates through the heat storage module shell 1001 and is used for accommodating the heat storage module spiral pipe 12. The third receiving groove is filled with a phase change material 11. The third receiving groove includes a first section, a second section and a third section connected in sequence, and the diameters of the first section and the third section are smaller than the diameter of the second section. The heat storage module upper end cover 1002 and the heat storage module lower end cover 1003 are respectively arranged in the first section and the second section. The heat storage module spiral pipe 12 is arranged in the second section.

[0043] The step formed by the first section and the second section is provided with a third receiving hole and a fourth receiving hole, and the third receiving hole and the fourth receiving hole are in communication with the second section and penetrate through one end of the heat storage module shell 1001. The third receiving hole and the fourth receiving hole are respectively provided with the sealing joints. The step formed by the third section and the second section is provided with a fifth receiving hole and a sixth receiving hole, and the fifth receiving hole and the sixth receiving hole are in communication with the second section and penetrate through the other end of the heat storage module shell 1001. The fifth receiving hole and the sixth receiving hole are respectively provided with the sealing joints.

[0044] The heat storage module spiral pipe 12 includes a first pipe and a second pipe, and the two ends of the first pipe are respectively connected to the sealing joints arranged in the third receiving hole and the sixth receiving hole. The two ends of the second pipe are respectively connected to the sealing joints arranged in the fourth receiving hole and the fifth receiving hole. The one ends of the first pipe and the second pipe away from the liquid cooling framework are respectively connected to the one ends of the outer circulation water outlet pipe 15 and the outer circulation water inlet pipe 16 through the sealing joints, and the other ends of the outer circulation water outlet pipe 15 and the outer circulation water inlet pipe 16 are respectively connected to the outer circulation quick connector 17 after penetrating through the second thermal insulation plug 14. The working mode switching valve 13 is connected to the outer circulation water outlet pipe 15 and the outer circulation water inlet pipe 16.

[0045] During packaging, the spiral duct 12 of the heat storage module is first placed inside the heat storage module shell 1001 and fixed by welding; then the upper end cover 1002 of the heat storage module and the lower end cover 1003 of the heat storage module are welded to the heat storage module shell 1001. After that, the phase change material 11 is heated to melt into a liquid state, and the liquid phase change material 11 is poured into the inside of the shell through the through hole in the upper end cover 1002 of the heat storage module, and after cooling, the heat storage module plug is sealed.

[0046] The upper end cover 1002 of the heat storage module is provided with a through hole. The heat storage module plug is arranged in the through hole. One end of the heat storage module plug is provided with an outer hexagonal groove, and the heat storage module plug is tightened through the outer hexagonal groove. An O-shaped groove 1005 is formed on the outer circumferential surface of the heat storage module plug, and a sealing ring is arranged in the O-shaped groove 1005. The sealing ring is in close contact with the wall surface to achieve a sealing effect.

[0047] The liquid cooling module comprises an adapter 8, a liquid compensator 6 and a high-temperature-resistant circulating pump 7. The adapter 8 is provided with a first flow channel and a second flow channel. One end of the first flow channel and the second flow channel is respectively connected to the two ends of the skeleton cooling duct 4 through a sealing joint, and the other end is respectively connected to the first duct and the second duct through a sealing joint. The high-temperature-resistant circulating pump 7 is arranged on the first flow channel, and the liquid compensator 6 is arranged on the second flow channel.

[0048] Please refer to Figure 7 , the outer circulation quick connector 17 is a C type self-locking connector, which comprises a male quick connector 1701 and a female quick connector 1702. The male quick connector 1701 is connected to the duct of the active cooling mechanism 20, and the female quick connector 1702 is connected to the outer circulation water outlet duct 15 and the outer circulation water inlet duct 16.

[0049] Please refer to Figure 8 , the active cooling mechanism 20 comprises a compressor 2001, a condenser 2002, an expansion valve 2003, an evaporator 2004 and a circulating pump. The evaporator 2004 is connected to the cooling water inlet 2005 and the cooling water outlet 2006 through a duct, and the circulating pump is connected to the cooling water outlet 2006 and the evaporator 2004. The expansion valve 2003 is connected to the evaporator 2004 and the condenser 2002, and the compressor 2001 is connected to the evaporator 2004 and the condenser 2002. The cooling water inlet 2005 and the cooling water outlet 2006 are respectively connected to the cooling mechanism water inlet pipe 21 and the cooling mechanism water outlet pipe 22.

[0050] The compressor 2001 sucks in low-temperature and low-pressure steam and converts the low-temperature and low-pressure steam into high-temperature and high-pressure gas through compression. The compressor 2001 is driven by an electric motor and compresses the steam through a piston or rotary compressor 2001. The compressed high-temperature and high-pressure gas enters the condenser 2002 and is cooled into high-pressure liquid. The high-pressure liquid then enters the evaporator 2004 through the expansion valve 2003, which controls the flow of the high-pressure liquid so that the high-pressure liquid can be rapidly evaporated after entering the evaporator 2004. Due to the action of the expansion valve 2003, the pressure of the high-pressure liquid rapidly decreases after entering the evaporator 2004, and the liquid begins to evaporate into low-temperature and low-pressure steam, which achieves the cooling effect on the high-temperature circulating working medium. The cooled circulating working medium is driven by the circulating pump and is transported into the pipeline system through the pipeline, thereby achieving the cooling of the system.

[0051] In the embodiment, the first thermal insulation plug 2 is made of PEEK, which can reduce the environmental heat leakage of the end face of the adiabatic bottle, and the second thermal insulation plug 14 is made of PEEK and filled with nano aerogel in the inside, which can effectively prevent the heat in the environment from invading the inside of the pipeline system and reduce the environmental heat leakage of the open end of the adiabatic bottle; the circulating working medium is high-temperature adiabatic heat-conducting oil, which has a temperature resistance of more than 200 DEG C and a high thermal conductivity, and can avoid leakage to cause short circuit of the chip 18 and the electronic circuit, thereby protecting the safety of the circuit.

[0052] The liquid cooling framework, the liquid cooling module, the heat storage module and the second thermal insulation plug 14 are connected by uniformly distributed axial screws. The phase change material 11 is preferably paraffin, low-melting-point alloy or alloy salt. The manufacturing material of the liquid cooling framework is preferably aluminum alloy, stainless steel and beryllium bronze, and the heat storage module through shell 1001, the heat storage module upper end cover 1002, the heat storage module lower end cover 1003 and the heat storage module plug are made of stainless steel 304. The manufacturing material of the working mode switching valve 13 is preferably aluminum alloy or stainless steel, and the manufacturing material of the adiabatic bottle is preferably titanium alloy or stainless steel.

[0053] The heat dissipation device further comprises a controller for controlling the operation of the high-temperature-resistant circulating pump 7, the active cooling mechanism 20 and the working mode switching module.

[0054] The application also provides an internal and external double-liquid cooling heat dissipation method for a logging instrument, which uses the internal and external double-liquid cooling heat dissipation device for a logging instrument to cool the logging instrument in the downhole operation process and the out-of-well stage, respectively.

[0055] When the logging instrument works in the downhole high temperature environment: the heat dissipation device reduces the radial environmental heat leakage through the vacuum layer 3 of the adiabatic bottle, reduces the axial environmental heat leakage through the first heat insulation plug 2 and the second heat insulation plug 14; the chip 18 is placed on the liquid cooling framework, and the two are precisely attached through the thermal interface material 19 to reduce the contact thermal resistance, and the heat generated by the chip 18 is transported to the heat storage module for storage through the heat conduction process of the liquid cooling framework in the initial stage of work; the internal framework cooling pipeline 4 of the liquid cooling framework, the flow channel in the adapter 8, the high-temperature-resistant circulating pump 7, the liquid compensator 6, the heat storage module spiral pipeline 12 and the working mode switching valve 13 are connected to form a complete internal circulation pipeline system, wherein the internal framework cooling pipeline 4 is arranged in an S shape, and the heat storage module spiral pipeline 12 is arranged in a spiral shape, both of which are used for heat exchange enhancement, so that the heat of the chip 18 is transported to the phase change material 11 of the heat storage module for storage more quickly; when the chip 18 is about to reach the upper limit of the temperature resistance, the high-temperature-resistant circulating pump 7 is started to drive the circulating working medium to flow in the pipeline system, so that the heat generated by the chip 18 is forced to be transported to the heat storage module for storage, forced convection heat exchange replaces the heat conduction of the framework, greatly improves the speed of heat transportation from the chip 18 to the heat storage module, and realizes heat dissipation of the chip 18. In addition, the working time of the high-temperature-resistant circulating pump 7 can be reduced by delaying the start of the high-temperature-resistant circulating pump 7, so that the heat generated by the circulating pump is reduced, and the longest working time of the heat dissipation device is prolonged.

[0056] After the downhole high temperature environment work is completed, the rapid heat dissipation process is as follows: the high-temperature-resistant circulating pump 7 and the working mode switching valve 13 are closed, the external circulation quick connector 17 is used to connect the external circulation water outlet pipeline 15 and the cooling mechanism water inlet pipe 21, and the external circulation water inlet pipeline 16 and the cooling mechanism water outlet pipe are connected, so that the active cooling mechanism 20 is connected to the pipeline system. At this time, the working mode of the system is switched to the external circulation mode; the active cooling mechanism 20 is started, the high-temperature circulating working medium in the system enters the active cooling mechanism 20, and the temperature is rapidly reduced under the refrigeration effect of the active cooling mechanism 20, and then reenters the system under the driving of the circulating pump of the active cooling mechanism 20. At this time, the working medium shares the internal framework cooling pipeline 4 in the internal circulation mode, the flow channel in the adapter 8 and the heat storage module spiral pipeline 12, and realizes rapid heat dissipation of the system.

[0057] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present application, and is not used to limit the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A dual internal and external liquid cooling heat dissipation device for a well logging tool, characterized in that: The heat dissipation device includes an insulating bottle, a liquid-cooled frame, a liquid-cooled module, a heat storage module, a working mode switching valve, and an active cooling mechanism. The liquid-cooled frame, the liquid-cooled module, the heat storage module, and the working mode switching valve are connected in sequence and are all located inside the insulating bottle. The cooling pipes of the liquid-cooled frame, the flow channels in the liquid-cooled module, and the spiral channels of the heat storage module are connected in sequence to form a piping system. The working mode switching valve is connected to the piping system, and the active cooling mechanism is detachably connected to the piping system. The heat dissipation device can be switched between internal and external circulation modes by opening or closing the working mode switching valve; the internal circulation mode and the external circulation mode correspond to the downhole working state of the logging tool and the out-of-well state after the work is completed, respectively; when the heat dissipation device is in internal circulation mode, the active cooling mechanism is disconnected from the pipeline system; when the heat dissipation device is in external circulation mode, the active cooling mechanism is connected to the pipeline system.

2. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 1, characterized in that: The insulated bottle has a receiving cavity that extends through one end of the insulated bottle, forming a closed end and an open end. The receiving cavity is used to house the liquid-cooled frame, the liquid-cooled module, the heat storage module, and the operating mode switching valve. A vacuum layer is formed inside the wall of the receiving cavity. A first heat-insulating plug and a second heat-insulating plug are respectively provided at opposite ends of the receiving cavity, located at the closed end and the open end, respectively. The first heat-insulating plug and the second heat-insulating plug are respectively connected to the liquid-cooled frame and the heat storage module, and the operating mode switching valve is located inside the second heat-insulating plug.

3. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 2, characterized in that: The liquid-cooled frame has an S-shaped cooling pipe inside; the liquid-cooled frame has a first groove and a second groove, and the two chips of the logging instrument are respectively set in the first groove and the second groove. The two chips are respectively attached to the bottom surface of the first groove and the bottom surface of the second groove through a thermal interface material.

4. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 3, characterized in that: The liquid cooling frame has a first receiving groove and a second receiving groove respectively at opposite ends, and one end of the first heat insulation plug is disposed in the first receiving groove; the liquid cooling frame includes an upper liquid cooling frame and a lower liquid cooling frame connected to each other, and the first receiving groove and the second receiving groove are both formed by the upper liquid cooling frame and the lower liquid cooling frame; the first groove and the second groove are respectively formed on the upper liquid cooling frame and the lower liquid cooling frame.

5. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 4, characterized in that: The liquid cooling frame is sealed to the liquid cooling module through a sealing joint; the outer circumferential surface of the sealing joint is provided with a sealing joint O-ring groove, and a sealing ring is placed in the sealing joint O-ring groove to achieve sealing.

6. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 1, characterized in that: The thermal storage module includes multiple sealing joints, a thermal storage module shell, a thermal storage module spiral pipe, and a thermal storage module plug. The multiple sealing joints are respectively located at opposite ends of the thermal storage module shell. The thermal storage module is connected to the liquid cooling module and the active cooling mechanism through the multiple sealing joints. The thermal storage module spiral pipe is located inside the thermal storage module shell and is connected to the sealing joints. The thermal storage module plug is located at one end of the thermal storage module shell adjacent to the liquid cooling module.

7. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 6, characterized in that: The thermal storage module housing is cylindrical and includes an upper end cover, a through shell, and a lower end cover. The upper and lower end covers are respectively located at both ends of the through shell. The through shell has a third receiving groove that penetrates the through shell and is used to receive the spiral pipe of the thermal storage module. The third receiving groove is filled with a phase change material.

8. The internal and external dual liquid cooling heat dissipation device for logging tools as described in claim 1, characterized in that: The liquid cooling module includes an adapter, a liquid compensator, and a high-temperature circulating pump. The adapter has a through first flow channel and a second flow channel. One end of the first flow channel and the second flow channel are connected to both ends of the skeleton cooling pipe through a sealing joint, and the other end is connected to the spiral pipe of the heat storage module through a sealing joint. The high-temperature circulating pump is installed on the first flow channel, and the liquid compensator is installed on the second flow channel.

9. The internal and external dual liquid cooling heat dissipation device for a logging tool as described in claim 8, characterized in that: The active cooling mechanism is connected to the heat storage module through an external circulation rapid structure, and the working mode switching module is connected to the spiral pipe of the heat storage module.

10. A dual liquid cooling method for well logging tools, characterized in that: The heat dissipation method employs the internal and external dual liquid cooling heat dissipation device for logging tools as described in any one of claims 1-9 to dissipate heat and cool the logging tool. When the logging tool is operating downhole, the heat dissipation device adopts an internal circulation working mode for heat dissipation; when the logging tool returns to the outside of the well after the downhole operation is completed, the heat dissipation device adopts an external circulation working mode for heat dissipation.

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