Real-time solder nozzle process analysis using one or more cameras

Abstract

A selective welding machine is configured to adjust a solder wave provided by a selective welding nozzle based on at least one attribute detected by an image sensor of the selective welding machine. The selective welding nozzle may be configured to provide a solder wave to weld a portion of the workpiece. The image sensor may be configured to detect at least one property of the selective welding nozzle and / or the solder wave in real time. The selective welding machine may include a controller configured to adjust the solder wave provided by the selective welding nozzle based on the at least one attribute detected by the image sensor.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 392,888, filed on July 28, 2022, the contents of which are incorporated herein by reference as if set forth herein in its entirety. Technical Field

[0003] The present disclosure relates to a selective soldering machine and method for applying molten solder to a workpiece, and more particularly to a selective soldering machine and method for adjusting a solder wave based on a real-time visual image of the solder wave. Background Art

[0004] In a wave soldering machine, a printed circuit board ("PCB") is moved by a conveyor over the top of a fixed wave solder nozzle that spans the entire width of the PCB. Heat-sensitive components disposed on the bottom side of the PCB must be shielded by a protective fixture. In addition, PCBs with components disposed on the bottom side that exceed a predetermined height (e.g., more than a quarter inch high) cannot be soldered on a wave soldering machine because these components will collide with the wave solder nozzle during operation.

[0005] In contrast, selective soldering machines are advantageous because they can apply molten solder to individual pins or groups of pins of components on a substrate without interfering with other components that do not need to be soldered or cannot withstand the heating effects of, for example, a wave soldering machine. In the case of selective soldering, a small surge (e.g., column) of solder is provided / formed using a vertically oriented selective soldering nozzle, and the nozzle and surge of solder are selectively raised to engage the PCB holes through which the pins of the component extend or through which the grouping of pins / holes extend. In this regard, the surge of solder applies solder to the pins of the component or the grouping of pins of the component, respectively. The selective solder nozzle may be wettable, and thus the solder may adhere to the surface of the corresponding selective solder nozzle as the solder flows upward through the output of the corresponding selective solder nozzle and then flows downward along one side of the corresponding selective solder nozzle.

[0006] However, variations from ideal wave properties (eg, wave height) may result in imperfect welding of such pins or pin groupings. Summary of the invention

[0007] The present application provides a selective soldering machine, which is configured to adjust a solder wave provided by a selective soldering nozzle based on at least one attribute detected by an image sensor of the selective soldering machine. The selective soldering nozzle can be configured to provide a solder wave to solder a portion of a workpiece. The image sensor can be configured to detect at least one attribute of the selective soldering nozzle and / or the solder wave in real time. The selective soldering machine may include a controller configured to adjust the solder wave provided by the selective soldering nozzle based on at least one attribute detected by the image sensor.

[0008] According to one embodiment of the present disclosure, a selective soldering machine includes a selective soldering nozzle configured to provide a solder wave to solder a portion of a workpiece. The selective soldering machine may include at least one image sensor configured to detect at least one property of the selective soldering nozzle and / or the solder wave in real time. The selective soldering machine may include a controller configured to adjust the solder wave provided by the selective soldering nozzle based on at least one property detected by the at least one image sensor.

[0009] According to another embodiment of the present disclosure, a method of applying solder to a workpiece may include providing a solder wave using a selective soldering nozzle. The method may include detecting at least one property of the selective soldering nozzle and / or the solder wave in real time using at least one image sensor. The method may include adjusting the solder wave provided by the selective soldering nozzle based on at least one property detected by the at least one image sensor using a controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The foregoing summary, as well as the following detailed description of illustrative embodiments of the selective soldering machine of the present application, will be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the selective soldering machine of the present application, illustrative embodiments are shown in the accompanying drawings. It should be understood, however, that the present application is not limited to the precise arrangements and instrumentalities shown. In the drawings:

[0011] Figure 1 is an oblique view of a selective soldering machine according to aspects of the present disclosure;

[0012] Figure 2 yes Figure 1 An oblique view of a welding area of ​​a selective welding machine;

[0013] Figure 3 A schematic representation of the nozzle and camera is shown. Figure 1 A side view of a selective soldering machine;

[0014] Figure 4 is a front view of a display interface screen for monitoring and / or controlling a selective welding machine;

[0015] Figure 5is a front view of a display screen including multiple camera views of a solder wave;

[0016] Figure 6A-6F each being a front view of a display screen including a plurality of camera views at various stages of a solder wave conditioning process throughout a plurality of selective soldering nozzles;

[0017] Figure 7 is a front view of multiple representations of a solder wave and a corrected solder wave;

[0018] Figure 8 is a front view of a portion of a display screen including a camera view and properties of a selective soldering nozzle and a solder wave;

[0019] Fig. 9 is a graph showing wave height, pump speed, and pump speed error over time; and

[0020] Fig.10 It is the wave height check control block diagram. DETAILED DESCRIPTION

[0021] The present disclosure may be more readily understood by reference to the following detailed description in conjunction with the accompanying drawings and examples, which form a part of the present disclosure. It should be understood that the present disclosure is not limited to the specific devices, methods, applications, conditions or parameters described and / or shown herein, and that the terms used herein are for the purpose of describing specific embodiments by way of example only, and are not intended to limit the scope of the present disclosure. In addition, as used in the specification including the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" include the plural, and references to a particular numerical value include at least that particular value.

[0022] As used herein, the term "plurality" means more than one. When a range of values ​​is expressed, another embodiment includes from one particular value and / or to another particular value. Similarly, when a value is expressed as an approximation by using the antecedent "about," it will be understood that the particular value forms another embodiment. All ranges are inclusive and combinable.

[0023] Current systems for inspecting solder nozzle quality are limited to inspecting the solder wave height by measuring it against a fixed sensor or probe at intervals and by an operator visually inspecting a video stream. Figure 1 The selective soldering machine 20 shown may include a selective soldering area 22, a heating area 24, and a flux application area 26. The selective soldering machine 20 may include a controller 30, which controls the selective soldering machine 20 to perform a selective soldering operation. Figure 1The controller 30 may be operably coupled to the selective soldering region 22 , the heating region 24 , and / or the flux application region 26 , such that the controller 30 is configured to control the selective soldering region 22 , the heating region 24 , and / or the flux application region 26 .

[0024] Reference now Figure 2 The selective soldering area 22 may include a movable selective soldering body 40, one or more solder pots 42a, 42b, one or more selective soldering nozzles 44a, 44b, and one or more image sensors 50a, 50b (eg, cameras).

[0025] Each image sensor 50a, 50b may be configured to check a number of process values ​​related to solder nozzle quality such as (but not limited to): size, height, correct position in the riser, solder wave height, solder wave shape, nozzle body flow, and / or oxidation level.

[0026] The controller 30 may be operably coupled to each image sensor 50a, 50b such that the controller 30 is configured to receive image data from each image sensor 50a, 50b, such as in Figure 2 Schematically represented by dashed lines in FIG. For example, the controller 30 may be configured to control one or two solder pots 42a, 42b and / or one or two selective soldering nozzles 44a, 44b based on the image data. In an embodiment, the controller is operably coupled to one or more of the selective soldering nozzles 44a, 44b and one or more of the image sensors 50a, 50b.

[0027] The controller 30 is operably coupled to one or more displays 28a, 28b of the selective welding machine 20, such as in Figure 1 For example, the controller 30 may be configured to communicate with one or both displays 28a, 28b.

[0028] Image data can be collected and analyzed in real time without the presence of an operator (e.g., by the controller 30), and the controller 30 will automatically take action. For example, the controller 30 can operate software to automatically correct the problem or stop / pause the welder to notify the operator.

[0029] Each selective soldering nozzle 44a, 44b may be configured to provide a solder wave to solder a workpiece (e.g., Figure 594a). For example, each solder wave can be generated at the outlet of the corresponding selective soldering nozzle 44a, 44b. One or more pumps 52a, 52b can be configured to generate each solder wave by pumping solder from one or more solder pots 42a, 42b to the corresponding selective soldering nozzle 44a, 44b. The pumps 52a, 52b can be part of the corresponding solder pots 42a, 42b.

[0030] Each selective soldering nozzle 44a, 44b can be moved along a machine direction (e.g., along a longitudinal axis X), a direction orthogonal to the machine direction (e.g., along a transverse axis Y), and / or along a vertical direction orthogonal to both the machine direction and the direction orthogonal to the machine direction (e.g., along a vertical axis Z) to selectively apply solder to a workpiece (e.g., at its bottom).

[0031] The image sensors 50a, 50b (e.g., at least one, at least two, or more than two image sensors) can each be configured to detect at least one property of the selective soldering nozzle and / or the solder wave in real time. For example, each of the image sensors 50a, 50b can be configured to detect at least one of the size of the selective soldering nozzles 44a, 44b, the height of the selective soldering nozzles 44a, 44b, the position of the selective soldering nozzles 44a, 44b in the riser, the size of the solder wave, the height of the solder wave, the shape of the solder wave, the nozzle body flow, and / or the oxidation level of the solder wave.

[0032] The image sensors 50a, 50b may each be directed toward a corresponding selective soldering nozzle 44a, 44b. For example, each image sensor 50a, 50b may have a corresponding line of sight 54 (at Figure 3 ), which can be directed toward the outlets of the corresponding selective soldering nozzles 44a, 44b (e.g., with Figure 3 4 ).

[0033] Real-time detection includes detection at least every 0.2 seconds. For example, each image sensor can detect at least one attribute of the selective soldering nozzle and / or the solder wave every 0.001 seconds to 0.2 seconds. In some embodiments, real-time detection of at least one attribute includes detecting the at least one attribute at least every 1 second, 0.1 second, 0.01 second, 0.001 second, and / or 0.0001 second.

[0034] The controller 30 may be configured to adjust the solder wave provided by the corresponding selective soldering nozzle 44a, 44b based on at least one property detected by the image sensor 50a, 50b. The controller 30 may be configured to adjust the solder wave based on at least one of the size of the selective soldering nozzle 44a, 44b, the height of the selective soldering nozzle 44a, 44b, the position of the selective soldering nozzle 44a, 44b in the riser, the size of the solder wave, the height of the solder wave, the shape of the solder wave, the nozzle body flow, and / or the oxidation level of the solder wave.

[0035] The controller 30 may be configured to analyze each frame of image data detected by at least one image sensor 50a, 50b to determine whether to adjust the solder wave, and the controller 30 may be configured to adjust the solder wave in response to determining that the solder wave should be adjusted. In an embodiment, the selective soldering machine 20 (e.g., the controller 30 of the selective soldering machine 20) may record a video stream of a camera (an example of an image sensor) and each frame of the video stream, which may analyze the data (e.g., any one or any combination of the above attributes). The selective soldering machine 20 (e.g., the controller 30) may then apply filters and algorithms to determine any one or all of the processing values. The selective soldering machine 20 (e.g., the controller 30) may then feed the data back to the software to allow it to act accordingly (e.g., adjust the solder wave).

[0036] The controller 30 may be configured to provide a prompt to the operator in response to determining that the solder wave should be adjusted. The controller 30 may include a processor 60, a memory 62, a display (e.g., one or both of the displays 28a, 28b), a user interface 64 (e.g., a keyboard), etc. The processor 60 may be a central processing unit, a microprocessor, dedicated hardware, etc. configured to execute instructions (including instructions associated with a software program). In one aspect, the controller may be implemented with a wireless phone, etc., configured to provide additional functionality as defined herein.

[0037] Each display 28a, 28b may be a liquid crystal display with a backlight to illuminate various colored liquid crystals to provide a color display. The displays 28a, 28b may each be a light emitting diode display (LED), an electroluminescent display (ELD), a plasma display panel (PDP), a liquid crystal display (LCD), an organic light emitting diode display (OLED), a quantum dot LED (QLED), or any other display technology.

[0038] The user interface 64 may be any type of physical input having one or more buttons, switches, etc. and / or may be implemented as a touch screen.

[0039] In or separately from the memory 62, the controller 30 may also include a computer readable memory, an operating system, a communication component, a contact / motion component, a touch screen controller, a graphics component, etc. The operating system, together with the various components, provides software functionality for each component of the controller. The controller may also include a read-only memory (ROM) and a power supply.

[0040] The memory 62 may include a high-speed random access memory. The memory 62 may also be a non-volatile memory, such as a magnetic fixed disk memory, a flash memory, etc. The various components of the controller may be connected via various communication lines including a data bus. In addition, the controller 30 may include an input / output device. The input / output device may include an analog-to-digital converter and a digital-to-analog converter.

[0041] Each image sensor 50a, 50b can capture video in conjunction with an input / output device. The image sensors 50a, 50b can include a charge coupled device (CCD), a CMOS image sensor, a back-illuminated CMOS, etc. The images captured by the image sensors 50a, 50b can be converted and stored in various formats. The image sensors 50a, 50b can include a lens.

[0042] refer to Figure 1 , the selective soldering machine 20 may include a conveyor 70. The conveyor 70 may be configured to move one or more workpieces (not shown), for example, along a machine direction. The workpiece may be a PCB, which may include a plurality of exposed component pins. The workpiece may be continuously and sequentially conveyed by the conveyor 70 along the machine direction through the flux application area 26, the heating area 24, and the selective soldering area 22. The controller 30 may control the conveyor 70 to continuously convey the workpiece through the flux application area 26, the heating area 24, and the selective soldering area 22 to control the application of flux, heat, and / or solder at each corresponding area.

[0043] Compared to existing soldering machines, the selective soldering machine 20 can add more processing data in real time, which can be used to determine solder nozzle quality without requiring an operator to monitor a video stream. The selective soldering machine 20 may also not require a fixed sensor or probe, as in some existing selective soldering systems, where the selective soldering nozzles 44a, 44b need to travel for verifying the corresponding nozzle heights.

[0044] Because the selective soldering machine 20 operates in real time (eg, the image sensors 50a, 50b provide image data of the selective soldering nozzles 44a, 44b and / or solder wave), it also removes the need to travel to specific locations in the soldering machine, which may provide reduced cycle times.

[0045] The selective soldering machine 20 may advantageously greatly improve the overall soldering quality of the process. The selective soldering machine may advantageously reduce the overall cost of the soldering machine. The selective soldering machine may advantageously provide the user / customer with more data about the solder nozzle. The selective soldering machine may advantageously improve the cycle time and / or performance of the solder nozzle / wave condition.

[0046] Reference now Figure 4 , the display 28a can be configured to display an interface screen 90. For example, the interface screen 90 can include a representation of the selective welding machine 20 and representations of various control settings and / or properties of the selective welding machine 20. The control settings and / or properties can relate to, for example, Figure 1 The selective soldering zone 22 (also referred to as the solder zone), the heating zone 24 (also referred to as the preheat zone), the flux application zone 26 (also referred to as the flux zone), and / or the conveyor 70 are shown in FIG.

[0047] Steering Figure 5 , another display 28b can be configured to display a first dashboard screen 92. The first dashboard screen 92 can include multiple camera views of solder waves generated in real time by corresponding selective soldering nozzles of the selective soldering machine 20. The first dashboard screen 92 can include multiple camera views of one or more workpieces 94a-94b at various stages within the selective soldering machine 20, as well as status details for each area of ​​the selective soldering machine 20.

[0048] Steering Figure 6A-6F , another display 28b may be configured to display an adjustment dashboard screen 100 that includes one or more camera views of a solder wave generated in real time by a corresponding selective soldering nozzle of the selective soldering machine 20 at various stages of the solder wave adjustment process. FIG. 6A to FIG. 6F A representation of the transition of the camera views through the solder wave adjustment process is provided. In an embodiment, one or more camera views are represented on an adjustment dashboard screen.

[0049] For example, in Fig. 6A In FIG. 1 , the adjustment dashboard screen 100 includes real-time representations of five different solder waves generated by corresponding selective soldering nozzles prior to a solder wave adjustment process (eg, after a previous soldering process has been completed). Figure 6B In FIG. 1 , the adjustment dashboard screen 100 includes a real-time representation of five different solder waves during a second stage of the solder wave adjustment process, wherein each soldering process of a different solder wave is stopped. Figure 6C, the adjustment dashboard screen 100 includes real-time representations of five different solder waves at a third stage of the solder wave adjustment process, wherein the controller 30 measures the wave height of each solder wave. The adjustment dashboard screen 100 may include one or more representations 110a-110e (as described below with reference to the wave height measurement) that may be displayed as mapped to each respective solder wave at the third stage. Figure 8 discussed). Fig.6D , the adjustment dashboard screen 100 includes a real-time representation of five different solder waves at a fourth stage of the solder wave adjustment process, wherein the controller 30 adjusts the wave height of each solder wave (eg, to a predetermined wave height).

[0050] exist Fig. 6E , the adjustment dashboard screen 100 includes a real-time representation of five different solder waves at a fifth stage of the solder wave adjustment process, wherein the controller 30 stabilizes the wave height of each solder wave (eg, at a predetermined wave height). Fig. 6F , the tuning dashboard screen 100 includes a real-time representation of five different solder waves after the tuning process is complete. Fig. 6F The adjustment dashboard screen 100 in FIG. 1 may include a representation 110 b of a wave height measurement generated by the controller 30 to verify that the corresponding wave height is at a predetermined height.

[0051] Figure 7 Additional examples of solder waves that are adjusted (also referred to as calibrated) to a predetermined height are provided. Figure 7 As shown, the controller 30 may crop the lower portion 112a, 112b of the representation of the solder wave for analysis and / or comparison to a predetermined threshold.

[0052] Steering Figure 8 , each window of the dashboard screen 100 may include a plurality of attributes and / or visual representations. For example, one window 120 of the dashboard screen 100 may include a representation 110d of a wave height measurement and a nozzle size 130. The representation 110d of the wave height measurement may be confined within a measurement area 132a and may include a top 132b of a nozzle reference and a top 132c of a wave real-time representation.

[0053] The nozzle size measurement 132d may be represented within the measurement area 132a. In an embodiment, the wave height adjustment may not be based on the nozzle size measurement 132d.

[0054] Fig. 9 Graphs showing wave height, pump speed, and pump speed error over time during a solder wave adjustment process are shown. For example, the controller 30 may control the pump 52a to adjust the corresponding solder wave height to a predetermined wave height. Fig. 9As shown, during the fast control period, the controller 30 may increase the pump speed of the pump 52 to or above the wave height set point corresponding to the predetermined wave height. At the end of the fast control period, the controller 30 may adjust (e.g., reduce and / or increase) the pump speed of the pump 52 to the wave height set point more slowly during the slow control period than during the fast control period. After the slow control period, the controller 30 may perform stabilization control to reach the wave height set point so that when the wave height check is completed, the weight height remains at the wave height set point without significant changes.

[0055] Steering Fig.10 , schematically illustrates an example of a wave height check control block diagram. For example, an image sensor (e.g., camera) 150 with a wave check filter block may output an actual value wave height block 152 to a wave height check proportional-integral-derivative ("PID") controller block 154. The wave height check PID controller block 154 may receive a wave height check set point corresponding to a predetermined wave height and output a pump speed set point received by a wave height processing block 156. A wave height processing disturbance may be input to the wave height processing block 156, which may provide a pump speed actual value.

[0056] The actual value of the pump speed may be input back into the image sensor using the wave check filter block 150. Thus, feedback of the actual value of the pump speed is provided to the image sensor using the wave check filter block 150, thereby providing a second or more iterations of the adjustment process described above.

[0057] The image sensor with wave check filter block 150 may include an image source block 160 (e.g., a camera source block) that may provide an output to a camera single frame block 162. The camera single frame block 162 may provide an output that undergoes a Sobel matrix transformation (e.g., performed by the controller 30) and is provided to a differential in an XY block 164. The output of the differential in the XY block 164 may be changed to polar coordinates (e.g., by the controller 30) and received by an image with magnitude only polar coordinates block 166. The output of the image with magnitude only polar coordinates block 166 may be changed to grayscale and received by a line drawing with edge pixel block 168. The output of the line drawing with edge pixel block 168 may be subjected to a find highest edge pixel process that is directed to the actual value wave height block 152.

[0058] The controller 30 may be configured to perform the processes and / or functions of the wave height check control block diagram.

[0059] The terms used herein are only used for the purpose of describing specific aspects and are not intended to limit the present disclosure. As used herein, the singular forms "a", "an" and "the" are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "include", "comprise", "cover" and / or "contain" when used herein specify the presence of the features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0060] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It should also be understood that the terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant field, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this document.

[0061] In addition, according to various aspects of the present disclosure, the methods described herein are intended for operations implemented using dedicated hardware, including but not limited to PCs, PDAs, semiconductors, application-specific integrated circuits (ASICs), programmable logic arrays, cloud computing devices, and other hardware devices configured to implement the methods described herein.

[0062] It should also be noted that the software implementations of the present disclosure as described herein are optionally stored on tangible storage media, such as: magnetic media, such as disks or tapes; magneto-optical or optical media, such as disks; or solid-state media, such as memory cards or other packages containing one or more read-only (non-volatile) memories, random access memories, or other rewritable (volatile) memories. Digital file attachments to e-mails or other self-contained information archives or archives are considered distribution media equivalent to tangible storage media. Therefore, the present disclosure is considered to include tangible storage media or distribution media as listed herein, and including art-recognized equivalents and successor media in which the software implementations of this document are stored.

[0063] In addition, various aspects of the present disclosure may be implemented in non-general purpose computer implementations. In addition, various aspects of the present disclosure set forth herein improve the functionality of a system as will be apparent from the disclosure herein. In addition, various aspects of the present disclosure relate to computer hardware that is specifically programmed to solve the complex problems solved by the present disclosure. Therefore, various aspects of the present disclosure generally improve the functionality of a system in its specific implementation to perform the processing set forth in the present disclosure and defined by the claims.

[0064] Aspects of the present disclosure may be implemented in any type of computing device, such as, for example, a desktop computer, a personal computer, a laptop / mobile computer, a personal digital assistant (PDA), a mobile phone, a tablet computer, a cloud computing device, etc., which has wired / wireless communication capabilities via a communication channel.

[0065] Artificial intelligence and / or machine learning can utilize any number of approaches, including one or more of cybernetics and brain simulation, symbolic, cognitive simulation, logic-based, anti-logic, knowledge-based, sub-symbolic, embodied intelligence, computational intelligence and soft computing, machine learning and statistics, etc.

[0066] The many features and advantages of the present disclosure are apparent from the detailed description, and thus, the appended claims are intended to cover all such features and advantages of the present disclosure that fall within the true spirit and scope of the present disclosure. Furthermore, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the present disclosure to the exact construction and operation illustrated and described, and thus, all suitable modifications and equivalents that may be employed fall within the scope of the present disclosure.

[0067] The following are several non-limiting examples of aspects of the disclosure.

[0068] In one general aspect, a selective soldering machine may include a selective soldering nozzle configured to provide a solder wave to solder a portion of a workpiece. The selective soldering machine may also include at least one image sensor configured to detect at least one attribute of the selective soldering nozzle and / or the solder wave in real time. The selective soldering machine may also include a controller configured to adjust the solder wave provided by the selective soldering nozzle based on at least one attribute detected by the at least one image sensor. Other embodiments of this aspect include corresponding computer systems, devices, and computer programs recorded on one or more computer storage devices, each configured to perform the actions of the method.

[0069] Embodiments may include one or more of the following features. In the selective soldering machine, the controller is configured to adjust the solder wave based on at least one of the size of the selective soldering nozzle, the height of the selective soldering nozzle, the position of the selective soldering nozzle in the riser, the size of the solder wave, the height of the solder wave, the shape of the solder wave, the nozzle body flow and / or the oxidation level of the solder wave. In the selective soldering machine, the at least one image sensor is configured to detect at least one attribute of the solder wave in real time. In the selective soldering machine, the controller is configured to analyze each frame of image data detected by the at least one image sensor to determine whether to adjust the solder wave. In the selective soldering machine, the controller is configured to adjust the solder wave in response to determining that the solder wave should be adjusted. In the selective soldering machine, the controller is configured to provide a prompt to an operator in response to determining that the solder wave should be adjusted. The selective soldering machine may include a first solder tank configured to provide solder to the selective soldering nozzle. In the selective welding machine, the selective welding nozzle is a first selective welding nozzle; and wherein the selective welding machine may further include: a second selective welding nozzle, which is configured to provide a solder wave to weld another part of the workpiece. In the selective welding machine, at least one other image sensor is configured to detect at least one attribute of the solder wave provided by the second selective welding nozzle in real time. In the selective welding machine, the controller is configured to adjust the solder wave provided by the second selective welding nozzle based on the at least one attribute detected by the at least one other image sensor. The selective welding machine may include a second solder tank configured to provide solder to the second selective welding nozzle. Implementations of the described techniques may include hardware, methods or processes or computer tangible media.

[0070] In one general aspect, a method may include providing a solder wave using a selective soldering nozzle. The method may also include detecting at least one property of the selective soldering nozzle and / or the solder wave in real time using at least one image sensor. The method may also include adjusting the solder wave provided by the selective soldering nozzle based on at least one property detected by the at least one image sensor using a controller. Other embodiments of this aspect include corresponding computer systems, devices, and computer programs recorded on one or more computer storage devices, each configured to perform the actions of the method.

[0071] Implementations may include one or more of the following features. In the method, a controller adjusts the solder wave based on at least one of a size of a selective soldering nozzle, a height of a selective soldering nozzle, a position of a selective soldering nozzle in a riser, a size of a solder wave, a height of a solder wave, a shape of a solder wave, a nozzle body flow, and / or an oxidation level of the solder wave. The method may include applying solder from a selective soldering nozzle to a target portion of a workpiece. In the method, the at least one image sensor detects at least one attribute of the solder wave in real time. In the method, the controller adjusts the solder wave in response to determining that the solder wave should be adjusted. In the method, the controller provides a prompt to an operator in response to determining that the solder wave should be adjusted. The method may include providing solder to a selective soldering nozzle with a first solder pot. In the method, the selective soldering nozzle is a first selective soldering nozzle, and wherein the method may further include providing a solder wave using a second selective soldering nozzle to solder another portion of the workpiece. The method may include detecting at least one attribute of the solder wave provided by the second selective soldering nozzle in real time using at least one other image sensor. Implementations of the described techniques may include hardware, methods, or processes or computer tangible media.

[0072] It should be noted that the illustration and description of the examples shown in the accompanying drawings are for exemplary purposes only and should not be construed as limiting the present disclosure. It will be appreciated by those skilled in the art that the present disclosure contemplates various examples. In addition, it should be appreciated that the concepts described above with the above examples may be used alone or in combination with any other examples described above. It should also be appreciated that, unless otherwise noted, the various alternative examples described above with respect to an illustrated example may be applied to all examples as described herein.

[0073] Unless expressly stated otherwise or otherwise understood in the context of use, conditional language used herein (e.g., "can," "can," "might," "may," "could," "for example," etc.) is generally intended to convey that certain embodiments include and other embodiments do not include certain features, elements, and / or steps. Thus, such conditional language is generally not intended to imply that features, elements, and / or steps are in any way required for one or more examples, or that one or more examples necessarily include these features, elements, and / or steps. The terms "comprise," "include," "have," etc. are synonymous and are used inclusively in an open-ended manner, and do not exclude additional elements, features, actions, operations, etc.

[0074] Although the present disclosure has been described in detail, it should be understood that various changes, substitutions and modifications may be made herein without departing from the spirit and scope of the present disclosure as defined by the appended claims. In addition, any embodiment disclosed herein may be combined with the features disclosed with respect to any other embodiment disclosed herein. In addition, the scope of the present disclosure is not intended to be limited to the specific embodiments described in the specification. As will be readily understood by those of ordinary skill in the art, according to the present disclosure, processes, welders, manufactures, material compositions, devices, methods or steps that perform substantially the same functions or achieve substantially the same results as the corresponding embodiments described herein that currently exist or are developed may be utilized.

[0075] It should be understood that the steps of the exemplary methods set forth herein do not necessarily need to be performed in the order described, and the order of the steps of these methods should be understood to be merely exemplary. Likewise, in methods consistent with various embodiments of the present invention, additional steps may be included, and certain steps may be omitted or combined.

[0076] Although elements in the following method claims, if any, are recited in a specific sequence with corresponding labels, those elements are not necessarily intended to be limited to being implemented in that specific order unless the claim recitation otherwise implies a specific sequence for implementing some or all of those elements.

[0077] It should be understood that references to "a" or "an" herein to describe a feature such as a component or step do not exclude additional features or multiples of features. For example, reference to a device having or defining "one" of a feature does not exclude the device having or defining more than one feature, as long as the device has or defines at least one of the features. Similarly, references to "one" of multiple features herein do not exclude the invention from including two or more, up to all features. For example, reference to a device having or defining "one of X and Y" does not exclude the device having both X and Y.

Claims

1. A selective welding machine, comprising: a selective soldering nozzle configured to provide a solder wave to solder a portion of a workpiece; at least one image sensor configured to detect at least one property of the selective soldering nozzle and / or the solder wave in real time; as well as A controller is configured to adjust a solder wave provided by the selective soldering nozzle based on the at least one property detected by the at least one image sensor.

2. The selective welding machine according to claim 1, wherein: The controller is configured to adjust the solder wave based on at least one of: a size of the selective soldering nozzle, a height of the selective soldering nozzle, a position of the selective soldering nozzle in a riser, a size of the solder wave, a height of the solder wave, a shape of the solder wave, a nozzle body flow, and / or an oxidation level of the solder wave.

3. The selective welding machine according to any one of claims 1 to 2, wherein: The at least one image sensor is configured to detect at least one property of the solder wave in real time.

4. The selective welding machine according to any one of claims 1 to 3, wherein: The controller is configured to analyze each frame of image data detected by the at least one image sensor to determine whether to adjust the solder wave.

5. The selective welding machine according to any one of claims 1 to 4, wherein: The controller is configured to adjust the solder wave in response to determining that the solder wave should be adjusted.

6. The selective welding machine according to any one of claims 1 to 5, wherein: The controller is configured to provide a prompt to an operator in response to determining that the solder wave should be adjusted. 7 . The selective soldering machine according to claim 1 , further comprising a first solder pot configured to supply solder to the selective soldering nozzle.

8. The selective welding machine according to any one of claims 1 to 7, wherein: The selective welding nozzle is a first selective welding nozzle; and Among them, the selective welding machine also includes: A second selective soldering nozzle is configured to provide a solder wave to solder another portion of the workpiece.

9. The selective welding machine according to claim 8, wherein: At least one other image sensor is configured to detect in real time at least one property of the solder wave provided by the second selective soldering nozzle. 10 . The selective soldering machine according to claim 8 , further comprising a second solder pot configured to supply solder to the second selective soldering nozzle.

11. The selective welding machine according to any one of claims 9 or 10, wherein: The controller is configured to adjust a solder wave provided by the second selective soldering nozzle based on the at least one property detected by the at least one other image sensor.

12. A method of applying solder to a workpiece, the method comprising: A solder wave is provided using a selective soldering nozzle; Detecting at least one property of the selective soldering nozzle and / or the solder wave in real time using at least one image sensor; as well as A solder wave provided by the selective soldering nozzle is adjusted, with a controller, based on the at least one property detected by the at least one image sensor.

13. The method according to claim 12, wherein: The controller adjusts the solder wave based on at least one of: a size of the selective soldering nozzle, a height of the selective soldering nozzle, a position of the selective soldering nozzle in a riser, a size of the solder wave, a height of the solder wave, a shape of the solder wave, a nozzle body flow, and / or an oxidation level of the solder wave.

14. The method according to any one of claims 12 or 13, further comprising: Solder is applied from the selective soldering nozzle to a target portion of a workpiece.

15. The method according to any one of claims 12 to 14, wherein: The at least one image sensor detects at least one property of the solder wave in real time.

16. The method according to any one of claims 12 to 15, wherein: The controller adjusts the solder wave in response to determining that the solder wave should be adjusted.

17. The method according to any one of claims 12 to 16, wherein: The controller provides a prompt to an operator in response to determining that the solder wave should be adjusted.

18. The method according to any one of claims 12 to 17, further comprising: Solder is supplied to the selective soldering nozzle using a first solder pot.

19. The method according to any one of claims 12 to 18, wherein: The selective soldering nozzle is a first selective soldering nozzle, and wherein the method further comprises: A solder wave is provided using a second selective soldering nozzle to solder another portion of the workpiece.

20. The method according to claim 19, further comprising: At least one property of the solder wave provided by the second selective soldering nozzle is detected in real time using at least one other image sensor.

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