Micro-jet ultra-high heat flux density cooling experiment device based on wake flow suction

Abstract

The embodiment of the invention discloses a micro-jet boiling ultra-high heat flux cooling experiment device based on wake flow suction. The micro-jet boiling ultra-high heat flux cooling experiment device comprises a sealing cover, a micro-jet pipe, a wake flow suction pipe and a pressure supplementing pipeline, the sealing cover is used for sealing and covering a heat transfer surface of a to-be-cooled part; a plurality of groups of micro-jet pipes and wake flow suction pipes are arranged in one-to-one correspondence, the micro-jet pipes in the same group are coaxially sleeved in the wake flow suction pipes, and the micro-jet pipes and the wake flow suction pipes in groups are distributed along the surface array of the heat transfer surface; a set distance is kept between one ends, penetrating into the sealing cover, of the wake flow suction pipe and the micro-jet pipe and the heat transfer surface; the end, away from the heat transfer face, of the micro-jet pipe communicates with the jet device. One end, far away from the heat transfer surface, of the wake flow suction pipe and the part, surrounding the micro-jet pipe, of the wake flow suction pipe are communicated to a suction pump; and the pressure supplementing pipeline penetrates through the sealing cover and is communicated with the atmosphere. According to the embodiment of the invention, wake flow and boiling bubbles can be removed in an active suction mode, and a solution is provided for the current ultrahigh heat flux cooling requirement.

Description

Technical Field

[0001] The present application relates to the technical field of jet boiling heat transfer enhancement, and in particular to a micro jet boiling ultra-high heat flux density cooling experimental device based on wake suction. Background Art

[0002] High heat flux cooling technology is a technology that is generally required in various industries such as energy, power and chips. As electronic products develop towards miniaturization and high power, the heat generation is more concentrated and the heat flux density continues to increase. Especially in the fields of high-performance electronic chips, data centers and new energy power equipment, the overheating problem caused by high heat flux density has become a problem that needs to be solved.

[0003] Among many different types of cooling technologies, jet boiling has become a hot topic of research due to its significant potential for dealing with high heat flux density heat dissipation. However, from the perspective of the essential mechanism and characteristics of jet and boiling phenomena, although the jet itself has the effect of enhancing heat transfer, strong jets will cause bubbles to accumulate near the heat transfer surface and are difficult to separate, leading to the occurrence of critical heat flux density. In addition, the problem of wake retention is prone to occur after the jet impact, which restricts the further improvement of the heat transfer capacity of jet boiling.

[0004] Although the critical heat flux of jet boiling can be improved by removing the wake flow passively by gravity or by designing cooling modules, the effect is not ideal. Therefore, if the wake flow can be effectively removed during the jet process, it is possible to prevent the accumulation of liquid layer and bubbles near the heat transfer surface and further improve the critical heat flux. Summary of the invention

[0005] In order to solve at least one of the problems mentioned in the background technology, an embodiment of the present application provides a microjet boiling ultra-high heat flux density cooling experimental device based on wake suction, which can use active suction to remove wake and boiling bubbles, providing a solution to the current ultra-high heat flux density cooling needs.

[0006] In order to achieve the above-mentioned purpose, the embodiment of the present application provides a micro jet boiling ultra-high heat flux cooling experimental device based on wake suction, including a sealing cover, a micro jet tube, a wake suction tube and a pressure compensation pipe;

[0007] The sealing cover is used to seal the heat transfer surface of the part to be cooled;

[0008] The micro jet tubes and the wake suction tubes are arranged in a plurality of groups corresponding to each other, and the micro jet tubes in the same group are coaxially sleeved in the wake suction tubes, and the micro jet tubes and the wake suction tubes in the group are arranged perpendicular to the heat transfer surface and distributed in an array along the surface of the heat transfer surface, and the tube holes of the micro jet tubes and the wake suction tubes have a size of hundreds of micrometers to millimeters;

[0009] A set distance is maintained between one end of the tail flow suction pipe and the micro-fluidic pipe that penetrates into the sealing cover and the heat transfer surface;

[0010] One end of the microfluidic tube away from the heat transfer surface is connected to the ejector;

[0011] One end of the tail flow suction pipe away from the heat transfer surface and the portion of the tail flow suction pipe surrounding the micro jet tube are connected to a suction pump;

[0012] The pressure compensation pipeline passes through the sealing cover and communicates with the atmosphere.

[0013] In an achievable implementation, the cross-sectional shape of the wake suction pipe corresponds to the shape of the heat transfer surface;

[0014] Preferably, the shape of the heat transfer surface includes a square or a rectangle, and the cross-sectional shape of the wake suction pipe is a square ring or a rectangular ring accordingly.

[0015] In a feasible implementation, the microfluidic tube comprises a round tube, and the wake suction tube comprises a square tube.

[0016] In a feasible implementation, the inner diameter of the tube hole of the micro jet tube is 0.3 mm-0.5 mm, and the inner side length of the tube hole of the wake flow suction tube is 1.5 mm-1.7 mm.

[0017] In an achievable embodiment, each of the plurality of microfluidic tubes is connected to one of the ejectors, or a set number of the microfluidic tubes are connected to one of the ejectors via a common ejection channel;

[0018] Each of the plurality of wake suction pipes is connected to one of the suction pumps, or a set number of the wake suction pipes are connected to one of the suction pumps via a common wake suction pipeline.

[0019] In an achievable embodiment, the cooling device further comprises a first support seat, a second support seat and a base which are sealed and connected in sequence from top to bottom, a jet pipe is arranged on the first support seat, a wake suction pipe and a pressure compensation pipe are arranged on the second support seat, a mounting groove is arranged on the top surface of the base, and the cooling member is arranged at the bottom of the mounting groove;

[0020] The micro jet tube passes through the second support seat from top to bottom, the upper end is connected to the jet pipeline via the jet channel preset on the first support seat, and the lower end extends into the installation groove;

[0021] The wake suction pipe is arranged through the middle and lower parts of the second support seat, the upper end of the wake suction pipe surrounds the micro jet tube and is connected with the wake suction pipeline via a suction channel preset on the second support seat, and the lower end extends into the installation groove;

[0022] The pressure-compensating pipeline is connected to the installation groove via the pressure-compensating channel on the second support seat.

[0023] In an achievable implementation, the first support seat includes a jet mounting seat and a jet support plate integrally connected up and down;

[0024] The jet mounting seat is used to connect the jet pipe, and the jet support plate is connected to the second support seat via a first fastening bolt;

[0025] The jet mounting seat is provided with a jet channel extending from the jet pipe connection to a jet groove preset on the lower end surface of the jet supporting plate.

[0026] In an achievable implementation, the second support seat comprises a microfluidic mounting plate, a suction mounting seat and a pressure compensation mounting seat integrally connected from top to bottom;

[0027] The micro-jet mounting plate is used to connect to the first support seat; the suction mounting seat is used to connect to the wake suction pipe; the pressure-compensating mounting seat is used to connect to the pressure-compensating pipe, and the pressure-compensating mounting seat is connected to the base via a second fastening bolt;

[0028] The microfluidic installation plate is provided with a microfluidic tube installation hole extending from top to bottom, the suction installation seat is provided with a tail flow suction tube installation hole extending from top to bottom, and the pressure compensation installation seat is provided with a pressure compensation channel extending from top to bottom.

[0029] In an achievable embodiment, an electric heating plate is connected below the center of the workpiece to be cooled, a clamping protrusion extending into the mounting groove is provided below the pressure-compensating mounting seat, and the clamping protrusion surrounds the outer periphery of the workpiece to be cooled corresponding to the electric heating plate to form the sealing cover;

[0030] The pressing protrusion is provided with an outwardly penetrating observation channel at a side position corresponding to the heat transfer surface of the component to be cooled, the observation channel is filled with a transparent component, and an observation window is provided on the side wall of the mounting groove corresponding to the observation channel.

[0031] In a feasible embodiment, the base includes a support platform and a bottom plate integrally connected up and down, the support platform is provided with a step hole which is larger at the top and smaller at the bottom, the large end of the step hole forms the installation groove, the small end of the step hole forms a support groove, a support plate is inserted into the support groove, the support plate supports the electric heating plate, and the support plate is provided with a threading hole which runs through from top to bottom for passing the power cord.

[0032] The embodiment of the present application provides a micro-jet boiling ultra-high heat flux density cooling experimental device based on wake suction, including a sealing cover, a micro-jet tube, a wake suction tube and a pressure-compensating pipe. By utilizing the jetting effect of the ejector, a certain flow of cooling liquid is ejected at high speed through the micro-jet tube to the heat transfer surface of the part to be cooled, and the cooling liquid boils and exchanges heat on the surface of the heat transfer surface of the part to be cooled. By utilizing the suction effect of the suction pump, the wake bubbles generated in the boiling heat exchange process actively diffuse to the periphery and are actively sucked out. The pressure-compensating pipe is used to connect to the atmosphere to ensure that the pressure in the sealing cover always remains at atmospheric pressure and does not change due to suction.

[0033] By setting a sealing cover, the cooling liquid that performs jet impact boiling heat exchange is confined to the surface of the heat transfer surface of the part to be cooled to prevent it from affecting other areas. By setting a combined array of micro-jet tubes and wake suction tubes on the surface of the heat transfer surface, the entire heat transfer surface can be subjected to uniform jet impact boiling heat exchange. By setting the sizes of the micro-jet tubes and wake suction tubes, the cooling liquid that performs jet impact can impact the heat transfer surface in small amounts and at high speeds, and the wake is extracted in time, resulting in high cooling efficiency. By setting the wake suction tube and the micro-jet tube to maintain a distance from the heat transfer surface, a certain impact effect and cooling effect can be guaranteed, and the diffusion flow of the wake bubbles is facilitated.

[0034] The embodiment of the present application utilizes active suction to remove wake and boiling bubbles, effectively solving the problem that no wake treatment and passive wake treatment cannot further enhance the jet impact boiling heat transfer capacity, and provides a new solution to the problem of ultra-high heat flux density heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0036] Figure 1 A first-perspective stereoscopic image of a microjet boiling ultra-high heat flux cooling experimental device based on wake suction provided in an embodiment of the present application;

[0037] Figure 2A second perspective stereogram of a microjet boiling ultra-high heat flux cooling experimental device based on wake suction provided in an embodiment of the present application;

[0038] Figure 3 An exploded view from the first perspective of a microjet boiling ultra-high heat flux cooling experimental device based on wake suction provided in an embodiment of the present application;

[0039] Figure 4 An exploded view from a second perspective of a microjet boiling ultra-high heat flux cooling experimental device based on wake suction provided in an embodiment of the present application;

[0040] Figure 5 for Figure 4 A local enlarged view of point A;

[0041] Figure 6 A front view of a microjet boiling ultra-high heat flux cooling experimental device based on wake suction provided in an embodiment of the present application;

[0042] Figure 7 for Figure 6 Right view of;

[0043] Figure 8 for Figure 6 A top view of

[0044] Fig. 9 for Figure 8 BB cross-sectional view;

[0045] Fig.10 for Figure 8 CC section view;

[0046] Fig.11 A first perspective stereoscopic image of a second support base provided in an embodiment of the present application;

[0047] Fig.12 A second perspective stereoscopic image of a second support base provided in an embodiment of the present application;

[0048] Fig.13 A front view of the second support seat provided in an embodiment of the present application;

[0049] Fig.14 for Fig.13 Right view of;

[0050] Fig.15 for Fig.13 Bottom view of

[0051] Fig.16 for Fig.13 A top view of

[0052] Fig.17 for Fig.16DD cross-sectional view;

[0053] Fig.18 for Fig.16 EE cross-sectional view.

[0054] Description of reference numerals:

[0055] 100-Experimental setup;

[0056] 110-microfluidic tube;

[0057] 120-wake suction pipe;

[0058] 130-jet pipe;

[0059] 140-wake suction pipe;

[0060] 150-pressure replenishing pipeline;

[0061] 160-first support seat; 161-jet mounting seat; 162-jet support plate; 163-jet gasket; 164-first fastening bolt;

[0062] 170-second support seat; 171-micro jet mounting plate; 172-suction mounting seat; 173-pressure compensation mounting seat; 174-pressing protrusion; 175-observation channel; 176-pressing gasket; 177-second fastening bolt;

[0063] 180-part to be cooled; 181-electric heating plate;

[0064] 190-base; 191-bottom plate; 192-support platform; 193-installation slot; 194-support slot; 195-observation window. DETAILED DESCRIPTION

[0065] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution in the embodiment of the present application will be described in more detail below in conjunction with the drawings in the embodiment of the present application. It is worth noting that the embodiments described in the drawings are only part of the embodiments of the present application, not all of the embodiments. That is, the embodiments described by the drawings are exemplary and are intended to be used to explain the present application, and cannot be understood as limiting the present application.

[0066] The following will be combined Figure 1-Figure 18 The microjet boiling ultra-high heat flux cooling experimental device 100 based on wake suction provided in an embodiment of the present application is described.

[0067] The present application embodiment provides a micro jet boiling ultra-high heat flux cooling experimental device 100 based on wake suction, such as Figure 1-Figure 10 As shown, it includes a sealing cover, a micro jet tube 110 , a wake suction tube 120 and a pressure compensation pipe 150 .

[0068] The sealing cover is used to seal the heat transfer surface of the component 180 to be cooled.

[0069] A plurality of groups of micro-jet tubes 110 and wake suction tubes 120 are arranged in a one-to-one correspondence, and the micro-jet tubes 110 in the same group are coaxially sleeved in the wake suction tubes 120. The groups of micro-jet tubes 110 and wake suction tubes 120 are arranged perpendicular to the heat transfer surface and distributed in an array along the surface of the heat transfer surface, and the tube holes of the micro-jet tubes 110 and the wake suction tubes 120 have a size of hundreds of micrometers to millimeters.

[0070] A set distance is maintained between the end of the tail flow suction pipe 120 and the micro jet pipe 110 that penetrates into the sealing cover and the heat transfer surface.

[0071] One end of the microfluidic tube 110 away from the heat transfer surface is connected to the ejector.

[0072] One end of the wake suction pipe 120 away from the heat transfer surface and the portion of the wake suction pipe 120 surrounding the micro-jet tube 110 are connected to the suction pump.

[0073] The pressure compensating pipe 150 passes through the sealing cover and communicates with the atmosphere.

[0074] Among them, the sealing cover can be an integral cover arranged on the periphery and above the heat transfer surface of the part to be cooled 180, or it can be a combined cover formed by other parts, so as to limit the cooling liquid of the jet impact boiling heat exchange to the surface of the heat transfer surface of the part to be cooled 180, and avoid flowing to other areas. The part to be cooled 180 can include heating elements or heat transfer elements in high heat flux density products involved in various industrial fields such as energy, power and chips. For example, any high heat flux density heating element that needs to be cooled, such as electronic chips, power semiconductors, high-temperature metals, fuel rods, etc. The cooling liquid for jet impact boiling heat exchange can include water, and can also include a cooling liquid working medium with insulating properties, and the boiling point of the cooling liquid working medium can be determined according to the temperature of the heat transfer surface of the part to be cooled 180, and should usually be significantly lower than the temperature of the heat transfer surface.

[0075] The micro jet tubes 110 and the wake suction tubes 120 can be combined with their own sizes and set in multiple groups according to the area of ​​the heat transfer surface to cover the entire heat transfer surface and uniformly impinge on the boiling heat exchange by jets. The array form of the micro jet tubes 110 and the wake suction tubes 120 preferably corresponds to the shape of the heat transfer surface. If the heat transfer surface is square, the array form is a square array, and if the heat transfer surface is circular, the array form is a circular array.

[0076] The micro jet tube 110 and the wake suction tube 120 are coaxially sleeved to form an axisymmetric structure with a central jet and surrounding suction. By utilizing the ejector's jetting action, a certain flow of cooling liquid is ejected at high speed through the micro jet tube 110 to the heat transfer surface of the part to be cooled 180, and the cooling liquid boils and exchanges heat on the heat transfer surface of the part to be cooled 180. By utilizing the suction action of the suction pump, the wake bubbles generated during the boiling heat exchange process are actively diffused to the periphery and are actively sucked out. The pressure compensation pipe 150 is connected to the atmosphere to ensure that the pressure in the sealed cover always remains at atmospheric pressure and does not change due to suction.

[0077] The ejector can be a conventional high-pressure ejector device, combined with the micro jet tube 110 with a tube hole diameter of hundreds of micrometers to millimeters, so that the cooling liquid impacted by the jet can continuously impact the heat transfer surface in a small amount and at a high speed. The suction pump can be a vacuum pump, combined with the wake suction tube 120 surrounding the micro jet tube 110, the wake bubbles after the jet boiling are extracted in time, and the cooling efficiency is high. The wake suction tube 120 and the micro jet tube 110 both maintain a set distance from the heat transfer surface, which can ensure a certain impact effect and cooling effect, and facilitate the diffusion flow of the wake bubbles. The combined array of the micro jet tube 110 and the wake suction tube 120 is set on the surface of the heat transfer surface, which can perform uniform jet impact boiling heat exchange on the entire heat transfer surface.

[0078] The embodiment of the present application utilizes active suction to remove wake and boiling bubbles, effectively solving the problem that no wake treatment and passive wake treatment cannot further enhance the jet impact boiling heat transfer capacity, and provides a new solution to the problem of ultra-high heat flux density heat dissipation.

[0079] In a feasible implementation, the cross-sectional shape of the wake suction pipe 120 corresponds to the shape of the heat transfer surface.

[0080] Preferably, the shape of the heat transfer surface includes a square or a rectangle, and the cross-sectional shape of the wake suction pipe 120 is a square ring or a rectangular ring accordingly.

[0081] In this way, the combination of the wake suction pipe 120 and the micro-fluidic pipe 110 can be evenly distributed on the entire surface of the heat transfer surface, so as to evenly cool and dissipate the heat of the cooling element 180 .

[0082] In one possible implementation, Figure 4 and Figure 5 As shown, the cross-sectional shape of the micro jet tube 110 is a circular ring, and the cross-sectional shape of the wake flow suction tube 120 is a square ring.

[0083] With this arrangement, the central circular tube can be used to spray cooling liquid, and the outer square tube can draw tail flow around the circular tube, which is particularly suitable for electronic chips with rectangular heat transfer surfaces waiting for cooling member 180.

[0084] It is worth noting that the above is only an example of a combination shape of the wake suction pipe 120 and the micro jet tube 110. Combined with the actual application scenario, the specific shapes of the two are not limited to this. For example, the micro jet tube 110 can also be various shapes such as a square tube and a hexagonal tube. Similarly, the wake suction pipe 120 can also be various shapes such as a circular tube and a pentagonal tube. Furthermore, the wake suction pipe 120 and the micro jet tube 110 can have a variety of combined shapes such as a circular tube and a square tube at the same time, or the micro jet tube 110 is a square tube and the wake suction pipe 120 is a circular tube, so as to be evenly distributed on the heat transfer surface of the part to be cooled 180 and meet the cooling requirements.

[0085] In a feasible implementation, the inner diameter of the microfluidic tube 110 is 0.3 mm-0.5 mm, the inner side length of the tube hole of the wake suction tube 120 is 1.5 mm-1.7 mm, and the gap between the outer walls of adjacent wake suction tubes 120 may be 0.4 mm-0.6 mm.

[0086] Among them, the microjet tube 110 and the wake suction tube 120 can both be made of stainless steel, such as 316L stainless steel, and need to be accurately processed and installed in strict accordance with the size. The size setting of the tube hole diameter of the microjet tube 110 can provide a sufficient flow of cooling liquid and meet the set cooling jet speed to cool the heat transfer surface in real time. The tube hole side length size setting of the wake suction tube 120 can provide sufficient suction space and meet the set suction speed to discharge the wake and bubbles at the same time. The gap size setting between the outer walls of adjacent wake suction tubes 120 can have a guiding flow and suction effect on the cooling liquid outside the wake suction tube 120, thereby achieving a uniform cooling and heat dissipation effect on the entire heat transfer surface.

[0087] In the embodiment of the present application, the inner diameter of the tube hole of the microjet tube 110 is 0.4 mm, and the tube wall thickness is 0.2 mm; the inner side length of the tube hole of the wake suction tube 120 is 1.62 mm, and the tube wall thickness is 0.2 mm. The gap between the outer walls of adjacent wake suction tubes 120 can be 0.48 mm, and experiments have shown that the above parameter configuration can have good cooling and wake suction effects.

[0088] In this way, it can provide cooling liquid with sufficient flow and speed for boiling cooling, and provide appropriate suction power to suck out the wake flow in time, forming a reasonable size and shape configuration.

[0089] In a feasible implementation, each of the plurality of microfluidic tubes 110 is connected to an ejector, or a set number of microfluidic tubes 110 are connected to an ejector via a common ejection channel 130 .

[0090] Each of the plurality of wake suction pipes 120 is connected to a suction pump, or a set number of wake suction pipes 120 are connected to a suction pump via a common wake suction pipeline 140 .

[0091] It is understandable that when an ejector is connected to a micro jet tube 110, a higher ejection velocity can be provided, and when an ejector is connected to multiple micro jet tubes 110, the ejection velocity in a single micro jet tube 110 is appropriately reduced. Similarly, when a suction pump is connected to a wake suction tube 120, a higher suction velocity can be provided, and when a suction pump is connected to multiple wake suction tubes 120, the suction velocity in a single wake suction tube 120 is appropriately reduced.

[0092] In this way, appropriate jet velocity, jet flow rate, suction velocity, and suction flow rate can be selected according to the heat flux density of the cooling member 180. In the embodiment of the present application, a total of 4 micro jet tubes 110 and 4 wake suction tubes 120 are provided, and the 4 micro jet tubes 110 are connected to one micro jet tube 110, and the 4 wake suction tubes 120 are connected to one wake suction tube 120.

[0093] In one possible implementation, Figure 1-Figure 10 As shown, the micro-jet boiling ultra-high heat flux density cooling experimental device 100 based on wake suction also includes a first support seat 160, a second support seat 170 and a base 190 which are sealed and connected in sequence from top to bottom, a jet pipe 130 is arranged on the first support seat 160, a wake suction pipe 140 and a pressure compensation pipe 150 are arranged on the second support seat 170, an installation groove 193 is opened on the top surface of the base 190, and the cooling part 180 is arranged at the bottom of the installation groove 193.

[0094] The micro jet tube 110 passes through the second support seat 170 from top to bottom, the upper end is connected to the jet pipe 130 via the jet channel preset on the first support seat 160, and the lower end extends into the installation groove 193.

[0095] The wake suction pipe 120 is arranged in the middle and lower parts of the second support seat 170 . The upper end of the wake suction pipe 120 surrounds the micro jet tube 110 and is connected to the wake suction pipeline 140 via a suction channel preset on the second support seat 170 , and the lower end extends into the installation groove 193 .

[0096] The pressure-compensating pipeline 150 is connected to the installation groove 193 via the pressure-compensating channel on the second support seat 170 .

[0097] Among them, the first support seat 160, the second support seat 170 and the base 190 can all be made of stainless steel, such as 304 stainless steel. Sealing rings can be added to the connecting surfaces of the three to improve the sealing of the experimental device 100 and prevent leakage of the cooling liquid.

[0098] Based on this, an experimental device 100 is constructed to facilitate data recording and analysis, providing a direction for further research.

[0099] In one possible implementation, Figure 3 , Figure 4 and Figure 6-Figure 10 As shown, the first support seat 160 includes a jet mounting seat 161 and a jet support plate 162 which are integrally connected up and down.

[0100] The jet mounting seat 161 is used to connect the jet pipeline 130 , and the jet supporting plate 162 is connected to the second supporting seat 170 via a first fastening bolt 164 .

[0101] A jet channel is arranged inside the jet mounting seat 161 and extends from the connection point of the jet pipe 130 to the jet groove preset at the lower end surface of the jet supporting plate 162 .

[0102] The jet mounting seat 161 may be a rectangular block, and the jet support plate 162 may be a rectangular plate. The side of the jet mounting seat 161 may be connected to the jet pipe 130 by means of clamping, welding, etc., the lower surface of the jet support plate 162 is processed with a jet groove, and the interior of the jet mounting seat 161 is precisely processed with a jet channel connecting the jet pipe 130 and the jet groove. Considering the existence of the jet groove, a jet gasket 163 may be installed between the jet support plate 162 and the second support seat 170.

[0103] In this way, the cooling liquid ejected by the ejector flows through the ejector pipe 130 , the ejector channel and the micro ejector tube 110 in sequence, and ejects the high-speed cooling liquid onto the heat transfer surface of the component 180 to be cooled.

[0104] In one possible implementation, Figure 11-Figure 18 As shown, the second support seat 170 includes a microfluidic mounting plate 171, a suction mounting seat 172 and a pressure compensation mounting seat 173 which are integrally connected from top to bottom.

[0105] The microfluidic mounting plate 171 is used to connect to the first support seat 160 . The suction mounting seat 172 is used to connect to the wake suction pipeline 140 . The pressure compensation mounting seat 173 is used to connect to the pressure compensation pipeline 150 , and the pressure compensation mounting seat 173 is connected to the base 190 via a second fastening bolt 177 .

[0106] The microjet mounting plate 171 has a mounting hole for the microjet tube 110 extending from top to bottom, the suction mounting seat 172 has a mounting hole for the wake suction tube 120 extending from top to bottom, and the pressure compensation mounting seat 173 has a pressure compensation channel extending from top to bottom.

[0107] The suction mounting seat 172 may be a rectangular block, and the micro-jet mounting plate 171 and the pressure-compensating mounting seat 173 may be rectangular plates.

[0108] The micro-jet mounting plate 171 is used to connect the jet support plate 162 of the first support seat 160. The micro-jet tube 110 is installed in the micro-jet mounting hole, and the upper end of the micro-jet tube 110 can slightly extend out of the micro-jet mounting plate 171.

[0109] The wake suction pipe 140 and the pressure-compensating pipe 150 are arranged in upper and lower layers. Similarly, the wake suction pipe 140 and the pressure-compensating pipe 150 can be connected to the corresponding mounting seat by means of clamping or welding.

[0110] In the embodiment of the present application, a suction channel is formed inside the suction mounting seat 172 at a position where the extension of the wake suction pipe 140 intersects with the microjet tube 110, and a mounting hole for the wake suction pipe 120 is opened on the suction mounting seat 172 below the suction channel, and the wake suction pipe 120 is tightly installed in the mounting hole of the wake suction pipe 120, so that the suction pipe connects the wake suction pipe 140 and the wake suction pipe 120.

[0111] A pressure compensating channel is provided inside the pressure compensating mounting seat 173 at a position where the extension of the pressure compensating pipeline 150 intersects with the wake suction pipe 120, and the pressure compensating channel extends to the lower end surface of the pressure compensating mounting seat 173. The wake suction pipe 120 and the microfluidic tube 110 are grouped and located in the pressure compensating channel and extend above the to-be-cooled component in the mounting groove. The gap between the inner wall of the pressure compensating channel and the outer wall of the adjacent wake suction pipe 120 can be 0.2-0.3 mm.

[0112] In one possible implementation, Fig. 9 and Fig.10 As shown, an electric heating plate 181 is welded below the center of the part to be cooled 180, and a clamping protrusion 174 extending into the mounting groove 193 is provided below the pressure-compensating mounting seat 173. The clamping protrusion 174 surrounds the outer periphery of the electric heating plate 181 corresponding to the part to be cooled 180 and forms a sealing cover.

[0113] The mounting groove 193 may be a rectangular groove, and the cooling member 180 may be a copper sheet. The lower surface of the copper sheet is welded with an electric heating sheet 181, and the lower surface of the electric heating sheet 181 may first be sputtered with a platinum layer by magnetic sputtering control, and then two copper electrodes may be sputtered on both sides of the platinum layer, so as to facilitate connection of the positive and negative electrodes through a power line. The copper sheet is pressed against the bottom of the rectangular groove, and the pressing protrusion 174 is pressed against the copper sheet accordingly.

[0114] Furthermore, an observation channel 175 extending outward is opened at the side position of the clamping protrusion 174 corresponding to the heat transfer surface of the cooling part 180, and a transparent part (not shown) is filled in the observation channel 175. An observation window 195 is set on the side wall of the installation groove 193 corresponding to the observation channel 175.

[0115] In this way, the jet boiling phenomenon of the heat transfer surface can be directly observed and recorded through the observation window 195 and the transparent member. It can be understood that at this time, the sealing cover is formed in a combination of multiple transparent members.

[0116] In one possible implementation, Fig. 9 and Fig.10 As shown, the base 190 includes a support platform 192 and a bottom plate 191 which are integrally connected up and down. The support platform 192 is provided with a step hole which is larger at the top and smaller at the bottom. The large end of the step hole forms a mounting groove 193, and the small end of the step hole forms a support groove 194. A support plate (not shown) is inserted into the support groove 194. The support plate supports the electric heating plate 181, and the support plate is provided with a threading hole which runs through from top to bottom for passing the power cord.

[0117] The bottom plate 191 of the base 190 can be fixedly connected to the experimental platform by bolts. The support plate can include an upper support seat and a bottom mounting plate, the support seat extends into the support groove 194 and supports the electric heating plate 181, and a threading hole is provided in the center of the support seat. The mounting plate is clamped in a preset clamping groove on the bottom surface of the bottom and bolted to the bottom plate 191.

[0118] It should be noted that, unless otherwise clearly specified and limited, in the description of this application, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0119] The orientations or positional relationships indicated by terms such as “upper”, “lower”, “front”, “back”, “vertical”, “horizontal”, “top”, “bottom”, “inside” and “outside” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0120] The term "plurality" means two or more than two, unless expressly specified otherwise.

[0121] The terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this way are interchangeable where appropriate, so that the embodiments of the present application described herein can include sequential implementations other than those illustrated or described herein.

[0122] The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product, or apparatus that comprises a series of steps or elements is not necessarily limited to those steps or elements explicitly listed but may include other steps or elements not explicitly listed or inherent to such process, method, product, or apparatus.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A microjet boiling ultra-high heat flux cooling experimental device based on wake suction, characterized in that: It includes a sealing cover, a micro jet tube, a wake suction tube and a pressure compensation pipe; The sealing cover is used to seal the heat transfer surface of the part to be cooled; The micro jet tubes and the wake suction tubes are arranged in a plurality of groups corresponding to each other, and the micro jet tubes in the same group are coaxially sleeved in the wake suction tubes, and the micro jet tubes and the wake suction tubes in the group are arranged perpendicular to the heat transfer surface and distributed in an array along the surface of the heat transfer surface, and the tube holes of the micro jet tubes and the wake suction tubes have a size of hundreds of micrometers to millimeters; A set distance is maintained between one end of the tail flow suction pipe and the micro-fluidic pipe that penetrates into the sealing cover and the heat transfer surface; One end of the microfluidic tube away from the heat transfer surface is connected to the ejector; One end of the tail flow suction pipe away from the heat transfer surface and the portion of the tail flow suction pipe surrounding the micro jet tube are connected to a suction pump; The pressure compensation pipeline passes through the sealing cover and communicates with the atmosphere.

2. The microjet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 1 is characterized in that: The cross-sectional shape of the wake suction pipe corresponds to the shape of the heat transfer surface; Preferably, the shape of the heat transfer surface includes a square or a rectangle, and the cross-sectional shape of the wake suction pipe is a square ring or a rectangular ring accordingly.

3. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 1 is characterized in that: The micro jet tube comprises a round tube, and the wake flow suction tube comprises a square tube.

4. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 3 is characterized in that: The inner diameter of the tube hole of the micro jet tube is 0.3mm-0.5mm, and the inner side length of the tube hole of the tail flow suction tube is 1.5mm-1.7mm.

5. The microjet boiling ultra-high heat flux cooling experimental device based on wake suction according to any one of claims 1 to 4, characterized in that: Each of the plurality of microfluidic tubes is connected to one of the ejectors, or a set number of the microfluidic tubes are connected to one of the ejectors via a common ejection channel; Each of the plurality of wake suction pipes is connected to one of the suction pumps, or a set number of the wake suction pipes are connected to one of the suction pumps via a common wake suction pipeline.

6. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to any one of claims 1 to 4, characterized in that: It also includes a first support seat, a second support seat and a base which are sealed and connected in sequence from top to bottom, a jet pipe is arranged on the first support seat, a wake suction pipe and a pressure compensation pipe are arranged on the second support seat, a mounting groove is arranged on the top surface of the base, and the to-be-cooled part is arranged at the bottom of the mounting groove; The micro jet tube passes through the second support seat from top to bottom, the upper end is connected to the jet pipeline via the jet channel preset on the first support seat, and the lower end extends into the installation groove; The wake suction pipe is arranged through the middle and lower parts of the second support seat, the upper end of the wake suction pipe surrounds the micro jet tube and is connected with the wake suction pipeline via a suction channel preset on the second support seat, and the lower end extends into the installation groove; The pressure-compensating pipeline is connected to the installation groove via the pressure-compensating channel on the second support seat.

7. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 6 is characterized in that: The first support seat comprises a jet mounting seat and a jet support plate integrally connected up and down; The jet mounting seat is used to connect the jet pipe, and the jet support plate is connected to the second support seat via a first fastening bolt; The jet mounting seat is provided with a jet channel extending from the jet pipe connection to a jet groove preset on the lower end surface of the jet supporting plate.

8. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 6 is characterized in that: The second support seat comprises a microfluidic mounting plate, a suction mounting seat and a pressure compensation mounting seat which are integrally connected from top to bottom; The micro-jet mounting plate is used to connect to the first support seat; the suction mounting seat is used to connect to the wake suction pipe; the pressure-compensating mounting seat is used to connect to the pressure-compensating pipe, and the pressure-compensating mounting seat is connected to the base via a second fastening bolt; The microfluidic installation plate is provided with a microfluidic tube installation hole extending from top to bottom, the suction installation seat is provided with a tail flow suction tube installation hole extending from top to bottom, and the pressure compensation installation seat is provided with a pressure compensation channel extending from top to bottom.

9. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 6 is characterized in that: An electric heating plate is connected below the center of the workpiece to be cooled, and a clamping protrusion extending into the mounting groove is arranged below the pressure-compensating mounting seat, and the clamping protrusion surrounds the outer periphery of the workpiece to be cooled corresponding to the electric heating plate to form the sealing cover; The pressing protrusion is provided with an outwardly penetrating observation channel at a side position corresponding to the heat transfer surface of the component to be cooled, the observation channel is filled with a transparent component, and an observation window is provided on the side wall of the mounting groove corresponding to the observation channel.

10. The micro jet boiling ultra-high heat flux cooling experimental device based on wake suction according to claim 9 is characterized in that: The base includes a support platform and a bottom plate integrally connected up and down, the support platform is provided with a step hole which is larger at the top and smaller at the bottom, the large end of the step hole forms the installation groove, the small end of the step hole forms a support groove, a support plate is inserted in the support groove, the support plate supports the electric heating plate, and the support plate is provided with a threading hole which runs through from top to bottom for passing the power cord.

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