Experimental device for ultra-high heat flux density cooling using microjets based on wake extraction

Abstract

This application discloses an experimental device for ultra-high heat flux density cooling based on wake suction using micro-jet boiling. The device includes a sealing cover, micro-jet tubes, a wake suction tube, and a pressure-replenishing pipe. The sealing cover is used to seal the heat transfer surface of the component to be cooled. Multiple sets of micro-jet tubes and wake suction tubes are arranged in a one-to-one correspondence, with micro-jet tubes in the same set coaxially sleeved inside the wake suction tube. The sets of micro-jet tubes and wake suction tubes are arrayed along the surface of the heat transfer surface. A set distance is maintained between the end of the wake suction tube and the micro-jet tube that penetrates the sealing cover and the heat transfer surface. The end of the micro-jet tube away from the heat transfer surface is connected to an ejector. The end of the wake suction tube away from the heat transfer surface and the portion of the wake suction tube surrounding the micro-jet tube are connected to a suction pump. The pressure-replenishing pipe passes through the sealing cover and is open to the atmosphere. This application embodiment can remove wake and boiling bubbles using active suction, providing a solution for current ultra-high heat flux density cooling needs.

Description

Technical Field

[0001] This application relates to the field of jet boiling heat transfer enhancement technology, and in particular to a micro-jet boiling ultra-high heat flux density cooling experimental device based on wake suction. Background Technology

[0002] High heat flux density cooling technology is a widely needed technology in various industries such as energy, power, and chips. As electronic products become smaller and more powerful, heat generation becomes more concentrated, and heat flux density continues to increase. Especially in fields such as high-performance electronic chips, data centers, and new energy power equipment, overheating caused by high heat flux density has become a key issue that needs to be addressed.

[0003] Among various cooling technologies, jet boiling has become a research hotspot due to its significant potential for handling high heat flux density heat dissipation. However, from the perspective of the essential mechanism and characteristics of jets and boiling phenomena, although jets themselves enhance heat transfer, strong jets can lead to the accumulation of bubbles near the heat transfer surface, making them difficult to detach and causing the critical heat flux density to occur. In addition, the jet impact can easily generate wake retention problems, which restricts further improvement of the heat transfer capacity of jet boiling.

[0004] While passive methods such as utilizing gravity or cooling module design to remove the wake can increase the critical heat flux density of jet boiling, the effect is not ideal. Therefore, if the wake can be effectively eliminated during the jet process, it is hoped that the accumulation of liquid layer and bubbles near the heat transfer surface can be prevented, further increasing the critical heat flux density. Summary of the Invention

[0005] To address at least one of the problems mentioned in the background art, embodiments of this application provide a micro-jet boiling ultra-high heat flux density cooling experimental device based on wake suction, which can remove wake and boiling bubbles by active suction, providing a solution for current ultra-high heat flux density cooling needs.

[0006] To achieve the above objectives, this application provides an experimental device for ultra-high heat flux density cooling of micro-jet boiling based on wake suction, including a sealing cover, a micro-jet tube, a wake suction tube, and a pressure replenishment pipe.

[0007] The sealing cover is used to seal the heat transfer surface of the component to be cooled;

[0008] Multiple sets of micro-jet tubes and tailflow suction tubes are arranged in a one-to-one correspondence. The micro-jet tubes in the same set are coaxially sleeved inside the tailflow suction tube. The micro-jet tubes and tailflow suction tubes in the set are arranged perpendicular to the heat transfer surface and distributed in an array along the surface of the heat transfer surface. The tube holes of the micro-jet tubes and tailflow suction tubes have a size of hundreds of micrometers to millimeters.

[0009] The tail flow suction tube and the micro-jet tube are inserted into the sealing cover at one end and the heat transfer surface at a set distance;

[0010] The end of the microjet tube away from the heat transfer surface is connected to the jet injector;

[0011] The end of the tail flow suction pipe away from the heat transfer surface and the portion of the tail flow suction pipe surrounding the micro-jet tube are connected to the suction pump.

[0012] The pressure-replenishing pipe passes through the sealing cover and is open to the atmosphere.

[0013] In one feasible implementation, the cross-sectional shape of the wake suction pipe corresponds to the shape of the heat transfer surface;

[0014] Preferably, the heat transfer surface has a square or rectangular shape, and the cross-sectional shape of the wake suction pipe is a square ring or a rectangular ring.

[0015] In one feasible implementation, the microjet tube comprises a circular tube, and the wake suction tube comprises a square tube.

[0016] In one feasible implementation, the inner diameter of the microjet tube is 0.3mm-0.5mm, and the inner side length of the tailflow suction tube is 1.5mm-1.7mm.

[0017] In one possible implementation, each of the plurality of microjet tubes is connected to a jet injector, or a set number of the microjet tubes are connected to a jet injector via a common jet conduit.

[0018] Each of the multiple wake suction pipes is connected to a suction pump, or a set number of the wake suction pipes are connected to a suction pump via a common wake suction pipe.

[0019] In one feasible implementation, it further includes a first support base, a second support base, and a base that are sequentially and sealed from top to bottom. The first support base is provided with a jet pipe, the second support base is provided with a tail flow suction pipe and a pressure replenishment pipe, and the top surface of the base is provided with an installation groove, and the part to be cooled is disposed at the bottom of the installation groove.

[0020] The micro-jet tube passes through the second support base from top to bottom, with its upper end connected to the jet pipe via a pre-set jet channel on the first support base, and its lower end extending into the mounting groove.

[0021] The tail flow suction tube passes through the middle and lower part of the second support base. The upper end of the tail flow suction tube is connected to the tail flow suction pipe through a suction channel preset on the second support base around the micro jet tube, and the lower end extends into the mounting groove.

[0022] The pressure-replenishing pipe is connected to the mounting groove via the pressure-replenishing channel on the second support.

[0023] In one possible implementation, the first support base includes a jet mounting base and a jet support plate that are integrally connected vertically.

[0024] The jet mounting base is used to connect the jet pipe, and the jet support plate is connected to the second support base by the first fastening bolt;

[0025] The jet mounting base is provided with a jet channel extending from the jet pipe connection to a pre-set jet groove on the lower end face of the jet support plate.

[0026] In one possible implementation, the second support includes a microjet mounting plate, a suction mounting base, and a pressure-compensating mounting base integrally connected from top to bottom;

[0027] The microjet mounting plate is used to connect to the first support base; the suction mounting base is used to connect to the tail suction pipe; the pressure-replenishing mounting base is used to connect to the pressure-replenishing pipe, and the pressure-replenishing mounting base is connected to the base by a second fastening bolt;

[0028] The microjet mounting plate has microjet tube mounting holes extending from top to bottom inside, the suction mounting base has tail flow suction tube mounting holes extending from top to bottom inside, and the pressure replenishing mounting base has pressure replenishing channels extending from top to bottom inside.

[0029] In one feasible implementation, an electric heating element is connected below the center of the part to be cooled, and a pressing protrusion extending into the mounting groove is provided below the pressure-reducing mounting base. The pressing protrusion surrounds the outer periphery of the part to be cooled corresponding to the electric heating element and forms the sealing cover.

[0030] An outwardly penetrating observation channel is opened at the side position of the heat transfer surface of the component to be cooled corresponding to the pressing protrusion. The observation channel is filled with a transparent component, and an observation window is provided on the side wall of the mounting groove corresponding to the observation channel.

[0031] In one feasible implementation, the base includes a support platform and a base plate integrally connected at the top and bottom. The support platform has a stepped hole that is larger at the top and smaller at the bottom. The larger end of the stepped hole forms the mounting groove, and the smaller end of the stepped hole forms a support groove. A support plate is inserted into the support groove. The support plate supports the electric heating element, and the support plate has a through hole for the power cord to pass through.

[0032] This application provides an experimental device for ultra-high heat flux density cooling via micro-jet boiling based on wake suction, comprising a sealed enclosure, a micro-jet tube, a wake suction tube, and a pressure-replenishing pipe. Utilizing the jetting action of the jet injector, a certain flow rate of cooling liquid is propelled at high speed through the micro-jet tube onto the heat transfer surface of the component to be cooled, where the cooling liquid undergoes boiling heat exchange. The suction force of the suction pump causes the wake bubbles generated during the boiling heat exchange process to actively diffuse outwards and be actively suctioned out. The pressure-replenishing pipe connects to the atmosphere, ensuring that the pressure inside the sealed enclosure remains at atmospheric pressure and does not change due to suction.

[0033] By setting up a sealing cover, the cooling liquid undergoing jet impact boiling heat transfer is confined to the heat transfer surface of the component to be cooled, preventing it from affecting other areas. By arranging a combined array of micro-jet tubes and tail-flow suction tubes on the heat transfer surface, uniform jet impact boiling heat transfer can be achieved across the entire surface. By adjusting the dimensions of the micro-jet tubes and tail-flow suction tubes, a small amount of cooling liquid can impact the heat transfer surface at high speed, and the tail flow is promptly extracted, resulting in high cooling efficiency. Maintaining a distance between the tail-flow suction tubes and micro-jet tubes and the heat transfer surface ensures a certain impact and cooling effect while facilitating the diffusion and flow of tail-flow bubbles.

[0034] This application embodiment utilizes an active suction method to remove wake and boiling bubbles, effectively solving the problem that wakeless treatment and passive wake treatment cannot further enhance the jet impact boiling heat transfer capability, and providing a new solution for solving the heat dissipation problem of ultra-high heat flux density. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A first-view perspective perspective view of the experimental device for ultra-high heat flux density cooling of micro-jet boiling based on wake extraction provided in the embodiments of this application.

[0037] Figure 2A second-view perspective perspective view of the micro-jet boiling ultra-high heat flux density cooling experimental device based on wake suction provided in the embodiments of this application;

[0038] Figure 3 A first-view exploded view of the experimental device for micro-jet boiling ultra-high heat flux density cooling based on wake extraction provided in the embodiments of this application.

[0039] Figure 4 A second-view exploded view of the micro-jet boiling ultra-high heat flux density cooling experimental device based on wake extraction provided in the embodiments of this application.

[0040] Figure 5 for Figure 4 Enlarged view of a portion at point A;

[0041] Figure 6 A front view of the microjet boiling ultra-high heat flux density cooling experimental device based on wake suction provided in the embodiments of this application;

[0042] Figure 7 for Figure 6 The right view;

[0043] Figure 8 for Figure 6 Top view;

[0044] Figure 9 for Figure 8 BB section view;

[0045] Figure 10 for Figure 8 CC section view;

[0046] Figure 11 A first-view perspective view of the second support base provided in an embodiment of this application;

[0047] Figure 12 A second perspective view of the second support base provided in the embodiments of this application;

[0048] Figure 13 This is a front view of the second support provided in an embodiment of this application;

[0049] Figure 14 for Figure 13 The right view;

[0050] Figure 15 for Figure 13 A bottom view;

[0051] Figure 16 for Figure 13 Top view;

[0052] Figure 17 for Figure 16DD sectional view;

[0053] Figure 18 for Figure 16 EE sectional view.

[0054] Explanation of reference numerals in the attached figures:

[0055] 100 - Experimental setup;

[0056] 110-Microjet Tube;

[0057] 120 - Wake suction tube;

[0058] 130 - Jet pipe;

[0059] 140 - Wake suction pipe;

[0060] 150 - Pressure replenishment pipe;

[0061] 160 - First support base; 161 - Jet mounting base; 162 - Jet support plate; 163 - Jet gasket; 164 - First fastening bolt;

[0062] 170 - Second support seat; 171 - Microjet mounting plate; 172 - Suction mounting seat; 173 - Pressure compensation mounting seat; 174 - Compressive protrusion; 175 - Observation channel; 176 - Compressive gasket; 177 - Second fastening bolt;

[0063] 180 - Component to be cooled; 181 - Electric heating element;

[0064] 190-Base; 191-Base plate; 192-Support platform; 193-Mounting slot; 194-Support slot; 195-Observation window. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. It is worth noting that the embodiments described in the accompanying drawings are only some embodiments of this application, and not all embodiments. That is, the embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0066] The following will combine Figures 1-18 The experimental apparatus 100 for ultra-high heat flux density cooling based on microjet boiling using wake extraction provided in this application embodiment will be described.

[0067] This application provides an experimental device 100 for ultra-high heat flux density cooling of microjets based on wake extraction and boiling, such as... Figures 1-10 As shown, it includes a sealing cover, a microjet tube 110, a tail flow suction tube 120, and a pressure replenishment pipe 150.

[0068] The sealing cover is used to seal the heat transfer surface of the part to be cooled 180.

[0069] Multiple sets of micro-jet tubes 110 and tailflow suction tubes 120 are arranged in a one-to-one correspondence. The micro-jet tubes 110 in the same set are coaxially sleeved inside the tailflow suction tubes 120. The micro-jet tubes 110 and tailflow suction tubes 120 in the set are arranged perpendicular to the heat transfer surface and distributed in an array along the surface of the heat transfer surface. The tube holes of the micro-jet tubes 110 and tailflow suction tubes 120 have a size of hundreds of micrometers to millimeters.

[0070] The tail flow suction pipe 120 and the micro-jet pipe 110 are inserted into the sealing cover at a set distance from the heat transfer surface.

[0071] The end of the microjet tube 110 away from the heat transfer surface is connected to the jet injector.

[0072] The end of the tail flow suction pipe 120 away from the heat transfer surface and the part of the tail flow suction pipe 120 surrounding the microjet pipe 110 are connected to the suction pump.

[0073] The pressure-replenishing pipe 150 passes through the sealed cover and is open to the atmosphere.

[0074] The sealing cover can be an integral cover surrounding and above the heat transfer surface of the component 180 to be cooled, or it can be a combined cover formed by other components. This design effectively confines the cooling liquid undergoing jet impingement boiling heat exchange within the surface of the heat transfer surface of the component 180, preventing it from flowing to other areas. The component 180 to be cooled can include heating elements or heat transfer components in high heat flux density products across various industries such as energy, power, and semiconductors. Examples include electronic chips, power semiconductors, high-temperature metals, fuel rods, and any other high heat flux density heating element requiring cooling. The cooling liquid used for jet impingement boiling heat exchange can include water, or it can include an insulating cooling liquid working medium. The boiling point of the cooling liquid working medium can be determined based on the temperature of the heat transfer surface of the component 180, and should generally be significantly lower than the temperature of the heat transfer surface.

[0075] The microjet tubes 110 and the tail suction tubes 120 can be arranged in multiple sets according to their own dimensions and the area of ​​the heat transfer surface, so as to cover the entire heat transfer surface and achieve uniform jet impact boiling heat transfer. The array form of the microjet tubes 110 and the tail suction tubes 120 is preferably corresponding to the shape of the heat transfer surface. For example, if the heat transfer surface is square, the array form is a square array; if the heat transfer surface is circular, the array form is a circular array.

[0076] The micro-jet tube 110 and the tail-flow suction tube 120 are coaxially fitted to form an axisymmetric structure with a central jet and surrounding suction. Utilizing the jetting action of the jetter, a certain flow rate of cooling liquid is propelled at high speed through the micro-jet tube 110 to the heat transfer surface of the component 180 to be cooled, where the cooling liquid undergoes boiling heat exchange. The suction force of the suction pump causes the tail-flow bubbles generated during the boiling heat exchange process to actively diffuse outwards and be actively sucked out. The pressure-replenishing pipe 150 connects to the atmosphere, ensuring that the pressure inside the sealed enclosure remains at atmospheric pressure and does not change due to suction.

[0077] The jet ejector can be a conventional high-pressure jet device, combined with a microjet tube 110 with a diameter ranging from hundreds of micrometers to millimeters, enabling the jet to continuously impact the heat transfer surface with a small amount of cooling liquid at high speed. The suction pump can be a vacuum pump, combined with a tail suction pipe 120 surrounding the microjet tube 110, ensuring that the tail bubbles after jet boiling are promptly removed, resulting in high cooling efficiency. Both the tail suction pipe 120 and the microjet tube 110 maintain a set distance from the heat transfer surface, ensuring a certain impact and cooling effect while facilitating the diffusion and flow of tail bubbles. The combined array of microjet tubes 110 and tail suction pipes 120 on the surface of the heat transfer surface enables uniform jet impact boiling heat transfer across the entire surface.

[0078] This application embodiment utilizes an active suction method to remove wake and boiling bubbles, effectively solving the problem that wakeless treatment and passive wake treatment cannot further enhance the jet impact boiling heat transfer capability, and providing a new solution for solving the heat dissipation problem of ultra-high heat flux density.

[0079] In one feasible implementation, the cross-sectional shape of the wake suction pipe 120 corresponds to the shape of the heat transfer surface.

[0080] Preferably, the heat transfer surface has a square or rectangular shape, and the cross-sectional shape of the wake suction pipe 120 is a square ring or a rectangular ring.

[0081] In this way, the combination of the tail suction pipe 120 and the micro-jet pipe 110 can be evenly distributed across the entire surface of the heat transfer surface to uniformly cool and dissipate heat from the component to be cooled 180.

[0082] In one feasible implementation, such as Figure 4 and Figure 5 As shown, the cross-sectional shape of the microjet tube 110 is annular, and the cross-sectional shape of the tail suction tube 120 is square annular.

[0083] With this configuration, the central circular tube can be used to spray cooling liquid, and the outer square tube can draw in the tail flow around the circular tube, which is especially suitable for electronic chips waiting to be cooled 180 with rectangular heat transfer surfaces.

[0084] It is worth noting that the above is only an example of one combination shape of the wake suction pipe 120 and the micro-jet pipe 110. Depending on the actual application scenario, the specific shapes of the two are not limited to this. For example, the micro-jet pipe 110 can also be a square pipe, a hexagonal pipe, or various other shapes. Similarly, the wake suction pipe 120 can also be a round pipe, a pentagonal pipe, or various other shapes. Furthermore, the wake suction pipe 120 and the micro-jet pipe 110 can have multiple combinations of shapes, such as both being round pipes and both being square pipes, or the micro-jet pipe 110 being a square pipe and the wake suction pipe 120 being a round pipe, to evenly distribute them on the heat transfer surface of the component 180 to be cooled and meet the cooling requirements.

[0085] In one feasible implementation, the inner diameter of the microjet tube 110 is 0.3mm-0.5mm, the inner side length of the tailflow suction tube 120 is 1.5mm-1.7mm, and the gap between the outer walls of adjacent tailflow suction tubes 120 can be 0.4mm-0.6mm.

[0086] Both the microjet tube 110 and the tailflow suction tube 120 can be made of stainless steel, such as 316L stainless steel, and must be precisely machined and installed according to strict dimensions. The diameter of the tube orifice of the microjet tube 110 is set to provide a sufficient flow rate of cooling liquid and meet the set cooling jet velocity for real-time cooling of the heat transfer surface. The side length of the tube orifice of the tailflow suction tube 120 is set to provide sufficient suction space and meet the set suction velocity to simultaneously discharge the tailflow and bubbles. The gap between the outer walls of adjacent tailflow suction tubes 120 guides the flow and suctions the cooling liquid around the tailflow suction tube 120, achieving uniform cooling and heat dissipation of the entire heat transfer surface.

[0087] In this embodiment, the inner diameter of the microjet tube 110 is 0.4 mm and the wall thickness is 0.2 mm; the inner side length of the tailflow suction tube 120 is 1.62 mm and the wall thickness is 0.2 mm; the gap between the outer walls of adjacent tailflow suction tubes 120 can be 0.48 mm; and experiments have shown that the above parameter configuration can have good cooling and tailflow suction effects.

[0088] In this way, it can provide a sufficient flow and velocity of cooling liquid working fluid for boiling cooling, and also provide a suitable suction power to promptly extract the tail flow, forming a reasonable size and shape configuration.

[0089] In one possible implementation, each of the multiple microjet tubes 110 is connected to an ejector, or a set number of microjet tubes 110 are connected to an ejector via a common jet conduit 130.

[0090] Multiple tailflow suction pipes 120 are each connected to a suction pump, or a set number of tailflow suction pipes 120 are connected to a suction pump via a common tailflow suction pipe 140.

[0091] Understandably, when an ejector is connected to a micro-jet tube 110, it can provide a higher jet velocity; when an ejector is connected to multiple micro-jet tubes 110, the jet velocity within a single micro-jet tube 110 decreases appropriately. Similarly, when a suction pump is connected to a wake suction tube 120, it can provide a higher suction velocity; when a suction pump is connected to multiple wake suction tubes 120, the suction velocity within a single wake suction tube 120 decreases appropriately.

[0092] In this way, appropriate jet velocity, jet flow rate, and suction velocity and flow rate can be selected according to the heat flux density of the component 180 to be cooled. In this embodiment, a total of 4 micro-jet tubes 110 and 4 tailflow suction tubes 120 are provided. The 4 micro-jet tubes 110 are connected to one micro-jet tube 110, and the 4 tailflow suction tubes 120 are connected to one tailflow suction tube 120.

[0093] In one feasible implementation, such as Figures 1-10 As shown, the micro-jet boiling ultra-high heat flux density cooling experimental device 100 based on wake suction also includes a first support 160, a second support 170 and a base 190 that are sealed and connected from top to bottom. The first support 160 is provided with a jet pipe 130, the second support 170 is provided with a wake suction pipe 140 and a pressure replenishment pipe 150, and the top surface of the base 190 has an installation groove 193, on which the part to be cooled 180 is placed at the bottom of the installation groove 193.

[0094] The micro-jet tube 110 passes through the second support 170 from top to bottom. Its upper end is connected to the jet pipe 130 via a pre-set jet channel on the first support 160, and its lower end extends into the mounting groove 193.

[0095] The tail flow suction pipe 120 is installed in the middle and lower part of the second support 170. The upper end of the tail flow suction pipe 120 is connected to the tail flow suction pipe 140 through the suction channel preset on the second support 170 around the micro jet pipe 110, and the lower end extends into the mounting groove 193.

[0096] The pressure replenishment pipe 150 is connected to the mounting groove 193 via the pressure replenishment channel on the second support 170.

[0097] The first support 160, the second support 170, and the base 190 can all be made of stainless steel, such as 304 stainless steel. A sealing ring can be added at the joint surfaces of the three to improve the sealing performance of the experimental device 100 and prevent leakage of cooling liquid.

[0098] Based on this, an experimental device 100 was constructed to facilitate data recording and analysis, providing direction for further research.

[0099] In one feasible implementation, such as Figure 3 , Figure 4 and Figures 6-10 As shown, the first support base 160 includes a jet mounting base 161 and a jet support plate 162 that are integrally connected.

[0100] The jet mounting base 161 is used to connect the jet pipe 130, and the jet support plate 162 is connected to the second support base 170 through the first fastening bolt 164.

[0101] The jet mounting base 161 has a jet channel inside that extends from the connection of the jet pipe 130 to the jet groove at the lower end face of the jet support plate 162.

[0102] The jet mounting base 161 can be a rectangular block, and the jet support plate 162 can be a rectangular plate. The side of the jet mounting base 161 can be connected to the jet pipe 130 via snap-fit ​​or welding. The lower surface of the jet support plate 162 is machined with a jet groove, and the interior of the jet mounting base 161 is precision-machined with a jet channel connecting the jet pipe 130 and the jet groove. Considering the presence of the jet groove, a jet gasket 163 can be installed between the jet support plate 162 and the second support base 170.

[0103] In this way, the cooling liquid ejected by the ejector flows sequentially through the ejector pipe 130, the ejector channel and the micro-jet tube 110, spraying the high-speed cooling liquid onto the heat transfer surface of the component to be cooled 180.

[0104] In one feasible implementation, such as Figures 11-18 As shown, the second support 170 includes a microjet mounting plate 171, a suction mounting base 172, and a pressure-replenishing mounting base 173, which are integrally connected from top to bottom.

[0105] The microjet mounting plate 171 is used to connect to the first support base 160. The suction mounting base 172 is used to connect to the wake suction pipe 140. The pressure replenishing mounting base 173 is used to connect to the pressure replenishing pipe 150, and the pressure replenishing mounting base 173 is connected to the base 190 by the second fastening bolt 177.

[0106] The microjet mounting plate 171 has a microjet tube 110 mounting hole extending from top to bottom inside, the suction mounting base 172 has a tail flow suction tube 120 mounting hole extending from top to bottom inside, and the pressure replenishing mounting base 173 has a pressure replenishing channel extending from top to bottom inside.

[0107] Among them, the suction mounting base 172 can be a rectangular block, and the microjet mounting plate 171 and the pressure-repairing mounting base 173 can be rectangular plates.

[0108] The micro-jet mounting plate 171 is used to connect the jet support plate 162 of the first support base 160. The micro-jet tube 110 is installed in the micro-jet mounting hole, and the upper end of the micro-jet tube 110 can extend slightly out of the micro-jet mounting plate 171.

[0109] The wake suction pipe 140 and the pressure replenishment pipe 150 are arranged in upper and lower layers. Similarly, the wake suction pipe 140 and the pressure replenishment pipe 150 can be connected to the corresponding mounting base by means of snap-fit ​​or welding.

[0110] In this embodiment, a suction channel is formed inside the suction mounting base 172 at the position where the extension of the tail flow suction pipe 140 intersects with the micro-jet pipe 110. A tail flow suction pipe 120 mounting hole is opened on the suction mounting base 172 below the suction channel. The tail flow suction pipe 120 is tightly installed in the tail flow suction pipe 120 mounting hole, so that the suction pipe connects the tail flow suction pipe 140 and the tail flow suction pipe 120.

[0111] A pressure-replenishing channel is formed inside the pressure-replenishing mounting base 173 at the intersection of the extension of the pressure-replenishing pipe 150 and the tailflow suction pipe 120. The pressure-replenishing channel extends to the lower end face of the pressure-replenishing mounting base 173. The tailflow suction pipe 120 and the micro-jet pipe 110 are grouped together and located inside the pressure-replenishing channel, extending above the part to be cooled in the mounting groove. The gap between the inner wall of the pressure-replenishing channel and the outer wall of the adjacent tailflow suction pipe 120 can be 0.2-0.3 mm.

[0112] In one feasible implementation, such as Figure 9 and Figure 10 As shown, an electric heating element 181 is welded below the center of the part to be cooled 180. A pressing protrusion 174 is provided below the pressure mounting base 173 and extends into the mounting groove 193. The pressing protrusion 174 surrounds the outer periphery of the electric heating element 181 of the part to be cooled 180 and forms a sealing cover.

[0113] The mounting groove 193 can be a rectangular groove, and the part to be cooled 180 can be a copper sheet. An electric heating element 181 is welded to the lower surface of the copper sheet. The lower surface of the electric heating element 181 can first be sputtered with a platinum layer via magnetron sputtering, and then two copper electrodes can be sputtered on both sides of the platinum layer to facilitate connection of the positive and negative electrodes via a power cord. The copper sheet is pressed firmly against the bottom of the rectangular groove, and the pressing protrusion 174 is correspondingly pressed against the copper sheet.

[0114] Furthermore, an outwardly penetrating observation channel 175 is opened at the side position of the heat transfer surface of the component to be cooled 180 corresponding to the pressing protrusion 174. The observation channel 175 is filled with a transparent component (not shown), and an observation window 195 is provided on the side wall of the mounting groove 193 corresponding to the observation channel 175.

[0115] In this way, the jet boiling phenomenon of the heat transfer surface can be directly observed and recorded through the observation window 195 and the transparent parts. Understandably, a sealed cover is formed by combining multiple transparent parts at this time.

[0116] In one feasible implementation, such as Figure 9 and Figure 10 As shown, the base 190 includes a support platform 192 and a base plate 191 that are integrally connected. The support platform 192 has a stepped hole that is larger at the top and smaller at the bottom. The larger end of the stepped hole forms a mounting groove 193, and the smaller end of the stepped hole forms a support groove 194. A support plate (not shown) is inserted into the support groove 194. The support plate supports the electric heating element 181, and the support plate has a through hole for the power cord to pass through.

[0117] The base plate 191 of the base 190 can be fixedly connected to the experimental platform by bolts. The support plate may include an upper support base and a bottom mounting plate. The support base extends into the support groove 194 and supports the electric heating element 181. A wire through hole is opened in the center of the support base. The mounting plate is snapped into a pre-set slot on the bottom surface and is bolted to the base plate 191.

[0118] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" in the description of this application should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0119] The terms “upper,” “lower,” “front,” “back,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0120] The term "multiple" means two or more, unless otherwise specified precisely.

[0121] The terms “first,” “second,” “third,” “fourth,” etc., (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can include implementations in sequences other than those illustrated or described herein.

[0122] The terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An experimental device for ultra-high heat flux density cooling of microjets based on wake extraction and boiling, characterized in that, Includes a sealing cover, microjet tube, tail suction tube, and pressure replenishment pipe; The sealing cover is used to seal the heat transfer surface of the component to be cooled; Multiple sets of micro-jet tubes and tailflow suction tubes are arranged in a one-to-one correspondence. The micro-jet tubes in the same set are coaxially sleeved inside the tailflow suction tube. The micro-jet tubes and tailflow suction tubes in the set are arranged perpendicular to the heat transfer surface and distributed in an array along the surface of the heat transfer surface. The tube holes of the micro-jet tubes and tailflow suction tubes have a size of hundreds of micrometers to millimeters. The tail flow suction tube and the micro-jet tube are inserted into the sealing cover at one end and the heat transfer surface at a set distance; The end of the microjet tube away from the heat transfer surface is connected to the jet injector; The end of the tail flow suction pipe away from the heat transfer surface and the portion of the tail flow suction pipe surrounding the micro-jet tube are connected to the suction pump. The pressure-replenishing pipe passes through the sealing cover and is open to the atmosphere; The cross-sectional shape of the wake suction pipe corresponds to the shape of the heat transfer surface; the gap between the outer walls of adjacent wake suction pipes is 0.4 mm - 0.6 mm.

2. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 1, characterized in that, The heat transfer surface has a shape that includes a square or a rectangle, and the cross-sectional shape of the wake suction pipe is a square ring or a rectangular ring.

3. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 1, characterized in that, The microjet tube includes a circular tube, and the wake suction tube includes a square tube.

4. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 3, characterized in that, The inner diameter of the microjet tube is 0.3 mm - 0.5 mm, and the inner side length of the tailflow suction tube is 1.5 mm - 1.7 mm.

5. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to any one of claims 1-4, characterized in that, Each of the multiple microjet tubes is connected to a jet injector, or a set number of the microjet tubes are connected to a jet injector via a common jet conduit. Each of the multiple wake suction pipes is connected to a suction pump, or a set number of the wake suction pipes are connected to a suction pump via a common wake suction pipe.

6. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to any one of claims 1-4, characterized in that, It also includes a first support base, a second support base, and a base that are sealed and connected from top to bottom. The first support base is provided with a jet pipe, the second support base is provided with a tail flow suction pipe and a pressure replenishment pipe, and the top surface of the base is provided with an installation groove, and the part to be cooled is placed at the bottom of the installation groove. The micro-jet tube passes through the second support base from top to bottom, with its upper end connected to the jet pipe via a pre-set jet channel on the first support base, and its lower end extending into the mounting groove. The tail flow suction tube passes through the middle and lower part of the second support base. The upper end of the tail flow suction tube is connected to the tail flow suction pipe through a suction channel preset on the second support base around the micro jet tube, and the lower end extends into the mounting groove. The pressure-replenishing pipe is connected to the mounting groove via the pressure-replenishing channel on the second support.

7. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 6, characterized in that, The first support base includes a jet mounting base and a jet support plate that are integrally connected from top to bottom; The jet mounting base is used to connect the jet pipe, and the jet support plate is connected to the second support base by the first fastening bolt; The jet mounting base is provided with a jet channel extending from the jet pipe connection to a pre-set jet groove on the lower end face of the jet support plate.

8. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 6, characterized in that, The second support includes a microjet mounting plate, a suction mounting base, and a pressure-repairing mounting base integrally connected from top to bottom; The microjet mounting plate is used to connect to the first support base; the suction mounting base is used to connect to the tail suction pipe; the pressure-replenishing mounting base is used to connect to the pressure-replenishing pipe, and the pressure-replenishing mounting base is connected to the base by a second fastening bolt; The microjet mounting plate has microjet tube mounting holes extending from top to bottom inside, the suction mounting base has tail flow suction tube mounting holes extending from top to bottom inside, and the pressure replenishing mounting base has pressure replenishing channels extending from top to bottom inside.

9. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 8, characterized in that, An electric heating element is connected to the lower center of the part to be cooled. A pressing protrusion extending into the mounting groove is provided below the pressure-repairing mounting base. The pressing protrusion surrounds the outer periphery of the part to be cooled corresponding to the electric heating element and forms the sealing cover. An outwardly penetrating observation channel is opened at the side position of the heat transfer surface of the component to be cooled corresponding to the pressing protrusion. The observation channel is filled with a transparent component, and an observation window is provided on the side wall of the mounting groove corresponding to the observation channel.

10. The experimental apparatus for ultra-high heat flux density cooling of microjets based on wake extraction according to claim 9, characterized in that, The base includes an integrally connected support platform and a base plate. The support platform has a stepped hole that is larger at the top and smaller at the bottom. The larger end of the stepped hole forms the mounting groove, and the smaller end of the stepped hole forms the support groove. A support plate is inserted into the support groove. The support plate supports the electric heating element, and the support plate has a through hole for the power cord to pass through.

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