Glue dipping disc module, glue dipping device and die bonding equipment

Abstract

The invention relates to the technical field of chip packaging, in particular to a glue dipping disc module, a glue dipping device and die bonding equipment. The invention provides a glue dipping disc module. The glue dipping disc module comprises a mounting seat, a magnetic driving assembly and a glue dipping disc, the mounting seat comprises a first mounting seat and a second mounting seat which are detachably connected, the magnetic driving assembly comprises a first magnetic driving part and a second magnetic driving part, the first magnetic driving part and the second magnetic driving part are in transmission connection through magnetic force, and the first magnetic driving part is arranged on the upper surface of the first mounting seat; the second magnetic driving part is arranged at the end, away from the first mounting seat, of the second mounting seat and penetrates through the second mounting seat, and the glue dipping disc is connected with the end, away from the first magnetic driving part, of the second magnetic driving part. The magnetic driving assembly is arranged on the detachable mounting seat, so that the difficulty of mounting and maintenance is reduced, and the driving part is in magnetic transmission, so that the problem of frictional wear is avoided, the service life of equipment is prolonged, and the maintenance cost of the equipment is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, and in particular to a glue dipping disc module, a glue dipping device and a crystal bonding device. Background Art

[0002] Glue dipping is an important step in the chip packaging process. When packaging semiconductor chips, the glue dipping head dips the glue and then applies it on the lead frame or its PCB board so that the semiconductor chip can be bonded to the corresponding position of the lead frame.

[0003] In traditional dipping devices, each time the dipping head completes the dipping and dispensing of a row of semiconductor chips, the corresponding dipping motor will drive the dipping plate to rotate one degree or a large angle through transmission structures such as gears for the next dipping. This intermittent rotation is not only inefficient, but also puts a burden on the transmission structure, making it prone to failure.

[0004] Secondly, the driving components of the traditional glue dipping device are usually integrated on a mounting base, which makes installation, disassembly and maintenance difficult and inefficient. Summary of the invention

[0005] In order to solve the problems of difficult installation and maintenance and short service life of the existing glue dipping device, the present invention provides a glue dipping disc module, a glue dipping device and a die bonding device.

[0006] In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions: a glue dipping tray module, comprising a mounting seat, a magnetic drive assembly and a glue dipping tray; the mounting seat comprises a first mounting seat and a second mounting seat that are detachably connected, the magnetic drive assembly comprises a first magnetic drive component and a second magnetic drive component, the first magnetic drive component and the second magnetic drive component are connected by magnetic transmission, the first magnetic drive component is arranged on the upper surface of the first mounting seat, the second magnetic drive component is arranged at an end of the second mounting seat away from the first mounting seat, and passes through the second mounting seat, and the glue dipping tray is connected to an end of the second magnetic drive component away from the first magnetic drive component.

[0007] Preferably, adjacent ends of the first magnetic driving component and the second magnetic driving component are respectively sleeved with magnetic components, the first magnetic driving component and the second magnetic driving component are gap-matched, the first magnetic driving component drives the second magnetic driving component to rotate through the magnetic component, and the gap size between the first magnetic driving component and the second magnetic driving component is 0.3mm-0.7mm.

[0008] Preferably, an annular limiting groove is provided above the first mounting seat, and the first magnetic driving component is arranged in the annular limiting groove.

[0009] Preferably, a fixing block is provided at one end of the second mounting seat close to the second magnetic driving member, a scraper plate is connected to the fixing block, and the scraper plate is rotatably matched with the glue dipping plate.

[0010] Preferably, the fixing block is further provided with an adjusting knob, and the adjusting knob is used to adjust the distance between the bottom surface of the scraper plate and the glue dipping plate, and the distance between the bottom surface of the scraper plate and the glue dipping plate is 0.5mm-2mm.

[0011] Preferably, an inclined channel is provided at the bottom of the scraper plate, and the inclined channel is inclined downward along the rotation direction of the glue dipping plate, and the angle between the inclined channel and the glue dipping plate is 20-30 degrees.

[0012] In order to solve the above technical problems, the present invention provides another technical solution as follows: a glue dipping device, comprising a Z-axis module, a glue dipping module and a glue dipping tray module as described in any of the above items, wherein the glue dipping tray module is arranged on the Z-axis module, and the glue dipping module is arranged on the side of the Z-axis module close to the glue dipping tray.

[0013] Preferably, the Z-axis module includes a Z-axis driving component, the glue dipping module is fixed on the Z-axis driving component, and the glue dipping module includes an X-axis driving component and a glue dipping needle connected to the X-axis driving component; the glue dipping module is driven up and down by the Z-axis driving component, and the glue dipping needle is driven left and right by the X-axis driving component, and the Z-axis driving component and the X-axis driving component can work simultaneously.

[0014] Preferably, the glue dipping module comprises a glue dipping needle, and the glue dipping needle comprises a sleeve, a glue dipping head and an elastic element. The elastic element is accommodated in the sleeve, and the glue dipping head is partially accommodated in the sleeve and connected to the elastic element.

[0015] In order to solve the above technical problems, the present invention provides another technical solution as follows: a solid crystal device, comprising a track device, a feeding device, a dipping device, a mounting device and a unloading device are sequentially arranged along the length direction of the track device, the dipping device comprises a Z-axis module, a dipping module and a dipping tray module as described in any one of the above items; the dipping tray module is arranged on the Z-axis module, and the dipping module is arranged on the side of the Z-axis module close to the dipping tray; the Z-axis module comprises a Z-axis driving member, the dipping module is fixed on the Z-axis driving member, the dipping module comprises an X-axis driving member, and a dipping needle connected to the X-axis driving member; the dipping module moves up and down by the drive of the Z-axis driving member, the dipping needle moves left and right by the drive of the X-axis driving member, and the Z-axis driving member and the X-axis driving member can work simultaneously; the dipping module comprises a dipping needle, and the dipping needle comprises a sleeve, a dipping head and an elastic element, the elastic element is accommodated in the sleeve, and the dipping head is partially accommodated in the sleeve and connected to the elastic element.

[0016] Compared with the prior art, the glue dipping tray module, glue dipping device and die bonding equipment provided by the present invention have the following beneficial effects: 1. A glue dipping tray module provided in an embodiment of the present invention drives the glue dipping tray to rotate through a magnetic drive component to ensure that the glue dipping head can evenly dip the required amount of glue from the glue dipping tray to ensure the final glue dipping quality.

[0017] It can be understood that the first mounting seat and the second mounting seat are detachably connected, so that when the device fails or requires maintenance, the corresponding components can be removed for repair or replacement, thereby improving maintenance efficiency, while reducing interference with other components during the maintenance process and reducing the time and cost required for maintenance.

[0018] In addition, magnetic drive components use magnetic transmission to avoid friction and wear problems in traditional mechanical transmission, thereby extending the service life of the equipment and reducing equipment maintenance costs; therefore, the magnetic drive component can be used to drive the glue dipping disc to rotate continuously, so that the glue dipping head can quickly dip into glue, thereby improving the glue dipping efficiency.

[0019] 2. The first magnetic driving component and the second magnetic driving component provided in the embodiment of the present invention are clearance-matched, and the non-contact transmission between the two reduces energy loss and improves transmission efficiency. At the same time, since there is no mechanical connection between the first magnetic driving component and the second magnetic driving component, the structure of the transmission device is simplified, making it more compact, lightweight, and easy to disassemble, debug and maintain; secondly, since the magnetic drive assembly is a contactless transmission, there is no need to use lubricants on the transmission points, reducing environmental pollution and waste disposal costs.

[0020] 3. The first magnetic driving component provided in the embodiment of the present invention is fixed above the first mounting seat, and its output end is accommodated in the annular limiting groove. The annular limiting groove can effectively limit the horizontal movement of the first magnetic driving component and the shaking during the transmission process, thereby enhancing the stability and reliability of the magnetic driving component.

[0021] 4. A scraper plate is provided above the glue dipping tray provided in the embodiment of the present invention. The scraper plate is fixed above the glue dipping tray and maintains a certain gap with the glue dipping tray, so that the glue can be scraped flat when the glue dipping tray rotates to ensure that the thickness of the glue dipped by the glue dipping head is uniform each time, avoiding glue accumulation in the glue dipping tray or forming an uneven glue layer, which affects the glue dipping effect.

[0022] 5. The adjustment knob provided in the embodiment of the present invention is used to adjust the distance between the scraper plate and the dip sticking plate. Specifically, the adjustable distance range between the scraper plate and the dip sticking plate is 0.5-2mm, which can meet the dip sticking requirements of most chips. The user can adjust the distance between the scraper plate and the dip sticking plate according to specific process requirements, so that the glue layer on the dip sticking plate maintains a specific thickness to meet the corresponding dip sticking process requirements and ensure the quality of the final product. Through this design, the dip sticking plate can meet different process requirements.

[0023] 6. The inclined channel provided by the embodiment of the present invention is inclined downward along the rotation direction of the glue dipping disc. Specifically, the angle between the inclined channel and the glue dipping disc is greater than 0 and less than 45 degrees, so that excess glue can accumulate at the rear end of the inclined channel, while the glue at the front end of the inclined channel is maintained at a specific thickness. As the glue dipping disc rotates, the area of ​​the glue dipping disc where the glue has been dipped will rotate to the rear end of the inclined channel, and the glue originally accumulated at the rear end of the inclined channel will fill it, so that the area to be dipped in glue of the glue dipping disc always maintains a certain thickness of glue layer, specifically a thickness of 0.5-2mm.

[0024] 7. An embodiment of the present invention also provides a glue dipping device, wherein the glue dipping module is arranged on the side of the Z-axis module close to the glue dipping tray, thereby reducing the moving distance of the glue dipping module to the glue dipping tray for dipping and taking glue, and improving the glue dipping efficiency; the glue dipping tray module and the glue dipping module are arranged on the adjacent sides of the Z-axis module, so that the overall structure of the glue dipping device is compact and the space utilization rate is high.

[0025] 8. The glue dipping head provided in the embodiment of the present invention is moved up and down by the Z-axis driving member on the Z-axis module, and is moved left and right by the X-axis driving member on the glue dipping module. Since the Z-axis driving member and the X-axis driving member are respectively arranged on two independent modules, the Z-axis driving member and the X-axis driving member can work at the same time, thereby improving the moving efficiency of the glue dipping head; Secondly, since only the X-axis drive component is retained on the glue dipping module, the weight of the glue dipping module is reduced, giving it a better force control effect, enabling more precise glue dipping operations and improving glue dipping accuracy.

[0026] 9. The glue dipping head provided in the embodiment of the present invention is partially accommodated in the sleeve and connected to the elastic element in the sleeve, so that the glue dipping head can move along the length direction of the sleeve, so as to flexibly dip the glue and apply it to the target position to adapt to different work requirements; during the glue dipping process, the elastic force of the elastic element can maintain the stability and accuracy of the glue dipping head. When the glue dipping head contacts the target position, the buffering effect of the elastic element can reduce the impact force on the glue dipping head, thereby avoiding uneven glue application or damage to the target position.

[0027] 10. An embodiment of the present invention further provides a solid crystal device, comprising a track device, along the length direction of the track device are sequentially arranged a loading device, a dipping device, a mounting device and a unloading device, the dipping device comprising a Z-axis module, a dipping module and a dipping tray module as described in any one of the above items; the dipping tray module is arranged on the Z-axis module, and the dipping module is arranged on the side of the Z-axis module close to the dipping tray; the Z-axis module comprises a Z-axis driving member, the dipping module is fixed on the Z-axis driving member, the dipping module comprises an X-axis driving member, and a dipping needle connected to the X-axis driving member; the dipping module moves up and down by the drive of the Z-axis driving member, and the dipping needle moves left and right by the drive of the X-axis driving member, and the Z-axis driving member and the X-axis driving member can work simultaneously; the dipping module comprises a dipping needle, and the dipping needle comprises a sleeve, a dipping head and an elastic element, the elastic element is accommodated in the sleeve, the dipping head part is accommodated in the sleeve, and the elastic element is connected to the elastic element.

[0028] It has the same beneficial effects as the glue dipping tray module described in any of the above items, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 It is a structural schematic diagram of the glue dipping tray module provided in the first embodiment of the present invention.

[0031] Figure 2 It is a schematic diagram of the exploded structure of the mounting base and the magnetic drive assembly provided in the first embodiment of the present invention.

[0032] Figure 3It is a schematic diagram of the exploded structure of the glue dipping disc module provided in the first embodiment of the present invention.

[0033] Figure 4 It is a cross-sectional view of a scraper provided by the first embodiment of the present invention.

[0034] Figure 5 The structure of the glue dipping device provided by the second embodiment of the present invention is shown in FIG. Figure 1 .

[0035] Figure 6 The structure of the glue dipping device provided by the second embodiment of the present invention is shown in FIG. Figure 2 .

[0036] Figure 7 It is a schematic structural diagram of a glue dipping needle provided in the second embodiment of the present invention.

[0037] Figure 8 It is a schematic structural diagram of a die bonding device provided in the third embodiment of the present invention.

[0038] Description of the accompanying drawings: 100. Crystal bonding equipment; 10. Glue dipping device; 20. Track device; 30. Loading device; 40. Mounting device; 50. Unloading device; 1. Glue plate module; 2. Glue dipping module; 3. Z-axis module; 11. Mounting seat; 111. First mounting seat; 1111. Annular limiting groove; 112. Second mounting seat; 113. Fixing block; 114. Adjusting knob; 115. Knob fixing piece; 12. Magnetic drive assembly; 121. First magnetic drive component; 122. Second magnetic drive component; 123. Magnetic component; 13. Glue dipping plate; 131. Glue scraping plate; 1311. Inclined channel; 21. X-axis driving part; 22. Glue dipping needle; 221. Sleeve; 222. Glue dipping head; 223. Elastic element; 224. Fastener; 31. Z-axis driving component; 32. Fixed seat. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0041] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0042] In various embodiments of the present invention, it should be understood that the size of the sequence number of each process does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0043] The flow chart and block diagram in the accompanying drawings of the present invention illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be particularly noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs a specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0044] See also Figure 1 and Figure 2The first embodiment of the present invention provides a glue dipping tray module 1, including a mounting seat 11, a magnetic drive assembly 12 and a glue dipping tray 13; the mounting seat 11 includes a first mounting seat 111 and a second mounting seat 112 that are detachably connected, the magnetic drive assembly 12 includes a first magnetic drive component 121 and a second magnetic drive component 122, the first magnetic drive component 121 and the second magnetic drive component 122 are connected by magnetic transmission, the first magnetic drive component 121 is arranged on the upper surface of the first mounting seat 111, the second magnetic drive component 122 is arranged at an end of the second mounting seat 112 away from the first mounting seat 111, and passes through the second mounting seat 112, and the glue dipping tray 13 is connected to an end of the second magnetic drive component 122 away from the first magnetic drive component 121.

[0045] As a feasible implementation mode, the first magnetic driving component 121 and the second magnetic driving component 122 are respectively arranged on the first mounting seat 111 and the second mounting seat 112 which are detachably connected, so that when the corresponding driving component fails or needs maintenance, the corresponding components can be removed for repair or replacement, thereby improving the maintenance efficiency, reducing the interference with other components during the maintenance process, and reducing the time and cost required for maintenance.

[0046] It should be noted that the second magnetic driving component 122 is arranged at the end of the second mounting seat 112 away from the first mounting seat 111, that is, the second magnetic driving component 122 is located at the edge of the mounting seat 11, so that the glue dipping plate 13 connected to the second magnetic driving component 122 is also located at the edge of the mounting seat 11, thereby reducing the distance from the glue dipping component to the glue dipping plate 13 to take glue, thereby improving the glue dipping efficiency, and at the same time, avoiding interference between the glue dipping component and the mounting seat 11 when removing the glue.

[0047] It should be further explained that the second magnetic driving component 122 is arranged at an end of the second mounting seat 112 away from the first mounting seat 111 and passes through the second mounting seat 112. The glue dipping plate 13 is connected to the second magnetic driving component 122 below the second mounting seat 112, so that the mounting seat 11 provides a certain wind shielding effect for the glue dipping plate 13 to slow down the drying speed of the glue on the glue dipping plate 13.

[0048] It can be understood that the magnetic drive components 12 avoid friction and wear problems in traditional mechanical transmission through magnetic transmission, thereby extending the service life of the equipment and reducing the maintenance cost of the equipment; since friction and wear are avoided, the magnetic drive component can drive the glue dipping plate 13 to rotate continuously, so that the glue dipping component can quickly dip into glue, thereby improving the glue dipping efficiency.

[0049] Optionally, the first magnetic driving component 121 is a driving motor.

[0050] Furthermore, an annular limiting groove 1111 is provided above the first mounting seat 111 , and the first magnetic driving component 121 is disposed in the annular limiting groove 1111 .

[0051] It should be noted that the size and shape of the annular limit groove 1111 match the output end of the first magnetic driving component 121 to ensure that the first magnetic driving component 121 can be stably installed in the annular limit groove 1111. The first magnetic driving component 121 is fixedly connected to the outer edge of the annular limit groove 1111, and the output end of the first magnetic driving component 121 is accommodated in the annular limit groove 1111. The restriction of the annular limit groove 1111 can limit the horizontal movement of the first magnetic driving component 121 and the shaking during the transmission process, thereby enhancing the stability and reliability of the operation of the magnetic driving component 12.

[0052] Furthermore, the adjacent ends of the first magnetic driving component 121 and the second magnetic driving component 122 are respectively sleeved with magnetic components 123, and the first magnetic driving component 121 and the second magnetic driving component 122 are gap-matched. The first magnetic driving component 121 drives the second magnetic driving component 122 to rotate through the magnetic component 123, and the gap size between the first magnetic driving component 121 and the second magnetic driving component 122 is 0.3mm-0.7mm.

[0053] Specifically, the magnetic member 123 is respectively sleeved on the output shaft of the first magnetic driving member 121 and the input shaft of the second magnetic driving member 122 , and the output shaft of the second magnetic driving member 122 is connected to the glue dipping plate 13 .

[0054] It can be understood that the first magnetic driving component 121 and the second magnetic driving component 122 are connected by magnetic transmission, thereby driving the glue dipping tray 13 to rotate, thereby preventing the glue dipping component from taking glue from the same position of the glue dipping tray 13 every time, resulting in uneven glue taking. That is, the rotation of the glue dipping tray 13 can ensure that the glue dipping component can evenly take the required amount of glue from the glue dipping tray 13, thereby ensuring the final glue dipping quality.

[0055] It should be noted that the first magnetic driving component 121 and the second magnetic driving component 122 realize power transmission through the interaction between the magnetic poles of the magnetic component 123 arranged thereon. When the first magnetic driving component 121 rotates, the magnetic component 123 mounted thereon will also rotate, thereby generating a changing magnetic field, which will act on the magnetic component 123 on the second magnetic driving component 122, thereby causing the second magnetic driving component 122 to also rotate accordingly.

[0056] Optionally, the magnetic member 123 may be configured to be cylindrical, disc-shaped, or gear-shaped, etc., and may be configured specifically according to actual transmission requirements and space layout requirements.

[0057] As a preferred embodiment, the magnetic part 123 is set to be cylindrical. The cylindrical magnetic part 123 has a regular shape, which is easy to process and manufacture, and is also convenient for installation and maintenance. Secondly, the cylindrical magnetic part 123 has a stable structure and can bear large radial and axial loads, ensuring the stability and reliability of the transmission.

[0058] It can be understood that the first magnetic driving component 121 and the second magnetic driving component 122 are gap-fitted, and power is transmitted through magnetism as a medium, thereby realizing non-contact transmission. Compared with the transmission method of mechanical engagement, the non-contact transmission reduces the energy loss of mechanical friction and improves the transmission efficiency. Since there is no mechanical contact, noise and vibration caused by friction will not be generated, thereby reducing noise pollution.

[0059] Optionally, the gap between the first magnetic driving component 121 and the second magnetic driving component 122 may be 0.3 mm-0.7 mm.

[0060] It should be understood that the first magnetic driving component 121 can drive the second magnetic driving component 122 to rotate within a spacing of 0.3mm-0.7mm. If the gap is less than 0.3mm, the first magnetic driving component 121 and the second magnetic driving component 122 are likely to collide when they rotate relative to each other; conversely, if the gap is greater than 0.7mm, the attraction and repulsion between the first magnetic driving component 121 and the second magnetic driving component 122 will be greatly reduced, thereby reducing the magnetic transmission efficiency.

[0061] Specifically, since there is no mechanical connection between the first magnetic drive component 121 and the second magnetic drive component 122, the structure of the transmission device is simplified, making it more compact, lightweight, and easy to disassemble, debug and maintain; secondly, since the magnetic drive component 12 is a contactless transmission, there is no need to use lubricants on the transmission points, reducing environmental pollution and waste disposal costs.

[0062] On the other hand, the first magnetic driving component 121 and the second magnetic driving component 122 are non-contact transmission. When the load of the second magnetic driving component 122 is too large, although the second magnetic driving component 122 cannot operate synchronously with the first magnetic driving component 121, it will not cause damage to the first magnetic driving component 121, thereby improving the reliability and safety of the equipment.

[0063] Optionally, the first magnetic driving component 121 and the second magnetic driving component 122 are axially vertically arranged or horizontally arranged.

[0064] As a feasible implementation mode, the first magnetic driving component 121 is fixed above the first mounting seat 111, and its rotation axis is parallel to the upper surface of the first mounting seat 111. The second magnetic driving component 122 is arranged on the second mounting seat 112, and its rotation axis is perpendicular to the upper surface of the second mounting seat 112 and extends toward the lower surface, that is, the rotation axes of the second magnetic driving component 122 and the second magnetic driving component 122 are perpendicular to each other. The vertical arrangement of the two makes the entire transmission mechanism more compact, which is conducive to space saving and relatively simple to install. The vertical design of the second magnetic driving component 122 and the second magnetic driving component 122 enables the magnetic component 123 to more effectively utilize the magnetic field energy when transmitting torque and reduce energy loss.

[0065] Please also refer to Figure 3 A fixing block 113 is disposed at one end of the second mounting seat 112 close to the second magnetic driving member 122 , and a scraper plate 131 is connected to the fixing block 113 , and the scraper plate 131 is rotatably matched with the glue dipping plate 13 .

[0066] As a feasible implementation mode, the scraper plate 131 is fixed above the glue dipping disc 13 and maintains a certain gap with the glue dipping disc 13, so that the glue can be scraped flat when the glue dipping disc 13 rotates to ensure that the thickness of the glue dipped each time is uniform, and to avoid glue accumulation in the glue dipping disc 13 or forming an uneven glue layer, which affects the dipping effect.

[0067] Furthermore, an adjusting knob 114 is provided on the fixing block 113, and the adjusting knob 114 is used to adjust the distance between the bottom surface of the scraper plate 131 and the glue dipping plate 13, and the distance between the bottom surface of the scraper plate 131 and the glue dipping plate 13 is 0.5mm-2mm.

[0068] Specifically, the adjustable distance between the scraper plate 131 and the glue dipping plate 13 is in the range of 0.5-2 mm, which can meet the glue dipping requirements of most chips, so that the glue dipping plate 13 can meet the glue dipping and process requirements of various chips.

[0069] It should be noted that a knob fixing member 115 is also provided on the second mounting seat 112, and the knob fixing member 115 is fixedly connected to the second mounting seat 112. The fixing block 113 and the knob fixing member 115 are movably connected via an adjusting knob 114, and the distance between the fixing block 113 and the knob fixing member 115 can be adjusted by adjusting the knob 114.

[0070] It can be understood that the scraper plate 131 is arranged on the fixed block 113, the knob fixing part 115 is arranged on the second mounting seat 112, and the glue dipping plate 13 is connected to the second magnetic driving part 122 on the second mounting seat 112, that is, the distance between the glue dipping plate 13 and the knob fixing part 115 is relatively fixed. Therefore, when the distance between the fixed block 113 and the knob fixing part 115 changes, the distance between the scraper plate 131 and the glue dipping plate 13 also changes accordingly.

[0071] The user can adjust the distance between the scraper plate 131 and the glue dipping plate 13 by adjusting the knob 114 according to specific process requirements, so that the glue layer on the glue dipping plate 13 maintains a specific thickness to meet the corresponding glue dipping process requirements and ensure the quality of the final product; through this design, the glue dipping plate 13 can meet different process requirements.

[0072] Please also refer to Figure 4 An inclined channel 1311 is provided at the bottom of the scraper plate 131. The inclined channel 1311 is inclined downward along the rotation direction of the glue dipping plate 13. The angle between the inclined channel 1311 and the glue dipping plate 13 is 20-30 degrees.

[0073] As a feasible implementation, the inclined channel 1311 is downward along the rotation direction of the glue dipping plate 13, that is, inclined toward the glue dipping plate 13, and the channel opening at the front end of the inclined channel 1311 along the rotation direction of the glue dipping plate 13 is smaller than the channel opening at the rear end, so that the rear end of the inclined channel 1311 can be used to store excess glue, and the smaller opening at the front end means that the excess glue at the rear end will not affect the glue scraping effect at the front end.

[0074] Optionally, the cross-section of the inclined channel 1311 or its opening may be rectangular, arched, trapezoidal, etc., and may be specifically set according to actual conditions.

[0075] It can be understood that the inclined channel 1311 is inclined downward along the rotation direction of the glue dipping tray 13, so that excess glue can accumulate at the rear end of the inclined channel 1311, while the glue at the front end of the inclined channel 1311 is maintained at a specific thickness. As the glue dipping tray 13 rotates, the area of ​​the glue dipping tray 13 where the glue has been dipped will rotate to the rear end of the inclined channel 1311, and the glue originally accumulated at the rear end of the inclined channel 1311 will fill it, so that the area to be dipped in glue of the glue dipping tray 13 always maintains a certain thickness of glue layer, thereby ensuring the smooth execution of the dipping process.

[0076] Optionally, the range of values ​​of the angle between the inclined channel 1311 and the glue dipping plate 13 includes but is not limited to any point value of 20, 23, 25, 27, 30 or a range value between any two of them.

[0077] See also Figure 5 - Figure 6The second embodiment of the present invention further provides a glue dipping device 10, comprising a Z-axis module 3, a glue dipping module 2 and a glue dipping tray module 1 as described in any of the above items, wherein the glue dipping tray module 1 is arranged on the Z-axis module 3, and the glue dipping module 2 is arranged on the side of the Z-axis module 3 close to the glue dipping tray 13.

[0078] It can be understood that the glue dipping tray module 1 and the glue dipping module 2 are arranged on adjacent sides of the Z-axis module 3, so that the overall structure of the glue dipping device 10 is compact and the space utilization rate is high.

[0079] Specifically, the glue dipping module 2 is arranged on the side of the Z-axis module 3 close to the glue dipping tray 13, which reduces the moving distance required for the glue dipping head 222 to dip and take glue from the glue dipping tray 13, thereby improving the glue dipping efficiency.

[0080] It can be understood that the glue dipping device 10 provided in this embodiment has the same beneficial effects as the glue dipping tray module 1 described in any of the above items, which will not be described in detail here.

[0081] Furthermore, the Z-axis module 3 includes a Z-axis driving component 31 , the glue dipping module 2 is fixed on the Z-axis driving component 31 , and the glue dipping module 2 includes an X-axis driving component 21 and a glue dipping needle 22 connected to the X-axis driving component 21 .

[0082] It should be noted that the Z-axis module 3 includes a fixed seat 32, a Z-axis driving member 31 is arranged on the first side surface of the fixed seat 32, and is slidably connected to the fixed seat 32, the glue dipping module 2 is fixed on the Z-axis driving member 31, and the glue dipping module 2 is driven to move up and down as a whole by the Z-axis driving member 31; and the glue dipping needle 22 is moved left and right by the X-axis driving member 21 on the glue dipping module 2, that is, the glue dipping head 222 is moved in the X and Y axis directions under the joint action of the Z-axis driving member 31 and the X-axis driving member 21. Specifically, the movement trajectory of the glue dipping head 222 during the glue dipping process of the glue dipping device 10 is as follows Figure 5 Shown by dotted line.

[0083] It can be understood that the present embodiment separates the Z-axis driving component 31 from the glue dipping module 2, thereby reducing the weight of the glue dipping module 2 without affecting the movement effect of the glue dipping head 222, so that the glue dipping module 2 has a better force control effect, and the glue dipping head 222 can perform more precise operations, thereby improving the glue dipping accuracy; at the same time, the Z-axis driving component and the X-axis driving component are respectively arranged on two independent modules, so that they can work at the same time, thereby improving the movement efficiency of the glue dipping head, and the separate arrangement of the two also facilitates installation and maintenance, reducing the cost of parts repair and replacement.

[0084] For further information, see Figure 7The glue dipping module 2 includes a glue dipping needle 22 , which includes a sleeve 221 , a glue dipping head 222 and an elastic element 223 . The elastic element 223 is accommodated in the sleeve 221 , and the glue dipping head 222 is partially accommodated in the sleeve 221 and connected to the elastic element 223 .

[0085] It should be noted that the sleeve 221 has a hollow chamber inside, and the elastic element 223 is accommodated in the chamber. A fastener 224 is provided at one end of the sleeve 221 away from the glue dipping head 222. One end of the elastic element 223 is connected to the fastener 224, and the other end is connected to the glue dipping head 222.

[0086] It can be understood that the glue dipping head 222 is partially accommodated in the sleeve 221 and is elastically connected to the elastic element 223 in the sleeve 221, so that the glue dipping head 222 can move along the length direction of the sleeve 221, so that it can flexibly dip the glue and apply it to the target position to meet different work requirements.

[0087] Specifically, during the glue dipping process, the elastic force of the elastic element 223 can maintain the stability and accuracy of the glue dipping head 222. When the glue dipping head 222 contacts the target position, the buffering effect of the elastic element 223 can reduce the impact force on the glue dipping head 222, thereby avoiding uneven glue smearing or damage to the target position.

[0088] See also Figure 8 The third embodiment of the present invention further provides a die bonding device 100 for mounting a chip on a substrate, comprising a track device 20, wherein a loading device 30, a glue dipping device 10, a mounting device 40 and a unloading device 50 are sequentially arranged along the length direction of the track device 20, and the glue dipping device 10 comprises a Z-axis module 3, a glue dipping module 2 and a glue dipping tray module 1 as described in any one of the above items; the glue dipping tray module 1 is arranged on the Z-axis module 3, and the glue dipping module 2 is arranged on the side of the Z-axis module 3 close to the glue dipping tray 13; the Z-axis module 3 comprises a Z-axis driving member 31, and the glue dipping module 2 is fixed to the Z-axis driving member 31, the glue dipping module 2 includes an X-axis driving component 21, and a glue dipping needle 22 connected to the X-axis driving component 21; the glue dipping module 2 moves up and down through the drive of the Z-axis driving component 31, and the glue dipping needle 22 moves left and right through the drive of the X-axis driving component 21, and the Z-axis driving component 31 and the X-axis driving component 21 can work simultaneously; the glue dipping module 2 includes the glue dipping needle 22, and the glue dipping needle 22 includes a sleeve 221, a glue dipping head 222 and an elastic element 223, the elastic element 223 is accommodated in the sleeve 221, and the glue dipping head 222 is partially accommodated in the sleeve 221 and connected to the elastic element 223.

[0089] It can be understood that the crystal bonding equipment 100 provided in this embodiment completes the gluing process and the mounting process while circulating the substrate along the length direction of the track device 20, and the corresponding loading device 30, unloading device 50, glue dipping device 10, mounting device 40, etc. are compactly arranged around the track device 20, so that the space is reasonably utilized, the transportation distance of various materials is reduced, the production efficiency is improved, and the equipment is also made more miniaturized, which is conducive to the efficient layout and optimization of the production line.

[0090] The die bonding device 100 provided in this embodiment also has the same beneficial effects as the glue dipping tray module 1 and the glue dipping device 10 described in any of the above items, which will not be described in detail here.

[0091] Compared with the prior art, the glue dipping tray module, glue dipping device and die bonding equipment provided by the present invention have the following beneficial effects: 1. A glue dipping tray module provided in an embodiment of the present invention drives the glue dipping tray to rotate through a magnetic drive component to ensure that the glue dipping head can evenly dip the required amount of glue from the glue dipping tray to ensure the final glue dipping quality.

[0092] In addition, magnetic drive components use magnetic transmission to avoid friction and wear problems in traditional mechanical transmission, thereby extending the service life of the equipment and reducing equipment maintenance costs; therefore, the magnetic drive component can be used to drive the glue dipping disc to rotate continuously, so that the glue dipping head can quickly dip into glue, thereby improving the glue dipping efficiency.

[0093] 2. The first magnetic driving component and the second magnetic driving component provided in the embodiment of the present invention are clearance-matched, and the non-contact transmission between the two reduces energy loss and improves transmission efficiency. At the same time, since there is no mechanical connection between the first magnetic driving component and the second magnetic driving component, the structure of the transmission device is simplified, making it more compact, lightweight, and easy to disassemble, debug and maintain; secondly, since the magnetic drive assembly is a contactless transmission, there is no need to use lubricants on the transmission points, reducing environmental pollution and waste disposal costs.

[0094] 3. The first magnetic driving component provided in the embodiment of the present invention is fixed above the first mounting seat, and its output end is accommodated in the annular limiting groove. The annular limiting groove can effectively limit the horizontal movement of the first magnetic driving component and the shaking during the transmission process, thereby enhancing the stability and reliability of the magnetic driving component.

[0095] 4. A scraper plate is provided above the glue dipping tray provided in the embodiment of the present invention. The scraper plate is fixed above the glue dipping tray and maintains a certain gap with the glue dipping tray, so that the glue can be scraped flat when the glue dipping tray rotates to ensure that the thickness of the glue dipped by the glue dipping head is uniform each time, avoiding glue accumulation in the glue dipping tray or forming an uneven glue layer, which affects the glue dipping effect.

[0096] 5. The adjustment knob provided in the embodiment of the present invention is used to adjust the distance between the scraper plate and the dip sticking plate. Specifically, the adjustable distance range between the scraper plate and the dip sticking plate is 0.5-2mm, which can meet the dip sticking requirements of most chips. The user can adjust the distance between the scraper plate and the dip sticking plate according to specific process requirements, so that the glue layer on the dip sticking plate maintains a specific thickness to meet the corresponding dip sticking process requirements and ensure the quality of the final product. Through this design, the dip sticking plate can meet different process requirements.

[0097] 6. The inclined channel provided by the embodiment of the present invention is inclined downward along the rotation direction of the glue dipping disc. Specifically, the angle between the inclined channel and the glue dipping disc is greater than 0 and less than 45 degrees, so that excess glue can accumulate at the rear end of the inclined channel, while the glue at the front end of the inclined channel is maintained at a specific thickness. As the glue dipping disc rotates, the area of ​​the glue dipping disc where the glue has been dipped will rotate to the rear end of the inclined channel, and the glue originally accumulated at the rear end of the inclined channel will fill it, so that the area to be dipped in glue of the glue dipping disc always maintains a certain thickness of glue layer, specifically a thickness of 0.5-2mm.

[0098] 7. An embodiment of the present invention also provides a glue dipping device, wherein the glue dipping module is arranged on the side of the Z-axis module close to the glue dipping tray, thereby reducing the moving distance of the glue dipping module to the glue dipping tray for dipping and taking glue, and improving the glue dipping efficiency; the glue dipping tray module and the glue dipping module are arranged on the adjacent sides of the Z-axis module, so that the overall structure of the glue dipping device is compact and the space utilization rate is high.

[0099] 8. The glue dipping head provided in the embodiment of the present invention is moved up and down by the Z-axis driving member on the Z-axis module, and is moved left and right by the X-axis driving member on the glue dipping module. Since the Z-axis driving member and the X-axis driving member are respectively arranged on two independent modules, the Z-axis driving member and the X-axis driving member can work at the same time, thereby improving the moving efficiency of the glue dipping head; Secondly, since only the X-axis drive component is retained on the glue dipping module, the weight of the glue dipping module is reduced, giving it a better force control effect, enabling more precise glue dipping operations and improving glue dipping accuracy.

[0100] 9. The glue dipping head provided in the embodiment of the present invention is partially accommodated in the sleeve and connected to the elastic element in the sleeve, so that the glue dipping head can move along the length direction of the sleeve, so as to flexibly dip the glue and apply it to the target position to adapt to different work requirements; during the glue dipping process, the elastic force of the elastic element can maintain the stability and accuracy of the glue dipping head. When the glue dipping head contacts the target position, the buffering effect of the elastic element can reduce the impact force on the glue dipping head, thereby avoiding uneven glue application or damage to the target position.

[0101] 10. An embodiment of the present invention further provides a solid crystal device, comprising a track device, along the length direction of the track device are sequentially arranged a loading device, a dipping device, a mounting device and a unloading device, the dipping device comprising a Z-axis module, a dipping module and a dipping tray module as described in any one of the above items; the dipping tray module is arranged on the Z-axis module, and the dipping module is arranged on the side of the Z-axis module close to the dipping tray; the Z-axis module comprises a Z-axis driving member, the dipping module is fixed on the Z-axis driving member, the dipping module comprises an X-axis driving member, and a dipping needle connected to the X-axis driving member; the dipping module moves up and down by the drive of the Z-axis driving member, and the dipping needle moves left and right by the drive of the X-axis driving member, and the Z-axis driving member and the X-axis driving member can work simultaneously; the dipping module comprises a dipping needle, and the dipping needle comprises a sleeve, a dipping head and an elastic element, the elastic element is accommodated in the sleeve, the dipping head part is accommodated in the sleeve, and the elastic element is connected to the elastic element.

[0102] It has the same beneficial effects as the glue dipping tray module described in any of the above items, and will not be described in detail here.

[0103] The above is a detailed introduction to a dipping disc module, a dipping device and a solid crystal device disclosed in an embodiment of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention, and any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A glue dipping tray module, characterized in that: Includes mounting base, magnetic drive assembly and dip plate; The mounting seat includes a first mounting seat and a second mounting seat that are detachably connected, and the magnetic drive assembly includes a first magnetic drive component and a second magnetic drive component, the first magnetic drive component and the second magnetic drive component are connected by magnetic transmission, the first magnetic drive component is arranged on the upper surface of the first mounting seat, the second magnetic drive component is arranged at an end of the second mounting seat away from the first mounting seat, and passes through the second mounting seat, and the glue dipping plate is connected to an end of the second magnetic drive component away from the first magnetic drive component.

2. The glue-dipping tray module according to claim 1, characterized in that: The adjacent ends of the first magnetic driving component and the second magnetic driving component are respectively sleeved with magnetic components, and the first magnetic driving component and the second magnetic driving component are gap-matched. The first magnetic driving component drives the second magnetic driving component to rotate through the magnetic component, and the gap size between the first magnetic driving component and the second magnetic driving component is 0.3mm-0.7mm.

3. The glue tray module according to claim 1, characterized in that: An annular limiting groove is provided above the first mounting seat, and the first magnetic driving component is arranged in the annular limiting groove.

4. The glue tray module according to claim 1, characterized in that: A fixing block is disposed at one end of the second mounting seat close to the second magnetic driving member, and a scraper plate is connected to the fixing block, and the scraper plate is rotatably matched with the glue dipping plate.

5. The glue-dipping tray module according to claim 4, characterized in that: The fixed block is also provided with an adjusting knob, and the adjusting knob is used to adjust the distance between the bottom surface of the scraper plate and the glue dipping plate. The distance between the bottom surface of the scraper plate and the glue dipping plate is 0.5mm-2mm.

6. The glue tray module according to claim 4, characterized in that: An inclined channel is provided at the bottom of the scraper plate, and the inclined channel is inclined downward along the rotation direction of the glue dipping plate, and the angle between the inclined channel and the glue dipping plate is 20-30 degrees.

7. A glue dipping device, characterized in that: It comprises a Z-axis module, a glue dipping module and a glue dipping tray module as described in any one of claims 1 to 6, wherein the glue dipping tray module is arranged on the Z-axis module, and the glue dipping module is arranged on the side of the Z-axis module close to the glue dipping tray.

8. The glue dipping device according to claim 7, characterized in that: The Z-axis module includes a Z-axis driving member, the glue dipping module is fixed on the Z-axis driving member, and the glue dipping module includes an X-axis driving member and a glue dipping needle connected to the X-axis driving member; The glue dipping module is driven to move up and down by the Z-axis driving member, and the glue dipping needle is driven to move left and right by the X-axis driving member. The Z-axis driving member and the X-axis driving member can work simultaneously.

9. The glue dipping device according to claim 7, characterized in that: The glue dipping module comprises a glue dipping needle, which comprises a sleeve, a glue dipping head and an elastic element. The elastic element is accommodated in the sleeve, and the glue dipping head is partially accommodated in the sleeve and connected to the elastic element.

10. A die bonding device, characterized in that: It comprises a track device, and a loading device, a glue dipping device, a mounting device and a unloading device are sequentially arranged along the length direction of the track device, and the glue dipping device comprises a Z-axis module, a glue dipping module and a glue dipping tray module as described in any one of claims 1 to 6; The glue dipping plate module is arranged on the Z-axis module, and the glue dipping module is arranged on the side of the Z-axis module close to the glue dipping plate; The Z-axis module includes a Z-axis driving member, the glue dipping module is fixed on the Z-axis driving member, and the glue dipping module includes an X-axis driving member and a glue dipping needle connected to the X-axis driving member; the glue dipping module moves up and down by the driving of the Z-axis driving member, and the glue dipping needle moves left and right by the driving of the X-axis driving member, and the Z-axis driving member and the X-axis driving member can work simultaneously; The glue dipping module comprises a glue dipping needle, which comprises a sleeve, a glue dipping head and an elastic element. The elastic element is accommodated in the sleeve, and the glue dipping head is partially accommodated in the sleeve and connected to the elastic element.

Images