Automatic chamfering machine for wafer

Abstract

The invention relates to an automatic chamfering machine for a wafer, and the chamfering machine comprises a bearing part which is used for fixing the wafer; the moving part is in running fit with the bearing part; and the grinding part is arranged on the moving part at a fixed point. According to the chamfering device, the moving part is arranged to be in running fit with the bearing part, so that the precision of the moving process along the edge of the wafer can be fully kept in the working process of the polishing part, the deviation between the polishing part and the wafer is reduced, and the chamfering quality is guaranteed.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor processing equipment, and in particular relates to an automatic wafer chamfering machine. Background Art

[0002] At present, in the processing of semiconductors, and specifically in the wafer cutting process, the wafer is placed on a turntable for rotation, and a grinding wheel is brought close to the edge of the turntable to contact the wafer to chamfer it. During the whole process, a common disadvantage of the equipment is that due to the problem of precision adjustment, it is difficult to keep the rotation axis of the turntable and the rotation axis of the grinding wheel sufficiently parallel, which causes the grinding wheel to easily deviate from the edge of the wafer during the process, making it difficult to ensure the quality of the chamfer. Summary of the invention

[0003] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0004] In order to solve the problems in the above background technology, the present invention provides the following technical solutions:

[0005] A wafer automatic chamfering machine, comprising:

[0006] A bearing portion, the bearing portion being used to fix the wafer;

[0007] A moving part, rotatably matched with the bearing part;

[0008] The polishing part is fixedly arranged on the moving part.

[0009] As a preferred technical solution for an automatic wafer chamfering machine, a shaft is rotatably arranged on the moving part, and the grinding part includes a plurality of grinding wheels which are adjustably arranged on the shaft.

[0010] As an optimal technical solution for an automatic wafer chamfering machine, a guide ring is fixedly provided on the carrying part. When the wafer is placed on the carrying part, it is coaxial with the guide ring, and the moving part is configured to slide with the guide ring.

[0011] As a preferred technical solution for an automatic wafer chamfering machine, a driving wheel is rotatably provided on the moving part, and forms a transmission fit with the guide ring.

[0012] As an optimal technical solution for an automatic wafer chamfering machine, it also includes a base, the driving wheel is coaxially driven with the shaft, the bearing part is rotationally matched with the base, and the moving part is relatively fixedly arranged with the base.

[0013] As an optimal technical solution for an automatic wafer chamfering machine, a dual-axis motor is fixedly provided on the moving part, and the shaft and the driving wheel are respectively connected to two ends of the dual-axis motor.

[0014] As an optimal technical solution for an automatic wafer chamfering machine, it also includes a connecting part that rotates with the shaft, and a locking element that is detachably connected to the connecting part. The locking element and the connecting part fix multiple grinding wheels and keep the connecting part fixed to the shaft.

[0015] As a preferred technical solution for an automatic wafer chamfering machine, an alignment portion is provided between any two adjacent grinding wheels, and the locking element is threadedly matched with the connecting portion.

[0016] As a preferred technical solution for an automatic wafer chamfering machine, the connecting portion is connected to a resistance end, and the resistance end forms a resistance fit with the shaft body under the pressure of a locking element.

[0017] As an optimal technical solution for an automatic wafer chamfering machine, a gap is formed between any two adjacent grinding wheels through the alignment portion, and a suction element is provided on one side of the connecting portion, which forms air suction on the inner side of the grinding wheel during rotation.

[0018] The automatic wafer chamfering machine provided by the present invention has the following beneficial effects:

[0019] The present invention arranges the moving part to be rotationally matched with the bearing part, so that the grinding part can fully maintain the accuracy of the movement process along the edge of the wafer during operation, thereby reducing the offset between the grinding part and the wafer, thereby ensuring the quality of the chamfer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0021] Figure 1 It is a three-dimensional diagram of one embodiment of the present invention.

[0022] Figure 2 About Figure 1 A diagram of the structure of the middle part.

[0023] Figure 3 About Figure 1 A diagram showing a part of the structure being disassembled.

[0024] Figure 4 About Figure 3 Another perspective view of .

[0025] Figure 5 About Figure 1 A cutaway perspective view of the middle structure.

[0026] Figure 6 FIG. 1 is a schematic diagram of an application of one embodiment of the present invention.

[0027] Figure 7 About Figure 6 Front view of .

[0028] Figure numerals: 1. bearing part; 2. moving part; 3. shaft body; 4. grinding wheel; 5. guide ring; 6. driving wheel; 7. base; 8. dual-axis motor; 9. connecting part; 10. locking element; 11. interference end; 12. suction element. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0030] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0031] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0032] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0033] Reference Figure 1 as well as Figure 6 and Figure 7 One embodiment of the present invention provides an automatic wafer chamfering machine, comprising:

[0034] A carrier 1, wherein the carrier 1 is used to fix the wafer, and the carrier 1 may be a vacuum suction cup;

[0035] The moving part 2 is configured to be rotationally matched with the carrying part 1, so that during the movement of the moving part 2 relative to the carrying part 1, it can be fully maintained at the edge of the surface of the carrying part 1;

[0036] A grinding part, used for grinding the edge of the wafer to achieve the chamfering process, the grinding part is fixedly arranged on the moving part 2, so that it can move along the edge of the wafer with the moving part 2;

[0037] Compared with the prior art, the present invention directly establishes a rotational relationship between the moving part 2 and the bearing part 1, thereby maintaining the accuracy of the grinding part moving along the edge of the wafer, thereby improving the chamfering quality.

[0038] Further, see Figure 1-5 The moving part 2 is rotatably provided with a shaft 3, and the grinding part includes a plurality of grinding wheels 4, and the roughness of the plurality of grinding wheels 4 is different, so that grinding in different stages can be achieved, and the plurality of grinding wheels 4 are adjustably provided on the shaft 3, so that they can be easily replaced in multiple grinding stages;

[0039] Specifically, Figure 3-5 As shown, the present invention also includes a connecting portion 9 rotatably matched with the shaft body 3, and a locking element 10 detachably connected to the connecting portion 9. The connecting portion 9 is a sleeve-shaped structure. When the locking element 10 is arranged on the connecting portion 9, it fixes the multiple grinding wheels 4 together with the connecting portion 9, and at the same time keeps the connecting portion 9 fixed to the shaft body 3. When the locking element 10 is released from the connecting portion 9, the adjustment between the multiple grinding wheels 4 can be facilitated. The locking element 10 and the connecting portion 9 can be disassembled and assembled in a threaded manner. When tightened, the end of the mating connecting portion 9 presses the multiple grinding wheels 4, and an alignment portion is arranged between each adjacent two grinding wheels 4. The alignment portion can be implemented by a plug-in structure. The alignment portion allows the multiple grinding wheels 4 to remain coaxial. The locking element 10 and the connecting portion 9 can be disassembled and assembled by threaded engagement.

[0040] Further, see Figure 3-5 The connecting portion 9 is connected to a contact end 11, which can be made of an elastic metal sheet. When the locking element 10 is tightened, the contact end 11 will be squeezed, so that the contact end 11 and the shaft body 3 form a contact fit to limit the connecting portion 9 to a fixed position on the shaft body 3.

[0041] Further, see Figure 5A spacing is formed between any two adjacent grinding wheels 4 through the alignment portion. A suction element 12 is provided on one side of the connecting portion 9, which can form air suction on the inner side of the grinding wheel 4 during rotation, so that the dust formed during grinding can be sucked into the gap between the two grinding wheels 4, and then guided out by the suction element 12 for easy collection. The suction element 12 can adopt the structure of a fan blade.

[0042] Further, see Figure 1-2 A guide ring 5 is fixedly provided on the carrying part 1. In terms of positional relationship, when the wafer is placed on the carrying part 1, it forms a coaxial relationship with the guide ring 5. The moving part 2 is configured to slide with the guide ring 5 to ensure that the moving part 2 can move accurately along the edge of the wafer.

[0043] Further, regarding the power configuration, refer to Figure 1 , Figure 2 and Figure 7 A driving wheel 6 is rotatably provided on the moving part 2, which forms a transmission match with the guide ring 5. Specifically, a tooth match can be set between the two. When the driving wheel 6 rotates, the moving part 2 is moved along the edge of the bearing part 1.

[0044] Further, see Figure 1 The present invention also includes a base 7, a driven wheel 6 and a shaft 3 that are coaxially driven, and the bearing part 1 and the base 7 are rotatably matched, and the moving part 2 and the base 7 are relatively fixedly arranged. Specifically, the moving part 2 can be set to be fixedly connected with the base 7. When the driving wheel 6 on the moving part 2 rotates, the bearing part 1 is kept rotating on the base 7, so that the moving part 2 does not need to move on the base 7 to facilitate the collection of dust.

[0045] Further, see Figure 1 A dual-axis motor 8 is fixedly provided on the moving part 2, and the shaft body 3 and the driving wheel 6 are respectively connected to the two ends of the dual-axis motor 8, so as to share the driving force, simplify the structure of the equipment, and thus reduce the manufacturing cost.

[0046] It will be appreciated that in the development of any actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will be a routine task of design, fabrication, and production for those of ordinary skill having the benefit of this disclosure without undue experimentation.

[0047] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A wafer automatic chamfering machine, characterized in that: include: A bearing portion, the bearing portion being used to fix the wafer; A moving part, rotatably matched with the bearing part; The polishing part is fixedly arranged on the moving part.

2. The automatic wafer chamfering machine according to claim 1, characterized in that: The moving part is rotatably provided with an axis body, and the grinding part comprises a plurality of grinding wheels which are adjustably arranged on the axis body.

3. The automatic wafer chamfering machine according to claim 2, characterized in that: A guide ring is fixedly arranged on the bearing part. When the wafer is placed on the bearing part, it forms a coaxial relationship with the guide ring. The moving part is configured to slide with the guide ring.

4. The automatic wafer chamfering machine according to claim 3, characterized in that: The moving part is rotatably provided with a driving wheel, which forms a transmission match with the guide ring.

5. The automatic wafer chamfering machine according to claim 4, characterized in that: It also includes a base, the driven wheel is coaxially transmitted with the shaft, the bearing part is rotationally matched with the base, and the moving part is relatively fixedly arranged with the base.

6. The automatic wafer chamfering machine according to claim 5, characterized in that: A double-axis motor is fixedly arranged on the moving part, and the shaft body and the driving wheel are respectively connected to two ends of the double-axis motor.

7. The automatic wafer chamfering machine according to claim 2, characterized in that: It also includes a connecting portion rotatably matched with the shaft body, and a locking element detachably connected to the connecting portion, wherein the locking element and the connecting portion fix a plurality of grinding wheels and keep the connecting portion fixed to the shaft body.

8. The automatic wafer chamfering machine according to claim 7, characterized in that: An alignment portion is provided between any two adjacent grinding wheels, and the locking element is threadedly matched with the connecting portion.

9. The automatic wafer chamfering machine according to claim 8, characterized in that: The connecting portion is connected with a resistance end, and the resistance end forms a resistance fit with the shaft body under the pressure of the locking element.

10. The automatic wafer chamfering machine according to claim 7, characterized in that: A spacing is formed between any two adjacent grinding wheels through the alignment portion, and a suction element is provided on one side of the connecting portion, which forms air suction on the inner side of the grinding wheel during the rotation process.

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