A blister mold for carrier tape production

Abstract

The present invention relates to the technical field of carrier tape production, and in particular to a blister mold for carrier tape production, comprising a mold body, a plurality of molding grooves are arranged on the surface of the mold body, and a blister mechanism and an ejection mechanism are arranged inside the molding grooves, and the ejection mechanism is used to eject the molded carrier tape from the molding grooves, a plurality of columns are passed through the mold body, a top plate is fixed on the top of the column, a pressing block is arranged between the top plate and the mold body, a pressing ring for fixing the carrier tape is fixed on the bottom of the pressing block, an adsorption mechanism is arranged at the bottom of the pressing ring, and the adsorption mechanism is used to adsorb the molded carrier tape, and a driving mechanism is connected to the top of the pressing block, and the driving mechanism is used to drive the pressing block to move horizontally and up and down; after the blister molding of the carrier tape is completed, the pressing ring can adsorb the carrier tape to a specified position, and there is no need to manually remove the blister molded carrier tape from the blister mold, which saves manpower and improves the blister molding efficiency of the carrier tape.

Description

Technical Field

[0001] The invention relates to the technical field of carrier tape production, in particular to a blister mould for carrier tape production. Background Art

[0002] Carrier tape is mainly used in the electronic component mounting industry. It is used in conjunction with cover tape to carry and store electronic components such as resistors, capacitors, transistors, diodes, etc. in the pockets of the carrier tape, and a closed package is formed by sealing the cover tape on top of the carrier tape to protect the electronic components from contamination and damage during transportation. In the production of carrier tape, blister molds are used to form grooves, holes and other structures on the carrier tape to ensure that the carrier tape can accurately carry and fix electronic products or other items.

[0003] At present, after the blister forming is completed, in order to facilitate the removal of the carrier tape from the blister mold, most of the carrier tapes are ejected from the blister mold by an ejection mechanism. However, after the ejection mechanism ejects the carrier tape from the blow mold, it is still necessary to manually remove the carrier tape from the blow mold and place it in a designated position, which wastes manpower and reduces the blow molding efficiency of the carrier tape. Summary of the invention

[0004] The object of the present invention is to provide a blister mold for producing carrier tapes to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A blister mold for carrier tape production comprises a mold body, a plurality of molding grooves are provided on the surface of the mold body, a blister mechanism and an ejection mechanism are provided inside the molding grooves, the blister mechanism is used for molding the carrier tape, and the ejection mechanism is used for ejecting the molded carrier tape from the molding grooves, a plurality of columns are passed through the mold body, the columns are fixedly connected to the mold body, a top plate is fixed on the top of the columns, a pressure block is provided between the top plate and the mold body, a pressure ring for fixing the carrier tape is fixed on the bottom of the pressure block, an adsorption mechanism is provided at the bottom of the pressure ring, the adsorption mechanism is used for adsorbing the molded carrier tape, a driving mechanism is connected to the top of the pressure block, and the driving mechanism is used to drive the pressure block to move horizontally and up and down.

[0007] Preferably, the driving mechanism comprises telescopic rods fixedly connected to the bottom of the top plate and symmetrically distributed, the bottom of the telescopic rods are fixed with support frames, the support frames are connected to the pressing blocks via translation components, and the translation components are used to drive the pressing blocks to move horizontally.

[0008] Preferably: the translation assembly includes moving blocks fixedly connected to the top of the pressing block and symmetrically distributed, one of the support frames is rotatably connected to a threaded rod inside, one end of the threaded rod is connected to a motor, the motor is fixedly connected to the side wall of the support frame, the other support frame is rotatably connected to a limiting rod inside, the threaded rod passes through one of the moving blocks and is threadedly connected to the moving block, the limiting rod passes through the other moving block and is slidably connected to the moving block.

[0009] Preferably: the ejection mechanism includes a groove arranged at the bottom of the molding groove, a top block is slidably connected inside the groove, the top block is adapted to the groove, a sliding rod is fixed to the bottom of the top block, the sliding rod passes through the bottom of the mold body, a baffle is fixed to the bottom of the sliding rod, the baffle is connected to the bottom of the mold body through a plurality of first elastic parts, wherein the baffle is connected to a lifting assembly, and the lifting assembly is used to drive the baffle to move upward.

[0010] Preferably: the lifting assembly includes a fixed plate fixedly connected to the side wall of the pressing block and symmetrically distributed, a connecting column is fixed at the bottom of the fixed plate, a first magnet is fixed at the bottom of the connecting column, and a second magnet is fixed at the top of the baffle in a symmetrical distribution, and the second magnet has opposite magnetic properties to the first magnet.

[0011] Preferably: the adsorption mechanism includes an air pressure tube fixedly connected to the top of the pressing block, an air cavity is provided inside the pressing block, a plurality of adsorption holes are provided at the bottom of the air cavity, the adsorption holes pass through the bottom of the pressing ring, the air cavity is connected to a plurality of air pipes, the other end of the air pipe is connected to the air pressure tube, wherein the air pressure tube is connected to an air suction component, and the air suction component is used to absorb the gas inside the air cavity.

[0012] Preferably: the air suction assembly includes a piston arranged inside the air pressure tube, the piston is located below the connection position between the air pipe and the air pressure tube, a support rod is fixed to the top of the piston, the support rod passes through the top of the pressure block, a support plate is fixed to the outside of the support rod, the support plate is connected to the top of the pressure block through a second elastic member, and a trapezoidal block for squeezing the support rod is fixed to the bottom of the top plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: when the carrier is subjected to blister forming, the edge position of the carrier is pressed and held by the pressure ring, which effectively improves the stability of the carrier during the blister forming process and ensures the blister forming effect on the carrier. After the blister forming of the carrier is completed, the pressure ring can adsorb the carrier to a specified position, and there is no need to manually remove the blister formed carrier from the blister mold, which saves manpower and improves the blister forming efficiency of the carrier. In addition, before the pressure ring adsorbs the carrier, the ejector block can eject the blister formed carrier from the inside of the blister mold, thereby avoiding the phenomenon that the blister formed carrier is stuck inside the blister mold and ensuring the adsorption effect of the pressure ring on the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure in an embodiment of the present invention.

[0015] Figure 2 Schematic diagram of the connection structure of the pressing block in the embodiment of the present invention.

[0016] Figure 3 Schematic diagram of the bottom structure of the mold body in an embodiment of the present invention.

[0017] Figure 4 Schematic diagram of the top structure of the mold body in an embodiment of the present invention.

[0018] Figure 5 Schematic diagram of the pressure ring structure in an embodiment of the present invention.

[0019] Figure 6 Schematic diagram of the internal structure of the pressing block in an embodiment of the present invention.

[0020] In the figure: 1-mold body; 2-column; 3-top plate; 4-driving mechanism; 41-telescopic rod; 42-support frame; 43-threaded rod; 44-motor; 45-moving block; 46-limiting rod; 5-ejection mechanism; 51-fixed plate; 52-connecting column; 53-first magnet; 54-second magnet; 55-baffle; 56-slide rod; 57-first elastic member; 58-top block; 6-adsorption mechanism; 61-adsorption hole; 62-air cavity; 63-air pipe; 64-air pressure pipe; 65-piston; 66-support rod; 67-support plate; 68-second elastic member; 69-trapezoidal block; 7-pressing ring; 8-pressing block; 9-collecting tank; 10-molding tank; 11-blister mechanism. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0022] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0023] In one embodiment, see Figure 1 , Figure 2 and Figure 5A blister mold for carrier production includes a mold body 1, a plurality of molding grooves 10 are provided on the surface of the mold body 1, and a blister mechanism 11 and an ejection mechanism 5 are provided inside the molding grooves 10. The blister mechanism 11 is used for molding the carrier, and the ejection mechanism 5 is used to eject the molded carrier from the molding groove 10. A plurality of columns 2 are passed through the mold body 1, and the columns 2 are fixedly connected to the mold body 1. A top plate 3 is fixed on the top of the column 2, and a pressure block 8 is provided between the top plate 3 and the mold body 1. A pressure ring 7 for fixing the carrier is fixed at the bottom of the pressure block 8, and an adsorption mechanism 6 is provided at the bottom of the pressure ring 7. The adsorption mechanism 6 is used to adsorb the molded carrier, and a driving mechanism 4 is connected to the top of the pressure block 8. The driving mechanism 4 is used to drive the pressure block 8 to move horizontally and up and down.

[0024] In the present embodiment, when the blister mold is in use, the carrier tape is placed on the top of the mold body 1, and the driving mechanism 4 drives the pressing block 8 to move downward, and the pressing block 8 drives the pressing ring 7 to move downward until the pressing ring 7 presses the carrier tape on the mold body 1, and the edge position of the carrier tape is pressed by the pressing ring 7, which effectively improves the stability of the carrier tape during the blister molding process and ensures the blister molding effect of the carrier tape. After the carrier tape is fixed, the carrier tape is blister molded by the blister molding mechanism 11 inside the molding groove 10, wherein the blister molding mechanism 11 is a prior art and will not be described in detail here. For example, the blister molding mechanism 11 can be a vacuum pump (not shown in the figure), which is arranged inside the mold body 1 and is connected to a blister tube, and the other end of the blister tube passes through the bottom of the molding groove 10. After the blister molding of the carrier tape is completed, the driving mechanism 4 drives the pressing block 8 to move upward, and the pressing block 8 moves upward. While moving, the formed carrier tape is ejected from the inside of the forming groove 10 through the ejection mechanism 5. When the ejection mechanism 5 pushes the carrier tape to a certain height, the adsorption mechanism 6 at the bottom of the pressure ring 7 automatically adsorbs the carrier tape to the bottom of the pressure ring 7. At this time, even if the ejection mechanism 5 no longer supports the carrier tape, the carrier tape can be fixed at the bottom of the pressure ring 7. When the carrier tape is adsorbed to a certain height, the driving mechanism 4 drives the pressing block 8 to move horizontally, and then drives the carrier tape after blister molding to move horizontally. When the carrier tape moves horizontally to a certain position, the blister mechanism 11 no longer adsorbs the carrier tape, and the carrier tape after blister molding automatically falls off from the bottom of the pressure ring 7, and thus falls into the collecting groove 9 at the top of the mold body 1. There is no need to manually remove the carrier tape after blister molding from the mold body 1, and the automatic collection of the carrier tape can also be completed, which saves manpower and effectively improves the blister molding efficiency of the carrier tape.

[0025] See also Figure 2 The driving mechanism 4 includes telescopic rods 41 fixedly connected to the bottom of the top plate 3 and symmetrically distributed, and a support frame 42 is fixed to the bottom of the telescopic rods 41. The support frame 42 is connected to the pressing block 8 through a translation assembly, and the translation assembly is used to drive the pressing block 8 to move horizontally;

[0026] During the blister forming of the carrier tape, the support frame 42 is driven downward by the telescopic rod 41, and the support frame 42 drives the pressing block 8 to move downward through the translation assembly. The pressing block 8 presses the edge position of the carrier tape through the pressing ring 7, which effectively improves the stability of the carrier tape during the blister forming process, thereby ensuring the blister effect of the carrier tape.

[0027] See also Figure 2 The translation assembly includes moving blocks 45 that are fixedly connected to the top of the pressing block 8 and are symmetrically distributed, one of the support frames 42 is rotatably connected to a threaded rod 43, one end of the threaded rod 43 is connected to a motor 44, and the motor 44 is fixedly connected to the side wall of the support frame 42, and the other support frame 42 is rotatably connected to a limiting rod 46, the threaded rod 43 penetrates one of the moving blocks 45 and is threadedly connected to the moving block 45, and the limiting rod 46 penetrates the other moving block 45 and is slidably connected to the moving block 45;

[0028] After the carrier tape is formed by vacuum evaporation, the pressure ring 7 absorbs the carrier tape to a certain height through the absorption mechanism 6, and the motor 44 is started. The motor 44 drives the threaded rod 43 to rotate, and the threaded connection between the threaded rod 43 and the moving block 45 drives the pressure block 8 to move horizontally, thereby driving the carrier tape to move horizontally. When the carrier tape moves horizontally to a certain position, the vacuum evaporation mechanism 11 no longer absorbs the carrier tape, and the vacuum evaporation-formed carrier tape automatically falls off from the bottom of the pressure ring 7, thereby playing a role in transferring and collecting the vacuum evaporation-formed carrier tape, and effectively improving the vacuum evaporation-formation efficiency of the carrier tape.

[0029] See also Figure 3 and Figure 5 The ejection mechanism 5 includes a groove arranged at the bottom of the molding groove 10, and a top block 58 is slidably connected inside the groove, and the top block 58 is adapted to the groove. A slide bar 56 is fixed to the bottom of the top block 58, and the slide bar 56 passes through the bottom of the mold body 1. A baffle 55 is fixed to the bottom of the slide bar 56, and the baffle 55 is connected to the bottom of the mold body 1 through a plurality of first elastic members 57, wherein the baffle 55 is connected to a lifting assembly, and the lifting assembly is used to drive the baffle 55 to move upward;

[0030] During the vacuum forming of the carrier tape, the top block 58 is located inside the groove under the action of the slide bar 56, the baffle 55 and the first elastic member 57, and the upper surface of the top block 58 is flush with the bottom of the molding groove 10, thereby avoiding the interference of the top block 58 with the molding of the carrier tape and ensuring the molding effect of the carrier tape. The first elastic member 57 can be a spring. After the vacuum forming of the carrier tape is completed, the pressure block 8 drives the pressure ring 7 to move upward, and the lifting assembly drives the baffle 55 to move upward. The baffle 55 drives the top block 58 to move upward through the slide bar 56, and the vacuum formed carrier tape is ejected from the molding groove 10 through the top block 58, which can effectively avoid the phenomenon that the vacuum formed carrier tape is stuck in the molding groove 10, thereby ensuring the adsorption effect of the adsorption mechanism 6 on the carrier tape.

[0031] See also Figure 4 and Figure 5 The lifting assembly includes a fixed plate 51 fixedly connected to the side wall of the pressing block 8 and symmetrically distributed, a connecting column 52 is fixed at the bottom of the fixed plate 51, a first magnet 53 is fixed at the bottom of the connecting column 52, and a symmetrically distributed second magnet 54 is fixed at the top of the baffle 55, and the second magnet 54 has opposite magnetic properties to the first magnet 53;

[0032] During the vacuum forming of the carrier tape, the pressing block 8 drives the pressing ring 7 to move downward, the pressing ring 7 drives the connecting column 52 to move downward through the fixing plate 51, the connecting column 52 drives the first magnet 53 to move downward, when the first magnet 53 drops to a certain position, the first magnet 53 and the second magnet 54 attract each other, thereby driving the baffle 55 to move upward, at this time, the first magnet 53 moves downward and drives the baffle 55 to move downward through the second magnet 54, the baffle 55 drives the top block 58 to move downward through the sliding rod 56, when the pressing ring 7 presses the edge of the carrier tape to the mold body 1, the upper surface of the top block 58 is flush with the bottom of the molding groove 10. When the carrier tape is blister-formed, the pressing block 8 drives the pressing ring 7 to move upward. At this time, the connecting column 52 drives the baffle 55 to move upward through the mutual attraction between the first magnet 53 and the second magnet 54. The baffle 55 drives the top block 58 to move upward through the sliding rod 56, so that the carrier tape after blister forming is ejected from the molding groove 10. When the first magnet 53 rises to a certain position, the second magnet 54 is separated from the attraction of the first magnet 53, and the baffle 55 is automatically reset under the action of the first elastic member 57.

[0033] See also Figure 4 and Figure 6 The adsorption mechanism 6 includes an air pressure tube 64 fixedly connected to the top of the pressing block 8, an air cavity 62 is provided inside the pressing block 8, a plurality of adsorption holes 61 are provided at the bottom of the air cavity 62, and the adsorption holes 61 penetrate the bottom of the pressing ring 7, the air cavity 62 is connected to a plurality of air pipes 63, and the other end of the air pipe 63 is connected to the air pressure tube 64, wherein the air pressure tube 64 is connected to an air suction component, and the air suction component is used to absorb the gas inside the air cavity 62;

[0034] When the carrier tape is blister formed, the pressing block 8 drives the pressing ring 7 to move upward. At this time, under the action of the ejection mechanism 5, the bottom of the pressing ring 7 is tightly fitted with the surface of the carrier tape. When the pressing ring 7 rises to a certain height, the suction component absorbs the gas inside the air cavity 62, and the gas inside the air cavity 62 and the adsorption hole 61 enters the air pressure tube 64 through the air pipe 63. Negative pressure is formed inside the adsorption hole 61, so that the carrier tape after blister forming is adsorbed on the surface of the pressing ring 7. There is no need to manually remove the carrier tape after blister forming from the mold body 1, which saves manpower and improves the blister forming efficiency of the carrier tape.

[0035] See also Figure 1 , Figure 2 and Figure 6 The air suction assembly includes a piston 65 arranged inside the air pressure tube 64, the piston 65 is located below the position where the air pipe 63 and the air pressure tube 64 are connected, a support rod 66 is fixed on the top of the piston 65, the support rod 66 passes through the top of the pressing block 8, a support plate 67 is fixed outside the support rod 66, the support plate 67 is connected to the top of the pressing block 8 through a second elastic member 68, and a trapezoidal block 69 for squeezing the support rod 66 is fixed at the bottom of the top plate 3;

[0036] After the carrier tape is formed by vacuum forming, the pressing block 8 drives the pressing ring 7 to move upward. When the pressing ring 7 rises to a certain height, the plane at the bottom of the trapezoidal block 69 contacts the top of the support rod 66. As the pressing block 8 continues to move upward, the trapezoidal block 69 squeezes the support rod 66, causing the piston 65 to move downward relative to the air pressure tube 64. The internal space of the air pressure tube 64 above the piston 65 increases, thereby forming a negative pressure inside the adsorption hole 61, and then the formed carrier tape is adsorbed on the bottom of the pressing ring 7. When the carrier tape formed by vacuum forming rises to a certain height, the ejection mechanism 5 no longer supports the carrier tape, and the driving mechanism 4 drives the pressing block 8 to move horizontally, thereby driving the carrier tape to move horizontally. When the support rod 66 moves to the trapezoidal block 69 obliquely When the upper and lower surfaces are in the same position, the degree of squeezing of the support rod 66 by the trapezoidal block 69 is reduced, and the support rod 66 automatically moves upward under the action of the support plate 67 and the second elastic member 68. The second elastic member 68 can be a spring. At this time, the support rod 66 drives the piston 65 to move upward inside the air pressure tube 64, and the piston 65 squeezes the gas inside the air pressure tube 64 above it. The gas enters the air cavity 62 and the adsorption hole 61 through the air pipe 63. The air pressure inside the adsorption hole 61 increases, so that the carrier tape automatically falls off from the bottom of the pressure ring 7, which plays a role in transferring and collecting the carrier tape after the blister forming, and there is no need to manually remove the carrier tape after the blister forming from the bottom of the pressure ring 7, which effectively improves the blister forming efficiency of the carrier tape.

[0037] Working principle: When the blister mold is in use, the carrier tape is placed on the top of the mold body 1, and the pressing block 8 is driven to move downward by the telescopic rod 41, and the pressing block 8 drives the pressing ring 7 to move downward until the pressing ring 7 presses the carrier tape on the mold body 1. When the carrier tape is fixed, the blister mechanism 11 inside the molding groove 10 is used to blister the carrier tape. After the blister molding of the carrier tape is completed, the telescopic rod 41 drives the pressing block 8 to move upward. While the pressing block 8 moves upward, the mutual attraction between the first magnet 53 and the second magnet 54 drives the baffle 55 to move upward. The baffle 55 drives the top block 58 to move upward through the sliding rod 56, so that the carrier tape after blister molding is ejected from the inside of the molding groove 10, and the bottom of the pressing ring 7 is tightly fitted with the surface of the carrier tape. When the pressing ring 7 rises to a certain height, the trapezoidal block 69 squeezes the support rod 66, so that the piston 65 moves downward relative to the air pressure tube 64, and the internal space of the air pressure tube 64 above the piston 65 increases, thereby forming a negative pressure inside the adsorption hole 61. The pressure is applied to the bottom of the pressing ring 7, and the formed carrier tape is adsorbed on the bottom of the pressing ring 7. When the carrier tape after blister molding rises to a certain height, the second magnet 54 is separated from the attraction of the first magnet 53, the baffle 55 is automatically reset, and the top block 58 no longer supports the carrier tape. Subsequently, the threaded connection between the threaded rod 43 and the moving block 45 drives the pressing block 8 to move horizontally, thereby driving the carrier tape to move horizontally. When the support rod 66 moves to the position of the inclined surface of the trapezoidal block 69, the degree of squeezing of the support rod 66 by the trapezoidal block 69 is reduced, and the support rod 66 drives the piston 65 to move upward inside the air pressure tube 64. The piston 65 squeezes the gas inside the air pressure tube 64 above it, and the gas enters the air cavity 62 and the adsorption hole 61 through the air pipe 63. The air pressure inside the adsorption hole 61 increases, so that the carrier tape automatically falls off from the bottom of the pressing ring 7, which plays a role in transferring and collecting the carrier tape after blister molding, and there is no need to manually remove the carrier tape after blister molding from the bottom of the pressing ring 7, which effectively improves the blister molding efficiency of the carrier tape.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A blister mold for carrier tape production, comprising a mold body; characterized in that: The mold body surface is provided with a plurality of molding grooves, and the molding grooves are provided with a blister mechanism and an ejection mechanism. The blister mechanism is used for molding the carrier tape, and the ejection mechanism is used to eject the molded carrier tape from the molding groove. The mold body is penetrated by a plurality of columns, and the columns are fixedly connected to the mold body. A top plate is fixed on the top of the columns, and a pressing block is provided between the top plate and the mold body. A pressing ring for fixing the carrier tape is fixed on the bottom of the pressing block, and an adsorption mechanism is provided at the bottom of the pressing ring. The adsorption mechanism is used to adsorb the molded carrier tape, and a driving mechanism is connected to the top of the pressing block, and the driving mechanism is used to drive the pressing block to move horizontally and up and down; The ejection mechanism comprises a groove arranged at the bottom of the forming groove, a top block is slidably connected inside the groove, the top block is adapted to the groove, a slide rod is fixed at the bottom of the top block, the slide rod passes through the bottom of the mold body, a baffle is fixed at the bottom of the slide rod, the baffle is connected to the bottom of the mold body through a plurality of first elastic members, wherein the baffle is connected to a lifting assembly, and the lifting assembly is used to drive the baffle to move upward; The lifting assembly comprises a fixed plate fixedly connected to the side wall of the pressing block and symmetrically distributed, a connecting column is fixed at the bottom of each fixed plate, a first magnet is fixed at the bottom of the connecting column, and a second magnet is fixed at the top of the baffle plate and symmetrically distributed, and the second magnet has opposite magnetic properties to the first magnet; The adsorption mechanism includes an air pressure tube fixedly connected to the top of the pressing block, an air cavity is provided inside the pressing block, a plurality of adsorption holes are provided at the bottom of the air cavity, the adsorption holes penetrate the bottom of the pressing ring, the air cavity is connected to a plurality of air pipes, the other end of the air pipe is connected to the air pressure tube, wherein the air pressure tube is connected to an air suction component, and the air suction component is used to absorb the gas inside the air cavity; The air suction assembly includes a piston arranged inside the air pressure tube, the piston is located below the connection position between the air pipe and the air pressure tube, a support rod is fixed to the top of the piston, the support rod passes through the top of the pressure block, a support plate is fixed to the outside of the support rod, the support plate is connected to the top of the pressure block through a second elastic member, and a trapezoidal block for squeezing the support rod is fixed to the bottom of the top plate.

2. A blister mold for carrier tape production according to claim 1, characterized in that: The driving mechanism includes telescopic rods fixedly connected to the bottom of the top plate and symmetrically distributed, and support frames are fixed to the bottom of the telescopic rods. The support frames are connected to the pressing blocks through translation components, and the translation components are used to drive the pressing blocks to move horizontally.

3. A blister mold for carrier tape production according to claim 2, characterized in that: The translation assembly includes moving blocks that are fixedly connected to the top of the pressure block and are symmetrically distributed. One of the support frames is rotatably connected to a threaded rod on the inner side, one end of the threaded rod is connected to a motor, and the motor is fixedly connected to the side wall of the support frame. The other support frame is rotatably connected to a limiting rod on the inner side, the threaded rod passes through one of the moving blocks and is threadedly connected to the moving block, and the limiting rod passes through the other moving block and is slidably connected to the moving block.

Images