An apparatus for uniformly tin-plating copper wires

Abstract

The present invention relates to the technical field of tin plating for copper wires, and specifically discloses a uniform tin plating device for copper wires, including: a tin plating furnace and a plurality of tin plating tubes arranged front and back; multiple groups of processing modules corresponding to the tin plating tubes one by one are further provided in the tin plating furnace; the processing module includes a bearing unit, multiple groups of adsorption units and a cleaning unit; the bearing unit includes an outer cylinder sliding horizontally left and right on the tin plating furnace and an inner cylinder rotating coaxially in the outer cylinder. The beneficial effects of the present invention are as follows: multiple groups of adsorption units rotate around the axis of the inner cylinder. When the adsorption block in each group of adsorption units rotates to directly below the copper wire, the top of the hemispherical surface of the adsorption block will contact the tin liquid converging at the bottom of the copper wire, so as to adsorb the excess tin liquid converging at the bottom of the copper wire on the adsorption block. The air cylinder drives the outer cylinder to continuously reciprocate in the left and right directions, increasing the contact area between the adsorption block and the tin liquid at the bottom of the copper wire, and ensuring the comprehensive cleaning of the tin liquid converging at the bottom of the copper wire.

Description

Technical Field

[0001] The present invention relates to the technical field of copper wire tin plating, and particularly relates to a uniform tin plating device for copper wire. Background Art

[0002] Tinned copper wire refers to copper wire with a thin layer of metallic tin plated on its surface. Tinned copper wire is relatively soft in texture and has good electrical conductivity. Compared with bare copper wire, it has stronger corrosion resistance and oxidation resistance, which can greatly extend the service life of weak electric wires and cables. Further, it is necessary to tin plate the outside of the copper wire because when the copper wire is exposed to air for a long time, it will be oxidized by the air to form a layer of verdigris, and the electrical conductivity of verdigris is very poor, which will increase the resistance.

[0003] A Chinese patent with the authorization announcement number CN115125465B discloses a copper wire tin plating device for tin plated wire processing, including a tin plating furnace, a copper wire passing through the tin plating furnace, a tin solution filled in the tin plating furnace, a pump suction device and a protective gas delivery device outside the tin plating furnace. The top of the tin plating furnace is provided with a top cover, the bottom end of the top cover is fixedly connected with evenly distributed fixing seats, the bottom end of the fixing seat is fixedly connected with tin plating pipes, a liquid infusion cavity is opened in the fixing seat, a through processing hole is opened in the tin plating pipe, one end of the liquid infusion cavity is connected to the pump suction device, and the other end is connected to the processing hole. One end of the pump suction device is connected to the tin solution in the tin plating furnace, and the copper wire passes through the processing hole. A power device is arranged in the tin plating furnace. This patent forms a suction action through the reciprocating deformation of a high-temperature rubber tube, so that the high-temperature rubber tube sucks the tin solution in the tin plating pipe, and the tin solution stirs the surrounding tin slag for rapid discharge, avoiding the influence of tin slag on the rapid tin plating of copper wire and tin solution.

[0004] In the above technical solution, when the copper wire just exits from the tin plating pipe, the tin solution on the surface of the copper wire has not completely cooled. At this time, affected by gravity, the tin solution will converge along the outer wall of the copper wire to the bottom of the copper wire, and finally the tin layer thickness at the bottom of the copper wire is greater than that at other positions, affecting the quality of copper wire tin plating. Summary of the Invention

[0005] The present invention provides a uniform tin plating device for copper wire, aiming to solve the technical problem that in the related art, when the copper wire just exits from the tin plating pipe, the tin solution on the surface of the copper wire has not completely cooled. At this time, affected by gravity, the tin solution will converge along the outer wall of the copper wire to the bottom of the copper wire, and finally the tin layer thickness at the bottom of the copper wire is greater than that at other positions, affecting the quality of copper wire tin plating.

[0006] A uniform tin plating device for copper wires according to the present invention includes: a tin plating furnace and a plurality of tin plating tubes arranged front and back; a plurality of processing modules corresponding to the tin plating tubes one by one are further provided in the tin plating furnace; the processing module includes a carrying unit, a plurality of adsorption units and a cleaning unit; the carrying unit includes an outer cylinder sliding horizontally left and right on the tin plating furnace and an inner cylinder rotating coaxially in the outer cylinder, a driving mechanism for driving the inner cylinder to rotate is provided on the outer cylinder, the copper wire passes through the inner cylinder and the axis of the copper wire is directly below the axis of the inner cylinder; a plurality of adsorption units are circumferentially arranged in the inner cylinder, the adsorption unit includes a plurality of mounting posts rotatably fitted in the inner cylinder and spaced along the axial direction of the inner cylinder, and an adsorption block fixed on the mounting post; the cleaning unit includes a plurality of driving racks slidably connected to the inner cylinder through elastic members and drivingly engaged with the mounting posts of each adsorption unit, and a top pushing member fixed on the outer cylinder, the top pushing member is located on the movement path of the driving rack to drive the driving rack to slide; it further includes a cleaning member fixed on the outer cylinder, a plurality of arc-shaped cleaning grooves spaced left and right on the cleaning member, and a collection box provided at the bottom of the cleaning member, the cleaning grooves correspond to the adsorption blocks in the left-right direction one by one, and the cleaning grooves match the shapes of the adsorption blocks.

[0007] Beneficial effects: When the copper wire just passes out of the tin plating tube, the tin liquid on the outer wall will gather at the bottom of the copper wire under the influence of gravity. At this time, the inner cylinder continuously rotates on the outer cylinder, thereby driving a plurality of adsorption units to rotate around the axis of the inner cylinder. When the adsorption block in each adsorption unit rotates to directly below the copper wire, the top of the hemispherical surface of the adsorption block will contact the tin liquid converging at the bottom of the copper wire, thereby adsorbing the excess tin liquid converging at the bottom of the copper wire on the adsorption block, and the tin liquid will disperse around along the spherical surface of the adsorption block. At the same time, the air cylinder will drive the outer cylinder and the inner cylinder to continuously reciprocate left and right, increasing the contact area between the adsorption block and the tin liquid at the bottom of the copper wire, and ensuring a comprehensive cleaning of the tin liquid converging at the bottom of the copper wire. When the adsorption block rotates from the bottom to the top, it will enter the cleaning groove, and the outer side wall of the adsorption block will be in full contact with the inner side wall of the cleaning groove. Then, the end of the ejector rod will abut against the top pushing member, forcing the adsorption block to rotate. During the process of the adsorption block passing through the arc-shaped cleaning groove, it will also rotate around its own axis, thereby rubbing off the tin liquid on the outer side wall of the adsorption block and realizing the cleaning of the adsorption block.

[0008] Preferably, an installation frame is provided on the side wall of the tin plating furnace, a through hole is provided inside the installation frame, two sliding rods are fixedly installed on the installation frame, the sliding rods are horizontally arranged in the left-right direction, the outer cylinder is slidably fitted on the sliding rods, and an air cylinder is fixedly installed on the installation frame, and the telescopic part of the air cylinder is fixedly connected to the outer cylinder.

[0009] The effect is: realizing the continuous left-right reciprocating movement of the inner cylinder driving the adsorption unit, increasing the cleaning area of the copper wire, and ensuring a comprehensive cleaning of the tin liquid converging at the bottom of the copper wire.

[0010] Preferably, the mounting frame is vertically slidably engaged with the tin plating furnace. A regulating rod is rotatably mounted on the top of the mounting frame, and the regulating rod is in threaded engagement with the tin plating furnace.

[0011] The effect is that by rotating the regulating rod to control the lifting of the mounting frame, the distance between the upper end of the adsorption block rotated to the bottom and the bottom of the copper wire can be adjusted, and the adsorption amount of the tin liquid converged at the bottom of the copper wire can be controlled and copper wires with different diameters can be adapted.

[0012] Preferably, the driving mechanism includes a motor fixedly mounted on the outer cylinder. A driving gear is fixedly mounted on the output end of the motor. A gear ring is fixedly provided on the outer side wall of the inner cylinder. An opening is provided in the outer cylinder corresponding to the driving gear and penetrating through. The driving gear passes through the opening and meshes with the gear ring.

[0013] Preferably, transmission gears are fixedly provided on the outer side walls of the mounting columns, and the driving rack is engaged with the transmission gears.

[0014] Preferably, the pushing member is of an arc structure, and its width gradually increases along the rotation direction of the inner cylinder.

[0015] The effect is that when the ejector rod rotates to a position close to the upper part of the inner cylinder, the end of the ejector rod will abut against the pushing member. As the width of the pushing member increases, the ejector rod will be forced to slide, causing the mounting column to drive the adsorption block to rotate.

[0016] Preferably, the adsorption block is of a hemispherical structure, and the bottom plane of the adsorption block is fixedly connected to the end of the mounting column.

[0017] Preferably, the cleaning member is of an arc structure and is coaxially arranged with the inner cylinder. Both ends of the cleaning groove are provided with blanking through holes communicating with the inner side of the cleaning member.

[0018] The effect is that the tin material falling on the cleaning groove will fall into the collection box through the blanking through hole, completing the cleaning of the residue.

[0019] Preferably, a heating member is provided on the cleaning member to heat the cleaning groove, and a pipeline is communicated with the collection box to enable the tin liquid to flow back into the tin plating furnace again.

[0020] Preferably, a liquid supply pipe is installed on the tin plating furnace. The liquid supply pipe is communicated with a plurality of tin plating pipes, and a pump body is communicated with the liquid supply pipe.

[0021] With the above technical solutions, the beneficial effects of the present invention are as follows: When the copper wire just exits from the tin-plating tube, the tin liquid on the outer wall will gather at the bottom of the copper wire under the influence of gravity. At this time, the inner cylinder continuously rotates on the outer cylinder, driving multiple groups of adsorption units to rotate around the axis of the inner cylinder. When the adsorption block in each group of adsorption units rotates to directly below the copper wire, the top of the hemispherical surface of the adsorption block will contact the tin liquid converging at the bottom of the copper wire, thereby adsorbing the excess tin liquid converging at the bottom of the copper wire on the adsorption block, and the tin liquid will disperse around along the spherical surface of the adsorption block. At the same time, the air cylinder drives the outer cylinder and the inner cylinder to continuously reciprocate in the left-right direction, increasing the contact area between the adsorption block and the tin liquid at the bottom of the copper wire, and ensuring a comprehensive cleaning of the tin liquid converging at the bottom of the copper wire. When the adsorption block rotates from the bottom to the top, it will enter the cleaning groove. The outer side wall of the adsorption block will be in full contact with the inner side wall of the cleaning groove, and then the end of the ejector rod will abut against the ejecting part, forcing the adsorption block to rotate. During the process of the adsorption block passing through the arc-shaped cleaning groove, it will also rotate around its own axis, thereby rubbing off the tin liquid on the outer side wall of the adsorption block and realizing the cleaning of the adsorption block. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0023] Figure 2 It is a sectional view of the present invention.

[0024] Figure 3 It is a schematic diagram of the internal structure of the tin-plating furnace of the present invention.

[0025] Figure 4 It is a schematic diagram of the structure of the mounting rack of the present invention.

[0026] Figure 5 It is an exploded view of the outer cylinder and the inner cylinder of the present invention.

[0027] Figure 6 It is a left view of the outer cylinder of the present invention.

[0028] Figure 7 It is an axonometric sectional view of the inner cylinder of the present invention.

[0029] Figure 8 It is an exploded view of the cleaning part and the collection box of the present invention.

[0030] Figure 9 It is a schematic diagram of the structure of the ejecting part of the present invention.

[0031] Reference Signs:

[0032] 10. Tin plating furnace; 11. Threading hole; 12. Tin plating pipe; 13. Liquid supply pipe; 20. Mounting frame; 21. Adjusting rod; 22. Slide rod; 23. Cylinder; 30. Outer cylinder; 31. Motor; 32. Driving gear; 33. Ring gear; 40. Inner cylinder; 41. Mounting post; 42. Adsorption block; 43. Driving gear; 44. Driving rack; 45. Spring; 46. Thrust rod; 47. Thrust piece; 50. Cleaning piece; 51. Cleaning groove; 52. Blanking through hole; 53. Collection box. Detailed implementation manners

[0033] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0034] As Figures 1 to 9 shown, a specific embodiment of a uniform tin plating device for copper wires according to the present invention includes a tin plating furnace 10, a tin plating module, and a processing module.

[0035] As Figure 1 , Figure 2 and Figure 3 shown, the tin plating furnace 10 internally holds tin liquid, and through holes 11 are provided on both the left and right side walls of the tin plating furnace 10 for copper wires to pass through. In this embodiment, the copper wire after preliminary treatment enters the tin plating furnace 10 through the through hole 11 on the left side. After being tin plated by the tin plating module, the tin liquid converged at the bottom of the copper wire is cleaned by the processing module, and finally the copper wire passes out through the through hole 11 on the right side, and then the copper wire is cooled and wound up.

[0036] It should be particularly noted that in this embodiment, the diameter specification of the copper wire is above 10 mm.

[0037] A plurality of groups of tin plating modules are arranged in the front-rear direction, and the tin plating modules can be set according to the number of copper wires. Each tin plating module allows one copper wire to pass through. In this embodiment, three groups of tin plating modules are provided, and in other embodiments, there may also be two groups, four groups or even more.

[0038] Each group of tin plating modules includes a tin plating pipe 12 fixedly installed on the top wall of the tin plating furnace 10. The axis of the tin plating pipe 12 is horizontally arranged in the left-right direction, and the copper wire passes through the tin plating pipe 12. A liquid supply pipe 13 is installed on the tin plating furnace 10. The liquid supply pipe 13 is communicated with a plurality of tin plating pipes 12, and a pump body (not shown in the figure) is communicated with the liquid supply pipe 13. The pump body can pump out the tin liquid in the tin plating furnace 10 and pump it into the tin plating pipes 12 through the liquid supply pipe 13 respectively, so as to tin plate the copper wire passing through the tin plating pipes 12. The tin liquid will be discharged from the openings on both sides of the tin plating pipe 12 and return to the tin plating furnace 10 again to achieve circulation.

[0039] AsFigure 3 As shown, there are multiple sets of processing modules arranged in the front-back direction. The processing modules are arranged on the right side of the tin plating module, and a set of processing modules is correspondingly arranged on the right side of each tin plating tube 12.

[0040] The processing module includes a mounting unit, a carrying unit, an adsorption unit, and a cleaning unit.

[0041] As Figure 3 shown in Figure 4 As shown, the mounting unit includes a mounting frame 20 that is slidably mounted up and down on the right side wall of the tin plating furnace 10. The mounting frame 20 is a square frame with a through hole inside to ensure that the copper wire can pass through the through hole inside. The through hole inside the mounting frame 20 corresponds to the wire threading hole 11 on the right side of the tin plating furnace 10, so as to facilitate the transportation of the copper wire.

[0042] The top of the mounting frame 20 is rotatably mounted with an adjusting rod 21, and the adjusting rod 21 is in threaded cooperation with the tin plating furnace 10. Thus, when the adjusting rod 21 is rotated, the mounting frame 20 can be controlled to slide up and down on the side wall of the tin plating furnace 10, so as to adjust the distance between the adsorption unit and the bottom of the copper wire, control the amount of tin liquid adsorbed at the bottom of the copper wire, or adapt to copper wires of different sizes.

[0043] As Figure 4 shown in Figure 5 and Figure 6 As shown, the carrying unit includes a sliding rod 22, an outer cylinder 30, an inner cylinder 40, and a driving mechanism.

[0044] The sliding rod 22 is fixedly mounted on the mounting frame 20. The sliding rod 22 is horizontally arranged in the left-right direction, and there are two sliding rods 22 arranged front and back, and the two sliding rods 22 are arranged in parallel. The outer cylinder 30 is slidably mounted on the front and back two sliding rods 22 and can reciprocally slide along the axial direction of the sliding rod 22. A cylinder 23 is fixedly mounted on the mounting frame 20, and the telescopic part of the cylinder 23 is fixedly connected to the outer cylinder 30. Thus, the outer cylinder 30 is driven to continuously reciprocally slide in the left-right direction by the cylinder 23.

[0045] The inner cylinder 40 is rotatably mounted inside the outer cylinder 30. The inner cylinder 40 is coaxially arranged with the outer cylinder 30, and the inner cylinder 40 rotates inside the outer cylinder 30 through a driving mechanism. The driving mechanism includes a motor 31 fixedly mounted on the top of the outer cylinder 30. The output end of the motor 31 is fixedly mounted with a driving gear 32. A toothed ring 33 is fixedly mounted on the outer side wall of the inner cylinder 40. An opening that penetrates up and down is provided at the position corresponding to the driving gear 32 on the outer cylinder 30. The driving gear 32 passes through the opening and meshes with the toothed ring 33. Thus, the motor 31 drives the toothed ring 33 and the inner cylinder 40 to rotate by driving the driving gear 32 to rotate.

[0046] The copper wire passes through the inside of the inner cylinder 40. It should be noted that the axis of the copper wire is directly below the axis of the inner cylinder 40, so that when the inner cylinder 40 drives the adsorption unit to rotate, when the adsorption unit contacts the tin liquid at the bottom of the copper wire, the excess tin liquid can be adsorbed.

[0047] As Figure 6 shown in Figure 7 the figure, the adsorption units are arranged on the inner wall of the inner cylinder 40, and multiple groups of adsorption units are arranged along the circumferential direction of the inner cylinder 40. In this embodiment, 3 groups of adsorption units are arranged. In other embodiments, there can be 4 groups, 6 groups or even more.

[0048] Each group of adsorption units includes a plurality of mounting posts 41 vertically and rotatably mounted on the inner wall of the inner cylinder 40, and the plurality of mounting posts 41 are spaced along the axial direction of the inner cylinder 40. An adsorption block 42 is fixedly installed at one end of the mounting post 41 away from the inner cylinder 40. In this embodiment, the adsorption block 42 has a hemispherical structure, and the flat surface at the bottom of the adsorption block 42 is fixedly connected to the end of the mounting post 41.

[0049] It should be noted that the structure of the adsorption block 42 is not limited to this, and it can also be other structures such as spherical or conical.

[0050] When the copper wire just passes out of the tin plating tube 12, the tin liquid on the outer wall will gather at the bottom of the copper wire under the influence of gravity. At this time, the inner cylinder 40 rotates continuously on the outer cylinder 30, thereby driving multiple groups of adsorption units to rotate around the axis of the inner cylinder 40. When the adsorption block 42 in each group of adsorption units rotates to directly below the copper wire (as Figure 6 shown in the figure), the top of the hemispherical surface of the adsorption block 42 will contact the tin liquid converging at the bottom of the copper wire, so that the excess tin liquid converging at the bottom of the copper wire is adsorbed on the adsorption block 42, and the tin liquid will disperse around along the spherical surface of the adsorption block 42. At the same time, the air cylinder 23 will drive the outer cylinder 30 and the inner cylinder 40 to reciprocate continuously in the left and right directions, increasing the contact area between the adsorption block 42 and the tin liquid at the bottom of the copper wire, and ensuring the comprehensive cleaning of the tin liquid converging at the bottom of the copper wire.

[0051] It should be noted that when the adsorption block 42 rotates to directly below the copper wire, there is a certain gap between the upper end of the adsorption block 42 and the copper wire, only ensuring that the upper end of the adsorption block 42 contacts the tin liquid converging at the bottom of the copper wire, but the adsorption block 42 does not contact the copper wire, avoiding damage to the tin layer on the copper wire.

[0052] By rotating the adjusting rod 21 to control the lifting of the mounting frame 20, the distance between the upper end of the adsorption block 42 rotating to the bottom and the bottom of the copper wire can be adjusted, and the adsorption amount of the tin liquid converging at the bottom of the copper wire can be controlled.

[0053] The adsorption force of the adsorption block 42 on the tin liquid is less than that of the copper wire on the tin liquid, so that the adsorption block 42 can only adsorb the excess tin liquid converged at the bottom of the copper wire, avoiding the adsorption block 42 from adsorbing the tin liquid normally attached to the copper wire. The material of the adsorption block 42 can be stainless steel, ceramic, etc.

[0054] The cleaning unit includes a transmission component and a cleaning component.

[0055] As Figure 7 , Figure 8 and Figure 9 shown, the transmission component includes a transmission gear 43 fixedly installed on the outer side wall of the mounting column 41. Each group of adsorption units is provided with a driving rack 44 slidably installed on the inner wall of the inner cylinder 40. The driving rack 44 can slide axially along the inner cylinder 40, and the end of the driving rack 44 is connected to the inner cylinder 40 through a spring 45. Each driving rack 44 is meshed with the transmission gear 43 in each group of adsorption units. When the driving rack 44 slides axially along the inner cylinder 40, it can drive the mounting column 41 in each group to rotate together.

[0056] A push rod 46 is fixedly installed at the moving end (left end) of each driving rack 44, and the push rod 46 extends to the outside of the inner cylinder 40.

[0057] A pushing member 47 is fixedly installed at a position near the top on the left side of the outer cylinder 30. The pushing member 47 is located on the rotation path of the push rod 46. The pushing member 47 is of an arc structure, and its width gradually increases along the rotation direction of the inner cylinder 40 (as Figure 9 ). Thus, when the push rod 46 rotates to a position near the upper part of the inner cylinder 40, the end of the push rod 46 will abut against the pushing member 47. As the width of the pushing member 47 increases, it will force the push rod 46 to slide to the right, causing the mounting column 41 to drive the adsorption block 42 to rotate. At this time, the spring 45 will be compressed. When the push rod 46 disengages from the pushing member 47, the spring 45 will drive the driving rack 44 to reset.

[0058] As Figure 6 and Figure 8 shown, the cleaning component includes a cleaning member 50 arranged inside the inner cylinder 40. The cleaning member 50 is of an arc structure and is coaxially arranged with the inner cylinder 40. The cleaning member 50 is located at a position near the upper part inside the inner cylinder 40, and the cleaning member 50 is fixedly connected to the outer cylinder 30 through a connecting frame.

[0059] A plurality of cleaning grooves 51 are arranged at intervals in the left - right direction on the cleaning member 50. Each cleaning groove 51 corresponds to the adsorption block 42 in the left - right direction one by one. The cleaning groove 51 is near the top of the cleaning member 50 and is located on the movement path of the adsorption block 42. The cleaning groove 51 is of an arc structure, and the cross - section of the cleaning groove 51 is a semi - circular structure that completely matches the adsorption block 42.

[0060] Thus, after the adsorption block 42 rotates from the bottom to the upper side, the molten tin on the adsorption block 42 will cool and adhere to the outer side wall of the adsorption block 42. Immediately afterwards, the adsorption block 42 will enter the cleaning groove 51, and the outer side wall of the adsorption block 42 will be in full contact with the inner side wall of the cleaning groove 51. Then, the end of the ejector rod 46 will abut against the ejecting member 47, forcing the adsorption block 42 to rotate. During the process of the adsorption block 42 passing through the arc-shaped cleaning groove 51, it will also rotate around its own axis, thereby rubbing off the molten tin on the outer side wall of the adsorption block 42 and realizing the cleaning of the adsorption block 42.

[0061] A collection box 53 is detachably installed at the bottom of the cleaning member 50. Through holes 52 for discharging materials that communicate with the inside of the cleaning member 50 are provided at the front and rear ends of the cleaning groove 51. The molten tin that falls on the cleaning groove 51 will pass through the through holes 52 for discharging materials and fall into the collection box 53, completing the cleaning of the residue. After the work is completed, the residue in the collection box 53 can be recycled.

[0062] In another embodiment, the cleaning member 50 can clean the molten tin adhering to the adsorption block 42 by heating. This embodiment is not shown in the figure.

[0063] A heating member is provided on the cleaning member 50, which can specifically be an electric heating wire, and can heat up the cleaning groove 51 to keep the cleaning groove 51 at a certain temperature. When the adsorption block 42 enters the cleaning groove 51, the heat of the cleaning member 50 will be transferred to the adsorption block 42, so that the cooled tin layer on the adsorption block 42 will remelt and flow onto the cleaning groove 51, and then fall into the collection box 53 through the through holes 52 for discharging materials on both sides of the cleaning groove 51. A pipeline is connected to the collection box 53, and the liquid discharge end of the pipeline can discharge the molten tin into the tin plating furnace 10, so that the molten tin flows back into the tin plating furnace 10 to realize circulation.

[0064] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

Claims

1. A uniform tinning device for copper wire, comprising: A tinning furnace and a plurality of tinning tubes arranged in front and back; the characteristic is that a plurality of processing modules corresponding to the tinning tubes are also arranged in the tinning furnace; the processing modules include a carrying unit, a plurality of adsorption units and a cleaning unit; The bearing unit comprises an outer cylinder horizontally sliding on the tinning furnace, an inner cylinder coaxially rotating on the outer cylinder, a driving mechanism driving the inner cylinder to rotate is arranged on the outer cylinder, the copper wire passes through the inner cylinder and the axis of the copper wire is located directly below the axis of the inner cylinder; the driving mechanism comprises a motor fixedly mounted on the top of the outer cylinder, a driving gear is fixedly mounted on the output end of the motor, a gear ring is fixedly mounted on the outer side wall of the inner cylinder, an opening through from top to bottom is opened on the outer cylinder at a position corresponding to the driving gear, and the driving gear passes through the opening and meshes with the gear ring; A plurality of adsorption units are circumferentially arranged on the inner wall of the inner cylinder, and each adsorption unit comprises a plurality of mounting columns which are vertically rotatably mounted on the inner wall of the inner cylinder and spaced apart along the axial direction of the inner cylinder, and an adsorption block fixedly arranged on the mounting columns; The cleaning unit includes a transmission assembly and a cleaning assembly. The transmission assembly includes a transmission gear fixedly mounted on the outer wall of the mounting column. Each group of adsorption units is provided with a driving rack slidably mounted on the inner wall of the inner cylinder. The driving rack can slide along the axial direction of the inner cylinder, and the end of the driving rack is connected to the inner cylinder by a spring. Each driving rack is meshed with the transmission gear in each group of adsorption units. A push rod is fixedly mounted on the left end of each driving rack. The push rod extends to the outside of the inner cylinder. A push piece is fixedly mounted on the left side of the outer cylinder near the top. The push piece is located on the rotation path of the push rod. The push piece is an arc-shaped structure, and its width gradually increases along the rotation direction of the inner cylinder; it also includes a cleaning piece fixedly mounted on the outer cylinder, a plurality of arc-shaped cleaning grooves spaced apart on the cleaning piece along the left and right directions, and a collection box arranged at the bottom of the cleaning piece. The cleaning grooves correspond one to one with the adsorption blocks in the left and right directions, and the shapes of the cleaning grooves and the adsorption blocks match.

2. A uniform tinning device for copper wire according to claim 1, characterized in that: A mounting frame is provided on the side wall of the tinning furnace, and a through hole is provided on the inner side of the mounting frame. Two sliding rods are fixedly installed on the mounting frame, and the sliding rods are horizontally arranged in the left and right directions. The outer tube slides and cooperates with the sliding rods. A cylinder is fixedly installed on the mounting frame, and the telescopic part of the cylinder is fixedly connected to the outer tube.

3. A uniform tinning device for copper wire according to claim 2, characterized in that: The mounting frame is vertically slidably matched with the tinning furnace, and an adjusting rod is rotatably mounted on the top of the mounting frame, and the adjusting rod is threadably matched with the tinning furnace.

4. A uniform tinning device for copper wire according to claim 1, characterized in that: The adsorption block is a hemispherical structure, and the bottom plane of the adsorption block is fixedly connected to the end of the mounting column.

5. The uniform tinning device for copper wire according to claim 1, characterized in that: The cleaning piece is in an arc-shaped structure and is coaxially arranged with the inner cylinder. Both ends of the cleaning groove are provided with blanking through holes which are communicated with the inner side of the cleaning piece.

6. A uniform tinning device for copper wire according to claim 5, characterized in that: The cleaning piece is provided with a heating piece to heat the cleaning tank, and the collecting box is connected with a pipeline to allow the tin liquid to flow back into the tinning furnace.

7. A uniform tinning device for copper wire according to any one of claims 1 to 6, characterized in that: The tinning furnace is provided with a liquid supply pipe, the liquid supply pipe is connected with a plurality of tinning tubes, and the liquid supply pipe is connected with a pump body.

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