Spraying plate structure and vapor deposition equipment applying same

Abstract

The invention discloses a spraying plate structure and vapor deposition equipment applying the spraying plate structure, the spraying plate structure comprises a spraying plate assembly and a heating assembly, the heating assembly comprises an annular heating wire unit, and the heating wire unit is nested in the spraying plate assembly and surrounds the spraying plate assembly in the circumferential direction. The heating wire unit is embedded in the spraying plate assembly, namely the heating wire unit and the spraying plate assembly are of an integrated structure, the heating wire unit and the spraying plate assembly have a larger contact area through the arrangement mode, heat is not prone to being diffused to the outside, and therefore the heating efficiency can be improved, it is guaranteed that the temperature of the heating wire unit is basically equal to that of the spraying plate assembly, and the heating efficiency is improved. The temperature difference between the heating ring and the spraying plate is prevented from being too large to affect the deposition effect of the film, and the technical problem that in a traditional scheme, due to the fact that the heating ring and the spraying plate are two parts, the temperature difference exists between the temperature of the heating ring and the temperature of the spraying plate, and then the deposition effect of the film is affected is solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a shower plate structure and a vapor deposition device using the same. Background Art

[0002] Thin film deposition technology is one of the key technologies for manufacturing microelectronic devices. It realizes the manufacturing of microelectronic devices by forming deposits on the substrate. Common thin film deposition technologies include physical vapor deposition, chemical vapor deposition and other technologies. These technologies can be used to manufacture thin films of various materials and thicknesses to meet different electronic device manufacturing needs.

[0003] The semiconductor reaction chamber provides a closed and controlled space, which guarantees the execution of various semiconductor manufacturing process steps. In the existing semiconductor thin film deposition equipment, in some application fields of thin film deposition process, a higher process temperature is required in the reaction chamber, and further, a spray device that can generate higher temperature is required. In order to meet the heat demand of the high-temperature shower head, a heating device such as a heating ring is usually required to provide heat.

[0004] However, currently the heating ring and the shower plate are two components, which will cause a difference in the temperature of the heating ring and the temperature of the shower plate, which is not conducive to efficient temperature control of the process and will further affect the effect of thin film deposition. Summary of the invention

[0005] The embodiments of the present invention provide a shower plate structure and a vapor deposition device using the same, which solves the technical problem in the traditional solution that the temperature of the heating ring and the shower plate are two components, resulting in a difference in temperature between the heating ring and the shower plate, thereby affecting the thin film deposition effect.

[0006] In order to solve the above-mentioned problem, according to one aspect of the present application, an embodiment of the present invention provides a spray plate structure, wherein the spray plate structure includes a spray plate assembly and a heating assembly, wherein the heating assembly includes an annular heating wire unit, and the heating wire unit is nested in the spray plate assembly and circumferentially surrounds the spray plate assembly.

[0007] In some embodiments, the heating wire unit includes at least two circles of heating wires and electrodes corresponding to the heating wires one by one, the at least two circles of heating wires are distributed vertically along the axial direction, and the power of each circle of the heating wires is different.

[0008] In some embodiments, the heating component further includes a socket and a plug, the socket having at least two groups of holes, each electrode corresponding to a group of holes, and the plug can be connected to the heating wire of the electrode corresponding to the hole after being inserted into the corresponding hole.

[0009] In some embodiments, the shower plate structure further includes a temperature measuring hole opened on a side of the shower plate assembly.

[0010] In some embodiments, the shower plate assembly includes a baffle and a shower plate, wherein the baffle is located above the shower plate, and the shower plate extends radially outward compared to the baffle.

[0011] In some embodiments, the shower plate structure further includes a first cooling component, which is sleeved on the outer periphery of the baffle plate and has a bottom in contact with the shower plate.

[0012] In some embodiments, the shower plate structure further includes a second cooling assembly, and the second cooling assembly is sleeved on the outer peripheral surface of the shower plate.

[0013] In some embodiments, the first cooling assembly includes a first cover plate, a first water channel, and a first quick-connect plug, the first cover plate being sleeved on the outer circumference of the portion of the spray plate extending from the baffle, the first water channel being located in the first cover plate, and the first quick-connect plug being connected to the end of the first water channel and extending from the first cover plate.

[0014] In some embodiments, the second cooling assembly includes a second cover plate, a second water circuit and a second quick-connect plug, the second cover plate is sleeved on the outer circumference of the spray plate, the second water circuit is located in the second cover plate, and the second quick-connect plug is connected to the end of the second cover plate.

[0015] According to another aspect of the present application, an embodiment of the present invention provides a vapor deposition device, wherein the vapor deposition device includes the above-mentioned shower plate structure.

[0016] Compared with the prior art, the shower plate structure of the present invention has at least the following beneficial effects:

[0017] The shower plate structure provided by the present invention comprises a shower plate assembly and a heating assembly. The heating assembly comprises an annular heating wire unit. The heating wire unit is nested in the shower plate assembly and circumferentially surrounds the shower plate assembly.

[0018] In the process of chemical vapor deposition, a method of using a heating component to decompose the precursor gas to form a thin film is required. The heating component is usually made of refractory metals such as tungsten, tantalum or rhenium, and the temperature can reach above 2000 degrees Celsius. At high temperatures, the gas is decomposed into active groups, which then form a thin film on the surface of the substrate. The heating wire unit in the present invention is nested in the shower plate assembly, that is, the two are an integrated structure. This arrangement allows the heating wire unit and the shower plate assembly to have more contact area, and the heat is not easy to diffuse to the outside, so it can improve the heating efficiency, while ensuring that the temperature of the heating wire unit and the shower plate assembly is basically the same, avoiding excessive temperature difference between the two and affecting the deposition effect of the thin film.

[0019] The vapor deposition equipment provided by the present invention is designed based on the above-mentioned shower plate structure. Its beneficial effects refer to the beneficial effects of the above-mentioned shower plate structure, which will not be described in detail here.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0022] Figure 1 is an exploded view of a spray plate structure provided by an embodiment of the present invention;

[0023] Figure 2 is a structural schematic diagram of a spray plate structure provided by an embodiment of the present invention;

[0024] Figure 3 is a schematic structural diagram of a spray plate structure provided by an embodiment of the present invention from another angle;

[0025] Figure 4 is a cross-sectional view of a spray plate structure provided by an embodiment of the present invention;

[0026] Figure 5 is a structural schematic diagram of a heating component in a spray plate structure provided by an embodiment of the present invention;

[0027] Figure 6 is a structural schematic diagram of a first cooling assembly in a spray plate assembly provided by an embodiment of the present invention;

[0028] Figure 7is a schematic structural diagram of a socket in a shower plate assembly provided by an embodiment of the present invention;

[0029] Reference numerals:

[0030] 1. Spray plate assembly; 11. Baffle; 12. Spray plate; 2. Heating assembly; 21. Heating wire unit; 22. Socket; 23. Plug; 24. Hole position; 211. Heating wire; 3. Temperature measurement hole position; 4. First cooling assembly; 41. First cover plate; 42. First water channel; 43. First quick-connect plug; 5. Second cooling assembly; 51. Second cover plate; 52. Second water channel; 53. Second quick-connect plug. DETAILED DESCRIPTION

[0031] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation methods, structures, features and effects of the present invention application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0032] In the description of the present invention, it should be clarified that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, but are not necessarily used to describe a specific order or sequence; the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the referred device or element must have a specific direction or position, and therefore cannot be understood as a limitation on the present invention.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0035] Example 1

[0036] This embodiment provides a spray plate structure, such as Figure 1-Figure 7As shown, the shower plate structure includes a shower plate assembly 1 and a heating assembly 2. The heating assembly 2 includes a ring-shaped heating wire unit 21. The heating wire unit 21 is nested in the shower plate assembly 1 and circumferentially surrounds the shower plate assembly 1.

[0037] The spraying technology in vapor deposition is mainly used in the process of chemical vapor deposition. The precursor gas is mixed and sprayed onto the substrate surface through a gas shower head to form the desired thin film or single crystal structure. In this embodiment, the shower plate assembly 1 can control the flow, concentration and speed of the gas to ensure uniform gas distribution in the reaction chamber, thereby achieving a stable deposition process. In the process of chemical vapor deposition, it is necessary to use a heating assembly 2 to decompose the precursor gas to form a thin film. The heating assembly 2 is usually made of refractory metals such as tungsten, tantalum or rhenium, and the temperature can reach more than 2000 degrees Celsius. At high temperatures, the gas is decomposed into active groups, which then form a thin film on the surface of the substrate.

[0038] In this embodiment, the general outline of the spray plate assembly 1 is a columnar structure, and the general outline of the heating wire unit 21 in the heating assembly 2 is an annular structure. An annular structure is arranged on a circular section inside the columnar structure. In this way, the heating wire unit 21 is nested in the spray plate assembly 1, that is, the two are an integrated structure. This arrangement allows the heating wire unit 21 to have more contact area with the spray plate assembly 1, and heat is not easily diffused to the outside, thereby improving the heating efficiency and ensuring that the temperature of the heating wire unit 21 is basically the same as that of the spray plate assembly 1, thereby avoiding excessive temperature difference between the two and affecting the deposition effect of the thin film.

[0039] In a specific embodiment, the heating wire unit 21 includes at least two circles of heating wires 211 and electrodes corresponding to the heating wires 211 one by one. The at least two circles of heating wires 211 are distributed vertically along the axial direction, and the power of each circle of heating wires 211 is different.

[0040] Specifically, for a clearer explanation, it is assumed that in a certain embodiment, the heating wire unit 21 includes five circles of heating wires 211, namely, a first circle of heating wires, a second circle of heating wires, a third circle of heating wires, a fourth circle of heating wires, and a fifth circle of heating wires. At least two circles of the heating wires 211 are distributed vertically along the axial direction, namely, a first circle of heating wires, a second circle of heating wires, a third circle of heating wires, a fourth circle of heating wires, and a fifth circle of heating wires are arranged in sequence from top to bottom.

[0041] In addition, this embodiment emphasizes that the power of each circle of the heating wire 211 is different, that is, the first circle of heating wire, the second circle of heating wire, the third circle of heating wire, the fourth circle of heating wire and the fifth circle of heating wire have different heating powers. In other words, in this embodiment, the resistance value of the heating wire can be changed, and the diameter of the heating wire and the diameter of each circle of heating wire surrounded by the heating wire can also be changed, thereby adjusting the power output of the heating component 2 to adapt to different processes of the spray plate structure.

[0042] For example, in a certain process, the heating wire 211 needs to generate an output power of 9.8Kw, and any one of the first circle of heating wires, the second circle of heating wires, the third circle of heating wires, the fourth circle of heating wires, or the fifth circle of heating wires can be selected for limitation, specifically:

[0043] Assuming that the diameter of the annular structure formed by the first circle of heating wire is 445mm, the length of the first circle of heating wire is: L = πd = 3.14X445 = 1397mm; the diameter of the heating wire itself is 8mm, then the cross-sectional area is: A = πd 2 / 4=3.14X8X8 / 4=50mm 2 ; The resistivity of the heating wire is: 6.3X10 -5 Ω·mm; the resistance of the first circle resistor is: R=ρ*L / A=6.3X10 -5 *X1397X50=4.4Ω;Heating wire voltage: U=208V;Then the output power of the first coil heating wire: P=U 2 / R=208X208 / 4.4=9.8Kw, meeting the process requirements.

[0044] Of course, the heating component 2 can also output different powers by setting parameters.

[0045] In addition, in this embodiment, the first circle of heating wires, the second circle of heating wires, the third circle of heating wires, the fourth circle of heating wires and the fifth circle of heating wires are arranged in sequence from top to bottom, which can cover a larger area on the side of the spray plate assembly 1 without increasing the diameter of the spray plate assembly 1 too much, and will not affect the space in the reaction chamber.

[0046] In a specific embodiment, the heating component 2 also includes a socket 22 and a plug 23, the socket 22 has at least two groups of holes 24, each electrode corresponds to a group of holes 24, and the plug 23 can be connected to the heating wire 211 of the electrode corresponding to the hole 24 after being inserted into the corresponding hole 24.

[0047] For a clearer explanation, the first circle of heating wire, the second circle of heating wire, the third circle of heating wire, the fourth circle of heating wire and the fifth circle of heating wire are continued to be used. The electrodes corresponding to the five circles of heating wire are connected to the socket 22, and there are six groups of holes 24 on the socket 22, namely the positive hole, the first negative hole, the second negative hole, the third negative hole, the fourth negative hole and the fifth negative hole, wherein the positive hole has a plug 23, when another plug 23 is inserted into the first negative hole, the first circle of heating wire is connected; when another plug 23 is inserted into the second negative hole, the second circle of heating wire is connected; when another plug 23 is inserted into the third negative hole, the third circle of heating wire is connected; when another plug 23 is inserted into the fourth negative hole, the fourth circle of heating wire is connected; when another plug 23 is inserted into the fifth negative hole, the fifth circle of heating wire is connected.

[0048] In this embodiment, the selection of the first circle of heating wires, the second circle of heating wires, the third circle of heating wires, the fourth circle of heating wires and the fifth circle of heating wires are achieved through the mutual cooperation between the socket 22, the plug 23, the hole 24 and the electrodes. Any circle of heating wires can be selected to work according to needs, and more than two circles of heating wires can be made to work at the same time to increase the output power.

[0049] In a specific embodiment, the shower plate structure further includes a temperature measuring hole 3 opened on the side of the shower plate assembly 1. The temperature measuring hole 3 uses a thermocouple to measure the temperature, and real-time feedback of the temperature of the shower plate assembly 1 is provided to adjust the output power of the heating assembly 2.

[0050] A thermocouple is a device that uses the thermoelectric effect to measure temperature. It has the advantages of high accuracy, wide measurement range and simple operation. It consists of two different metals at contact points. When the temperatures of these contact points are different, a voltage is generated. By measuring this voltage, the temperature can be determined.

[0051] In a specific embodiment, the shower plate assembly 1 includes a baffle plate 11 and a shower plate 12 . The baffle plate 11 is located above the shower plate 12 , and compared with the baffle plate 11 , the shower plate 12 extends radially outward.

[0052] The general outline of the baffle 11 is a columnar structure, on which a first spray hole is provided. The general outline of the spray plate 12 is also a columnar structure, on which a second spray hole is provided. In a specific deposition process, the gas reaches the film of the heating disk after passing through the first spray hole and the second spray hole. In other words, the gas is dispersed twice through the first spray hole and the second spray hole, which is more conducive to evenly diffusing the gas to the film of the heating disk. In this embodiment, the diameter of the baffle 11 is smaller than the diameter of the spray plate 12, and the two are concentrically arranged. In this way, compared with the baffle 11, the spray plate 12 has a radially outward extension section.

[0053] In a specific embodiment, the spray plate structure further includes a first cooling component 4, which is sleeved on the outer periphery of the baffle 11, and its bottom is in contact with the spray plate 12. That is, in this embodiment, after the first cooling component 4 is sleeved on the outer periphery of the baffle 11, it can be located just on the extension section of the spray plate 12. In this way, when the heating function is not needed, the upper surface of the spray plate 12 and the outer periphery of the baffle 11 can be cooled by the first cooling component 4.

[0054] In a specific embodiment, the spray plate structure further includes a second cooling assembly 5, which is sleeved on the outer peripheral surface of the spray plate 12. The second cooling assembly 5 is wrapped around the outer peripheral surface of the spray plate 12, and is combined with the first cooling assembly 4, so that the outer peripheral surface of the entire spray plate assembly 1 is wrapped, and part of the upper surface of the spray plate 12 is also covered, which is more conducive to cooling and improving the cooling efficiency.

[0055] In a specific embodiment, the first cooling assembly 4 includes a first cover plate 41, a first water channel 42 and a first quick-connect plug 43. The first cover plate 41 is sleeved on the outer peripheral surface of the baffle plate 11 extending out of the spray plate 12. The first water channel 42 is located in the first cover plate 41. The first quick-connect plug 43 is connected to the end of the first water channel 42 and extends out of the first cover plate 41.

[0056] More specifically, the first cover plate 41 is an annular structure with a channel inside. Its axial thickness is not greater than the height of the baffle 11, so that the first cover plate 41 can be closely matched with the outer peripheral surface of the baffle 11. The first waterway 42 is arranged in the channel of the first cover plate 41. The first waterway 42 includes at least two annular water pipes, and at least two of the annular water pipes are arranged horizontally adjacent to each other. However, it should be noted that the first waterway 42 is not surrounded by a whole ring. It has a first notch. At both ends of the first notch, a first quick-connect plug 43 is arranged. The quick-connect plug is the most convenient plug-and-play connection method. In some occasions where the connection is inconvenient and the space is small, the quick-connect plug has great advantages. In this embodiment, the first waterway 42 is arranged in the first cover plate 41, and the first quick-connect plug 43 at the first notch extends out of the first cover plate 41, which facilitates the installation and removal of the first cooling assembly 4. For example, when the spray plate structure needs to be removed, the first quick-connect plug 43 can be used to temporarily isolate the first waterway 42 from the outside.

[0057] More specifically, in the first cooling assembly 4, assuming that the flow rate of the cooling medium (water) is 1L / min, the water inlet temperature is 25°C, the water outlet temperature is 50°C, and the water specific heat capacity is C=4.18J / (g*C), then the heat taken away by the cooling water per minute is Q=C*M*Δt=4.18x1x1000x25=104.5, and the power taken away by the water cooling is Q / T=104.5 / 60=1.7Kw. It can be seen that the first cooling assembly 4 can effectively reduce the heat of the spray plate assembly 1.

[0058] In a specific embodiment, the second cooling assembly 5 includes a second cover plate 51, a second water channel 52 and a second quick-connect plug 53. The second cover plate 51 is sleeved on the outer peripheral surface of the spray plate 12, the second water channel 52 is located in the second cover plate 51, and the second quick-connect plug 53 is connected to the end of the second cover plate 51.

[0059] Specifically, the second cover plate 51 is an annular structure with a second notch, and the annular structure has a space inside, and the second waterway 52 is arranged in the space. The second waterway 52 includes at least two annular water pipes, and at least two of the annular water pipes are arranged vertically adjacent to each other, and the second waterway 52 is not surrounded by a whole ring, and has a third notch, and the third notch matches the second notch, so that the entire second waterway 52 can be accommodated in the second cover plate 51. In addition, in order to make the second waterway 52 fit tightly with the second cover plate 51, a groove can be provided in the second cover plate 51, and the annular water pipe corresponding to the second waterway 52 is embedded in the groove. In addition, a second quick-connect plug 53 is provided at both ends of the second notch. The quick-connect plug is the most convenient plug-and-play connection method. In some occasions where the connection is inconvenient and the space is small, the quick-connect plug has great advantages.

[0060] More specifically, in the second cooling assembly 5, assuming that the flow rate of the cooling medium (water) is 2L / min, the water inlet temperature is 25°C, the water outlet temperature is 47°C, and the water specific heat capacity is C=4.18J / (g*C), then the heat taken away by the cooling water per minute is Q=C*M*Δt=4.18x3x1000x22=183.9, and the power taken away by the water cooling is Q / T=183.9 / 60=3.1Kw. It can be seen that the second cooling assembly 5 can effectively reduce the heat of the spray plate assembly 1.

[0061] During specific use, the first cooling component 4 and the second cooling component 5 can be selected to work simultaneously, or either of them can work alone according to actual needs, so as to achieve the cooling demand caused by the temperature of the spray plate exceeding the set temperature when the heating component 2 is not working.

[0062] The spray plate assembly provided in this embodiment, firstly, the spray plate assembly 1 and the heating wire unit 21 are a whole, so that the temperature rise of the spray plate 12 is more uniform, and the heating efficiency of the spray plate 12 is improved; secondly, the heating wire unit 21 can provide different powers, which can change the heating temperature of the spray plate 12 so that the spray plate assembly can adapt to processes with different spray plate temperatures; and, when the heating wire unit 21 is not working and the temperature of the spray plate 12 exceeds the set temperature, the spray plate 12 can be cooled by the first cooling assembly 4 and / or the second cooling assembly.

[0063] Example 2

[0064] This embodiment provides a vapor deposition device, which includes the shower plate structure described in Embodiment 1.

[0065] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A shower plate structure, characterized in that: The shower plate structure comprises a shower plate assembly and a heating assembly. The heating assembly comprises an annular heating wire unit. The heating wire unit is nested in the shower plate assembly and circumferentially surrounds the shower plate assembly.

2. The shower plate structure according to claim 1, characterized in that: The heating wire unit comprises at least two circles of heating wires and electrodes corresponding to the heating wires one by one. The at least two circles of heating wires are distributed vertically along the axial direction, and the power of each circle of heating wires is different.

3. The shower plate structure according to claim 2, characterized in that: The heating component also includes a socket and a plug, the socket has at least two groups of holes, each electrode corresponds to a group of holes, and the plug can be connected to the heating wire of the electrode corresponding to the hole after being inserted into the corresponding hole.

4. The shower plate structure according to claim 1, characterized in that: The spray plate structure also includes a temperature measuring hole opened on the side of the spray plate assembly.

5. The shower plate structure according to any one of claims 1 to 4, characterized in that: The shower plate assembly includes a baffle and a shower plate. The baffle is located above the shower plate, and compared with the baffle, the shower plate extends radially outward.

6. The shower plate structure according to claim 5, characterized in that: The spray plate structure further includes a first cooling component, which is sleeved on the outer periphery of the baffle plate, and the bottom of the first cooling component is in contact with the spray plate.

7. The shower plate structure according to claim 5, characterized in that: The spray plate structure further includes a second cooling assembly, which is sleeved on the outer peripheral surface of the spray plate.

8. The shower plate structure according to claim 6, characterized in that: The first cooling assembly includes a first cover plate, a first water channel and a first quick-connect plug. The first cover plate is sleeved on the outer circumference of the part of the baffle extending out of the spray plate. The first water channel is located in the first cover plate. The first quick-connect plug is connected to the end of the first water channel and extends out of the first cover plate.

9. The shower plate structure according to claim 7, characterized in that: The second cooling assembly includes a second cover plate, a second water channel and a second quick-connect plug. The second cover plate is sleeved on the outer circumference of the spray plate. The second water channel is located inside the second cover plate. The second quick-connect plug is connected to the end of the second cover plate.

10. A vapor deposition device, characterized in that: The vapor deposition equipment comprises the shower plate structure according to any one of claims 1-9.

Images