Miniature wireless electric heating refrigerating device

Abstract

The invention provides a miniature wireless electric heating refrigeration device, and relates to the technical field of semiconductor thermoelectric energy conversion. The miniature wireless thermoelectric refrigeration device comprises a wireless power supply mechanism and a semiconductor refrigeration mechanism which are independent of each other, and the wireless power supply mechanism comprises a wireless power supply transmitting coil, a first conversion circuit module and a power supply which are connected in sequence; and the semiconductor refrigeration mechanism comprises a miniature semiconductor refrigeration sheet, a second conversion circuit module and a wireless power supply receiving coil which are connected in sequence. The wireless power supply mechanism is adopted as a power supply part of the miniature wireless thermoelectric refrigeration device, the limitation of a fixed power supply position on a traditional refrigeration mode is eliminated, the wireless power supply transmitting coil can provide a magnetic field in a target area, and the wireless power supply receiving coil can generate induced alternating current in the magnetic field; therefore, electric energy is provided for the miniature semiconductor chilling plate, and the effect that the miniature semiconductor chilling plate can provide precise refrigeration and temperature control for the movable target object is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor thermoelectric energy conversion, in particular to a miniature wireless thermal cooling device. Background Art

[0002] As an advanced clean, safe, stable and pollution-free energy material, thermoelectric materials have the characteristics of being able to realize the mutual conversion of thermal energy and electrical energy. Thermoelectric energy conversion devices designed and prepared based on thermoelectric materials have the advantages of good stability, high reliability, maintenance-free and long life. During the working process, they have attracted much attention for their advantages such as no mechanical moving parts, no noise, no vibration, no release of any greenhouse gases, and no toxicity.

[0003] Thermoelectric cooling technology is a solid-state electronic cooling technology. By applying direct current to a thermoelectric module composed of P-type and N-type thermoelectric arm thermoelectric materials connected in series, heat can be transferred from one end face of the thermoelectric module to the other end face under the action of the Peltier effect, thereby achieving the purpose of heat flow evacuation to the target area of ​​the object.

[0004] Thermoelectric coolers (TECs) made of thermoelectric materials have the advantages of being fast, noiseless, and having precise temperature control when cooling. They can provide precise and controllable cooling and heat dissipation for various devices that require real-time temperature control, such as concentrated heat flux density areas of microelectronic chips, portable drug storage devices, wearable human-computer interaction devices, consumer electronic products, etc., and provide a heat dissipation solution that is conducive to in-situ cooling to solve thermal management problems. Micro thermoelectric coolers have high process integration, a large number of thermoelectric pairs per unit area, and a high cooling power per unit area, and can effectively use small currents (milliamperes) for precise temperature control. At the same time, micro thermoelectric coolers are small in size, which is convenient for integrated device integration, so they can be built into functional equipment to solve the problem of heat concentration caused by high integration in several microcircuits.

[0005] In the actual application of existing thermoelectric cooling technology, due to the size, power and line limitations of the DC power supply, the integrated cooling device can only work in a fixed position, and there are problems such as complex line layout and large space occupied in the application scenario.

[0006] In summary, there is an urgent need for a refrigeration device that can break away from the limitations of fixed power supply locations in traditional refrigeration methods. Summary of the invention

[0007] In order to solve the above problems, the present invention provides a miniature wireless thermoelectric cooling device, which gets rid of the limitation of the traditional cooling method being subject to the fixed power supply position, and realizes the effect that the miniature semiconductor cooling chip can provide precise cooling and temperature control for a movable target object.

[0008] A miniature wireless thermoelectric refrigeration device provided by the present invention comprises a wireless power supply mechanism and a semiconductor refrigeration mechanism which are independent of each other, wherein the wireless power supply mechanism comprises a wireless power supply transmitting coil, a first conversion circuit module and a power supply which are connected in sequence; the semiconductor refrigeration mechanism comprises a miniature semiconductor refrigeration sheet, a second conversion circuit module and a wireless power supply receiving coil which are connected in sequence; the power supply is used to provide alternating current to the first conversion circuit module; the first conversion circuit module is used to adjust the frequency and power of the alternating current provided by the power supply; the wireless power supply transmitting coil is used to generate a magnetic field; the wireless power supply receiving coil generates induced alternating current through the principle of electromagnetic induction in the magnetic field generated by the wireless power supply transmitting coil; the second conversion circuit module converts the induced alternating current generated by the wireless power supply receiving coil into direct current and adjusts the power of the direct current; the miniature semiconductor refrigeration sheet provides a refrigeration function.

[0009] In some feasible implementations, the volume of the wireless power supply mechanism is 10 to 20 cm 3 ; and / or, the size of the micro semiconductor refrigeration chip is 0.2-0.7cm*0.2-0.7cm*0.1-0.5cm; and / or, the input current of the micro semiconductor refrigeration chip is 0-800mA; and / or, the temperature difference generated by the micro semiconductor refrigeration chip is 0-63°C; and / or, the cooling power of the micro semiconductor refrigeration chip is 0-0.38W;

[0010] In a feasible embodiment, the micro-semiconductor refrigeration chip includes a cooling layer, a top electrode layer, a thermoelectric element layer, a bottom electrode layer, and a heat release layer from top to bottom; the thermoelectric element layer includes multiple groups of thermoelectric elements, each group of thermoelectric elements includes a P-type thermoelectric arm and an N-type thermoelectric arm; the top electrode layer includes multiple top electrode sheets, and the bottom electrode layer includes multiple bottom electrode sheets; in the thermoelectric elements of the same group, the top of the P-type thermoelectric arm and the top of the N-type thermoelectric arm are connected through the top electrode sheet; in the thermoelectric elements of adjacent but different groups, the bottom of the P-type thermoelectric arm and the bottom of the N-type thermoelectric arm are connected through the bottom electrode sheet; the second conversion circuit module is connected to the bottom electrode sheets located at both ends of the thermoelectric element layer through wires.

[0011] In a feasible implementation manner, the top electrode sheet and the bottom electrode sheet are made of conductive metal, the cooling layer and the heat release layer are made of ceramic substrates; the P-type thermoelectric arm is Bi 0.5 Sb 1.5 Te3, the N-type thermoelectric arm is Bi2Se 0.3 Te 2.7 .

[0012] In a feasible implementation manner, the material of the top electrode sheet and the bottom electrode sheet is copper or gold, and the material of the cooling layer and the heat release layer is aluminum oxide or aluminum nitride.

[0013] In some feasible embodiments, the outer diameter of the wireless power transmitting coil is 5 to 10 cm; and / or the AC power provided by the first conversion circuit module is 20 to 30 w; and / or the AC frequency provided by the first conversion circuit module is 100 to 200 KHz; and / or the magnetic field size provided by the wireless power transmitting coil is 10 to 50 μT; and / or the magnetic field space provided by the wireless power transmitting coil is 5 to 15 cm*5 to 15 cm*2 to 8 cm.

[0014] In a feasible implementation manner, the induced current generated by the wireless power receiving coil is 0-500 mA; and / or the output voltage of the second conversion circuit module is 0-5 V, and the output current is 0-800 mA.

[0015] In a feasible implementation, the micro wireless thermoelectric cooling device dissipates heat through air convection under no-load conditions, the distance between the wireless power transmitting coil and the wireless power receiving coil is less than 1 cm, the induced current generated by the wireless power receiving coil is 60-80 mA, the output power of the wireless power receiving coil is 0.28-0.48 W, the cooling power of the micro semiconductor refrigeration sheet is 0.28-0.48 W, and a temperature difference of 10-20°C is established within 5-10 seconds.

[0016] In a feasible implementation, the micro wireless thermoelectric cooling device dissipates heat through metal conduction under no-load conditions, the distance between the wireless power transmitting coil and the wireless power receiving coil is less than 1 cm, the induced current generated by the wireless power receiving coil is 60-80 mA, the output power of the wireless power receiving coil is 0.28-0.48 W, the cooling power of the micro semiconductor refrigeration sheet is 0.28-0.48 W, and a temperature difference of 20-30°C is established within 80-100 seconds.

[0017] In a feasible implementation, the micro wireless thermoelectric cooling device is used as a test carrier with a bionic prosthesis made of organic material, and the heat dissipation surface is placed in the air, and the heat is dissipated by air convection. The distance between the wireless power transmitting coil and the wireless power receiving coil is less than 1 cm, the induced current generated by the wireless power receiving coil is 60-80 mA, the output power of the wireless power receiving coil is 0.28-0.48 W, the cooling power of the micro semiconductor refrigeration chip is 0.28-0.48 W, and a temperature difference of 10-20°C is established within 5-10 seconds.

[0018] The present invention provides a miniature wireless thermoelectric cooling device, which has the following beneficial effects:

[0019] 1) The present invention adopts a wireless power supply mechanism as the power supply part of the micro wireless thermoelectric cooling device, which gets rid of the limitation of the traditional cooling method being subject to the fixed power supply position. The wireless power supply transmitting coil can provide a magnetic field in the target area, and the wireless power supply receiving coil can generate induced alternating current in the magnetic field, thereby providing electrical energy to the micro semiconductor cooling chip, thereby achieving the effect that the micro semiconductor cooling chip can provide precise cooling and temperature control for the movable target object.

[0020] 2) The wireless power transmitting coil and the wireless power receiving coil used in the present invention can change the current size by changing the distance between the two, that is, the size of the induced current changes with the distance between the wireless power transmitting coil and the wireless power transmitting coil, and the current size input by the micro semiconductor refrigeration chip changes with the space, so that the cooling effect can change with the position of the target area. In addition, the power of the micro semiconductor refrigeration chip can be further controlled by the first conversion circuit module and the second conversion circuit module, so that precise temperature control can be achieved according to actual needs.

[0021] 3) The micro wireless thermoelectric cooling device used in the present invention has a fast cooling speed. By applying a pulse current to the wireless induction power supply module, the target thermoelectric area can be cooled down quickly and a certain temperature difference can be maintained without interrupting its original working process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the wireless power supply mechanism in the present invention.

[0023] Figure 2 It is a structural schematic diagram of the semiconductor refrigeration mechanism in the present invention.

[0024] Figure 3 It is a working schematic diagram of the present invention.

[0025] Figure 4 It is a schematic diagram of the structure of the micro semiconductor refrigeration chip in the present invention.

[0026] Figure 5 This is a performance test data diagram of the present invention when heat is dissipated through air in a no-load state.

[0027] Figure 6 This is a performance test data diagram of the present invention when heat is dissipated through brass in a no-load state.

[0028] Figure 7 This is a data chart of the application performance test of the present invention on the prosthesis.

[0029] Reference numerals

[0030] Wireless power supply mechanism 1

[0031] Wireless power transmission coil 11

[0032] The first conversion circuit module 12

[0033] Power Supply 13

[0034] Semiconductor refrigeration mechanism 2

[0035] Wireless power receiving coil 21

[0036] The second conversion circuit module 22

[0037] Micro semiconductor refrigeration chip 23

[0038] Cooling layer 3

[0039] Top electrode layer 31

[0040] Top electrode sheet 31a

[0041] Thermoelectric element layer 32

[0042] P-type thermoelectric arm 32a

[0043] N-type thermoelectric arm 32b

[0044] Bottom electrode layer 33

[0045] Bottom electrode sheet 33a

[0046] Heat release layer 34

[0047] Heating platform 4

[0048] Prosthesis 5

[0049] Contact position between the prosthesis and the cooling layer Sp1

[0050] Prosthesis quarter Sp2

[0051] Sp3, half of the prosthesis

[0052] Heating platform and prosthesis contact surface Sp4 DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without creative work belong to the scope of protection of the present invention. In the description of the present invention, it should be noted that the orientation or position relationship indicated by the terms "left side", "right side", "upper side", "lower side", "above", "below" and the like is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0054] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Furthermore, in the description of the present invention, unless otherwise specified, “plurality” means two or more.

[0056] The embodiment of the present invention provides a miniature wireless thermoelectric cooling device, referring to Figure 1 and Figure 2 , including a wireless power supply mechanism 1 and a semiconductor refrigeration mechanism 2 which are independent of each other. In a specific embodiment, the volume of the semiconductor refrigeration mechanism 2 is 15 to 20 cm 3 Continue reading Figure 1, the wireless power supply mechanism 1 includes a wireless power supply transmitting coil 11, a first conversion circuit module 12 and a power supply 13 connected in sequence. In a specific embodiment, the above-mentioned units are connected by wires. In some supplementary embodiments, the outer diameter of the wireless power supply transmitting coil 11 is 8 to 10 cm, the input voltage of the power supply 13 is 220V AC, the output voltage of the power supply 13 is 20 to 30V AC, the AC provided by the first conversion circuit module 12 is a high-frequency AC of 100 to 200KHz, the power of the AC provided by the first conversion circuit module 12 is 20 to 30w, the magnetic field size provided by the wireless power supply transmitting coil 11 is 10 to 50μT, and the magnetic field space provided by the wireless power supply transmitting coil 11 is 5 to 15cm*5 to 15cm*2 to 8cm. Continue reading Figure 2 , the semiconductor refrigeration mechanism 2 includes a micro semiconductor refrigeration chip 23, a second conversion circuit module 22 and a wireless power receiving coil 21 connected in sequence. In a specific embodiment, the above units are connected by wires. In some supplementary embodiments, the outer diameter of the wireless power receiving coil 21 is 1 to 5 cm, the size of the micro semiconductor refrigeration chip 23 is 0.2 to 0.7 cm*0.2 to 0.7 cm*0.1 to 0.5 cm, the input current of the micro semiconductor refrigeration chip 23 is 0 to 800 mA, the temperature difference generated by the micro semiconductor refrigeration chip 23 is 0 to 63 ° C, and the cooling power of the micro semiconductor refrigeration chip 23 is 0 to 0.38 W.

[0057] As an illustration: the power supply 13 is used to provide alternating current to the first conversion circuit module 12; the first conversion circuit module 12 is used to adjust the frequency and power of the alternating current provided by the power supply 13, usually by amplifying the frequency of the alternating current provided by the power supply 13 to make it a high-frequency alternating current; the wireless power transmission coil 11 is used to generate a magnetic field, the magnitude of which is 10 to 50 μT; the wireless power receiving coil 21 generates induced alternating current by electromagnetic induction principle in the magnetic field generated by the wireless power transmission coil 11, and the current of the induced alternating current is 0 to 500 mA; the second conversion circuit module 22 converts the induced alternating current generated by the wireless power receiving coil 21 into direct current and adjusts the power of the direct current, the voltage of which is 0 to 5 V, and the output current of which is 0 to 800 mA; the micro semiconductor refrigeration chip 23 provides a refrigeration function, and can perform precise, rapid, noiseless, and temperature-controllable refrigeration on the part of the freely moving object where the local heat flux density is concentrated in the magnetic field space provided by the wireless power transmission coil 11. The present invention adopts a wireless power supply mechanism 1 as the power supply part of the micro wireless thermoelectric cooling device, which gets rid of the limitation of the position of the fixed power supply 13 in the traditional cooling method. The wireless power supply transmitting coil 11 can provide a magnetic field in the target area, and the wireless power supply receiving coil 21 can generate induced alternating current in the magnetic field, thereby providing electrical energy to the micro semiconductor cooling chip 23, so that the micro semiconductor cooling chip 23 can provide precise cooling and temperature control for the movable target object.

[0058] When the micro wireless thermoelectric cooling device provided in the embodiment of the present invention is in use, as long as the wireless power receiving coil 21 is located within the magnetic field range of the wireless power transmitting coil 11, an induced current can be generated to power the micro semiconductor cooling chip 23. In a supplementary embodiment, refer to Figure 3 , a wireless power supply mechanism 1 can supply power to multiple semiconductor refrigeration mechanisms 2. Therefore, the wireless power supply transmitting coil 11 and the wireless power supply receiving coil 21 used in the present invention can change the current size by changing the distance between the two, that is, the size of the induced current changes with the distance between the wireless power supply transmitting coil 11 and the wireless power supply transmitting coil 11, and the current size input by the micro semiconductor refrigeration chip 23 changes with the space, so that the cooling effect can be changed with the change of the position of the target area. In addition, the power of the micro semiconductor refrigeration chip 23 can be further controlled by the first conversion circuit module 12 and the second conversion circuit module 22, so that accurate temperature control can be achieved according to actual needs.

[0059] In the micro wireless thermoelectric cooling device provided in the embodiment of the present invention, referring to Figure 4The micro semiconductor refrigeration sheet 23 includes a refrigeration layer 3, a top electrode layer 31, a thermoelectric element layer 32, a bottom electrode layer 33, and a heat release layer 34 from top to bottom. The thermoelectric element layer 32 includes multiple groups of thermoelectric elements, each group of thermoelectric elements includes a P-type thermoelectric arm 32a and an N-type thermoelectric arm 32b, the top electrode layer 31 includes multiple top electrode sheets 31a, and the bottom electrode layer 33 includes multiple bottom electrode sheets 33a. Figure 4 In the thermoelectric elements of the same group, the top of the P-type thermoelectric arm 32a and the top of the N-type thermoelectric arm 32b are connected through the top electrode sheet 31a; in the thermoelectric elements of adjacent and different groups, the bottom of the P-type thermoelectric arm 32a and the bottom of the N-type thermoelectric arm 32b are connected through the bottom electrode sheet 33a. The second conversion circuit module 22 is connected to the bottom electrode sheets 33a located at both ends of the thermoelectric element layer 32 through wires. As an illustration, the arrangement order of the P-type thermoelectric arm 32a and the N-type thermoelectric arm 32b in each group of thermoelectric elements should be the same, for example: the P-type thermoelectric arm 32a is on the left, and the N-type thermoelectric arm 32b is on the right. In addition, there is a gap between the P-type thermoelectric arm 32a and the N-type thermoelectric arm 32b in each group of thermoelectric elements, and they are not in direct contact. At the same time, refer to Figure 4 , all the thermoelectric elements are connected in sequence to form a plurality of "π" shapes. In a specific embodiment, refer to Figure 4 The number of thermoelectric elements is four groups, and the P-type thermoelectric arm 32a is Bi 0.5 Sb 1.5 Te3, and the N-type thermoelectric arm 32b is Bi2Se0.3Te2.7. In a supplementary embodiment, the material of the top electrode sheet 31a and the bottom electrode sheet 33a is a conductive metal, preferably copper or gold, the material of the cooling layer 3 and the heat release layer 34 is a ceramic substrate with high thermal conductivity, preferably alumina or aluminum nitride, and the P-type thermoelectric arm 32a and the N-type thermoelectric arm 32b are sealed by an organic material such as silica gel, epoxy resin, etc. to isolate the external environmental pollution to achieve a protective effect.

[0060] Embodiment 1

[0061] The test conditions of the micro wireless thermoelectric refrigeration device in this embodiment are as follows: in the no-load state, the heat release layer 34 is placed in the air to dissipate heat through air convection. The outer diameter of the wireless power transmission coil 11 is 8.8 cm, and the outer diameter of the wireless power receiving coil 21 is 3 cm; the input voltage of the power supply 13 is 220V AC, and the output voltage is 24V AC; the volume of the semiconductor refrigeration mechanism 2 is 15 cm 3; The magnetic field space of the wireless power transmitting coil 11 is 10cm*10cm*5cm; the size of the micro semiconductor refrigeration chip 23 is 0.5cm*0.5cm*0.3cm; the distance between the wireless power transmitting coil 11 and the wireless power receiving coil 21 is less than 1cm; the induced current generated by the wireless power receiving coil 21 is about 70mA; the output power of the wireless power receiving coil 21 is 0.35w; the cooling power of the micro semiconductor refrigeration chip 23 is 0.35w.

[0062] The experimental results show that the micro wireless thermoelectric cooling device in this embodiment establishes a temperature difference of 16.8°C within 7 seconds. Figure 5 shown.

[0063] Embodiment 2

[0064] The test conditions of the micro wireless thermoelectric refrigeration device in this embodiment are as follows: in the no-load state, the heat release layer 34 is placed on the brass block, and the heat is dissipated by metal conduction. The outer diameter of the wireless power transmission coil 11 is 8.8 cm, and the outer diameter of the wireless power receiving coil 21 is 3 cm; the input voltage of the power supply 13 is 220V AC, and the output voltage is 24V AC; the volume of the semiconductor refrigeration mechanism 2 is 15 cm 3 ; The magnetic field space of the wireless power transmitting coil 11 is 10cm*10cm*5cm; the size of the micro semiconductor refrigeration chip 23 is 0.5cm*0.5cm*0.3cm; the distance between the wireless power transmitting coil 11 and the wireless power receiving coil 21 is less than 1cm; the induced current generated by the wireless power receiving coil 21 is about 70mA; the output power of the wireless power receiving coil 21 is 0.35w; the cooling power of the micro semiconductor refrigeration chip 23 is 0.35w.

[0065] The experimental results show that the micro wireless thermoelectric cooling device in this embodiment can establish a temperature difference of 16.8°C within 90 seconds. Figure 6 shown.

[0066] Embodiment 3

[0067] The test conditions of the micro wireless thermoelectric refrigeration device in this embodiment are as follows: a heating platform 4 is set, and a bionic prosthesis 5 made of organic material is used as a test carrier, the bionic prosthesis 5 is placed on the heating platform 4, the heating temperature of the heating platform 4 is set to 45°C, the cooling layer 3 is placed on the prosthesis 5, and the heat release layer 34 is placed in the air, and the heat is dissipated by air convection. The outer diameter of the wireless power transmission coil 11 is 8.8cm, and the outer diameter of the wireless power receiving coil 21 is 3cm; the input voltage of the power supply 13 is 220V AC, and the output voltage is 24V AC; the volume of the semiconductor refrigeration mechanism 2 is 15cm3 ; The magnetic field space of the wireless power transmitting coil 11 is 10cm*10cm*5cm; the size of the micro semiconductor refrigeration chip 23 is 0.5cm*0.5cm*0.3cm; the distance between the wireless power transmitting coil 11 and the wireless power receiving coil 21 is less than 1cm; the induced current generated by the wireless power receiving coil 21 is about 70mA; the output power of the wireless power receiving coil 21 is 0.35w; the cooling power of the micro semiconductor refrigeration chip 23 is 0.35w.

[0068] The temperature of the contact position (Sp1) between the prosthesis 5 and the cooling layer 3, the quarter and half positions (Sp2, Sp3) of the prosthesis 5, and the contact surface (Sp4) between the heating platform 4 and the prosthesis 5 are measured by an infrared thermal imager. Figure 7 The experimental results show that the micro wireless thermoelectric cooling device in this embodiment establishes a temperature difference of 7.9°C within 6.4s. Figure 7 shown.

[0069] In summary, the micro wireless thermoelectric cooling device used in the present invention has a fast cooling speed, which can quickly cool down the target area and maintain a certain temperature difference.

[0070] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A miniature wireless thermoelectric cooling device, characterized in that: The invention comprises a wireless power supply mechanism (1) and a semiconductor refrigeration mechanism (2) which are independent of each other, wherein the wireless power supply mechanism (1) comprises a wireless power supply transmitting coil (11), a first conversion circuit module (12) and a power source (13) which are connected in sequence; and the semiconductor refrigeration mechanism (2) comprises a micro semiconductor refrigeration sheet (23), a second conversion circuit module (22) and a wireless power supply receiving coil (21) which are connected in sequence. The power supply (13) is used to provide alternating current to the first conversion circuit module (12); The first conversion circuit module (12) is used to adjust the frequency and power of the alternating current provided by the power source (13); The wireless power transmission coil (11) is used to generate a magnetic field; The wireless power receiving coil (21) generates induced alternating current in the magnetic field generated by the wireless power transmitting coil (11) through the principle of electromagnetic induction; The second conversion circuit module (22) converts the induced alternating current generated by the wireless power receiving coil (21) into direct current and adjusts the power of the direct current; The micro semiconductor refrigeration chip (23) provides a refrigeration function.

2. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: The volume of the wireless power supply mechanism (1) is 10 to 20 cm 3 ; And / or, the size of the micro semiconductor refrigeration chip (23) is 0.2-0.7 cm*0.2-0.7 cm*0.1-0.5 cm; And / or, the input current of the micro semiconductor refrigeration chip (23) is 0-800 mA; And / or, the temperature difference that can be generated by the micro semiconductor refrigeration chip (23) is 0 to 63°C; And / or, the cooling power of the micro semiconductor refrigeration chip (23) is 0 to 0.38W.

3. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: The micro semiconductor refrigeration sheet (23) comprises, from top to bottom, a refrigeration layer (3), a top electrode layer (31), a thermoelectric element layer (32), a bottom electrode layer (33), and a heat release layer (34); The thermoelectric element layer (32) includes a plurality of groups of thermoelectric elements, each group of thermoelectric elements includes a P-type thermoelectric arm (32a) and an N-type thermoelectric arm (32b); the top electrode layer (31) includes a plurality of top electrode sheets (31a), and the bottom electrode layer (33) includes a plurality of bottom electrode sheets (33a); In the thermoelectric elements of the same group, the top of the P-type thermoelectric arm (32a) and the top of the N-type thermoelectric arm (32b) are connected via a top electrode sheet (31a); in the thermoelectric elements of adjacent but different groups, the bottom of the P-type thermoelectric arm (32a) and the bottom of the N-type thermoelectric arm (32b) are connected via a bottom electrode sheet (33a); The second conversion circuit module (22) is connected to the bottom electrode sheets (33a) located at both ends of the thermoelectric element layer (32) via wires.

4. The micro wireless thermoelectric cooling device according to claim 3, characterized in that: The material of the top electrode sheet (31a) and the bottom electrode sheet (33a) is a conductive metal, and the material of the cooling layer (3) and the heat release layer (34) is a ceramic substrate; The P-type thermoelectric arm (32a) is Bi 0.5 Sb 1.5 Te3, the N-type thermoelectric arm (32b) is Bi2Se 0.3 Te 2.7 .

5. The micro wireless thermoelectric cooling device according to claim 4, characterized in that: The materials of the top electrode sheet (31a) and the bottom electrode sheet (33a) are copper or gold, and the materials of the cooling layer (3) and the heat release layer (34) are aluminum oxide or aluminum nitride.

6. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: The outer diameter of the wireless power transmission coil (11) is 5 to 10 cm; And / or, the AC power provided by the first conversion circuit module (12) is 20-30W; And / or, the frequency of the alternating current provided by the first conversion circuit module (12) is 100-200 KHz; And / or, the magnetic field provided by the wireless power transmission coil (11) is 10 to 50 μT; And / or, the magnetic field space provided by the wireless power transmission coil (11) is 5-15 cm*5-15 cm*2-8 cm.

7. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: The induced current generated by the wireless power receiving coil (21) is 0 to 500 mA; and / or the output voltage of the second conversion circuit module (22) is 0 to 5 V, and the output current is 0 to 800 mA.

8. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: The micro wireless thermoelectric refrigeration device dissipates heat through air convection under no-load conditions, the distance between the wireless power transmitting coil (11) and the wireless power receiving coil (21) is less than 1 cm, the induced current generated by the wireless power receiving coil (21) is 60 to 80 mA, the output power of the wireless power receiving coil (21) is 0.28 to 0.48 W, the refrigeration power of the micro semiconductor refrigeration sheet (23) is 0.28 to 0.48 W, and a temperature difference of 10 to 20° C. is established within 5 to 10 seconds.

9. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: The micro wireless thermoelectric refrigeration device dissipates heat through metal conduction under no-load conditions. The distance between the wireless power transmitting coil (11) and the wireless power receiving coil (21) is less than 1 cm. The induced current generated by the wireless power receiving coil (21) is 60 to 80 mA. The output power of the wireless power receiving coil (21) is 0.28 to 0.48 W. The refrigeration power of the micro semiconductor refrigeration sheet (23) is 0.28 to 0.48 W. A temperature difference of 20 to 30° C. is established within 80 to 100 seconds.

10. The micro wireless thermoelectric cooling device according to claim 1, characterized in that: When a bionic prosthesis (5) made of organic material is used as a test carrier, the heat dissipation surface of the micro wireless thermoelectric refrigeration device is placed in the air and heat is dissipated by air convection. The distance between the wireless power transmitting coil (11) and the wireless power receiving coil (21) is less than 1 cm. The induced current generated by the wireless power receiving coil (21) is 60 to 80 mA. The output power of the wireless power receiving coil (21) is 0.28 to 0.48 W. The cooling power of the micro semiconductor refrigeration chip (23) is 0.28 to 0.48 W. A temperature difference of 10 to 20° C. is established within 5 to 10 seconds.

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