Infrared thermal imaging electric power meter

Abstract

The invention relates to an infrared thermal imaging electric power meter which comprises meter internal components, a meter shell and external terminals on the meter shell, and the meter internal components comprise a signal measurement function board, a voltage measurement device, a current measurement device, a switch state measurement device and an infrared thermal imaging temperature measurement device. The instrument shell is provided with a plurality of external terminals, the devices are connected to a signal measurement function board through an IIC bus, the instrument shell is provided with a liquid crystal display, the liquid crystal display is connected to the signal measurement function board, and the external terminals comprise a voltage measurement terminal, a current measurement terminal, a switching value measurement terminal and an infrared thermal imaging temperature measurement terminal. According to the method, infrared thermal imaging is adopted, contact is not needed, an imaging mode is adopted, the temperature of an area can be recognized like a picture, and a point position with the higher temperature can be screened out. Insulation and electrical creepage between electrical equipment under high voltage are solved through non-contact temperature measurement, the service life is longer, and the device is not affected by the environment.

Description

Technical Field

[0001] The present invention relates to an electric power meter, and in particular to an infrared thermal imaging electric power meter which can perform non-contact temperature measurement and temperature field distribution detection while measuring electrical parameters of electric equipment, and has the function of multi-dimensional measurement and judgment of the operating status of electric equipment. Background Art

[0002] At present, power meters can collect power parameters. For temperature collection, sensors are often attached to conductors or fixed in a certain space to measure the average temperature around. It is impossible to measure the temperature of an area, especially the joints and connections of power equipment, where the temperature rises seriously. These data may be replaced by local temperature measurements, and the temperature cannot be accurately predicted. There is an urgent need for temperature measurement tools with temperature field display. Based on the above situation of infrared thermal imaging power meters, infrared thermal imaging can measure the temperature field without contact, solve the discharge phenomenon caused by traditional embedded thermocouples, and measure the temperature of a certain space while performing the spatial temperature identification function. Summary of the invention

[0003] In response to the above problems, the main purpose of the present invention is to provide an infrared thermal imaging power meter that can perform non-contact temperature measurement and temperature field distribution detection while measuring the electrical parameters of the power equipment, thereby playing the role of multi-dimensional measurement and judgment of the operating status of the electrical equipment.

[0004] The present invention solves the above technical problems through the following scheme: an infrared thermal imaging power meter, the infrared thermal imaging power meter comprises: a meter internal component, a meter shell, and external terminals on the meter shell.

[0005] The internal components of the instrument include a signal measurement function board, a voltage measurement device, a current measurement device, a switch state measurement device, and an infrared thermal imaging temperature measurement device; the voltage measurement device, the current measurement device, the switch state measurement device, and the infrared thermal imaging temperature measurement device are connected to the signal measurement function board through an I2C bus, and a liquid crystal display is provided on the instrument casing, and the liquid crystal display is connected to the signal measurement function board.

[0006] The external terminals include: voltage measurement terminal, current measurement terminal, switch quantity measurement terminal, infrared thermal imaging temperature measurement terminal.

[0007] The voltage measuring terminal, the current measuring terminal, the switch state measuring terminal, and the infrared thermal imaging temperature measuring terminal are terminals of a voltage measuring device, a current measuring device, a switch state measuring device, and an infrared thermal imaging temperature measuring device, respectively.

[0008] In a specific implementation example of the present invention, the voltage measuring device includes a resistor step-down and sampling circuit; the voltage measuring device samples the signal and sends it to the signal measurement function board, which compiles the collected signal into a corresponding voltage digital quantity.

[0009] In a specific implementation example of the present invention, the current measuring device includes a current measuring device that uses an amplifier for sampling, and the current measuring device samples the signal and sends it to a signal measurement function board, and the signal measurement function board compiles the collected signal into a corresponding current digital quantity.

[0010] In a specific implementation example of the present invention, the switch state measurement device adopts high and low level sampling. After the signal is sampled, it is sent to the signal measurement function board, and the signal measurement function board compiles the collected signal into the corresponding switch state digital quantity.

[0011] In a specific implementation example of the present invention, an infrared thermal imaging temperature measurement device uses an infrared thermal imaging sensor to collect temperature matrices, and the signals are sent to a signal measurement function board, which compiles the collected signals into corresponding temperature gradient field matrices and digital temperatures.

[0012] In a specific implementation example of the present invention, the signal measurement function board is a single-chip signal processing unit with stronger processing capabilities, which receives multiple I2C bus signals. The signal measurement function board communicates with the voltage measurement module via I2C, and exchanges voltage signals to the signal measurement function board.

[0013] The signal measurement function board maps the data into the internal memory, and the liquid crystal display module displays the collected voltage signal on the liquid crystal display under the drive of the SPI bus of the signal measurement function board.

[0014] The current measurement module and the signal measurement function board use the I2C bus to exchange data, and the data exchanged between the signal measurement function board and the liquid crystal display is driven by the SPI bus to transmit the data to the liquid crystal display.

[0015] The switch status module connects the switch signal with the microcontroller pin of the signal measurement function board, and the signal measurement function board and the liquid crystal display adopt the SPI bus driving mode to connect the switch quantity module.

[0016] The infrared thermal imaging module communicates data with the signal measurement function board I2C, and the video data matrix data is stored in each measurement frame. The signal measurement module and the LCD display use SPI communication to display the video signal collected by the infrared thermal imaging module and the related temperature measurement value analyzed by the image information.

[0017] The voltage signal, current signal, switch signal and infrared thermal imaging signal collected by the information processing unit are all sent to the liquid crystal display unit and displayed when the relevant signals are queried. At the same time, the signal measurement function board transmits the collected signals to a remote location through the RS485 interface and the MODBUS-RTU protocol.

[0018] The positive progress of the present invention is that compared with common similar technologies, the infrared thermal imaging power meter provided by the present invention adopts infrared thermal imaging, does not require contact, and adopts an imaging method, which can identify the temperature of an area like a photo, and can screen out points with higher temperatures. Non-contact temperature measurement solves the insulation and electrical creepage between electrical equipment under high voltage, has a longer service life, and is not affected by the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention. DETAILED DESCRIPTION

[0020] Preferred embodiments of the present invention are given below in conjunction with the accompanying drawings to illustrate the technical solutions of the present invention in detail.

[0021] Figure 1 It is a schematic diagram of the overall structure of the present invention, as shown in Figure 1 As shown: the infrared thermal imaging power meter proposed in the present invention comprises: an internal component of the meter, an instrument housing, and external terminals on the instrument housing. The internal component of the meter comprises a signal measurement function board, a voltage measurement device, a current measurement device, a switch state measurement device, and an infrared thermal imaging temperature measurement device; the voltage measurement device, the current measurement device, the switch state measurement device, and the infrared thermal imaging temperature measurement device are connected to the signal measurement function board via an I2C bus, and a liquid crystal display is arranged on the instrument housing, and the liquid crystal display is connected to the signal measurement function board.

[0022] The external terminals include: voltage measurement terminals, current measurement terminals, switch quantity measurement terminals, and infrared thermal imaging temperature measurement terminals; the voltage measurement terminals, current measurement terminals, switch state measurement terminals, and infrared thermal imaging temperature measurement terminals are terminals of a voltage measurement device, a current measurement device, a switch state measurement device, and an infrared thermal imaging temperature measurement device, respectively.

[0023] The voltage measuring device of the present invention comprises a resistor voltage reduction and sampling circuit; the voltage measuring device samples the signal and sends it to the signal measurement function board, and the signal measurement function board compiles the collected signal into a corresponding voltage digital quantity.

[0024] The current measuring device of the present invention adopts an amplifier for sampling, wherein the current measuring device samples the signal and sends it to a signal measuring function board, and the signal measuring function board compiles the collected signal into a corresponding current digital quantity.

[0025] The switch state measuring device of the present invention adopts high and low level sampling, and the signal is sent to the signal measurement function board after sampling, and the signal measurement function board compiles the collected signal into the corresponding switch state digital quantity.

[0026] The infrared thermal imaging temperature measuring device of the present invention uses an infrared thermal imaging sensor to collect temperature matrix, and the signal is sent to a signal measurement function board, which compiles the collected signal into a corresponding temperature gradient field matrix and digital temperature.

[0027] The signal measurement function board of the present invention adopts a single-chip microcomputer as a basic functional unit, can read signals collected by other single-chip microcomputers, and is mainly used for signal transmission between single-chip microcomputers. The voltage measurement unit adopts a single-chip microcomputer with a small pin as the main processor. After the voltage signal is reduced by a resistor, the collected voltage signal is converted into a digital signal and stored in the single-chip microcomputer for the signal measurement function board to read relevant data.

[0028] The signal measurement function board of the present invention is mainly a single-chip signal processing unit with stronger processing capability, which can receive multiple I2C bus signals. The signal measurement function board communicates with the voltage measurement module through I2C, and exchanges voltage signals to the signal measurement function board. The signal measurement function board maps data into the internal memory, and the liquid crystal display module displays the collected voltage signal on the liquid crystal display under the SPI bus drive of the signal measurement function board. The I2C bus used between the current measurement module and the signal measurement function board is used for data exchange, and the data exchanged between the signal measurement function board and the liquid crystal display is also driven by the SPI bus to transmit the data to the liquid crystal display. The switch state module docks the switch signal with the single-chip pin of the signal measurement function board, and the signal measurement function board and the liquid crystal display use the SPI bus drive mode to connect the switch quantity module. The infrared thermal infrared imaging module communicates data with the signal measurement function board through I2C, and stores the video data matrix data in each measurement frame. The signal measurement module and the liquid crystal display use SPI communication to display the video signal collected by the infrared thermal imaging module and the related temperature measurement value analyzed by the picture information. In this way, the voltage signal, current signal, switch signal and infrared thermal imaging signal collected by the information processing unit are all sent to the LCD display unit and displayed when the relevant signals are queried. At the same time, the signal measurement function board can transmit the collected signals to a remote place through the RS485 interface and the MODBUS-RTU protocol.

[0029] The current measurement device uses an operational amplifier as the core of sampling. After amplifying the tiny current signal through the operational amplifier, the real primary current value is obtained after multiplication operation. The current value is stored in the current measurement unit and the signal measurement function board exchanges information to obtain the current. After mathematical operation with the voltage, the power and metered electricity can be obtained.

[0030] The switch status module converts the collected switch signal into a digital signal of 0 and 1 and directly sends it to the IO pin of the signal measurement function board, and determines the switch status by the high and low level of the point.

[0031] The infrared thermal imaging module uses the standard MLX90640 module. The signal measurement function board collects data from the infrared module through the underlying data exchange, and then analyzes the data through the single-chip microcomputer on the signal measurement function board. The data is restored to image data and measured temperature and stored in the register.

[0032] The signal measurement function board of the present invention has the functions of detecting voltage, current, temperature, switch state, infrared thermal imaging recognition and the like.

[0033] The present invention uses an infrared thermal imaging electric power meter to measure electrical parameters and more quickly understand the temperature distribution of equipment operation. The electrical parameter measurement of power equipment can simultaneously perform non-contact temperature measurement and temperature field distribution detection, which plays a multi-dimensional measurement and judgment function on the operating status of electrical equipment. Currently, the temperature measurement group must adopt contact temperature measurement, and the measured temperatures are all local temperatures. Infrared thermal imaging is used, which does not require contact and uses imaging to identify the temperature of an area like a photo, and can screen out points with higher temperatures. Non-contact temperature measurement solves the insulation and electrical creepage between electrical equipment under high voltage, has a longer service life, and is not affected by the environment.

[0034] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected, and the scope of the present invention to be protected is defined by the attached claims and their equivalents.

Claims

1. An infrared thermal imaging power meter, characterized in that: The infrared thermal imaging power meter comprises: The internal components of the instrument, the instrument housing, and the external terminals on the instrument housing, The internal components of the instrument include a signal measurement function board, a voltage measurement device, a current measurement device, a switch state measurement device, and an infrared thermal imaging temperature measurement device; the voltage measurement device, the current measurement device, the switch state measurement device, and the infrared thermal imaging temperature measurement device are connected to the signal measurement function board through the I2C bus. A liquid crystal display is provided on the instrument housing, and the liquid crystal display is connected to the signal measurement function board. The external terminals include: voltage measurement terminal, current measurement terminal, switch quantity measurement terminal, infrared thermal imaging temperature measurement terminal; The voltage measuring terminal, the current measuring terminal, the switch state measuring terminal, and the infrared thermal imaging temperature measuring terminal are terminals of a voltage measuring device, a current measuring device, a switch state measuring device, and an infrared thermal imaging temperature measuring device, respectively.

2. The infrared thermal imaging power meter according to claim 1, characterized in that: The voltage measuring device includes a resistor voltage reduction and sampling circuit; the voltage measuring device samples the signal and sends it to the signal measurement function board, and the signal measurement function board compiles the collected signal into a corresponding voltage digital quantity.

3. The infrared thermal imaging power meter according to claim 1, characterized in that: The current measuring device includes a current measuring device which adopts an amplifier for sampling, and sends the signal to a signal measuring function board after the signal is sampled, and the signal measuring function board compiles the collected signal into a corresponding current digital quantity.

4. The infrared thermal imaging power meter according to claim 1, characterized in that: The switch state measuring device adopts high and low level sampling. After the signal is sampled, it is sent to the signal measurement function board. The signal measurement function board compiles the collected signal into the corresponding switch state digital quantity.

5. The infrared thermal imaging power meter according to claim 1, characterized in that: The infrared thermal imaging temperature measurement device uses an infrared thermal imaging sensor to collect temperature matrix, and the signal is sent to the signal measurement function board. The signal measurement function board compiles the collected signal into the corresponding temperature gradient field matrix and digital temperature.

6. The infrared thermal imaging power meter according to claim 1, characterized in that: The signal measurement function board is a single-chip signal processing unit with stronger processing capabilities. It receives multiple I2C bus signals. The signal measurement function board communicates with the voltage measurement module through I2C and exchanges voltage signals to the signal measurement function board. The signal measurement function board maps the data into the internal memory, and the LCD display module displays the collected voltage signal on the LCD under the SPI bus drive of the signal measurement function board; The current measurement module and the signal measurement function board use the I2C bus to exchange data, and the data exchanged between the signal measurement function board and the liquid crystal display is driven by the SPI bus to transmit the data to the liquid crystal display; The switch status module connects the switch signal with the microcontroller pin of the signal measurement function board. The signal measurement function board and the liquid crystal display use the SPI bus drive mode to connect the switch quantity module; The infrared thermal imaging module communicates with the signal measurement function board I2C to store the video data matrix data in each measurement frame. The signal measurement module and the LCD display use SPI communication to display the video signal collected by the infrared thermal imaging module and the related temperature measurement value analyzed by the image information; The voltage signal, current signal, switch signal and infrared thermal imaging signal collected by the information processing unit are all sent to the liquid crystal display unit and displayed when the relevant signals are queried. At the same time, the signal measurement function board transmits the collected signals to a remote location through the RS485 interface and the MODBUS-RTU protocol.

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