Electric energy monitoring device based on algorithm chip

Abstract

The invention belongs to the technical field of electric energy monitoring, and particularly relates to an electric energy monitoring device based on an algorithm chip, which comprises a meter shell, an equipment shell and an integrated heat dissipation device, the meter shell is installed on the front side of the equipment shell, the equipment shell and the meter shell are spliced together, and binding posts are arranged at the bottom of the meter shell. Fixing plates are symmetrically arranged on the two sides of the equipment shell, screw holes are formed in the fixing plates, and bolts are installed in the screw holes; the monitoring device of the scheme adopts an integrated heat dissipation device, and has double functions of heat dissipation and dust prevention; the algorithm chip is linked with the integrated heat dissipation device, so that full-automatic intelligent management of the heat dissipation system is realized; the micro circulating pump can be automatically started and stopped according to the real-time temperature in the device, timely intervention is performed according to the temperature change, manual intervention is not needed, energy is saved, stable operation of a heat dissipation system is ensured, and the service life of an algorithm chip and other elements is effectively prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of electric energy monitoring, and in particular to an electric energy monitoring device based on an algorithm chip. Background Art

[0002] Electric energy is the energy possessed by electric charge due to its electric potential. The load in the circuit consumes electric energy. A large amount of electric energy will be consumed during the operation of the load. In order to monitor the electric energy consumption generated during the operation of the load, an electric energy consumption monitoring device is required. An algorithm chip is generally provided inside the electric energy consumption monitoring device to calculate the electric energy consumption, which is convenient for users to view;

[0003] When the algorithm chip is working, the internal transistors will frequently switch on and off. According to Joule's law, when the current passes through the circuit elements inside the chip, heat will be generated due to the existence of resistance. For example, during the operation of a complex electric energy monitoring algorithm, the logic gates in the chip switch states quickly, causing the current to change continuously, thereby generating heat.

[0004] The higher the chip's integration, the more transistors there are per unit area; the heat generated by these transistors when working will be more concentrated; excessively high temperatures will cause the electrical properties of the semiconductor materials inside the chip to change as the temperature rises, causing the chip's operating speed to slow down. For electric energy monitoring devices, problems such as data processing delays and reduced monitoring accuracy may occur; and external dust will also enter the casing through open heat dissipation ports. The accumulated dust will increase the power consumption of the algorithm chip and reduce the service life of the algorithm chip and other components, which is very unfavorable for industrial production. Summary of the invention

[0005] The purpose of the present invention is to provide an electric energy monitoring device based on an algorithm chip to solve the problem that traditional monitoring devices do not have an intelligent heat dissipation structure and cannot take into account both heat dissipation and dust prevention.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: an electric energy monitoring device based on an algorithm chip, comprising a case, a device case and an integrated heat dissipation device;

[0007] The watch case is installed on the front side of the device case, the device case and the watch case are spliced ​​together, and a terminal is provided at the bottom of the watch case; fixing plates are symmetrically provided on both sides of the device case, screw holes are opened on the fixing plates, and bolts are installed in the screw holes; a power converter, a microcontroller, a current sensor, a voltage sensor, an analog-to-digital converter, a communication module and a storage chip are provided in the device case;

[0008] The device shell is also equipped with an integrated heat dissipation device, which includes two left and right heat dissipation boxes and a heat exchange box. The heat exchange box is fixed on the top of the device shell, and the two heat dissipation boxes are respectively fixed on the left and right sides of the device shell. A heat exchange plate extending downward is installed at the bottom of the heat exchange box. The heat exchange plate is a thin-walled heat absorption plate, and the heat exchange plate is plugged into the rear side of the inner cavity of the device shell.

[0009] Adapters are installed between the two ends of the heat exchange box and the two heat dissipation boxes, and adapters are also installed at the bottoms of the two heat dissipation boxes. Connecting pipes are installed between the adapters, and the heat exchange box and the heat dissipation box form a circulation through the connecting pipes.

[0010] Preferably, the top and bottom of the device shell and the watch case are symmetrically provided with splicing fixing parts, and bolts are installed in the splicing fixing parts for locking; a locking nut is installed at the bottom of the terminal; and a display screen is embedded in the front side of the watch case.

[0011] Preferably, micro-circulation pumps are installed at both ends of the inner cavity of the heat exchange box, and a micro-circulation pump is also installed at the bottom of the inner cavity of one of the heat dissipation boxes, and the micro-circulation pump is connected to the adapter.

[0012] Preferably, a guide cavity is opened in the inner cavity of the heat exchange plate, and the guide cavity is composed of multiple small cavities from top to bottom, and the upper and lower adjacent small cavities are connected end to end. The two ends of the guide cavity are respectively connected to the two micro circulation pumps in the heat exchange box through connecting pipes.

[0013] Preferably, a corrugated flow guide cavity is provided in the inner cavity of the heat dissipation box, a heat dissipation plate is provided on the outer side of the heat dissipation box, and a wavy groove is provided on the surface of the heat dissipation plate.

[0014] Preferably, the inner walls of the heat exchange box and the heat dissipation box are both installed with liquid level sensors; and the inner wall of the equipment shell is installed with a temperature sensor.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The monitoring device of this solution adopts an integrated heat dissipation device, which takes into account the dual functions of heat dissipation and dust prevention; the heat dissipation box and the heat exchange box work together, using the excellent thermal conductivity of the aluminum alloy heat dissipation box and the carefully designed wavy grooves on the heat dissipation plate to greatly improve the natural heat dissipation efficiency and quickly dissipate the internal heat of the device to the external environment;

[0017] The algorithm chip is linked with the integrated cooling device to achieve fully automatic intelligent management of the cooling system. It can automatically start and stop the micro-circulation pump according to the real-time temperature inside the device, and intervene in time according to temperature changes without manual intervention. This saves energy and ensures the stable operation of the cooling system, effectively extending the service life of the algorithm chip and other components. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is the first front view of the present invention;

[0019] Figure 2 It is the second front view of the present invention;

[0020] Figure 3 It is a schematic diagram of the integrated heat dissipation device of the present invention;

[0021] Figure 4 It is a cross-sectional view of the integrated heat dissipation device of the present invention.

[0022] In the figure: 1 case, 2 terminal, 3 locking nut, 4 display screen, 5 device case, 6 splicing fixing part, 7 fixing plate, 8 heat sink, 9 heat exchange box, 10 corrugated heat sink, 11 adapter, 12 heat exchange plate, 13 guide cavity, 14 corrugated guide cavity, 15 micro circulation pump. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0024] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0025] Example:

[0026] See also Figure 1-4 , the present invention provides the following technical solutions: an electric energy monitoring device based on an algorithm chip, comprising a watch case 1, a device case 5 and an integrated heat dissipation device;

[0027] The watch case 1 is installed on the front side of the device case 5. The device case 5 and the watch case 1 are spliced ​​together. Splicing fixing parts 6 are symmetrically arranged at the top and bottom of the device case 5 and the watch case 1. Bolts are installed in the splicing fixing parts 6 for locking, which is convenient for installation and disassembly, and effectively improves the assembly efficiency of the device;

[0028] A terminal 2 is provided at the bottom of the case 1. The terminal 2 is made of copper alloy and silver-plated on the surface to reduce contact resistance and ensure the high efficiency of current transmission. A locking nut 3 is installed at the bottom of the terminal 2. When the terminal 2 is connected to the wire, it is tightened with a locking bolt. The locking nut 3 can be detached from the terminal 2 by rotating downward. A display screen 4 is embedded in the front side of the case 1.

[0029] The two sides of the device shell 5 are symmetrically provided with fixing plates 7, screw holes are opened on the fixing plates 7, bolts are installed in the screw holes, and the outer side of the fixing plates 7 is wrapped with rubber shock-absorbing pads. When the monitoring device is installed in a vibration environment, the influence of external vibration on internal components can be reduced, thereby ensuring the accuracy of monitoring data;

[0030] The device housing 5 is provided with a power converter, a microcontroller, a current sensor, a voltage sensor, an analog-to-digital converter, a communication module and a storage chip;

[0031] The power converter is a high-efficiency, wide-voltage input range model that is suitable for different power environments and provides stable power supply for all components of the device; its installation position is close to the bottom of the device shell 5 to facilitate heat dissipation and wiring;

[0032] The microcontroller is the core computing unit of the device. An algorithm chip is built into the microcontroller. The microcontroller is installed at the center of the device shell 5. Current sensors, voltage sensors, analog-to-digital converters and other supporting components are distributed around it to shorten the signal transmission path and reduce interference. The current sensor and the voltage sensor are electrically connected to the terminal 2. The current sensor is used to measure the current size in the circuit, and the voltage sensor is mainly used to measure the voltage value in the circuit.

[0033] The storage chip uses a large-capacity, high-speed read-write Flash chip to store long-term electric energy monitoring data, which is convenient for subsequent data analysis and tracing. It is installed near the microcontroller and connected through a high-speed data bus;

[0034] The device shell 5 is also equipped with an integrated heat dissipation device, which includes two left and right heat dissipation boxes 8 and a heat exchange box 9. The heat exchange box 9 is fixed on the top of the device shell 5, and the two heat dissipation boxes 8 are respectively fixed on the left and right sides of the device shell 5. A heat exchange plate 12 extending downward is installed at the bottom of the heat exchange box 9. The heat exchange plate 12 is a thin-walled heat absorbing plate, and the heat exchange plate 12 is plugged into the rear side of the inner cavity of the device shell 5. The bottom of the heat exchange plate 12 is embedded in the inner wall of the device shell 5, so that the heat exchange plate 12 plays the role of the side wall of the device shell 5.

[0035] Adapters 11 are installed between the two ends of the heat exchange box 9 and the two heat dissipation boxes 8, and adapters 11 are also installed at the bottom of the two heat dissipation boxes 8, and connecting pipes are installed between the adapters 11, through which the heat exchange box 9 and the heat dissipation box 8 form a circulation; micro-circulation pumps 15 are installed at both ends of the inner cavity of the heat exchange box 9, and a micro-circulation pump 15 is also installed at the bottom of the inner cavity of one of the heat dissipation boxes 8, and the micro-circulation pump 15 is connected to the adapter 11;

[0036] A guide cavity 13 is provided in the inner cavity of the heat exchange plate 12. The guide cavity 13 is composed of a plurality of small cavities from top to bottom. The upper and lower adjacent small cavities are connected end to end. The two ends of the guide cavity 13 are respectively connected to the two micro-circulation pumps 15 in the heat exchange box 9 through connecting pipes. The guide cavity 13 can extend the flow path of the coolant and increase the heat exchange efficiency.

[0037] A corrugated flow guide cavity 14 is provided in the inner cavity of the heat dissipation box 8, a heat dissipation plate 10 is provided on the outer side of the heat dissipation box 8, and a wave-shaped groove is provided on the surface of the heat dissipation plate 10. The function of the wave-shaped groove is to increase the contact area between the heat dissipation plate 10 and the air; and the corrugated flow guide cavity 14 in the heat dissipation box 8 can also extend the flow path of the coolant and improve the heat exchange efficiency between the coolant and the heat dissipation plate 10; the inner walls of the heat exchange box 9 and the heat dissipation box 8 are both installed with liquid level sensors; and the inner wall of the equipment shell 5 is installed with a temperature sensor;

[0038] When in use, the two heat sinks 8 are responsible for heat dissipation and storage of coolant, and the heat exchange box 9 is responsible for heat exchange in the device shell 5. A temperature sensor is installed in the device shell 5, and the real-time temperature is detected by the temperature sensor. When the circulation pump 15 (a DC micro circulation pump with a size that can be embedded in the heat exchange box 9 or the heat sink 8) is started, the liquid in the guide cavity 13 of the heat exchange box 9 can be pumped into the heat sink 8, and the static heat dissipation circulation direction in the heat sink 8 is as shown in the attached figure. Figure 4 The arrow direction; intelligent temperature control is achieved by connecting the integrated heat sink to the microcontroller;

[0039] The monitoring principle of this solution is as follows: the current sensor works based on the Hall effect principle. When the measured current passes through the current-carrying conductor, a magnetic field is generated around the conductor. The Hall element in the current sensor is placed in the magnetic field. Due to the Hall effect, a Hall voltage is generated in the direction perpendicular to the magnetic field and the current, and the voltage is proportional to the measured current. The Hall voltage is amplified and filtered by the signal conditioning circuit to convert it into an analog electrical signal suitable for processing by the algorithm chip.

[0040] Voltage sensors usually use the principle of resistor voltage division, using a high-precision resistor network to proportionally attenuate the measured high voltage to a range acceptable to the algorithm chip, and also convert it into an analog signal through a signal conditioning circuit; these conditioned current and voltage analog signals are used as raw data and input into the analog-to-digital converter;

[0041] The analog-to-digital converter samples the analog signals from the current and voltage sensors at a certain sampling frequency. Based on the quantization principle, it discretizes the continuous analog signals into digital codes. It uses a common successive approximation analog-to-digital converter to compare the input analog signal with a series of reference voltages through an internal comparator, gradually approaching the true value of the analog signal, and finally outputs the corresponding binary digital code, which accurately reflects the current and voltage amplitude information at the sampling moment.

[0042] After receiving the digital current and voltage values ​​converted by the analog-to-digital converter, the algorithm chip calculates the electric energy according to the formula Electric energy is calculated, where P(t) = U(t) × I(t), U(t) is the instantaneous voltage, and I(t) is the current. Due to certain measurement errors of the sensor, environmental interference, and quantization errors of the analog-to-digital converter, the algorithm chip has a built-in data correction module. It uses the sensor calibration parameters pre-stored in the chip to perform real-time correction on the collected current and voltage data to compensate for errors caused by sensor characteristic drift.

[0043] At the same time, data smoothing filtering algorithms, such as Kalman filtering, are used to suppress data fluctuations in the electric energy calculation process and remove noise interference, making the final output electric energy data more stable and reliable, and truly reflecting the actual energy consumption of the power system;

[0044] The algorithm chip sets a series of electric energy parameter thresholds, including power thresholds, electric energy accumulation thresholds, etc.; in the process of real-time calculation of electric energy, the current value is constantly compared with these thresholds; once it is detected that the power exceeds the preset overload power threshold, indicating that the power system may have abnormal load conditions, the algorithm chip immediately triggers an alarm signal and sends an alarm message to the monitoring center or local display screen through the communication module, so that timely measures can be taken to prevent equipment damage or power accidents;

[0045] Similarly, when the accumulated value of electric energy reaches a specific warning threshold, the user can be prompted to perform operations such as electricity bill calculation and energy-saving assessment to achieve effective control of power consumption;

[0046] Working principle of the integrated heat dissipation device: the heat exchange box 9 is fixed on the top of the equipment shell 5, and a heat exchange plate 12 extending downward is installed at the bottom thereof; the heat exchange plate 12 is a thin-walled heat absorbing plate and is plugged into the rear side of the inner cavity of the equipment shell 5; the heat in the equipment shell 5 is transferred to the heat exchange plate 12; a temperature sensor is installed in the equipment shell 5, and when the temperature rise is detected, the heat dissipation device is triggered to start working;

[0047] The heat sinks 8 on both sides are filled with coolant (the coolant is any one of deionized water and oil-based coolant). When the temperature reaches a certain level, the left micro-circulation pump 15 in the heat exchange box 9 is started. A connecting pipe is installed at the bottom of the micro-circulation pump 15. The connecting pipe extends to the bottom of the inner cavity of the heat exchange box 8 to pump the coolant in the left heat exchange box 8 into the guide cavity 13 in the heat exchange plate 12. The heat exchange between the heat exchange plate 12 and the equipment shell 5 is used to achieve cooling.

[0048] The coolant in the right heat sink 8 is pumped into the left heat sink 8 in advance. When the temperature in the heat exchange plate 12 rises to a certain threshold, the micro-circulation pump 15 on the right side of the heat exchange box 9 is started to pump the heated coolant into the right heat sink 8. The heat dissipation contact surface is expanded through the heat sink 10 to achieve rapid cooling. The left heat sink 8 continues to pump the coolant into the heat exchange box 9 to perform heat exchange again to achieve a reciprocating heat exchange cycle. Moreover, the integrated heat dissipation device of this scheme is a closed heat dissipation device, and there is no need to consider the influence of foreign matter such as dust on the heat dissipation device. At the same time, it can prevent dust from entering through the heat dissipation structure to interfere with internal components, thereby extending the service life of the components.

[0049] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description. Therefore, it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0050] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electric energy monitoring device based on an algorithm chip, comprising a housing (1), a device housing (5) and an integrated heat dissipation device, characterized in that: The watch case (1) is mounted on the front side of the device case (5), the device case (5) and the watch case (1) are spliced ​​together, and a terminal (2) is arranged at the bottom of the watch case (1); fixing plates (7) are symmetrically arranged on both sides of the device case (5), and screw holes are opened on the fixing plates (7), and bolts are installed in the screw holes; a power converter, a microcontroller, a current sensor, a voltage sensor, an analog-to-digital converter, a communication module and a storage chip are arranged in the device case (5); The device shell (5) is also provided with an integrated heat dissipation device, the integrated heat dissipation device comprising two left and right heat dissipation boxes (8) and a heat exchange box (9), the heat exchange box (9) being fixed on the top of the device shell (5), the two heat dissipation boxes (8) being respectively fixed on the left and right sides of the device shell (5), the bottom of the heat exchange box (9) being provided with a heat exchange plate (12) extending downward, the heat exchange plate (12) being a thin-walled heat absorbing plate, and the heat exchange plate (12) being plugged into the rear side of the inner cavity of the device shell (5); Adapters (11) are installed between the two ends of the heat exchange box (9) and the two heat dissipation boxes (8), and adapters (11) are also installed at the bottoms of the two heat dissipation boxes (8). Connecting pipes are installed between the adapters (11), and the heat exchange box (9) and the heat dissipation box (8) form a circulation through the connecting pipes.

2. The electric energy monitoring device based on the algorithm chip according to claim 1 is characterized in that: The device shell (5) and the watch case (1) are symmetrically provided with a splicing fixing part (6) at the top and bottom, and a bolt is installed in the splicing fixing part (6) for locking; a locking nut (3) is installed at the bottom of the terminal (2); and a display screen (4) is embedded in the front side of the watch case (1).

3. The electric energy monitoring device based on the algorithm chip according to claim 1 is characterized in that: Micro-circulation pumps (15) are installed at both ends of the inner cavity of the heat exchange box (9), and a micro-circulation pump (15) is also installed at the bottom of the inner cavity of one of the heat dissipation boxes (8). The micro-circulation pump (15) is connected to the adapter (11).

4. The electric energy monitoring device based on the algorithm chip according to claim 3 is characterized in that: A flow guide cavity (13) is provided in the inner cavity of the heat exchange plate (12), and the flow guide cavity (13) is composed of a plurality of small cavities in sequence from top to bottom, and the upper and lower adjacent small cavities are connected end to end, and the two ends of the flow guide cavity (13) are respectively connected to two micro circulation pumps (15) in the heat exchange box (9) through connecting pipes.

5. The electric energy monitoring device based on the algorithm chip according to claim 1 is characterized in that: A corrugated flow guide cavity (14) is provided in the inner cavity of the heat dissipation box (8), a heat dissipation plate (10) is provided on the outer side of the heat dissipation box (8), and a wave-shaped groove is provided on the surface of the heat dissipation plate (10).

6. The electric energy monitoring device based on the algorithm chip according to claim 1 is characterized in that: The inner walls of the heat exchange box (9) and the heat dissipation box (8) are both installed with liquid level sensors; and the inner wall of the equipment shell (5) is installed with a temperature sensor.

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