Composite test system for differential crystal oscillator chip and wafer

Abstract

The invention discloses a composite test system for a differential crystal oscillator chip and a wafer. The composite test system comprises a test board, a signal tester, a chip test device and a wafer test device, a differential crystal oscillator is fixed on the testboard by adopting a fixing seat, and when the differential crystal oscillator is fixed, a chip test pin is exposed upwards, and a wafer test pin is exposed towards the side; a first driving device in the chip testing device is used for driving; the first test circuit board is used for pressing and contacting a chip test pin through a probe so as to carry out chip test; a second driving device in the wafer testing device is used for driving a second testing circuit board to move horizontally, and the second testing circuit board is used for performing wafer testing by making contact with the wafer testing pins through probe side insertion; the signal tester is used for analyzing signals. According to the invention, the chip and the wafer of the differential crystal oscillator can be tested at the same time, so that whether the chip is abnormal or the wafer is abnormal can be accurately judged, the problems of mistakenly tracing the abnormal reason of the differential crystal oscillator and causing the outflow of unqualified products are avoided, and the production energy efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of differential crystal oscillator testing, and in particular to a composite testing system for a differential crystal oscillator chip and a wafer. Background Art

[0002] The differential crystal oscillator is a high-end, miniaturized crystal oscillator with an integrated chip inside. It does not need to be matched with an external circuit and can output the corresponding frequency as long as it is powered. The main output frequency signal of the differential crystal oscillator has the characteristics of high frequency, low voltage difference and strong anti-interference ability. The differential crystal oscillator is mainly composed of a wafer and a chip. The wafer uses its piezoelectric effect to assist the internal oscillation loop of the chip to generate the required main frequency signal. Different wafers correspond to different frequencies. The chip contains an oscillation loop, a shaping circuit, a frequency modulation circuit, etc., which generates a differential frequency signal, and performs operations such as amplification, shaping, frequency multiplication and frequency division on the differential frequency signal.

[0003] Differential crystal oscillators are very complex in actual production, and various problems may occur during the production process, resulting in poor performance of differential crystal oscillators. For example, if materials are mixed due to human operation during the production process, resulting in incorrect chip and wafer mounting, the output signal will have a serious frequency deviation or even fail to oscillate: First, the correct chip is equipped with a wafer of the wrong frequency, resulting in the main frequency of the oscillation loop being incorrect, and in severe cases, it may not be able to oscillate to generate a frequency signal. Even if it can oscillate, its output frequency signal does not meet the requirements. Second, the wrong chip is equipped with a wafer of the correct frequency, and there is a frequency output signal, but the chip's shaping and frequency multiplication functions do not correspond, and the output frequency signal does not meet the requirements. The miniaturization, high performance, and unique way of outputting differential signals of differential crystal oscillators lead to strict requirements for the test system required in the final stage of production.

[0004] However, the existing differential crystal oscillator testing device only tests the chip output end, ignoring the chip and wafer mounting error problem. After obtaining the measurement results, it is impossible to know what caused the product output signal to fail to meet the requirements, and thus it is impossible to trace the source of the error and correct the error in time, thereby reducing the production efficiency of the differential crystal oscillator and causing waste of resources. Summary of the invention

[0005] In order to solve at least one of the above-mentioned technical problems, the present invention provides a composite test system for a differential crystal oscillator chip and a wafer.

[0006] The present invention provides a composite test system for a differential crystal oscillator chip and a wafer, the system comprising: Test benches, signal testers, chip testers and wafer testers; The table top of the test bench is a turntable structure, and a plurality of differential crystal oscillator fixing seats are evenly arranged on the table top at preset intervals, and the differential crystal oscillator fixing seats are used to fix the differential crystal oscillator to be tested, so that when the differential crystal oscillator is fixed, the chip test pins are exposed upward and the wafer test pins are exposed sideways; The chip testing device comprises a first driving device and a first testing circuit board, wherein the first driving device is used to drive the first testing circuit board to move up and down; the first testing circuit board is provided with a downward-pressing probe contact device, which is used to contact the chip testing pins by downward-pressing the probes to perform chip testing; The wafer testing device comprises a second driving device and a second testing circuit board, wherein the second driving device is used to drive the second testing circuit board to move horizontally, and the second testing circuit board is provided with a side-insertion probe contact device, which is used to contact the wafer testing pins through side-insertion of the probe to perform wafer testing; The signal tester is connected to the chip output end through a first clamp, and performs waveform and frequency analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal; the signal tester is also connected to the chip output end through a second clamp, and performs frequency point analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal.

[0007] In one embodiment, the first driving device includes a servo motor and an upper and lower pressing linkage device; The upper and lower pressing linkage device comprises a connecting mechanism, a supporting mechanism and a sliding mechanism; The servo motor is transmission-connected to the connecting mechanism; One end of the support mechanism is fixedly connected to the connecting mechanism, and the other end is slidably connected to the sliding mechanism; The sliding mechanism is detachably connected to the first testing circuit board.

[0008] In one embodiment, the support mechanism includes a first support member and a second support member; The first support member is a support plate structure, and the second support member is a columnar structure; The side end of the first support member is fixedly connected to the connection mechanism, and the lower end of the first support member is detachably connected to at least one of the second support members.

[0009] In one embodiment, the sliding mechanism is an L-shaped structure, and the L-shaped structure includes a long arm and a short arm; The long arm is slidably connected to the second supporting member, and the short arm is detachably connected to the first testing circuit board for supporting the first testing circuit board.

[0010] In one embodiment, the second driving device includes an adjustable cylinder, a fine-tuning slider and a fine-tuning slider fixing seat; The fine-tuning slider fixing seat is used to fix the fine-tuning slider. The adjustable cylinder is arranged above the fine-tuning slider. The piston rod of the adjustable cylinder is detachably connected to the second test circuit board.

[0011] In one embodiment, the first test circuit board further includes: Power supply end, power supply filter circuit, matching resistor, dual-channel buffer, differential signal synthesizer, frequency output interface and waveform output interface; The output end of the power supply end is connected to the input end of the power supply filter circuit, the two ends of the matching resistor are respectively connected to the output end of the power supply filter circuit and the input end of the dual-channel buffer, the output end of the dual-channel buffer is connected to the input end of the differential signal synthesizer, and the output end of the differential signal synthesizer is respectively connected to the frequency output interface and the waveform output interface.

[0012] In one embodiment, the second test circuit board further includes: π-type filter circuit and waveform output interface; The π-type filter circuit transmits the filtered signal to the signal tester through the waveform output interface.

[0013] In one embodiment, there are six chip test pins, and the first test circuit board is provided with six push-down probes, which contact the six chip test pins respectively.

[0014] In one embodiment, there are two wafer test pins, and the second test circuit board is provided with two side-insertion probes, which contact the two wafer test pins respectively.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides a composite test system for differential crystal oscillator chips and wafers, comprising a test bench, a signal tester, a chip test device and a wafer test device; the table top of the test bench is a turntable structure, and a plurality of differential crystal oscillator fixing seats are evenly arranged on the table top at preset intervals, and the differential crystal oscillator fixing seats are used to fix the differential crystal oscillator to be tested, so that when the differential crystal oscillator is fixed, the chip test pins are exposed upward and the wafer test pins are exposed laterally; the chip test device comprises a first driving device and a first test circuit board, and the first driving device is used to drive the first test circuit board to move up and down; the first test circuit board is provided with a downward pressure probe contact device, which is used to contact the first test circuit board through the probe The needle is pressed down to contact the chip test pin to perform chip testing; the chip testing device includes a second driving device and a second test circuit board, the second driving device is used to drive the second test circuit board to move horizontally, and the second test circuit board is provided with a side-insertion probe contact device, which is used to contact the chip test pin by side insertion of the probe to perform chip testing; the signal tester is connected to the chip output end through the first clamp, and performs waveform and frequency analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal; the signal tester is also connected to the chip output end through the second clamp, and performs frequency point analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal.

[0016] The present invention takes into account the problem of chip and wafer loading errors in the differential crystal oscillator production process, and uses two parts of the test circuit in the system to simultaneously test the chip and wafer of the differential crystal oscillator. The test system tests whether the chip performance meets the requirements and whether the chip frequency meets the requirements. Compared with the existing differential crystal oscillator test device that only tests the chip output end, does not take into account the problem of chip and wafer loading errors, and cannot know what causes the product output signal to not meet the requirements, thereby being unable to trace the source of the error and causing production waste, the composite test system provided by the present invention can timely and accurately trace the source of the error, thereby correcting the error. Ensure that the materials used in the production process are correct, avoid causing production waste and the problem of unqualified products flowing out. In addition, the two test parts in the composite test system are simple in structure, the test function is highly compatible, the design is reasonable and the reliability is strong, and production efficiency can be improved and costs can be saved.

[0017] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below.

[0019] The drawings herein are incorporated into the specification and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and are used to illustrate the technical solutions of the present disclosure together with the specification.

[0020] Figure 1 A schematic diagram of the structure of a composite test system for a differential crystal oscillator chip and a wafer provided by an embodiment of the present invention; Figure 2 for Figure 1 A schematic diagram of the principle of contact between the downward pressure probe of the peripheral device in the first test circuit board and the side insertion probe of the peripheral device in the second test circuit board and the differential crystal oscillator; Figure 3 for Figure 1 A schematic diagram of the enlarged structure of the first driving device; Figure 4 for Figure 3 A schematic diagram of the enlarged structure of the middle support mechanism; Figure 5 for Figure 1 Schematic diagram of the enlarged composition structure of the second driving device. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indications, such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0023] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0024] The existing differential crystal oscillator test device only tests the chip output end. The problem of chip and wafer mounting errors is not taken into account, and it is impossible to know what causes the product output signal to fail to meet the requirements, so it is impossible to trace the source of the error and correct the error in time, further causing production waste. In view of the shortcomings of the prior art, the present invention aims to provide a new composite test system for differential crystal oscillator testing. Taking into account the problem of chip and wafer mounting errors in the differential crystal oscillator production process, the two-part test circuit in the system is used to simultaneously test the chip and wafer of the differential crystal oscillator. The test system not only tests whether the chip performance meets the requirements, but also tests whether the chip frequency meets the requirements. The source of the error can be traced back in time and the error can be corrected. Ensure that the materials used in the production process are correct to avoid production waste and the outflow of unqualified products.

[0025] See also Figure 1 , Figure 1 The present invention provides a schematic diagram of a composite test system for a differential crystal oscillator chip and a wafer. Figure 1 As shown, a composite test system for a differential crystal oscillator chip and a wafer includes: Test bench 1, signal tester, chip tester and wafer tester; The table top of the test table 1 is a turntable structure, and a plurality of differential crystal oscillator fixing seats 2 are evenly arranged on the table top at preset intervals. The differential crystal oscillator fixing seats 2 are used to fix the differential crystal oscillator to be tested, so that when the differential crystal oscillator is fixed, the chip test pins are exposed upward and the wafer test pins are exposed to the side; The chip testing device comprises a first driving device 3 and a first testing circuit board 4. The first driving device 3 is used to drive the first testing circuit board 4 to move up and down. The first testing circuit board 4 is provided with a downward-pressing probe contact device 40, which is used to contact the chip testing pins by downward-pressing the probe to perform chip testing. The wafer testing device comprises a second driving device 5 and a second testing circuit board 6, wherein the second driving device 5 is used to drive the second testing circuit board 6 to move horizontally, and the second testing circuit board 6 is provided with a side-insertion probe contact device 60, which is used to contact the wafer testing pins through the side-insertion of the probe to perform wafer testing; The signal tester is connected to the chip output end through the first clamp, and performs waveform and frequency analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal; the signal tester is also connected to the chip output end through the second clamp, and performs frequency point analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal.

[0026] In this embodiment, the tabletop of the test bench 1 is designed as a rotatable turntable, which is driven by a motor and can be accurately positioned at a preset angle. Usually, a number of differential crystal oscillator holders 2 are evenly distributed on the turntable at preset intervals, and these holders are precisely processed to ensure their position accuracy on the turntable. Figure 1 As shown, sixteen fixing seats are evenly distributed on the table. After completing the test of one differential crystal oscillator, the next differential crystal oscillator can be tested by rotating the table. A fixed loading structure and unloading structure are set next to the table. The loading structure is used to fix the differential crystal oscillator to be tested into the differential crystal oscillator fixing seat 2, and the unloading structure is used to unload the differential crystal oscillator that has been tested.

[0027] Each holder is equipped with a specially designed fixture or slot to firmly fix the differential crystal to be tested and ensure that it will not move during the test. The design of the holder allows the differential crystal to expose the chip test pins upward and the wafer test pins to the side when it is fixed, which is convenient for subsequent test operations.

[0028] See also Figure 2 , Figure 2 A schematic diagram of the principle of contact between the downward pressure probe of the peripheral device in the first test circuit board 4 and the side insertion probe of the peripheral device in the second test circuit board 6 and the differential crystal oscillator is provided. Figure 2 As shown, there are six chip test pins, and the first test circuit board 4 is provided with six downward-pressing probes, which contact the six chip test pins respectively. There are two wafer test pins, and the second test circuit board 6 is provided with two side-insertion probes, which contact the two wafer test pins respectively.

[0029] In this embodiment, the downward pressure probe is used because in most cases, the pins of the chip are distributed at the top, which is suitable for using vertical pressure to achieve good electrical contact. This method is simple and direct, and can ensure that each pin can receive uniform pressure, thereby ensuring the consistency and accuracy of the test results. For chips with only two test pins, especially when these pins are located at the edge of the chip, it is more appropriate to use a side-insertion probe. This method can avoid damaging other parts of the chip and can better adapt to the miniaturization trend of the chip. The designs of the downward pressure and side-insertion probes are both to ensure that the probes can accurately contact the corresponding test pins, reduce the possibility of false touch, and improve the accuracy of the test. Both probes are designed with appropriate mechanical structures to ensure sufficient contact force without causing damage to the test object.

[0030] Further, the chip testing device includes a first driving device 3 and a first test circuit board 4. The first driving device 3 includes a servo motor 30 and an upper and lower pressing linkage device 31, and the upper and lower pressing linkage device 31 includes a connecting mechanism 310, a supporting mechanism 320 (composed of a supporting plate and a columnar structure) and a sliding mechanism 330 (L-shaped structure). The servo motor 30 provides precise vertical motion control to ensure that the probe accurately contacts the chip test pin. The first test circuit board 4 is equipped with a downward-pressing probe contact device 40, which is installed at the bottom of the circuit board. When the first driving device 3 moves downward, the probe will contact the chip test pin. The design of the probe takes into account durability and electrical contact quality to ensure that good performance can be maintained after multiple tests.

[0031] The wafer testing device includes a second driving device 5 and a second test circuit board 6. The second driving device 5 is similar to the first driving device 3, but is used to drive the movement in the horizontal direction. It also uses a servo motor 30 to achieve precise horizontal displacement control to ensure that the probe can be accurately inserted into the wafer test pin. The second test circuit board 6 is provided with a side-insertion probe contact device 60, which extends from the side and docks with the wafer test pin. In order to adapt to wafer test pins of different sizes, the probe may have a certain degree of resiliency or flexibility while ensuring a good electrical connection.

[0032] In order to save costs, the same signal tester is usually used for the two signal analyses, and different first and second fixtures are used to connect the chip output and wafer output, respectively, such as spring clips or push-in connectors. The fixture material is a metal that is well conductive and corrosion-resistant, such as gold-plated copper alloy. Usually, the signal tester has built-in advanced waveform capture and spectrum analysis functions, which can monitor and record the signal characteristics from the differential crystal oscillator in real time. By comparing the standard parameters, it can be quickly determined whether there is an abnormality in the chip part. For the wafer part, the signal tester can determine whether its operating frequency is stable and accurate through frequency point analysis, thereby evaluating the quality of the wafer.

[0033] In summary, this embodiment takes into account the problem of chip and wafer loading errors in the differential crystal oscillator production process, and uses two parts of the test circuit in the system to simultaneously test the chip and wafer of the differential crystal oscillator. The test system not only tests whether the chip performance meets the requirements, but also tests whether the chip frequency meets the requirements. Compared with the existing differential crystal oscillator test device that only tests the chip output end, does not take into account the problem of chip and wafer loading errors, and cannot know what causes the product output signal to not meet the requirements, so that it is impossible to trace the source of the error and cause production waste. The composite test system provided by the present invention can timely and accurately trace the source of the error, thereby correcting the error. Ensure that the materials used in the production process are correct, avoid causing production waste and the problem of unqualified products flowing out. In summary, the two test parts in the composite test system provided by the present invention are simple in structure, have strong compatibility of test functions, are reasonably designed and have strong reliability, and can improve production efficiency and save costs.

[0034] See also Figure 3 , Figure 3 A schematic diagram of the enlarged structure of the first drive device 3 is provided. Figure 3 As shown, in one embodiment, the first driving device 3 includes a servo motor 30 and an upper and lower pressing linkage device 31; The upper and lower pressing linkage device 31 includes a connecting mechanism 310, a supporting mechanism 320 and a sliding mechanism 330; The servo motor 30 is transmission-connected to the connecting mechanism 310; One end of the support mechanism 320 is fixedly connected to the connection mechanism 310, and the other end is slidably connected to the sliding mechanism 330; The sliding mechanism 330 is detachably connected to the first testing circuit board 4 .

[0035] In this embodiment, the servo motor 30 is fixed on the structural frame of the test bench 1, and the position needs to ensure smooth transmission connection with the connecting mechanism 310 without interference. The rotational motion of the servo motor 30 is converted into linear motion through a coupling or other appropriate mechanical connectors (such as synchronous belts, gears, etc.), and transmitted to the connecting mechanism 310 of the upper and lower pressure linkage device 31. One end of the connecting mechanism 310 is connected to the transmission component of the servo motor 30 through a precision guide rail or a bearing system, and the other end is fixed to the support mechanism 320 to ensure a stable mechanical connection between the two. In addition to transmitting motion, the connecting mechanism 310 also plays a guiding role to ensure the linear motion of the sliding mechanism 330 in the vertical direction.

[0036] When not in operation, the servo motor 30 is in a standby state, and the sliding mechanism 330 is in the initial position, ready to receive instructions. When the control system issues a command, the servo motor 30 rotates according to the preset parameters, and drives the connecting mechanism 310 to move downward through the transmission connection. As the connecting mechanism 310 moves, the supporting mechanism 320 guides the sliding mechanism 330 to descend synchronously until the probe on the first test circuit board 4 contacts the chip test pin of the differential crystal oscillator. The servo motor 30 stops rotating and maintains pressure for a certain period of time to ensure that the probe has good contact with the test pin. During this period, the signal tester obtains and analyzes the test signal from the chip output end through the first fixture. After the test is completed, the servo motor 30 reverses to return the entire linkage device to the initial position and prepare for the next test cycle.

[0037] Therefore, this embodiment can provide high-precision position control by using the servo motor 30 to ensure the consistency of each test condition. At the same time, the servo motor 30 has a fast response time and can quickly adjust the position or force, making the test process more efficient. The detachable connection between the sliding mechanism 330 and the first test circuit board 4 provides system flexibility. Different types of test circuit boards can be easily replaced as needed to adapt to different test requirements or product changes.

[0038] See also Figure 4 , Figure 4 for Figure 3 The enlarged structural diagram of the middle support mechanism 320 is shown. Figure 4 As shown, in one embodiment, the support mechanism 320 includes a first support member 3201 and a second support member 3202; The first support member 3201 is a support plate structure, and the second support member 3202 is a columnar structure; The side end of the first support member 3201 is fixedly connected to the connection mechanism 310 , and the lower end of the first support member 3201 is detachably connected to at least one second support member 3202 .

[0039] The support mechanism 320 is composed of a first support member 3201 (support plate structure) and a second support member 3202 (columnar structure). Figure 1 As shown, the first support member 3201 is a "fan-shaped" disguised plate-like structure, and two circular through holes are symmetrically arranged on the plate surface. Under the premise of ensuring the structural strength, the through hole setting can reduce the weight of the support plate by reducing the use of materials, thereby reducing the workload of the servo motor 30 and improving the response speed and energy efficiency. In addition, the through holes can increase air circulation and help heat dissipation, especially when there are heating components near the support plate, such as the servo motor 30 or electronic components. Good ventilation helps to extend the service life of the equipment. The support plate structure is used to provide a large area of ​​support and ensure a fixed connection with the connecting mechanism 310; the columnar structure is responsible for carrying the sliding mechanism 330 and allowing it to slide in the vertical direction. One side of the support plate structure is firmly combined with the connecting mechanism 310 by bolts, welding or other fixing means; the other side is connected to multiple columnar structures in a detachable manner, such as using a quick release clamp or latch.

[0040] In this embodiment, the detachable connection between the first support member 3201 and the second support member 3202 allows the system to adopt a modular design. This allows the device to be quickly adjusted and configured according to different application scenarios or requirements, improving the adaptability and flexibility of the system. Since the supports are detachably connected, when a component is damaged or needs to be upgraded, the component can be replaced or repaired separately without replacing the entire support mechanism 320, reducing maintenance costs and time. By changing the number or length of the second support members 3202, the height of the upper and lower pressure linkage device 31 can be adjusted to accommodate test circuit boards or other test objects of different thicknesses, increasing the versatility of the system. The first support member 3201 provides a larger contact area, which helps to improve the stability and load-bearing capacity of the overall structure, and can also better distribute the forces from the servo motor 30 and the connecting mechanism 310.

[0041] In one embodiment, the sliding mechanism 330 is an L-shaped structure, and the L-shaped structure includes a long arm and a short arm; The long arm is slidably connected to the second support member 3202 , and the short arm is detachably connected to the first test circuit board 4 , so as to support the first test circuit board 4 .

[0042] The sliding mechanism 330 is designed with an L-shaped structure, and the long arm part forms a sliding fit with the columnar structure. It can be a linear guide, a ball screw or other forms of low-friction sliding pairs to ensure smooth and accurate up and down movement. The end of the short arm is provided with an interface that matches the first test circuit board 4, which may be a card slot, a screw hole or other forms of quick-change interface to facilitate the installation and removal of the circuit board. The sliding mechanism 330 and the first test circuit board 4 are detachably connected to facilitate the replacement of different types of test circuit boards or maintenance.

[0043] In this embodiment, the sliding connection between the long arm and the second support member 3202 ensures the stability of the sliding mechanism 330 in the vertical direction, while allowing it to move up and down along a predetermined path, which helps to maintain the position accuracy of the first test circuit board 4, especially when applying pressure or performing test operations. Since the long arm can slide relative to the second support member 3202, this enables the system to adapt to test requirements at different heights. By adjusting the position of the long arm, the height of the first test circuit board 4 can be easily changed to match different test conditions or sample sizes. The detachable connection between the short arm and the first test circuit board 4 simplifies the installation and replacement process of the test circuit board. This design allows the user to quickly replace different test circuit boards, improves work efficiency, and reduces downtime. The L-shaped structure can help optimize the force transmission path from the servo motor 30 to the test circuit board, reduce unnecessary torque or lateral force, and improve the response speed and control accuracy of the system.

[0044] See also Figure 5 , Figure 5 A schematic diagram of the enlarged structure of the second driving device 5 is provided. Figure 5 As shown, in one embodiment, the second driving device 5 includes an adjustable cylinder 52 , a fine-tuning slider 51 and a fine-tuning slider fixing seat 50 .

[0045] The fine-tuning slider fixing seat 50 is used to fix the fine-tuning slider 51 . An adjustable cylinder 52 is provided above the fine-tuning slider 51 . The piston rod of the adjustable cylinder 52 is detachably connected to the second test circuit board 6 .

[0046] In this embodiment, the adjustable cylinder 52 allows the telescopic movement of the piston rod to be achieved by adjusting the air pressure, thereby accurately positioning the second test circuit board 6 connected thereto. This pneumatic control system can provide very fine position control capabilities. The design of the fine-tuning slider 51 and its fixing seat allows the position to be further finely adjusted manually or mechanically even after the rough positioning provided by the cylinder, ensuring that the second test circuit board 6 can be placed in the most ideal position. Since the piston rod and the second test circuit board 6 are detachably connected, this not only facilitates the installation and removal of the test circuit board, but also allows different circuit boards or other components to be quickly replaced according to different test requirements, increasing the flexibility and adaptability of the system. The design of the fine-tuning slider fixing seat 50 ensures the stability of the fine-tuning slider 51 during operation, prevents position displacement due to external force or vibration, and improves the reliability and accuracy of the entire system.

[0047] In one embodiment, the first test circuit board 4 further includes: Power supply end, power supply filter circuit, matching resistor, dual-channel buffer, differential signal synthesizer, frequency output interface and waveform output interface; The output end of the power supply end is connected to the input end of the power supply filter circuit, the two ends of the matching resistor are respectively connected to the output end of the power supply filter circuit and the input end of the dual-channel buffer, the output end of the dual-channel buffer is connected to the input end of the differential signal synthesizer, and the output end of the differential signal synthesizer is respectively connected to the frequency output interface and the waveform output interface.

[0048] In this embodiment, the power supply provides the necessary power support for the entire circuit board. The power supply filter circuit is used to filter out noise and other interference components in the power supply to ensure that the subsequent circuit receives clean and stable DC power, which is crucial to improving signal quality and system stability. The matching resistor is mainly used to achieve impedance matching to reduce reflections and maximize power transmission efficiency. It is connected between the power supply filter circuit and the dual-channel buffer to ensure the integrity of the signal when it is transmitted from one part to another.

[0049] The dual-channel buffer can receive signals from two different sources and isolate or amplify them before outputting them to the differential signal synthesizer. This helps protect sensitive front-end circuits from load and can enhance signal strength. The differential signal synthesizer receives the signal from the dual-channel buffer and converts it into a differential signal format. Differential signals have better noise immunity and higher signal-to-noise ratio, and are particularly suitable for applications in long-distance transmission or complex electromagnetic environments.

[0050] The frequency output interface and waveform output interface are used to output the processed frequency information and waveform data respectively. Through these two interfaces, users can obtain accurate frequency measurement results and clear waveform images for further analysis and diagnosis. Signal processing through this circuit board can provide stable and high-quality signal processing capabilities and is suitable for various test and measurement applications.

[0051] In one embodiment, the second test circuit board 6 further includes: π-type filter circuit and waveform output interface; The π-type filter circuit transmits the filtered signal to the signal tester through the waveform output interface.

[0052] In this embodiment, the π-type filter circuit can effectively remove noise and harmonic components from the input signal, ensuring that the signal transmitted to the signal tester is purer and smoother. This is crucial to improving the accuracy of the test results. Through carefully designed π-type filter parameters, such as inductance and capacitance values, signals within a specific frequency range can be selectively allowed to pass while blocking unwanted frequency components. This helps to focus on the signal features of interest and reduce interference. In addition, the filtered signal can prevent high-frequency noise or spike voltage from damaging sensitive test equipment, extend its service life and ensure long-term stable operation, while helping the signal tester to more accurately capture and analyze signal characteristics, thereby providing more accurate measurement data.

[0053] In one embodiment, based on the composite test system provided in the above embodiment, a corresponding test method is also provided, which specifically includes the following steps: 1) Loading: Place the differential crystal oscillator to be tested in the fixed seat on the turntable, making sure it is correctly positioned.

[0054] 2) Initialization: Start the system, rotate the turntable to the position of the first differential crystal oscillator, and prepare to start the test.

[0055] 3) Chip test: The first driving device 3 is actuated to lower the first test circuit board 4, and the probe contacts the chip test pin. The signal tester acquires and analyzes the chip signal through the first fixture.

[0056] 4) Wafer test: Subsequently, the second driving device 5 is activated to move the second test circuit board 6 horizontally, and the side-insertion probe contacts the wafer test pin, and the signal tester obtains and analyzes the wafer signal through the second fixture.

[0057] 5) Result judgment: According to the analysis results of the signal tester, it is automatically determined whether the chip and wafer parts of the differential crystal oscillator are normal.

[0058] 6) Unloading: After the test is completed, the turntable continues to rotate, and the next differential crystal oscillator to be tested is moved to the test position, and the above steps are repeated.

[0059] In summary, the composite test system and method provided by the present invention, taking into account the problem of chip and wafer loading errors in the differential crystal oscillator production process, uses two parts of the test circuit in the system to simultaneously test the chip and wafer of the differential crystal oscillator. The test system not only tests whether the chip performance meets the requirements, but also tests whether the chip frequency meets the requirements. Compared with the existing differential crystal oscillator test device, which only tests the chip output end, does not take into account the problem of chip and wafer loading errors, and cannot know what causes the product output signal to not meet the requirements, so that it is impossible to trace the source of the error and cause production waste. The composite test system provided by the present invention can timely and accurately trace the source of the error, thereby correcting the error. Ensure that the materials used in the production process are correct, avoid causing production waste and the problem of unqualified products flowing out. In addition, the two test parts in the composite test system are simple in structure, the test function is highly compatible, the design is reasonable and the reliability is strong, and production efficiency can be improved and costs can be saved.

[0060] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

[0061] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A composite test system for differential crystal oscillator chips and wafers, characterized in that: The system comprises: Test benches, signal testers, chip testers and wafer testers; The table top of the test bench is a turntable structure, and a plurality of differential crystal oscillator fixing seats are evenly arranged on the table top at preset intervals, and the differential crystal oscillator fixing seats are used to fix the differential crystal oscillator to be tested, so that when the differential crystal oscillator is fixed, the chip test pins are exposed upward and the wafer test pins are exposed sideways; The chip testing device comprises a first driving device and a first testing circuit board, wherein the first driving device is used to drive the first testing circuit board to move up and down; the first testing circuit board is provided with a downward-pressing probe contact device, which is used to contact the chip testing pins by downward-pressing the probes to perform chip testing; The wafer testing device comprises a second driving device and a second testing circuit board, wherein the second driving device is used to drive the second testing circuit board to move horizontally, and the second testing circuit board is provided with a side-insertion probe contact device, which is used to contact the wafer testing pins through side-insertion of the probe to perform wafer testing; The signal tester is connected to the chip output end through a first clamp, and performs waveform and frequency analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal; the signal tester is also connected to the chip output end through a second clamp, and performs frequency point analysis on the chip test signal to determine whether the chip part of the differential crystal oscillator is abnormal.

2. The composite test system for differential crystal oscillator chip and wafer according to claim 1, characterized in that: The first driving device includes a servo motor and an upper and lower pressing linkage device; The upper and lower pressing linkage device comprises a connecting mechanism, a supporting mechanism and a sliding mechanism; The servo motor is transmission-connected to the connecting mechanism; One end of the support mechanism is fixedly connected to the connecting mechanism, and the other end is slidably connected to the sliding mechanism; The sliding mechanism is detachably connected to the first testing circuit board.

3. The composite test system for differential crystal oscillator chip and wafer according to claim 2, characterized in that: The support mechanism comprises a first support member and a second support member; The first support member is a support plate structure, and the second support member is a columnar structure; The side end of the first support member is fixedly connected to the connection mechanism, and the lower end of the first support member is detachably connected to at least one of the second support members.

4. The composite test system for differential crystal oscillator chip and wafer according to claim 2, characterized in that: The sliding mechanism is an L-shaped structure, and the L-shaped structure includes a long arm and a short arm; The long arm is slidably connected to the second supporting member, and the short arm is detachably connected to the first testing circuit board for supporting the first testing circuit board.

5. The composite test system for differential crystal oscillator chip and wafer according to claim 1, characterized in that: The second driving device includes an adjustable cylinder, a fine-tuning slider and a fine-tuning slider fixing seat; The fine-tuning slider fixing seat is used to fix the fine-tuning slider. The adjustable cylinder is arranged above the fine-tuning slider. The piston rod of the adjustable cylinder is detachably connected to the second test circuit board.

6. The composite test system for differential crystal oscillator chip and wafer according to claim 1, characterized in that: The first test circuit board also includes: Power supply end, power supply filter circuit, matching resistor, dual-channel buffer, differential signal synthesizer, frequency output interface and waveform output interface; The output end of the power supply end is connected to the input end of the power supply filter circuit, the two ends of the matching resistor are respectively connected to the output end of the power supply filter circuit and the input end of the dual-channel buffer, the output end of the dual-channel buffer is connected to the input end of the differential signal synthesizer, and the output end of the differential signal synthesizer is respectively connected to the frequency output interface and the waveform output interface.

7. The composite test system for differential crystal oscillator chip and wafer according to claim 1, characterized in that: The second test circuit board also includes: π-type filter circuit and waveform output interface; The π-type filter circuit transmits the filtered signal to the signal tester through the waveform output interface.

8. The composite test system for differential crystal oscillator chip and wafer according to claim 1, characterized in that: There are six chip test pins, and the first test circuit board is provided with six push-down probes, which contact the six chip test pins respectively.

9. The composite test system for differential crystal oscillator chip and wafer according to claim 1, characterized in that: There are two wafer test pins, and the second test circuit board is provided with two side-insertion probes, which contact the two wafer test pins respectively.

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