Intelligent enhanced computer cooling system

Abstract

The invention discloses an intelligent enhanced computer cooling system, and aims to solve the problems that a traditional cooling system is low in cooling efficiency, high in energy consumption and insufficient in intelligence when being applied to a high-performance computer and a server. The system comprises a multi-layer heat dissipation mechanism which is composed of a heat conduction layer made of a high-heat-conduction graphene composite material, a liquid cooling layer made of phase change cooling liquid and an air cooling layer provided with an intelligent fan control system, and heat of core components can be efficiently transferred and dissipated; the intelligent temperature control algorithm monitors the temperatures of the CPU, the GPU and the memory by means of a sensor network, and automatically switches three heat dissipation modes of energy saving, high efficiency and limit according to the load and the temperature; the adjustable heat dissipation module adopts a modular design, the fan and the liquid cooling system are detachable, and the mounting position is adjustable, so that a user can upgrade and maintain conveniently; the intelligent air flow control system optimizes the air flow direction and strength in the case according to temperature feedback by using a programmable airflow guider. The heat dissipation efficiency is remarkably improved, the energy consumption is reduced, the system stability and maintainability are improved, the heat dissipation requirement under the high-performance computing environment is effectively met, and good application and popularization value is achieved.

Description

1. Technical Field

[0001] The present invention relates to the technical field of computer hardware, and in particular to an intelligent enhanced heat dissipation system for high-performance computers and servers. 2. Background Technology

[0002] With the rapid development of computer technology, high-performance computers and servers are increasingly used in high-performance computing (HPC), graphics processing, and data centers. The performance of core components such as processors and graphics cards continues to improve, and their power consumption and heat generation are also increasing sharply. Existing heat dissipation systems mainly use air cooling, liquid cooling, or thermal conductive materials to dissipate heat. However, under extremely high-load operating conditions, these traditional heat dissipation methods still have many shortcomings. Air cooling is limited by the thermal conductivity of air and is less efficient when dealing with high heat; although the liquid cooling system has a relatively good heat dissipation effect, there is a risk of coolant leakage and high cost; simple thermal conductive materials are difficult to achieve rapid dissipation of large amounts of heat. In addition, traditional heat dissipation systems are generally not intelligent enough and cannot dynamically and accurately adjust the heat dissipation strategy according to the actual operating load of the computer and the temperature of each component, resulting in low heat dissipation efficiency and high energy consumption, which cannot meet the growing heat dissipation needs of high-performance computers. Therefore, there is an urgent need for a new type of intelligent heat dissipation system to effectively solve the heat dissipation problem in high-performance computing environments. III. Summary of the invention

[0003] The purpose of the present invention is to provide an intelligent enhanced computer heat dissipation system, which overcomes the defects of existing heat dissipation systems through innovative design and technical integration, and achieves efficient heat dissipation, low energy consumption and intelligent operation.

[0004] (1) Multi-layer heat dissipation mechanism

[0005] Thermal Conductive Layer: The thermal conductive layer is made of graphene composite material with high thermal conductivity, which fits tightly on the surface of the processor and GPU. Graphene has excellent thermal conductivity and can quickly transfer the heat generated by the core components to the liquid cooling layer, greatly shortening the heat transfer path and improving the heat transfer efficiency.

[0006] Liquid cooling layer: The liquid cooling layer uses phase change coolant, which will change phase within a specific temperature range. When the temperature rises, the coolant evaporates from liquid to gas, absorbing a lot of heat in this process. The gaseous coolant condenses through the heat sink and turns back into liquid, circulating back to the liquid cooling module, thereby continuously and effectively absorbing and dissipating heat.

[0007] Air cooling layer: An air cooling device is installed on the outside of the liquid cooling module, and the air cooling layer is equipped with an intelligent fan control system. The system monitors the temperature in real time through sensors, and automatically adjusts the fan speed according to the preset temperature and fan speed correspondence. At low load and low temperature, the fan speed is low to save energy; as the temperature rises or the load increases, the fan speed increases accordingly, accelerating the air flow, further enhancing the heat dissipation effect, and ensuring the efficient operation of the entire heat dissipation system.

[0008] (II) Intelligent temperature control algorithm

[0009] Through the sensor network distributed around key components such as the CPU, GPU and memory, the temperature of each component is accurately monitored in real time. Based on these temperature data, the intelligent temperature control algorithm divides the heat dissipation mode into the following three types:

[0010] Energy-saving mode: When the computer is in a low-load operating state, the intelligent temperature control algorithm gives priority to the air cooling system and controls the fan speed at a low level. In this mode, the heat dissipation demand can be met by relying solely on the air cooling layer, while minimizing energy consumption and extending the service life of components such as fans.

[0011] High-efficiency mode: Under medium load, the intelligent temperature control algorithm activates the liquid cooling layer and dynamically adjusts the fan speed according to the real-time temperature of each component. The intervention of the liquid cooling layer effectively improves the heat dissipation capacity, and the flexible adjustment of the fan speed further optimizes the heat dissipation effect, ensuring that the computer maintains a low temperature and reasonable energy consumption while running stably.

[0012] Extreme Mode: When the computer is facing high-load tasks or in a high-temperature environment, the thermal layer, liquid cooling layer, and air cooling layer work at full capacity at the same time. The intelligent temperature control algorithm not only increases the fan speed to the maximum, but also increases the flow rate of the coolant to achieve the strongest heat dissipation effect. This mode can ensure that the computer can still run stably under extreme conditions, avoiding performance degradation or hardware damage caused by overheating.

[0013] (III) Adjustable heat dissipation module

[0014] The heat dissipation system of the present invention adopts a modular design concept. The fan and the liquid cooling system are both connected in a detachable manner, such as by fixing with buckles and screws. Users can easily replace fans or liquid cooling components with different performances according to actual needs to meet different heat dissipation requirements. At the same time, the installation position of the heat dissipation module can be flexibly adjusted and can be adapted according to the layout changes of the internal hardware of the computer, ensuring that the best heat dissipation effect can be achieved under various hardware configurations, greatly improving the versatility and maintainability of the heat dissipation system.

[0015] (IV) Intelligent air flow control system

[0016] A specially designed intelligent air flow control system includes multiple programmable air flow guides. Through the internal temperature data of the chassis fed back by the temperature sensor, the intelligent air flow control system can automatically analyze and adjust the direction and intensity of the air flow in the chassis. Under high load conditions, the system will increase the air flow speed of the air inlet and outlet, so that the cold air can flow accurately and quickly through the CPU and GPU and other areas with high heat generation, optimize the overall heat dissipation effect, effectively avoid the occurrence of local overheating, and improve the uniformity and effectiveness of heat dissipation. IV. Description of the drawings

[0017] Attached Figure 1 Schematic diagram of the structure of the multi-layer heat dissipation mechanism.

[0018] Attached Figure 2 This is the working flow chart of the intelligent temperature control algorithm.

[0019] Attached Figure 3 Schematic diagram of an adjustable heat dissipation module.

[0020] Attached Figure 4 This is the schematic diagram of the intelligent air flow control system. V. Specific implementation methods

[0021] (I) Example 1: Implementation of multi-layer heat dissipation mechanism

[0022] On the computer motherboard, the thermal conductive layer made of high thermal conductivity graphene composite material is precisely attached to the surface of the CPU and GPU chips to ensure seamless contact and achieve efficient heat conduction. The phase change coolant container of the liquid cooling layer is tightly connected to the thermal conductive layer to form a complete heat transfer link. The fan of the air cooling layer is installed at a reasonable position outside the liquid cooling module. The intelligent fan control system is connected to the temperature sensor on the motherboard to control the fan speed in real time according to the preset temperature threshold and speed adjustment strategy.

[0023] (II) Example 2: Application of Intelligent Temperature Control Algorithm

[0024] When the computer starts, the sensor network starts working and continuously collects temperature data of the CPU, GPU and memory. When the computer is in low-load tasks such as text processing and web browsing, the intelligent temperature control algorithm determines it as energy-saving mode, only starts the air cooling layer and maintains the fan speed at a low level, such as 1000-1500 rpm. When running medium-load tasks such as video editing and games, the algorithm switches to high-efficiency mode, starts the liquid cooling layer, and adjusts the fan speed to 1500-2500 rpm according to temperature changes. When performing high-load tasks such as large-scale data calculations and 3D rendering, the extreme mode is activated, and the thermal conductive layer, liquid cooling layer and air cooling layer work together. The fan speed is increased to 2500-3500 rpm or even higher, and the coolant flow rate is also increased accordingly.

[0025] (III) Example 3: Use of adjustable heat dissipation module

[0026] When users find that the heat dissipation effect of the computer is not ideal after running for a long time under high load, they can easily open the chassis. By loosening the buckles and screws, remove the original fan or liquid cooling components and replace them with higher-performance heat dissipation components. For example, replace the ordinary fan with a fan with a higher speed and larger air volume, or replace the liquid cooling pipe with a model with higher thermal conductivity. At the same time, according to the changes in the hardware layout inside the chassis, such as the addition of hardware devices such as expansion cards, the installation position of the heat dissipation module can be adjusted, and the heat dissipation component can be moved to a more appropriate position to ensure effective heat dissipation of the newly added hardware.

[0027] (IV) Example 4: Optimization of Intelligent Air Flow Control System

[0028] Programmable airflow guides are installed at key locations inside the computer case, such as air inlets, air outlets, and near the CPU and GPU, and connected to temperature sensors and control systems. When the computer is operating normally, the intelligent air flow control system automatically adjusts the angle and ventilation volume of the airflow guide according to the temperature differences in each area. For example, when the CPU temperature is high and the GPU temperature is relatively low, the air inlet and outlet volume in the CPU area are increased to guide more cold air to flow through the CPU, while reducing the airflow intensity in the GPU area to achieve precise heat dissipation, improve overall heat dissipation efficiency and reduce energy consumption.

[0029] The intelligent enhanced computer cooling system of the present invention effectively solves the problems of low cooling efficiency, high energy consumption and insufficient intelligence of traditional cooling systems through the implementation of the above-mentioned innovative design and technical solutions, and significantly improves the cooling performance and stability of high-performance computers and servers in various operating scenarios. It has broad application prospects and important practical value.

Claims

1. An intelligent enhanced computer heat dissipation system, characterized in that: include: (1) A multi-layer heat dissipation mechanism, comprising: a heat conductive layer, made of a high thermal conductivity material and covering the processor and the GPU, for quickly transferring heat; The liquid cooling layer uses phase change coolant to absorb and dissipate heat through the phase change process of the liquid; the air cooling layer is arranged on the outside of the liquid cooling layer and includes an intelligent fan control system to adjust the fan speed for heat dissipation.

2. (2) Intelligent temperature control algorithm, which monitors the temperature of CPU, GPU and memory in real time through the sensor network, and dynamically adjusts the cooling mode according to the temperature of different components. The cooling mode includes: Energy-saving mode: in low-load conditions, the air cooling system is enabled first and the fan speed is reduced; In high-efficiency mode, the liquid cooling layer is started at medium load and the fan speed is adjusted according to the temperature. In extreme mode, the thermal conductive layer, liquid cooling layer and air cooling layer work simultaneously and the coolant flow rate is increased under high load and high temperature conditions.

3. (3) Adjustable heat dissipation module, whose fan and liquid cooling system adopt a detachable design and the installation position is adjustable, so that users can replace, upgrade or adjust the position of the heat dissipation components according to their needs to adapt to different hardware layouts and heat dissipation requirements.

4. (4) Intelligent air flow control system, including multiple programmable air flow guides, which automatically adjust the direction and intensity of air flow in the chassis based on temperature sensor feedback data to optimize the overall heat dissipation effect.

5. The intelligent enhanced computer heat dissipation system according to claim 1, wherein the high thermal conductivity material of the heat conductive layer is a graphene composite material.

6. The intelligent enhanced computer heat dissipation system according to claim 1, wherein the intelligent fan control system adjusts the fan speed according to a preset corresponding relationship between temperature and fan speed.

7. The intelligent enhanced computer heat dissipation system according to claim 1, wherein the adjustable heat dissipation module realizes detachable connection of each heat dissipation component through buckles and screws.

8. The intelligent enhanced computer cooling system according to claim 1, wherein the intelligent air flow control system increases the air flow speed of the air inlet and the air outlet under high load conditions, so that the cold air flows quickly through the CPU and GPU areas.

9. The intelligent enhanced computer heat dissipation system according to claim 1, wherein the phase change coolant in the liquid cooling layer evaporates and absorbs heat when the temperature rises and condenses through the heat sink and then circulates back to the liquid cooling module.

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