Screen module, processing method thereof and electronic equipment

Abstract

The invention relates to a screen module, a processing method of the screen module and electronic equipment, and the processing method of the screen module comprises the steps that a display panel mother board is provided, and the display panel mother board comprises a plurality of display panels; a mother film with an optical cement material is formed on the first surface of the display panel mother board, a laminated structure is obtained, and the mother film covers the display panels; the laminated structure is cut to obtain a sub-laminated structure, the sub-laminated structure comprises a display panel and an optical adhesive film covering the display panel, and the optical adhesive film is obtained by cutting a mother film; a transparent cover plate is attached to the optical adhesive film, and the screen module is obtained. Therefore, the control effect on the excessive glue can be effectively improved, so that the excessive glue control distance does not need to be reserved, the frame width of the screen module is reduced, and the screen-to-body ratio of the electronic equipment adopting the screen module is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic devices, and in particular to a screen module and a processing method thereof, and an electronic device. Background Art

[0002] With the continuous advancement of technology, users have an increasing demand for a higher screen-to-body ratio of electronic devices. However, due to the limitations of existing manufacturing processes, it is difficult to further reduce the width of the screen border of electronic devices, making it difficult to further increase the screen-to-body ratio of electronic devices. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a screen module and a processing method thereof, and an electronic device.

[0004] According to a first aspect of the present disclosure, a method for processing a screen module is provided, the method comprising: providing a display panel motherboard, the display panel motherboard comprising a plurality of display panels; forming a mother film having an optical adhesive material on a first surface of the display panel motherboard to obtain a stacked structure, the mother film covering each of the display panels; cutting the stacked structure to obtain a sub-stacked structure, the sub-stacked structure comprising the display panels and an optical adhesive film covering the display panels, the optical adhesive film being obtained by cutting the mother film; and laminating a transparent cover plate on the optical adhesive film to obtain the screen module.

[0005] In some embodiments of the present disclosure, an outer contour line of an orthographic projection of the master film on the first surface coincides with an outer contour line of the first surface.

[0006] In some embodiments of the present disclosure, cutting the stacked structure includes: using a cutting tool to cut the stacked structure from one side of the mother film.

[0007] In some embodiments of the present disclosure, before laminating a transparent cover plate on the optical adhesive film, the processing method of the screen module further includes: forming a light shielding layer on the second surface of the transparent cover plate, wherein the light shielding layer extends along an edge of the transparent cover plate.

[0008] In some embodiments of the present disclosure, laminating the transparent cover plate on the optical adhesive film includes: laminating the second surface of the transparent cover plate to the optical adhesive film, wherein the optical adhesive film covers a portion of the light-shielding layer, and an area of ​​the light-shielding layer close to the edge of the transparent cover plate is exposed outside the optical adhesive film.

[0009] According to a second aspect of the present disclosure, a screen module is provided, which includes a display panel and an optical adhesive film arranged on a third surface of the display panel, wherein an outer contour line of an orthographic projection of the optical adhesive film on the third surface coincides with an outer contour line of the third surface; the screen module also includes: a transparent cover plate, which is adhered to the optical adhesive film.

[0010] In some embodiments of the present disclosure, the screen module also includes: a light-shielding layer, wherein the light-shielding layer is disposed on the second surface of the transparent cover plate facing the optical adhesive film, the light-shielding layer extends along the edge of the transparent cover plate, the optical adhesive film covers a portion of the light-shielding layer, and an area of ​​the light-shielding layer close to the edge of the transparent cover plate is exposed outside the optical adhesive film.

[0011] In some embodiments of the present disclosure, the width of the light-shielding layer covered by the optical adhesive film is 0.4 to 0.6 mm.

[0012] In some embodiments of the present disclosure, the display panel includes a display area and a non-display area located outside the display area, the orthographic projection of the shading layer on the second surface is located outside the orthographic projection of the display area on the second surface, and there is a preset distance between the outer contour line of the orthographic projection of the display area on the second surface and the inner contour line of the orthographic projection of the shading layer on the second surface.

[0013] In some embodiments of the present disclosure, the preset distance is 0.15 mm to 0.25 mm.

[0014] According to a third aspect of the present disclosure, an electronic device is provided, comprising the screen module as described above.

[0015] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0016] The processing method of the screen module provided by the present disclosure is that the display panel motherboard includes multiple display panels, a mother film with an optical adhesive material is formed on the first surface of the display panel motherboard, and it is covered with each display panel to obtain a stacked structure, and then the stacked structure is cut to obtain a sub-stacked structure of the display panel covered with an optical adhesive film, and a transparent cover is attached to the optical adhesive film of the sub-stacked structure to obtain a screen module. In this way, the control effect of overflow glue can be effectively improved, so that there is no need to reserve a distance for overflow glue control, thereby reducing the border width of the screen module and improving the screen ratio of the electronic device using the screen module.

[0017] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0019] Figure 1 It is a structural schematic diagram of a screen module in the related art;

[0020] Figure 2 is a schematic flow chart of a method for processing a screen module according to an exemplary embodiment;

[0021] Figure 3 is a schematic structural diagram of a display panel motherboard according to an exemplary embodiment;

[0022] Figure 4 is a schematic structural diagram of a stacked structure according to an exemplary embodiment;

[0023] Figure 5 is a schematic structural diagram of a sub-stack structure according to an exemplary embodiment;

[0024] Figure 6 is a schematic flow chart of a method for processing a screen module according to another exemplary embodiment;

[0025] Figure 7 is a schematic cross-sectional view of a screen module according to an exemplary embodiment.

[0026] In the figure:

[0027] 1-screen module; 11-display panel; 111-display area; 112-non-display area; 113-third surface; 12-optical adhesive film; 13-transparent cover plate; 131-light shielding layer; 132-second surface; 133-extension part; 14-buffer layer; 141-adhesive layer; 2-display panel motherboard; 21-first surface; 3-mother film. DETAILED DESCRIPTION

[0028] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0029] With the continuous advancement of technology, users have an increasing demand for a higher screen-to-body ratio of electronic devices. However, due to the limitations of existing manufacturing processes, it is difficult to further reduce the width of the screen border of electronic devices, making it difficult to further increase the screen-to-body ratio of electronic devices.

[0030] For example, Figure 1 1 is a schematic diagram of the structure of the screen module 1 obtained by using the processing method in the related art. In the related art, the processing method of the screen module 1 in the related art is to cut the display panel motherboard to form the display panel 11, set the optical adhesive film 12 on the first surface of the display panel 11, and then set the transparent cover plate 13 with the light shielding layer 131 on the optical adhesive film 12. At this time, the frame width L mainly includes three parts. The first part is the distance between the outer contour line of the positive projection of the optical adhesive film 12 on the first surface and the outer contour line of the display panel 11 (for example, Figure 1 The second part is the overlap width between the optical adhesive film 12 and the light shielding layer 131 (eg, L3). Figure 1 The third part is the distance between the inner contour line of the orthographic projection of the light shielding layer 131 on the first surface and the outer contour line of the orthographic projection of the display area 111 of the display panel 11 on the first surface (e.g., L2). Figure 1 L1 shown in FIG. 1 ). It can be understood that the frame width refers to the distance between the edge of the display area 111 of the display panel 11 and the middle frame of the electronic device.

[0031] In the processing method of the related art, since there will be a certain bonding error when the optical adhesive film 12 is bonded to the display panel 11 alone, in order to avoid the optical adhesive film 12 from overflowing and thus affecting the subsequent assembly process, a glue overflow control distance needs to be reserved, that is, Figure 1 L3 is shown in the figure to prevent the optical adhesive film 12 from overflowing and causing the overflowing part to interfere with the middle frame when assembling the screen module 1. Due to this limitation, it is difficult to further reduce the border width of the screen module 1, thereby affecting the further increase of the screen ratio of the electronic device.

[0032] In order to solve the above technical problems, the present disclosure provides a method for processing a screen module, wherein a display panel motherboard includes a plurality of display panels, a mother film having an optical adhesive material is formed on the first surface of the display panel motherboard, and the mother film is covered with each display panel to obtain a stacked structure, and then the stacked structure is cut to obtain a sub-stacked structure of the display panel covered with an optical adhesive film, and a transparent cover is attached to the optical adhesive film of the sub-stacked structure to obtain a screen module. In this way, the control effect of the overflow glue can be effectively improved, and there is no need to reserve a distance for the overflow glue control, thereby reducing the border width of the screen module and improving the screen-to-body ratio of the electronic device using the screen module.

[0033] An exemplary embodiment of the present disclosure provides a method for processing a screen module, such as Figure 2 As shown, the processing method of the screen module includes the following steps:

[0034] S100: Provide a display panel motherboard, where the display panel motherboard includes a plurality of display panels.

[0035] In this step, if Figure 3 As shown, the display panel motherboard 2 includes a plurality of display panels 11 , and a cutting area for cutting is provided between adjacent display panels 11 .

[0036] S200, forming a mother film having an optical adhesive material on a first surface of a display panel motherboard to obtain a stacked structure, wherein the mother film covers each display panel.

[0037] In this step, if Figure 4 As shown, a mother film 3 having an optical adhesive material is formed on the first surface 21 of the display panel motherboard 2 to obtain a laminated structure, and the mother film 3 can cover each display panel 11 on the display panel motherboard 2. Exemplarily, each display panel 11 is arranged in an array on the display panel motherboard 2, and the mother film 3 can be a whole layer of optical adhesive film layer adapted to the display panel motherboard 2, and the whole layer of optical adhesive film layer covers each display panel 11. The mother film 2 can also be a strip-shaped optical adhesive film layer, and multiple optical adhesive film layers correspond to multiple columns of display panels 11 one by one, and each optical adhesive film layer covers each display panel 11 on a corresponding column. The mother film 3 can also be a plurality of mother films 2 corresponding to each display panel 11 one by one, and each mother film 2 covers the corresponding display panel 11, and the orthographic projection of each display panel 11 on the first surface 21 is located within the orthographic projection of the corresponding mother film 2 on the first surface 21, so as to ensure the comprehensive coverage of the display panel 11. The mother film 3 can be designed according to the requirements. It only needs to be able to cover the display panels 11 on the display panel motherboard 2 to obtain a stacked structure, and there is no specific limitation on this.

[0038] The mother film 3 may be, for example, OCA (Optically Clear Adhesive). For example, a liquid optical adhesive may be coated on the display panel motherboard 2, and the mother film 3 may be formed after the optical adhesive is cured. Alternatively, an optical adhesive having release films attached to two opposite surfaces may be used, and the release film on one surface of the optical adhesive may be peeled off first, and then the surface of the optical adhesive from which the release film is peeled off may be attached to the first surface 21 of the display panel motherboard 2, thereby forming the mother film 3. The release film on the other surface of the optical adhesive may be peeled off in a subsequent bonding process.

[0039] S300, cutting the stacked structure to obtain a sub-stacked structure, wherein the sub-stacked structure includes a display panel and an optical adhesive film covering the display panel, and the optical adhesive film is cut from a mother film.

[0040] In this step, the stacked structure can be cut by laser or cutting wheel, so as to obtain a plurality of Figure 5The sub-stacked structure of the display panel 11 covered with the optical adhesive film 12 is shown.

[0041] S400, attaching a transparent cover plate to the optical adhesive film to obtain a screen module.

[0042] In this step, if Figure 7 As shown, after the sub-laminated structure of the display panel 11 covered with the optical adhesive film 12 is obtained by cutting, the transparent cover plate 13 is attached to the optical adhesive film 12 of the sub-laminated structure. Exemplarily, the release film on one side surface of the optical adhesive is peeled off, and then the side surface is attached to the first surface 21 of the display panel motherboard 2 to form a mother film 3 to obtain a laminated structure. After cutting the laminated structure, multiple layers as shown in FIG. Figure 5 The sub-stacked structure of the display panel 11 covered with the optical adhesive film 12 is shown. Then, the cut release film on the other side surface of the optical adhesive film 12 of the sub-stacked structure is peeled off, and finally the transparent cover plate 13 is attached to the optical adhesive film 12 to obtain the screen module 1.

[0043] The transparent cover plate 13 is used to prevent the display panel 11 from being scratched, worn, etc. The material of the transparent cover plate 13 can be, for example, tempered glass, which is also called tempered glass. It is a glass material that is strengthened by tempering. It has the characteristics of high strength, high transparency and high wear resistance, and can effectively protect the display panel 11 from being damaged. The transparent cover plate 13 can also be, for example, a film cover plate. The film cover plate is a film made of a polymer material, which has the characteristics of being soft, thin and transparent, and can also effectively protect the display panel from being damaged.

[0044] By attaching the transparent cover plate 13 to the optical adhesive film 12 of the sub-laminated structure, on the one hand, the optical adhesive film 12 can realize the connection and fixation of the transparent cover plate 13, and on the other hand, the transparent cover plate 13 protects the display panel 11 to prevent the display panel 11 from being punctured or damaged.

[0045] In this embodiment, after a mother film 3 having an optical adhesive material is formed on the first surface of the display panel motherboard to obtain a laminated structure, the laminated structure is cut to obtain a sub-laminated structure of a display panel 11 covered with an optical adhesive film 12. In this way, compared with the method of separately setting optical adhesive films 12 on a single display panel 11, the control effect of overflow glue can be effectively improved, and there is no need to reserve a distance for overflow glue control, thereby effectively reducing the width of the frame of the screen module 1 and improving the screen-to-body ratio of the electronic device using the screen module 1.

[0046] In one embodiment, the outer contour line of the orthographic projection of the mother film 3 on the first surface 21 of the display panel motherboard 2 coincides with the outer contour line of the first surface 21 of the display panel motherboard 2. Such a design can improve the comprehensiveness of the mother film 3 covering each display panel 11 while facilitating the design and processing of the mother film 3.

[0047] In one embodiment, the cutting of the stacked structure is determined by:

[0048] The stacked structure is cut from one side of the mother film using a cutting tool.

[0049] In this embodiment, the cutting tool may be, for example, a laser cutting tool or a cutter wheel cutting tool. The stacked structure is cut from one side of the mother film 3. For example, one side of the display panel motherboard 2 is placed on the cutting platform, and the cutting tool is cut from one side of the mother film 3. With such a cutting method, on the one hand, during the cutting process, the display panel motherboard 2 can play a supporting role to avoid deformation during the cutting process, thereby improving the cutting effect. On the other hand, during the cutting process, part of the mother film 3 will follow the cutting tool and adhere to the edge of the display panel 11, thereby protecting the edge of the display panel 11 and avoiding damage to the display panel 11 during the cutting process.

[0050] In another embodiment, the cutting of the stacked structure is determined by:

[0051] The stacked structure is cut from one side of the display panel motherboard using a cutting tool.

[0052] In this embodiment, the stacked structure can be cut from one side of the display panel motherboard 2. For example, one side of the mother film 3 is placed on a cutting platform, and a laser cutting tool is used to cut the display panel motherboard 2. In this way, the display panel motherboard 2 is prevented from moving during the cutting process, thereby ensuring the cutting effect.

[0053] In one embodiment, before laminating the transparent cover plate on the optical adhesive film, the processing method of the screen module further includes the following steps:

[0054] A light shielding layer is formed on the second surface of the transparent cover plate, and the light shielding layer extends along the edge of the transparent cover plate.

[0055] In this step, if Figure 7 As shown, a shading layer 131 is formed on the second surface 132 of the transparent cover plate 13, that is, the shading layer 131 is formed on the side of the transparent cover plate 13 facing the display panel 11. Exemplarily, ink printing can be performed on the transparent cover plate by screen printing to form the shading layer.

[0056] In this embodiment, a light shielding layer 131 is provided on the transparent cover plate 13, and the light shielding layer 131 can play a light shielding role to prevent light leakage from the display panel 11 during the display of the picture, thereby effectively improving the display effect. By extending the light shielding layer 131 along the edge of the transparent cover plate 13, the comprehensiveness of the light shielding can be improved, thereby further improving the display effect of the screen module 1. In addition, by providing the light shielding layer 131 on the transparent cover plate 13, the internal structure of the screen module 1 can also be covered, thereby improving the overall aesthetics of the screen module 1.

[0057] In one embodiment, laminating the transparent cover plate on the optical adhesive film specifically includes the following steps:

[0058] The second surface of the transparent cover plate is laminated with the optical adhesive film, the optical adhesive film covers a part of the light shielding layer, and the area of ​​the light shielding layer close to the edge of the transparent cover plate is exposed outside the optical adhesive film.

[0059] In this embodiment, the optical adhesive film 12 covers part of the light shielding layer 131, so that the generation of bonding bubbles during the bonding of the transparent cover plate 13 and the optical adhesive film 12 can be effectively avoided, thereby improving the bonding effect. The area of ​​the light shielding layer 131 close to the edge of the transparent cover plate 13 is exposed outside the optical adhesive film 12. Such a design, on the one hand, avoids the light shielding layer 131 from blocking the display area of ​​the display panel 11, thereby improving the display effect of the screen module 1. On the other hand, the internal structure of the screen module 1 can be shielded by the light shielding layer 131, thereby effectively improving the overall aesthetics of the screen module 1.

[0060] An exemplary embodiment of the present disclosure provides a method for processing a screen module, such as Figure 6 As shown, the processing method of the screen module includes:

[0061] S500: Provide a display panel motherboard, where the display panel motherboard includes a plurality of display panels.

[0062] S600, forming a mother film having an optical adhesive material on a first surface of a display panel motherboard to obtain a stacked structure, wherein the mother film covers each display panel.

[0063] S700, cutting the stacked structure to obtain a sub-stacked structure, where the sub-stacked structure includes a display panel and an optical adhesive film covering the display panel, and the optical adhesive film is cut from a mother film.

[0064] S800, forming a light shielding layer on the second surface of the transparent cover plate, wherein the light shielding layer extends along an edge of the transparent cover plate.

[0065] S900, attaching a transparent cover plate to the optical adhesive film to obtain a screen module.

[0066] In this embodiment, a mother film 3 having an optical adhesive material is first formed on the first surface 21 of the display panel motherboard 2 to obtain a stacked structure, and then the stacked structure is cut to obtain a sub-stacked structure of the display panel 11 covered with the optical adhesive film 12. During the cutting process, a cutting tool is used to cut the stacked structure from one side of the mother film 3.

[0067] A light-shielding layer 131 is disposed on the transparent cover plate 13, and the light-shielding layer 131 extends along the edge of the transparent cover plate 13. The transparent cover plate 13 provided with the light-shielding layer 131 is bonded to the optical adhesive film 12. During bonding, the side of the transparent cover plate 13 provided with the light-shielding layer 131 faces the optical adhesive film 3 of the sub-stacked structure.

[0068] Compared with the method of separately setting optical adhesive films 12 on a single display panel 11, the processing method of the screen module in this embodiment can effectively improve the control effect of overflow glue, thereby eliminating the need to reserve overflow glue control distance, thereby reducing the border width of the screen module 1 and improving the screen-to-body ratio of the electronic device using the screen module 1.

[0069] An exemplary embodiment of the present disclosure provides a screen module, such as Figure 7 As shown, the screen module 1 includes a display panel 11 and an optical adhesive film 12 arranged on the third surface 113 of the display panel 11, and the outer contour line of the orthographic projection of the optical adhesive film 12 on the third surface 113 coincides with the outer contour line of the third surface 113. It should be noted that the coincidence of the outer contour line of the orthographic projection of the optical adhesive film 12 on the third surface 113 and the outer contour line of the third surface 113 does not mean that they completely coincide, and a certain error range is allowed, and the error range can be, for example, 0 to 0.15 mm.

[0070] For example, a laminated structure can be obtained by first forming a mother film 3 having an optical adhesive material on the first surface 21 of the display panel motherboard 2, and then cutting the laminated structure to obtain a sub-laminated structure of the display panel 11 covered with an optical adhesive film 12. At this time, the outer contour line of the orthographic projection of the optical adhesive film 12 on the third surface 113 coincides with the outer contour line of the third surface 113. With such a setting, when processing the screen module 1, there is no need to reserve a distance for the optical adhesive film 12 to control the overflow of the adhesive, thereby reducing the frame width of the screen module 1 and improving the screen-to-body ratio of the electronic device using the screen module 1.

[0071] Continue to refer Figure 7 In one embodiment, the screen module 1 further includes a transparent cover plate 13 , which is attached to the optical adhesive film 12 . The transparent cover plate 13 protects the display panel 11 to prevent the display panel 11 from being stabbed or otherwise damaged.

[0072] In this embodiment, the area of ​​the transparent cover plate 12 is larger than the area of ​​the display panel 11, that is, the orthographic projection of the display panel 11 on the transparent cover plate 12 is located inside the display panel 11, and the transparent cover plate 12 has an extension portion 133 that exceeds the display panel 11, and the extension portion 133 is used to connect with the middle frame of the electronic device to achieve assembly and fixation between the screen module 1 and the middle frame. Exemplarily, the inner side surface of the middle frame is protrudingly provided with a connection structure, and when the screen module 1 is assembled on the middle frame, the extension portion 133 is placed on the connection structure, and the extension portion 133 is fixed to the connection structure by gluing.

[0073] Continue to refer Figure 7 In one embodiment, the screen module 1 further includes a light shielding layer 131, which is disposed on the second surface of the transparent cover plate 13 facing the optical adhesive film 12. For example, ink printing can be performed on the transparent cover plate 13 by screen printing to form the light shielding layer 131. The light shielding layer 131 can play a light shielding role to prevent light leakage from the display panel 11 during the display of the picture, thereby effectively improving the display effect of the screen module 1. The light shielding layer 131 extends along the edge of the transparent cover plate 13, effectively improving the comprehensiveness of the light shielding, thereby further improving the display effect of the screen module 1. The optical adhesive film 12 covers part of the light shielding layer 131, which can effectively prevent the generation of bonding bubbles in the process of bonding the transparent cover plate 13 and the optical adhesive film 12, thereby improving the bonding effect. The area of ​​the light shielding layer 131 close to the edge of the transparent cover plate 13 is exposed outside the optical adhesive film 12. With such a configuration, the internal structure of the screen module 1 can be shielded by the light shielding layer 131 , thereby effectively improving the overall aesthetics of the screen module 1 .

[0074] In one embodiment, the width of the light shielding layer 131 covered by the optical adhesive film 12 (eg Figure 3 L2) shown in the figure is 0.4 to 0.6 mm, for example, it can be 0.5 mm. Since a step structure of a certain height is formed between the light shielding layer 131 and the transparent cover plate 13, such a setting form is adopted to ensure that there is a sufficient overlap width between the optical adhesive film 12 and the light shielding layer 131, improve the bonding strength and bonding area between the two, and effectively avoid the bonding bubbles generated by the step structure when the transparent cover plate 13 and the optical adhesive film 12 are bonded, thereby effectively improving the bonding effect.

[0075] Continue to refer Figure 7In one embodiment, the display panel 11 includes a display area 111 and a non-display area 112 located outside the display area 111. The display area 111 is used to display images. For example, a plurality of pixel units arranged in an array are provided in the display area 111. Each pixel unit includes a corresponding light-emitting device and a control element. The light-emitting device may be, for example, a light-emitting diode, and the control element may be, for example, a thin film transistor constituting a pixel driving circuit. The non-display area 112 is used to set peripheral driving elements, peripheral wiring, etc.

[0076] The orthographic projection of the light shielding layer 131 on the second surface is outside the orthographic projection of the display area 111 on the second surface, and there is a preset distance (for example, Figure 3 L1 shown in FIG. 1 ). With such a design, on the one hand, the light shielding layer 131 is prevented from blocking the display area 111 of the display panel 11, and a certain safety distance is provided for the bonding between the transparent cover plate 13 and the optical adhesive film 12, so as to prevent the light shielding layer 131 from extending into the display area 111 and blocking the display area 111, thereby improving the display effect of the screen module 1. On the other hand, the internal structure of the screen module 1 can be shielded by the light shielding layer 131, so as to effectively improve the overall aesthetics of the screen module 1.

[0077] In one embodiment, the preset distance (eg Figure 3 L1) shown in FIG. 1 is 0.15 mm to 0.25 mm, for example, 0.2 mm. With such a configuration, the light shielding layer 131 is effectively prevented from blocking the display area 111, thereby effectively improving the display effect of the screen module 1.

[0078] Continue to refer Figure 7 In one embodiment, the screen module 1 further includes a buffer layer 14, which is disposed on the side of the display panel 11 away from the optical adhesive film 12. The buffer layer 14 may be, for example, an SCF (super clean foam) film layer. The buffer layer 14 may be attached to the side of the display panel 11 away from the optical adhesive film 12 through an adhesive layer 141. The adhesive layer 141 may be, for example, an OCA optical adhesive or other adhesive materials. By providing the buffer layer 14, a buffering protection effect is provided for the display panel 11, thereby improving the reliability of the screen module 1.

[0079] An exemplary embodiment of the present disclosure provides an electronic device, which may be, for example, a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and may also be a non-mobile device such as a personal computer (PC), a television (TV), a teller machine, or a self-service machine.

[0080] The electronic device comprises the screen module 1 as above, Figure 7 As shown, the screen module 1 includes a display panel 11 and an optical adhesive film 12 disposed on the third surface of the display panel 11, and the outer contour line of the orthographic projection of the optical adhesive film 12 on the third surface coincides with the outer contour line of the third surface. For example, a laminated structure can be obtained by first forming a mother film having an optical adhesive material on the first surface of the display panel motherboard, and then cutting the laminated structure to obtain a sub-laminated structure of the display panel 11 covered with the optical adhesive film 12. At this time, the outer contour line of the orthographic projection of the optical adhesive film 12 on the third surface coincides with the outer contour line of the third surface. With such a setting form, when processing the screen module 1, compared with the method of separately setting the optical adhesive film 12 on a single display panel 11, the control effect of the overflow glue can be effectively improved, so that there is no need to reserve the overflow glue control distance, thereby reducing the frame width of the screen module 1 and improving the screen-to-body ratio of the electronic device.

[0081] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0082] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A method for processing a screen module, characterized in that: include: Providing a display panel motherboard, wherein the display panel motherboard includes a plurality of display panels; Forming a mother film having an optical adhesive material on the first surface of the display panel motherboard to obtain a stacked structure, wherein the mother film covers each of the display panels; Cutting the stacked structure to obtain a sub-stacked structure, wherein the sub-stacked structure includes the display panel and an optical adhesive film covering the display panel, wherein the optical adhesive film is obtained by cutting the mother film; A transparent cover plate is attached to the optical adhesive film to obtain the screen module.

2. The method for processing a screen module according to claim 1, characterized in that: An outer contour line of the orthographic projection of the master film on the first surface coincides with an outer contour line of the first surface.

3. The method for processing a screen module according to claim 1, characterized in that: The step of cutting the stacked structure comprises: The stacked structure is cut from one side of the mother film using a cutting tool.

4. The method for processing a screen module according to claim 1, characterized in that Before the transparent cover plate is attached to the optical adhesive film, the processing method of the screen module further includes: A light shielding layer is formed on the second surface of the transparent cover plate, and the light shielding layer extends along the edge of the transparent cover plate.

5. The method for processing a screen module according to claim 4, characterized in that: The step of laminating a transparent cover plate on the optical adhesive film comprises: The second surface of the transparent cover plate is bonded to the optical adhesive film, wherein the optical adhesive film covers a portion of the light shielding layer, and a region of the light shielding layer close to an edge of the transparent cover plate is exposed outside the optical adhesive film.

6. A screen module, characterized in that: The screen module includes a display panel and an optical adhesive film disposed on a third surface of the display panel, wherein an outer contour line of an orthographic projection of the optical adhesive film on the third surface coincides with an outer contour line of the third surface; the screen module further includes: A transparent cover plate is attached to the optical adhesive film.

7. The screen module according to claim 6, characterized in that: The screen module also includes: A shading layer is arranged on the second surface of the transparent cover plate facing the optical adhesive film, the shading layer extends along the edge of the transparent cover plate, the optical adhesive film covers a portion of the shading layer, and an area of ​​the shading layer close to the edge of the transparent cover plate is exposed outside the optical adhesive film.

8. The screen module according to claim 7, characterized in that: The width of the light-shielding layer covered by the optical adhesive film is 0.4 to 0.6 mm.

9. The screen module according to claim 7, characterized in that: The display panel includes a display area and a non-display area located outside the display area, the orthographic projection of the shading layer on the second surface is located outside the orthographic projection of the display area on the second surface, and there is a preset distance between the outer contour line of the orthographic projection of the display area on the second surface and the inner contour line of the orthographic projection of the shading layer on the second surface.

10. The screen module according to claim 9, characterized in that: The preset distance is 0.15 mm to 0.25 mm.

11. An electronic device, characterized in that: Comprising the screen module as described in any one of claims 6 to 10.

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