Display module, preparation method thereof and display device

Abstract

The invention provides a display module, a preparation method thereof and a display device.The preparation method comprises the steps that a display panel and a supporting piece are attached through optical cement, and an initial display module is formed; and filling a first adhesive material on one side, facing the third through hole, of the edge of the optical adhesive positioned at the periphery of the third through hole. A first through hole is formed in the display panel, a second through hole is formed in the supporting piece, a third through hole is formed in the optical cement, and the first through hole, the second through hole and the third through hole are communicated; in the direction parallel to the plane where the display module is located, the edge, facing the third through hole, of the optical cement shrinks inwards in the direction away from the third through hole relative to the edge, facing the first through hole, of the display panel, and the edge, facing the third through hole, of the optical cement shrinks inwards in the direction away from the third through hole relative to the edge, facing the second through hole, of the supporting piece. The modulus of the first adhesive material is greater than that of the optical adhesive. The first adhesive material can play a role in supporting the display panel, so that the probability that part of the circuit structure is damaged due to bending of the display panel is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a preparation method thereof, and a display device. Background Art

[0002] With the continuous development of preparation technology, display modules equipped with cameras have gradually become a common module type at present. Usually, a hole needs to be reserved on the display module to place the camera device. The hole often penetrates part of the structure in the display module. For example, the hole can penetrate the protective layer and the supporting structure used to protect the display panel. It should be noted that the above-mentioned protective layer and the supporting structure are often bonded together by optical glue. In order to avoid the optical glue adhering to the camera device in the hole, it is usually chosen to set the optical glue to shrink inward in the direction away from the hole. However, the shrinkage of the above-mentioned optical glue often leads to a step area between the above-mentioned protective layer and the supporting structure, and there is no structure in the step area that can play the role of supporting the protective layer. In this case, if the area on the display module corresponding to the hole is subjected to force, the above-mentioned protective layer and the display panel may easily bend and deform in the step area. In particular, the conductive structure in the display panel (such as wiring or semiconductor devices, etc.) may be damaged, thereby reducing the display effect. Summary of the invention

[0003] In view of this, the present application provides a display module and a manufacturing method thereof, and a display device.

[0004] In a first aspect, the present application provides a method for preparing a display module, comprising: The display panel and the support are bonded together by optical glue to form an initial display module; a first through hole is opened on the display panel, a second through hole is opened on the support, and a third through hole is opened on the optical glue, and the first through hole, the second through hole and the third through hole are connected; in a direction parallel to the plane where the display module is located, the edge of the optical glue toward the third through hole shrinks inwardly in a direction away from the third through hole relative to the edge of the display panel toward the first through hole, and the edge of the optical glue toward the third through hole shrinks inwardly in a direction away from the third through hole relative to the edge of the support toward the second through hole.

[0005] A first adhesive material is filled on a side of the edge of the optical adhesive located at the periphery of the third through hole and facing the third through hole, and the modulus of the first adhesive material is greater than the modulus of the optical adhesive.

[0006] In a second aspect, based on the same inventive concept, the present application provides a display module, including a display module prepared by the preparation method provided in the first aspect.

[0007] In a third aspect, based on the same inventive concept, the present application provides a display device, comprising a display module as provided in the second aspect.

[0008] In the embodiment of the present application, when the portion of the display panel located in the first area has a tendency to bend toward the support member due to force, since the first adhesive material can contact both the first contact portion and the second contact portion, the first adhesive material can play a role in supporting the display panel, preventing the portion of the display panel located in the first area from further bending, thereby reducing the probability of damage to some circuit structures in the array substrate. In addition, since the modulus of the first adhesive material is greater than the modulus of the optical adhesive, compared with the solution of filling the optical adhesive on the side of the first edge facing the third through hole, the solution of filling the first adhesive material can have a better supporting effect on the display panel, which helps to further reduce the degree of bending of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0010] Figure 1 A schematic diagram of a partial structure of a display module related to the present application; Figure 2 for Figure 1 The schematic diagram of the display module shown is under stress; Figure 3 A schematic diagram of the steps of a method for preparing a display module provided in the present application; Figure 4 A schematic diagram of a partial structure of a display module provided in the present application; Figure 5 A schematic diagram of some steps of a preparation method provided in the present application; Figure 6 For Figure 5 A schematic flow chart corresponding to the preparation method in FIG. Figure 7 is a schematic diagram of some steps in the preparation process of the display module; Figure 8 A schematic diagram of the steps of a method for preparing a display module provided in the present application; Fig. 9 A schematic diagram of the steps of a method for preparing a display module provided in the present application; Fig.10 For Fig. 9 A schematic flow chart corresponding to the preparation method in FIG. Fig.11 A schematic diagram of a partial structure of a display module provided in the present application; Fig.12 A schematic diagram of a partial structure of a display module provided in the present application; Fig.13 A schematic diagram of a partial structure of a display module provided in the present application; Fig.14 A schematic diagram of a display device provided in the present application. DETAILED DESCRIPTION

[0011] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0012] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0013] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0014] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0015] It is obvious to those skilled in the art that various modifications and changes can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and changes of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0016] Figure 1 It is a structural schematic diagram of a part of the structure of a display module related to the present application.

[0017] In the prior art, Figure 1As shown, the display module 10' may include a stacked support structure 01', a protective structure 02' and an array substrate 03', wherein the protective structure 02' is located between the support structure 01' and the array substrate 03', and the protective structure 02' is bonded to the support structure 01' through a first optical adhesive layer 04'. In order to accommodate the camera device, the display module 10' may also include a hole-digging structure 05', and the hole-digging structure 05' may penetrate the support structure 01', the protective structure 02', the array substrate 03', and the polarizing layer 06', the cover plate 08' (the polarizing layer 06' and the cover plate 08' are bonded together through the second optical adhesive layer 07') and other structures. In order to reduce the impact on the lighting process of the camera device, other structures (such as a transparent adhesive layer, etc.) may not be set in the hole-digging structure 05'.

[0018] It should be noted that, in order to prevent the optical glue in the first optical glue layer 04' from overflowing and contacting the camera device in the hole structure 05', it is usually necessary to set the edge of the first optical glue layer 04' toward the hole structure 05' and shrink inward in the direction away from the hole structure 05' to form a step area 09'. Similar to the hole structure 05', no other structure may be set in the step area 09'. Therefore, there is no structure in the step area 09' that can support the protective structure 02'.

[0019] Figure 2 for Figure 1 The schematic diagram of the display module under stress is shown.

[0020] like Figure 2 As shown, when the area corresponding to the hole structure 05' on the side of the cover plate 08' away from the array substrate 03' is acted upon by a force, especially a force with a small acting area and a large strength (for example, when performing a pointed impact test), since there is no structure that can play a supporting role in the step difference area 09', the part of the protective structure 02' overlapping with the step difference area 09' is easy to bend and deform, causing the part of the structure of the protective structure 02' away from the support structure 01' (for example, the array substrate 03') to bend and deform accordingly. Since the array substrate 03' may include circuit structures such as wiring structures, when the array substrate 03' is bent, part of the wiring structure included therein is easy to break, thereby causing part of the light-emitting devices electrically connected to the wiring structure to emit abnormal light (for example, causing bright lines to appear on the display screen), reducing the display effect.

[0021] Figure 3 A schematic diagram of the steps of a method for preparing a display module provided in this application, Figure 4 A schematic diagram of a partial structure of a display module provided in the present application.

[0022] In view of the above problems, the present application provides a method for preparing a display module. Figure 3 and Figure 4 , the preparation method comprises: S1: Bonding the display panel 01 and the support member 02 by optical adhesive 03 to form an initial display module.

[0023] like Figure 4 As shown, the display module 10 may include a display panel 01, a support member 02 and an optical adhesive 03. The display panel 01 may include a protective layer 01a and an array substrate 01b. The protective layer 01a may be located on a side of the array substrate 01b close to the support member 02. The protective layer 01a may be used to protect the array substrate 01b and reduce the degree of corrosion of the array substrate 01b by water and oxygen. The array substrate 01b may include a circuit structure such as a wiring, and this part of the circuit structure may be used to drive the light-emitting device to emit light. The support member 02 may have a large rigidity and may be used to enhance the structural stability of the display module 10. The support member 02 may include metal titanium.

[0024] The display panel 01 and the support member 02 are bonded together by the optical adhesive 03 . It can be understood that the protection layer 01 a on the display panel 01 can be bonded together with the support member 02 by the optical adhesive 03 .

[0025] In addition, the display module 10 may further include a polarizing structure 04 and a cover plate 05 . The cover plate 05 may be located on a side of the polarizing structure 04 away from the display panel 01 . The cover plate 05 may be bonded to the polarizing structure 04 via an adhesive material 06 . The components included in the adhesive material 06 may be the same as those included in the optical adhesive 03 .

[0026] like Figure 4 As shown, a first through hole 011 is provided on the display panel 01, a second through hole 021 is provided on the support member 02, and a third through hole 031 is provided on the optical glue 03, and the first through hole 011, the second through hole 021 and the third through hole 031 are connected. Among them, along the direction perpendicular to the plane where the display module 10 is located, the overlapping part of the first through hole 011, the second through hole 021 and the third through hole 031 can be used to place the camera device. In addition, in order to avoid the lighting process of the camera device being hindered, the first through hole 011, the second through hole 021 and the third through hole 031 may not be filled with glue, etc., and in particular, the medium in the above three may only include air.

[0027] In a direction parallel to the plane where the display module 10 is located, the edge of the optical adhesive 03 facing the third through hole 031 is retracted inwardly away from the third through hole 031 relative to the edge of the display panel 01 facing the first through hole 011. Therefore, in a direction perpendicular to the plane where the display module 10 is located, the first area 010 on the display panel 01 does not overlap with the optical adhesive 03.

[0028] The edge of the optical adhesive 03 facing the third through hole 031 is retracted inwards away from the third through hole 031 relative to the edge of the support member 02 facing the second through hole 021. In a direction perpendicular to the plane where the display module 10 is located, the second area 020 on the support member 02 does not overlap with the optical adhesive 03.

[0029] S2: Fill the first adhesive material 071 on the side of the edge of the optical adhesive 03 located at the periphery of the third through hole 031 and facing the third through hole 031. Figure 4 As shown, the first adhesive material 071 can be located on the side of the first edge s1 of the optical adhesive 03 facing the third through hole 031, the first adhesive material 071 can contact the portion of the protective layer 01a located in the first area 010 (the first contact portion), and the first adhesive material 071 can contact the portion of the support member 02 located in the second area 020 (the second contact portion).

[0030] The modulus of the first adhesive material 071 is greater than that of the optical adhesive 03 . When the force conditions of the first adhesive material 071 and the optical adhesive 03 are the same (the magnitude of the force, the area of ​​action and other characteristics are the same), the deformation degree of the first adhesive material 071 is lower than that of the optical adhesive 03 .

[0031] In the embodiment of the present application, when the portion of the display panel 01 located in the first region 010 has a tendency to bend toward the support member 02 due to force, since the first adhesive material 071 can contact both the first contact portion and the second contact portion, the first adhesive material 071 can play a role in supporting the display panel 01, preventing the portion of the display panel 01 located in the first region 010 from further bending, thereby reducing the probability of damage to a portion of the circuit structure in the array substrate 01a. In addition, since the modulus of the first adhesive material 071 is greater than the modulus of the optical adhesive 03, compared with the solution of filling the optical adhesive 03 on the side of the first edge s1 facing the third through hole 031, the solution of filling the first adhesive material 071 can have a better supporting effect on the display panel 01, which helps to further reduce the degree of bending of the display panel 01.

[0032] In one embodiment of the present application, the modulus k of the first adhesive material 071 satisfies: 200 kPa≤k≤400 kPa.

[0033] In the embodiment of the present application, the larger the modulus k of the first adhesive material 071 is, the lower the degree of deformation of the first adhesive material 071 is when subjected to a force of a fixed magnitude, and the more helpful it is to improve the supporting effect of the first adhesive material 071. It should be noted that when the modulus k of the first adhesive material 071 is too large, the rigidity of the first adhesive material 071 itself is also relatively strong, and it is easy to cause the display panel 01 to be partially deformed due to the excessive supporting effect of the first adhesive material 071. Therefore, in this embodiment, by controlling the modulus k of the first adhesive material 071 to satisfy 200kPa≤k≤400kPa, it is helpful to reduce the risk of the above-mentioned local deformation of the display panel 01 while achieving the support of the display panel 01.

[0034] Figure 5 A schematic diagram of some steps of a preparation method provided in this application, Figure 6 For Figure 5 The schematic diagram of the process corresponding to the preparation method in is provided for ease of understanding. Figure 6 The Figure 5 The structure of the display module corresponding to the preparation method shown is shown.

[0035] In one embodiment of the present application, Figure 5 and Figure 6 S2: Filling the first adhesive material 071 on the side of the edge of the optical adhesive 03 located at the periphery of the third through hole 031 and facing the third through hole 031, including: S21: adjusting the positions of the initial display module 100 and the glue dispenser 20 so that the display panel 01 of the initial display module 100 is located on the side of the support member 02 away from the glue dispenser 20 and the outlet 201 of the glue dispenser 20 faces the groove 08; The groove 08 is located between the display panel 01 and the support member 02 and the opening of the groove 08 faces the third through hole 031, wherein the inner wall of the groove 08 may include a portion of the protective layer 01a located in the first area 010 on the surface of the support member 02 facing the display panel 01, a portion of the support member 02 located in the second area 020 on the surface of the display panel 01, and the first edge s1 of the optical glue 03.

[0036] S22 : controlling the glue dispenser 20 to flow out the first glue material 071 , so that the first glue material 071 at least flows into the groove 08 .

[0037] In the embodiment of the present application, after adjusting the positions of the initial display module 100 and the glue dispenser 20, the glue dispenser 20 may be located above the initial display module 100 in the vertical direction. In this case, when the glue dispenser 20 is controlled to leave the first glue material 071, the first glue material 071 may flow into the groove 08 under the action of gravity, and the action of gravity helps the first glue material 071 to be filled to the bottom of the groove 08 first, thereby improving the filling effect of the first glue material 071 in the groove 08.

[0038] In one embodiment of the present application, Figure 6 As shown, the depth h of the groove 08 is less than or equal to 0.3 mm.

[0039] In the embodiment of the present application, when h≤0.3 mm, the depth of the groove 08 is relatively small. When the first adhesive material 071 is filled, the first adhesive material 071 easily fills the gap in the groove 08 , which helps to enhance the supporting effect of the first adhesive material 071 on the display panel 01 .

[0040] Figure 7 This is a schematic diagram of some steps in the preparation process of the display module. For easy understanding, Figure 7 The figure shows the positional relationship between the initial display module and the dispenser during the process of preparing the display module.

[0041] In one embodiment of the present application, Figure 7 As shown, after adjusting the positions of the initial display module 100 and the glue dispenser 20, the angle θ between the initial display module 100 and the outlet 021 of the glue dispenser 20 satisfies: 30°≤θ≤80°. The angle θ here can be understood as the angle between the plane where the initial display module 100 is located and the direction of the outlet 021 of the glue dispenser 20.

[0042] In the embodiment of the present application, when 30°≤θ≤80°, it means that the direction of the outlet 021 of the dispenser 20 may not be perpendicular to the outlet direction of the groove 08, and the outlet 021 of the dispenser 20 may be directed toward the bottom of the groove 08. In this case, it is more conducive to the first glue material 071 flowing into the bottom of the groove 08.

[0043] Figure 8 A schematic diagram of the steps of a method for preparing a display module provided in the present application.

[0044] In one embodiment of the present application, Figure 8 As shown, S2: before the first adhesive material 071 is filled on the side of the edge of the optical adhesive 03 located at the periphery of the third through hole 031 and facing the third through hole 031, the preparation method further includes: S11 : performing laser irradiation on the surfaces of the support member 02 and the display panel 01 facing the groove 08 to increase the roughness of the surfaces of the support member 02 and the display panel 01 facing the groove 08 .

[0045] In the embodiment of the present application, during the process of filling the first adhesive material 071, the first adhesive material 071 flowing into the groove 08 may contact a part of the inner wall of the groove 08 (the surface of the support member 02 and the display panel 01 facing the groove 08 and the first edge S1 of the optical adhesive 03). The laser irradiation scheme adopted in this embodiment can increase the roughness of a part of the inner wall of the groove 08, thereby improving the wettability between the first adhesive material 071 and the inner wall of the groove 08, and facilitating the uniformity of filling the first adhesive material 071 in the groove 08.

[0046] Fig. 9 A schematic diagram of the steps of a method for preparing a display module provided in this application, Fig.10 For Fig. 9 The schematic diagram of the process corresponding to the preparation method in is provided for ease of understanding. Fig.10 The following is shown in Fig. 9 The structure of the display module corresponding to the preparation method shown is shown.

[0047] In one embodiment of the present application, Fig. 9 and Fig.10 Before the display panel 01 and the support member 02 are bonded together by the optical adhesive 03, the preparation method further includes: S01: attaching the optical adhesive 03 to the first portion 02 a of the support 02 .

[0048] S02: Prepare the second adhesive material 072 on the side of the second portion 02b of the support member 02 facing the optical adhesive 03. It should be noted that when preparing the second adhesive material 072, the support member 02 has not yet been attached to the display panel 01, and the second adhesive material 072 can be filled at the first edge s1 of the optical adhesive 03 by adjusting the position between the support member 02 and the adhesive dispenser 20. Therefore, after the display panel 01 and the support member 02 are attached, the second adhesive material 072 can be located at the bottom of the groove 08.

[0049] The modulus of the second adhesive material 072 is greater than the modulus of the optical adhesive 03. The optical adhesive 03 is not attached to the second portion 02b and the second portion 02b is located on a side of the first portion 02a close to the second through hole 021.

[0050] In the embodiment of the present application, by preparing the second adhesive material 072 before filling the first adhesive material 071, it is helpful to set the second adhesive material 072 at the bottom of the groove 08 and set the first adhesive material 071 at the outlet of the groove 08, that is, the adhesive filling degree in the groove 08 is relatively high. In addition, since the modulus of the second adhesive material 072 is also greater than the modulus of the optical adhesive 03, the second adhesive material 072 can also play a good supporting effect on the display panel 01.

[0051] In addition, it should be noted that when the display panel 01 is bent by force, in addition to easily causing the wiring structure to break, it is also easy to cause the position of the display panel 01 and the support member 02 to shift, thereby causing the display panel 01 and the support member 02 to peel off. In this embodiment, the second adhesive material 072 is provided to increase the amount of adhesive material that can be attached to the display panel 01 on the support member 02, that is, the bonding strength between the display panel 01 and the support member 02 is enhanced, and the risk of the display panel 01 and the support member 02 peeling off is reduced.

[0052] In one embodiment of the present application, Fig.10 As mentioned above, the width w of the second portion 02b satisfies: 0.3mm≤w≤2mm.

[0053] In the embodiment of the present application, the surface of the second portion 02b facing the optical adhesive 03 can be used as a part of the inner wall of the groove 08, and the width w of the second portion 02b can affect the depth of the groove 08. The larger the width w of the second portion 02b, the greater the depth of the groove 08 can be, and the more difficult it is for the adhesive to be filled to the bottom of the groove 08. When 0.3mm≤w≤2mm, the first adhesive 071 is difficult to be filled to the bottom of the groove 08. Therefore, the embodiment of the present application helps to increase the amount of adhesive filled into the groove 08 by filling the second adhesive 072 between the first adhesive 071, thereby enhancing the support effect on the display panel 01.

[0054] In one embodiment of the present application, the first adhesive material 071 and the second adhesive material 072 are made of the same material.

[0055] In the embodiment of the present application, the first adhesive material 071 and the second adhesive material 072 are made of the same material, which means that the modulus of the first adhesive material 071 and the modulus of the second adhesive material 072 can be the same. Since the distribution positions of the first adhesive material 071 and the second adhesive material 072 in the groove 08 can be different, the setting method of this embodiment helps to achieve the effect of uniformly supporting the display panel 01 in various areas of the groove 08.

[0056] The present application provides a display module, which is prepared using the preparation method described in the above embodiment.

[0057] In the display module provided in the present application, the phenomenon of partial circuit structure breakage in the display panel 01 is greatly suppressed.

[0058] Fig.11 A schematic diagram of a partial structure of a display module provided in the present application.

[0059] The present application provides a display module 10, such as Fig.11As shown, it includes a stacked display panel 01 and a support member 02. The display panel 01 is provided with a first through hole 011, and the support member 02 is provided with a second through hole 021, and the first through hole 011 is connected to the second through hole 021.

[0060] The display module 10 further includes an optical glue 03 located between the display panel 01 and the support member 02. The optical glue 03 is provided with a third through hole 031, and the third through hole 031 is connected to the first through hole 011 and the second through hole 021. In a direction parallel to the plane where the display module 10 is located, the edge of the optical glue 03 facing the third through hole 031 shrinks inwardly in a direction away from the third through hole 031 relative to the edge of the display panel 01 facing the first through hole 011, and shrinks inwardly in a direction away from the third through hole 031 relative to the edge of the support member 02 facing the second through hole 021, forming a groove 08.

[0061] The display module 10 further includes a glue material 07 . The glue material 07 at least fills the groove 08 . The modulus of the glue material 07 is greater than the modulus of the optical glue 03 .

[0062] In the embodiment of the present application, the adhesive material 07 filled in the groove 08 can support the display panel 01 and reduce the deformation degree of the display panel 01. In addition, since the modulus of the adhesive material 07 is greater than the modulus of the optical adhesive 03, the adhesive material 07 has a better supporting effect on the display panel 01 than the optical adhesive 03, which helps to further reduce the deformation degree of the display panel 01.

[0063] In one embodiment of the present application, the modulus k of the adhesive material 07 satisfies: 200 kPa≤k≤400 kPa.

[0064] In this embodiment, k is controlled to satisfy 200 kPa≤k≤400 kPa, which helps to reduce the risk of local deformation on the display panel 01 while supporting the display panel 01 .

[0065] Fig.12 A schematic diagram of a partial structure of a display module provided in the present application.

[0066] The present application provides a display module 10, such as Fig.12 As shown, in a direction perpendicular to the plane where the display module 10 is located, the edge of the adhesive material 07 facing the third through hole 031 is flush with the edge of the display panel 01 facing the first through hole 011 .

[0067] In the embodiment of the present application, since the overlapping portion of the first through hole 011, the second through hole 021, and the third through hole 031 can be used to place the camera device, in order to prevent the adhesive material 07 from contacting the camera device, the edge s2 of the adhesive material 07 can be set to be flush with the edge s3 of the display panel 01. In this case, the risk of the adhesive material 07 contacting the camera device in the future is low. On the other hand, the adhesive material 07 can contact the portion of the display panel 01 close to the first through hole 011, and the adhesive material 07 has a better supporting effect.

[0068] Fig.13 A schematic diagram of a partial structure of a display module provided in the present application.

[0069] The present application provides a display module 10, such as Fig.13 As shown, the display panel 01 includes a protrusion 012. In a direction parallel to the plane where the display module 10 is located, the protrusion 012 protrudes in a direction close to the first through hole 011 relative to the edge of the support member 02 toward the second through hole 021. It should be noted that when the display panel 01 has a tendency to bend and deform, the risk of the protrusion 012 bending and causing positional displacement is higher relative to other parts on the display panel 01. The reason is that when the display panel 01 has a tendency to bend, the optical glue 03 can support the display panel 01. Based on the principle of leverage, the part of the display panel 01 that is not supported and is farther away from the optical glue 03 is more likely to bend, that is, the protrusion 012 is more likely to bend.

[0070] The adhesive material 07 covers the side of the protrusion 012 facing the support member 02 .

[0071] In the embodiment of the present application, by disposing the adhesive material 07 on the side of the protrusion 012 facing the support member 02 , it is helpful for the adhesive material 07 to support the protrusion 012 , thereby reducing the probability of the protrusion 012 being bent.

[0072] Fig.14 A schematic diagram of a display device provided in the present application.

[0073] The present application provides a display device 30, such as Fig.14 As shown, the display device 30 includes the display module 10 provided in the above embodiment. The display device 30 may be a mobile phone, and in addition, the display device 30 may also be an electronic device such as a computer or a television.

[0074] The probability of bright lines appearing on the display screen of the display device 30 provided in the embodiment of the present application is greatly reduced.

[0075] In this specification, the same or similar parts between the various embodiments can be referred to each other. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

Claims

1. A method for preparing a display module, characterized in that: The preparation method comprises: The display panel and the support are bonded together by optical glue to form an initial display module; the display panel is provided with a first through hole, the support is provided with a second through hole, and the optical glue is provided with a third through hole, and the first through hole, the second through hole and the third through hole are connected; in a direction parallel to the plane where the display module is located, the edge of the optical glue facing the third through hole shrinks inwardly in a direction away from the third through hole relative to the edge of the display panel facing the first through hole, and the edge of the optical glue facing the third through hole shrinks inwardly in a direction away from the third through hole relative to the edge of the support facing the second through hole; A first adhesive material is filled on a side of the edge of the optical adhesive located at the periphery of the third through hole and facing the third through hole; the modulus of the first adhesive material is greater than the modulus of the optical adhesive.

2. The preparation method according to claim 1, characterized in that: The modulus k of the first adhesive material satisfies: 200 kPa≤k≤400 kPa.

3. The preparation method according to claim 1, characterized in that: The step of filling the first adhesive material on a side of the edge of the optical adhesive located at the periphery of the third through hole and facing the third through hole comprises: Adjust the positions of the initial display module and the glue dispenser so that the display panel of the initial display module is located on the side of the support member away from the glue dispenser and the outlet of the glue dispenser faces the groove, the groove is located between the display panel and the support member and the opening of the groove faces the third through hole; The glue dispenser is controlled to flow out the first glue material so that the first glue material at least flows into the groove.

4. The preparation method according to claim 3, characterized in that: The depth of the groove is less than or equal to 0.3 mm.

5. The preparation method according to claim 3, characterized in that: After the positions of the initial display module and the glue dispenser are adjusted, an angle θ between the initial display module and the outlet of the glue dispenser satisfies: 30°≤θ≤80°.

6. The preparation method according to claim 1, characterized in that: Before the first adhesive material is filled on a side of the edge of the optical adhesive located at the periphery of the third through hole and facing the third through hole, the preparation method further comprises: Laser irradiation is performed on the surfaces of the support member and the display panel facing the groove to increase the roughness of the surfaces of the support member and the display panel facing the groove.

7. The preparation method according to claim 1, characterized in that: Before bonding the display panel and the support member by optical adhesive, the preparation method further includes: Attaching the optical adhesive to the first portion of the support; A second adhesive material is prepared on a side of the second portion of the support member facing the optical adhesive; the modulus of the second adhesive material is greater than the modulus of the optical adhesive; the optical adhesive is not adhered to the second portion and the second portion is located on a side of the first portion close to the second through hole.

8. The preparation method according to claim 7, characterized in that: The width w of the second portion satisfies: 0.3 mm ≤ w ≤ 2 mm.

9. The preparation method according to claim 7, characterized in that: The first adhesive material and the second adhesive material are made of the same material.

10. A display module, characterized in that: The method comprises preparing the product by the preparation method according to any one of claims 1 to 9.

11. A display module, characterized in that: include: A display panel and a support member are stacked; the display panel is provided with a first through hole, the support member is provided with a second through hole, and the first through hole is connected to the second through hole; An optical glue is located between the display panel and the support member, the optical glue is provided with a third through hole, the third through hole is connected with the first through hole and the second through hole; in a direction parallel to the plane where the display module is located, an edge of the optical glue facing the third through hole is inwardly contracted in a direction away from the third through hole relative to an edge of the display panel facing the first through hole, and is inwardly contracted in a direction away from the third through hole relative to an edge of the support member facing the second through hole to form a groove; The adhesive material is at least filled in the groove, and the modulus of the adhesive material is greater than the modulus of the optical adhesive.

12. The display module according to claim 11, characterized in that: The modulus k of the adhesive material satisfies: 200kPa≤k≤400kPa.

13. The display module according to claim 11, characterized in that: In a direction perpendicular to the plane where the display module is located, an edge of the adhesive material facing the third through hole is flush with an edge of the display panel facing the first through hole.

14. The display module according to claim 11, characterized in that: The display panel comprises a protrusion; in a direction parallel to the plane where the display module is located, the protrusion protrudes in a direction close to the first through hole relative to the edge of the support member toward the second through hole; The adhesive material covers a side of the protrusion facing the support member.

15. A display device, characterized in that: Comprising a display module as described in any one of claims 10-14.

Images