Capacitor assembly packaging structure, capacitor structure packaging method and electronic device

Abstract

The invention provides a capacitor assembly packaging structure, a capacitor structure packaging method and an electronic device. The capacitor assembly packaging structure comprises a capacitor assembly, a plurality of first insulation packaging bodies, a second insulation packaging body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stack gaps. The plurality of first insulating packaging bodies are configured to be accommodated in the plurality of stacking gaps of the capacitor assembly respectively. The second insulating package is configured to cover the plurality of first insulating packages and the plurality of capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure electrically connected to the capacitor assembly. The solid content of each first insulation packaging body is smaller than that of the second insulation packaging body, so that the percentage of a plurality of air holes formed in each stacking gap of the capacitor assembly is reduced, and the structural stability of the capacitor assembly packaging structure is improved.

Description

Technical Field

[0001] The present invention relates to a capacitor, and in particular to a capacitor component packaging structure, a capacitor structure packaging method and an electronic device using the capacitor component packaging structure. Background Art

[0002] Capacitors have been widely used as basic components in consumer home appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, phase shifting, etc., making them one of the indispensable components in electronic products. According to different materials and uses, capacitors include aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors, etc. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, and superior frequency characteristics, and can be applied to the decoupling function of the power circuit of the central processing unit. Generally speaking, a solid electrolytic capacitor with high capacitance can be formed by stacking multiple capacitor units. The stacked solid electrolytic capacitor in the current technology includes multiple capacitor units and a lead frame. Each capacitor unit includes an anode portion, a cathode portion and an insulating portion, and the insulating portion electrically insulates the anode portion and the cathode portion from each other. In particular, the cathode portions of the capacitor units are stacked on each other, and a conductive layer is provided between two adjacent capacitor units so that multiple capacitor units can be electrically connected to each other. However, the stacked capacitor in the prior art still has room for improvement. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a capacitor component packaging structure, a capacitor structure packaging method and an electronic device to address the deficiencies in the prior art, so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor component (that is, to reduce the structural defect rate or structural defect caused by the multiple pores), thereby improving the structural stability of the capacitor component packaging structure (for example, improving the seismic resistance of the multiple capacitor structures of the capacitor component packaging structure, so that the electrical characteristics of the capacitor component packaging structure provided by the present invention are not easily affected by vibration and thus degraded), and to avoid excessive moisture from accumulating in the pores, thereby reducing the probability of structural cracking of the capacitor component packaging structure during reflow.

[0004] In order to solve the above problems, one of the technical means adopted by the present invention is to provide a capacitor assembly packaging structure, which includes: a capacitor assembly, a plurality of first insulating packaging bodies, a second insulating packaging body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures stacked and electrically connected to each other, each capacitor structure having a positive electrode portion and a negative electrode portion, and the capacitor assembly has a plurality of stacking gaps, each stacking gap being formed between two adjacent capacitor structures. The plurality of first insulating packaging bodies are configured to be respectively accommodated in the plurality of stacking gaps of the capacitor assembly. The second insulating packaging body is configured to cover the plurality of first insulating packaging bodies and the plurality of capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating packaging body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating packaging body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure. Wherein, the solid content of each first insulating packaging body is less than the solid content of the second insulating packaging body; wherein, the total volume of the plurality of first insulating packaging bodies is less than the volume of the second insulating packaging body; wherein, each first insulating packaging body and the second insulating packaging body have the same or different insulating materials.

[0005] In order to solve the above-mentioned problems, another technical means adopted by the present invention is to provide a capacitor structure packaging method, which includes: providing a capacitor assembly, the capacitor assembly includes a plurality of capacitor structures stacked and electrically connected to each other, each capacitor structure having a positive electrode portion and a negative electrode portion, the capacitor assembly having a plurality of stacking gaps, each stacking gap being formed correspondingly between two adjacent capacitor structures; forming a plurality of first insulating packaging bodies for being respectively accommodated in the plurality of stacking gaps of the capacitor assembly; and forming a second insulating packaging body for covering the plurality of first insulating packaging bodies and the plurality of capacitor structures. The solid content of each first insulating packaging body is less than the solid content of the second insulating packaging body; the total volume of the plurality of first insulating packaging bodies is less than the volume of the second insulating packaging body; each first insulating packaging body and the second insulating packaging body have the same or different insulating materials.

[0006] In order to solve the above-mentioned problems, another technical means adopted by the present invention is to provide an electronic device, which uses a capacitor assembly packaging structure, characterized in that the capacitor assembly packaging structure includes: a capacitor assembly, a plurality of first insulating packaging bodies, a second insulating packaging body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures stacked and electrically connected to each other, each capacitor structure having a positive electrode portion and a negative electrode portion, and the capacitor assembly has a plurality of stacking gaps, each stacking gap being formed correspondingly between two adjacent capacitor structures. The plurality of first insulating packaging bodies are configured to be respectively accommodated in the plurality of stacking gaps of the capacitor assembly. The second insulating packaging body is configured to cover the plurality of first insulating packaging bodies and the plurality of capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating packaging body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating packaging body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure. wherein the solid content of each first insulating package is less than the solid content of the second insulating package; wherein the total volume of the plurality of first insulating packages is less than the volume of the second insulating package; wherein each first insulating package and the second insulating package have the same or different insulating materials.

[0007] In one feasible or preferred embodiment, the solid content of each first insulating package is between 5% and 79%, and the solid content of each second insulating package is between 80% and 95%.

[0008] In one feasible or preferred embodiment, the plurality of first insulating packaging bodies have the same insulating material, and the plurality of first insulating packaging bodies have the same solid content.

[0009] In one feasible or preferred embodiment, each first insulating package includes a first insulating colloid and a plurality of first insulating particles mixed in the first insulating colloid, and the second insulating package includes a second insulating colloid and a plurality of second insulating particles mixed in the second insulating colloid.

[0010] In one feasible or preferred embodiment, the material of the first insulating colloid of each first insulating package is silica gel or epoxy resin, and the material of each first insulating particle of each first insulating package is silicon dioxide or aluminum oxide.

[0011] In one feasible or preferred embodiment, the material of the second insulating colloid of the second insulating package is silica gel or epoxy resin, and the material of each second insulating particle of the second insulating package is silicon dioxide or aluminum oxide.

[0012] In one feasible or preferred embodiment, the density of the plurality of first insulating particles in each first insulating package is smaller than the density of the plurality of second insulating particles in the second insulating package.

[0013] In one feasible or preferred embodiment, the first insulating colloid of each first insulating package and the second insulating colloid of the second insulating package have the same insulating material or different insulating materials, and each first insulating particle of each first insulating package and each second insulating particle of the second insulating package have the same insulating material or different insulating materials.

[0014] In one feasible or preferred embodiment, the plurality of first insulating encapsulants are configured to respectively fill the plurality of stacking gaps of the capacitor assembly, thereby reducing the percentage of the plurality of air voids formed in each stacking gap of the capacitor assembly.

[0015] In one feasible or preferred embodiment, the filling rate of each stacking gap of the capacitor assembly filled by the corresponding first insulating packaging body is between 85% and 95%.

[0016] One of the beneficial effects of the present invention is that a capacitor component packaging structure provided by the present invention can reduce the percentage of multiple pores formed in each stacking gap of the capacitor component (that is, reduce the structural defect rate or structural defect caused by multiple pores) through the technical solutions of "multiple first insulating packaging bodies are configured to be respectively accommodated in multiple stacking gaps of the capacitor component", "second insulating packaging bodies are configured to cover multiple first insulating packaging bodies and multiple capacitor structures", "the solid content of each first insulating packaging body is less than the solid content of the second insulating packaging body" and "the total volume of the multiple first insulating packaging bodies is less than the volume of the second insulating packaging body", thereby improving the structural stability of the capacitor component packaging structure (for example, improving the seismic resistance of multiple capacitor structures of the capacitor component packaging structure, so that the electrical characteristics of the capacitor component packaging structure provided by the present invention are not easily affected by vibration and thus reduced), and can avoid excessive moisture from accumulating in the pores, thereby reducing the probability of structural cracking of the capacitor component packaging structure during reflow.

[0017] Another beneficial effect of the present invention is that the capacitor structure packaging method provided by the present invention can reduce the percentage of multiple pores formed in each stacking gap of the capacitor component (that is, reduce the structural defect rate or structural defect caused by multiple pores) through the technical solutions of "forming multiple first insulating packaging bodies for respectively accommodating multiple stacking gaps of the capacitor component", "forming a second insulating packaging body for covering multiple first insulating packaging bodies and multiple capacitor structures", "the solid content of each first insulating packaging body is less than the solid content of the second insulating packaging body" and "the total volume of the multiple first insulating packaging bodies is less than the volume of the second insulating packaging body", thereby improving the structural stability of the capacitor component packaging structure (for example, improving the seismic resistance of multiple capacitor structures of the capacitor component packaging structure, so that the electrical characteristics of the capacitor component packaging structure provided by the present invention are not easily affected by vibration and reduced), and can avoid excessive moisture from accumulating in the pores, thereby reducing the probability of structural cracking of the capacitor component packaging structure during reflow.

[0018] Another beneficial effect of the present invention is that an electronic device using a capacitor component packaging structure provided by the present invention can reduce the percentage of multiple pores formed in each stacking gap of the capacitor component (that is, reduce the structural defect rate or structural defect caused by the multiple pores) through the technical solutions of "multiple first insulating packaging bodies are configured to be respectively accommodated in multiple stacking gaps of the capacitor component", "the second insulating packaging body is configured to cover multiple first insulating packaging bodies and multiple capacitor structures", "the solid content of each first insulating packaging body is less than the solid content of the second insulating packaging body" and "the total volume of the multiple first insulating packaging bodies is less than the volume of the second insulating packaging body", thereby improving the structural stability of the capacitor component packaging structure (for example, improving the seismic resistance of the multiple capacitor structures of the capacitor component packaging structure, so that the electrical characteristics of the capacitor component packaging structure provided by the present invention are not easily affected by vibration and reduced), and can avoid excessive moisture from accumulating in the pores, thereby reducing the probability of structural cracking of the capacitor component packaging structure during reflow.

[0019] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a cross-sectional schematic diagram of the capacitor structure provided by the present invention.

[0021] Figure 2 The cross-sectional diagram is a diagram showing that a plurality of first insulating packaging bodies provided by the first embodiment of the present invention are respectively accommodated in a plurality of stacking gaps of a capacitor assembly.

[0022] Figure 3 It is a cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a first embodiment of the present invention.

[0023] Figure 4 The cross-sectional diagram of a second embodiment of the present invention shows that a plurality of first insulating packaging bodies are respectively accommodated in a plurality of stacking gaps of a capacitor assembly.

[0024] Figure 5 It is a cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a second embodiment of the present invention.

[0025] Figure 6 The schematic cross-sectional view of a third embodiment of the present invention showing that a plurality of first insulating packaging bodies are respectively accommodated in a plurality of stacking gaps of a capacitor assembly.

[0026] Figure 7 It is a cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a third embodiment of the present invention.

[0027] Figure 8 This is a flow chart of a capacitor structure packaging method provided by a fourth embodiment of the present invention.

[0028] Fig. 9 A functional block diagram of an electronic device provided in accordance with a fifth embodiment of the present invention. DETAILED DESCRIPTION

[0029] The following is an explanation of the implementation methods of the "capacitor assembly packaging structure, capacitor structure packaging method and electronic device" disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0030] [First embodiment]

[0031] See also Figures 1 to 3As shown, the first embodiment of the present invention provides a capacitor assembly packaging structure S, which includes: a capacitor assembly 1, a plurality of first insulating packaging bodies 2A, a second insulating packaging body 2B, and an electrode assembly 3. It is worth noting that the capacitor assembly 1 includes a plurality of capacitor structures 10 stacked and electrically connected to each other, and each capacitor structure 10 has a positive electrode portion P and a negative electrode portion N. When the plurality of capacitor structures 10 are stacked and electrically connected to each other, the capacitor assembly 1 has a plurality of stacking gaps 1000, and each stacking gap 1000 is correspondingly formed between two adjacent capacitor structures 10.

[0032] For example, if Figure 1As shown, the capacitor structure 10 includes a metal foil 100, an insulating limiting layer 101 (or an insulating surrounding layer), a conductive polymer layer 102, a carbon glue layer 103, and a silver glue layer 104 (for example, a silver glue layer formed by curing, or a nanosilver layer formed by sintering, and the average thickness of the nanosilver layer can be less than or equal to 1 μm). Further, the insulating limiting layer 101 is configured to be disposed on the first portion 100A of the metal foil 100 in a surrounding manner, but will not contact the second portion 100B of the metal foil 100 through the barrier of the insulating limiting layer 101. The conductive polymer layer 102 is configured to cover the first portion 100A of the metal foil 100 and contact the insulating limiting layer 101, but will not contact the second portion 100B of the metal foil 100 through the barrier of the insulating limiting layer 101. The carbon glue layer 103 is configured to cover the conductive polymer layer 102 and contact the insulating limiting layer 101, but will not contact the second part 100B of the metal foil 100 through the barrier of the insulating limiting layer 101. The silver glue layer 104 is configured to cover the carbon glue layer 103 and contact the insulating limiting layer 101, but will not contact the second part 100B of the metal foil 100 through the barrier of the insulating limiting layer 101. Furthermore, the metal foil 100 can be an aluminum foil, a copper foil or any kind of conductive foil, and the surface of the metal foil 100 has a corrosion layer and an oxide layer formed on the corrosion layer. In addition, a second part 100B of the metal foil 100 of each capacitor structure 10 is not covered by the insulating limiting layer 101, and multiple second parts 100B of multiple metal foils 100 of multiple capacitor structures 10 can be stacked. In addition, the insulating limiting layer 101 may be silicone, epoxy or any type of insulating material, and the conductive polymer layer 102 may be polyacetylene (PA), polypyrrole (PPy), polythiophene (PT), polyaniline (PANI), poly(p-phenylene) (PPP), poly(phenylenevinylene) (PPV), or the conductive polymer layer 102 may be polyphenylene sulfide, polypyrrole, polythiophene, polyphenyl, polythiazole, etc. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0033] In addition, with Figure 2 and Figure 3As shown, the plurality of first insulating packages 2A may be configured to be respectively accommodated in the plurality of stacking gaps 1000 of the capacitor assembly 1, and the second insulating package 2B may be configured to cover the plurality of first insulating packages 2A and the plurality of capacitor structures 10. For example, in one feasible or preferred embodiment, each first insulating package 2A may include a first insulating colloid 21A and a plurality of first insulating particles 22A (such as granules 22A) mixed in the first insulating colloid 21A. Figure 2 As shown), the second insulating package body 2B may include a second insulating colloid 21B and a plurality of second insulating particles 22B (as shown) mixed in the second insulating colloid 21B. Figure 3 It is worth noting that the total volume of the first insulating packaging bodies 2A is smaller than the volume of the second insulating packaging bodies 2B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0034] For example, with Figure 2 and Figure 3 As shown, in one feasible or preferred embodiment, the solid content of each first insulating package 2A (that is, the content of solid particles in the first insulating package 2A after the material is dried or solidified) can be less than the solid content of the second insulating package 2B (that is, the content of solid particles in the second insulating package 2B after the material is dried or solidified). More specifically, the solid content of each first insulating package 2A can be approximately between 5% and 79% (that is, in each first insulating package 2A, the content ratio or weight percentage of the plurality of first insulating particles 22A can be any integer percentage between 5% and 79%), and the solid content of the second insulating package 2B can be approximately between 80% and 95% (that is, in each second insulating package 2B, the content ratio or weight percentage of the plurality of second insulating particles 22B can be any integer percentage between 80% and 95%). In other words, the density of the first insulating particles 22A of each first insulating package 2A (that is, the mass of the first insulating particles 22A in each first insulating package 2A) may be less than the density of the second insulating particles 22B of the second insulating package 2B (that is, the mass of the second insulating particles 22B in each second insulating package 2B). It is worth noting that the first insulating packages 2A may have the same or different solid contents. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0035] For example, with Figure 2 and Figure 3As shown, in one feasible or preferred embodiment, each first insulating package 2A and the second insulating package 2B can have the same or different insulating materials, and multiple first insulating packages 2A can have the same or different insulating materials. In addition, the first insulating colloid 21A of each first insulating package 2A and the second insulating colloid 21B of the second insulating package 2B can have the same insulating material or different insulating materials, and each first insulating particle 22A of each first insulating package 2A and each second insulating particle 22B of the second insulating package 2B can have the same insulating material or different insulating materials. Further, the material of the first insulating colloid 21A of each first insulating package 2A can be silicone, epoxy or any kind of insulating material, and the material of each first insulating particle 22A of each first insulating package 2A can be silicon dioxide (SiO2), aluminum oxide (Al2O3) or any kind of oxide. In addition, the material of the second insulating colloid 21B of the second insulating package 2B can be silica gel, epoxy resin or any kind of insulating material, and the material of each second insulating particle 22B of the second insulating package 2B can be silicon dioxide, aluminum oxide or any kind of oxide. Figure 2 As shown, when the plurality of capacitor structures 10 of the capacitor assembly 1 are pre-stacked on the electrode assembly 3 that has not been bent, the plurality of second portions 100B of the plurality of metal foils 100 of the plurality of capacitor structures 10 are bent and stacked on the electrode assembly 3 that has not been bent. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0036] In addition, if Figure 3As shown, the electrode assembly 3 includes a first electrode structure 31 and a second electrode structure 32, the first electrode structure 31 can cooperate with the second insulating package 2B and be electrically connected to the positive electrode portion P of the capacitor structure 10, and the second electrode structure 32 can cooperate with the second insulating package 2B and be electrically connected to the negative electrode portion N of the capacitor structure 10. For example, in one feasible or preferred embodiment, the electrode assembly 3 can be a conductive pin assembly (lead frame assembly). Further, when the electrode assembly 3 is a conductive pin assembly, the first electrode structure 31 of the electrode assembly 3 includes a first embedded portion 311 covered by the second insulating package 2B and a first exposed portion 312 connected to the first embedded portion 311 and exposed outside the second insulating package 2B, the first embedded portion 311 of the first electrode structure 31 (can be through a conductive material) is electrically connected to the positive electrode portion P of the capacitor structure 10, and the first exposed portion 312 of the first electrode structure 31 extends along the outer surface of the second insulating package 2B. In addition, when the electrode assembly 3 is a conductive pin assembly, the second electrode structure 32 of the electrode assembly 3 includes a second embedded portion 321 covered by the second insulating package 2B and a second exposed portion 322 connected to the second embedded portion 321 and exposed outside the second insulating package 2B, the second embedded portion 321 of the second electrode structure 32 (may be through a conductive material) is electrically connected to the negative electrode portion N of the capacitor structure 10, and the second exposed portion 322 of the second electrode structure 32 extends along the outer surface of the second insulating package 2B. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0037] Thus, since the plurality of first insulating encapsulation bodies 2A can be configured to respectively fill the plurality of stacking gaps 1000 of the capacitor assembly 1, the capacitor assembly encapsulation structure S provided by the present invention can be used to reduce the percentage of the plurality of pores V or voids formed in each stacking gap 1000 of the capacitor assembly 1. For example, in one feasible or preferred embodiment, the filling rate of each stacking gap 1000 of the capacitor assembly 1 filled by the corresponding first insulating encapsulation body 2A can be approximately between 85% and 95% (for example, it can be any integer approximately between 85% and 95%). In other words, the percentage of the plurality of pores V formed in each stacking gap 1000 of the capacitor assembly 1 can be reduced to between approximately 5% and 15% (for example, the percentage of the plurality of pores V can be reduced to any integer approximately between 5% and 15%, or the percentage of the plurality of pores V can also be reduced to less than 5%, for example, it can be any integer approximately between 0% and 5%). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0038] [Second embodiment]

[0039] See also Figure 4 and Figure 5 As shown, the second embodiment of the present invention provides a capacitor assembly packaging structure S, which includes: a capacitor assembly 1, a plurality of first insulating packaging bodies 2A, a second insulating packaging body 2B and an electrode assembly 3. Figure 4 and Figure 2 comparison, and Figure 5 and Figure 3 It can be seen from the comparison that the main difference between the second embodiment of the present invention and the first embodiment is that in the second embodiment, the electrode assembly 3 can be a lateral terminal assembly, and the multiple second parts 100B of the multiple metal foils 100 of the multiple capacitor structures 10 are separated from each other.

[0040] More specifically, when the electrode assembly 3 is a side-end electrode assembly, the first electrode structure 31 of the electrode assembly 3 includes a first internal conductive layer 313 configured to cover a first side end 201B of the second insulating package 2B and electrically connected to the positive electrode portion P of the capacitor structure 10, a first intermediate conductive layer 314 configured to cover the first internal conductive layer 313, and a first external conductive layer 315 configured to cover the first intermediate conductive layer 314. In addition, when the electrode assembly 3 is a side-end electrode assembly, the second electrode structure 32 of the electrode assembly 3 includes a second internal conductive layer 323 configured to cover a second side end 202B of the second insulating package 2B and electrically connected to the negative electrode portion N of the capacitor structure 10, a second intermediate conductive layer 324 configured to cover the second internal conductive layer 323, and a second external conductive layer 325 configured to cover the second intermediate conductive layer 324. For example, the first inner conductive layer 313 may be one of an Ag layer and a Cu layer, the first intermediate conductive layer 314 may be a Ni layer, and the first outer conductive layer 315 may be a Sn layer. In addition, the second inner conductive layer 323 may be one of an Ag layer and a Cu layer, the second intermediate conductive layer 324 may be a Ni layer, and the second outer conductive layer 325 may be a Sn layer. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0041] [Third embodiment]

[0042] See also Figure 6 and Figure 7 As shown, the third embodiment of the present invention provides a capacitor assembly packaging structure S, which includes: a capacitor assembly 1, a plurality of first insulating packaging bodies 2A, a second insulating packaging body 2B and an electrode assembly 3. Figure 6 and Figure 4comparison, and Figure 7 and Figure 5 From the comparison, it can be seen that the main difference between the third embodiment of the present invention and the second embodiment is that: in the third embodiment, when the electrode assembly 3 can be a side-end electrode assembly, multiple capacitor structures 10 can be pre-supported by a conductive supporting substrate 33, and the negative electrode portion N of the capacitor structure 10 can be electrically connected to the second electrode structure 32 of the electrode assembly 3 through the conductive supporting substrate 33.

[0043] [Fourth embodiment]

[0044] See also Figure 8 As shown, the fourth embodiment of the present invention provides a capacitor structure packaging method, the capacitor structure packaging method comprises: first, cooperate with Figure 1 , Figure 2 (or Figure 4 ,or Figure 6 )and Figure 8 As shown, a capacitor assembly 1 is provided, the capacitor assembly 1 includes a plurality of capacitor structures 10 stacked and electrically connected to each other, each capacitor structure 10 has a positive electrode portion P and a negative electrode portion N, and the capacitor assembly 1 has a plurality of stacking gaps 1000, each stacking gap 1000 is correspondingly formed between two adjacent capacitor structures 10 (step S100); then, Figure 2 (or Figure 4 ,or Figure 6 )and Figure 8 As shown, a plurality of first insulating packages 2A are formed to be respectively accommodated in a plurality of stacking gaps 1000 of the capacitor assembly 1 (step S102); then, Figure 3 (or Figure 5 ,or Figure 7 )and Figure 8 As shown, a second insulating package 2B is formed to cover the first insulating packages 2A and the capacitor structures 10 (step S104). It is worth noting that the solid content of each first insulating package 2A is less than the solid content of the second insulating package 2B.

[0045] For example, with Figure 2 and Figure 3 As shown, in step S100 of providing a capacitor assembly 1, a plurality of capacitor structures 10 may be pre-stacked and arranged on an electrode assembly 3, but Figure 4 The electrode assembly 3 shown has not yet been bent into Figure 5 The electrode assembly 3 is shown. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0046] For example, with Figure 4 and Figure 5As shown, after step S104 of forming the second insulating package 2B, an electrode assembly 3 (including a first electrode structure 31 and a second electrode structure 32) and the second insulating package 2B can cooperate with each other to be electrically connected to the capacitor assembly 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0047] For example, with Figure 6 and Figure 7 As shown, in step S100 of providing the capacitor assembly 1, a plurality of capacitor structures 10 may be pre-supported by a conductive carrier substrate 33, and the negative electrode portion N of the capacitor structure 10 may be electrically connected to the second electrode structure 32 of the electrode assembly 3 through the conductive carrier substrate 33. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0048] By this, Figure 3 , Figure 5 or Figure 7 As shown, since the plurality of first insulating encapsulation bodies 2A can be configured to respectively fill the plurality of stacking gaps 1000 of the capacitor assembly 1, the capacitor assembly encapsulation structure S provided by the present invention can be used to reduce the percentage of the plurality of pores V or voids formed in each stacking gap 1000 of the capacitor assembly 1. For example, in one feasible or preferred embodiment, the filling rate of each stacking gap 1000 of the capacitor assembly 1 filled by the corresponding first insulating encapsulation body 2A can be approximately between 85% and 95% (for example, it can be any integer approximately between 85% and 95%). In other words, the percentage of the plurality of pores V formed in each stacking gap 1000 of the capacitor assembly 1 can be reduced to between approximately 5% and 15% (for example, the percentage of the plurality of pores V can be reduced to any integer approximately between 5% and 15%, or the percentage of the plurality of pores V can also be reduced to less than 5%, for example, it can be any integer approximately between 0% and 5%). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0049] [Fifth embodiment]

[0050] See also Fig. 9 As shown, the fifth embodiment of the present invention provides an electronic device E, which can use any capacitor assembly packaging structure S (such as Figure 3 , Figure 5 or Figure 7As shown). For example, the electronic device E may be a portable electronic device (such as a desktop computer, a laptop computer or a tablet computer) or a mobile device (such as a car, a ship, an airplane or any other means of transportation). However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0051] [Beneficial Effects of Embodiments]

[0052] One of the beneficial effects of the present invention is that the capacitor assembly packaging structure S provided by the present invention can reduce the volume of each stack formed in the capacitor assembly 1 by the technical solutions of "a plurality of first insulating packaging bodies 2A are configured to be respectively accommodated in a plurality of stacking gaps 1000 of the capacitor assembly 1", "a second insulating packaging body 2B is configured to cover a plurality of first insulating packaging bodies 2A and a plurality of capacitor structures 10", "the solid content of each first insulating packaging body 2A is less than the solid content of the second insulating packaging body 2B", and "the total volume of the plurality of first insulating packaging bodies 2A is less than the volume of the second insulating packaging body 2B". The percentage of the multiple pores V within the stack gap 1000 (that is, reducing the structural defect rate or structural defect caused by the multiple pores V) can improve the structural stability of the capacitor component packaging structure S (for example, improving the seismic resistance of the multiple capacitor structures 10 of the capacitor component packaging structure S, so that the electrical characteristics of the capacitor component packaging structure S provided by the present invention are not easily affected by vibration and thus reduced), and can prevent excessive moisture from accumulating in the pores V, thereby reducing the probability of structural cracking of the capacitor component packaging structure S during reflow.

[0053] Another beneficial effect of the present invention is that the capacitor structure packaging method provided by the present invention can reduce the volume of each stack formed in the capacitor assembly 1 by the technical solutions of "forming a plurality of first insulating packaging bodies 2A for being respectively accommodated in a plurality of stacking gaps 1000 of the capacitor assembly 1", "forming a second insulating packaging body 2B for covering the plurality of first insulating packaging bodies 2A and the plurality of capacitor structures 10", "the solid content of each first insulating packaging body 2A is less than the solid content of the second insulating packaging body 2B", and "the total volume of the plurality of first insulating packaging bodies 2A is less than the volume of the second insulating packaging body 2B". The percentage of the multiple pores V within the stack gap 1000 (that is, reducing the structural defect rate or structural defect caused by the multiple pores V) can improve the structural stability of the capacitor component packaging structure S (for example, improving the seismic resistance of the multiple capacitor structures 10 of the capacitor component packaging structure S, so that the electrical characteristics of the capacitor component packaging structure S provided by the present invention are not easily affected by vibration and thus reduced), and can prevent excessive moisture from accumulating in the pores V, thereby reducing the probability of structural cracking of the capacitor component packaging structure S during reflow.

[0054] Another beneficial effect of the present invention is that the electronic device using the capacitor assembly packaging structure S provided by the present invention can reduce the volume formed in the capacitor assembly 1 through the technical solutions of "a plurality of first insulating packaging bodies 2A are configured to be respectively accommodated in a plurality of stacking gaps 1000 of the capacitor assembly 1", "a second insulating packaging body 2B is configured to cover a plurality of first insulating packaging bodies 2A and a plurality of capacitor structures 10", "the solid content of each first insulating packaging body 2A is less than the solid content of the second insulating packaging body 2B", and "the total volume of the plurality of first insulating packaging bodies 2A is less than the volume of the second insulating packaging body 2B". The percentage of the multiple pores V in each stacking gap 1000 is reduced (that is, the structural defect rate or structural defect caused by the multiple pores V is reduced), thereby improving the structural stability of the capacitor component packaging structure S (for example, improving the seismic resistance of the multiple capacitor structures 10 of the capacitor component packaging structure S, so that the electrical characteristics of the capacitor component packaging structure S provided by the present invention are not easily affected by vibration and thus degraded), and excessive moisture can be prevented from accumulating in the pores V, thereby reducing the probability of structural cracking of the capacitor component packaging structure S during reflow.

[0055] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A capacitor assembly packaging structure, characterized in that: The capacitor assembly packaging structure comprises: A capacitor assembly, the capacitor assembly comprising a plurality of capacitor structures stacked and electrically connected to each other, each of the capacitor structures having a positive electrode portion and a negative electrode portion, the capacitor assembly having a plurality of stacking gaps, each of the stacking gaps being correspondingly formed between two adjacent capacitor structures; a plurality of first insulating packaging bodies, wherein the plurality of first insulating packaging bodies are configured to be respectively accommodated in a plurality of the stacking gaps of the capacitor assembly; a second insulating package, the second insulating package being configured to enclose a plurality of the first insulating packages and a plurality of the capacitor structures; and an electrode assembly, the electrode assembly comprising a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; wherein the solid content of each of the first insulating packaging bodies is less than the solid content of the second insulating packaging body; Wherein, the total volume of the plurality of first insulating packaging bodies is smaller than the volume of the second insulating packaging body; Wherein, each of the first insulating packaging body and the second insulating packaging body has the same or different insulating materials.

2. The capacitor assembly packaging structure according to claim 1, characterized in that: in, Each of the capacitor structures comprises a metal foil, an insulating limiting layer circumferentially arranged on a first portion of the metal foil, a conductive polymer layer for coating the first portion of the metal foil and contacting the insulating limiting layer, a carbon glue layer for coating the conductive polymer layer and contacting the insulating limiting layer, and a silver glue layer for coating the carbon glue layer and contacting the insulating limiting layer; Wherein, a second portion of the metal foil of each of the capacitor structures is not covered by the insulating limiting layer, and a plurality of the second portions of a plurality of the metal foils of a plurality of the capacitor structures are stacked or separated from each other; wherein the solid content of each of the first insulating packages is between 5% and 79%, and the solid content of each of the second insulating packages is between 80% and 95%; Wherein, the plurality of first insulating packaging bodies have the same insulating material, and the plurality of first insulating packaging bodies have the same solid content; Each of the first insulating packages includes a first insulating colloid and a plurality of first insulating particles mixed in the first insulating colloid, and each of the second insulating packages includes a second insulating colloid and a plurality of second insulating particles mixed in the second insulating colloid; Wherein, the material of the first insulating colloid of each of the first insulating packaging bodies is silica gel or epoxy resin, and the material of each of the first insulating particles of each of the first insulating packaging bodies is silicon dioxide or aluminum oxide; Wherein, the material of the second insulating colloid of the second insulating package is silica gel or epoxy resin, and the material of each of the second insulating particles of the second insulating package is silicon dioxide or aluminum oxide; wherein the density of the first insulating particles in each of the first insulating packages is smaller than the density of the second insulating particles in the second insulating packages; The first insulating colloid of each first insulating package and the second insulating colloid of the second insulating package have the same insulating material or different insulating materials, and each of the first insulating particles of each first insulating package and each of the second insulating particles of the second insulating package have the same insulating material or different insulating materials; wherein the plurality of first insulating packaging bodies are configured to respectively fill the plurality of stacking gaps of the capacitor assembly, thereby reducing the percentage of a plurality of air holes formed in each of the stacking gaps of the capacitor assembly; The filling rate of each stacking gap of the capacitor assembly filled by the corresponding first insulating packaging body is between 85% and 95%.

3. The capacitor assembly packaging structure according to claim 1, characterized in that: in, The electrode assembly is a conductive pin assembly or a side end electrode assembly; Wherein, when the electrode assembly is the conductive pin assembly, the first electrode structure of the electrode assembly includes a first embedded portion covered by the second insulating package and a first exposed portion connected to the first embedded portion and exposed outside the second insulating package, the first embedded portion of the first electrode structure is electrically connected to the positive electrode portion of the capacitor structure, and the first exposed portion of the first electrode structure extends along the outer surface of the second insulating package; Wherein, when the electrode assembly is the conductive pin assembly, the second electrode structure of the electrode assembly includes a second embedded portion covered by the second insulating package and a second exposed portion connected to the second embedded portion and exposed outside the second insulating package, the second embedded portion of the second electrode structure is electrically connected to the negative electrode portion of the capacitor structure, and the second exposed portion of the second electrode structure extends along the outer surface of the second insulating package; Wherein, when the electrode assembly is the side end electrode assembly, the first electrode structure of the electrode assembly includes a first internal conductive layer configured to cover a first side end of the second insulating package and electrically connected to the positive electrode portion of the capacitor structure, a first intermediate conductive layer configured to cover the first internal conductive layer, and a first external conductive layer configured to cover the first intermediate conductive layer, the first internal conductive layer is one of an Ag layer and a Cu layer, the first intermediate conductive layer is a Ni layer, and the first external conductive layer is a Sn layer; Wherein, when the electrode assembly is the side end electrode assembly, the second electrode structure of the electrode assembly includes a second inner conductive layer configured to cover a second side end of the second insulating package and electrically connected to the negative electrode portion of the capacitor structure, a second middle conductive layer configured to cover the second inner conductive layer, and a second outer conductive layer configured to cover the second middle conductive layer, the second inner conductive layer is one of an Ag layer and a Cu layer, the second middle conductive layer is a Ni layer, and the second outer conductive layer is a Sn layer; Wherein, when the electrode assembly is the side electrode assembly, the plurality of capacitor structures are supported by a conductive supporting substrate, and the negative electrode portion of the capacitor structure is electrically connected to the second electrode structure of the electrode assembly through the conductive supporting substrate.

4. A capacitor structure packaging method, characterized in that: The capacitor structure packaging method comprises: A capacitor assembly is provided, the capacitor assembly comprising a plurality of capacitor structures stacked and electrically connected to each other, each of the capacitor structures having a positive electrode portion and a negative electrode portion, the capacitor assembly having a plurality of stacking gaps, each of the stacking gaps being correspondingly formed between two adjacent capacitor structures; forming a plurality of first insulating packaging bodies for being respectively accommodated in a plurality of the stacking gaps of the capacitor assembly; and forming a second insulating package body for encapsulating a plurality of the first insulating packages and a plurality of the capacitor structures; wherein the solid content of each of the first insulating packaging bodies is less than the solid content of the second insulating packaging body; Wherein, the total volume of the plurality of first insulating packaging bodies is smaller than the volume of the second insulating packaging body; Wherein, each of the first insulating packaging body and the second insulating packaging body has the same or different insulating materials.

5. The capacitor structure packaging method according to claim 4, characterized in that: in, In the step of providing the capacitor assembly, a plurality of the capacitor structures are stacked and arranged on an electrode assembly; The electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; The first electrode structure of the electrode assembly includes a first embedded portion covered by the second insulating package and a first exposed portion connected to the first embedded portion and exposed outside the second insulating package, the first embedded portion of the first electrode structure is electrically connected to the positive electrode portion of the capacitor structure, and the first exposed portion of the first electrode structure extends along the outer surface of the second insulating package; In which, the second electrode structure of the electrode assembly includes a second embedded portion covered by the second insulating packaging body and a second exposed portion connected to the second embedded portion and exposed outside the second insulating packaging body, the second embedded portion of the second electrode structure is electrically connected to the negative electrode portion of the capacitor structure, and the second exposed portion of the second electrode structure extends along the outer surface of the second insulating packaging body.

6. The capacitor structure packaging method according to claim 4, characterized in that: in, After the step of forming the second insulating package, an electrode assembly cooperates with the second insulating package to be electrically connected to the capacitor assembly; The electrode assembly includes a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, and the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; The first electrode structure of the electrode assembly includes a first inner conductive layer configured to cover a first side end of the second insulating package and electrically connected to the positive electrode portion of the capacitor structure, a first middle conductive layer configured to cover the first inner conductive layer, and a first outer conductive layer configured to cover the first middle conductive layer, the first inner conductive layer is one of an Ag layer and a Cu layer, the first middle conductive layer is a Ni layer, and the first outer conductive layer is a Sn layer; The second electrode structure of the electrode assembly includes a second inner conductive layer configured to cover a second side end of the second insulating package and electrically connected to the negative electrode portion of the capacitor structure, a second middle conductive layer configured to cover the second inner conductive layer, and a second outer conductive layer configured to cover the second middle conductive layer, the second inner conductive layer is one of an Ag layer and a Cu layer, the second middle conductive layer is a Ni layer, and the second outer conductive layer is a Sn layer; In the step of providing the capacitor assembly, the plurality of capacitor structures are carried by a conductive carrier substrate, and the negative electrode portion of the capacitor structure is electrically connected to the second electrode structure of the electrode assembly through the conductive carrier substrate.

7. The capacitor structure packaging method according to claim 4, characterized in that: in, Each of the capacitor structures comprises a metal foil, an insulating limiting layer circumferentially arranged on a first portion of the metal foil, a conductive polymer layer for coating the first portion of the metal foil and contacting the insulating limiting layer, a carbon glue layer for coating the conductive polymer layer and contacting the insulating limiting layer, and a silver glue layer for coating the carbon glue layer and contacting the insulating limiting layer; Wherein, a second portion of the metal foil of each capacitor structure is not covered by the insulating limiting layer, and a plurality of the second portions of a plurality of the metal foils of a plurality of the capacitor structures are stacked or separated from each other; wherein the solid content of each of the first insulating packages is between 5% and 79%, and the solid content of each of the second insulating packages is between 80% and 95%; Wherein, the plurality of first insulating packaging bodies have the same insulating material, and the plurality of first insulating packaging bodies have the same solid content; Each of the first insulating packages includes a first insulating colloid and a plurality of first insulating particles mixed in the first insulating colloid, and each of the second insulating packages includes a second insulating colloid and a plurality of second insulating particles mixed in the second insulating colloid; Wherein, the material of the first insulating colloid of each of the first insulating packaging bodies is silica gel or epoxy resin, and the material of each of the first insulating particles of each of the first insulating packaging bodies is silicon dioxide or aluminum oxide; Wherein, the material of the second insulating colloid of the second insulating package is silica gel or epoxy resin, and the material of each of the second insulating particles of the second insulating package is silicon dioxide or aluminum oxide; wherein the density of the first insulating particles in each of the first insulating packages is smaller than the density of the second insulating particles in the second insulating packages; The first insulating colloid of each first insulating package and the second insulating colloid of the second insulating package have the same insulating material or different insulating materials, and each of the first insulating particles of each first insulating package and each of the second insulating particles of the second insulating package have the same insulating material or different insulating materials; wherein the plurality of first insulating packaging bodies are configured to respectively fill the plurality of stacking gaps of the capacitor assembly, thereby reducing the percentage of a plurality of air holes formed in each of the stacking gaps of the capacitor assembly; The filling rate of each stacking gap of the capacitor assembly filled by the corresponding first insulating packaging body is between 85% and 95%.

8. An electronic device, wherein the electronic device uses a capacitor assembly packaging structure, characterized in that: The capacitor assembly packaging structure comprises: A capacitor assembly, the capacitor assembly comprising a plurality of capacitor structures stacked and electrically connected to each other, each of the capacitor structures having a positive electrode portion and a negative electrode portion, the capacitor assembly having a plurality of stacking gaps, each of the stacking gaps being correspondingly formed between two adjacent capacitor structures; a plurality of first insulating packaging bodies, wherein the plurality of first insulating packaging bodies are configured to be respectively accommodated in a plurality of the stacking gaps of the capacitor assembly; a second insulating package, the second insulating package being configured to enclose a plurality of the first insulating packages and a plurality of the capacitor structures; and an electrode assembly, the electrode assembly comprising a first electrode structure and a second electrode structure, the first electrode structure and the second insulating package body cooperate with each other and are electrically connected to the positive electrode portion of the capacitor structure, the second electrode structure and the second insulating package body cooperate with each other and are electrically connected to the negative electrode portion of the capacitor structure; wherein the solid content of each of the first insulating packaging bodies is less than the solid content of the second insulating packaging body; Wherein, the total volume of the plurality of first insulating packaging bodies is smaller than the volume of the second insulating packaging body; Wherein, each of the first insulating packaging body and the second insulating packaging body has the same or different insulating materials.

9. The electronic device according to claim 8, characterized in that: in, Each of the capacitor structures comprises a metal foil, an insulating limiting layer circumferentially arranged on a first portion of the metal foil, a conductive polymer layer for coating the first portion of the metal foil and contacting the insulating limiting layer, a carbon glue layer for coating the conductive polymer layer and contacting the insulating limiting layer, and a silver glue layer for coating the carbon glue layer and contacting the insulating limiting layer; Wherein, a second portion of the metal foil of each of the capacitor structures is not covered by the insulating limiting layer, and a plurality of the second portions of a plurality of the metal foils of a plurality of the capacitor structures are stacked or separated from each other; wherein the solid content of each of the first insulating packages is between 5% and 79%, and the solid content of each of the second insulating packages is between 80% and 95%; Wherein, the plurality of first insulating packaging bodies have the same insulating material, and the plurality of first insulating packaging bodies have the same solid content; Each of the first insulating packages includes a first insulating colloid and a plurality of first insulating particles mixed in the first insulating colloid, and each of the second insulating packages includes a second insulating colloid and a plurality of second insulating particles mixed in the second insulating colloid; Wherein, the material of the first insulating colloid of each of the first insulating packaging bodies is silica gel or epoxy resin, and the material of each of the first insulating particles of each of the first insulating packaging bodies is silicon dioxide or aluminum oxide; Wherein, the material of the second insulating colloid of the second insulating package is silica gel or epoxy resin, and the material of each of the second insulating particles of the second insulating package is silicon dioxide or aluminum oxide; wherein the density of the first insulating particles in each of the first insulating packages is smaller than the density of the second insulating particles in the second insulating packages; The first insulating colloid of each first insulating package and the second insulating colloid of the second insulating package have the same insulating material or different insulating materials, and each of the first insulating particles of each first insulating package and each of the second insulating particles of the second insulating package have the same insulating material or different insulating materials; wherein the plurality of first insulating packaging bodies are configured to respectively fill the plurality of stacking gaps of the capacitor assembly, thereby reducing the percentage of a plurality of air holes formed in each of the stacking gaps of the capacitor assembly; The filling rate of each stacking gap of the capacitor assembly filled by the corresponding first insulating packaging body is between 85% and 95%.

10. The electronic device according to claim 8, characterized in that: in, The electrode assembly is a conductive pin assembly or a side end electrode assembly; Wherein, when the electrode assembly is the conductive pin assembly, the first electrode structure of the electrode assembly includes a first embedded portion covered by the second insulating package and a first exposed portion connected to the first embedded portion and exposed outside the second insulating package, the first embedded portion of the first electrode structure is electrically connected to the positive electrode portion of the capacitor structure, and the first exposed portion of the first electrode structure extends along the outer surface of the second insulating package; Wherein, when the electrode assembly is the conductive pin assembly, the second electrode structure of the electrode assembly includes a second embedded portion covered by the second insulating package and a second exposed portion connected to the second embedded portion and exposed outside the second insulating package, the second embedded portion of the second electrode structure is electrically connected to the negative electrode portion of the capacitor structure, and the second exposed portion of the second electrode structure extends along the outer surface of the second insulating package; Wherein, when the electrode assembly is the side end electrode assembly, the first electrode structure of the electrode assembly includes a first internal conductive layer configured to cover a first side end of the second insulating package and electrically connected to the positive electrode portion of the capacitor structure, a first intermediate conductive layer configured to cover the first internal conductive layer, and a first external conductive layer configured to cover the first intermediate conductive layer, the first internal conductive layer is one of an Ag layer and a Cu layer, the first intermediate conductive layer is a Ni layer, and the first external conductive layer is a Sn layer; Wherein, when the electrode assembly is the side end electrode assembly, the second electrode structure of the electrode assembly includes a second inner conductive layer configured to cover a second side end of the second insulating package and electrically connected to the negative electrode portion of the capacitor structure, a second middle conductive layer configured to cover the second inner conductive layer, and a second outer conductive layer configured to cover the second middle conductive layer, the second inner conductive layer is one of an Ag layer and a Cu layer, the second middle conductive layer is a Ni layer, and the second outer conductive layer is a Sn layer; Wherein, when the electrode assembly is the side electrode assembly, the plurality of capacitor structures are supported by a conductive supporting substrate, and the negative electrode portion of the capacitor structure is electrically connected to the second electrode structure of the electrode assembly through the conductive supporting substrate.

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