Double-sided edge sealing method for substrate

Abstract

A method for double-sided edge sealing of a substrate involves using a first carrier and a second carrier of a double-sided edge sealing fixture to clamp a substrate with a stacked structure, thereby simultaneously heating both sides of the substrate. This shortens processing time and increases production capacity, while ensuring that the processing positions on both sides of the substrate correspond, thus improving processing accuracy.

Description

Technical Field

[0001] This invention relates to an edge-sealing technology, and more particularly to a method for double-sided edge-sealing of a substrate. Background Technology

[0002] Currently, there are many types and forms of semiconductor packages. For example, it is known that circuitry can be fabricated on substrates with a multilayer structure. As a carrier board for the circuitry, a multilayer substrate includes, for example, a core layer, carrier layers formed on both sides of the core layer, and functional layers formed on both sides of the carrier layers. If delamination occurs between the layers of this substrate, it may penetrate into the gaps between the layers during wet processing (e.g., copper plating), leading to product reliability issues. Therefore, to avoid delamination and gaps between the layers of this substrate, the outer periphery of the substrate is typically heated and the edges are sealed before circuitry fabrication. This ensures a secure bond between the layers and prevents foreign matter from entering through the edges of the substrate.

[0003] In related technologies, laser processing (such as carbon dioxide laser) can be used to ablate the edges of the substrate, thereby bonding the layers of the substrate together. However, laser processing methods suffer from short equipment lifespans and insufficient precision; for example, the precision of laser processing can only reach approximately + / - 75 μm.

[0004] Furthermore, the laser takes a long time to heat the substrate along a trajectory, and it can only process one side of the substrate at a time. This means that one side must be processed before flipping the substrate to process the other side. This increases the processing time, potentially exceeding 100 seconds in total. Moreover, when flipping the substrate after processing one side, the substrate's position may shift, causing the processing positions on the two sides to misalign.

[0005] In addition, the processing width of laser processing may be less than 30um. In order to ensure that the layers of the substrate are properly bonded and do not easily separate, more than one laser processing may be required to strengthen the bonding between the layers. This will further increase the processing time and occupy more of the substrate space, thus compressing the space for subsequent circuit fabrication.

[0006] Therefore, overcoming the various problems of the existing technologies has become an urgent issue to be addressed. Summary of the Invention

[0007] In view of the various deficiencies of the prior art, the present invention provides a method for double-sided edge sealing of a substrate, comprising: providing a double-sided edge sealing fixture including a first carrier and a second carrier, wherein the first carrier has a first body and a first heating head disposed on the first body, and the second carrier is disposed above the first carrier and has a second body and a second heating head disposed on the second body; placing a substrate having a stacked structure between the first carrier and the second carrier of the double-sided edge sealing fixture, such that the first carrier carries the substrate and aligns the substrate with the first heating head of the first carrier; moving the second carrier toward the first carrier such that the second heating head of the second carrier contacts the substrate, wherein the second heating head and the first heating head face each other and are corresponding in position; and heating the substrate by means of the first heating head and the second heating head.

[0008] In one specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the first heating head and the second heating head simultaneously heat the opposite first and second sides of the substrate.

[0009] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the first heating head is disposed around the outer periphery of the first body, and the second heating head is also disposed around the outer periphery of the second body. That is, the first heating head and the second heating head are continuously formed corresponding to the outer periphery of the substrate, surrounding the functional area of ​​the substrate.

[0010] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the heating of the substrate by the first heating head and the second heating head is completed simultaneously on both sides and in one go.

[0011] In one specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the second carrier applies pressure to the substrate while it is being heated.

[0012] In one specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the first heating head and the second heating head are connected to a circuit and form a loop with the substrate, so as to heat the substrate by passing current through the substrate.

[0013] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the first body has a first groove, the first heating head is disposed in the first groove and protrudes from the first groove onto the surface of the first body, and the second body has a second groove, the second heating head is disposed in the second groove and protrudes from the second groove onto the surface of the second body.

[0014] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the depth of the first groove and the second groove is 2 to 7 mm.

[0015] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the height of the first heating head and the second heating head protruding from the surface of the first body and the surface of the second body, respectively, is 0.1 to 0.5 mm.

[0016] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the first heating head is formed as a pointed shape that gradually narrows in width as it extends outward from the first groove, and the second heating head is formed as a pointed shape that gradually narrows in width as it extends outward from the second groove.

[0017] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the width of the tips of the first heating head and the second heating head is 0.5 to 1 mm.

[0018] In one specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the first heating head and the second heating head are made of cast iron or a thermally conductive material of carbide. In one specific embodiment, the carbide is tungsten carbide.

[0019] In a specific embodiment of the aforementioned double-sided edge sealing method for the substrate, the surfaces of the first body and the second body are subjected to hard anodizing treatment.

[0020] As can be seen from the above, the double-sided edge sealing method of the substrate of the present invention mainly involves using a first carrier and a second carrier to clamp both sides of the substrate with a stacked structure to process the substrate. Since the first heating head of the first carrier and the second heating head of the second carrier are facing each other and their positions correspond, both sides of the substrate can be heated simultaneously. Therefore, compared with the prior art, the double-sided edge sealing fixture of the present invention can shorten the processing time and increase the production capacity, and can ensure that the processing positions on both sides of the substrate correspond, thereby improving the processing accuracy. Attached Figure Description

[0021] Figure 1 This is a cross-sectional schematic diagram of the substrate of the present invention.

[0022] Figure 2 This is a three-dimensional schematic diagram of the double-sided edge-sealing fixture of the present invention.

[0023] Figure 3A This is a cross-sectional schematic diagram of the double-sided edge-sealing tool of the present invention processing the substrate.

[0024] Figure 3B This is a cross-sectional schematic diagram showing that an electric cylinder is provided at the bottom of the first heating head of the double-sided sealing fixture of the present invention.

[0025] Figure 4 for Figure 3A A magnified view of a portion of the image.

[0026] Figure 5 for Figure 3AA top view of the substrate after processing.

[0027] The reference numerals in the attached figures are explained as follows:

[0028] 1: Double-sided edge banding fixture

[0029] 10: First Vehicle

[0030] 11: The first ontology

[0031] 12: First heating head

[0032] 13: First groove

[0033] 20: Second vehicle

[0034] 21: The Second Body

[0035] 22: Second heating head

[0036] 23: Second groove

[0037] 24: Mobile organization

[0038] 25: Electric cylinder

[0039] 251: Power pipe

[0040] 30: Substrate

[0041] 30a: First side

[0042] 30b: Second side

[0043] 31: Core Layer

[0044] 32: Carrier layer

[0045] 33: Functional Layer

[0046] A: Functional Area

[0047] B: Non-functional area

[0048] D: Distance

[0049] D1, D2: Depth

[0050] H1, H2: Height

[0051] P: Processing location

[0052] W1, W2, W3, W4: Width. Detailed Implementation

[0053] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0054] It should be understood that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the present invention, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0055] Figure 1 This is a cross-sectional schematic diagram of the substrate of the present invention. Figure 2 This is a three-dimensional schematic diagram of the double-sided edge-sealing fixture of the present invention. Figure 3A This is a cross-sectional schematic diagram of the double-sided edge-sealing fixture of the present invention processing the substrate. First, please refer to... Figures 1 to 3A In the double-sided edge sealing method of the substrate shown in this embodiment, the double-sided edge sealing fixture 1 is used to process the substrate 30 with a stacked structure so that the edge layers of the substrate 30 are joined together to seal its interior.

[0056] The substrate 30 may be a carrier board for fabricating circuits, and the substrate 30 may have a core layer 31, with a carrier layer 32 and a functional layer 33 sequentially formed on opposite sides of the core layer 31. That is, the substrate 30 may have a stacked structure consisting of five layers in sequence: functional layer 33, carrier layer 32, core layer 31, carrier layer 32, and functional layer 33. It should be understood that although the substrate 30 is shown here to have a five-layer stacked structure, the present invention is not limited thereto, and in other embodiments, the substrate 30 may also have a non-five-layer stacked structure, which can be adjusted as needed.

[0057] In this embodiment, the core layer 31 can be an organic polymer substrate such as bis(cis-butenediamide) / triazine (BT) or a copper foil substrate, and the carrier layer 32 can be a metal layer of a copper layer (or copper foil), and the functional layer 33 can be another metal layer of a copper layer (or copper foil). The thickness of the carrier layer 32 can be 18 μm, and the thickness of the functional layer 33 can be 5 μm. After double-sided edge sealing of the substrate 30, the layers at the heated areas of the substrate 30 can be made to melt or become plastic, thereby bonding them together.

[0058] The double-sided edge-sealing fixture 1 includes a first carrier 10 and a second carrier 20. The second carrier 20 is disposed above the first carrier 10 and spaced apart from the first carrier 10, so that a substrate 30 can be placed between the first carrier 10 and the second carrier 20. By adjusting the distance between the first carrier 10 and the second carrier 20, the first carrier 10 and the second carrier 20 can clamp the opposite first side 30a and second side 30b of the substrate 30 (e.g., ...). Figure 3A (as shown), and the first side 30a and the second side 30b of the substrate 30 can be heated simultaneously.

[0059] In this embodiment, the first carrier 10 has: a first body 11, a first groove 13 recessed in the first body 11, and a first heating head 12 disposed in the first groove 13 and protruding from the first groove 13 onto the surface of the first body 11.

[0060] The first body 11 may be made of an insulating material with a heat-resistant and deformation-resistant surface treatment to ensure that it will not deform due to long-term use, resulting in delamination during hot pressing. The surface treatment is, for example, hard anodizing, but the present invention is not limited to the above, as long as the first body 11 is not deformed due to long-term use.

[0061] The first heating head 12 can be made of a high thermal conductivity material such as cast iron or carbides, for example, tungsten carbide, which has high temperature resistance, high hardness, good thermal conductivity and anti-oxidation properties, thus facilitating repeated contact and heating of the substrate 30 by the first heating head 12.

[0062] like Figure 2 As shown, in this embodiment, the first groove 13 is recessed around the upper surface of the outer periphery of the first body 11, corresponding to the size of the substrate 30, and is an annular groove. Correspondingly, the first heating head 12 is also arranged around the outer periphery of the first body 11. Furthermore, the first heating head 12 can be an annular heating head, or multiple heating heads can be arranged in a ring within the first groove 13 (not shown). Alignment lines or alignment structures (not shown) can be disposed on the upper surface of the first body 11. The user can place the substrate 30 on the upper surface of the first body 11 according to the alignment lines or alignment structures, so that the first heating head 12 is aligned with the processing position P of the substrate 30. The processing position P of the substrate 30 is shown in... Figure 5 This will be explained in more detail later.

[0063] Figure 4 for Figure 3A A magnified view of a portion of the image. For example... Figure 4As shown, the depth D1 of the first groove 13 is 2 to 7 mm, for example, 2, 3, 4, 5, 6, or 7 mm, and the height H1 of the first heating head 12 extending upward from the bottom of the first groove 13 and protruding from the surface of the first body 11 is 0.1 to 0.5 mm, for example, 0.1, 0.2, 0.3, 0.4, or 0.5 mm. Since the first heating head 12 is mostly embedded in the first body 11, it can be protected, reducing the possibility of damage to the first heating head 12. It should be understood that as long as the first heating head 12 can be securely mounted on the first body 11, the depth of the first groove 13 or the protrusion height of the first heating head 12, or the manner in which the first heating head 12 is positioned on the first body 11, can be changed, and is not limited to the above.

[0064] Furthermore, in this embodiment, the width W1 of the bottom of the first heating head 12 is 2 to 7 mm, for example, 2, 3, 4, 5, 6, or 7 mm, and its width gradually narrows as it extends outward from the first groove 13. The width W2 of the tip of the first heating head 12 is 0.5 to 1 mm, for example, 0.5, 0.6, 0.7, 0.8, 0.9, or 1 mm. This pointed, blade-like heating head allows the first heating head 12 to accurately contact the desired processing position P on the substrate 30 (e.g., ...). Figure 5 As shown in the figure, and at the same time, since the first heating head 12 has a wide bottom, it can be ensured that the first heating head 12 has sufficient support. It should be understood that the first heating head 12 can also be formed in other shapes or sizes, and is not limited to the above, as long as it can accurately contact the processing position P of the substrate 30 and have sufficient support.

[0065] Additionally, heat insulation can be applied above the first heating head 12, and an air-blowing cooling function can be added. Furthermore, in situations such as... Figure 3B In the illustrated configuration, at least one electric cylinder 25 can be provided at the bottom of the first heating head 12. The cylinder's power pipe 251 abuts against the bottom of the first heating head 12 to control the torque, thereby preventing uneven contact pressure caused by uneven height of the first heating head 12, which could lead to carbonization. Similarly, at least one electric cylinder can also be provided at the bottom of the second heating head 22 (described later) for torque control (figure omitted).

[0066] In this embodiment, the second carrier 20 has a structure corresponding to the first carrier 10. Specifically, the second carrier 20 may also have: a second body 21, a second groove 23 recessed in the second body 21, and a second heating head 22 disposed in the second groove 23 and protruding from the second groove 23 onto the surface of the second body 21.

[0067] Furthermore, the second body 21 can also be made of an insulating material with a surface treated for heat resistance and deformation resistance, such as hard anodizing, and the second heating head 22 can also be made of a high thermal conductivity material such as cast iron or carbides, for example, tungsten carbide. Moreover, the depth D2 of the second groove 23 can be 2 to 7 mm, for example, 2, 3, 4, 5, 6, or 7 mm; the height H2 of the second heating head 22 protruding from the surface of the second body 21 can be 0.1 to 0.5 mm, for example, 0.1, 0.2, 0.3, 0.4, or 0.5 mm; and the second heating head 22 can also be pointed with a bottom width W3 of 2 to 7 mm, for example, 2, 3, 4, 5, 6, or 7 mm, and a tip width W4 of 0.5 to 1 mm, for example, 0.5, 0.6, 0.7, 0.8, 0.9, or 1 mm. However, the present invention is not limited to this, and the material and size of the first vehicle 10 and the second vehicle 20 can also be adjusted as needed.

[0068] Furthermore, the second carrier 20 also has a moving mechanism 24 for moving the second body 21. The moving mechanism 24 can be a lifting device that allows the second body 21 to move vertically up and down relative to the first body 11. Its height can be automatically adjusted by parameters set by the control system, or it can be adjusted by the user at any time as needed. Moreover, the moving mechanism 24 allows the second carrier 20 to apply pressure to the substrate 30, thereby improving the bonding of the layers of the substrate 30, which has been heated to a molten or plastic state.

[0069] In this embodiment, the second heating head 22 on the second body 21 is configured to face each other and correspond to the first heating head 12 on the first body 11. By raising and lowering the second body 21 through the moving mechanism 24, the distance between the first heating head 12 and the second heating head 22 can be changed, and the substrate 30 can be clamped between the first heating head 12 and the second heating head 22.

[0070] In this embodiment, the first heating head 12 and the second heating head 22 are connected in a circuit to serve as two electrodes. The first heating head 12 and the second heating head 22, as the two electrodes, respectively contact the first side 30a and the second side 30b of the substrate 30 to form a circuit. This allows a high-frequency current to pass through the substrate 30, generating a resistance heating effect to heat the substrate 30 to a molten or plastic state, thereby bonding the layers of the substrate 30. It should be understood that the heating method of the present invention is not limited to the above. In other embodiments, the first heating head 12 and the second heating head 22 can also be connected to heating devices to heat the first heating head 12 and the second heating head 22 separately. Furthermore, the heating temperature of the first heating head 12 and the second heating head 22 on the substrate 30 can be adjusted as needed. This heating temperature is set to be higher than the melting point of each layer of the substrate 30, and its temperature range is, for example, 1000 to 2500°C.

[0071] Figure 5 for Figure 3A A top view of the substrate after processing. (See diagram below.) Figure 3A and Figure 5 As shown, the first heating head 12 and the second heating head 22 are positioned to match the size and specifications of the substrate 30 to be processed, such that the processing position P of the first heating head 12 and the second heating head 22 on the substrate 30 is located in the non-functional area B outside the functional area A of the substrate 30, and the distance D between the processing position P and the edge of the substrate 30 is minimized as much as possible, for example, the distance D can be less than 3mm. Therefore, this double-sided edge sealing will not affect the subsequent circuit fabrication in the functional area A of the substrate 30, ensuring that the utilization rate of the functional area A of the substrate 30 is maximized. In addition, the processing position P is formed into a closed ring along the outer periphery of the substrate 30, thereby preventing foreign objects from entering the interlayer from the edge of the substrate 30.

[0072] When performing double-sided edge sealing on a substrate 30 using a double-sided edge sealing fixture 1, the user places the substrate 30 on the upper surface of the first body 11, aligning the predetermined processing position P of the substrate 30 with the first heating head 12, and moves the second body 21 so that the second heating head 22 contacts the substrate 30. Thus, the first heating head 12 and the second heating head 22 can simultaneously heat both sides 30a and 30b of the substrate 30. Because the first heating head 12 and the second heating head 22 can simultaneously heat both sides of the substrate 30, processing time can be shortened and productivity increased; for example, the processing time is only 20 to 40 seconds. Furthermore, it ensures that the processing positions P on both sides of the substrate 30 correspond, thereby improving processing accuracy.

[0073] Furthermore, since the first heating head 12 and the second heating head 22 are configured to correspond to a complete circle around the processing position P of the substrate 30, they do not require the laser to move along a trajectory to complete a full circle of heating in one go, as is the case in existing technologies. Therefore, processing time can be further shortened and production capacity increased. Moreover, as long as the substrate 30 is initially placed in the correct position on the double-sided edge sealing fixture 1 using a pattern alignment method, heating can be performed quickly and accurately at the predetermined processing position P of the substrate 30, with an accuracy of, for example, ±10µm.

[0074] In summary, the double-sided edge sealing method of the substrate of the present invention mainly involves using a first carrier and a second carrier to clamp both sides of the substrate with a stacked structure to process the substrate. Since the first heating head of the first carrier and the second heating head of the second carrier are opposite to each other and their positions correspond, both sides of the substrate can be heated simultaneously, thereby shortening the processing time and increasing the production capacity. Furthermore, it can ensure that the processing positions on both sides of the substrate correspond, thereby improving the processing accuracy.

[0075] Furthermore, since the first heating head of the first carrier and the second heating head of the second carrier are continuously formed along the edge of the substrate and surround the functional area of ​​the substrate, it can be ensured that the edge of the substrate is sealed to prevent foreign objects from entering the interlayer from the edge of the substrate.

[0076] Furthermore, the double-sided edge-sealing fixture constructed in the above manner has a long service life and does not require frequent equipment replacement, thus reducing manufacturing costs.

[0077] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Those skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. A method for sealing the edges of a substrate on both sides, comprising: A double-sided edge-sealing fixture is provided, comprising a first carrier and a second carrier, wherein the first carrier has a first body and a first heating head, and the second carrier is disposed above the first carrier and has a second body and a second heating head, wherein the first body has a first groove, the first heating head is disposed in the first groove and protrudes from the first groove onto the surface of the first body, and the second body has a second groove, the second heating head is disposed in the second groove and protrudes from the second groove onto the surface of the second body; A substrate with a stacked structure is placed between the first carrier and the second carrier of the double-sided edge sealing fixture, so that the first carrier carries the substrate and aligns the substrate with the first heating head of the first carrier; The second carrier is moved toward the first carrier so that the second heating head of the second carrier contacts the substrate, wherein the second heating head is opposite to and positionally aligned with the first heating head; and The substrate is heated by the first heating head and the second heating head.

2. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head and the second heating head simultaneously heat the opposite first and second sides of the substrate.

3. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head is disposed around the periphery of the first body, and the second heating head is also disposed around the periphery of the second body.

4. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head and the second heating head heat the substrate simultaneously on both sides in one go.

5. The double-sided edge sealing method for a substrate as described in claim 1, wherein, While the substrate is being heated, the second carrier applies pressure to the substrate.

6. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head and the second heating head are connected to a circuit and form a loop with the substrate, so as to heat the substrate by passing current through the substrate.

7. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The depth of the first groove and the second groove is 2 to 7 mm.

8. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head and the second heating head protrude from the surfaces of the first body and the second body respectively by a height of 0.1 to 0.5 mm.

9. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head is formed into a pointed shape that gradually narrows in width as it extends outward from the first groove, and the second heating head is formed into a pointed shape that gradually narrows in width as it extends outward from the second groove.

10. The double-sided edge sealing method for a substrate as described in claim 9, wherein, The width of the tips of the first heating head and the second heating head is 0.5 to 1 mm.

11. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The first heating head and the second heating head are made of cast iron or thermally conductive materials made of carbide.

12. The double-sided edge sealing method for a substrate as described in claim 11, wherein, The carbide is tungsten carbide.

13. The double-sided edge sealing method for a substrate as described in claim 1, wherein, The surfaces of the first body and the second body are subjected to hard anodizing treatment.

Images