Horizontal monitoring and self-adjusting system for manipulator

Abstract

The invention relates to the technical field of semiconductor equipment, in particular to a horizontal monitoring and self-adjusting system for a manipulator. The self-adjusting system provided by the invention comprises a manipulator wafer bearing device used for bearing a wafer; the electronic horizontal monitoring device is arranged on the manipulator wafer bearing device and is used for monitoring the horizontal state of the manipulator wafer bearing device; the horizontal adjustment transmission plate is used for transmitting and adjusting the horizontal position of the wafer bearing device of the manipulator; and the horizontal self-adjusting device is used for adjusting the balance state of the horizontal adjusting transmission plate based on feedback data of the electronic horizontal monitoring device so as to ensure that the manipulator wafer bearing device is in a horizontal state. Automatic horizontal adjustment of the manipulator is achieved through the horizontal self-adjustment device, the problem of inaccuracy in the manual adjustment process is solved, the accuracy and efficiency of horizontal monitoring adjustment are improved, and powerful technical support is provided for stable operation of the manipulator.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and more particularly to a robot level monitoring and self-adjusting system. Background Art

[0002] In the vacuum transfer chamber of semiconductor equipment, vacuum manipulators are used to transfer wafers. Whether the position of the wafer is accurate during the operation of the equipment, whether it is offset, and whether it is successfully transferred to the target position have a decisive impact on the equipment process results.

[0003] The current vacuum robot monitors the position of the wafer through sensors on the chamber, but this is limited to the transient data of the sensor when the wafer is transferred into or out of the chamber on the robot. During the automatic wafer transfer process, if the wafer shifts, the system can only alarm based on transient data, and lacks continuous operation data to assist analysis.

[0004] With the continuous advancement of semiconductor process technology, the requirements for the accuracy of wafer transfer position are increasing. Any position deviation may have a negative impact on the process results. If the robot is not adjusted properly, the wafer will shift during the transfer process or at the beginning / end of the transfer.

[0005] However, to solve the problem of manipulator leveling, the vacuum chamber must be refilled to atmospheric pressure and then the manipulator fingers must be manually adjusted. Currently, the leveling of the manipulator, including the manipulator body and fingers, relies on manual operation. After adjustment, the current leveling state can only be judged by an external level meter, which has the following problems:

[0006] 1) The error introduced by human operation is large, and improper adjustment often leads to problems with the robot slide;

[0007] 2) It is impossible to obtain continuous operation data and ensure that the robot is always in the best state;

[0008] 3) The machine recovery process takes a long time, and even after manual adjustment, the robot may still have level problems during movement, requiring repeated adjustments, which affects the normal operation time of the equipment. Summary of the invention

[0009] The purpose of the present invention is to provide a robot horizontal monitoring and self-adjusting system to solve the problem in the prior art that the horizontal state of the robot is difficult to monitor and adjust during the wafer transmission process.

[0010] In order to achieve the above-mentioned object, the present invention provides a robot level monitoring self-adjustment system, including a robot wafer carrying device, an electronic level monitoring device, a level adjustment transmission plate and a level self-adjustment device:

[0011] The robot wafer carrying device is used to carry wafers;

[0012] The electronic level monitoring device is arranged on the robot arm wafer carrying device and is used to monitor the level state of the robot arm wafer carrying device;

[0013] The horizontal adjustment transmission plate is connected to the robot arm wafer carrying device and the horizontal self-adjusting device respectively, and is used to transmit and adjust the horizontal position of the robot arm wafer carrying device;

[0014] The self-leveling adjustment device adjusts the balance state of the leveling adjustment transmission plate based on the feedback data of the electronic level monitoring device to ensure that the robot arm carrying the wafer device is in a level state.

[0015] In some embodiments, the manipulator level monitoring and self-adjusting system further includes a control device connected to the electronic level monitoring device and the level self-adjusting device respectively;

[0016] The control device receives and processes the horizontal state data fed back by the electronic horizontal monitoring device, and sends a control instruction to the horizontal self-adjusting device to perform horizontal adjustment based on the processing result.

[0017] In some embodiments, the robot wafer carrying device comprises at least a robot body and a robot finger:

[0018] The interior of the manipulator body is a hollow structure;

[0019] The manipulator finger is arranged on one side of the manipulator body and is used for placing the wafer;

[0020] The horizontal adjustment transmission plate is arranged in the hollow structure, and one end is connected to the horizontal self-adjusting device.

[0021] In some embodiments, the contact forms between the robot fingers and the wafer include back-side contact type and sloped line contact type.

[0022] In some embodiments, a recessed structure is provided in the middle of the robot fingers.

[0023] In some embodiments, the horizontal self-adjusting device includes a three-point support structure and a driving mechanism:

[0024] There are two three-point support structures, and the installation positions correspond to the ends of the balance adjustment transmission plate;

[0025] The three-point support structure is three ejector pins distributed in a triangular shape, and the tops thereof are in contact with the balance adjustment transmission plate;

[0026] The driving mechanism is used to control the lifting and lowering of part or all of the ejectors according to the received control instructions, so as to adjust the height of the balancing and adjusting transmission plate.

[0027] In some embodiments, the driving mechanism is a servo motor or a stepper motor.

[0028] In some embodiments, the electronic level monitoring device includes a tilt sensor, which is arranged at a robot finger of a robot wafer carrying device to detect the horizontal state of the robot.

[0029] In some embodiments, the electronic level monitoring device further comprises a micro-electromechanical system gyro sensor, which is arranged at a manipulator finger of the manipulator carrying the wafer device, and is used to detect the angular velocity of the manipulator.

[0030] In some embodiments, the control device uses a Kalman filter algorithm to process data fed back by a micro-electromechanical system gyro sensor and an inclination sensor.

[0031] In some embodiments, the control device receives and stores the transmission data of the atmosphere and / or vacuum chamber of the semiconductor equipment;

[0032] When the control device detects that the position deviation of the wafer is greater than a preset threshold, the control device issues an offset alarm.

[0033] In some embodiments, the bending strength of the horizontal adjustment transmission plate is above 310 MPa and the thermal shock temperature is above 100 degrees Celsius.

[0034] In some embodiments, the weight of the leveling plate is no greater than 10% of the weight of the wafer.

[0035] The manipulator horizontal monitoring self-adjustment system proposed in the present invention can realize automatic horizontal adjustment of the manipulator through the horizontal self-adjustment device, avoid inaccuracies in the manual adjustment process, improve the accuracy and efficiency of horizontal monitoring adjustment, and provide strong technical support for the stable operation of the manipulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and other features, properties and advantages of the present invention will become more apparent through the following description in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always represent the same features, wherein:

[0037] Figure 1 A schematic diagram of the principle of a manipulator level monitoring and self-adjusting system according to an embodiment of the present invention is disclosed;

[0038] Figure 2 A partial structural diagram of a manipulator level monitoring and self-adjusting system according to an embodiment of the present invention is disclosed;

[0039] Figure 3a A schematic diagram of the principle of a horizontal self-adjusting device according to an embodiment of the present invention is disclosed;

[0040] Figure 3b An internal schematic diagram of a horizontal self-adjusting device according to an embodiment of the present invention is disclosed;

[0041] Figure 4 A control principle diagram of a manipulator level monitoring and self-adjusting system according to an embodiment of the present invention is disclosed.

[0042] The meanings of the reference numerals in the figures are as follows:

[0043] 10. Robotic arm carrying wafer device;

[0044] 11. Concave structure;

[0045] 20 electronic level monitoring device;

[0046] 30 Horizontal adjustment of the transmission plate;

[0047] 40 Horizontal self-adjusting device;

[0048] 41 Three-point support structure;

[0049] 42 driving mechanism. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the invention and are not used to limit the invention.

[0051] Figure 1 The schematic diagram of the principle of the robot level monitoring self-adjustment system according to an embodiment of the present invention is disclosed. Figure 1 As shown, a robot level monitoring self-adjusting system proposed by the present invention includes a robot wafer carrying device 10, an electronic level monitoring device 20, a level adjustment transmission plate 30 and a level self-adjusting device 40:

[0052] The robot wafer carrying device 10 at least includes a robot for carrying a wafer;

[0053] The electronic level monitoring device 20 is arranged on the robot carrying wafer device 10 and is used for the level state of the robot carrying wafer device 10;

[0054] The horizontal adjustment transmission plate 30 is connected to the robot arm wafer carrying device 10 and the horizontal self-adjusting device 40 respectively, and is used to transmit and adjust the horizontal position of the robot arm wafer carrying device 10;

[0055] The self-leveling device 40 adjusts the balance state of the leveling adjustment transmission plate 30 based on the feedback data of the electronic leveling monitoring device 20 to ensure that the robot arm wafer carrying device is in a level state.

[0056] Furthermore, the manipulator level monitoring and self-adjusting system further includes a control device, which is connected to the electronic level monitoring device 20 and the level self-adjusting device 40 respectively;

[0057] The control device receives the horizontal state data fed back by the electronic horizontal monitoring device 20 for processing, and sends an adjustment instruction to the horizontal self-adjusting device 40 for horizontal adjustment based on the processing result.

[0058] In this embodiment, the control device is a host computer, which can be implemented in the form of an industrial computer or the like.

[0059] The manipulator horizontal monitoring self-adjustment system proposed in the present invention helps to avoid inaccuracies in the manual adjustment process through the automatic adjustment function. When the manipulator is in long-term operation or the horizontal state of the manipulator changes due to external forces, horizontal adjustment can be achieved through the horizontal self-adjustment device.

[0060] The various core components of the automatic adjustment system for horizontal monitoring of a robotic arm proposed by the present invention will be described in detail below.

[0061] Specifically, the robot wafer carrying device 10 is the basic part of the entire system, and is mainly used to fix and carry wafers.

[0062] The robot wafer carrying device 10 at least comprises a robot body and robot fingers:

[0063] The interior of the manipulator body is a hollow structure;

[0064] The robot finger is arranged on one side of the robot body and its function is to place the wafer.

[0065] Typically, robot fingers are made of ceramic materials.

[0066] Depending on the way the robot fingers contact the wafer, they can be divided into two types: back-side point contact type or sloped line contact type.

[0067] The back point contact finger design mainly achieves precise grasping and stable support of the wafer by making point contact on the back of the wafer. The advantage of this contact method is that the contact area is small, which can reduce damage to the wafer surface and is suitable for occasions with high requirements on wafer surface quality.

[0068] The sloped line contact finger design makes linear contact on the edge or slope of the wafer. In this way, the robot can better disperse the contact pressure and reduce local stress concentration, thereby improving the stability and safety of grasping. This contact method is suitable for occasions where the wafer size is large or a larger contact area is required to provide sufficient support.

[0069] Whether it is the back point contact type or the sloped line contact type, both designs have their own advantages and can be selected and optimized according to the actual application scenarios and the characteristics of the wafer.

[0070] In addition, a recessed structure 11 is provided in the middle of the robot finger so that when placing the wafer, the wafer support device at the target position of the wafer can be effectively avoided, thereby improving the accuracy and safety of placement.

[0071] Specifically, the electronic level monitoring device 20 is used to monitor the level state of the robot arm carrying wafer device 10 .

[0072] In this embodiment, the electronic level monitoring device 20 includes a tilt sensor installed on a finger portion of a robot arm that carries a wafer device, so as to detect a horizontal state of the robot arm.

[0073] When the inclination sensor is at rest, there is no acceleration in the lateral and vertical directions, and only gravity acceleration acts on the sensor. At this time, the angle between the vertical axis of gravity and the sensitive axis of the acceleration sensor is the inclination angle.

[0074] The inclination sensor is an acceleration chip, which is usually used for static or quasi-static measurement. Once there is external acceleration, the acceleration value measured by the acceleration chip will contain the external acceleration component, resulting in inaccurate calculated tilt angle.

[0075] Therefore, preferably, the electronic level monitoring device should also include a micro-electromechanical system gyro sensor, which is also installed on the finger part of the robot arm carrying the wafer device to detect the angular velocity of the robot arm.

[0076] MEMS gyro sensors usually use MEMS gyro chips. Tilt sensors measure the acceleration of three axes, while MEMS gyro chips measure the angular acceleration of three axes. Therefore, this type of sensor product that includes tilt sensors and MEMS gyro sensors is also called 6-axis or VG (vertical gyro) sensors.

[0077] In this embodiment, the control device reads the horizontal state data of the electronic horizontal monitoring device 20 in real time to collect and store data, and uses big data technology to perform problem analysis and problem warning.

[0078] For the MEMS gyro sensor and inclination sensor, the control device uses advanced Kalman filtering algorithm to process the data fed back by the MEMS gyro sensor and inclination sensor, thereby improving the accuracy and reliability of the data.

[0079] The Kalman filter algorithm is a recursive filtering method based on a statistical model. It continuously predicts and updates, gradually approaches the true state value, and thus optimizes the processing of sensor data. This method performs well in dealing with noise and uncertainty in dynamic systems, so it has been widely used in micro-electromechanical systems. Through the processing of the Kalman filter algorithm, the control device can better understand and respond to the dynamic behavior of the system, thereby improving the performance and stability of the entire system.

[0080] Specifically, the horizontal adjustment transmission plate 30 is used to transmit and adjust the horizontal position of the robot arm carrying wafer device 10 .

[0081] Since the interior of the robot body is a hollow structure, the horizontal adjustment transmission plate 30 is arranged in the hollow structure, and one end is connected to the horizontal self-adjusting device 40, which adjusts the horizontal state of the robot by physical means to ensure that the wafer is always kept in a horizontal plane.

[0082] The horizontal adjustment transmission plate 30 transmits and adjusts the robot arm carrying wafer device 10 based on the force of the horizontal self-adjusting device. The horizontal adjustment transmission plate 30 needs to meet certain strength standards to avoid deformation, and its weight should be controlled within a certain range to avoid adversely affecting the performance of the robot arm.

[0083] Generally speaking, the weight of the horizontal adjustment transmission plate 30 is not greater than 10% of the weight of the wafer.

[0084] For example, the thickness of the wafer is 750 microns and the weight is about 125 grams. When the robot adjusts the parameters, it should be able to cover the fluctuation range of 10% of the wafer weight. Therefore, when the weight of the horizontal adjustment transmission plate 30 is within 12.5 grams, the parameters of the robot do not need to be modified. If the weight exceeds this range, the parameters need to be readjusted according to the actual situation.

[0085] In terms of strength requirements, the bending strength of the horizontal adjustment transmission plate 30 should exceed 310 MPa.

[0086] In addition, considering that the horizontal adjustment transmission plate 30 will be affected by temperature changes, its thermal shock temperature is above 100 degrees Celsius.

[0087] The self-leveling device 40 of the present invention adjusts the horizontality of the manipulator fingers by adjusting the position or angle of the horizontal adjustment transmission plate 30 , and verifies the adjustment result through the electronic level monitoring device 20 .

[0088] More specifically, Figure 3a The schematic diagram of the principle of the horizontal self-adjusting device according to an embodiment of the present invention is disclosed. Figures 1 to 3a As shown, the horizontal self-adjusting device 40 includes a three-point support structure 41 and a driving mechanism 42:

[0089] There are two three-point support structures 41, and the installation positions correspond to the ends of the balance adjustment transmission plate 30;

[0090] The three-point support structure 41 is three ejector pins distributed in a triangular shape, and the tops of the ejector pins are in contact with the balance adjustment transmission plate 30;

[0091] The function of the horizontal self-adjusting device 40 is to adjust the balance of the horizontal adjustment transmission plate 30 to ensure the balance state of the robot fingers, thereby ensuring that the wafer remains horizontal on the fingers.

[0092] The horizontal self-adjusting device 40 drives the three-point support structure 41 to fine-tune the horizontal adjustment transmission plate 30, thereby finally achieving horizontal adjustment of the manipulator.

[0093] Figure 3b The internal structure diagram of the horizontal self-adjusting device in one embodiment of the present invention is shown as follows: Figure 3b As shown, the driving mechanism 42 is used to control the lifting and lowering action of part or all of the three ejectors according to the received control instructions, so as to adjust the height of the balance adjustment transmission plate 30.

[0094] The three-point support structure 41 includes three ejector pins, which can be uniformly controlled by an ejector pin straight plate, or each ejector pin can be individually controlled by a driving mechanism 42. By adjusting the height of each ejector pin as a whole or independently, the horizontality of the horizontal adjustment transmission plate 30 can be adjusted, and finally the horizontal adjustment of the robot finger can be achieved.

[0095] In this embodiment, the driving mechanism 42 can be implemented by a servo motor or a stepper motor.

[0096] The three-point support structures 41 on the left and right sides respectively fine-tune the horizontal positions of the two manipulators, and the electronic level monitoring device 20 is used to confirm the adjustment results. Once the level data meets the requirements, the adjustment process is stopped.

[0097] The present invention proposes a robot arm level monitoring automatic adjustment system. During the robot arm transfer of wafers, the sensor of the electronic level monitoring device 20 is used to record the level, obtain the level data of the robot arm during operation, and transmit the data to the control device, which processes and stores the data. When the level of the robot arm fingers is slightly offset, automatic adjustment can be made according to the stored data.

[0098] Figure 4 The control principle diagram of the manipulator level monitoring self-adjusting system according to one embodiment of the present invention is disclosed. Figure 4 As shown, the control device receives and stores the transmission data of the atmosphere and / or vacuum chamber of the semiconductor equipment;

[0099] When the control device detects that the position deviation of the wafer is greater than a preset threshold, the control device issues an offset alarm.

[0100] The wafer transmission data is mainly used to monitor the position of the wafer during the wafer transmission process to prevent the wafer position from shifting too much, causing fragments during the transmission process or affecting the wafer's process processing results.

[0101] The control device determines and issues an offset alarm based on the collected wafer data to avoid excessive position deviation that affects the process results or causes wafer damage.

[0102] The dynamic data monitored in real time by the electronic level detection device 20, including the instantaneous position data of the wafer obtained by the tilt sensor, etc., are also stored in the control device, and the control device collects data within a set time interval (the time can be set).

[0103] The control device records the horizontal data of the manipulator during its transmission process. Through horizontal data monitoring, it is possible to promptly detect whether the manipulator has problems such as deformation and shaking.

[0104] The robot includes actions such as rotation, extension, and Z-axis lifting. The control device can collect data from an inclination sensor every second, synchronously record the specific actions at that time, and then combine the original wafer position center offset data of the equipment, that is, AWC (automated wafer control system) data for overall fitting, and then use the adjustment device to adjust the level of the robot fingers.

[0105] When a wafer position deviation alarm is detected, the control device checks whether there is any abnormality in the horizontal status data fed back by the electronic horizontal monitoring device. If there is any abnormality, the horizontal self-adjusting device issues a corresponding control instruction based on the horizontal deviation result to perform a horizontal adjustment operation.

[0106] When an alarm occurs during wafer transmission, the horizontal data monitored during wafer transmission can be used to determine whether the wafer deviation is related to the level of the robot. If so, the specific time of occurrence and the condition of the machine can be determined based on the recorded data.

[0107] When the robot level has a problem, the control device determines whether the robot level needs to be adjusted based on the level data recorded during transmission and the wafer position data recorded instantly. If adjustment is required, the control device issues a control instruction based on the data recorded by the inclination sensor, and records the time of the control instruction, and self-adjusts the left and right ejectors by driving the motor. At the same time, corresponding data collection is performed according to the control instruction.

[0108] Furthermore, the control device can perform big data algorithm analysis based on the stored data, predict possible failures in advance, and notify the operator to perform maintenance through an early warning mechanism.

[0109] It should be emphasized that the robot level monitoring self-adjustment system proposed in the present invention has a certain adjustment range. When the robot level deviation is too large, it is necessary to first make a rough adjustment to meet the basic level requirement, and then make a fine adjustment through the self-adjustment system, or when a slight deviation occurs after running for a period of time, the self-adjustment system makes corresponding adjustments.

[0110] The robot level monitoring and self-adjusting system provided by the present invention has the following beneficial effects:

[0111] 1) Compared with the prior art that measures the level data by manually placing a mechanical level block during machine maintenance, the present invention monitors the level data of the manipulator, monitors the level data through an electronic level detection device and uploads it to the control device, which can not only improve the accuracy and efficiency of level monitoring, but also realize long-term storage and real-time monitoring of data, providing strong technical support for the stable operation of the manipulator;

[0112] 2) Compared with the manual horizontal adjustment in the prior art, the present invention realizes the small-range horizontal self-adjustment of the manipulator, thereby ensuring that the manipulator always maintains the best working state. It not only greatly reduces the workload of manual adjustment, but also improves the accuracy and efficiency of the adjustment, and further enhances the overall performance and reliability of the manipulator.

[0113] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0114] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0115] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as resulting in a departure from the scope of the present invention.

[0116] In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom" and "vertical" are used interchangeably.

[0117] The directions or positional relationships indicated by “inside”, “clockwise”, “counterclockwise”, etc. are based on the directions or positional relationships shown in the drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0118] The above embodiments are provided for persons familiar with the art to implement or use the present invention. Personnel familiar with the art can make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope of the innovative features mentioned in the claims.

Claims

1. A robot level monitoring self-adjustment system, characterized in that: It includes a robot wafer carrying device, an electronic level monitoring device, a level adjustment transmission plate and a level self-adjusting device: The robot wafer carrying device is used to carry wafers; The electronic level monitoring device is arranged on the robot arm wafer carrying device and is used to monitor the level state of the robot arm wafer carrying device; The horizontal adjustment transmission plate is connected to the robot arm wafer carrying device and the horizontal self-adjusting device respectively, and is used to transmit and adjust the horizontal position of the robot arm wafer carrying device; The self-leveling adjustment device adjusts the balance state of the leveling adjustment transmission plate based on the feedback data of the electronic level monitoring device to ensure that the robot arm carrying wafer device is in a level state.

2. The robot level monitoring and self-adjusting system according to claim 1 is characterized in that: It also includes a control device, which is connected to the electronic level monitoring device and the level self-adjusting device respectively; The control device receives and processes the horizontal state data fed back by the electronic horizontal monitoring device, and sends a control instruction to the horizontal self-adjusting device to perform horizontal adjustment based on the processing result.

3. The robot level monitoring and self-adjusting system according to claim 1 is characterized in that: The robot wafer carrying device at least includes a robot body and robot fingers: The interior of the manipulator body is a hollow structure; The manipulator finger is arranged on one side of the manipulator body and is used for placing the wafer; The horizontal adjustment transmission plate is arranged in the hollow structure, and one end is connected to the horizontal self-adjusting device.

4. The robot level monitoring and self-adjusting system according to claim 3 is characterized in that: The contact forms between the robot fingers and the wafer include back contact type and slope line contact type.

5. The robot level monitoring and self-adjusting system according to claim 3 is characterized in that: The manipulator fingers have a recessed structure in the middle.

6. The robot level monitoring and self-adjusting system according to claim 2, characterized in that: The horizontal self-adjusting device includes a three-point support structure and a driving mechanism: There are two three-point support structures, and the installation positions correspond to the ends of the balance adjustment transmission plate; The three-point support structure is three ejector pins distributed in a triangular shape, and the tops thereof are in contact with the balance adjustment transmission plate; The driving mechanism is used to control the lifting and lowering of part or all of the ejectors according to the received control instructions, so as to adjust the height of the balance adjustment transmission plate.

7. The robot level monitoring and self-adjusting system according to claim 6, characterized in that: The driving mechanism is a servo motor or a stepping motor.

8. The robot level monitoring and self-adjusting system according to claim 2, characterized in that: The electronic level monitoring device comprises a tilt sensor, which is arranged at the manipulator finger of the manipulator wafer carrying device and is used to detect the horizontal state of the manipulator.

9. The robot level monitoring and self-adjusting system according to claim 8, characterized in that: The electronic level monitoring device also includes a micro-electromechanical system gyro sensor, which is arranged at the manipulator finger of the manipulator wafer carrying device and is used to detect the angular velocity of the manipulator.

10. The robot level monitoring and self-adjusting system according to claim 9, characterized in that: The control device uses a Kalman filter algorithm to process data fed back by a micro-electromechanical system gyro sensor and an inclination sensor.

11. The robot level monitoring and self-adjusting system according to claim 2, characterized in that: The control device receives and stores the transmission data of the atmosphere and / or vacuum chamber of the semiconductor device; When the control device detects that the position deviation of the wafer is greater than a preset threshold, the control device issues an offset alarm.

12. The robot level monitoring and self-adjusting system according to claim 1, characterized in that: The bending strength of the horizontal adjustment transmission plate is above 310 MPa, and the thermal shock temperature is above 100 degrees Celsius.

13. The robot level monitoring and self-adjusting system according to claim 1, characterized in that: The weight of the horizontal adjustment transmission plate is not greater than 10% of the weight of the wafer.

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