Die bonder and die bonding method

Abstract

The invention relates to the technical field of chip mounting, in particular to a die bonder and a die bonding method. The die bonder comprises a track device, a feeding device, a gluing device, a mounting device, a chip supply device and a discharging device. The feeding device and the discharging device are arranged at the two ends of the track device in the length direction correspondingly. The gluing device is arranged at the end, close to the feeding device, of the side edge of the rail device. The mounting device is arranged at the end, close to the discharging device, of the side edge of the rail device, the mounting device and the gluing device are located on the same side of the rail device, and the mounting device comprises a visual positioning component and a mounting component which are independently arranged; and the chip supply device is arranged on the other side of the track device and corresponds to the mounting device. The die bonder provided by the invention is compact in structure, the moving distance of each link is reduced, and the mounting efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and in particular to a die bonding machine and a die bonding method. Background Art

[0002] At present, the manufacturing of electronic products has increasingly higher requirements for the die bonding process, pursuing higher precision and speed. However, most of the existing die bonding equipment has the problem of single function and low efficiency. Traditional die bonding machines can usually only perform a single welding or bonding operation, and manual adjustment is required when changing products, which is not only time-consuming and labor-intensive, but also easy to introduce errors. In addition, the existing equipment is often not compact enough in layout, occupies a large space, and is not conducive to the efficient layout of the production line. Summary of the invention

[0003] In order to solve the problems of large size and low mounting efficiency of existing die bonding equipment, the present invention provides a die bonding machine and a die bonding method.

[0004] In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions: a crystal bonding machine, comprising a track device, a loading device, a gluing device, a mounting device, a chip supply device and a unloading device; the loading device and the unloading device are respectively arranged at the two ends of the track device in the length direction; the gluing device is arranged on the side of the track device close to one end of the loading device; the mounting device is arranged on the side of the track device close to one end of the unloading device, the mounting device and the gluing device are located on the same side of the track device, and the mounting device includes a visual positioning component and a mounting component that are independently arranged; the chip supply device is arranged on the other side of the track device and corresponds to the mounting device.

[0005] Preferably, the gluing device comprises a glue dispensing component and a glue dipping component, and the glue dispensing component and the glue dipping component are arranged in parallel along the length direction of the track device.

[0006] Preferably, the glue dipping component includes a glue dipping tray module, the glue dipping tray module includes a mounting seat, a magnetic drive component and a glue dipping tray, the magnetic drive component is arranged on the mounting seat, the magnetic drive component includes a first magnetic drive component and a second magnetic drive component, the first magnetic drive component and the second magnetic drive component are connected by magnetic transmission, and the glue dipping tray is connected to the second magnetic drive component.

[0007] Preferably, adjacent ends of the first magnetic driving component and the second magnetic driving component are respectively sleeved with magnetic components, the magnetic components are cylindrical, the first magnetic driving component and the second magnetic driving component are loosely matched, the first magnetic driving component drives the second magnetic driving component to rotate through the magnetic component, the first magnetic driving component is arranged on the upper surface of the mounting seat, and the second magnetic driving component is arranged perpendicular to the first magnetic driving component and extends to the lower surface of the mounting seat.

[0008] Preferably, the track device is provided with a gluing area, a mounting area and a transfer table, the gluing area is arranged corresponding to the gluing device, the mounting area is arranged corresponding to the chip supply device, and the transfer table is arranged on the mounting area close to the chip supply device.

[0009] Preferably, the mounting device includes a visual positioning component and a mounting component, the mounting component is arranged adjacent to the visual positioning component, the visual positioning component includes a bracket arranged above the track device, at least one first visual detector and at least one second visual detector are installed on the bracket, the first visual detector is arranged above the mounting area, the second visual detector is arranged above the transfer table, and the detection accuracy of the first visual detector is higher than the detection accuracy of the second visual detector.

[0010] Preferably, the chip supply device comprises a crystal expansion component and a lifting component, the lifting component is sleeved in the middle of the crystal expansion component, the top of the lifting component is lower than the working plane of the crystal expansion component, the lifting component comprises a top block assembly, a top rod assembly and an elastic assembly, the top block assembly is arranged above the top rod assembly, and the elastic assembly is respectively against the top block assembly and the top rod assembly; The top block assembly includes an outer top block, a middle top block and an inner top block which are sleeved in sequence; the top rod assembly includes an inner top rod and an outer top rod, a linkage piece is sleeved on the inner top rod, and the linkage piece is located between the inner top rod and the middle top block; The outer top rod is provided with a first locking step, and the middle top block is provided with a second locking step, and the first locking step and the second locking step respectively abut against the middle top block and the inner top block; When the outer ejector rod rises, it drives the outer ejector block, the middle ejector block and the inner ejector block to rise synchronously. When the inner ejector rod rises, it drives the middle ejector block and the inner ejector block to rise synchronously through the linkage. When the middle ejector block rises to the highest point, the inner ejector rod continues to drive the inner ejector block to rise, so that the inner ejector block is higher than the middle ejector block. There is a first gap between the linkage and the outer top block, and a second gap between the inner top rod and the middle top block. After the outer top rod rises to drive the outer top block, the middle top block and the inner top block to rise synchronously, the outer top rod descends to make the outer top block descend and press the middle top block downward, and the inner top rod descends to make the inner top block that is against it slide downward.

[0011] In order to solve the above technical problems, the present invention provides another technical solution as follows: a method for bonding crystals, using a bonding machine as described in any of the above items to perform bonding, comprising: a loading device transports a substrate into a track device; the track device transfers the substrate to a corresponding position of a gluing device, and the gluing device performs glue dispensing and / or dipping treatment on the substrate; a chip supply device supplies chips to the track device; the track device transfers the substrate to a corresponding position of a mounting device, and the mounting device mounts the chip onto the substrate; a unloading device takes the mounted substrate out of the track device; wherein the above steps can be performed simultaneously.

[0012] Preferably, the chip supply device includes a wafer loading component and a chip picking component, and the chip supply device supplies chips to the track device, including: the wafer loading component places the wafer on the crystal expansion component; the crystal expansion component expands the carrier film on the wafer; the lifting component pushes the chip up or pulls down the carrier film until the chip is separated from the carrier film; the chip picking component transfers the chip separated from the carrier film to the track device.

[0013] Preferably, the mounting device mounts the chip onto the substrate, including: a visual detector positions and identifies the substrate and chip to be mounted; a mounting component grabs the chip based on the detection result of the visual detector, and mounts the chip onto the substrate after position correction.

[0014] Compared with the prior art, the die bonding machine and die bonding method provided by the present invention have the following beneficial effects: 1. A die bonder provided in an embodiment of the present invention completes the gluing process and the mounting process while transferring the substrate along the length direction of the track device, and arranges the corresponding loading and unloading devices, gluing devices, mounting devices, chip supply devices, etc. compactly around the track device, thereby reducing the transportation distance of various materials, improving production efficiency, and also making the equipment more miniaturized, which is conducive to the efficient layout and optimization of the production line; Secondly, by separating the visual positioning component from the mounting component, the weight of the mounting component is simplified, so that it has a better force control effect and can achieve more refined operations. At the same time, the visual positioning component and the mounting component can work synchronously, thereby improving efficiency.

[0015] 2. The gluing device of the embodiment of the present invention includes a glue dispensing component and a glue dipping component, which can adapt to chip packaging that requires glue dispensing or glue dipping; the glue dispensing component and the glue dipping component are arranged in parallel along the length direction of the track device and can work simultaneously, greatly improving production efficiency.

[0016] 3. The glue dipping component of the embodiment of the present invention drives the glue dipping plate to rotate through the magnetic drive assembly. The magnetic drive assemblies use magnetic transmission to avoid friction and wear problems in traditional mechanical transmission, thereby extending the service life of the equipment and reducing the maintenance cost of the equipment.

[0017] 4. The first magnetic driving component and the second magnetic driving component of the embodiment of the present invention are clearance-matched, and the non-contact transmission of the two reduces energy loss and improves transmission efficiency. At the same time, the non-contact transmission has higher stability and is also convenient for maintenance and replacement.

[0018] 5. The transfer table in the embodiment of the present invention is arranged between the mounting area and the chip supply device, and the three are arranged compactly, which greatly reduces the moving distance of chip mounting and improves the mounting efficiency.

[0019] 6. In the embodiment of the present invention, a first visual detector and a second visual detector with different detection accuracy are respectively provided in the mounting area and the transfer table for identifying and locating the substrate and the chip. It should be understood that the accuracy required for identifying the substrate and the chip is different. According to the actual accuracy requirements, visual detectors with different accuracy can be used simultaneously to detect different links, thereby reducing resource waste and improving detection efficiency.

[0020] 7. The lifting member of the embodiment of the present invention comprises a lifting block assembly and a lifting rod assembly, wherein the lifting block assembly comprises an outer lifting block, a middle lifting block and an inner lifting block which are sleeved in sequence; the lifting rod assembly comprises an inner lifting rod and an outer lifting rod, wherein the inner lifting rod is sleeved with a linkage member, and the linkage member is located between the inner lifting rod and the middle lifting block; the outer lifting rod is provided with a first positioning step, and the middle lifting block is provided with a second positioning step, wherein the first positioning step and the second positioning step respectively abut against the middle lifting block and the inner lifting block; the outer lifting rod rises to drive the outer lifting block, the middle lifting block and the inner lifting block to move upwards and move upwards and move upwards and move upwards and move upwards and move upwards and move upwards and move upwards and moves ... The inner push rod rises and drives the middle push block and the inner push block to rise synchronously through the linkage. When the middle push block rises to the highest point, the inner push rod continues to drive the inner push block to rise, so that the inner push block is higher than the middle push block. There is a first gap between the linkage and the outer push block, and a second gap between the inner push rod and the middle push block. After the outer push rod rises and drives the outer push block, the middle push block and the inner push block to rise synchronously, the outer push rod descends to make the outer push block descend and press the middle push block down to slide down, and the inner push rod descends to make the inner push block that is against it slide down.

[0021] It can be understood that the lifting component of this embodiment has two different working modes. According to the different thicknesses of chips, the method of lifting the chip or pulling down the chip carrier film can be selected to separate the chip from the carrier film, making the device more applicable.

[0022] 8. In order to solve the above technical problems, the present invention provides another technical solution as follows: a method for bonding crystals, using a bonding machine as described in any of the above items to perform bonding, comprising: a loading device transports the substrate into a track device; the track device transfers the substrate to a corresponding position of the gluing device, and the gluing device dispenses and / or dips glue on the substrate; a chip supply device supplies chips to the track device; the track device transfers the substrate to a corresponding position of the mounting device, and the mounting device mounts the chip onto the substrate; a unloading device takes the mounted substrate out of the track device; wherein the above steps can be performed simultaneously.

[0023] It has the same beneficial effects as the die bonding machine described in any one of the above items, which will not be described in detail here.

[0024] 9. In the embodiment of the present invention, the chip carrier film is expanded by the crystal expansion component, so that the distance between adjacent chips on the carrier film is increased, which facilitates the demolding and / or grabbing operations of a single chip.

[0025] 10. The embodiment of the present invention uses two visual detectors to detect the substrate and the chip at the same time, thereby improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 It is a schematic structural diagram of a die bonding machine provided in the first embodiment of the present invention.

[0028] Figure 2 It is a schematic diagram of the mechanism of the feeding device provided in the first embodiment of the present invention.

[0029] Figure 3 It is a schematic structural diagram of a glue-dipping component provided in the first embodiment of the present invention.

[0030] Figure 4 It is a schematic diagram of the exploded structure of the glue-dipped component provided in the first embodiment of the present invention.

[0031] Figure 5 It is a schematic diagram of the motion trajectory of the glue dipping component provided in the first embodiment of the present invention.

[0032] Figure 6 It is a schematic diagram of the exploded structure of the glue dipping disc module provided in the first embodiment of the present invention.

[0033] Figure 7 It is a schematic structural diagram of a chip supply device provided in the first embodiment of the present invention.

[0034] Figure 8 It is a cross-sectional view of a lifting member provided in the first embodiment of the present invention.

[0035] Fig. 9 It is a flow chart of the steps of the die bonding method provided in the second embodiment of the present invention.

[0036] Fig.10 It is a detailed step flow chart of step three of the die bonding method provided in the second embodiment of the present invention.

[0037] Fig.11 It is a detailed step flow chart of step 4 of the die bonding method provided in the second embodiment of the present invention.

[0038] Description of the accompanying drawings: 100. Die bonding machine; 1. Track device; 11. Gluing area; 12. Mounting area; 13. Transfer table; 2. Feeding device; 21. Pushing member; 22. Clip feeding member; 3. Gluing device; 31. Glue dispensing component; 32. Glue dipping component; 321. Glue dipping plate module; 3211. Mounting seat; 3212. First magnetic driving component; 3213. Second magnetic driving component; 3214. Magnetic component; 3215. Glue dipping plate; 3216. Glue scraper; 3217. Adjusting knob; 3218. Knob fixing block; 3219. Fixing block; 322. Glue dipping module; 3221. X-axis driving component; 3222. Glue dipping head; 323. Z-axis module; 3231. Z-axis driving component; 4. Mounting device; 41. Visual positioning component; 411. Bracket; 412. First visual detector; 413. Second visual detector; 42. Mounting component; 5. Chip supply device; 51. Crystal expansion component; 511. Wafer loading component; 512. Chip taking component; 52. Lifting component; 521. Top block assembly; 5211. External top block; 52111. First clamping step; 5212. Middle top block; 52121. Second clamping step; 5213. Internal top block; 522. Top rod assembly; 5221. External top rod; 5222. Internal top rod; 523. Elastic component; 5231. First elastic member; 5232. Second elastic member; 524. Linkage member; 5241. First gap; 5242. Second gap; 6. Feeding device. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0040] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0041] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required for the present invention.

[0042] In various embodiments of the present invention, it should be understood that the size of the sequence number of each process does not necessarily mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention.

[0043] The flow chart and block diagram in the accompanying drawings of the present invention illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a sequence different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, which is determined based on the functions involved. It should be particularly noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs a specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0044] See also Figure 1The first embodiment of the present invention provides a die bonding machine 100, comprising a track device 1, a loading device 2, an adhesive device 3, a mounting device 4, a chip supply device 5 and a discharge device 6; the loading device 2 and the discharge device 6 are respectively arranged at both ends of the track device 1 in the length direction; the adhesive device 3 is arranged at one end of the side of the track device 1 close to the loading device 2; the mounting device 4 is arranged at one end of the side of the track device 1 close to the discharge device 6, the mounting device 4 and the adhesive device 3 are located on the same side of the track device 1, and the mounting device 4 includes a visual positioning component 41 and a mounting component 42 that are independently arranged; the chip supply device 5 is arranged on the other side of the track device 1 and corresponds to the mounting device 4.

[0045] It should be noted that the loading device 2 is used to transport the substrate to the track device 1. The substrate moves on the track device 1 toward the unloading device 6. When it moves to the corresponding position, the substrate is subjected to the gluing and / or dipping process and the mounting process by the gluing device 3 and the mounting device 4 arranged on the side of the track device 1. Finally, the mounted substrate is taken out from the track device 1 by the unloading device 6 and transferred to the next process.

[0046] It can be understood that the die bonding machine 100 provided in this embodiment completes the gluing process and the mounting process while circulating the substrate along the length direction of the track device 1, and compactly arranges the corresponding loading device 2, unloading device 6, gluing device 3, mounting device 4, chip supply device 5, etc. around the track device 1, so that the space is reasonably utilized, the transportation distance of various materials is reduced, the production efficiency is improved, and the equipment is also made more miniaturized, which is conducive to the efficient layout and optimization of the production line.

[0047] As a feasible implementation mode, the mounting device 4 includes a visual positioning component 41 and a mounting component 42 that are independently arranged. The visual positioning component 41 and the mounting component 42 are separated, which reduces the weight of the mounting component 42, enables it to have a better force control effect, and can achieve more refined operations. At the same time, the visual positioning component 41 and the mounting component 42 can work synchronously, reducing the corresponding waiting time, thereby improving work efficiency.

[0048] For further information, see Figure 2 The feeding device 2 includes a pushing component 21 and a clip feeding component 22.

[0049] Specifically, the magazine loading component 22 pushes the magazine stored thereon to the end of the track device 1, and the pushing component 21 pushes the carrier plate in the magazine and the substrate thereon into the track device 1, and the substrate is moved in the length direction of the track device 1 by the carrier plate, so that the substrate is in a stable state during the entire movement process.

[0050] Optionally, one or more substrates may be placed on the carrier.

[0051] Furthermore, please combine Figure 1 and Figure 3 The gluing device 3 includes a glue dispensing component 31 and a glue dipping component 32 , and the glue dispensing component 31 and the glue dipping component 32 are arranged in parallel along the length direction of the track device 1 .

[0052] As a feasible implementation, a glue dispensing component 31 and a glue dipping component 32 are arranged in parallel in the length direction of the track device 1 for performing glue dispensing and glue dipping processes on the substrate.

[0053] Optionally, the glue dispensing component 31 and the glue dipping component 32 can work separately or simultaneously.

[0054] This design enables the die bonder 100 to meet the mounting requirements of chips that require glue dispensing packaging and chips that require glue dipping packaging. When replacing the mounting product, there is no need to replace the operating head, which is convenient to operate and has greater versatility.

[0055] Optionally, the glue dipping component 32 and the glue dispensing component 31 are arranged in sequence in the substrate moving directions.

[0056] It is understandable that in some cases, chip mounting requires a combination of glue dispensing and dipping. In this case, the substrate can be moved to the bottom of the glue dipping component 32 by the track device 1, and the glue is applied to the chip or substrate by the glue dipping component 32. The substrate is then moved down to the bottom of the glue dispensing component 31, and the glue dispensing component 31 is used to accurately fill or reinforce the specific position of the substrate or chip.

[0057] It should be noted that when the substrate completes the dipping process and moves to the glue dispensing component 31 for glue dispensing, the loading device 2 conveys a new substrate to the track device 1, and the new substrate moves to the glue dipping component 32 for glue dipping, that is, the glue dipping component 32 and the glue dispensing component 31 work at the same time, thereby improving the efficiency of chip mounting.

[0058] As a feasible implementation method, a visual positioning module is provided on the glue dispensing component 31 and the glue dipping component 32. After the substrate is moved to the corresponding area, the visual positioning module is first used to quickly and accurately position and identify the substrate, and then the glue dispensing or glue dipping operation is performed. The visual positioning module can quickly identify and accurately position substrates of various shapes and sizes, thereby providing precise guidance for the glue dispensing or glue dipping operation, greatly shortening the preparation time before glue dispensing or glue dipping, and improving production efficiency; high-precision positioning can ensure that the glue can be accurately applied to the pins of the chip or the parts that need to be bonded, thereby avoiding glue overflow or dislocation, affecting the performance and stability of the chip.

[0059] For further information, see Figure 3-Figure 6The glue dipping component 32 includes a glue dipping tray module 321, and the glue dipping tray module 321 includes a mounting seat 3211, a magnetic driving component and a glue dipping tray 3215. The magnetic driving component is arranged on the mounting seat 3211, and the magnetic driving component includes a first magnetic driving component 3212 and a second magnetic driving component 3213. The first magnetic driving component 3212 and the second magnetic driving component 3213 are connected by magnetic transmission, and the glue dipping tray 3215 is connected to the second magnetic driving component 3213.

[0060] Specifically, the adjacent ends of the first magnetic driving component 3212 and the second magnetic driving component 3213 are respectively sleeved with magnetic components 3214, and the magnetic components 3214 are cylindrical. The first magnetic driving component 3212 and the second magnetic driving component 3213 are loosely matched, and the first magnetic driving component 3212 drives the second magnetic driving component 3213 to rotate through the magnetic component 3214. The first magnetic driving component 3212 is arranged on the upper surface of the mounting seat 3211, and the second magnetic driving component 3213 is arranged perpendicular to the first magnetic driving component 3212 and extends to the lower surface of the mounting seat 3211.

[0061] Optionally, the first magnetic driving component 3212 is a driving motor.

[0062] As a feasible implementation mode, the first magnetic driving component 3212 is fixed above the mounting seat 3211, and a magnetic component 3214 is sleeved on its rotating end. The rotating axis of the first magnetic driving component 3212 is parallel to the upper surface of the mounting seat 3211, and the rotating axis of the second magnetic driving component 3213 is perpendicular to the upper surface of the mounting seat 3211. The second magnetic driving component 3213 is sleeved on one end close to the first magnetic driving component 3212, and the second magnetic driving component 3213 extends from the end away from the magnetic component 3214 toward the lower surface of the mounting seat 3211 and is connected to the glue dipping plate 3215.

[0063] Specifically, the first magnetic driving component 3212 is magnetically transmitted to the second magnetic driving component 3213 through the magnetic component 3214, and the two are clearance-matched. The first magnetic driving component 3212 drives the second magnetic driving component 3213 to rotate non-contactly based on the magnetic principle, thereby driving the glue dipping plate 3215 connected thereto to rotate, avoiding taking glue at the same position every time, resulting in uneven glue taking.

[0064] It should be noted that the second magnetic driving component 3213 is arranged close to the edge of the mounting seat 3211, the glue dipping plate 3215 is connected to the second magnetic driving component 3213, and is located below the mounting seat 3211. The mounting seat 3211 provides a certain wind shielding effect for the glue dipping plate 3215 below it to slow down the drying speed of the glue on the glue dipping plate 3215.

[0065] The magnetic transmission method provided in this embodiment avoids the friction and wear problems of components in traditional mechanical transmission, thereby extending the service life of the equipment and reducing the maintenance cost of the equipment; at the same time, due to the clearance fit between the first magnetic driving component 3212 and the second magnetic driving component 3213, that is, the two are non-contact transmission, which can reduce the energy loss in the mechanical transmission process, improve the transmission efficiency, and also improve the stability of the transmission, and facilitate maintenance and replacement when a fault occurs.

[0066] Furthermore, the glue dipping component 32 also includes a Z-axis module 323 and a glue dipping module 322. The glue dipping disk module 321 is arranged on the side of the Z-axis module 323, and the glue dipping module 322 is arranged on the side of the Z-axis module 323 close to the glue dipping disk 3215, so that the glue dipping disk 3215 and the glue dipping module 322 are compactly arranged, reducing the distance that the glue dipping module 322 needs to move to the glue dipping disk 3215 for dipping glue, thereby improving the glue dipping efficiency.

[0067] Specifically, the Z-axis module 323 is provided with a Z-axis driving member 3231, and the glue dipping module 322 is arranged on the Z-axis driving member 3231. The glue dipping module 322 is moved up and down under the action of the Z-axis driving member 3231; the glue dipping module 322 includes an X-axis driving member 3221 and a glue dipping head 3222. The glue dipping head 3222 is connected to the X-axis driving member 3221 and moves left and right under the drive of the X-axis driving member 3221. The movement trajectory of the glue dipping head 3222 is as shown in FIG. Figure 5 Shown in the dotted line part.

[0068] In this embodiment, the Z-axis driving component 3231 is separated from the glue dipping module 322, and the weight of the glue dipping module 322 is reduced without affecting the movement effect of the glue dipping head 3222, so that the glue dipping module 322 has a better force control effect, and the glue dipping head 3222 can perform more precise operations; at the same time, the driving component is set separately, which reduces the cost of parts maintenance and replacement.

[0069] As a feasible implementation method, a fixing block 3219 is provided at one end of the mounting seat 3211 close to the glue dipping plate 3215, and a scraper plate 3216 is connected to the fixing block 3219 and is rotatably matched with the glue dipping plate 3215. The scraper plate 3216 is located above the glue dipping plate 3215 and has a gap with the glue dipping plate 3215. Along the rotation direction of the glue dipping plate 3215, the gap between the scraper plate 3216 and the glue dipping plate 3215 gradually increases.

[0070] It should be noted that the fixing block 3219 is movably connected to the mounting seat 3211, and the mounting seat 3211 is also provided with a knob fixing block 3218, on which an adjusting knob 3217 is installed. The adjusting knob 3217 passes through the knob fixing block 3218 and is connected to the fixing block 3219. The distance between the fixing block 3219 and the knob fixing block 3218 can be adjusted by adjusting the knob 3217, thereby adjusting the spacing between the scraper plate 3216 and the glue dipping plate 3215.

[0071] Further, please refer to Figure 1 The track device 1 is provided with a gluing area 11, a mounting area 12 and a transfer table 13. The gluing area 11 is arranged corresponding to the gluing device 3, the mounting area 12 is arranged corresponding to the chip supply device 5, and the transfer table 13 is arranged on the mounting area 12 close to the chip supply device 5.

[0072] It can be understood that the gluing area 11 and the mounting area 12 are sequentially arranged in the length direction of the track device 1, specifically in the moving direction of the substrate. When the substrate moves on the track device 1, relevant process treatments are performed in the corresponding areas to avoid errors in the process treatment sequence.

[0073] Specifically, the gluing area 11 is arranged corresponding to the position of the gluing device 3, and the mounting area 12 is arranged corresponding to the position of the mounting device 4. By making the relative processing devices and process areas correspond and compactly arranged, after the substrate is moved to the designated area, the mounting area 12 or the mounting device 4 can perform relevant processing on the substrate in time, thereby accelerating production efficiency.

[0074] In addition, different processes are processed in different areas, so that different processes can be processed on the track device 1 at the same time, thereby improving production efficiency.

[0075] As a feasible implementation, the track device 1 is also provided with a transfer table 13 for storing chips to be mounted. The mounting area 12, the transfer table 13 and the chip supply device 5 are arranged in parallel in sequence, which reduces the moving distance required for chip mounting and improves the mounting efficiency.

[0076] Optionally, the transfer table 13 is fixedly arranged on the side of the track device 1, so that the chip supply device 5 and the mounting device 4 can place or grab the chip at a fixed point, thereby improving the convenience of the chip supply device 5 and the mounting device 4 in placing or grabbing the chip. At the same time, the transfer table 13 is fixedly connected to the track device 1 to avoid errors in the chip position thereon due to the movement of the transfer table 13.

[0077] Furthermore, the mounting device 4 includes a visual positioning component 41 and a mounting component 42 that are independently arranged. The mounting component 42 is arranged adjacent to the visual positioning component 41. The visual positioning component 41 includes a bracket 411 arranged above the track device 1. At least one first visual detector 412 and at least one second visual detector 413 are installed on the bracket 411. The first visual detector 412 is arranged above the mounting area 12, and the second visual detector 413 is arranged above the transfer table 13. The detection accuracy of the first visual detector 412 is higher than the detection accuracy of the second visual detector 413.

[0078] It can be understood that the bracket 411 is erected above the track device 1 and corresponds to the mounting area 12 and the transfer table 13, and a first visual detector 412 and a second visual detector 413 are arranged thereon. Specifically, the first visual detector 412 is arranged above the mounting area 12, and the second visual detector 413 is arranged above the transfer table 13 to identify and locate the substrate or chip thereon. The mounting component 42 is connected to the first visual detector 412 and the second visual detector 413 by signal. The first visual detector 412 and the second visual detector 413 transmit the recognition results of the substrate and the chip to the mounting component 42, thereby guiding the mounting component 42 to accurately mount the chip and improve the mounting accuracy.

[0079] It should be noted that in the actual mounting process, the required accuracy for identifying the substrate and the chip is different. Usually, the accuracy required for identifying the chip mounting point on the substrate is higher than the accuracy for identifying the chip position on the transfer table 13.

[0080] As a feasible implementation method, a first visual detector 412 with higher precision is used to identify the substrate in the mounting area 12, and a second visual detector 413 with lower precision is used to identify the chip on the transfer table 13, thereby improving the efficiency of chip recognition and avoiding the use of high-precision visual detectors to identify processes with low precision requirements, thereby avoiding waste of resources.

[0081] Optionally, by respectively arranging a first visual detector 412 and a second visual detector 413 above the mounting area 12 and the transfer table 13, the visual detectors at the two locations can work simultaneously to improve the recognition efficiency, that is, the substrate on the mounting area 12 and the chip on the transfer table 13 can be identified synchronously, and then the corresponding identification information can be transmitted to the mounting component 42 to guide the mounting component 42 to grab the chip and mount it, thereby reducing the time for the mounting component 42 to wait for the recognition result, thereby improving the overall mounting efficiency.

[0082] For further information, see Figure 7 and Figure 8The chip supply device 5 includes a crystal expansion component 51 and a lifting component 52. The lifting component 52 is sleeved in the middle of the crystal expansion component 51. The top of the lifting component 52 is lower than the working plane of the crystal expansion component 51. The lifting component 52 includes a top block assembly 521, a top rod assembly 522 and an elastic assembly 523. The top block assembly 521 is arranged above the top rod assembly 522. The elastic assembly 523 abuts against the top block assembly 521 and the top rod assembly 522 respectively; the top block assembly 521 includes an outer top block 5211, a middle top block 5212 and an inner top block 5213 which are sleeved in sequence; the top block assembly 521 includes an inner top rod 5222 and an outer top rod 5221. A linkage member 524 is sleeved on the inner top rod 5222, and the linkage member 524 is located between the inner top rod 5222 and the middle top block 5212; The outer top rod 5221 is provided with a first locking step 52111, and the middle top block 5212 is provided with a second locking step 52121. The first locking step 52111 and the second locking step 52121 respectively abut against the middle top block 5212 and the inner top block 5213; The outer push rod 5221 rises to drive the outer push block 5211, the middle push block 5212 and the inner push block 5213 to rise synchronously. The inner push rod 5222 rises to drive the middle push block 5212 and the inner push block 5213 to rise synchronously through the linkage 524. When the middle push block 5212 rises to the highest point, the inner push rod 5222 continues to drive the inner push block 5213 to rise, so that the inner push block 5213 is higher than the middle push block 5212. There is a first gap 5241 between the linkage 524 and the outer top block 5211, and a second gap 5242 between the inner top rod 5222 and the middle top block 5212. After the outer top rod 5221 rises to drive the outer top block 5211, the middle top block 5212 and the inner top block 5213 to rise synchronously, the outer top rod 5221 descends to make the outer top block 5211 descend and press the middle top block 5212 to slide down, and the inner top rod 5222 descends to make the inner top block 5213 that is against it slide down.

[0083] As a feasible implementation mode, the crystal expansion component 51 is in the shape of a hollow cylinder as a whole. The wafer can be placed above the crystal expansion component 51, and the carrier film is expanded under the action of the crystal expansion component 51, so that the distance between adjacent chips is increased; a lifting component 52 is arranged in the middle of the crystal expansion component 51, and the lifting component 52 is specifically arranged below the chip carrier film. When the chip carrier film expands, the lifting component 52 pushes up the chip or pulls down the carrier film, thereby allowing the chip to detach from the carrier film.

[0084] In a specific embodiment, the elastic component 523 includes a first elastic member 5231 and a second elastic member 5232. The end of the outer ejector rod 5221 is connected to the outer ejector block 5211, and the end of the inner ejector rod 5222 is connected to the middle ejector block 5212 via a linkage member 524. The bottom of the linkage member 524 is connected to the inner wall surface of the outer ejector rod 5221. After the linkage member 524 and the inner ejector rod 5222 are sequentially penetrated, at least part of the inner ejector block 5213 is located inside the inner ejector rod 5222. The outer ejector block 5211 is provided with a first positioning step 52111, and the middle ejector block 5212 is provided with a second positioning step 52121. The first positioning step 52111 and the second positioning step 52121 respectively abut against the middle ejector block 521. 2 and the inner top block 5213, so that when the outer top block 5211 rises, the middle top block 5212 and the inner top block 5213 are driven to rise through the first blocking step 52111 and the second blocking step 52121, and there are a first gap 5241 and a second gap 5242 between the linkage member 524 and the outer top block 5211, and between the inner top rod 5222 and the middle top block 5212 respectively; a first elastic member 5231 sleeved on the inner top rod 5222 and a second elastic member 5232 sleeved on the linkage member 524, one end of the first elastic member 5231 away from the top block assembly 521 is fixed to the outer side wall of the inner top rod 5222, and both ends of the second elastic member 5232 are respectively connected to the outer top block 5211 and the linkage member 524.

[0085] Optionally, the end of the outer push rod 5221 is connected to the outer push block 5211, and the end of the inner push rod 5222 is connected to the middle push block 5212 through the linkage member 524, and at least part of the inner push block 5213 is located in the inner push rod 5222 after the linkage member 524 and the inner push rod 5222 are passed through. The first elastic member 5231 is sleeved on the inner push rod 5222 and fixed to the end of the inner push rod 5222 away from the push block assembly 521, and the second elastic member 5232 is sleeved on the linkage member 524, and the two ends of the second elastic member 5232 are respectively connected to the outer push block 5211 and the linkage member 524, so that when the linkage member 524 descends, the outer push block 5211 can be driven to descend.

[0086] As a feasible implementation mode, when the lifting member 52 is working, the inner top block 5213, the middle top block 5212 and the outer top block 5211 are first synchronously raised to a certain height, the mounting member 42 is moved above the chip and descends to adsorb the chip, and then the inner top rod 5222 continues to lift up, causing the first elastic member 5231 to be deformed and exert an upward lifting force on the linkage member 524, and the linkage member 524 drives the middle top block 5212 and the inner top block 5213 to lift upward, so that the middle top block 5212 slides upward for a distance relative to the outer top block 5211, and the first gap 5241 at this time gradually decreases until it disappears, that is, the middle top block 5212 is relative to the outer top block 5 The sliding stroke of 211 reaches the limit, at this time, the outer layer of the chip is separated from the carrier film; then the inner push rod 5222 continues to be pushed upward to lift it. Since the first gap 5241 has disappeared, the inner push rod 5222 further lifts the inner top block 5213 alone. At this time, the second gap 5242 also gradually decreases until it disappears. The inner top block 5213 continues to slide upward for a distance relative to the middle top block 5212. When the sliding stroke of the inner top block 5213 reaches the limit, the second gap 5242 between the inner push rod 5222 and the middle top block 5212 disappears. At this time, the mounting component 42 adsorbs the chip and continues to rise to make the chip completely separate from the carrier film, completing the material removal.

[0087] It can be understood that after the mounting component 42 absorbs the chip, the mounting component 42 needs to rise synchronously with the inner top block 5213 and the middle top block 5212, and keep its downward pressure for taking the material unchanged to avoid chip cracking.

[0088] As another feasible implementation mode, when the lifting component 52 is working, the inner top block 5213, the middle top block 5212 and the outer top block 5211 are first synchronously raised to a certain height, the mounting component 42 is moved above the chip and descends to adsorb the chip, and then the outer top rod 5221 descends, causing the outer top block 5211 to slide downward a certain distance relative to the middle top block 5212 under the action of gravity. At this time, the first gap 5241 will also gradually decrease until it disappears, that is, the sliding stroke of the outer top block 5211 relative to the middle top block 5212 reaches the limit, and then the outer top block 5211 will press down the middle top block 5212 so that the middle top block 5212 also slides downward a certain distance; the inner top rod 5222 continues to descend to make the inner top block 5213 descend, and finally, the inner top block 5213 is lowered to make the supporting film completely separate from the chip, and the mounting component 42 adsorbs the chip and rises to complete the material removal.

[0089] It can be understood that, during the process of the top block assembly 521 descending layer by layer, the downward pressure of the mounting component 42 for taking the material needs to be gradually reduced to 0 to avoid chip breakage due to the gradual increase in contact area.

[0090] The lifting member 52 provided in this embodiment realizes two different ejection block action modes, namely, the ejection type and the film pulling type, on the same set of structures through the limitation of springs and mechanical mechanisms. When in use, different action modes can be switched for chips of different thicknesses, thereby improving the compatibility of the ejector.

[0091] See also Fig. 9 A second embodiment of the present invention provides a die bonding method, using the die bonding machine 100 as described in any one of the above items to perform die bonding, comprising: Step S1: The loading device transports the substrate into the track device; Step S2: the track device transfers the substrate to the corresponding position of the gluing device, and the gluing device performs glue dispensing and / or dipping treatment on the substrate; Step S3: the chip supply device supplies chips to the track device; Step S4: the track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chip onto the substrate; Step S5: The unloading device takes the mounted substrate out of the track device; The above steps can be performed simultaneously.

[0092] It can be understood that the die bonding machine 100 of this embodiment integrates the dispensing, dipping, mounting and other processes required for chip mounting, and arranges the operating areas of each process in sequence along the track device 1 to realize an assembly line mounting process from loading, dipping, mounting and unloading, thereby improving the efficiency of mounting.

[0093] This embodiment divides the processes required for chip mounting and executes them in different areas, so that each process step can be performed simultaneously, greatly improving work efficiency.

[0094] It should be understood that the die bonding method provided in this embodiment has the same beneficial effects as the die bonding machine 100 described in any one of the above items, and will not be described in detail here.

[0095] For further information, see Figure 7 and Fig.10 The chip supply device 5 includes a wafer loading component 511 and a chip picking component 512. The chip supply device supplies chips to the track device, including: Step S31: The wafer loading component places the wafer on the wafer expanding component; Step S32: the wafer expansion component performs a carrier film expansion process on the wafer; Step S33: The lifting component lifts up the chip or pulls down the carrier film until the chip is separated from the carrier film; Step S34: The chip picking component transfers the chip separated from the carrier film to the track device.

[0096] It should be noted that after the wafer loading component 511 places the wafer on the crystal expansion component 51 in step S32, the crystal expansion component 51 clamps and fixes the wafer, so that the wafer carrier film covers the working plane of the crystal expansion component 51, and then the wafer carrier film is stretched by the crystal expansion component 51 to expand it, thereby increasing the distance between adjacent chips on the carrier film, which is convenient for the subsequent grabbing of the chips.

[0097] Optionally, the lifting component 52 can realize chip demoulding through two action modes: pushing and pulling. Different action modes can be switched for different products, which has higher applicability. Functional action switching does not require replacement of parts, and the operation is convenient.

[0098] For further information, see Fig.11 , the mounting device mounts the chip onto the substrate, including: Step S41: The visual detector locates and identifies the substrate and chip to be mounted; Step S42: The mounting component grabs the chip based on the detection result of the visual detector, and mounts the chip on the substrate after position correction.

[0099] It should be noted that, in this embodiment, two independent visual detectors are used to synchronously locate and identify the substrate in the mounting area 12 and the chip on the transfer table 13, thereby improving the detection efficiency.

[0100] As a feasible implementation, the first visual detector 412 is used to identify the substrate on the mounting area 12, and the second visual detector 413 is used to identify the chip on the transfer table 13. The mounting component 42 and the first visual detector 412 and the second visual detector 413 are independently set, and the first visual detector 412 and the second visual detector 413 are both connected to the mounting component 42 signal. The mounting component 42 receives the detection results of the first visual detector 412 and the second visual detector 413, thereby grabbing the chip on the transfer table 13 and correcting its position, and finally mounting the calibrated chip on the specified position of the substrate.

[0101] It can be understood that separating the first visual detector 412 and the second visual detector 413 from the mounting component 42 reduces the weight of the mounting component 42, enables better force control, enables more refined operations on the chip, and ensures the accuracy of mounting.

[0102] Compared with the prior art, the die bonding machine and die bonding method provided by the present invention have the following beneficial effects: 1. A die bonder provided in an embodiment of the present invention completes the gluing process and the mounting process while transferring the substrate along the length direction of the track device, and arranges the corresponding loading and unloading devices, gluing devices, mounting devices, chip supply devices, etc. compactly around the track device, thereby reducing the transportation distance of various materials, improving production efficiency, and also making the equipment more miniaturized, which is conducive to the efficient layout and optimization of the production line; Secondly, by separating the visual positioning component from the mounting component, the weight of the mounting component is simplified, so that it has a better force control effect and can achieve more refined operations. At the same time, the visual positioning component and the mounting component can work synchronously, thereby improving efficiency.

[0103] 2. The gluing device of the embodiment of the present invention includes a glue dispensing component and a glue dipping component, which can adapt to chip packaging that requires glue dispensing or glue dipping; the glue dispensing component and the glue dipping component are arranged in parallel along the length direction of the track device and can work simultaneously, greatly improving production efficiency.

[0104] 3. The glue dipping component of the embodiment of the present invention drives the glue dipping plate to rotate through the magnetic drive assembly. The magnetic drive assemblies use magnetic transmission to avoid friction and wear problems in traditional mechanical transmission, thereby extending the service life of the equipment and reducing the maintenance cost of the equipment.

[0105] 4. The first magnetic driving component and the second magnetic driving component of the embodiment of the present invention are clearance-matched, and the non-contact transmission of the two reduces energy loss and improves transmission efficiency. At the same time, the non-contact transmission has higher stability and is also convenient for maintenance and replacement.

[0106] 5. The transfer table in the embodiment of the present invention is arranged between the mounting area and the chip supply device, and the three are arranged compactly, which greatly reduces the moving distance of chip mounting and improves the mounting efficiency.

[0107] 6. In the embodiment of the present invention, a visual detector is provided in the mounting area and the transfer table respectively for identifying and locating the substrate and the chip. It should be understood that the accuracy required for identifying the substrate and the chip is different. According to the actual accuracy requirements, visual detectors with different accuracy can be used simultaneously to detect different links, thereby reducing resource waste and improving detection efficiency.

[0108] 7. The lifting component of the embodiment of the present invention can choose to use the method of lifting the chip or pulling down the chip carrier film to separate the chip from the carrier film according to the chips of different thicknesses, so that the device has higher applicability.

[0109] 8. In order to solve the above technical problems, the present invention provides another technical solution as follows: a method for bonding crystals, using a bonding machine as described in any of the above items to perform bonding, comprising: a loading device transports the substrate into a track device; the track device transfers the substrate to a corresponding position of the gluing device, and the gluing device dispenses and / or dips glue on the substrate; a chip supply device supplies chips to the track device; the track device transfers the substrate to a corresponding position of the mounting device, and the mounting device mounts the chip onto the substrate; a unloading device takes the mounted substrate out of the track device; wherein the above steps can be performed simultaneously.

[0110] It has the same beneficial effects as the die bonding machine described in any one of the above items, which will not be described in detail here.

[0111] 9. In the embodiment of the present invention, the chip carrier film is expanded by the crystal expansion component, so that the distance between adjacent chips on the carrier film is increased, which facilitates the film stripping and / or grabbing operations of a single chip.

[0112] 10. The embodiment of the present invention uses two visual detectors to detect the substrate and the chip at the same time, thereby improving the detection efficiency.

[0113] The above is a detailed introduction to a crystal bonding machine and a crystal bonding method disclosed in an embodiment of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A die bonding machine, characterized in that: It includes a track device, a loading device, a gluing device, a mounting device, a chip supply device and a unloading device; The loading device and the unloading device are respectively arranged at two ends of the track device in the length direction; The gluing device is arranged on the side of the track device close to one end of the feeding device; The mounting device is arranged on the side of the track device close to one end of the unloading device, the mounting device and the gluing device are located on the same side of the track device, and the mounting device includes a visual positioning component and a mounting component that are independently arranged. The chip supply device is arranged at the other side of the track device and corresponds to the mounting device.

2. The die bonding machine according to claim 1, characterized in that: The gluing device comprises a glue dispensing component and a glue dipping component, and the glue dispensing component and the glue dipping component are arranged in parallel along the length direction of the track device.

3. The die bonding machine according to claim 2, characterized in that: The glue dipping component includes a glue dipping tray module, and the glue dipping tray module includes a mounting seat, a magnetic drive component and a glue dipping tray. The magnetic drive component is arranged on the mounting seat, and the magnetic drive component includes a first magnetic drive component and a second magnetic drive component. The first magnetic drive component and the second magnetic drive component are connected by magnetic transmission, and the glue dipping tray is connected to the second magnetic drive component.

4. The die bonding machine according to claim 3, characterized in that: The adjacent ends of the first magnetic driving component and the second magnetic driving component are respectively sleeved with magnetic components, the magnetic components are cylindrical, the first magnetic driving component and the second magnetic driving component are loosely matched, the first magnetic driving component drives the second magnetic driving component to rotate through the magnetic component, the first magnetic driving component is arranged on the upper surface of the mounting seat, and the second magnetic driving component is arranged perpendicular to the first magnetic driving component and extends to the lower surface of the mounting seat.

5. The die bonding machine according to claim 1, characterized in that: The track device is provided with a gluing area, a mounting area and a transfer table. The gluing area is arranged corresponding to the gluing device, the mounting area is arranged corresponding to the chip supply device, and the transfer table is arranged on the mounting area close to the chip supply device.

6. The die bonding machine according to claim 5, characterized in that: The placement device includes a visual positioning component and a placement component, the placement component is arranged adjacent to the visual positioning component, the visual positioning component includes a bracket arranged above the track device, at least one first visual detector and at least one second visual detector are installed on the bracket, the first visual detector is arranged above the placement area, and the second visual detector is arranged above the transfer table. The first visual detector and the second visual detector are connected to the placement component signal, and the detection accuracy of the first visual detector is higher than the detection accuracy of the second visual detector.

7. The die bonding machine according to claim 1, characterized in that: The chip supply device comprises a crystal expansion component and a lifting component, wherein the lifting component is sleeved in the middle of the crystal expansion component, the top of the lifting component is lower than the working plane of the crystal expansion component, the lifting component comprises a top block assembly, a top rod assembly and an elastic assembly, the top block assembly is arranged above the top rod assembly, and the elastic assembly is respectively against the top block assembly and the top rod assembly; The top block assembly includes an outer top block, a middle top block and an inner top block which are sleeved in sequence; the top rod assembly includes an inner top rod and an outer top rod, a linkage piece is sleeved on the inner top rod, and the linkage piece is located between the inner top rod and the middle top block; The outer top rod is provided with a first locking step, and the middle top block is provided with a second locking step, and the first locking step and the second locking step respectively abut against the middle top block and the inner top block; When the outer ejector rod rises, it drives the outer ejector block, the middle ejector block and the inner ejector block to rise synchronously. When the inner ejector rod rises, it drives the middle ejector block and the inner ejector block to rise synchronously through the linkage. When the middle ejector block rises to the highest point, the inner ejector rod continues to drive the inner ejector block to rise, so that the inner ejector block is higher than the middle ejector block. There is a first gap between the linkage and the outer top block, and a second gap between the inner top rod and the middle top block. After the outer top rod rises to drive the outer top block, the middle top block and the inner top block to rise synchronously, the outer top rod descends to make the outer top block descend and press the middle top block downward, and the inner top rod descends to make the inner top block that is against it slide downward.

8. A method for bonding a crystal, using the crystal bonding machine as claimed in any one of claims 1 to 7, characterized in that: include: The loading device transports the substrate into the track device; The track device transfers the substrate to the corresponding position of the gluing device, and the gluing device performs glue dispensing and / or glue dipping treatment on the substrate; The chip supply device supplies chips to the track device; The track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chip onto the substrate; The unloading device takes the mounted substrate out of the track device; The above steps can be performed simultaneously.

9. The die bonding method according to claim 8, characterized in that: The chip supply device includes a wafer loading component and a chip picking component. The chip supply device supplies chips to the track device, including: The wafer loading component places the wafer on the wafer expanding component; The wafer expansion component performs a carrying film expansion process on the wafer; The lifting component lifts up the chip or pulls down the carrier film until the chip is separated from the carrier film; The chip picking member transfers the chip separated from the carrier film to the track device.

10. The die bonding method according to claim 8, characterized in that: The placement device places the chip on the substrate, including: The visual detector locates and identifies the substrate and chip to be mounted; The mounting component grabs the chip based on the detection results of the visual detector, and mounts the chip on the substrate after position correction.

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